CN107316883B - Manufacturing method of display panel - Google Patents
Manufacturing method of display panel Download PDFInfo
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- CN107316883B CN107316883B CN201710448501.XA CN201710448501A CN107316883B CN 107316883 B CN107316883 B CN 107316883B CN 201710448501 A CN201710448501 A CN 201710448501A CN 107316883 B CN107316883 B CN 107316883B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
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- Microelectronics & Electronic Packaging (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The invention discloses a manufacturing method of a display panel, which is used for solving the problem that in the prior art, a driving chip pressed on the display panel is damaged by laser irradiation in the laser stripping process, so that the stripping yield of the display panel is low, and comprises the following steps: carrying out laser lift-off treatment on the display panel on the substrate; and pressing a driving chip in the area of the chip to be pressed in the display panel after the laser stripping treatment. The invention also discloses a display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a manufacturing method of a display panel.
Background
With the development of display technology, new display products are coming out endlessly. Among them, Organic Light Emitting Diodes (OLEDs) are increasingly popular among panel manufacturers and consumers due to their advantages of flexibility, self-luminescence, wide viewing angle, high contrast, low power consumption, high reaction rate, full color, and simple process.
In the prior art, the display panel is manufactured on the rigid substrate, and the display panel needs to be peeled off from the rigid substrate after the rigid substrate is manufactured, and for convenience of description, the display panel before being peeled off and the rigid substrate are collectively referred to as a middle sheet hereinafter. Fig. 1 is a schematic diagram illustrating a process of peeling off a vapor-deposited and encapsulated display panel in the prior art, where the peeling process mainly includes the following steps: firstly, removing unnecessary places on the peripheral edge of the middle sheet by cutting; secondly, pressing a driving chip 10 for processing signals on the edge region of one side of the display panel, wherein the purpose of the step is to establish electrical connection between the display panel and an external circuit; attaching a polarizer for protecting the display panel to the upper surface of the display panel; fourthly, carrying out laser stripping treatment on the display panel; and fifthly, manually stripping the display panel from the rigid substrate.
However, in the prior art, the driving chip bonded on the display panel is damaged by laser irradiation during the laser lift-off process, so that the lift-off yield of the display panel is low.
Disclosure of Invention
The embodiment of the invention provides a manufacturing method of a display panel, which is used for solving the problem that in the prior art, a driving chip pressed on the display panel is damaged by laser irradiation in a laser stripping process, so that the stripping yield of the display panel is low.
The embodiment of the invention adopts the following technical scheme:
a manufacturing method of a display panel comprises the following steps:
carrying out laser lift-off treatment on the display panel on the substrate;
and pressing a driving chip in the area of the chip to be pressed in the display panel after the laser stripping treatment.
Preferably, the laser lift-off processing of the display panel on the substrate includes:
and carrying out laser stripping treatment on a preset area of the display panel on the substrate, wherein the preset area comprises an effective display area of the display panel and an area of a chip to be pressed.
Preferably, after the laser lift-off process is performed on the display panel on the substrate, the method further includes:
and cutting the middle sheet along a first edge of a preset area of the display panel, wherein the first edge is the edge, which is closest to the area of the chip to be pressed, in the preset area of the display panel.
Preferably, after the driving chip is bonded in the region of the display panel where the chip is to be bonded, the method further includes:
cutting the edge area of the middle sheet, wherein the edge area is an area except for a preset area in the middle sheet;
and peeling the display panel from the substrate to obtain the display panel.
Preferably, the cutting process of the edge region of the middle sheet includes:
and cutting the middle sheet along the other three edges except the first edge in the preset area of the display panel.
Preferably, the method further comprises:
and attaching a polarizer above the display panel.
Preferably, an adhesive layer is formed between the display panel and the substrate.
Preferably, the material of the bonding layer is polyimide.
Preferably, the substrate is made of glass.
Preferably, the driving chip is electrically connected with the display panel and the external circuit through metal wires.
A display panel comprises the display panel manufactured by the method.
