CN107231774B

CN107231774B - Electronic device shell, electronic device and electronic device shell machining method

Info

Publication number: CN107231774B
Application number: CN201710643998.0A
Authority: CN
Inventors: 林晨东; 吉斌
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-07-31
Filing date: 2017-07-31
Publication date: 2022-10-25
Anticipated expiration: 2037-07-31
Also published as: CN107231774A

Abstract

The invention relates to an electronic device shell, an electronic device and an electronic device shell processing method, wherein the electronic device shell comprises: a decorative sheet including an ink layer; the shell body is integrally formed with the decorative sheet in an injection molding mode and comprises a cover plate part and a frame part arranged around the edge of the cover plate part; the decoration piece is attached to the outer surface of the cover plate portion, and the printing ink layer covers the cover plate portion. The processing method of the electronic device comprises the following steps: providing a decorative sheet, wherein the decorative sheet comprises an ink layer and a bonding layer which is laminated with the ink layer; placing the decorative sheet in a cavity of an injection mold and closing the mold; injecting molten injection into a cavity of the injection mold, and cooling the injection to form a shell body connected with the decorative sheet; and opening the mold and taking out the shell body with the decorative sheet. Through will decorating the attached partial shell body of piece, can improve the outward appearance effect.

Description

Electronic device shell, electronic device and electronic device shell machining method

Technical Field

The present invention relates to the field of electronic devices, and in particular, to an electronic device housing, an electronic device, and a method for processing the electronic device housing.

Background

In electronic equipment such as a smart phone, in order to improve the appearance decoration effect, a membrane is generally attached to the back of a shell of the electronic equipment, but the integrity and consistency of the membrane and the shell of the electronic equipment are poor.

Disclosure of Invention

The invention solves the technical problem of improving the integrity and consistency of the decorative sheet and the shell body.

An electronic device housing, comprising:

the decorative sheet comprises an ink layer and an adhesive layer connected with the ink layer;

the shell body is integrally formed with the decorative sheet through in-mold injection molding, and comprises a cover plate part and a frame part arranged around the edge of the cover plate part; the decoration sheet is attached to the outer surface of the cover plate part, and the bonding layer is arranged between the cover plate part and the ink layer; and

and the transparent protective layer is covered on the ink layer and the frame part in a spraying mode.

In one embodiment, the decorative sheet is completely embedded on the cover plate part, and the decorative sheet comprises a second surface which is in smooth transition with the surface of the frame part and a first surface attached to the cover plate part.

In one embodiment, the first surface is a curved surface, and two ends of the first surface are respectively connected with the end parts of the second surface.

In one embodiment, the frame portion includes two first sidewalls disposed opposite to each other, two second sidewalls disposed opposite to each other, and a connecting wall connecting between the adjacent first sidewalls and the adjacent second sidewalls.

In one embodiment, the connecting wall is planar.

In one embodiment, the decorative sheet comprises a main body part and a skirt, wherein the main body part is used for attaching the whole outer surface of the cover plate part, and the skirt is connected with the edge of the main body part and is used for attaching the whole outer surface of the frame part; the expansion contour of the main body part is octagonal, and the skirt edges are connected to the eight side edges of the main body part respectively.

In one embodiment, the connecting wall is curved.

In one embodiment, the decorative sheet comprises a main body part and a plurality of skirts, wherein the main body part is used for attaching the whole outer surface of the cover plate part, and the skirts are connected with the edges of the main body part and are attached to the outer surface of the first side wall and/or the second side wall;

the main body part comprises two first side edges, two second side edges and a connecting edge, wherein the two first side edges correspond to and are arranged opposite to the first side walls, the two second side edges correspond to and are arranged opposite to the second side walls, and the connecting edge corresponds to the connecting wall and is connected with the adjacent first side edges and the second side edges;

the skirt is connected to the first side edge and/or the second side edge respectively.

In one embodiment, the outer surface of the first side wall and/or the outer surface of the second side wall are/is provided with a second groove which is recessed relative to the connecting wall and used for embedding the skirt, the tangent planes of the outer surface of the skirt and the outer surface of the connecting wall at the joint of the two are coplanar, and the end face of the skirt is flush with the end face of the frame part.

In one embodiment, a second groove for embedding the skirt is formed in a part of the outer surface of the first side wall and/or the second side wall in a recessed manner, the end face of the skirt is attached to the groove wall surrounding the second groove, and the outer surface of the skirt and the outer surface of the first side wall and/or the second side wall are coplanar at the joint tangent plane of the two.

In one embodiment, the decorative sheet comprises a main body part attaching the outer surface part of the cover plate part, and a plurality of skirts connected with the edges of the main body part and attached on the outer surface of the first side wall and/or the second side wall;

the outer surface of the cover plate part is provided with a first groove used for embedding the main body part, and the outer surface of the first side wall and/or the second side wall is provided with a second groove used for embedding the skirt edge.

In one embodiment, the decorative sheet further comprises a cured layer laminated to a side of the ink layer remote from the adhesive layer.

In one embodiment, the cured layer has a thickness A, wherein A is in a range of 2 μm ≦ A ≦ 5 μm.

