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CN107044745B - Micro-channel condenser - Google Patents

Micro-channel condenser Download PDF

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Publication number
CN107044745B
CN107044745B CN201710220028.XA CN201710220028A CN107044745B CN 107044745 B CN107044745 B CN 107044745B CN 201710220028 A CN201710220028 A CN 201710220028A CN 107044745 B CN107044745 B CN 107044745B
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Prior art keywords
pipe
flat
microchannel
micro
condenser
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CN107044745A (en
Inventor
赵雅楠
梁惊涛
蔡京辉
卫铃佼
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Technical Institute of Physics and Chemistry of CAS
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Technical Institute of Physics and Chemistry of CAS
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Priority to CN201710220028.XA priority Critical patent/CN107044745B/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00Evaporators; Condensers
    • F25B39/04Condensers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00Details of evaporators; Details of condensers
    • F25B2339/04Details of condensers
    • F25B2339/042Details of condensers of pcm condensers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0068Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for refrigerant cycles
    • F28D2021/007Condensers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention provides a micro-channel condenser, wherein the left end and the right end of each micro-channel condensing pipeline are respectively fixedly connected with a first collecting pipe and a second collecting pipe which are arranged in parallel, each row of flat heat pipes are arranged between the micro-channel condensing pipelines, one end of each row of flat heat pipes is fixedly connected to a first communication plate, and an air inlet pipe and a liquid outlet pipe are both communicated with one of the first collecting pipe and the second collecting pipe; the first filling pipe is fixedly arranged on the first communicating plate, the structure of the micro-channel condenser can be completed by one-time welding, and the preparation process is simple; in addition, replace traditional copper, aluminium fin structure with dull and stereotyped heat pipe, simultaneously, because communicate each other through first intercommunication board, second intercommunication board between the dull and stereotyped heat pipe, can once only accomplish working medium through filling the filler pipe and fill and annotate to all dull and stereotyped heat pipes, at the radiating process, dull and stereotyped heat pipe can carry out gas-liquid working medium automatically regulated and balance according to local heat dissipation capacity size to radiating efficiency has effectively been improved.

