CN107369677A - Three-primary color LED device of a kind of integration packaging and preparation method thereof and purposes - Google Patents
Three-primary color LED device of a kind of integration packaging and preparation method thereof and purposes Download PDFInfo
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- CN107369677A CN107369677A CN201710681453.9A CN201710681453A CN107369677A CN 107369677 A CN107369677 A CN 107369677A CN 201710681453 A CN201710681453 A CN 201710681453A CN 107369677 A CN107369677 A CN 107369677A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 47
- 230000010354 integration Effects 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims description 27
- 239000000843 powder Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 238000001228 spectrum Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 238000005286 illumination Methods 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims description 3
- 230000005496 eutectics Effects 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 230000005284 excitation Effects 0.000 claims description 2
- 235000013305 food Nutrition 0.000 claims description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 2
- 238000004643 material aging Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims 1
- 230000004907 flux Effects 0.000 abstract description 4
- 206010068052 Mosaicism Diseases 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 210000003765 sex chromosome Anatomy 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000003086 colorant Substances 0.000 description 5
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- 239000000919 ceramic Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000013517 stratification Methods 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 241001113556 Elodea Species 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 206010015150 Erythema Diseases 0.000 description 1
- 229940121710 HMGCoA reductase inhibitor Drugs 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 231100000321 erythema Toxicity 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- 241000894007 species Species 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to a kind of LED component, and in particular to three-primary color LED device of a kind of integration packaging and its production and use.The three-primary color LED device of the present invention, including red LED chip, green LED chip, blue-light LED chip, circular luminous face and packaging plastic；Wherein, the red LED chip, green LED chip is axisymmetricly distributed with the trunnion axis and vertical axis in circular luminous face respectively with blue-light LED chip, it is and in parallel after the series connection of red LED chip, green LED chip, blue-light LED chip, there is identical red LED chip in each parallel circuit, green LED chip and blue-light LED chip quantity, electric current meets the circuit requirement of existing constant-current supply on the market with voltage after series and parallel.The three-primary color LED device of the present invention improves the colour temperature of integration packaging LED component and luminous flux heat endurance in the prior art, three-primary color LED device uniformity of luminance and matches sex chromosome mosaicism with power supply.
Description
Technical field
The present invention relates to a kind of LED component, and in particular to three-primary color LED device of a kind of integration packaging and preparation method thereof
And purposes.
Background technology
At present on general illumination field integration packaging or plate encapsulation (Chip-On-Board, referred to as " COB ") LED devices
Part is obtained using the method for blue-light LED chip excitated fluorescent powder mostly.Heat endurance in the program due to fluorescent material is weaker, makes
Cold conditions colour temperature into LED component has larger difference with luminous flux, hot colour temperature and luminous flux, and this difference is requiring higher
Need to avoid in lighting environment.In order to avoid this difference, it is necessary to carry out good radiating treatment to LED component, so as to
Add holistic cost of the LED component in application end.
In some special lighting fields, such as ornamental flower, fancy fishes, ornamental waterweed class and market fresh meat
Illumination etc. need LED component not only with higher colour temperature (correlated colour temperature 6000-12000K) and spectrum but also with larger
Red color light component, so that illuminated object seems ruddy.This just needs to use the LED component that three primary colours combine to realize.In addition,
In some special lighting fields listed above, there is certain requirement for the launch angle of light fixture, if desired for by the angle of departure
Scope of the degree control in 15-60 degree.And the launch angle of the LED component of common integration packaging is typically in the range of 120-140 degree.
Therefore need to add reflector or lens in the front end of LED component to constrain the launch angle of device.And the constraint pair of reflector
It is larger in the loss of light, so preferable light the way of restraint is to add suitable lens on the led device in actual applications.It is right
For the LED component of three primary colours, the constraint of lens is a difficult point.Because three-primary color LED device is sent just relatively only
Vertical feux rouges, green glow and blue light, after the refraction of lens, corresponding erythema, green statin and locus coeruleus are shown as in irradiation area,
Rather than the uniform mixing of three kinds of colors.Contradiction above limits the three-primary color LED device of integration packaging in lighting field
Using.