In one embodiment, the thickness of the decorative sheet is B, wherein the value range of B is more than or equal to 4 mu m and less than or equal to 15 mu m.

In one embodiment, the transparent protective layer comprises an ultraviolet curing glue layer.

In one embodiment, the thickness of the transparent protective layer is C, wherein the value range of C is 10 μm-30 μm.

In one embodiment, the ink layer comprises one or more of a textured film, an optically plated film, and a colored film.

In one embodiment, the optical coating comprises first coating and second coating which are alternately stacked, the total number of the first coating and the second coating is D, and the value range of D is that D is more than or equal to 10 and less than or equal to 1500.

In one embodiment, the first plating film includes an alloy film, and the second plating film includes a non-metal oxide film.

In one embodiment, the refractive index of the first plating film is greater than that of the second plating film, and the difference between the refractive index of the first plating film and that of the second plating film is E, wherein the value range of E is 0.25-1.25.

In one embodiment, the adhesive layer is provided with a concave-convex connection structure corresponding to the shell body.

In one embodiment, the decorative sheet further comprises a reinforcing connecting layer which is connected to the end face of the decorative sheet in a stacking manner, and the reinforcing connecting layer is connected with the shell body.

In one embodiment, the reinforcing connection layer comprises a silicone layer or a hot melt adhesive layer.

In one embodiment, the housing body is made of a plastic material.

In one embodiment, the color difference value between the color of the decorative sheet and the color of the shell body is Δ E, and the value range of Δ E is 0-2.

An electronic device housing comprising:

the resin shell body comprises a cover plate part and a frame part connected with the edge of the cover plate part, the cover plate part and the frame part enclose an open cavity, and a first groove is formed in one surface of the cover plate part, which is far away from the open cavity;

the decorative sheet comprises an ink layer and an adhesive layer which is laminated with the ink layer, the ink layer and the adhesive layer are fixed in the first groove, and the adhesive layer is connected with the bottom wall of the first groove; and

and the transparent protective layer is covered on the frame part and the ink layer.

An electronic device comprising a processor and a memory, further comprising an electronic device housing as described in any of the above.

A processing method of an electronic device shell comprises the following steps:

providing a decorative sheet, wherein the decorative sheet comprises an ink layer and a bonding layer which is laminated with the ink layer;

placing the decorative sheet in a cavity of an injection mold and closing the mold;

injecting molten injection into a cavity of the injection mold, and cooling the injection to form a shell body connected with the decorative sheet;

opening the mold and taking out the shell body with the decorative sheet; and

and coating transparent adhesive on the decorative sheet and the shell body, and carrying out curing treatment to form a transparent protective layer.

In one embodiment, the decorative sheet further comprises a carrier film, and the ink layer is attached to the carrier film; before the step of coating the transparent adhesive tape, the carrier film is torn off.

In one embodiment, the ink layer is attached to the carrier film by a screen printing or ink jet process, and then the adhesive layer is attached to the ink layer.

In one embodiment, before the ink layer is attached to the carrier film, a viscous middle soft layer is coated on the carrier film, and then the ink layer and the bonding layer are sequentially attached to the middle soft layer.

In one embodiment, after the carrier film is removed, the intermediate soft layer is hardened by light or heat to obtain a cured layer.

In one embodiment, after the decorative sheet is formed, the concave-convex connection structure is formed on the surface of the adhesive layer by a sand blasting, laser engraving or chemical etching process.

In one embodiment, after the decorative sheet is formed, a reinforcing connection layer is stacked on the end surface of the decorative sheet.

In one embodiment, the injection mold cavity and the part of the decorative sheet are subjected to a preheating treatment before the step of injecting the molten injection liquid, wherein the temperature reached after the preheating treatment is 60 to 200 ℃.

In one embodiment, the step of injecting the molten injection solution is preceded by a first injection rate V ₁ Injecting the injection liquid into the cavity at a second injection speed V ₂ Injecting injection into the cavity and maintaining the pressure, wherein V is not less than 1 ₁ /V ₂ ≤10。

In one embodiment, the injection mold and the electronic device housing are cooled by water cooling, oil cooling, or air cooling prior to opening the mold.

A technical effect of one embodiment of the present invention is to ensure integrity and consistency of the appearance of the electronic device housing based on improved attachment.

Drawings

Fig. 1 is a schematic cross-sectional view illustrating a decoration sheet in a housing of an electronic device according to an embodiment;

fig. 2 is a schematic perspective view of a case body in a housing of an electronic device according to an embodiment;

FIG. 3 is a schematic cross-sectional view of an electronic device housing according to an embodiment;

FIG. 4 is a schematic cross-sectional view of an electronic device housing according to another embodiment;

FIG. 5 is a cross-sectional view of the housing body of FIG. 4;

FIG. 6 is a schematic cross-sectional view of an electronic device housing according to yet another embodiment;

FIG. 7 is a cross-sectional view of the housing body of FIG. 6;

FIG. 8 is a schematic structural diagram of a decorative sheet with a reinforcing connection layer in an electronic device housing according to an embodiment;

fig. 9 is a schematic cross-sectional view of an electronic device housing according to yet another embodiment;