Description

Micro-channel condenser
Technical Field
The invention relates to the technical field of air cooling and heat dissipation, in particular to a micro-channel condenser.
Background
At present, a condenser in a refrigeration system is generally a coil type condenser, a plurality of aluminum sheets or copper sheets are sleeved outside a coil to form fins, and heat is taken away by forced air cooling. Still another type of condenser is formed from a plurality of parallel flow aluminum tubes with corrugated fins disposed between adjacent parallel flow tubes to form a microchannel condenser. In the heat transfer process, gaseous working medium is condensed in the condensation pipeline to release heat, the heat is transferred to the fins outside through the wall of the condensation pipeline, and the heat is dissipated to the outside through the heat convection of the fins and the air.
The condensation heat transfer coefficient in the condensation pipeline and the convection heat transfer coefficient between the fins and the air have important influence on the overall heat exchange performance of the condenser. Generally, the heat dissipation fins are very thin and limited by rib efficiency, the height of the fins cannot be too large, the base parts and the tail ends of the existing fins have large temperature difference, if the heat dissipation capacity is improved, the number of the fins and the length of a condensation pipeline can only be increased, and the area of a condenser is continuously increased in the plane direction to meet the heat dissipation requirement. In order to improve the heat dissipation capacity of the condenser, the condensation heat exchange coefficient and the heat exchange area need to be increased, and particularly the heat dissipation area of the fins needs to be increased and the rib efficiency of the fins needs to be improved.
The heat pipe is a high-efficiency phase-change heat transfer device, has excellent temperature equalization performance and is called a heat superconductor. The condenser is subjected to extended heat dissipation by the heat pipe, so that the heat dissipation performance of the condenser is greatly improved. The applicant provides a microchannel condenser device which utilizes a flat heat pipe to perform extended heat dissipation in an invention patent with the application number of 201710020541.4 and the name of microchannel condenser, wherein a microchannel structure is used as a condensation pipeline, a plurality of flat heat pipes and the outer surface of the microchannel condensation pipeline are bonded or welded and fixed into a whole, and a fin structure is replaced by the flat heat pipes, so that the heat dissipation area of the condenser is increased, and the rib efficiency is improved. Although the micro-channel condenser can effectively improve the heat dissipation efficiency, each flat heat pipe is independent and needs to be filled separately, and then the flat heat pipes and the micro-channel pipeline are assembled and fixed, so that the whole production process is complex.
Disclosure of Invention
In view of the above, there is a need to provide a microchannel condenser with high heat dissipation efficiency and simple assembly.
In order to achieve the purpose, the invention adopts the following technical scheme:
a microchannel condenser, comprising: multiseriate flat heat pipe, many microchannel condensation line, first collector, second collector, first communications board, intake pipe, drain pipe and first filling pipe, wherein:
the first collecting pipe and the second collecting pipe are arranged in parallel, the left end and the right end of each micro-channel condensation pipeline are respectively and fixedly connected to the first collecting pipe and the second collecting pipe, each row of flat heat pipes are arranged between the micro-channel condensation pipelines, one end of each row of flat heat pipes is fixedly connected to the first communication plate, and the air inlet pipe and the liquid outlet pipe are both communicated with one of the first collecting pipe and the second collecting pipe; or the air inlet pipe and the liquid outlet pipe are respectively communicated with a first collecting pipe and a second collecting pipe, and the first filling pipe is fixedly arranged on the first communicating plate.
In a preferred embodiment of the present invention, the flat heat pipe includes a metal flat plate and at least one capillary structure provided inside the metal flat plate.
As a preferred embodiment of the present invention, the capillary structure is a micro-groove or a capillary wick, and the length of the capillary structure is the same as that of the flat heat pipe.
As a preferred embodiment of the invention, the cross-sectional shape of the capillary structure is a square, a circle or a special-shaped structure with protrusions.
In a preferred embodiment of the present invention, each of the microchannel condensation tubes is in the shape of a flat, elongated strip, and a plurality of condensation microchannels are provided in each of the microchannel condensation tubes.
In a preferred embodiment of the present invention, a plurality of the microchannel condensation pipes are arranged in parallel at equal intervals, and the interval is equal to the thickness of each column of the flat heat pipes.
As a preferred embodiment of the invention, each row of flat heat pipes arranged between two adjacent microchannel condensation pipelines comprises at least two flat heat pipes.
In a preferred embodiment of the present invention, a fin is disposed between each flat heat pipe.
In a preferred embodiment of the present invention, end caps are provided at both ends of the first header and the second header.
As a preferred embodiment of the present invention, the microchannel condenser further includes a second communicating plate, the other end of each row of the flat heat pipes is fixedly connected to the second communicating plate, and the first communicating plate and the second communicating plate are both provided with flat heat pipe assembling holes.
In a preferred embodiment of the present invention, the second communication plate is further communicated with a second filling tube.
The technical scheme adopted by the invention has the beneficial effects that:
according to the micro-channel condenser provided by the invention, the first collecting pipe and the second collecting pipe are arranged in parallel, the left end and the right end of each micro-channel condensing pipeline are respectively and fixedly connected to the first collecting pipe and the second collecting pipe, each row of flat heat pipes are arranged between the micro-channel condensing pipelines, one end of each row of flat heat pipes is fixedly connected to the first communication plate, and the air inlet pipe and the liquid outlet pipe are both communicated with one of the first collecting pipe and the second collecting pipe; or the air inlet pipe and the liquid outlet pipe are respectively communicated with a first collecting pipe and a second collecting pipe, the first filling pipe is fixedly arranged on the first communicating plate, the structure of the micro-channel condenser can be completed through one-time welding, and the preparation process is simple; in addition, according to the micro-channel condenser provided by the invention, the flat heat pipes are used for replacing the traditional copper and aluminum fin structures, meanwhile, because the flat heat pipes are mutually communicated through the first communicating plate and the second communicating plate, working medium charging can be completed for all the flat heat pipes at one time through the charging pipes, and in the heat dissipation process, the flat heat pipes can automatically adjust and balance gas-liquid working media according to the local heat dissipation capacity, so that the heat dissipation efficiency is effectively improved.
In addition, the micro-channel condenser provided by the invention has the advantages that the flat heat pipe and the micro-channel condensing pipeline are of the plane structures, the wall thicknesses are very thin, the contact areas are large, the flat heat pipe and the micro-channel condensing pipeline are combined into a whole through a welding method, the heat transfer resistance can be effectively reduced, the heat dissipation capacity of the micro-channel condenser can be enhanced through the structure of combining the flat heat pipe and the micro-channel condensing pipeline, and the reliability of the micro-channel condenser is improved; meanwhile, the micro-channel structure is adopted as the condensation pipeline, so that the heat exchange area and the condensation heat exchange coefficient in the pipeline can be increased, and the structure of the condensation pipeline is more compact.
Drawings
FIG. 1 is a schematic diagram of a flat plate heat pipe extended micro-channel condenser structure.
FIG. 2 is a right side view of a flat plate heat pipe extended microchannel condenser.
FIG. 3 is a schematic cross-sectional view of a microchannel condensation line.
FIG. 4 is a schematic cross-sectional view of a microchannel condenser.
Fig. 5 is a schematic structural view of the second communication plate.
Fig. 6 is a schematic diagram of a flat heat pipe structure.
Wherein: 1. the heat pipe comprises a flat heat pipe body, 2, a micro-channel condensation pipeline, 3, a first collecting pipe, 4, a second collecting pipe, 5, a first communicating plate, 6, a second communicating plate, 7, an air inlet pipe, 8, a liquid outlet pipe, 9, an end cover, 10, a first filling pipe, 11, a fin, 12, a condensation micro-channel, 13, a first communicating cavity, 14, a second communicating cavity, 15, a heat pipe inner cavity, 16 and a heat pipe assembling hole.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1 to 2, a microchannel condenser according to an embodiment of the present invention includes: the device comprises a multi-column flat heat pipe 1, a plurality of micro-channel condensation pipelines 2, a first collecting pipe 3, a second collecting pipe 4, a first communication plate 5, an air inlet pipe 7, a liquid outlet pipe 8 and a first filling pipe 10. Wherein:
the first collecting pipe 3 and the second collecting pipe 4 are arranged in parallel, the left end and the right end of each microchannel condensation pipeline 2 are respectively fixedly connected to the first collecting pipe 3 and the second collecting pipe 4, each row of the flat heat pipes 1 is arranged between the microchannel condensation pipelines 2, one end of each row of the flat heat pipes 1 is fixedly connected to the first communication plate 5, and the air inlet pipe 7 and the liquid outlet pipe 8 are both communicated with one of the first collecting pipe 3 and the second collecting pipe 4; or, the air inlet pipe 7 is communicated with the liquid outlet pipe 8 through the first collecting pipe 3 and the second collecting pipe 4 respectively, and the first filling pipe 10 is fixedly arranged on the first communication plate 5.
It can be understood that, in the present invention, when one end of each column of the flat heat pipes 1 is fixedly connected to the first communication plate 5, the other end of each flat heat pipe 1 is independently sealed.
In an embodiment of the present invention, the microchannel condenser further includes a second communicating plate 6, and the other end of each row of the flat heat pipes 1 is fixedly connected to the second communicating plate 6. It can be understood that, in the microchannel condenser provided by the invention, the flat heat pipe 1, the first communicating plate 5 and the second communicating plate 6 form an integral closed space, and the first filling pipe 10 is used for vacuumizing and filling working medium into the flat heat pipe 1, so that the microchannel condenser is simple in structure, stable and reliable.
Further, the second communicating plate 6 may be communicated with a second filling pipe (not shown)
Fig. 3 is a schematic structural diagram of a flat heat pipe according to a preferred embodiment of the present invention.
Preferably, the outer surface of the flat heat pipe 1 is a planar structure, the flat heat pipe 1 comprises a metal flat plate and at least one capillary structure arranged inside the metal flat plate, the capillary structure is a micro-groove or a capillary core, the length of the capillary structure is the same as that of the flat heat pipe 1, and a heat transfer working medium circularly flows in a cavity of the capillary structure to transfer heat.
Furthermore, the cross section of the capillary structure is square, round or a special-shaped structure with protrusions.
Furthermore, fins 11 are arranged between the flat heat pipes 1, and the fins 11 are welded with the flat heat pipes 1.
Specifically, one end of a flat heat pipe 1 extends between two adjacent microchannel condensation pipelines 2, the extending part of the flat heat pipe 1 is assembled and welded with a second communicating plate 6, and the other end of the flat heat pipe 1 is assembled and welded with a first communicating plate 5.