The embodiment of the invention adopts at least one technical scheme which can achieve the following beneficial effects:
in this application, after carrying out laser stripping treatment to the display panel on the base plate, can treat the regional pressfitting driver chip of pressfitting chip in this display panel, because driver chip carries out the pressfitting after laser stripping treatment to display panel, alright like this with avoid the driver chip of pressfitting on display panel, carry out the laser at display panel and peel off the in-process, receive laser irradiation and impaired problem, improved display panel's yield.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram illustrating a process of performing laser lift-off on a display panel after vapor deposition packaging in the prior art;
fig. 2 is a schematic structural diagram of a display panel after evaporation packaging provided in the present application;
fig. 3 is a schematic view illustrating a process of performing laser lift-off on a vapor-deposited and encapsulated display panel according to the present application;
fig. 4 is a schematic view illustrating a laser lift-off process performed on a vapor-deposited and encapsulated display panel according to the present application;
FIG. 5 is a schematic diagram of a chamber for performing a laser lift-off process on a display panel according to the present application;
fig. 6 is a schematic structural diagram of a display panel with a polarizer attached thereto according to the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
In order to solve the problem that the driving chip pressed on the display panel in the prior art is damaged by laser irradiation in the laser peeling process, so that the peeling yield of the display panel is low, the application provides a manufacturing method of the display panel, which comprises the following steps:
as shown in fig. 2, the display panel on the substrate is a display panel after vapor deposition encapsulation, and is a schematic structural diagram of the display panel after vapor deposition encapsulation provided by the present application, and includes a substrate 11, a display panel 13, and an adhesive layer 12 between the display panel 13 and the substrate 11. Laser Lift Off (LLO) is a method of separating a display panel from a substrate by decomposing an adhesive layer between the display panel and the substrate using Laser energy. When the laser peeling treatment is performed on the display panel on the substrate, the laser peeling treatment is mainly performed on the region of the substrate where the display panel is located, and the purpose is to carbonize the adhesive layer between the display panel and the substrate, thereby facilitating the peeling of the display panel from the substrate.
Optionally, the laser lift-off processing of the display panel on the substrate specifically includes: and carrying out laser stripping treatment on a preset area of the display panel, wherein the preset area comprises an effective display area of the display panel and an area of a chip to be pressed.
Optionally, before performing laser lift-off processing on the display panel on the substrate, the method further includes: and cutting the middle sheet along a first edge of a preset area of the display panel, wherein the first edge is the edge, which is closest to the area of the chip to be pressed, in the preset area of the display panel.
And step 12, pressing the driving chip in the area of the chip to be pressed in the display panel after the laser stripping treatment.
The driving chip is electrically connected with the display panel and the external circuit through the metal wires.
After the laser stripping treatment is carried out on the display panel on the substrate, the driving chip is pressed in the area of the chip to be pressed in the display panel, so that the driving chip can be prevented from being damaged by laser irradiation in the laser stripping treatment process, and the yield of the display panel can be improved.
Optionally, after the driving chip is pressed in the region of the chip to be pressed in the display panel, the method further includes: firstly, cutting an edge area of a middle sheet, wherein the edge area is an area except a preset area in the middle sheet; then, the display panel was peeled off from the substrate, and the display panel was obtained.
Optionally, the cutting process is performed on the edge area of the middle sheet, and includes: and cutting the middle sheet along the other three edges except the first edge in the preset area of the display panel.
Optionally, the method further includes: a polarizer is attached over the display panel.
Optionally, the material of the adhesive layer may be polyimide.
Optionally, the substrate may be made of glass.
The following describes in detail an implementation process of the method for manufacturing a display panel according to the embodiment of the present application, with reference to an actual processing process. As shown in fig. 3, an implementation process of the method for manufacturing a display panel provided by the present application includes the following steps:
step 101, attaching a polarizer above a display panel on a substrate;
the polarizer is an artificial membrane which has selective absorption performance on light vibration in different directions, so that the membrane has a special direction, when a beam of natural light irradiates on the membrane, the light vibration component perpendicular to the direction is completely absorbed, and only the light vibration component parallel to the direction passes through, and the special direction is called the polarization direction of the polarizer. In the application, the polaroid attached to the display panel can dissipate the reflection on the surface of the display panel and scatter the light emitted by the display panel so as to increase the visual angle of the liquid crystal display.
