CN107018216A - Decorate coil structures and preparation method thereof, cover plate assembly and electronic installation - Google Patents
Decorate coil structures and preparation method thereof, cover plate assembly and electronic installation Download PDFInfo
- Publication number
- CN107018216A CN107018216A CN201710382341.3A CN201710382341A CN107018216A CN 107018216 A CN107018216 A CN 107018216A CN 201710382341 A CN201710382341 A CN 201710382341A CN 107018216 A CN107018216 A CN 107018216A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- case ring
- coil structures
- ring
- waterproof seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
Abstract
Coil structures, cover plate assembly, electronic installation and the preparation method for decorating coil structures are decorated the invention discloses a kind of.Decorating coil structures includes case ring and waterproof seal.Waterproof seal is circumferentially provided on the lateral surface of case ring around case ring, and waterproof seal and case ring are formed in one structure.Embodiment of the present invention decoration coil structures, cover plate assembly, electronic installation and decorate coil structures preparation method in, because waterproof seal is structure as a whole with case ring, waterproof seal various pieces deflection in the assembling process of case ring is more consistent, can effectively seal against the gap between the side wall and case ring of the installation through-hole of cover plate.
Description
Technical field
The present invention relates to field of electronic devices, more particularly to a kind of decoration coil structures and preparation method thereof, cover plate assembly and
Electronic installation.
Background technology
In the related art, mobile phone includes cover plate and case ring, and cover plate offers through hole, and case ring is set in through-holes.
Therefore, how to ensure that the waterproof seal between the medial surface of through hole and case ring turns into technical problem to be solved.
The content of the invention
Embodiment of the present invention provides a kind of decoration coil structures, a kind of cover plate assembly, a kind of electronic installation and a kind of decoration
The preparation method of coil structures.
The decoration coil structures of embodiment of the present invention include case ring and waterproof seal.Waterproof seal surrounds the dress
Decorative circle is circumferentially provided on the lateral surface of the case ring, and the waterproof seal is structure as a whole with the case ring.
In some embodiments, the lateral surface is formed with the circumferentially extending groove along the case ring, described anti-
Watertight seal is partly housed in the groove.
In some embodiments, the case ring includes：
Basic ring, the basic ring includes the lateral surface；And
The support division stretched out from the top of the basic ring, the support division includes being connected with the lateral surface of the basic ring
Supporting surface, the angle of the supporting surface and the lateral surface is right angle or obtuse angle, and the supporting surface is used to be resisted against electronics dress
On the cover plate put, moved down with limiting the case ring relative to the cover plate.
In some embodiments, the support division includes the guide ramp opposite with the supporting surface, and the guiding is oblique
Face connects the medial surface of the basic ring and tilted down towards the medial surface of the basic ring.
In some embodiments, the case ring includes the support that the bottom of the medial surface from the basic ring extends internally
Piece.
In some embodiments, medial surface of the support chip perpendicular to the basic ring.
In some embodiments, the basic ring includes the bottom surface being connected with the lateral surface, the following table of the support chip
Face is concordant with the bottom surface.
In some embodiments, the waterproof seal includes silica gel waterproof seal.
The cover plate assembly of embodiment of the present invention includes cover plate and the decoration coil structures of any of the above embodiment, the dress
Decorative circle structure setting is in the installation through-hole, and the waterproof seal seals the inner side of the lateral surface and the installation through-hole
Gap between face.
In some embodiments, the cover plate assembly includes the fingerprint identification module being arranged in the case ring.
The electronic installation of embodiment of the present invention includes the cover plate assembly of any of the above embodiment.
The preparation method of the decoration coil structures of embodiment of the present invention includes：
One case ring is provided；
Liquid repellent glue is set on the lateral surface of the case ring, and the liquid repellent glue is surrounded the decoration
Circle；With
Solidify the liquid repellent glue to form the waterproof seal being structure as a whole with the case ring, so as to obtain institute
State decoration coil structures.
In some embodiments, the step of setting liquid repellent glue is with the step of solidifying the liquid repellent glue
Carried out in mould.