FIG. 10 is a schematic plan view of the decorative sheet of FIG. 9;

fig. 11 is a schematic plan view of a case body with a planar connecting wall in an electronic device case according to an embodiment;

FIG. 12 is a schematic plan expanded view of a decorative sheet attached to the housing body of FIG. 11;

fig. 13 is a schematic plan view illustrating a case body of an electronic device according to an embodiment, wherein a connecting wall of the case body is a curved surface;

FIG. 14 is a schematic plan view of a decorative sheet fully attached to the upper cover plate portion of the housing body provided in FIG. 13;

FIG. 15 is a schematic plan view of a decorative sheet partially attached to the upper cover plate portion of the housing body provided in FIG. 13;

FIG. 16 is a schematic view of the decorative sheet provided in FIG. 15 attached to the shell body provided in FIG. 13;

FIG. 17 is a schematic top structural view of the housing body provided in FIG. 16;

FIG. 18 is a cross-sectional view of an electronic device housing according to yet another embodiment;

fig. 19 is a flow chart of a method for processing an electronic device housing.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Referring to fig. 1 to 3, an electronic device housing includes a decorative sheet 100 and a housing body 200, the decorative sheet 100 can be partially attached to the housing body 200, and the decorative sheet 100 can have different colors and textures, so as to improve the appearance integrity, consistency and aesthetic property of the housing body 200. The decorative sheet 100 can reduce the influence of wrinkles generated when the decorative sheet 100 covers the shell body 200 by attaching part of the shell body 200, the attached decorative sheet 100 does not generate wrinkles, the outer surface of the decorative sheet 100 can smoothly transition with the outer surface of the shell body 200, and the sense of unity of the shell of the electronic device is ensured; meanwhile, the attaching force between the decorative sheet 100 and the case body 200 is also enhanced, and the appearance effect of the case body 200 and the attaching quality of the decorative sheet 100 are further improved.

Referring to fig. 3, in some embodiments, the electronic device housing further includes a transparent protection layer 300, the transparent protection layer 300 covers the decorative sheet 100 and a portion of the housing body 200, and the transparent protection layer 300 can effectively protect the decorative sheet 100 and prevent the decorative sheet 100 from being damaged due to external impact and friction.

Referring to fig. 1, in some embodiments, the decorative sheet 100 includes an ink layer 110, and in other embodiments, the decorative sheet 100 may further include an adhesive layer 120 and a cured layer 130. The ink layer 110 is stacked between the adhesive layer 120 and the cured layer 130, and the adhesive layer 120 is attached to the case body 200, thereby protecting the ink layer 110 and improving the adhesion between the decorative sheet 100 and the case body 200.

In some embodiments, for example, the decorative sheet 100 is integrally formed with the case body 200 by an in-mold injection molding process, which improves the production efficiency and appearance effect of the electronic device case; for another example, the housing body 200 may be processed with the receiving groove 230 by a CNC or an injection molding process, and the processed decoration piece 100 is inserted into the receiving groove 230 (see fig. 5), so that the decoration piece 100 and the housing body 200 are integrally formed.

Referring to fig. 1, 2 and 3, the housing body 200 includes a cover plate portion 210 and a frame portion 220, the frame portion 220 is disposed around an edge of the cover plate portion 210, that is, the frame portion 220 and the cover plate portion 210 together enclose an open cavity (not shown) for accommodating electronic components. The decorative sheet 100 may be attached only on the outer surface of the cover plate portion 210, for example, the decorative sheet 100 covers the entire outer surface of the cover plate portion 210; alternatively, the decorative sheet 100 is embedded in a certain partial area on the outer surface of the cover plate portion 210. For another example, the decorative sheet 100 may be attached to the outer surface of the cover plate portion 210, and may be attached to the outer surface of all or part of the frame portion 220.

Referring to fig. 6 and 7, fig. 9 and 10, in some embodiments, the cover plate portion 210 is opened with a first groove 231, and the decorative sheet 100 is completely received in the first groove 231, that is, the decorative sheet 100 is embedded in the cover plate portion 210. The decorative sheet 100 includes opposing first and

second surfaces

160 and 170. The first surface 160 is attached to the cover portion 210. The second surface 170 smoothly transitions with the outer surface of the rim portion 220. The first surface 160 may be a curved surface, and both ends of the first surface 160 are connected to ends of the second surface 170, respectively. The first recess 231 for accommodating the decorative sheet 100 is a curved groove (e.g., an arc groove). The first groove 231 may be a rectangular groove, and the cross section of the decorative sheet 100 may be rectangular. In other embodiments, the second surface 170 may also be curved to facilitate the user's grip.

Referring to fig. 12 and 14, the decorative sheet 100 includes a main body portion 180 and a skirt 190, the skirt 190 is connected to an edge of the main body portion 180, the number of the skirt 190 is plural, the main body portion 180 of the decorative sheet 100 is attached to an outer surface of the cover plate portion 210, and the skirt 190 of the decorative sheet 100 is attached to an outer surface of the rim portion 220. The skirts 190 are not integrally connected, and a certain gap (i.e., a gap) exists between the skirts, so that when the decorative sheet 100 is attached to the whole or a part of the housing body 200, the decorative sheet 100 does not wrinkle due to the influence of ductility, and the attachment quality of the decorative sheet 100 and the appearance effect of the whole electronic device housing are ensured.