It should be noted that, in the present application, a schematic structural diagram after attaching the polarizer over the display panel is shown in fig. 4, and includes the display panel 13 and the polarizer 14, the polarizer 14 in the present application does not completely cover the display panel 13, an uncovered area is an area to be bonded with the chip, a size of the partial area may be determined according to an actual requirement, generally speaking, a width of the partial area is only required to satisfy a width of the area to be bonded with the chip, and the partial area cannot be included in an effective display area of the display panel.
In addition, the application does not specifically limit the timing of attaching the polarizer above the display panel, and this step may be performed before or after performing the laser lift-off process on the display panel.
102, carrying out laser stripping treatment on a display panel on a substrate;
as described above, the schematic structural diagram of the vapor deposition packaged display panel provided in the present application is shown in fig. 2, and includes the substrate 11, the display panel 13, and the adhesive layer 12 between the display panel 13 and the substrate 11. In practical applications, the material of the adhesive layer may be Polyimide (PI), and the material of the substrate may be glass.
In practical application, when the laser lift-off processing is performed on the display panel on the substrate, the laser lift-off processing may be performed on a preset area of the display panel on the substrate, where the preset area includes an effective display area of the display panel and an area of a chip to be pressed.
It should be noted that the display panel includes an effective display (AA, Active Area) Area and a non-AA Area, where the predetermined Area includes an effective display Area of the display panel and an Area to be bonded with a chip in the non-AA Area, as shown in fig. 6, which is a schematic diagram of performing a laser lift-off process on the predetermined Area of the display panel on the substrate, where 13-2 is the predetermined Area of the display panel including the effective display Area and the Area to be bonded with a chip, and 13-1 is an Area of the display panel except the predetermined Area, since the solution provided in this application performs the laser lift-off process only on the predetermined Area 13-2, and the polyimide between the Area shown in 13-1 and the substrate is not irradiated by the laser, there is no carbonization, that is, the polyimide in the Area still connects the display panel and the substrate together, since the region is in the peripheral region of the display panel, the non-carbonized polyimide in the region 13-1 plays a role in sealing, so that the overflow of pollutants such as dust in the preset region during laser stripping can be prevented, and the hidden danger that the pollutants can pollute the chamber shown in fig. 5 is eliminated.
In addition, in the present application, in the process of peeling the vapor-deposited and packaged display panel from the substrate, the process of performing the laser peeling process on the display panel on the substrate is performed in the chamber as shown in fig. 5, and the process after performing the laser peeling process on the display panel on the substrate may be performed outside the chamber, so as to prevent the above-mentioned contaminants from contaminating the chamber in the process after the laser peeling process.
103, cutting the middle sheet along a first edge of a preset area of the display panel, wherein the first edge is the edge, which is closest to the area of the chip to be pressed, in the preset area of the display panel;
the scheme that this application provided, before the regional pressfitting driver chip of treating the pressfitting chip in display panel, can only follow the marginal area of piece in the regional first edge cutting of predetermineeing of display panel, all the other three limits of well piece alright fix display panel on the base plate like this to be convenient for pressfitting driver chip on display panel. The problem that after four edges of a preset area are all cut, a flexible display panel separated from a substrate is easy to bend and is not convenient for pressing a driving chip is solved.
Step 104, pressing the driving chip 10 in the area of the chip to be pressed in the display panel;
as mentioned above, the driving chip 10 is used for electrically connecting the display panel with an external circuit, i.e. electrically connecting the effective display area in the display panel with the external circuit.
105, cutting an edge area of the middle sheet, wherein the edge area is an area except for a preset area in the middle sheet;
the edge area of the middle sheet is subjected to a cutting process, specifically, the middle sheet is cut along three edges except the first edge in the preset area of the display panel.
And 106, peeling the display panel from the substrate to obtain the display panel.