Embodiment of the present invention decoration coil structures, cover plate assembly, electronic installation and decorate coil structures preparation method in,
Because waterproof seal is structure as a whole with case ring, waterproof seal various pieces deflection in the assembling process of case ring
It is more consistent, the gap between the medial surface of the installation through-hole of cover plate and the lateral surface of case ring can be effectively sealed against, it is ensured that
Waterproof seal.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become from description of the accompanying drawings below to embodiment is combined
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the floor map of the cover plate assembly of embodiment of the present invention；
Fig. 2 be Fig. 1 cover plate assembly II-II to partial cutaway schematic view；
Fig. 3 is the enlarged diagram of Fig. 2 cover plate assembly III parts；
Fig. 4 is the schematic perspective view of the electronic installation of embodiment of the present invention；
Fig. 5 be Fig. 1 cover plate assembly V-V to partial cutaway schematic view；
Fig. 6 is the schematic perspective view of the cover plate assembly of embodiment of the present invention；
Fig. 7 is the schematic perspective view of the decoration coil structures of embodiment of the present invention；
Fig. 8 is the diagrammatic cross-section of the decoration coil structures of embodiment of the present invention；
Fig. 9 is the schematic perspective view of the carrying tablet of embodiment of the present invention；
Figure 10 is the schematic flow sheet of the preparation method of the decoration coil structures of embodiment of the present invention.
Main element symbol description：
Cover plate assembly 100, electronic installation 200；
Cover plate 10, upper surface 11, lower surface 12, installation through-hole 13, the medial surface 131 of installation through-hole 13, confined planes 14；
Decorate coil structures 120, case ring 20, basic ring 21, lateral surface 211, medial surface 212, centre bore 213, bottom surface 214,
Groove 215, support division 22, supporting surface 221, guide ramp 222, support chip 23, avoidance hole 231, escape groove 232, waterproof sealing
Circle 50；
Fingerprint identification module 30, packaging body 31, fingerprint recognition chip 32, cover plate 33；
Carrying tablet 40, supporting part 41, perforation 411, fixed part 42, projection 43；
Flexible PCB 60；
Card 70, bayonet socket 71.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element or element with same or like function are represented to same or similar label eventually.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention and simplified description, rather than indicate or imply that the device or element of meaning must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, one or more feature can be expressed or be implicitly included to the feature of " second ".
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not direct contact but by it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between discussed various embodiments itself are not indicated and/or are set
Relation.In addition, the invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Fig. 1-Fig. 3 is referred to, the cover plate assembly 100 of embodiment of the present invention includes cover plate 10, decoration coil structures 120, referred to
Line identification module 30 and carrying tablet 40.Decoration coil structures 120 are arranged in cover plate 10, and fingerprint identification module 30 is arranged on case ring
In structure 120, carrying tablet 40 is fixedly connected with cover plate 10, and carries decoration coil structures 120.
Incorporated by reference to Fig. 4, the cover plate assembly 100 of embodiment of the present invention can be applied to electronic installation 200, electronic installation 200
The for example, electronic installation such as mobile phone, Intelligent worn device or tablet personal computer.It is appreciated that electronic installation 200 includes but is not limited to
The example of present embodiment.
Specifically, referring to Fig. 3, cover plate 10 includes upper surface 11 and lower surface 12.It is appreciated that the upper surface of cover plate 10
11 be the appearance of cover plate assembly 100, towards user.User can carry out gesture operation on upper surface 11, for example click on or
Slide to control electronic installation 200 to realize corresponding function.
Cover plate 10 can be made up of light transmissive materials such as glass, ceramics or sapphires.Because cover plate 10 as electronics due to filling
Put 200 input part, cover plate 10 is often subject to collide or the contact such as scratches.For example, electronic installation 200 is put into pocket by user
When, cover plate 10 may be scratched and damaged by the key in user's pocket.
Therefore, the material of cover plate 10 can be using the larger material of hardness, such as sapphire material.It is of course also possible to
Set up protection board to prevent cover plate 10 to be scraped off in the upper surface 11 of cover plate 10.
Because cover plate 10 is made up of light transmissive material, therefore, user can check the screen of electronic installation 200 by cover plate 10
Shown content.