Referring to fig. 2, the frame part 220 includes a first sidewall 221, a second sidewall 222 adjacent to the first sidewall 221, and a connecting wall 223 connecting the first sidewall 221 and the second sidewall 222. The number of the first sidewalls 221 is two, and the two first sidewalls 221 are disposed opposite to each other. The number of the second sidewalls 222 is also two, and the two second sidewalls 222 are oppositely disposed. The first sidewall 221 and the second sidewall 222 may be both planar or curved.

Referring to fig. 11 and 12, when the connecting wall 223 is a plane, the outline of the electronic device housing is substantially an octagonal prism with one end closed and the other end open. The cover plate portion 210 is substantially octagonal in shape. The first side wall 221, the second side wall 222, and the connecting wall 223 are substantially rectangular in shape. Similarly, the shape of the main body 180 of the decorative sheet 100 is the same as that of the cover 210, and the main body 180 is attached to the cover 210. Eight skirts 190 are connected to the edges of the cover portion 210, the eight skirts 190 are connected to eight sides of the body portion 180, and each skirt 190 is generally rectangular in shape. When the main body portion 180 is attached to the cover portion 210, each skirt 190 is bent approximately ninety degrees relative to the main body portion 180, so that the skirt 190 is attached to the first side wall 221, the second side wall 222 and the connecting wall 223, and further the skirt 190 is attached to the frame portion 220, and finally the purpose of attaching the decorative sheet 100 to the whole shell body 200 is achieved. Since there are gaps between the plurality of skirts 190, when the decorative sheet 100 is attached to the entire case body 200, the decorative sheet 100 does not wrinkle; meanwhile, the housing body 200 does not need to be provided with the accommodating groove 230, and all parts of the outer surface of the whole electronic device shell are in smooth transition, so that the integration effect of the electronic device shell is ensured.

Referring to fig. 13 and 14, when the connection wall 223 is a curved surface, the outer profile of the cover plate portion 210 is substantially a rectangle having rounded corners. The body portion 180 of the decorative sheet 100 has substantially the same shape as the cover portion 210. The body portion 180 may be formed by entirely attaching the outer surface of the cover portion 210, the cover portion 210 may not have the first groove 231, and the plurality of skirts 190 may be attached to the outer surface of the first sidewall 221 and/or the second sidewall 222. The body portion 180 includes a first side 181, a second side 182, and a connecting side 183. The number of the first side edges 181 is two, and the two first side edges 181 correspond to the first side wall 221. The number of the second sides 182 is two, and the two first sides 181 correspond to the first sidewalls 221. The connecting edge 183 connects the adjacent first and second side edges 181 and 182, and the connecting edge 183 corresponds to the connecting wall 223. The skirt 190 has substantially the same shape as the first side wall 221 and the second side wall 222 (which are rectangular), and the skirt 190 is connected to the first side edge 181 and/or the second side edge 182, respectively.

Referring to fig. 4, 5 and 18, when the connecting wall 223 is a curved surface and the skirt 190 is attached to all outer surfaces of the first sidewall 221 or the second sidewall 222 (the decorative sheet 100 is not attached to the connecting wall 223), all outer surfaces of the first sidewall 221 or the second sidewall 222 are provided with the second groove 232 (in fact, the thickness of the first sidewall 221 or the second sidewall 222 is smaller than that of the connecting wall 223, so that the first sidewall 221 or the second sidewall 222 between the two connecting walls 223 is recessed relative to the connecting wall 223 to form the second groove 232). The skirt 190 is embedded in the second groove 232, the tangent planes of the outer surface of the skirt 190 and the outer surface of the connecting wall 223 at the joint of the two are coplanar, so that smooth transition between the outer surface of the skirt 190 and the outer surface of the connecting wall 223 is realized, the end surface of the skirt 190 is flush with the end surface of the first side wall 221 or the second side wall 222, and the integration of the electronic device shell is ensured on the basis of eliminating wrinkles. Referring to fig. 4 and 5, when the skirt 190 is attached to only a portion of the outer surface of the first sidewall 221 and/or the second sidewall 222, a second groove 232 is formed in a portion where the outer surface of the first sidewall 221 and/or the second sidewall 222 is connected to the cover portion 210, the skirt 190 is embedded in the second groove 232, the outer surface of the skirt 190 and the outer surface of the first sidewall 221 or the second sidewall 222 are in smooth transition (i.e., are flush), and the end surface of the skirt 190 is attached to the wall of the groove surrounding the second groove 232.

