CN107326360A - A kind of erosion resistant coating structure of nanometer multilayer graded composite and preparation method thereof - Google Patents
A kind of erosion resistant coating structure of nanometer multilayer graded composite and preparation method thereof Download PDFInfo
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- 238000000576 coating method Methods 0.000 title claims abstract description 97
- 239000011248 coating agent Substances 0.000 title claims abstract description 91
- 239000002131 composite material Substances 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 230000003628 erosive effect Effects 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 238000005121 nitriding Methods 0.000 claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 50
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 34
- 150000002500 ions Chemical class 0.000 claims abstract description 34
- 238000002513 implantation Methods 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000000541 cathodic arc deposition Methods 0.000 claims abstract description 9
- 238000000151 deposition Methods 0.000 claims description 59
- 230000008021 deposition Effects 0.000 claims description 56
- 238000001914 filtration Methods 0.000 claims description 24
- 238000005516 engineering process Methods 0.000 claims description 20
- 238000005498 polishing Methods 0.000 claims description 19
- 238000004544 sputter deposition Methods 0.000 claims description 19
- 238000005468 ion implantation Methods 0.000 claims description 17
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
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- 125000004122 cyclic group Chemical group 0.000 claims description 4
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- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
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- 238000007733 ion plating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
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- 229910052723 transition metal Inorganic materials 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0617—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
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- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本发明公开了一种纳米多层梯度复合的抗冲蚀涂层结构,从基体到涂层表面,所述涂层结构依次含有渗氮层、“嵌入式结合层”以及由Ti金属层、Ti→TiN梯度层和TiN/Ti纳米多层循环叠加组成的结构。此外,本发明公开了上述涂层结构的制备方法:通过表面渗氮,使基体表面及亚表面的材料属性与涂层材料相似,以缓解膜基交界处的应力集中现象;采用金属真空蒸汽离子源注入方法,对渗氮后的基体表面进行离子注入,形成“嵌入式结合层”;在结合层之上,采用磁过滤真空阴极弧沉积方法,通过连续控制输入的N2流量,沉积由Ti金属层、Ti→TiN梯度层以及TiN/Ti纳米多层依次组成的周期性循环结构。所述纳米梯度多层复合涂层结构兼具了高硬度、高韧性以及优良的膜基结合力,从而具有很好的抗冲蚀性能。
The invention discloses a nanometer multi-layer gradient composite anti-erosion coating structure. From the substrate to the coating surface, the coating structure sequentially contains a nitriding layer, an "embedded bonding layer" and a Ti metal layer, a Ti metal layer, and a Ti metal layer. →The structure composed of TiN gradient layer and TiN/Ti nanometer multi-layer cycle stacking. In addition, the invention discloses a preparation method of the above-mentioned coating structure: through surface nitriding, the material properties of the substrate surface and sub-surface are similar to those of the coating material, so as to alleviate the stress concentration phenomenon at the junction of the film base; using metal vacuum vapor ion The source implantation method is to implant ions on the surface of the substrate after nitriding to form an "embedded bonding layer"; on the bonding layer, the magnetic filter vacuum cathodic arc deposition method is used to deposit Ti by continuously controlling the input N2 flow rate. A periodic cycle structure composed of metal layer, Ti→TiN gradient layer and TiN/Ti nanometer multilayer in sequence. The nano-gradient multilayer composite coating structure has both high hardness, high toughness and excellent film-base bonding force, so it has good erosion resistance performance.
Description
技术领域technical field
本发明涉及材料表面改性技术领域,特别涉及一种集渗氮结构、离子注入结构、纳米多层结构和梯度结构于一体的,具有高膜基结合力和高韧性的抗冲蚀复合涂层结构;以及与之相对应的有效结合了表面渗氮、离子注入和磁过滤真空阴极弧等离子体沉积等多种表面强化处理技术的涂层制备方法。The invention relates to the technical field of material surface modification, in particular to an anti-erosion composite coating which integrates a nitriding structure, an ion implantation structure, a nano-multilayer structure and a gradient structure, and has high film-base bonding force and high toughness structure; and the corresponding coating preparation method that effectively combines various surface strengthening treatment technologies such as surface nitriding, ion implantation and magnetic filtration vacuum cathode arc plasma deposition.
背景技术Background technique
直升机我国陆航、海航以及空降兵在复杂地面环境进行对地攻击、火力压制、后勤运输等多样化作战任务不可或缺的重要装备,且作战时常常没有固定场地或专用机场,使用的起降场地通常十分简易,甚至临时性的沙地、土地或草地。当直升机在砂尘环境下起降和低空飞行时,旋翼下洗气流会使得地面的砂尘颗粒与空气混合,发动机在吸入气流的同时,砂尘颗粒被高速带入其中,被吸入的砂尘首先经过压气机,对高速运动的压气机转子叶片造成冲蚀磨损,轻则使叶片出现表面粗糙度增大、前缘弯曲、弦长变短和厚度减小等问题,导致压气机的增压比、效率以及流通能力降低,进而造成发动机的整机参数衰减,影响其综合作战性能;严重情况下,砂尘冲蚀还将导致叶片表面产生凹坑、鼓包、缺口、裂纹等结构损伤,破坏叶片的结构完整性,改变叶片的自振频率,降低叶片的疲劳强度,严重威胁发动机的可靠性和安全性。Helicopters are indispensable and important equipment for my country's land aviation, sea aviation, and airborne troops to carry out diverse combat tasks such as ground attack, fire suppression, and logistics transportation in complex ground environments. The site is usually very simple, even temporary sand, earth or grass. When the helicopter takes off and lands and flies at low altitude in a dusty environment, the downwash airflow of the rotor will make the dust particles on the ground mix with the air. First, through the compressor, it will cause erosion and wear to the high-speed moving compressor rotor blades, and at the slightest, the blades will have problems such as increased surface roughness, curved leading edge, shortened chord length and reduced thickness, resulting in the pressurization of the compressor. Ratio, efficiency, and flow capacity are reduced, which in turn causes the overall parameters of the engine to attenuate, affecting its comprehensive combat performance; in severe cases, sand and dust erosion will also cause structural damage such as pits, bulges, gaps, and cracks on the blade surface, destroying the The structural integrity of the blade changes the natural frequency of the blade, reduces the fatigue strength of the blade, and seriously threatens the reliability and safety of the engine.
据统计,砂尘环境占我国国土总面积的50%以上,主要包括西北塔克拉玛干地区的细砂、西南地区大面积的粗砂以及东南沿海地区的沙滩等。而西北地区常年存在反恐维稳问题,西南地区时常发生局部冲突,扰乱社会稳定,东南地区更是需要时刻准备反分裂,维护国家主权。因此,无论从国民经济角度,还是从国防安全方面考虑,如何提高直升机发动机压气机叶片的抗砂尘冲蚀问题都显得极其重要且紧迫。According to statistics, the sand and dust environment accounts for more than 50% of my country's total land area, mainly including fine sand in the northwest Taklimakan region, large areas of coarse sand in the southwest region, and beaches in the southeast coastal region. However, the northwest region has perennial problems of counter-terrorism and stability maintenance. The southwest region often has local conflicts that disrupt social stability. The southeast region needs to be always prepared to fight against secession and safeguard national sovereignty. Therefore, no matter from the perspective of national economy or national defense security, how to improve the anti-sand erosion of helicopter engine compressor blades is extremely important and urgent.