It is appreciated that the shape of cover plate 10 can be according to the shape specific design of electronic installation 200, for example, fillet square
Shape.
Further, cover plate 10 offers installation through-hole 13.In present embodiment, installation through-hole 13 is through upper surface 11
And the through hole of lower surface 12.
In present embodiment, installation through-hole 13 is in the oval bodily form.Certainly, in other embodiments, installation through-hole 13 can
To take on a different shape, such as circular or ellipse shape.Therefore, the example of the shape of the installation through-hole 13 of present embodiment
It is not considered as limiting the invention.
In some embodiments, decoration coil structures 120 are arranged in installation through-hole 13, and fix company with cover plate 10
Connect.
Usually, the receiver of electronic installation 200 is arranged on the top area of electronic installation 200.Therefore, in order to prevent peace
Dress through hole 13 is interfered with receiver, it is preferred that installation through-hole 13 is opened in the bottom section of cover plate 10, so that logical to install
The larger design space of offer in hole 13.In addition, installation through-hole 13 is opened in the centre position of the bottom section of cover plate 10 so that lid
The substantially symmetrical structure of plate 10.So so that electronic installation 200 is more attractive in appearance, two is user-friendly.
Referring to Fig. 7, the decoration coil structures 120 of embodiment of the present invention include case ring 20 and waterproof seal 50.It is anti-
Watertight seal 50 is circumferentially provided on the lateral surface 211 of case ring 20 around case ring 50, waterproof seal 50 and case ring
20 are structure as a whole.
Referring to Fig. 10, the preparation method of the decoration coil structures 120 of embodiment of the present invention includes step：
There is provided a case ring 20 by S1；
S2, sets liquid repellent glue, and the liquid repellent glue is surrounded case ring on the lateral surface 211 of case ring 20
20；With
S3, solidifies the waterproof seal 50 that the liquid repellent glue is structure as a whole to be formed with case ring 20, so that
To decoration coil structures 120.
Decoration coil structures 120, cover plate assembly 100, electronic installation 200 and the decoration coil structures 120 of embodiment of the present invention
Preparation method in, because waterproof seal 50 is structure as a whole with case ring 20, dress of the waterproof seal 50 in case ring 20
Various pieces deflection is more consistent during matching somebody with somebody, and can effectively seal against the medial surface 131 and dress of the installation through-hole 13 of cover plate 10
Gap between decorative circle 20, it is ensured that waterproof seal.It can so prevent water, dust and other impurities from the lateral surface of case ring 20
Gap between 211 and installation through-hole 13 enters in electronic installation 200 and influences the normal work of electronic installation 200.
In some embodiments, step S2 and step S3 are carried out in mould.Specifically, first case ring 20 can be filled
Enter in mould, liquid repellent glue is then injected into mould, liquid repellent glue sticking is treated on the lateral surface 211 of case ring 20
The decoration coil structures 120 with waterproof seal 50 can be just obtained after liquid repellent adhesive curing.
In this way, decoration coil structures 120 are formed in mould can improve the production efficiency of decoration coil structures 120, be conducive to dress
Decorative circle structure 120 is produced in batches.
Also referring to Fig. 3, Fig. 7 and Fig. 8, in some embodiments, lateral surface 211 is formed with the week along case ring 20
To the groove 215 of extension, waterproof seal 50 is partly housed in groove 215.
In this way, groove 215 is conducive to that the connection area of waterproof seal 50 and case ring 20 can be increased, be conducive to waterproof
Seal 50 is better secured on case ring 20.Meanwhile, being arranged on for groove 215 is decorated in the preparation method of coil structures 110,
So that liquid repellent glue is easier to be arranged on the lateral surface 211 of case ring 20.
In some embodiments, waterproof seal 50 includes silica gel waterproof seal.
In some embodiments, case ring 20 includes basic ring 21 and support division 22.Basic ring 21 includes lateral surface 211.Support
Hold portion 22 from the top of basic ring 21 to stretch out, support division 22 includes the supporting surface 221 being connected with lateral surface 211, supporting surface 221
Angle with lateral surface 211 is right angle or obtuse angle, and supporting surface 221 is resisted against on cover plate 10, to limit case ring 20 relative to lid
Plate 10 is moved down.