Referring to fig. 4 and 5, fig. 15 to 17, when the connecting wall 223 is a curved surface and the main body 180 of the decorative sheet 100 is only attached to a part of the upper outer surface of the cover plate 210 (i.e. the part of the main body 180 embedded in the cover plate 210), a first groove 231 is formed on the outer surface of the cover plate 210, a second groove 232 is formed on all or a part of the outer surface of the first side wall 221 and/or the second side wall 222, and the first groove 231 and the second groove 232 are communicated with each other, and both form a receiving groove 230 for receiving the decorative sheet 100. The body portion 180 is embedded in the first groove 231 and the skirt 190 is embedded in the second groove 232. At this time, the decorative sheet 100 is not attached to the outer surface of the cover plate portion 210 near the four corners, and the decorative sheet 100 is formed of two rectangles stacked to cross each other in a planar development view. Of course, the outer surface of the skirt 190 is coplanar with the tangent plane of the outer surface of the first sidewall 221, the second sidewall 222 or the connecting wall 223 at the junction to ensure a smooth transition, and the outer surface of the body portion 180 is smoothly transitioned (flush) with the outer surface of the cover portion 210.

The cured layer 130 is laminated on the side of the ink layer 110 away from the adhesive layer 120, the thickness of the cured layer 130 is A, and A is in a range of 2 μm or less and A is 5 μm or less, for example, the thickness of the cured layer 130 can be 2 μm, 3.5 μm or 5 μm. Cured layer 130 may further provide protection to ink layer 110.

The thickness of the whole decorative sheet 100 is B, the thickness of the decorative sheet 100 cannot be too thick to save the manufacturing cost, and the decorative sheet 100 must have a certain volume to realize the display effect of the decorative sheet 100 on the texture and the color, that is, the decorative sheet 100 cannot be too thin. Therefore, the value of B is 4 μm. Ltoreq. B.ltoreq.15. Mu.m, and the thickness of the decorative sheet 100 may be 4 μm, 8 μm, 15 μm, or the like, for example.

The transparent protective layer 300 can be an ultraviolet curing adhesive layer, and under the irradiation of ultraviolet light, the transparent adhesive layer is cured and molded quickly, so that the transparent protective layer 300 has good light transmission performance, the texture and the color formed on the decorative sheet 100 cannot be covered and shielded, and the decorative effect of the decorative sheet 100 on the shell of the electronic device is ensured. Meanwhile, the transparent protective layer 300 has certain strength and toughness, and can effectively absorb impact and friction energy of the outside to the decorative sheet 100, and prevent the decorative sheet 100 from being damaged. The transparent protective layer 300 may also be made of polycarbonate, polystyrene, methacrylic acid-butadiene-styrene copolymer, polyvinyl chloride, or methyl methacrylate. The thickness of the transparent protection layer 300 is C, wherein C is not less than 10 μm and not more than 30 μm. For example, the thickness of the transparent protective layer 300 may be 10 μm, 20 μm, 30 μm, or the like.

The ink layer 110 comprises one or more of a texture film, an optical coating film and a coloring film, and the texture film can enable the whole ink layer 110 to present artificially designed lattice grains, straight lines, grid grains, annular grains and the like; or imitating natural cloth patterns, granite patterns, tree patterns and the like; the whole electronic device shell can have a three-dimensional visual effect with concave-convex feeling.

The optical coating can make the ink layer 110 show the full spectrum color or single color of visible light through the reflection, projection and absorption of light. The optical coating comprises a first coating and a second coating, wherein the first coating and the second coating are alternately laminated together, the total number of the layers is D, the value range of D is more than or equal to 10 and less than or equal to 1500, and the value of D can be 10, 1000 or 1500, for example.

The first plating film includes an alloy film, and the second plating film includes a non-metal oxide film. For example, the first plating film may be an aluminum alloy film, a titanium alloy film, a copper alloy film, or the like. The second plating film may be a silicon oxide film, a calcium oxide film, or the like. The refractive index of the first coating film is larger than that of the second coating film, so that the propagation paths of light rays passing through the first coating film and the second coating film are alternately changed, and different colors of the optical coating film are presented. Wherein the difference value of the refractive index of the first coating film and the refractive index of the second coating film is E, and the value range of E is more than or equal to 0.25 and less than or equal to 1.25. E.g. 0.25, 0.75 or 1.25 etc.

The adhesive layer 120 of the decorative sheet 100 is provided with a concave-convex connection structure, which may be a plurality of parallel convex strips protruding from the surface of the adhesive layer 120, and a corrugated structure is formed between the convex strips; the concave-convex connection structure may also be a plurality of convex peaks protruding from the surface of the adhesive layer 120, and the convex peaks are arranged in a dot matrix. The concave-convex connection structure may also be a plurality of counter bores recessed in the surface of the adhesive layer 120. Due to the arrangement of the adhesive layer 120, the connection strength between the decorative sheet 100 and the shell body 200 is increased, and the attachment quality of the decorative sheet 100 is improved. The adhesive layer 120 is made of a plastic material, such as epoxy glue, anaerobic glue or latex.

Referring to fig. 4, 5 and 8, the decorative sheet 100 may further include a reinforcing connection layer 140, the reinforcing connection layer 140 is connected (attached) to the end surface of the decorative sheet 100 in a stacking manner, for example, the reinforcing connection layer 140 is disposed on the end surface of the skirt 190, and when the end surface of the skirt 190 is attached to the groove wall of the second groove 232, the reinforcing connection layer 140 is directly connected to the groove wall of the second groove 232, so as to improve the bonding force between the end surface of the skirt 190 and the frame portion 220. The material of the reinforcing connection layer 140 may be the same as that of the adhesive layer 120, or may be a silicone layer or a hot melt adhesive layer.