It can be understood that above-mentioned microchannel condenser's structure can be through once welding completion, and the preparation process is simple, and adopt and replace traditional copper, aluminium fin structure with dull and stereotyped heat pipe, simultaneously, because communicate each other through first intercommunication board, second intercommunication board between the dull and stereotyped heat pipe, can once only accomplish working medium through filling the filler pipe and fill and annotate all dull and stereotyped heat pipes, in the radiating process, dull and stereotyped heat pipe can carry out gas-liquid working medium automatically regulated and balance according to local heat dissipation capacity size to the radiating efficiency has effectively been improved.
Fig. 4 is a schematic structural diagram of a microchannel condensation circuit according to a preferred embodiment of the present invention.
Preferably, each microchannel condensation pipe 2 is shaped as a flat, long strip, and a plurality of condensation microchannels are provided inside each microchannel condensation pipe.
Furthermore, a plurality of micro-channel condensation pipelines 2 are arranged in parallel at equal intervals, and the interval is equal to the thickness of the flat-plate heat pipe 1. It can be understood that both ends of the microchannel condensation conduit 2 extend into the interior of the first header 3 and the second header 4, and are assembled and welded with the first header 3 and the second header 4.
Furthermore, a plurality of condensing microchannels 12 are arranged in the microchannel condensing pipeline 2, so that the first collecting pipe 3 and the second collecting pipe 4 are communicated with the plurality of microchannel condensing pipelines 2, and the plurality of microchannel condensing pipelines 2, the first collecting pipe 3, the second collecting pipe 4, the air inlet pipe 7 and the liquid outlet pipe 8 form a refrigerating working medium flowing and condensing channel.
Preferably, each row of flat heat pipes arranged between two adjacent microchannel condensation pipelines 2 comprises at least two flat heat pipes 1. It can be understood that a plurality of flat heat pipes 1 form a two-dimensional array and are assembled with the microchannel condensation pipeline 2, the contact area of the flat heat pipes 1 and the microchannel condensation pipeline 2 is an evaporation area, other areas are condensation areas, and the condensation areas of the flat heat pipes 1 are cooled through forced air cooling.
It can be understood that because the flat heat pipe and the microchannel condensation pipeline are both in a plane structure, the wall thickness is very thin, the contact area is large, the flat heat pipe and the microchannel condensation pipeline are combined into a whole by a welding method, the heat transfer resistance can be effectively reduced, the heat dissipation capacity of the microchannel condenser can be enhanced through the structure combining the flat heat pipe and the microchannel pipeline, and the reliability of the microchannel condenser is improved.
Fig. 5 is a schematic diagram of a longitudinal cross-sectional structure of a microchannel condenser according to the present invention.
As can be seen from FIG. 5, the first communicating plate 5 and the second communicating plate 6 are respectively provided with a first communicating cavity 13 and a second communicating cavity 14 inside and communicated with the heat pipe inner cavity 15, so that the flat heat pipe 1, the first communicating plate 5 and the second communicating plate 6 form an integral closed space, and the first filling pipe 10 is used for vacuumizing and filling working medium into the flat heat pipe 1.
Please refer to fig. 6, which is a schematic structural diagram of the first communicating plate or the second communicating plate. As can be seen from fig. 6, the first communication plate 5 and the second communication plate 6 are provided with heat pipe assembly holes 16 for assembly with the ends of the flat heat pipe 1.
When the microchannel condenser works, a gaseous refrigerant flows into the first collecting pipe 3 from the condenser air inlet 7 and then dispersedly flows into each microchannel condensation pipeline 2, and in the process of flowing through the microchannel condensation pipelines 2, the gaseous refrigerant is condensed into liquid and releases heat to the pipe wall; the condensed liquid continues to flow forward and out of the microchannel condenser tubes 2 where it collects in the second header 4 and finally exits the condenser via outlet pipe 8.
It can be understood that the heat released during the condensation process of the refrigerant is transferred to the wall of the flat heat pipe 1 contacting the microchannel condensation pipeline 2 via the wall of the microchannel condensation pipeline in a heat conduction manner, and then transferred to the inside of the flat heat pipe 1. The liquid heat transfer working medium in the flat heat pipe 1 is heated and then undergoes phase change heat absorption to be evaporated into a gas state, and the gas heat transfer working medium flows to the condensation area of the flat heat pipe 1 along the gas channel in the cavity. The gaseous heat transfer working medium is condensed into liquid in the condensation area of the flat heat pipe 1, heat is released at the same time, the liquid heat transfer working medium flows back to the evaporation area along the capillary structure, and the released heat is taken away by cold air and is dissipated to the surrounding environment. Because two ends of the flat heat pipe 1 are communicated through the first communicating plate 5 and the second communicating plate 6, when the heat dissipation capacity of the local micro-channel condensation pipeline 2 is uneven with the heat dissipation capacity of the micro-channel condensation pipelines 2 at other positions, the automatic adjustment of internal gas-liquid balance can be carried out between the flat heat pipes 1 according to the local heat dissipation capacity. The heat transfer working medium is continuously subjected to phase change and circular flow in the flat heat pipe 1, so that the whole flat heat pipe 1 is in a uniform temperature state, and the heat of the condenser is efficiently dissipated to the external environment.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent should be subject to the appended claims.