涂层是提高航空发动机压气机叶片抗砂尘冲蚀性能的有效措施。研究初期,涂层的硬度被认为是提高其抗冲蚀性能的关键,美军也曾为了提高压气机叶片的抗砂尘冲蚀能力,在叶片表面制备了高硬度的TiN陶瓷涂层,然而,在海湾战争和阿富汗战争中,发现带有高硬度陶瓷涂层的压气机叶片依然受损严重。由此可见,结构简单、性能单一的单层涂层已无法满足航空发动机压气机叶片的砂尘防护要求。于是,在高硬度陶瓷涂层中增加金属材料,并使陶瓷层和金属层交替排列的陶瓷/金属多层涂层应运而生。研究表明,与单层结构相比,金属层的加入降低了涂层的硬度,在一定程度上提高了涂层的整体韧性,但是,传统的多层结构中存在大量的层间界面,由于界面两侧的材料属性差别迥异,容易造成应力集中,进而萌生层间裂纹,最终导致涂层剥落。为了解决多层涂层结构中,由于层间界面两侧的材料属性差别迥异而导致的应力集中问题,梯度涂层成为学者们的研究热点。该类涂层结构是在涂层沉积过程中,通过对输入气体流量进行实时连续控制,使得金属层与陶瓷层之间生成了特殊的梯度渐变结构,而不再存在材料属性突变的层间界面,可有效消除层间界面应力集中的问题。随着纳米科学与技术的发展,由于纳米结构特有的“超硬效应”和优越的力学性能,使纳米涂层已成为硬质涂层材料的重要发展方向。Coating is an effective measure to improve the anti-sand erosion performance of aeroengine compressor blades. In the early stage of research, the hardness of the coating was considered to be the key to improving its erosion resistance. The US military also prepared a high-hardness TiN ceramic coating on the surface of the blade in order to improve the sand and dust erosion resistance of the compressor blade. However, During the Gulf War and the Afghanistan War, it was found that the compressor blades with high hardness ceramic coatings were still severely damaged. It can be seen that a single-layer coating with simple structure and single performance cannot meet the sand and dust protection requirements of aeroengine compressor blades. Therefore, a ceramic/metal multilayer coating in which a metal material is added to a high-hardness ceramic coating and ceramic layers and metal layers are alternately arranged comes into being. Studies have shown that compared with the single-layer structure, the addition of the metal layer reduces the hardness of the coating and improves the overall toughness of the coating to a certain extent. However, there are a large number of interlayer interfaces in the traditional multi-layer structure. Due to the interface The material properties on both sides are very different, which is easy to cause stress concentration, and then initiate interlayer cracks, which eventually lead to peeling off of the coating. In order to solve the stress concentration problem caused by the different material properties on both sides of the interface between layers in the multilayer coating structure, gradient coating has become a research hotspot of scholars. This type of coating structure is based on real-time and continuous control of the input gas flow during the coating deposition process, so that a special gradient structure is formed between the metal layer and the ceramic layer, and there is no interlayer interface with sudden changes in material properties. , which can effectively eliminate the problem of stress concentration at the interface between layers. With the development of nano science and technology, due to the unique "superhard effect" and superior mechanical properties of nanostructures, nano coatings have become an important development direction of hard coating materials.
除涂层自身的结构特征之外,涂层与基体之间的结合力也是影响涂层抗冲蚀性能的重要影响因素。目前大多数学者都通过在TiN陶瓷层与基体之间增加一层起过渡作用的金属Ti,以期改善涂层结合力,这种方式虽有助于释放陶瓷层与基体间的内应力,可在一定程度上提高膜基结合力,但由于Ti层与基体之间依然存在明显的层间界面,膜基结合力仍无法满足抗砂尘冲蚀的要求。渗氮技术可对基体进行表面改性处理,使基体表面及其亚表面的材料属性与涂层材料相似,以缓解膜基交界处的应力集中现象,为膜基结合力的提高奠定基础。此外,离子注入也是一种具有独特特点的表面改性技术,它是在真空容器内,将选定的元素离化处理成带电离子,并使其经过几万甚至几十万伏的高电压进行加速,成为载能离子注入到基体亚表层,形成“嵌入式结合层”,该结构能有效地使基体和涂层紧密连接在一起,以获得超高的膜基结合力。In addition to the structural characteristics of the coating itself, the bonding force between the coating and the substrate is also an important factor affecting the erosion resistance of the coating. At present, most scholars are adding a layer of transition metal Ti between the TiN ceramic layer and the substrate in order to improve the bonding force of the coating. Although this method helps to release the internal stress between the ceramic layer and the substrate, it can be used in To a certain extent, the bonding force of the film base is improved, but because there is still an obvious interlayer interface between the Ti layer and the substrate, the bonding force of the film base still cannot meet the requirements of sand and dust erosion resistance. Nitriding technology can modify the surface of the substrate, so that the material properties of the substrate surface and its subsurface are similar to those of the coating material, so as to alleviate the stress concentration at the junction of the membrane and base, and lay the foundation for the improvement of the bonding force of the membrane. In addition, ion implantation is also a surface modification technology with unique characteristics. It ionizes selected elements into charged ions in a vacuum container and makes them undergo high voltage of tens of thousands or even hundreds of thousands of volts. Accelerated and implanted into the subsurface of the substrate as energy-carrying ions to form an "embedded bonding layer". This structure can effectively connect the substrate and the coating closely together to obtain ultra-high bonding force of the film substrate.
发明内容Contents of the invention
鉴于上述技术背景,本发明的目的之一是结合渗氮结构、离子注入结构、纳米多层结构和梯度结构的优势,提出一种具有高膜基结合力和高韧性的抗冲蚀纳米多层梯度复合涂层结构;同时,通过有效结合表面渗氮、离子注入和磁过滤真空阴极弧沉积、磁过滤真空阴极弧溅射等多种表面强化处理技术提出一种制备上述纳米多层梯度复合的抗冲蚀涂层的方法。具体发明内容如下:In view of the above-mentioned technical background, one of the purposes of the present invention is to combine the advantages of nitriding structure, ion implantation structure, nano-multi-layer structure and gradient structure, and propose a kind of anti-erosion nano-multi-layer with high film-base bonding force and high toughness Gradient composite coating structure; at the same time, through the effective combination of surface nitriding, ion implantation and magnetic filtration vacuum cathode arc deposition, magnetic filtration vacuum cathode arc sputtering and other surface strengthening treatment technologies, a method for preparing the above-mentioned nano-multilayer gradient composite is proposed. Methods for Erosion Resistant Coatings. Concrete invention content is as follows:
1、涂层结构包括渗氮结构、“嵌入式结合层”、纳米多层结构和梯度结构于一体。从基体到涂层表面依次层叠有渗氮层、离子注入层,以及由Ti金属层、Ti→TiN梯度层和TiN/Ti纳米多层结构顺序循环叠加组成的重复结构,三者共同构成纳米多层梯度复合的抗冲蚀涂层结构;所述重复结构重复循环层叠n次,n的取值范围为大于0的正整数。1. The coating structure includes a nitriding structure, an "embedded bonding layer", a nano-multilayer structure and a gradient structure. From the substrate to the surface of the coating, there are nitrided layer, ion implanted layer, and a repeating structure composed of Ti metal layer, Ti→TiN gradient layer and TiN/Ti nano-multilayer structure. An anti-erosion coating structure with gradient layers; the repeating structure is stacked n times repeatedly, and the value range of n is a positive integer greater than 0.
2、表面渗氮层深度为20~50um;嵌入式结合层的注入深度为60~200nm。优选范围为100~160nm。2. The depth of the surface nitriding layer is 20-50um; the implantation depth of the embedded bonding layer is 60-200nm. The preferred range is 100 to 160 nm.
3、在所述复合涂层结构的一个或多个重复结构中,金属Ti层、Ti→TiN梯度层以及TiN/Ti纳米多层结构的厚度比为1:(0.5~3):(0.5~9);3. In one or more repeating structures of the composite coating structure, the thickness ratio of the metal Ti layer, the Ti→TiN gradient layer and the TiN/Ti nano-multilayer structure is 1: (0.5~3): (0.5~ 9);
4、在所述TiN/Ti纳米多层结构中,Ti层与TiN层的厚度均大于10nm,且不超过100nm,且厚度比为1:(0.5~9);4. In the TiN/Ti nano-multilayer structure, the thicknesses of the Ti layer and the TiN layer are both greater than 10 nm and not more than 100 nm, and the thickness ratio is 1: (0.5-9);
5、所述复合涂层结构的总厚度为18~24um;5. The total thickness of the composite coating structure is 18-24um;
6、在所述复合涂层结构中,由Ti金属层、Ti→TiN梯度层、和TiN/Ti纳米多层的顺序循环叠加组成的重复结构,循环层叠n次,n的取值范围为0<n≤10的正整数。6. In the composite coating structure, a repeating structure composed of Ti metal layer, Ti→TiN gradient layer, and TiN/Ti nanometer multi-layer sequentially stacked is stacked n times, and the value range of n is 0 <n≤10 positive integer.
