CN107245739A - A kind of electro-plating method - Google Patents
A kind of electro-plating method Download PDFInfo
- Publication number
- CN107245739A CN107245739A CN201710317009.9A CN201710317009A CN107245739A CN 107245739 A CN107245739 A CN 107245739A CN 201710317009 A CN201710317009 A CN 201710317009A CN 107245739 A CN107245739 A CN 107245739A
- Authority
- CN
- China
- Prior art keywords
- electro
- plating method
- circulating slot
- electroplate liquid
- major trough
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
A kind of electro-plating method, added in electroplating bath and contain metal ion, buffer, conductive agent and halide ion in electroplate liquid, electroplate liquid, electroplating bath is divided into major trough and connected circulating slot, electroplate liquid can be circulated between major trough and circulating slot, and ultrasonic wave is applied around circulating slot.Electro-plating method of the present invention applies ultrasonic wave in circulating slot, enables to electroplating bath components to be uniformly dispersed, does not assemble so that electrodeposited coating is uniform, fine and close, is not easily blocked filter.The buffer of the present invention can persistently maintain the pH of electroplate liquid to balance, and improve the uniformity of plating.
Description
Technical field
The present invention relates to electroplating technology field, more particularly to a kind of electro-plating method.
Background technology
The method of the plating coat of metal, which is included between two electrodes in electroplate liquid, generally on article applies electric current, its
One of middle electrode is article to be plated.Usual acidic copper electroplating solutions include the copper (being typically copper sulphate) of dissolving, acidic electrolyte bath example
Such as a certain amount of sulfuric acid to give the electric conductivity that plating solution is enough, and suitable improve adding for electroplating evenness and metallic coating mass
Plus agent.Such additive includes accelerator, leveling agent and inhibitor etc..
For plating, there is so-called " traction " phenomenon, wherein electroplating solution is entrained together with the base material for plating
Go out beyond coating bath.Thus, the change in concentration of the component beyond metal ion.To repeat plating, supplement is caused to contain by traction
Measure the single component of reduction, it is thus possible to sediment or crystal occur.
Because the change in concentration of electroplate liquid causes uneven, the uneven of coating can be caused, it is necessary to improve.
The content of the invention
The object of the invention is exactly that there is provided a kind of electro-plating method in order to make up the defect of prior art.
The present invention is achieved by the following technical solutions：
A kind of electro-plating method, adds in electroplating bath and contains metal ion, buffer, conductive agent and halogen in electroplate liquid, electroplate liquid
Compound ion, electroplating bath is divided into major trough and connected circulating slot, and electroplate liquid can be circulated between major trough and circulating slot,
Apply ultrasonic wave around circulating slot.
The ultrasonic frequency is 20-25KHz.
Material to be plated is electroplated repeatedly using soluble anode.
Filter is set on the connecting path of major trough and circulating slot.
The metal ion is one or more combination in nickel, copper, silver, cobalt.
When supplementing metal ion, buffer, conductive agent and halide ion, add in circulating slot.
The buffer is by acrylic amine 4-5%, ascorbic acid 5-6%, citric acid 25-30%, triethanolamine 23-28%, remaining
Measure as boric acid, be mass percentage content above.
It is an advantage of the invention that：Electro-plating method of the present invention applies ultrasonic wave in circulating slot, enables to electroplating bath components point
Dissipate uniform, do not assemble so that electrodeposited coating is uniform, fine and close, is not easily blocked filter.The buffer of the present invention can be maintained persistently
The pH balances of electroplate liquid, improve the uniformity of plating.
Embodiment
A kind of electro-plating method, adds in electroplating bath and contains metal ion, buffer, conductive agent in electroplate liquid, electroplate liquid
And halide ion, electroplating bath is divided into major trough and connected circulating slot, and electroplate liquid can be followed between major trough and circulating slot
Ring, applies ultrasonic wave around circulating slot.
The ultrasonic frequency is 21KHz.
Material to be plated is electroplated repeatedly using soluble anode.
Filter is set on the connecting path of major trough and circulating slot.
The metal ion is nickel.
When supplementing metal ion, buffer, conductive agent and halide ion, add in circulating slot.
The buffer is boric acid by acrylic amine 5%, ascorbic acid 5%, citric acid 25%, triethanolamine 26%, surplus, with
Upper is mass percentage content.
Claims (7)
1. a kind of electro-plating method, it is characterised in that added in electroplating bath in electroplate liquid, electroplate liquid containing metal ion, buffering
Agent, conductive agent and halide ion, electroplating bath are divided into major trough and connected circulating slot, and electroplate liquid can be in major trough and circulation
Circulated between groove, apply ultrasonic wave around circulating slot.
2. electro-plating method as claimed in claim 1, it is characterised in that the ultrasonic frequency is 20-25KHz.
3. electro-plating method as claimed in claim 1, it is characterised in that carried out using soluble anode to material to be plated repeatedly electric
Plating.
4. electro-plating method as claimed in claim 1, it is characterised in that filtering dress is set on the connecting path of major trough and circulating slot
Put.
5. electro-plating method as claimed in claim 1, it is characterised in that the metal ion is a kind of or several in nickel, copper, silver, cobalt
Plant combination.
6. electro-plating method as claimed in claim 1, it is characterised in that in supplement metal ion, buffer, conductive agent and halide
During ion, add in circulating slot.
7. electro-plating method as claimed in claim 1, it is characterised in that the buffer is by acrylic amine 4-5%, ascorbic acid 5-
6%th, citric acid 25-30%, triethanolamine 23-28%, surplus are boric acid, are mass percentage content above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710317009.9A CN107245739A (en) | 2017-05-08 | 2017-05-08 | A kind of electro-plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710317009.9A CN107245739A (en) | 2017-05-08 | 2017-05-08 | A kind of electro-plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107245739A true CN107245739A (en) | 2017-10-13 |
Family
ID=60016973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710317009.9A Pending CN107245739A (en) | 2017-05-08 | 2017-05-08 | A kind of electro-plating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107245739A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101397692A (en) * | 2007-09-26 | 2009-04-01 | 上村工业株式会社 | Electroplating method |
-
2017
- 2017-05-08 CN CN201710317009.9A patent/CN107245739A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101397692A (en) * | 2007-09-26 | 2009-04-01 | 上村工业株式会社 | Electroplating method |
Non-Patent Citations (2)
| Title |
|---|
| A•M•津斯特林格等著: "《超声波在化工过程中的应用》", 31 October 1963, 中国工业出版社（第一版） * |
| 张允诚等: "《电镀手册》", 31 December 2011, 国防工业出版社（第4版） * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171013 |