In addition, for the three-primary color LED device of integration packaging, its spectrum (mainly chromaticity coordinates) and LED chip string
The matching of parallel way is also conflict.Because for the LED component of integration packaging, the string of chip is certainly existed simultaneously
Connection, the quantity of wherein series chip determine the cut-in voltage of LED component；The quantity of parallel chip determines the volume of LED component
Determine electric current, and series chip quantity is determined with parallel chip quantity by the model for the driving power selected.For common phosphors
For the LED component of mechanism, as long as matching power parameter, because spectrum can be carried out by the species of fluorescent material with dosage
Adjustment.And for the three-primary color LED device of integration packaging, once after the connection in series-parallel quantity of three kinds of chips determines, its spectrum
Determine that, but the spectrum of this determination is not necessarily applicable.This contradiction is also the three-primary color LED device of integration packaging above
Using problem.
Patent ZL 201120219454.X disclose a kind of COB LED components of RGB encapsulation, but the device is needed in COB
Previously prepared three disjoint helical orbits, manufacturing process are cumbersome and with high costs on substrate.And such as fail uniformly to arrange
RGB three-color LED chips, bright-colored colored and heterogeneous white light is presented into the light for sending COB LED component light-emitting areas.Simultaneously
Such as use the lens of general COB LED components, it is likely that the luminous of device the phenomenon of colour cast is occurred, can not obtain uniform
It is photochromic.
Patent 201520096441.6 discloses a kind of intelligent lighting COB LED light source component.Patent
201520371499.7 disclose a kind of common cathode holohedral symmetry COB encapsulating structures.Two patents of the above are concentrated mainly on display neck
Domain.In addition, this two patents document is all three kinds of face of the LED component to three primary colours by way of common cathode or common-anode
Color carries out independent control, and although this method makes spectrum become Independent adjustable section, but can so greatly increase control section
Cost, while controller volume is greatly increased, so as to be not suitable for being applied to ordinary lamp and lantern.
The content of the invention
The invention provides a kind of three-primary color LED device of integration packaging, improves integration packaging LED devices in the prior art
The colour temperature of part and luminous flux heat endurance, three-primary color LED device uniformity of luminance and match sex chromosome mosaicism with power supply.
The present invention is achieved by the following technical solution：
A kind of three-primary color LED device of integration packaging, including red LED chip, green LED chip, blue-light LED chip,
Circular luminous face and packaging plastic；
Wherein, the red LED chip, green LED chip is with blue-light LED chip respectively with the trunnion axis in circular luminous face
Axisymmetricly it is distributed with vertical axis, and in parallel after the series connection of red LED chip, green LED chip, blue-light LED chip, each parallel connection
There is the red LED chip of identical quantity in circuit, green LED chip and blue-light LED chip, the LED after chip series and parallel
Electric current and voltage meet the circuit requirement of existing constant-current supply on the market.
According to the present invention, the peak wavelength of the red LED chip is 610-660nm；The peak value of the green LED chip
Wavelength is 500-560nm；The peak wavelength of the blue-light LED chip is 440-470nm.
According to the present invention, the red LED chip, green LED chip and blue-light LED chip can be horizontal structure
One or more in LED chip, inverted structure LED chip or light emitting diode (LED) chip with vertical structure.
According to the present invention, the size of the red LED chip, green LED chip and blue-light LED chip is 0.3-1mm2。
According to the present invention, the quantity ratio of the green LED chip and blue-light LED chip is (10-2):1, for example, 2.7:
1、4:1、2.5:1、10:1、2:1；
The quantity ratio of the green LED chip and red LED chip is 5-0.5:1, for example, 2:1、1.6:1、3:1、
1.5:1、5:1、0.5:1。
According to the present invention, to the red LED chip, green LED chip, blue-light LED chip it is specified using electric current and
Voltage does not limit, and the electric current after its connection in series-parallel meets the circuit requirement of existing constant-current supply on the market.