7、所述基体为不锈钢、TC11和TC4基体中的一种或多种。7. The substrate is one or more of stainless steel, TC11 and TC4 substrates.
8、结合了表面渗氮、金属真空蒸汽离子源注入、磁过滤真空阴极弧沉积、磁过滤真空阴极弧溅射以及可编译流量控制器多种技术其中表面渗氮技术可使基体表面及亚表面的材料属性与涂层材料相似,以缓解膜基交界处的应力集中现象;金属真空蒸汽离子源注入方法用于对渗氮后的基体表面进行离子注入,形成“嵌入式结合层”;结合磁过滤真空阴极弧沉积方法和可编译流量控制器,通过连续控制输入的N2流量,可依次制备Ti金属层、Ti→TiN梯度层、TiN陶瓷层和TiN/Ti纳米多层结构;磁过滤真空阴极弧溅射技术是为了避免涂层内部形成过大的内应力而影响其综合性能性能。8. Combining surface nitriding, metal vacuum vapor ion source implantation, magnetic filtration vacuum cathode arc deposition, magnetic filtration vacuum cathode arc sputtering and compilable flow controller technologies. The surface nitriding technology can make the substrate surface and subsurface The material properties of the coating material are similar to those of the coating material, so as to alleviate the stress concentration phenomenon at the junction of the film base; the metal vacuum vapor ion source implantation method is used to perform ion implantation on the substrate surface after nitriding to form an "embedded bonding layer"; Filtration vacuum cathodic arc deposition method and compilable flow controller, by continuously controlling the input N2 flow rate, Ti metal layer, Ti→TiN gradient layer, TiN ceramic layer and TiN/Ti nano-multilayer structure can be prepared sequentially; magnetic filtration vacuum cathode The arc sputtering technology is to avoid excessive internal stress in the coating and affect its comprehensive performance.
9、其中各层结构的具体制备方法包括如下步骤采用辉光等离子渗氮技术,对基体进行表面渗氮处理,渗氮气体为NH3,辉光电压为700~1000V,电流为12~15A,炉内真空度为100~150Pa,渗氮温度为300℃,渗氮时间为1~4h;。9. The specific preparation method of each layer structure includes the following steps using glow plasma nitriding technology to carry out surface nitriding treatment on the substrate, the nitriding gas is NH 3 , the glow voltage is 700-1000V, and the current is 12-15A. The vacuum degree in the furnace is 100-150Pa, the nitriding temperature is 300°C, and the nitriding time is 1-4h;
1)其中各层结构的具体制备方法包括如下步骤采用辉光等离子渗氮技术,对基体进行表面渗氮处理,渗氮气体为NH3,辉光电压为700~1000V,电流为12~15A,炉内真空度为100~150Pa,渗氮温度为300℃,渗氮时间为1~4h;以下参数如可以优选,请给出优选范围。1) The specific preparation method of each layer structure includes the following steps using glow plasma nitriding technology to carry out surface nitriding treatment on the substrate, the nitriding gas is NH 3 , the glow voltage is 700-1000V, and the current is 12-15A. The vacuum degree in the furnace is 100-150Pa, the nitriding temperature is 300°C, and the nitriding time is 1-4h; if the following parameters can be optimized, please give the preferred range.
2)采用金属真空蒸汽离子源注入方法制备离子注入结合层,其特征在于:真空度为1.0×10-4~1.0×10-3Pa,注入电压为8~15kV,束流强度为4~8mA,注入离子总剂量为1.0×1015~1.0×1016/cm-2;2) The ion implantation bonding layer is prepared by metal vacuum vapor ion source implantation method, which is characterized in that: the degree of vacuum is 1.0×10 -4 ~ 1.0×10 -3 Pa, the implantation voltage is 8~15kV, and the beam intensity is 4~8mA , the total dose of implanted ions is 1.0×10 15 ~1.0×10 16 /cm -2 ;
3)采用磁过滤真空阴极弧沉积方法制备Ti金属层,其特征在于:利用90°磁过滤弯管,磁场电流2~4A,真空度为1.0×10-4~1.0×10-3Pa,起弧电流为100~110A,负偏压为200~250V,占空比为85%~90%,束流强度为700~800mA;3) The Ti metal layer is prepared by magnetic filtration vacuum cathodic arc deposition method, which is characterized in that: a 90° magnetic filtration elbow is used, the magnetic field current is 2 to 4A, and the vacuum degree is 1.0×10 -4 to 1.0×10 -3 Pa. The arc current is 100-110A, the negative bias voltage is 200-250V, the duty cycle is 85%-90%, and the beam current intensity is 700-800mA;
4)结合磁过滤真空阴极弧沉积方法和可编译流量控制器,通过连续控制输入的N2流量,制备金属Ti→TiN梯度结构,其特征在于:利用90°磁过滤弯管,真空度为1.0×10-4~5.0×10-3Pa,起弧电流为100~110A,负偏压为200~250V,占空比为85%~90%,束流强度为700~800mA,N2流量以正比例函数(y=kt,k>0)、二次函数(递增部分y=at2,a>0)或正弦函数(递增部分y=nsin2πft,n=20~32,)的形式从0sccm逐渐递增到20~32sccm,优选流量为26sccm;4) Combining the magnetic filtration vacuum cathodic arc deposition method and the compilable flow controller, the metal Ti → TiN gradient structure is prepared by continuously controlling the input N flow rate, which is characterized in that: a 90° magnetic filtration elbow is used, and the vacuum degree is 1.0 ×10 -4 ~5.0×10 -3 Pa, the arcing current is 100~110A, the negative bias voltage is 200~250V, the duty cycle is 85%~90%, the beam current intensity is 700~800mA, and the N 2 flow rate is above Proportional function (y=kt, k>0), quadratic function (incremental part y=at 2 , a>0) or sine function (incremental part y=nsin2πft, n=20~32, ) gradually increases from 0sccm to 20-32sccm, and the preferred flow rate is 26sccm;
5)结合磁过滤真空阴极弧沉积方法和可编译流量控制器,通过控制N2流量在最大流量(20~32sccm)和0sccm之间快速循环切换。制备TiN/Ti纳米多层结构,其特征在于:利用90°磁过滤弯管,真空度为1.0×10-4~5.0×10-3Pa,起弧电流为100~110A,负偏压为200~250V,占空比为85%~90%,束流强度为700~800mA;5) Combining the magnetic filtration vacuum cathodic arc deposition method and the programmable flow controller, by controlling the N 2 flow rate to switch between the maximum flow rate (20-32 sccm) and 0 sccm in a rapid cycle. Preparation of TiN/Ti nano multi-layer structure, characterized in that: using a 90° magnetic filter elbow, the vacuum degree is 1.0×10 -4 ~ 5.0×10 -3 Pa, the arcing current is 100 ~ 110A, and the negative bias is 200 ~250V, duty cycle 85%~90%, beam intensity 700~800mA;
6)在制备过程中,为避免涂层内部形成过大的内应力而影响其抗冲蚀性能,在除表面渗氮和离子注入外的制备过程中,采用磁过滤阴极真空弧溅射的方法,每30~40分钟进行一次Ti溅射,溅射时的N2流量为0sccm,起弧电流为110~120A,负偏压依次为-800V、-600V和-400V,占空比为85%~90%,且每个负偏压下保持30~40s。6) In the preparation process, in order to avoid the formation of excessive internal stress inside the coating and affect its erosion resistance, in the preparation process except surface nitriding and ion implantation, the method of magnetic filter cathode vacuum arc sputtering is adopted , Ti sputtering is carried out every 30 to 40 minutes, the N2 flow rate during sputtering is 0sccm, the arcing current is 110 to 120A, the negative bias voltage is -800V, -600V and -400V in turn, and the duty cycle is 85% ~90%, and keep for 30~40s under each negative bias.