In this way, because case ring 20 can be resisted against on cover plate 10 by supporting surface 221, so that it is relative to limit case ring 20
Moved down in cover plate 10, be conducive to Consumer's Experience.
Specifically, the medial surface 131 of installation through-hole 13 is tilted with the intersection of upper surface 11 and is connected to form confined planes 14,
Confined planes 14 match with supporting surface 221, and supporting surface 221 is resisted against on confined planes 14.
In this way, confined planes 14 can allow case ring 20 to be housed in installation through-hole 13, so that electronic installation
200 it is more attractive in appearance.
In present embodiment, basic ring 21 is in the oval bodily form.Certainly, in other embodiments, basic ring 21 can be in difference
Shape, the shape such as circular or ellipse.Therefore, the example of the shape of the basic ring 21 of present embodiment is it is not intended that right
The limitation of the present invention.
In some embodiments, support division 22 includes the guide ramp 222 opposite with supporting surface 221, guide ramp 222
Connect the medial surface 212 of basic ring 21 and tilted down towards the medial surface 212 of basic ring 21.
In this way, the finger that guide ramp 222 can guide user smoothly enters in basic ring 21 to carry out fingerprint recognition operation, can
Improve the accuracy rate that user carries out fingerprint recognition operation.It is possible to further plate shinny metal level in guide ramp 222
(such as layers of chrome), so that basic ring 21 is more attractive in appearance.
It is appreciated that guide ramp 222 is ring surface, it can so facilitate user that finger is inserted into basic ring 21 from all directions
It is interior to press fingerprint identification module 30, so as to carry out fingerprint recognition operation.
In some embodiments, case ring 20 includes the support that the bottom of the medial surface 212 from basic ring 21 extends internally
Piece 23.Further, fingerprint identification module 30 is supported on support chip 23.In this way, support chip 23 can be supported and location fingerprint
Identification module 30, so as to improve the efficiency of assembling of fingerprint identification module 30 and case ring 20.
In other words, fingerprint identification module 30 is supported on support chip 23.Fingerprint identification module 30 is loaded in basic ring 21
When, fingerprint identification module 30 can be pressed from top to bottom, if the position of fingerprint identification module 30 can not be moved again, then it represents that refer to
Line identification module 30 has been resisted against on support chip 23, and is installed into precalculated position.
It is appreciated that basic ring 21 is formed with centre bore 213, support chip 23 is located in centre bore 213.Fingerprint identification module 30
It is housed in centre bore 213.Centre bore 213 can be in right cylinder shape, in other words, and the medial surface 212 of basic ring 21 is linearly, so as to
Rapidly load in fingerprint identification module 30 in centre bore 213.
The material that centre bore 213 and support chip 23 can be removed on part by way of machining is formed, can also
Formed by modes such as castings.
In order to ensure the intensity of case ring 20, it is preferred that the material of case ring 20 is metal, such as stainless steel material, from
And the intensity requirement of case ring 20 is met, also with corrosion resistance, improve the life-span of case ring 20.Certainly, case ring 20
The other materials such as plastics can be used to be made.
In some embodiments, medial surface 212 of the support chip 23 perpendicular to basic ring 21.
In this way, support chip 23 is easily formed, the manufacturing cost of basic ring 21 can be reduced.In addition, when manufacture cover plate assembly 100
When, support chip 23 is horizontally situated, and medial surface 212 is located at vertical position so that the fingerprint recognition mould coordinated with support chip 23
The face of block 30 is horizontal plane, can so simplify the structure for the fingerprint identification module 30 being supported on support chip 23.
In some embodiments, basic ring 21 includes bottom surface 214, and bottom surface 214 is connected with lateral surface 211, support chip 23
Lower surface is concordant with the bottom surface 214 of basic ring 21.
In the basic ring 21 of equal height, such as arrangement above can form larger accommodation space in basic ring 21, to ensure
Fingerprint identification module 30 can be housed in basic ring 21.