According to the present invention, do not limited for the size in the circular luminous face, the red LED chip, green can be met
Light LED chip, the trunnion axis of blue-light LED chip and vertical axis are axisymmetricly distributed.
Wherein, the LED component can optionally be mixed into light spread powder or fluorescence according to the requirement to light source in packaging plastic
Powder.
When being mixed into light spread powder in the packaging plastic, the mass ratio of the smooth spread powder and packaging plastic is (0.001-
0.5):1, be preferably (0.001-0.3):1, it is further preferably (0.001-0.2):1.
The smooth spread powder is the inorganic smooth spread powder, organic smooth spread powder or the mixture of the two for preparing LED, example
One or more such as in following：Nano barium sulfate, calcium carbonate, silica, styrene type resin, acrylic resin
Deng.
When being mixed into fluorescent material in the packaging plastic, the mass ratio of the fluorescent material and packaging plastic is (0.001-0.2):1,
Preferably (0.001-0.15):1, it is further preferably (0.001-0.1):1.
The fluorescent material is the fluorescent material for preparing LED, such as the peak wavelength of excitation peak is 440-460nm fluorescence
The peak wavelength of powder or emission peak is 500-660nm fluorescent material.The three-primary color LED device of integration packaging of the present invention may be used also
With including lens, such as the launch angle of LED component of the present invention is set to control lens in 15-60 degree scopes.
The preparation method that the present invention also provides the three-primary color LED device of integration packaging as described above, comprises the following steps：
S1. determine the color chip of red, green, blue three in each parallel connection according to the constant-current dc power supply of required spectrum and cooperation
Ratio in loop, and the requirement being axisymmetricly distributed according to the trunnion axis and vertical axis with circular luminous face is to red, green, blue three
Color chip carries out the design of chip array；
S2., the color chip of red, green, blue three is fixed on to the relevant position of package substrate according to step S1 design；
S3. the color chip of red, green, blue three of fixed good position is realized according to design and be electrically connected with；
S4., packaging plastic is covered in the surface of LED chip, baking makes encapsulation adhesive curing, completes the making of LED component.
According to the preparation method of the present invention, in step S2, the fixing step can by silica gel die bond, tin cream die bond or
The mode of person's gold-tin alloy eutectic.
According to the preparation method of the present invention, in step S4, the baking temperature can according to packaging plastic solidification temperature
And the temperature for not influenceing miscellaneous part quality is configured.
The present invention also provides the purposes of the three-primary color LED device of the integration packaging, and it can be used for illuminating, is preferably pair
In the lighting field required with special contrast, such as the illumination of ornamental plant, potted landscape makes the illumination of scape, the fresh based food of supermarket
Illumination etc..
Beneficial effects of the present invention：
1) present invention is packaged into luminous LED device in an integrated manner by red, green, blue three-color LED chip, realizes three bases
The white light LED luminescent device of color, avoid a large amount of uses of fluorescent material；Simultaneously on the chip array of light source, make three kinds of colors
Chip be axisymmetricly distributed with the trunnion axis and vertical axis in circular luminous face respectively, to ensure that every kind of chip is each equably arranged
Cloth is on circular luminous face；And the light of each wavelength is sufficiently mixed in light source internal using spread powder, make the three of integration packaging
Primary-color LED device sends uniform white light；Finally, even if using general low-angle lens, LED of the present invention
It is not in the phenomenon of light source colour cast.
2) LED of the present invention can select multiple power source, reach the chromaticity coordinates requirement of needs, so as to realize
Simplicity, easy-to-use, the low purpose of cost.
3) preparation method of the invention can be mutually compatible with the preparation method of LED general at present, while device
Chromaticity coordinates uniformity when prepared by part batch is good, and yield is high.
Brief description of the drawings
The chip array and connected mode of Fig. 1 embodiments 1.
The red LED chip arrangement mode of Fig. 2 embodiments 1.