10、依次使用400~600、800~1000、1200以及2000目的砂纸对TC4基体试样进行粗磨和细磨至无明显的横纵向磨痕,再使用抛光绒布和金刚石抛光膏对细磨后的样品进行抛光处理,直至样品的表面粗糙度达到Ra=0.02±0.005μm。10. Use 400-600, 800-1000, 1200, and 2000-mesh sandpaper in sequence to roughly grind and finely grind the TC4 substrate sample until there are no obvious horizontal and vertical grinding marks, and then use polishing flannelette and diamond polishing paste to finely grind the sample. The sample is polished until the surface roughness of the sample reaches Ra=0.02±0.005 μm.
经抛光处理后的基材,在装夹镀膜前须先后采用无水乙醇和丙酮进行超声波清洗2次,每次10分钟,并迅速用高纯氮气吹干。The polished substrate must be ultrasonically cleaned twice with absolute ethanol and acetone before clamping and coating, each time for 10 minutes, and quickly dried with high-purity nitrogen.
相对于现有技术,本发明具有以下优势:Compared with the prior art, the present invention has the following advantages:
1、本发明提出的纳米多层梯度复合的抗冲蚀涂层结构,相比于传统的单一多层结构、梯度结构或纳米结构而言,本发明通过分析各类涂层结构的优势,并结合多种表面强化处理技术的特点,提出了一种集渗氮结构、离子注入结构、纳米多层结构和梯度结构于一体的复合涂层结构。该涂层结构不但兼具了高膜基结合力和纳米多层结构的超硬特质,梯度结构的加入还解决了多层结构中由于层间界面两侧的材料属性差别迥异而导致的应力集中问题,故冲击韧性亦很好,特别适用于沉积在直升机发动机压气机叶片上,以抵抗砂尘颗粒的高速冲蚀,具有很大的应用价值。1. Compared with the traditional single multilayer structure, gradient structure or nanostructure, the anti-erosion coating structure of the nano-multilayer gradient compound proposed by the present invention, the present invention analyzes the advantages of various coating structures, Combining the characteristics of various surface strengthening treatment technologies, a composite coating structure integrating nitriding structure, ion implantation structure, nano-multilayer structure and gradient structure is proposed. The coating structure not only combines high film-base bonding force and superhard properties of the nano-multilayer structure, but also solves the stress concentration caused by the difference in material properties on both sides of the interlayer interface in the multilayer structure. Therefore, the impact toughness is also very good, especially suitable for depositing on the blades of the compressor of the helicopter engine to resist the high-speed erosion of sand and dust particles, and has great application value.
2、本发明提出了一套沉积所述纳米多层梯度复合涂层的制备方法,与传统磁控溅射、离子镀等PVD沉积方法相比,本发明实施例提出的制备方法有效地结合了表面渗氮、离子注入和磁过滤真空阴极弧等离子体沉积等多种表面强化处理技术,其中表面渗氮使基体表面及其亚表面的材料属性与涂层材料相似,以缓解膜基交界处的应力集中现象,为膜基结合力的提高奠定基础;离子注入技术中载能离子通过注入到基体亚表面,使基体亚表面与注入离子形成金属-基材原子混合存在,而没有分界面的强化结合层,这种“嵌入式结合层”能有效地使基体和涂层紧密连接在一起,以获得超高的膜基结合力。而磁过滤弯管的存在可过滤掉几乎所有的中性粒子、液滴及大颗粒等,有利于提高膜层的致密性、纯度以及表面粗糙度等。2. The present invention proposes a set of preparation methods for depositing the nano-multilayer gradient composite coating. Compared with traditional PVD deposition methods such as magnetron sputtering and ion plating, the preparation method proposed in the embodiments of the present invention effectively combines Various surface strengthening treatment technologies such as surface nitriding, ion implantation, and magnetic filtration vacuum cathode arc plasma deposition, among which surface nitriding makes the material properties of the substrate surface and its subsurface similar to that of the coating material, so as to alleviate the damage at the junction of the film and substrate. The phenomenon of stress concentration lays the foundation for the improvement of the bonding force of the membrane base; in ion implantation technology, energy-carrying ions are implanted into the subsurface of the substrate, so that the subsurface of the substrate and the implanted ions form metal-substrate atoms mixed with each other, without strengthening the interface Bonding layer, this "embedded bonding layer" can effectively make the substrate and coating closely connected together to obtain super high film-base bonding force. The existence of the magnetic filter elbow can filter out almost all neutral particles, liquid droplets and large particles, which is beneficial to improve the compactness, purity and surface roughness of the film layer.
3、本发明提出了在膜层沉积过程中,每40分钟进行一次Ti溅射,该工艺的加入一方面可以部分地释放已沉积膜层中的内应力,另一方面由于溅射过程中,基体负偏压被设置得很高(依次为-800V、-600V及-400V),钛离子得到快速加速,并撞击基体表面,使基体升温,以减少后续沉积过程中内应力的产生,从而提高复合涂层的整体韧性和抗冲蚀性能。3. The present invention proposes to perform Ti sputtering every 40 minutes during the film deposition process. The addition of this process can partially release the internal stress in the deposited film on the one hand, and on the other hand, due to the sputtering process, The negative bias voltage of the substrate is set very high (-800V, -600V and -400V in turn), and the titanium ions are rapidly accelerated and hit the surface of the substrate to heat up the substrate to reduce the generation of internal stress in the subsequent deposition process, thereby improving Overall toughness and erosion resistance of composite coatings.
附图说明Description of drawings
图1是本发明的涂层结构示意图;Fig. 1 is a schematic view of the coating structure of the present invention;
图2为本发明实施例3提供的涂层与某传统多层涂层(对比例1)膜基结合力的对比。其中(a)图为某传统多层涂层的划痕法声发射信号,(b)图为本发明实施例3提出涂层的划痕法声发射信号,通过对比两种涂层经划痕法测试的声发射信号可知,传统涂层的膜基结合力约为58N,而本发明实施例制备的涂层的膜基结合力可达到95N,较传统多层涂层的膜基结合力提高了约70%。Fig. 2 is a comparison of the coating provided by Example 3 of the present invention and a traditional multi-layer coating (comparative example 1) film base binding force. Wherein (a) figure is the scratch method acoustic emission signal of a certain traditional multi-layer coating, (b) figure is the scratch method acoustic emission signal of the coating proposed in embodiment 3 of the present invention, by comparing two kinds of coatings through scratching It can be known from the acoustic emission signal tested by the method that the film base binding force of the traditional coating is about 58N, while the film base binding force of the coating prepared in the embodiment of the present invention can reach 95N, which is improved compared with the film base binding force of the traditional multilayer coating. up about 70%.
图3为本发明实施例提供的涂层与传统多层涂层的洛式压痕形貌对比,其中(a)图为传统涂层(对比例1)的洛氏压痕形貌,(b)图为本发明提出涂层的洛氏压痕形貌,经对比两种涂层的洛氏压痕形貌,并统计压痕周边的裂纹长度和数量,发现在相同的加载条件下,传统多层涂层的压痕周围出现了明显的脆性剥落现象,且压痕周边的裂纹长度和数量也明显多于本发明提出的涂层(实施例1),由此可知本发明提出的涂层韧性远好于传统多层涂层的韧性。Fig. 3 compares the Rockwell indentation appearance of the coating provided by the embodiment of the present invention and the traditional multilayer coating, wherein (a) figure is the Rockwell indentation appearance of the traditional coating (comparative example 1), (b ) The figure shows the Rockwell indentation appearance of the coating proposed by the present invention. After comparing the Rockwell indentation appearance of the two coatings, and counting the crack length and quantity around the indentation, it is found that under the same loading conditions, the traditional There is obvious brittle peeling phenomenon around the indentation of the multilayer coating, and the crack length and quantity around the indentation are also obviously more than the coating (embodiment 1) proposed by the present invention, thus it can be known that the coating proposed by the present invention The toughness is much better than that of traditional multi-layer coatings.