In some embodiments, the case body 200 is made of a plastic material, such as a resin case body 200 made of a resin material. In order to improve the consistency of the appearance color of the electronic device housing, the color difference value between the color of the decorative sheet 100 and the color of the housing body 200 is Δ E, wherein the value range of Δ E is 0-2. For example, when the decorative sheet 100 is attached to only a partial area of the frame portion 220, it is ensured that the color of the decorative sheet 100 substantially matches the color of the other portions (e.g., the connecting wall 223) of the frame portion 220.

The invention also provides an electronic device which comprises a processor, a memory and the electronic device shell. The electronic device can be a smart phone or a tablet computer and the like.

The invention also provides a method for processing the shell of the electronic device, which mainly comprises the following steps with reference to fig. 19:

s410, providing the decorative sheet 100;

s420, placing the decorative sheet 100 in a cavity of an injection mold and combining the mold;

s430, injecting molten injection liquid into a cavity of the injection mold, and cooling the injection liquid to form the shell body 200 connected with the decorative sheet 100;

s440, opening the mold and taking out the housing body 200 with the decorative sheet 100.

S450, in some embodiments, after the mold is opened to take out the housing body 200, the transparent adhesive is coated on the decorative sheet 100 and the housing body 200, and the transparent protective layer 300 is formed through curing treatment, and the transparent adhesive may be cured through an ultraviolet irradiation manner to form the transparent protective layer 300.

In the step of providing the decorative sheet 100, the decorative sheet 100 may include the ink layer 110, the adhesive layer 120 stacked on the ink layer 110, and an intermediate soft layer disposed on a surface of the ink layer 110 away from the adhesive layer 120, where the intermediate soft layer may be hardened to obtain the cured layer 130.

Referring to fig. 1, in the process of forming the electronic device housing, the decorative sheet 100 may further include a carrier film 150, and the carrier film 150 is used as an intermediate product and does not belong to a component of the formed electronic device housing. In the manufacturing process of the decorative sheet 100, the carrier film 150 is provided first, and then the viscous middle soft layer is coated on the carrier film 150, so that a certain binding force is kept between the middle soft layer and the carrier film 150, and after the middle soft layer is hardened into the cured layer 130, the carrier film 150 can be conveniently torn off from the cured layer 130. Then the ink layer 110 is pasted on the middle soft layer by silk-screen printing or ink-jet technology, and finally the adhesive layer 120 is coated on the ink layer 110.

After the mold is opened without the carrier film 150, if the transparent passivation layer 300 does not need to be formed, the intermediate soft layer can be hardened by light or heat to obtain the cured layer 130. If the decorative sheet 100 does not include the cured layer 130, the mold is opened to obtain a finished electronic device housing. After the mold is opened, if the transparent protection layer 300 is required to be formed, a transparent adhesive may be coated on the cured layer 130 or the ink layer 110, and finally ultraviolet light is applied to form the transparent adhesive into the transparent protection layer 300.

Under the condition of the carrier film 150, when the decorative sheet 100 includes the cured layer 130, the middle soft layer is firstly hardened to obtain the cured layer 130, and then the carrier film 150 is torn off; when the decorative sheet 100 does not include the cured layer 130, the carrier film 150 may be directly peeled off from the ink layer 110.

When the decorative sheet 100 includes the adhesive layer 120, after the decorative sheet 100 is formed, the concave-convex connection structure may be formed on the surface of the adhesive layer 120 through a sand blasting, laser engraving, chemical etching or CNC engraving process. Of course, the reinforcing connection layer 140 may be disposed on the end surface of the decorative sheet 100, and when the reinforcing connection layer 140 is made of a hot melt adhesive layer, the end surface of the decorative sheet 100 is closely attached to the groove wall (for example, the groove wall of the second groove 232 on the frame portion 220) abutted against the decorative sheet 100 by the hot melt adhesive layer under the action of the temperature due to the integral molding between the decorative sheet 100 and the housing body 200 through injection molding and the temperature in the cavity of the injection mold.

If the sand blasting process is adopted, the coarse sand blasting can be carried out firstly, and then the fine sand blasting can be carried out, wherein the grain size of the sand grains adopted by the fine sand blasting process is smaller than that of the sand grains adopted by the coarse sand blasting. This improves the uniformity of the roughness of the male-female connection structure.

The injection mold cavity and a part of the decorative sheet 100 are subjected to a preheating treatment before the step of injecting the molten injection liquid, wherein the temperature reached after the preheating treatment is 60 to 200 ℃. Through the preheating treatment, the internal stress between the molded case body 200 and the decorative sheet 100 can be reduced, and the adhesion strength of the decorative sheet 100 on the case body 200 can be improved. The injection mold cavity and the decorative sheet 100 can be preheated by microwaves, the microwave heating speed is high, the integral temperature rise of the injection mold after heat absorption is avoided, and the cooling time before mold opening is effectively reduced.