The green LED chip arrangement mode of Fig. 3 embodiments 1.
The blue-light LED chip arrangement mode of Fig. 4 embodiments 1.
The chip array and connected mode of Fig. 5 embodiments 2.
The red LED chip arrangement mode of Fig. 6 embodiments 2.
The green LED chip arrangement mode of Fig. 7 embodiments 2.
The blue-light LED chip arrangement mode of Fig. 8 embodiments 2.
The chip array and connected mode of Fig. 9 embodiments 3.
The red LED chip arrangement mode of Figure 10 embodiments 3.
The green LED chip arrangement mode of Figure 11 embodiments 3.
The blue-light LED chip arrangement mode of Figure 12 embodiments 3.
The chip array and connected mode of Figure 13 embodiments 4.
The red LED chip arrangement mode of Figure 14 embodiments 4.
The green LED chip arrangement mode of Figure 15 embodiments 4.
The blue-light LED chip arrangement mode of Figure 16 embodiments 4.
The chip array and connected mode of Figure 17 embodiments 5.
The red LED chip arrangement mode of Figure 18 embodiments 5.
The green LED chip arrangement mode of Figure 19 embodiments 5.
The blue-light LED chip arrangement mode of Figure 20 embodiments 5.
The chip array and connected mode of Figure 21 embodiments 6.
The red LED chip arrangement mode of Figure 22 embodiments 6.
The green LED chip arrangement mode of Figure 23 embodiments 6.
The blue-light LED chip arrangement mode of Figure 24 embodiments 6.
Wherein, each reference implication is as follows in Fig. 1-2 4：Substrate 10, functional areas 11, red LED chip 21, green light LED
Chip 22, blue-light LED chip 23.
Embodiment
Below in conjunction with specific embodiment to three-primary color LED luminescent device of integration packaging of the present invention and preparation method thereof
Further detailed description is done with purposes.The following example is merely illustrative the ground description and interpretation present invention, without that should be solved
It is interpreted as limiting the scope of the invention.All technologies realized based on the above of the present invention be encompassed by it is contemplated that
In the range of protection.
Unless otherwise indicated, the parts used in following examples are commercial goods, or can pass through known method
Prepare.
The three-primary color LED device of the integration packaging as shown in Figure 1 of embodiment 1, integrated envelope is used as using mirror-surface aluminum base board 10
The substrate of dress, the functional areas 11 (i.e. light-emitting area) of mirror-surface aluminum base board 10 are diameter 15mm circle.The design cut-in voltage of device is
42V, design input current are 700mA, and device total power consumption is about 30W.Red LED chip 21 used by the LED component in Fig. 1
Peak wavelength be 630nm, the specified of chip using electric current is 100mA, and voltage is 2.2V@100mA, chip size 0.35mm
×0.35mm；The peak wavelength 520nm of the green LED chip 22 used, the specified use electric current of chip is 100mA, and voltage is
3V@100mA, chip size are 0.3mm × 0.3mm；The peak wavelength of the blue-light LED chip 23 used is 460nm, the volume of chip
Surely the use of electric current is 100mA, voltage is 3V@100mA, and chip size is 0.3mm × 0.4mm.Three of the above chip is level
Structure.Red LED chip 21, green LED chip 22 and the distribution mode of blue-light LED chip 23 on the substrate 10 respectively as Fig. 2-
Shown in 4, three kinds of chips are each axisymmetricly distributed with the trunnion axis and vertical axis in functional substrate area 11.What the arrangement mode made
The light that LED component is sent is uniform white light, and the lens for being 15 degree in device front end addition angle, does not also interfere with device hair
Photochromic uniformity of the light gone out in irradiated plane.The series-parallel system of the three-primary color LED device of the integration packaging is 7 and 15
String, the connected mode of its chip is as shown in figure 1, red LED chip 4, green LED chip 8, blue-ray LED core in every a string
Piece 3.The cut-in voltage of the device is 42V, the use of electric current is 700mA, can easily match existing constant current driving on the market
Device.