图4为本发明中各实施例的纳米硬度及显微硬度值的对比图。从图中可以看出本发明提出的涂层实施例(实施例1~3)较传统多层涂层(对比例1)具有更高的纳米硬度和显微硬度值,提高了约60%。Fig. 4 is a comparison chart of nanohardness and microhardness values of various examples in the present invention. It can be seen from the figure that the coating examples proposed by the present invention (Examples 1-3) have higher nanohardness and microhardness values than the traditional multilayer coating (Comparative Example 1), which are about 60% higher.
图5为本发明中各实施例在沙尘冲蚀作用下,平均质量损失率的对比图。从图中可以看出本发明提出的涂层实施例(实施例1~3)较传统多层涂层(对比例1)的质量损失率降低了约90%,具有非常高高的抗冲蚀性能。Fig. 5 is a comparison chart of the average mass loss rate of each embodiment of the present invention under the action of sand and dust erosion. As can be seen from the figure, the mass loss rate of the coating embodiments (embodiments 1-3) proposed by the present invention has been reduced by about 90% compared with traditional multilayer coatings (comparative example 1), and has very high erosion resistance performance.
具体实施方式detailed description
下面将详细介绍本发明高抗冲蚀性梯度多层复合涂层结构及其制备方法的几种实施例(实施例1~3),以及一种传统多层涂层的制备实施例(对比例1)具体实施步骤如下:Several embodiments (embodiments 1 to 3) of the high erosion resistance gradient multilayer composite coating structure and preparation method thereof of the present invention will be described in detail below, as well as a preparation example (comparative example) of a traditional multilayer coating 1) The specific implementation steps are as follows:
实施例1:Example 1:
1)基体的抛光与清洗1) Polishing and cleaning of the substrate
依次使用400~600、800~1000、1200以及2000目的砂纸对TC4基体试样进行粗磨和细磨至无明显横纵向磨痕,再使用抛光绒布和金刚石抛光膏对细磨后的样品进行抛光处理,直至样品的表面粗糙度达到Ra=0.02±0.005μm。Use 400-600, 800-1000, 1200 and 2000 mesh sandpaper in turn to rough and finely grind the TC4 substrate sample until there are no obvious horizontal and vertical grinding marks, and then use polishing flannelette and diamond polishing paste to polish the finely ground sample Process until the surface roughness of the sample reaches Ra=0.02±0.005 μm.
经抛光处理后的基材,在装夹镀膜前须先后采用无水乙醇和丙酮进行超声波清洗2次,每次10分钟,并迅速用高纯氮气吹干。The polished substrate must be ultrasonically cleaned twice with absolute ethanol and acetone before clamping and coating, each time for 10 minutes, and quickly dried with high-purity nitrogen.
2)表面渗氮处理2) surface nitriding treatment
对基体进行表面渗氮的处理过程如下:采用辉光等离子渗氮技术,对基体进行表面渗氮处理,渗氮气体为NH3,辉光电压为800V,电流为13A,炉内真空度为100Pa,渗氮温度为400℃,渗氮时间为1h。The process of nitriding the surface of the substrate is as follows: using glow plasma nitriding technology, nitriding the surface of the substrate, the nitriding gas is NH 3 , the glow voltage is 800V, the current is 13A, and the vacuum in the furnace is 100Pa , Nitriding temperature is 400 ℃, nitriding time is 1h.
3)“嵌入式结合层”制备3) Preparation of "Embedded Bonding Layer"
在基体表面及亚表面制备“嵌入式结合层”包括三个步骤:The preparation of "embedded bonding layer" on the surface and subsurface of the substrate includes three steps:
首先利用金属真空蒸汽离子源(MEVVA),先向经渗氮处理后的基体表面预注入一定量的Ti元素,预注入电压为8.2kV,束流为5A,注入剂量为5.6×1014/cm2;然后关闭金属真空蒸汽离子源,利用磁过滤真空弧沉积系统(FCVA)在基体表面沉积一层纳米量级的金属Ti,沉积纳米Ti层的基体偏压为-200V,占空比为90%,起弧电流为100mA,磁过滤电场电流为2.0A,电压为24.2V,沉积时长为10s;最后利用金属真空蒸汽离子源(MEVVA),提高注入电压,在纳米Ti层和基体材料中注入大剂量的Ti元素,以最终形成提高膜基结合力的“嵌入式结合层”,此时Ti离子的注入电压为12kV,束流为5.8mA,注入剂量为8.2×1014/cm2。Firstly, using metal vacuum vapor ion source (MEVVA), a certain amount of Ti element is pre-implanted on the substrate surface after nitriding treatment, the pre-implantation voltage is 8.2kV, the beam current is 5A, and the implantation dose is 5.6×10 14 /cm 2 ; then close the metal vacuum vapor ion source, utilize the magnetic filter vacuum arc deposition system (FCVA) to deposit a layer of nano-scale metal Ti on the surface of the substrate, the substrate bias of the deposited nano-Ti layer is-200V, and the duty cycle is 90 %, the arcing current is 100mA, the magnetic filter electric field current is 2.0A, the voltage is 24.2V, and the deposition time is 10s; finally, the metal vacuum vapor ion source (MEVVA) is used to increase the injection voltage, and inject A large dose of Ti element is used to finally form an "embedded bonding layer" that improves the bonding force of the membrane base. At this time, the implantation voltage of Ti ions is 12kV, the beam current is 5.8mA, and the implantation dose is 8.2×10 14 /cm 2 .
4)金属过渡Ti层沉积4) Metal transition Ti layer deposition
利用磁过滤真空弧沉积(FCVA)系统在“嵌入式结合层”上进行金属Ti过渡层的沉积,具体工艺参数如下:磁过滤电流:2.0A,电压:24.2V,真空度为8.0×10-4Pa,起弧电流为100A,负偏压为-200V,占空比为90%,束流强度为700mA,沉积时长30mins;The metal Ti transition layer was deposited on the "embedded bonding layer" using a magnetic filter vacuum arc deposition (FCVA) system. The specific process parameters are as follows: magnetic filter current: 2.0A, voltage: 24.2V, vacuum degree: 8.0×10 - 4 Pa, the starting current is 100A, the negative bias voltage is -200V, the duty cycle is 90%, the beam intensity is 700mA, and the deposition time is 30mins;
5)Ti→TiN梯度结构沉积5) Ti→TiN gradient structure deposition
利用磁过滤真空弧沉积(FCVA)系统,通过可编译流量控制器,对输入的N2流量进行实时连续控制,在金属过渡层上沉积由金属Ti逐渐向陶瓷TiN转变的梯度结构。具体工艺参数如下:真空度为8.0×10-4~5.0×10-3Pa,起弧电流为100A,负偏压为200V,占空比为90%,束流强度为700mA,N2流量以正比例函数y=0.007t(t表示沉积时间)形式从0sccm逐渐递增到26sccm,沉积时长60mins。A magnetic filtered vacuum arc deposition (FCVA) system is used to continuously control the input N2 flow through a programmable flow controller in real time, and a gradient structure gradually transforming from metallic Ti to ceramic TiN is deposited on the metal transition layer. The specific process parameters are as follows: the degree of vacuum is 8.0×10 -4 ~5.0×10 -3 Pa, the arcing current is 100A, the negative bias voltage is 200V, the duty cycle is 90%, the beam intensity is 700mA, and the N2 flow rate is The form of the proportional function y=0.007t (t represents the deposition time) gradually increases from 0 sccm to 26 sccm, and the deposition time is 60 mins.