Claims (11)

1. A microchannel condenser, comprising: multiseriate flat heat pipe, many microchannel condensation line, first collector, second collector, first communications board, intake pipe, drain pipe and first filling pipe, wherein:
the first collecting pipe and the second collecting pipe are arranged in parallel, the left end and the right end of each micro-channel condensation pipeline are respectively and fixedly connected to the first collecting pipe and the second collecting pipe, each row of flat heat pipes are arranged between the micro-channel condensation pipelines, one end of each row of flat heat pipes is fixedly connected to the first communication plate, and the air inlet pipe and the liquid outlet pipe are both communicated with one of the first collecting pipe and the second collecting pipe; or the air inlet pipe and the liquid outlet pipe are respectively communicated with a first collecting pipe and a second collecting pipe, and the first filling pipe is fixedly arranged on the first communicating plate;
the flat heat pipe and the micro-channel condensation pipeline are combined into a whole through a welding method.
2. The microchannel condenser of claim 1, wherein the flat plate heat pipe comprises a flat metal plate and at least one capillary structure opening inside the flat metal plate.
3. The microchannel condenser of claim 2, wherein the capillary structure is a micro-groove or a wick, and the length of the capillary structure is the same as the length of the flat-plate heat pipe.
4. The microchannel condenser of claim 3, wherein the capillary structure has a cross-sectional shape of a square or circle.
5. The microchannel condenser of claim 1, wherein each of the microchannel condensation tubes is shaped as a flat, elongated strip, and wherein each of the microchannel condensation tubes has a plurality of condensation microchannels disposed therein.
6. The microchannel condenser of claim 1, wherein a plurality of the microchannel condenser tubes are arranged in parallel at equal intervals, and the interval is equal to the thickness of each column of flat heat pipes.
7. The microchannel condenser of claim 6, wherein each column of flat heat pipes disposed between two adjacent microchannel condensation lines comprises at least two flat heat pipes.
8. The microchannel condenser of claim 7, wherein a fin is disposed between each of the flat plate heat pipes.
9. The microchannel condenser of claim 1, wherein both ends of the first header and the second header are provided with end caps.
10. The micro-channel condenser of claim 1, further comprising a second communication plate, wherein the other end of each row of the flat heat pipes is fixedly connected to the second communication plate, and the first communication plate and the second communication plate are both provided with flat heat pipe assembly holes.
11. The microchannel condenser of claim 10, wherein the second communication plate is further communicated with a second fill tube.
CN201710220028.XA 2017-04-06 2017-04-06 Micro-channel condenser Active CN107044745B (en)

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Publication number Priority date Publication date Assignee Title
CN107917554A (en) * 2017-11-28 2018-04-17 中国科学院理化技术研究所 Flat heat pipe expansion type condensing device
CN110068237B (en) * 2019-04-30 2023-03-07 张国华 Anti-supply heat abstractor of storable energy
CN112050670A (en) * 2020-10-09 2020-12-08 北京丰联奥睿科技有限公司 Soaking cold plate heat exchanger and manufacturing method thereof
CN113267070B (en) * 2021-05-28 2022-06-10 衡水新工质能源科技有限公司 High-pressure-resistant wide-channel flat plate heat exchanger

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US5737923A (en) * 1995-10-17 1998-04-14 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
CN102506600A (en) * 2011-09-20 2012-06-20 华北电力大学 Condensation end extension type integrated flat heat pipe
CN103759563A (en) * 2014-02-21 2014-04-30 电子科技大学 Micro-channel heat dissipation device achieving heat transfer through phase-change circulating motion of working medium
CN104154787A (en) * 2014-08-29 2014-11-19 电子科技大学 Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device
CN206695446U (en) * 2017-04-06 2017-12-01 中国科学院理化技术研究所 Micro-channel condenser

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Publication number Priority date Publication date Assignee Title
US5737923A (en) * 1995-10-17 1998-04-14 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
CN102506600A (en) * 2011-09-20 2012-06-20 华北电力大学 Condensation end extension type integrated flat heat pipe
CN103759563A (en) * 2014-02-21 2014-04-30 电子科技大学 Micro-channel heat dissipation device achieving heat transfer through phase-change circulating motion of working medium
CN104154787A (en) * 2014-08-29 2014-11-19 电子科技大学 Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device
CN206695446U (en) * 2017-04-06 2017-12-01 中国科学院理化技术研究所 Micro-channel condenser

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