The three-primary color LED device of the integration packaging as shown in Figure 5 of embodiment 2, integrated envelope is used as using silver-plated copper base 10
The substrate of dress, the functional areas 11 of silver-plated copper base 10 are diameter 18mm circle.Red LED chip 21 used by the LED component
Peak wavelength be 620nm, the specified of chip using electric current is 160mA, and voltage is 2.2V@160mA, chip size 0.45mm
×0.45mm；The peak wavelength 535nm of the green LED chip 22 used, the specified use electric current of chip is 160mA, and voltage is
2.8V@160mA, chip size are 0.65mm × 0.65mm；The peak wavelength of the blue-light LED chip 23 used is 450nm, chip
It is specified using electric current be 160mA, voltage is 3V@160mA, and chip size is 0.3mm × 0.45mm.Three of the above chip is
Horizontal structure.Respectively as shown in figs 6-8, three kinds of chips are each for the distribution mode of feux rouges, green glow and blue-light LED chip on the substrate 10
Axisymmetricly it is distributed from the trunnion axis and vertical axis in functional substrate area 11.The light that the LED component that the arrangement mode makes is sent is
Uniform white light, and the collector lens for being 15 degree in device front end addition angle, do not interfere with the light that device is sent yet and are irradiating
Photochromic uniformity in plane.The series-parallel system of the LED component is gone here and there for 7 and 15, red light chips 5 in every a string, green glow core
Piece 8, blue chip 2.The design cut-in voltage of the LED component is 40V, and design input current is 1.2A, total device power
About 48W, it can easily match existing constant-flow driver on the market.
The three-primary color LED device of the integration packaging as shown in Figure 9 of embodiment 3, uses the aluminium oxide ceramics of metal patternization
Substrate of the substrate 10 as integration packaging, the functional areas 11 of aluminium oxide ceramic substrate 10 are diameter 30mm circle.The LED component institute
The peak wavelength of the red LED chip 21 used is 660nm, and the specified use electric current of chip is 80mA, and voltage is 2.2V@
80mA, chip size are 0.3mm × 0.3mm；The peak wavelength 560nm of the green LED chip 22 used, the specified use of chip
Electric current is 80mA, and voltage is 2.8V@80mA, and chip size is 0.45mm × 0.45mm；The peak value of the blue-light LED chip 23 used
Wavelength is 470nm, and the specified use electric current of chip is 80mA, and voltage is 3V@80mA, and chip size is 0.3mm × 0.35mm.Its
Middle red LED chip 21 is vertical stratification, and green LED chip 22 and blue-light LED chip 23 are horizontal structure.Feux rouges, green glow with
Respectively as shown in figs. 10-12, three kinds of chips are each with functional substrate area 11 for the distribution mode of blue-light LED chip on the substrate 10
Trunnion axis and vertical axis are axisymmetricly distributed.The light that the LED component that the arrangement mode makes is sent is uniform white light, and in device
Front end addition angle is more than 15 degree of collector lens, and it is photochromic uniform in irradiated plane not interfere with the light that device is sent yet
Property.The series-parallel system of the LED component goes here and there 19 simultaneously for 19, red light chips 4 in every a string, green glow chip 12, blue chip 3
, the connected mode of its chip is as shown in Figure 9.The design cut-in voltage of the LED component is 52V, and design input current is 1.5A,
Total device power is about 80W, can easily match existing constant-flow driver on the market.