6)TiN/Ti纳米多层结构沉积6) TiN/Ti nano multilayer structure deposition
利用磁过滤真空弧沉积(FCVA)系统,通过可编译流量控制器,对输入的N2流量实现在26sccm和0sccm两种流量之间的阶跃式循环切换,具体工艺参数如下:真空度为1.0×10-4~5.0×10-3Pa,起弧电流为100A,负偏压为200V,占空比为90%,束流强度为700~800mA,其中每个纳米Ti层沉积时长为12s,每个纳米TiN层沉积时长为48s,TiN/Ti纳米多层结构的总沉积时长为90min。Utilize the magnetic filtration vacuum arc deposition (FCVA) system, through the compilable flow controller, realize the step type cycle switch between 26sccm and 0sccm two kinds of flows to the input N flow, the specific process parameters are as follows: the vacuum degree is 1.0 ×10 -4 ~5.0×10 -3 Pa, the arcing current is 100A, the negative bias voltage is 200V, the duty cycle is 90%, the beam current intensity is 700~800mA, and the deposition time of each nano-Ti layer is 12s, The deposition time of each nano-TiN layer is 48s, and the total deposition time of the TiN/Ti nano-multilayer structure is 90min.
此外,在除表面渗氮和离子注入之外的其他膜层沉积过程中,每沉积40分钟,进行一次Ti离子溅射。该工艺一方面可以释放已沉积膜层中的内应力,另一方面,Ti离子高速撞击基体,可提高基体温度,以减少后续内应力的产生,从而提高膜层的整体韧性等机械性能。具体工艺参数如下:起弧电流:110mA,磁过滤电流:2.0A,电压:24.2V,基体偏压依次调至-800V、-600V和-400V,并在各偏压下分别溅射30s。In addition, Ti ion sputtering was carried out every 40 minutes during deposition of other film layers except surface nitriding and ion implantation. On the one hand, this process can release the internal stress in the deposited film. On the other hand, Ti ions hit the substrate at high speed, which can increase the temperature of the substrate to reduce the generation of subsequent internal stress, thereby improving the overall toughness and other mechanical properties of the film. The specific process parameters are as follows: arcing current: 110mA, magnetic filter current: 2.0A, voltage: 24.2V, the substrate bias voltage was adjusted to -800V, -600V and -400V in turn, and sputtering was performed under each bias voltage for 30s.
实施例2:Example 2:
1)基体的抛光与清洗1) Polishing and cleaning of the substrate
依次使用400~600、800~1000、1200以及2000目的砂纸对TC4基体试样进行粗磨和细磨,再使用抛光绒布和金刚石抛光膏对细磨后的样品进行抛光处理,直至样品的表面粗糙度达到Ra=0.02±0.005μm。Use 400-600, 800-1000, 1200 and 2000 mesh sandpaper in sequence to rough and finely grind the TC4 matrix sample, and then use polishing flannelette and diamond polishing paste to polish the finely ground sample until the surface of the sample is rough The degree reaches Ra=0.02±0.005μm.
经抛光处理后的基材,在装夹镀膜前须先后采用无水乙醇和丙酮进行超声波清洗10分钟,并迅速用高纯氮气吹干。After polishing, the substrate must be ultrasonically cleaned with absolute ethanol and acetone for 10 minutes before clamping and coating, and then quickly dried with high-purity nitrogen.
2)表面渗氮处理2) surface nitriding treatment
对基体进行表面渗氮的处理过程如下:采用辉光等离子渗氮技术,对基体进行表面渗氮处理,渗氮气体为NH3,辉光电压为800V,电流为13A,炉内真空度为100Pa,渗氮温度为400℃,渗氮时间为1h。The process of nitriding the surface of the substrate is as follows: using glow plasma nitriding technology, nitriding the surface of the substrate, the nitriding gas is NH 3 , the glow voltage is 800V, the current is 13A, and the vacuum in the furnace is 100Pa , Nitriding temperature is 400 ℃, nitriding time is 1h.
3)“嵌入式结合层”制备3) Preparation of "Embedded Bonding Layer"
在基体表面及亚表面制备“嵌入式结合层”包括三个步骤:The preparation of "embedded bonding layer" on the surface and subsurface of the substrate includes three steps:
首先利用金属真空蒸汽离子源(MEVVA),先向经渗氮处理后的基体表面预注入一定量的Ti元素,预注入电压为8.2kV,束流为5A,注入剂量为5.6×1014/cm2;然后关闭金属真空蒸汽离子源,利用磁过滤真空弧沉积系统(FCVA)在基体表面沉积一层纳米量级的金属Ti,沉积纳米Ti层的基体偏压为-200V,占空比为90%,起弧电流为100mA,磁过滤电场电流为2.0A,电压为24.2V,沉积时长为10s;最后利用金属真空蒸汽离子源(MEVVA),提高注入电压,在纳米Ti层和基体材料中注入大剂量的Ti元素,以最终形成提高膜基结合力的“嵌入式结合层”,此时Ti离子的注入电压为12kV,束流为5.8mA,注入剂量为8.2×1014/cm2。Firstly, using metal vacuum vapor ion source (MEVVA), a certain amount of Ti element is pre-implanted on the substrate surface after nitriding treatment, the pre-implantation voltage is 8.2kV, the beam current is 5A, and the implantation dose is 5.6×10 14 /cm 2 ; then close the metal vacuum vapor ion source, utilize the magnetic filter vacuum arc deposition system (FCVA) to deposit a layer of nano-scale metal Ti on the surface of the substrate, the substrate bias of the deposited nano-Ti layer is-200V, and the duty cycle is 90 %, the arcing current is 100mA, the magnetic filter electric field current is 2.0A, the voltage is 24.2V, and the deposition time is 10s; finally, the metal vacuum vapor ion source (MEVVA) is used to increase the injection voltage, and inject A large dose of Ti element is used to finally form an "embedded bonding layer" that improves the bonding force of the membrane base. At this time, the implantation voltage of Ti ions is 12kV, the beam current is 5.8mA, and the implantation dose is 8.2×10 14 /cm 2 .
4)金属过渡Ti层沉积4) Metal transition Ti layer deposition
利用磁过滤真空弧沉积(FCVA)系统在“嵌入式结合层”上进行金属Ti过渡层的沉积,具体工艺参数如下:磁过滤电流:2.0A,电压:24.2V,真空度为8.0×10-4Pa,起弧电流为100A,负偏压为-200V,占空比为90%,束流强度为700mA,沉积时长15min;The metal Ti transition layer was deposited on the "embedded bonding layer" using a magnetic filter vacuum arc deposition (FCVA) system. The specific process parameters are as follows: magnetic filter current: 2.0A, voltage: 24.2V, vacuum degree: 8.0×10 - 4 Pa, the starting current is 100A, the negative bias is -200V, the duty cycle is 90%, the beam intensity is 700mA, and the deposition time is 15min;
5)Ti→TiN梯度结构沉积5) Ti→TiN gradient structure deposition
利用磁过滤真空弧沉积(FCVA)系统,通过可编译流量控制器,对输入的N2流量进行实时连续控制,在金属过渡层上沉积由金属Ti逐渐向陶瓷TiN转变的梯度结构。具体工艺参数如下:真空度为8.0×10-4~5.0×10-3Pa,起弧电流为100A,负偏压为200V,占空比为90%,束流强度为700mA,N2流量以正比例函数y=0.0144t(t表示沉积时间)形式从0sccm逐渐递增到26sccm,沉积时长30min。A magnetic filtered vacuum arc deposition (FCVA) system is used to continuously control the input N2 flow through a programmable flow controller in real time, and a gradient structure gradually transforming from metallic Ti to ceramic TiN is deposited on the metal transition layer. The specific process parameters are as follows: the degree of vacuum is 8.0×10 -4 ~5.0×10 -3 Pa, the arcing current is 100A, the negative bias voltage is 200V, the duty cycle is 90%, the beam intensity is 700mA, and the N2 flow rate is The form of the proportional function y=0.0144t (t represents the deposition time) gradually increases from 0 sccm to 26 sccm, and the deposition time is 30 min.