In other words, in the case where the thickness of fingerprint identification module 30 is constant, the height of basic ring 21 is smaller, so as to drop
The thickness of low cover plate assembly 100, and then offer design basis can be thinned for the thickness of electronic installation 200.
Fig. 7 and Fig. 8 is referred to, in some embodiments, support chip 23 is formed with to be connected with the centre bore 213 of basic ring 21
Avoidance hole 231.
Incorporated by reference to Fig. 5 and Fig. 6, in this way, avoiding the flexible PCB 60 that hole 231 is conducive to being connected with fingerprint identification module 30
Cabling layout.For example, flexible PCB 60 can be connected through hole 231 is avoided with fingerprint identification module 30.
In some embodiments, the rounded rectangle in hole 231 is avoided, the long side wall for avoiding hole 231 is offered and avoided
The escape groove 232 that hole 231 is connected, escape groove 232 extends along the length direction for avoiding hole 231.
For example shown in Fig. 6, after flexible PCB 60 is connected with fingerprint identification module 30, first prolong to the direction of escape groove 232
Stretch, then bend roundabout.Therefore, escape groove 232 can prevent flexible PCB 60 from being interfered with avoiding the side wall in hole 231,
Flexible PCB 60 is conducive to connect up.
Referring to Fig. 5, in some embodiments, fingerprint identification module 30 is housed in case ring 20, and with dress
Decorative circle 20 is fixedly connected.For example, together with fingerprint identification module 30 is adhesively fixed with case ring 20 by colloid.Fingerprint recognition mould
Block 30 includes packaging body 31 and fingerprint recognition chip 32.
Specifically, when user carries out the operation of unlocked by fingerprint electronic installation 200, finger can be placed on and fingerprint recognition core
The corresponding position of piece 32.The signal of fingerprint recognition chip 32, to gather the fingerprint pattern of identification user, will be used through packaging body 31
The fingerprint pattern at family is matched with the fingerprint pattern prestored, if the match is successful, unlocks electronic installation 200.
It is appreciated that the surface of fingerprint recognition chip 32 towards the finger of user is provided with sensor pixel array, to gather
The fingerprint pattern of user.The encapsulation fingerprint recognition of packaging body 31 chip 32 can reduce sensor pixel array when gathering fingerprint pattern
Influenceed by other interference signals, to improve the accuracy rate of identification.
In some embodiments, the top surface of fingerprint identification module 30 is provided with cover plate 33.For example, cover plate 33 passes through
Colloid is fixed on the top surface of fingerprint identification module 30.
User is when carrying out fingerprint recognition operation, and finger can be pressed against in cover plate 33.Cover plate 33 can be with tamper seal
Body 31 is filled without damage, to improve the reliability of fingerprint identification module 30.
Cover plate 33 due to be often subject to touching, therefore, the material that cover plate 33 can be used hardness higher is made, for example with
On the sapphire material that refers to.
In some embodiments, the shape of the top surface of the form and dimension of cover plate 33 and fingerprint identification module 30 and big
It is small to coordinate.
For example, the shape of the top surface of fingerprint identification module 30 is in Long Circle, the shape of cover plate 33 is also in Long Circle.Covering
Area of the area of plate 33 slightly larger than the top surface of fingerprint identification module 30.Therefore, fingerprint recognition can be completely covered in cover plate 33
Module 30.
Fig. 3 and Fig. 5 is referred to, in some embodiments, the periphery of carrying tablet 40 including self installation through hole 13 is to installation
The supporting part 41 of the center extension of through hole 13, case ring 20 is arranged in installation through-hole 13 and is fixedly connected with supporting part 41.Example
Such as, case ring 20 is fixedly connected with supporting part 41 by bonding mode.And for example, case ring 20 passes through welding with supporting part 41
Mode is fixedly connected.
In this way, because carrying tablet 40 is fixedly connected with cover plate 10, and case ring 20 is fixedly connected with carrying tablet 40, so that
It can prevent case ring 20 from being moved relative to cover plate 10, be conducive to user to press the fingerprint identification module 30 in case ring 20 to enter
Row fingerprint recognition is operated.