In the step of injecting the molten injection liquid, the first injection rate V is first passed ₁ Injecting the injection liquid into the cavity at a second injection speed V ₂ Injecting injection into the cavity and maintaining the pressure, wherein V is not less than 1 ₁ /V ₂ Less than or equal to 10. In the pressure maintaining process, the injection liquid is injected into the cavity at a low speed, so that the effective molding of the shell body 200 can be ensured, and the defects of incomplete molding such as gaps and the like can be avoidedAnd the excessive injection liquid in the pouring gate of the injection mould can be avoided, and the cleaning difficulty of the subsequent pouring gate is reduced. The pressure for maintaining the pressure can be 150kg/cm ² ～180kg/cm ² The pressure maintaining time is 3 s-6 s.

Before the mold opening, the injection mold and the electronic device shell can be cooled in an air cooling, oil cooling or water cooling mode, so that the waiting time before the mold opening is reduced, and the production efficiency of the electronic device shell is improved.

"electronic devices" as used in embodiments of the present invention may include, but are not limited to, devices configured to receive/transmit communication signals via a wireline connection (e.g., via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network) and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a digital video broadcasting-handheld (DVB-H) network, a satellite network, an amplitude modulation (AM-FM) broadcast transmitter, and/or another communication terminal). Electronic devices that are arranged to communicate over a wireless interface may be referred to as "wireless communication terminals", "wireless terminals", and/or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; personal Communication System (PCS) terminals that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; personal Digital Assistants (PDAs) that may include radiotelephones, pagers, internet/intranet access, web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention. In the embodiment of the present invention, shapes of the first side wall 221, the second side wall 222, and the connecting wall 223 of the frame portion 220 are not particularly limited, and outlines of the first side wall 221, the second side wall 222, and the connecting wall 223 may be curved surfaces other than the rectangle described in the embodiment of the present invention, and a frame portion of an electronic device case is designed to be an arc shape, so that overall consistency and aesthetic feeling of an appearance of the electronic device case cannot be increased, a user can conveniently grip the electronic device case, and the electronic device case conforms to an ergonomic design concept.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being permanently connected, detachably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the second feature or the first and second features may be indirectly contacting each other through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description of the specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. An electronic device housing, comprising:

the shell body is integrally formed with the decorative sheet through in-mold injection molding, and comprises a cover plate part and a frame part arranged around the edge of the cover plate part; the decorative sheet is attached to the outer surface of the cover plate part, and the bonding layer is arranged between the cover plate part and the ink layer; the cover plate part is provided with a first groove, and the decorative sheets are all accommodated in the first groove; the decorative sheet comprises a second surface which is in smooth transition with the surface of the frame part and a first surface attached to the cover plate part; and

and the transparent protective layer is covered on the second surface and the frame part in a spraying mode.

2. The electronic device casing according to claim 1, wherein the first surface is a curved surface, and both ends of the first surface are respectively connected to ends of the second surface.

3. The electronic device casing of claim 1, wherein the frame portion comprises two first side walls disposed opposite to each other, two second side walls disposed opposite to each other, and a connecting wall connecting between the adjacent first side walls and the adjacent second side walls.

4. An electronic device enclosure as recited in claim 3, wherein the connecting wall is planar.

5. The electronic device casing according to claim 4, wherein the decorative sheet includes a main body portion to which the outer surface of the cover plate portion is entirely attached, and a skirt connected to an edge of the main body portion and to which the outer surface of the rim portion is entirely attached; the expansion contour of the main body part is octagonal, and the skirt edges are connected to the eight side edges of the main body part respectively.

6. An electronic device enclosure according to claim 3, wherein the connecting wall is curved.

7. The electronic device casing of claim 6, wherein the decorative sheet comprises a main body part which is attached to the whole outer surface of the cover plate part, and a plurality of skirts which are connected with edges of the main body part and are attached to the outer surfaces of the first side wall and/or the second side wall;

8. The electronic device casing according to claim 7, wherein the outer surface of the first side wall and/or the second side wall is provided with a second groove recessed with respect to the connecting wall and used for embedding the skirt, tangential planes of the outer surface of the skirt and the outer surface of the connecting wall at a junction therebetween are coplanar, and an end surface of the skirt is flush with an end surface of the rim portion.

9. The electronic device shell as claimed in claim 7, wherein a second groove for embedding the skirt is formed on a part of the outer surface of the first sidewall and/or the second sidewall in a recessed manner, the end surface of the skirt is attached to a groove wall enclosing the second groove, and the tangent planes of the outer surface of the skirt and the outer surface of the first sidewall and/or the second sidewall at the joint of the two are coplanar with each other.

10. The electronic device casing of claim 6, wherein the decorative sheet comprises a main body part attaching the outer surface part of the cover plate part, and a plurality of skirts connecting with edges of the main body part and attached on the outer surfaces of the first side wall and/or the second side wall;

11. The electronic device housing of claim 1, wherein the decorative sheet further comprises a cured layer laminated to a side of the ink layer remote from the adhesive layer.