6)TiN/Ti纳米多层结构沉积6) TiN/Ti nano multilayer structure deposition
利用磁过滤真空弧沉积(FCVA)系统,通过可编译流量控制器,对输入的N2流量实现在26sccm和0sccm两种流量之间的阶跃式循环切换,具体工艺参数如下:真空度为1.0×10-4~5.0×10-3Pa,起弧电流为100A,负偏压为200V,占空比为90%,束流强度为700~800mA,其中每个纳米Ti层沉积时长为12s,每个纳米TiN层沉积时长为48s,TiN/Ti纳米多层结构的总沉积时长为45min。Utilize the magnetic filtration vacuum arc deposition (FCVA) system, through the compilable flow controller, realize the step type cycle switch between 26sccm and 0sccm two kinds of flows to the input N flow, the specific process parameters are as follows: the vacuum degree is 1.0 ×10 -4 ~5.0×10 -3 Pa, the arcing current is 100A, the negative bias voltage is 200V, the duty cycle is 90%, the beam current intensity is 700~800mA, and the deposition time of each nano-Ti layer is 12s, The deposition time of each nano-TiN layer is 48s, and the total deposition time of the TiN/Ti nano-multilayer structure is 45min.
7)调制周期的循环叠加7) Cyclic superposition of modulation period
将步骤(4)~(6)中的工艺循环操作2次。The process cycle in steps (4)-(6) is operated twice.
此外,在除表面渗氮和离子注入之外的其他膜层沉积过程中,每沉积40分钟,进行一次Ti离子溅射。该工艺一方面可以释放已沉积膜层中的内应力,另一方面,Ti离子高速撞击基体,可提高基体温度,以减少后续内应力的产生,从而提高膜层的整体韧性等机械性能。具体工艺参数如下:起弧电流:110mA,磁过滤电流:2.0A,电压:24.2V,基体偏压依次调至-800V、-600V和-400V,并在各偏压下分别溅射30s。In addition, Ti ion sputtering was carried out every 40 minutes during deposition of other film layers except surface nitriding and ion implantation. On the one hand, this process can release the internal stress in the deposited film. On the other hand, Ti ions hit the substrate at high speed, which can increase the temperature of the substrate to reduce the generation of subsequent internal stress, thereby improving the overall toughness and other mechanical properties of the film. The specific process parameters are as follows: arcing current: 110mA, magnetic filter current: 2.0A, voltage: 24.2V, the substrate bias voltage was adjusted to -800V, -600V and -400V in turn, and sputtering was performed under each bias voltage for 30s.
实施例3:Example 3:
1)基体的抛光与清洗1) Polishing and cleaning of the substrate
依次使用400~600、800~1000、1200以及2000目的砂纸对TC4基体试样进行粗磨和细磨,再使用抛光绒布和金刚石抛光膏对细磨后的样品进行抛光处理,直至样品的表面粗糙度达到Ra=0.02±0.005μm。Use 400-600, 800-1000, 1200 and 2000 mesh sandpaper in sequence to rough and finely grind the TC4 matrix sample, and then use polishing flannelette and diamond polishing paste to polish the finely ground sample until the surface of the sample is rough The degree reaches Ra=0.02±0.005μm.
经抛光处理后的基材,在装夹镀膜前须先后采用无水乙醇和丙酮进行超声波清洗10分钟,并迅速用高纯氮气吹干。After polishing, the substrate must be ultrasonically cleaned with absolute ethanol and acetone for 10 minutes before clamping and coating, and then quickly dried with high-purity nitrogen.
2)表面渗氮处理2) surface nitriding treatment
对基体进行表面渗氮的处理过程如下:采用辉光等离子渗氮技术,对基体进行表面渗氮处理,渗氮气体为NH3,辉光电压为800V,电流为13A,炉内真空度为100Pa,渗氮温度为400℃,渗氮时间为1h。The process of nitriding the surface of the substrate is as follows: using glow plasma nitriding technology, nitriding the surface of the substrate, the nitriding gas is NH 3 , the glow voltage is 800V, the current is 13A, and the vacuum in the furnace is 100Pa , Nitriding temperature is 400 ℃, nitriding time is 1h.
3)“嵌入式结合层”制备3) Preparation of "Embedded Bonding Layer"
在基体表面及亚表面制备“嵌入式结合层”包括三个步骤:The preparation of "embedded bonding layer" on the surface and subsurface of the substrate includes three steps:
首先利用金属真空蒸汽离子源(MEVVA),先向经渗氮处理后的基体表面预注入一定量的Ti元素,预注入电压为8.2kV,束流为5A,注入剂量为5.6×1014/cm2;然后关闭金属真空蒸汽离子源,利用磁过滤真空弧沉积系统(FCVA)在基体表面沉积一层纳米量级的金属Ti,沉积纳米Ti层的基体偏压为-200V,占空比为90%,起弧电流为100mA,磁过滤电场电流为2.0A,电压为24.2V,沉积时长为10s;最后利用金属真空蒸汽离子源(MEVVA),提高注入电压,在纳米Ti层和基体材料中注入大剂量的Ti元素,以最终形成提高膜基结合力的“嵌入式结合层”,此时Ti离子的注入电压为12kV,束流为5.8mA,注入剂量为8.2×1014/cm2。Firstly, using metal vacuum vapor ion source (MEVVA), a certain amount of Ti element is pre-implanted on the substrate surface after nitriding treatment, the pre-implantation voltage is 8.2kV, the beam current is 5A, and the implantation dose is 5.6×10 14 /cm 2 ; then close the metal vacuum vapor ion source, utilize the magnetic filter vacuum arc deposition system (FCVA) to deposit a layer of nano-scale metal Ti on the surface of the substrate, the substrate bias of the deposited nano-Ti layer is-200V, and the duty cycle is 90 %, the arcing current is 100mA, the magnetic filter electric field current is 2.0A, the voltage is 24.2V, and the deposition time is 10s; finally, the metal vacuum vapor ion source (MEVVA) is used to increase the injection voltage, and inject A large dose of Ti element is used to finally form an "embedded bonding layer" that improves the bonding force of the membrane base. At this time, the implantation voltage of Ti ions is 12kV, the beam current is 5.8mA, and the implantation dose is 8.2×10 14 /cm 2 .
4)金属过渡Ti层沉积4) Metal transition Ti layer deposition
利用磁过滤真空弧沉积(FCVA)系统在“嵌入式结合层”上进行金属Ti过渡层的沉积,具体工艺参数如下:磁过滤电流:2.0A,电压:24.2V,真空度为8.0×10-4Pa,起弧电流为100A,负偏压为-200V,占空比为90%,束流强度为700mA,沉积时长10min;The metal Ti transition layer was deposited on the "embedded bonding layer" using a magnetic filter vacuum arc deposition (FCVA) system. The specific process parameters are as follows: magnetic filter current: 2.0A, voltage: 24.2V, vacuum degree: 8.0×10 - 4 Pa, the starting current is 100A, the negative bias is -200V, the duty cycle is 90%, the beam intensity is 700mA, and the deposition time is 10min;
5)Ti→TiN梯度结构沉积5) Ti→TiN gradient structure deposition
利用磁过滤真空弧沉积(FCVA)系统,通过可编译流量控制器,对输入的N2流量进行实时连续控制,在金属过渡层上沉积由金属Ti逐渐向陶瓷TiN转变的梯度结构。具体工艺参数如下:真空度为8.0×10-4~5.0×10-3Pa,起弧电流为100A,负偏压为200V,占空比为90%,束流强度为700mA,N2流量以正比例函数y=0.0144t(t表示沉积时间)形式从0sccm逐渐递增到26sccm,沉积时长20min。A magnetic filtered vacuum arc deposition (FCVA) system is used to continuously control the input N2 flow in real time through a programmable flow controller, and a gradient structure gradually transforming from metallic Ti to ceramic TiN is deposited on the metal transition layer. The specific process parameters are as follows: the degree of vacuum is 8.0×10 -4 ~ 5.0×10 -3 Pa, the arcing current is 100A, the negative bias voltage is 200V, the duty cycle is 90%, the beam intensity is 700mA, and the N2 flow rate is The form of the proportional function y=0.0144t (t represents the deposition time) gradually increases from 0 sccm to 26 sccm, and the deposition time is 20 min.