The three-primary color LED device of the integration packaging as shown in fig. 13 that of embodiment 4, uses the aluminium nitride ceramics of metal patternization
Substrate of the substrate 10 as integration packaging, the functional areas 11 of aluminum nitride ceramic substrate 10 are diameter 35mm circle.The LED component institute
The peak wavelength of the red LED chip 21 used is 610nm, and the specified use electric current of chip is 60mA, and voltage is 2.2V@
60mA, chip size are 0.3mm × 0.3mm；The peak wavelength 500nm of the green LED chip 22 used, the specified use of chip
Electric current is 60mA, and voltage is 2.8V@60mA, and chip size is 0.33mm × 0.33mm；The peak value of the blue-light LED chip 23 used
Wavelength is 440nm, and the specified use electric current of chip is 60mA, and voltage is 3V@60mA, and chip size is 0.3mm × 0.3mm.Its
Middle red LED chip 21 is vertical stratification, and green LED chip 22 is horizontal structure, and blue-light LED chip 23 is inverted structure.It is red
Respectively as illustrated in figures 14-16, three kinds of chips are each with substrate for the distribution mode of light, green glow and blue-light LED chip on the substrate 10
The trunnion axis and vertical axis of functional areas 11 are axisymmetricly distributed.The light that the LED component that the arrangement mode makes is sent is uniform white
Light, and be more than 15 degree of collector lens in device front end addition angle, light that device is sent is not interfered with yet in irradiated plane
Photochromic uniformity.The series-parallel system of the LED component goes here and there 30 simultaneously for 31, red light chips 10 in every a string, green glow chip 15
, blue chip 6, the connected mode of its chip is as shown in figure 13.The design cut-in voltage of the LED component is about 85V, design
Input current is 1.8A, and total device power is about 150W, can easily match existing constant-flow driver on the market.
The three-primary color LED device of the integration packaging as shown in figure 17 of embodiment 5, integrated envelope is used as using mirror-surface aluminum base board 10
The substrate of dress, the functional areas 11 of mirror-surface aluminum base board 10 are diameter 35mm circle.Red LED chip 21 used by the LED component
Peak wavelength be 625nm, the specified of chip using electric current is 250mA, and voltage is 2.2V@250mA, chip size 0.6mm
×0.6mm；The peak wavelength 535nm of the green LED chip 22 used, the specified use electric current of chip is 250mA, and voltage is
2.8V@250mA, chip size are 0.8mm × 0.8mm；The peak wavelength of the blue-light LED chip 23 used is 455nm, chip
Specified use electric current is 250mA, and voltage is 3V@250mA, and chip size is 0.5mm × 0.5mm.Wherein red LED chip 21,
Green LED chip 22 and blue-light LED chip 23 are horizontal structure.Feux rouges, point of the green glow with blue-light LED chip on the substrate 10
Respectively as depicted in figures 18-20, three kinds of chips are each axisymmetricly divided mode for cloth with the trunnion axis and vertical axis in functional substrate area 11
Cloth.The light that the LED component that the arrangement mode makes is sent is uniform white light, and poly- more than 15 degree in device front end addition angle
Optical lens, the photochromic uniformity of light that device is sent in irradiated plane is not interfered with yet.The series-parallel system of the LED component is
26 go here and there 24 simultaneously, red light chips 4 in every a string, green glow chip 20, blue chip 2, connected mode such as Figure 17 of its chip
It is shown.The design cut-in voltage of the LED component is about 70V, and design input current is 6A, and total device power is about 400W.
The three-primary color LED device of the integration packaging as shown in figure 21 of embodiment 6, integrated envelope is used as using mirror-surface aluminum base board 10
The substrate of dress, the functional areas 11 of mirror-surface aluminum base board 10 are diameter 25mm circle.Red LED chip 21 used by the LED component
Peak wavelength be 645nm, the specified of chip using electric current is 350mA, and voltage is 2.2V@350mA, chip size 0.85mm
×0.85mm；The peak wavelength 540nm of the green LED chip 22 used, the specified use electric current of chip is 350mA, and voltage is
2.8V@350mA, chip size are 1mm × 1mm；The peak wavelength of the blue-light LED chip 23 used is 465nm, chip it is specified
The use of electric current is 30mA, voltage is 3V@350mA, and chip size is 0.7mm × 0.7mm.Wherein red LED chip 21, green glow
LED chip 22 and blue-light LED chip 23 are horizontal structure.Feux rouges, green glow and the distribution side of blue-light LED chip on the substrate 10
Respectively as shown in figs. 22-24, three kinds of chips are each axisymmetricly distributed formula with the trunnion axis and vertical axis in functional substrate area 11.Should
The light that the LED component that arrangement mode makes is sent is uniform white light, and saturating more than 15 degree of optically focused in device front end addition angle
Mirror, the photochromic uniformity of light that device is sent in irradiated plane is not interfered with yet.The series-parallel system of the LED component is 14 strings
12 simultaneously, and red light chips 8 in every a string, green glow chip 4, blue chip 2, the connected mode of its chip is as shown in figure 21.