In some embodiments, carrying tablet 40 includes the fixed part 42 for being fixed on the lower surface 12 of cover plate 10, fixed part
42 are fixedly connected with supporting part 41.
In other words, the periphery of installation through-hole 13 is first extended to outside the periphery of the self installation through hole 13 of carrying tablet 40, then from peace
The periphery for filling through hole 13 extends to the center of installation through-hole 13.
The lower surface 12 that carrying tablet 40 is fixed on cover plate 10 is conducive to carrying tablet 40 to be fixedly connected with cover plate 10, for example, holding
Slide glass 40 can be fixed on the lower surface 12 of cover plate 10 by way of bonding.
In some embodiments, the fixed part 42 of carrying tablet 40 is set around installation through-hole 13, and supporting part 41 is around installation
The circumferentially extending of through hole 13.In this way, the area that supporting part 41 is contacted with case ring 20 is larger, be conducive to the stable twelve Earthly Branches of case ring 20
Support is on supporting part 41.
In some embodiments, supporting part 41 forms the projection 43 that oriented case ring 20 protrudes, and case ring 20 is resisted against
In projection 43.
In this way, projection 43 can increase the intensity of supporting part 41, when pressing fingerprint identification module 30, supporting part 41 is difficult
Deformation.In one example, carrying tablet 40 is made up of sheet metal, and projection 43 is the die mould of carrying tablet 40.It is convex in present embodiment
Play 43 and be scattered in multiple raised 43 around the circumferentially-spaced of supporting part 41, for example in fig .9, projection 43 is spaced apart into 2 projections
43。
Fig. 3 and Fig. 6 is referred to, in some embodiments, supporting part 41 is formed with perforation 411, and cover plate assembly 100 includes
Card 70, the bending of card 70 is formed with bayonet socket 71, and card 70 is fixedly connected with case ring 20, and passes through from the edge of perforation 411
The clamp standoff portion 41 of bayonet socket 71, is moved with limiting case ring 20 relative to carrying tablet 40.
In this way, card 70 can prevent case ring 20 from moving, fingerprint identification module 30 is conducive to carry out fingerprint recognition.
In present embodiment, the quantity of card 70 is two, and two cards 70 are clamped in the length direction of perforation 411 respectively
Two ends.It is appreciated that in other embodiments, the quantity and clip position of card 70 can it is specific according to actual conditions and
It is fixed.
In one example, when assembling cover plate assembly 100, carrying tablet 40 can be first fixed on to the lower surface of cover plate 10
12, then the case ring 20 for the card 70 being fixed with before non-doubling is fitted into installation through-hole 13, and make card 70 through perforation
411, by the doubling of card 70 after case ring 20 is supported on supporting part 41, so that the formation bayonet socket 71 of card 70 and clamp standoff
Fingerprint identification module 30, is finally arranged in the basic ring 21 of case ring 20 by portion 41.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Specific features, structure, material or feature are contained at least one embodiment of the present invention or example.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Levy, structure, material or feature can in an appropriate manner be combined in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
These embodiments can be carried out with a variety of changes, modification in the case of not departing from the principle and objective of the present invention, replace and become
Type, the scope of the present invention is limited by claim and its equivalent.
Claims (13)
1. one kind decoration coil structures, it is characterised in that including：
Case ring；With
Around the waterproof seal being circumferentially provided on the lateral surface of the case ring of the case ring, the waterproof seal
It is structure as a whole with the case ring.
2. coil structures are decorated as claimed in claim 1, it is characterised in that the lateral surface is formed with the week along the case ring
To the groove of extension, the waterproof seal is partly housed in the groove.
3. coil structures are decorated as claimed in claim 1, it is characterised in that the case ring includes：
Basic ring, the basic ring includes the lateral surface；And
The support division stretched out from the top of the basic ring, the support division includes and supporting that the lateral surface of the basic ring is connected
Hold face, the angle of the supporting surface and the lateral surface is right angle or obtuse angle, and the supporting surface is used to be resisted against electronic installation
On cover plate, moved down with limiting the case ring relative to the cover plate.