6)TiN/Ti纳米多层结构沉积6) TiN/Ti nano multilayer structure deposition
利用磁过滤真空弧沉积(FCVA)系统,通过可编译流量控制器,对输入的N2流量实现在26sccm和0sccm两种流量之间的阶跃式循环切换,具体工艺参数如下:真空度为1.0×10-4~5.0×10-3Pa,起弧电流为100A,负偏压为200V,占空比为90%,束流强度为700~800mA,其中每个纳米Ti层沉积时长为12s,每个纳米TiN层沉积时长为48s,TiN/Ti纳米多层结构的总沉积时长为30min。Utilize the magnetic filtration vacuum arc deposition (FCVA) system, through the compilable flow controller, realize the step type cycle switch between 26sccm and 0sccm two kinds of flows to the input N flow, the specific process parameters are as follows: the vacuum degree is 1.0 ×10 -4 ~5.0×10 -3 Pa, the arcing current is 100A, the negative bias voltage is 200V, the duty cycle is 90%, the beam current intensity is 700~800mA, and the deposition time of each nano-Ti layer is 12s, The deposition time of each nano-TiN layer is 48s, and the total deposition time of the TiN/Ti nano-multilayer structure is 30min.
7)调制周期的循环叠加7) Cyclic superposition of modulation period
按照步骤(4)~(6)中的工艺共循环操作4次。According to the process in steps (4)-(6), the operation is circulated for 4 times in total.
此外,在除表面渗氮和离子注入之外的其他膜层沉积过程中,每沉积40分钟,进行一次Ti离子溅射。该工艺一方面可以释放已沉积膜层中的内应力,另一方面,Ti离子高速撞击基体,可提高基体温度,以减少后续内应力的产生,从而提高膜层的整体韧性等机械性能。具体工艺参数如下:起弧电流:110mA,磁过滤电流:2.0A,电压:24.2V,基体偏压依次调至-800V、-600V和-400V,并在各偏压下分别溅射30s。In addition, Ti ion sputtering was carried out every 40 minutes during deposition of other film layers except surface nitriding and ion implantation. On the one hand, this process can release the internal stress in the deposited film. On the other hand, Ti ions hit the substrate at high speed, which can increase the temperature of the substrate to reduce the generation of subsequent internal stress, thereby improving the overall toughness and other mechanical properties of the film. The specific process parameters are as follows: arcing current: 110mA, magnetic filter current: 2.0A, voltage: 24.2V, the substrate bias voltage was adjusted to -800V, -600V and -400V in turn, and sputtering was performed under each bias voltage for 30s.
对比例1(某传统多层涂层的制备方法):Comparative example 1 (the preparation method of certain traditional multi-layer coating):
1)基体的抛光与清洗1) Polishing and cleaning of the substrate
依次使用400~600、800~1000、1200以及2000目的砂纸对TC4基体试样进行粗磨和细磨至无明显横纵向磨痕,再使用抛光绒布和金刚石抛光膏对细磨后的样品进行抛光处理,直至样品的表面粗糙度达到Ra=0.02±0.005μm。Use 400-600, 800-1000, 1200 and 2000 mesh sandpaper in turn to rough and finely grind the TC4 substrate sample until there are no obvious horizontal and vertical grinding marks, and then use polishing flannelette and diamond polishing paste to polish the finely ground sample Process until the surface roughness of the sample reaches Ra=0.02±0.005 μm.
经抛光处理后的基材,在装夹镀膜前须先后采用无水乙醇和丙酮进行超声波清洗2次,每次10分钟,并迅速用高纯氮气吹干。The polished substrate must be ultrasonically cleaned twice with absolute ethanol and acetone before clamping and coating, each time for 10 minutes, and quickly dried with high-purity nitrogen.
2)金属过渡Ti层沉积2) Metal transition Ti layer deposition
利用磁过滤真空弧沉积(FCVA)系统在“嵌入式结合层”上进行金属Ti过渡层的沉积,具体工艺参数如下:磁过滤电流:2.0A,电压:24.2V,真空度为8.0×10-4Pa,起弧电流为100A,负偏压为-200V,占空比为90%,束流强度为700mA,沉积时长10mins;The metal Ti transition layer was deposited on the "embedded bonding layer" using a magnetic filter vacuum arc deposition (FCVA) system. The specific process parameters are as follows: magnetic filter current: 2.0A, voltage: 24.2V, vacuum degree: 8.0×10 - 4 Pa, the starting current is 100A, the negative bias is -200V, the duty cycle is 90%, the beam intensity is 700mA, and the deposition time is 10mins;
3)TiN陶瓷层沉积3) TiN ceramic layer deposition
利用磁过滤真空弧沉积(FCVA)系统,通过可编译流量控制器使输入的N2流量保持为26sccm不变,在Ti→TiN梯度结构上沉积TiN陶瓷层。具体工艺参数如下:真空度不低于8×10-3Pa,基体偏压:-200V,占空比:90%,起弧电流:100mA,磁过滤电流:2.0A,电压:24.2V,沉积时长为40min。A TiN ceramic layer was deposited on the Ti→TiN gradient structure using a magnetic filtered vacuum arc deposition (FCVA) system with the input N flow rate kept constant at 26 sccm by a programmable flow controller. The specific process parameters are as follows: vacuum degree not less than 8×10 -3 Pa, substrate bias voltage: -200V, duty cycle: 90%, arcing current: 100mA, magnetic filter current: 2.0A, voltage: 24.2V, deposition The duration is 40 minutes.
4)调制周期的循环叠加4) Cyclic superposition of modulation period
按照步骤(4)~(6)中的工艺共循环操作4次。According to the process in steps (4)-(6), the operation is circulated for 4 times in total.
需要说明的是,为了简单描述,上述实施例是根据具体的实施方式将其表述为一系列步骤的组合,但并不能认定本发明的具体实施方式仅限于此。在本发明的精神和原则之内,本领域技术人员可以在上述实施例的基础上进行各种变形和改进,而这些变形和改进落在本发明的保护范围内。本领域技术人员应该明白,说明书中所描述的实施例均属于优选实施例,所涉及的动作并不一定是本发明所必需的,而且在不冲突的情况下,本发明实施例及实施例中的特征可以相互组合。此外,本实施例中选用的基体材料为用于加工航空发动机压气机叶片的TC4钛合金,但本发明实施例中的基体不仅限于TC4基体,还可以是TC11、不锈钢等航空发动机压气机叶片常用的材料。本发明的保护范围由权利要求及其等同物限定。It should be noted that, for the sake of simple description, the above-mentioned embodiments are expressed as a combination of a series of steps according to specific implementation modes, but it cannot be assumed that the specific implementation modes of the present invention are limited thereto. Within the spirit and principles of the present invention, those skilled in the art can make various modifications and improvements on the basis of the above-mentioned embodiments, and these modifications and improvements fall within the protection scope of the present invention. Those skilled in the art should understand that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily necessary for the present invention, and in the case of no conflict, the embodiments of the present invention and the features can be combined with each other. In addition, the base material selected in this embodiment is TC4 titanium alloy used for processing the blades of aero-engine compressors, but the base in the embodiment of the present invention is not limited to TC4 bases, but can also be TC11, stainless steel and other commonly used aero-engine compressor blades. s material. The protection scope of the present invention is defined by the claims and their equivalents.
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CN115074668B (en) * | 2022-08-22 | 2022-11-15 | 北京辰融科技有限责任公司 | Blisk coating and preparation method and application thereof |
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