The design cut-in voltage of the LED component is about 35V, and design input current is 4.2A, and total device power is about 150W.
Embodiment 7
S01. determine the color chip of red, green, blue three per in the lump according to the constant-current dc power supply of required spectrum and cooperation
Join the ratio in loop, and the requirement being axisymmetricly distributed according to the trunnion axis and vertical axis with circular luminous face is to red, green, blue
Three color chips carry out the design of chip array；
S02. the color chip of red, green, blue three is passed through into silica gel die bond, tin cream die bond or gold according to the design drawing of step 1
The mode of tin alloy eutectic is fixed on the relevant position of package substrate；
S03. three color chips are realized by the color chip of red, green, blue three of fixed good position according to design and be electrically connected with；
S04., the silica gel for being mixed with fixed proportion fluorescent material and spread powder is covered in the surface of LED chip, baking makes silicon
Adhesive curing, and complete the making of the LED component.
More than, embodiments of the present invention are illustrated.But the present invention is not limited to above-mentioned embodiment.It is all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvements done etc., it should be included in the guarantor of the present invention
Within the scope of shield.
Claims (10)
1. the three-primary color LED device of a kind of integration packaging, it is characterised in that including red LED chip, green LED chip, blue light
LED chip, circular luminous face and packaging plastic, the red LED chip, green LED chip is with blue-light LED chip respectively with circle
The trunnion axis and vertical axis of light-emitting area are axisymmetricly distributed, and red LED chip, green LED chip, blue-light LED chip are connected
It is in parallel afterwards, there is the red LED chip of identical quantity, green LED chip and blue-light LED chip in each parallel circuit；Chip
The electric current of the LED meets the circuit requirement of existing constant-current supply on the market with voltage after series and parallel.
2. three-primary color LED device as claimed in claim 1, it is characterised in that the peak wavelength of the red LED chip is
610-660nm；The peak wavelength of the green LED chip is 500-560nm；The peak wavelength of the blue-light LED chip is
440-470nm；
The red LED chip, green LED chip and blue-light LED chip are LED chip, the inverted structure LED core of horizontal structure
One or more in piece or light emitting diode (LED) chip with vertical structure；
The size of the red LED chip, green LED chip and blue-light LED chip is 0.3-1mm2。
3. three-primary color LED device as claimed in claim 1 or 2, it is characterised in that green light LED described in each parallel circuit
The quantity of chip and blue-light LED chip ratio is (10-2):1, for example, 2.7:1、4:1、2.5:1、10:1 or 2:1；Each parallel connection
In circuit, the quantity ratio of the green LED chip and red LED chip is 5-0.5:1, for example, 2:1、1.6:1、3:1、1.5:
1、5:1 or 0.5:1；
The red LED chip, green LED chip, the specified of blue-light LED chip are not limited using electric current and voltage, its
The electric current of the LED after connection in series-parallel meets the circuit requirement of existing constant-current supply on the market.
4. the three-primary color LED device as described in claim any one of 1-3, it is characterised in that for the circular luminous face
Size does not limit, and can meet that the red LED chip, green LED chip, the trunnion axis of blue-light LED chip and vertical axis are in
Axial symmetry is distributed.