4. coil structures are decorated as claimed in claim 3, it is characterised in that the support division includes opposite with the supporting surface
Guide ramp, the guide ramp connects the medial surface of the basic ring and tilted down towards the medial surface of the basic ring.
5. coil structures are decorated as claimed in claim 3, it is characterised in that the case ring includes the medial surface from the basic ring
The support chip that extends internally of bottom.
6. coil structures are decorated as claimed in claim 5, it is characterised in that the support chip is perpendicular to the inner side of the basic ring
Face.
7. coil structures are decorated as claimed in claim 5, it is characterised in that the basic ring includes the bottom being connected with the lateral surface
Face, the lower surface of the support chip is concordant with the bottom surface.
8. coil structures are decorated as claimed in claim 1, it is characterised in that the waterproof seal includes silica gel waterproof sealing
Part.
9. a kind of cover plate assembly, it is characterised in that including：
Cover plate, the cover plate offers installation through-hole；With
Decoration coil structures described in claim 1-8 any one, the case ring structure setting is in the installation through-hole, institute
State the gap between the waterproof seal sealing lateral surface and the medial surface of the installation through-hole.
10. cover plate assembly as claimed in claim 9, it is characterised in that the cover plate assembly includes being arranged on the case ring
In fingerprint identification module.
11. a kind of electronic installation, it is characterised in that including the cover plate assembly described in claim 9 or 10.
12. a kind of preparation method for decorating coil structures, it is characterised in that including step：
One case ring is provided；
Liquid repellent glue is set on the lateral surface of the case ring, and the liquid repellent glue is surrounded the case ring；With
Solidify the liquid repellent glue to form the waterproof seal being structure as a whole with the case ring, so as to obtain the dress
Decorative circle structure.
13. the preparation method of coil structures is decorated as claimed in claim 12, it is characterised in that the setting liquid repellent glue
The step of step and the solidification liquid repellent glue, is carried out in mould.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710382341.3A CN107018216A (en) | 2017-05-26 | 2017-05-26 | Decorate coil structures and preparation method thereof, cover plate assembly and electronic installation |
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| CN201710382341.3A CN107018216A (en) | 2017-05-26 | 2017-05-26 | Decorate coil structures and preparation method thereof, cover plate assembly and electronic installation |
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| CN107018216A true CN107018216A (en) | 2017-08-04 |
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| CN201710382341.3A Pending CN107018216A (en) | 2017-05-26 | 2017-05-26 | Decorate coil structures and preparation method thereof, cover plate assembly and electronic installation |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107547708A (en) * | 2017-09-26 | 2018-01-05 | 广东欧珀移动通信有限公司 | Cover plate assembly, housing unit and mobile terminal |
| CN108433632A (en) * | 2018-03-13 | 2018-08-24 | 小狗电器互联网科技（北京）股份有限公司 | The frame structure and hand-held cleaners of hand-held cleaners |
| CN108596072A (en) * | 2018-04-17 | 2018-09-28 | Oppo广东移动通信有限公司 | Electronic device and its fingerprint recognition module |
| CN110416697A (en) * | 2018-04-28 | 2019-11-05 | Oppo广东移动通信有限公司 | The control method of electronic device and electronic device |
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| CN205318405U (en) * | 2015-11-20 | 2016-06-15 | 维沃移动通信有限公司 | Fingerprint identification module and terminal equipment |
| CN205485758U (en) * | 2016-02-26 | 2016-08-17 | 联想(北京)有限公司 | Electronic equipment |
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| CN105512652A (en) * | 2016-01-26 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile terminal and fingerprint recognizing and sensing device |
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| CN107547708A (en) * | 2017-09-26 | 2018-01-05 | 广东欧珀移动通信有限公司 | Cover plate assembly, housing unit and mobile terminal |
| CN108433632A (en) * | 2018-03-13 | 2018-08-24 | 小狗电器互联网科技（北京）股份有限公司 | The frame structure and hand-held cleaners of hand-held cleaners |
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| CN110416697A (en) * | 2018-04-28 | 2019-11-05 | Oppo广东移动通信有限公司 | The control method of electronic device and electronic device |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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Application publication date: 20170804 |