In this application, after carrying out laser stripping treatment to the display panel on the base plate, can treat the regional pressfitting driver chip of pressfitting chip in this display panel, because driver chip is after carrying out laser stripping treatment to display panel, the pressfitting is on display panel, like this alright avoid the driver chip of pressfitting on display panel, carry out the laser at display panel and peel off the in-process, receive laser irradiation and impaired problem, and then can improve display panel's the yield of peeling off.
The above is a manufacturing method of a display panel provided by the present application, and based on the manufacturing method, the present application also provides a display panel manufactured by the manufacturing method.
The display panel may be, for example, an organic electroluminescent device, but is not limited thereto; it is within the scope of the present application that the display panel is manufactured by performing a laser lift-off process on the display panel on the substrate, and then bonding the driving chip in the region of the chip to be bonded in the display panel.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
It is to be noted that, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. The terms "vertical," "horizontal," "first," "second," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.
Claims (9)
1. A method for manufacturing a display panel is characterized by comprising the following steps:
carrying out laser lift-off treatment on the display panel on the substrate;
after laser stripping treatment, pressing a driving chip in the area of the chip to be pressed in the display panel;
performing laser lift-off processing on a display panel on a substrate, comprising: carrying out laser stripping treatment on a preset area of the display panel, wherein the preset area comprises an effective display area of the display panel and an area of a chip to be pressed; wherein the display panel includes: the preset area and other areas except the preset area.
2. The method of claim 1, wherein after the laser lift-off treatment of the display panel on the substrate, the method further comprises:
and cutting a middle sheet along a first edge of a preset area of the display panel, wherein the middle sheet comprises the display panel and the rigid substrate before being stripped, and the first edge is the edge where the chip to be pressed is located in the preset area of the display panel.
3. The method of claim 2, wherein after the driving chip is bonded in an area of the display panel where the chip is to be bonded, the method further comprises:
cutting the edge area of the middle sheet, wherein the edge area is an area except for a preset area in the middle sheet;
and peeling the display panel from the substrate to obtain the display panel.
4. The method of claim 2, wherein the cutting process of the edge region of the middle panel comprises:
and cutting the middle sheet along the other three edges except the first edge in the preset area of the display panel.
5. The method of claim 1, wherein the method further comprises:
and attaching a polarizer above the display panel.
6. The method of claim 1, wherein an adhesive layer is formed between the display panel and the substrate.
7. The method of claim 1, wherein the substrate is glass.
8. The method of claim 1, wherein the driving chip is electrically connected to the display panel and the external circuit through metal traces.
9. A display panel manufactured by the method according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710448501.XA CN107316883B (en) | 2017-06-14 | 2017-06-14 | Manufacturing method of display panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710448501.XA CN107316883B (en) | 2017-06-14 | 2017-06-14 | Manufacturing method of display panel |
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| Publication Number | Publication Date |
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| CN107316883A CN107316883A (en) | 2017-11-03 |
| CN107316883B true CN107316883B (en) | 2020-06-05 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108336227B (en) * | 2018-01-19 | 2022-01-25 | 云谷（固安）科技有限公司 | Substrate structure of display screen, flexible display device, manufacturing method of flexible display device and display screen |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104167429A (en) * | 2014-08-01 | 2014-11-26 | 京东方科技集团股份有限公司 | Flexible display panel, manufacturing method thereof and display device |
| CN204808294U (en) * | 2015-07-10 | 2015-11-25 | 成都京东方光电科技有限公司 | Display panel and display device |
| CN105632347A (en) * | 2016-04-01 | 2016-06-01 | 京东方科技集团股份有限公司 | Flexible panel and manufacture method thereof and display device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104332487B (en) * | 2014-10-31 | 2018-09-11 | 京东方科技集团股份有限公司 | A kind of display screen and preparation method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104167429A (en) * | 2014-08-01 | 2014-11-26 | 京东方科技集团股份有限公司 | Flexible display panel, manufacturing method thereof and display device |
| CN204808294U (en) * | 2015-07-10 | 2015-11-25 | 成都京东方光电科技有限公司 | Display panel and display device |
| CN105632347A (en) * | 2016-04-01 | 2016-06-01 | 京东方科技集团股份有限公司 | Flexible panel and manufacture method thereof and display device |
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