12. The electronic device housing as recited in claim 11, wherein the cured layer has a thickness a, wherein a is in a range of 2 μ ι η and a ≦ 5 μ ι η.

13. The electronic device shell according to claim 1, wherein the thickness of the decorative sheet is B, wherein B is in a range of 4 μm to 15 μm.

14. The electronic device enclosure of claim 1, wherein the transparent protective layer comprises an ultraviolet cured glue layer.

15. The electronic device shell according to claim 1, wherein the transparent protective layer has a thickness C, wherein C is in a range of 10 μm C30 μm.

16. The electronic device enclosure of claim 1, wherein the ink layer comprises one or more of a textured film, an optically coated film, and a colored film.

17. The electronic device shell of claim 16, wherein the optical coating comprises a first coating and a second coating alternately stacked, and the total number of the first coating and the second coating is D, wherein D is in a range of 10 ≤ D ≤ 1500.

18. The electronic device enclosure of claim 17, wherein the first plating film comprises an alloy film and the second plating film comprises a non-metal oxide film.

19. The electronic device housing of claim 17, wherein the refractive index of the first plating film is greater than the refractive index of the second plating film by a difference E, wherein E is in a range of 0.25 ≤ E ≤ 1.25.

20. The electronic device casing according to claim 1, wherein a concave-convex connection structure corresponding to the case body is provided on the adhesive layer.

21. The electronic device casing of claim 1, wherein the decorative sheet further comprises a reinforcing connection layer laminated on an end surface of the decorative sheet, the reinforcing connection layer being connected to the case body.

22. The electronic device enclosure of claim 21, wherein the reinforcing connection layer comprises a silicone layer or a hot melt adhesive layer.

23. The electronic device enclosure of claim 1, wherein the housing body is made of a plastic material.

24. The electronic device housing as claimed in claim 1, wherein a color difference value between the color of the decoration sheet and the color of the housing body is Δ E, and a value of Δ E ranges from 0 to 2.

25. An electronic device housing, comprising:

the decorative sheet comprises an ink layer and an adhesive layer which is laminated with the ink layer, the ink layer and the adhesive layer are fixed in the first groove, and the adhesive layer is connected with the bottom wall of the first groove; the decorative sheet comprises a second surface which is in smooth transition with the surface of the frame part and a first surface attached to the cover plate part; and

and the transparent protective layer is covered on the frame part and the second surface.

26. An electronic device comprising a processor and a memory, further comprising an electronic device housing as claimed in any one of claims 1 to 25.

27. A processing method for an electronic device shell is characterized by comprising the following steps:

providing a decorative sheet, wherein the decorative sheet comprises an ink layer and an adhesive layer which is laminated with the ink layer;

injecting molten injection into a cavity of the injection mold, and cooling the injection to form a shell body connected with the decorative sheet; the shell body comprises a cover plate part and a frame part arranged around the edge of the cover plate part; the decorative sheet is attached to the outer surface of the cover plate part, and the bonding layer is arranged between the cover plate part and the ink layer; the cover plate part is provided with a first groove, and the decorative sheet is completely accommodated in the first groove; the decorative sheet comprises a second surface which is in smooth transition with the surface of the frame part, and a first surface attached to the cover plate part;

opening the die and taking out the shell body with the decorative sheet; and

and coating transparent adhesive on the second surface and the frame part, and carrying out curing treatment to form a transparent protective layer.

28. The method for processing an electronic device shell according to claim 27, wherein the decorative sheet further comprises a carrier film, and the ink layer is attached to the carrier film; before the step of coating the transparent adhesive tape, the carrier film is torn off.

29. The method of claim 28, wherein the ink layer is attached to the carrier film by silk-screen printing or ink-jet printing, and the adhesive layer is attached to the ink layer.

30. The method of claim 29, wherein before the ink layer is attached to the carrier film, a viscous middle soft layer is coated on the carrier film, and then the ink layer and the adhesive layer are sequentially attached to the middle soft layer.

31. The method for manufacturing an electronic device housing as claimed in claim 30, wherein after removing the carrier film, the intermediate soft layer is hardened by light or heat to obtain a cured layer.

32. The method of claim 27, wherein after the decorative sheet is formed, the concave-convex connection structure is formed on the surface of the adhesive layer by a sand blasting, laser engraving or chemical etching process.

33. The method of manufacturing an electronic device case as claimed in claim 27, wherein a reinforcing connection layer is laminated on an end face of the decorative sheet after the decorative sheet is formed.

34. The method of manufacturing an electronic device cover according to claim 27, wherein the injection mold cavity and the part of the decorative sheet are subjected to a preheating treatment before the step of injecting the molten injection liquid, wherein the temperature reached after the preheating treatment is 60 to 200 ℃.

35. The method of claim 27, wherein the step of injecting the molten injection liquid is preceded by a first injection rate V ₁ Injecting the injection liquid into the cavity at a second injection speed V ₂ Injecting injection into the cavity and maintaining the pressure, wherein V is not less than 1 ₁ /V ₂ ≤10。

36. The method of claim 27, wherein the injection mold and the electronic device housing are cooled by water, oil, or air cooling prior to opening the mold.