5. the three-primary color LED device as described in claim any one of 1-4, it is characterised in that the LED component can be according to right
The requirement of light source is optionally mixed into light spread powder in packaging plastic；
When being mixed into light spread powder in the packaging plastic, the mass ratio of the smooth spread powder and packaging plastic is (0.001-0.5):1,
Also preferably (0.001-0.3):1, it is further preferably (0.001-0.2):1；
The smooth spread powder is for preparing LED inorganic smooth spread powder, organic smooth spread powder or the mixture of the two, such as is selected
One or more in following：Nano barium sulfate, calcium carbonate, silica, styrene type resin, acrylic resin etc.；
The LED component can optionally be mixed into fluorescent material according to the requirement to light source in packaging plastic；
When being mixed into fluorescent material in the packaging plastic, the mass ratio of the fluorescent material and packaging plastic is (0.001-0.2):1, it is also excellent
Elect as (0.001-0.15):1, it is further preferably (0.001-0.1):1；
The fluorescent material is the fluorescent material for preparing LED, for example, excitation peak peak wavelength be 440-460nm fluorescent material or
The peak wavelength of emission peak is 500-660nm fluorescent material.
6. the three-primary color LED device as described in claim any one of 1-5, it is characterised in that also including lens, such as make described
Lens of the launch angle control of LED component in 15-60 degree scopes.
7. the preparation method of the three-primary color LED device as described in claim any one of 1-6, it is characterised in that including following step
Suddenly：
S1. determine the color chip of red, green, blue three in each shunt circuit according to the constant-current dc power supply of required spectrum and cooperation
In ratio, and according to the requirement that the trunnion axis and vertical axis with circular luminous face are axisymmetricly distributed to the color core of red, green, blue three
Piece carries out the design of chip array；
S2., the color chip of red, green, blue three is fixed on to the relevant position of package substrate according to step S1 design；
S3. the color chip of red, green, blue three of fixed good position is realized according to design and be electrically connected with；
S4., packaging plastic is covered in the surface of LED chip, baking makes encapsulation adhesive curing, completes the making of LED component.
8. preparation method as claimed in claim 7, it is characterised in that in step S2, the fixing step can pass through silica gel
The mode of die bond, tin cream die bond or gold-tin alloy eutectic.
9. preparation method as claimed in claim 7 or 8, it is characterised in that in step S4, the baking temperature is according to encapsulation
The solidification temperature of glue and do not influence the temperature of miscellaneous part quality and be configured.
10. the purposes of the three-primary color LED device as described in claim any one of 1-6, it is characterised in that for illuminating, preferably
For for the lighting field required with special contrast, such as the illumination of ornamental plant, potted landscape makes the illumination of scape, the fresh class of supermarket
Illumination of food etc..
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| CN108601157A (en) * | 2018-06-21 | 2018-09-28 | 南京养元素电子科技有限公司 | A kind of white light LEDs lamp bead based on RGB three primary colours chips |
| CN109994459A (en) * | 2019-04-08 | 2019-07-09 | 东莞市铱源光电科技有限公司 | A kind of method and structure of the panchromatic light distribution of high integration LED chip module |
| CN112116882A (en) * | 2020-10-19 | 2020-12-22 | 夏林嘉 | Three-primary-color light emitting device for outdoor full-color LED display screen and outdoor full-color LED display screen |
| CN115119355A (en) * | 2022-08-29 | 2022-09-27 | 南昌硅基半导体科技有限公司 | High-speed LED device with positioning and lighting functions and manufacturing method thereof |
| CN116995157A (en) * | 2023-09-25 | 2023-11-03 | 苏州芯聚半导体有限公司 | Manufacturing method of micro-LED chip packaging structure and packaging structure |
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Inventor after: Liu Zhuguang Inventor after: Deng Zhonghua Inventor after: Guo Wang Inventor after: Chen Jian Inventor after: Huang Qiufeng Inventor after: Huang Jiquan Inventor after: Zhang Weifeng Inventor before: Liu Zhuguang Inventor before: Deng Zhonghua Inventor before: Guo Wang Inventor before: Chen Jian Inventor before: Huang Qiufeng Inventor before: Huang Jiquan Inventor before: Zhang Weifeng |
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Application publication date: 20171121 |