CN107017329A - QFN surface-adhered types RGB LED package supports and its manufacture method - Google Patents
QFN surface-adhered types RGB LED package supports and its manufacture method Download PDFInfo
- Publication number
- CN107017329A CN107017329A CN201710194336.XA CN201710194336A CN107017329A CN 107017329 A CN107017329 A CN 107017329A CN 201710194336 A CN201710194336 A CN 201710194336A CN 107017329 A CN107017329 A CN 107017329A
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- Prior art keywords
- base plate
- metal base
- led package
- package supports
- adhered
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 77
- 239000002184 metal Substances 0.000 claims abstract description 77
- 239000003292 glue Substances 0.000 claims abstract description 9
- 238000003466 welding Methods 0.000 claims description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 238000010276 construction Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 230000032683 aging Effects 0.000 claims description 3
- 239000012141 concentrate Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- WBLJAACUUGHPMU-UHFFFAOYSA-N copper platinum Chemical compound [Cu].[Pt] WBLJAACUUGHPMU-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- -1 is not protected Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H01L33/62—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H01L33/48—
-
- H01L33/647—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a kind of QFN surface-adhered types RGB LED package supports, including metal base plate and Insulating frame, the metal base plate front is provided with luminous zone, described light divides into four regions, it is connected between the region by Insulating frame, the Insulating frame forms bowl in metal base plate front, and the metal base plate reverse side is provided with the pad for being used for being connected with external circuit.Present invention also offers the manufacture method of the package support, metal base plate is made into conducting wire, pad is made at the metal base plate back side, front and/or reverse side make step, glue is wrapped on the metal base plate, the metal electrode of die bond and bonding wire is reserved, the Insulating frame with bowl shape is formed.The present invention concentrates light by bowl structure, makes light-emitting area unique, and then make the display resolution made more excellent；By making step on metal base plate, it is ensured that the compactness and the stability of package support combined with Insulating frame.
Description
Technical field
The present invention relates to SMD（Surface Mounted Devices, surface mount device）LED encapsulation technologies, it is special
It is not to be related to QFN（Quad Flat No-leadPackage, quad flat non-pin package）Surface-adhered type RGB LED are encapsulated
Support and its manufacture method.
Background technology
As display screen industry is continued to develop, display screen is with LED by original DIP（dual inline-pin
Package, dual-inline package technology）Structure high-speed changes to SMD structures, and the LED of SMD structures has lightweight, individual
It is smaller, be increasingly accepted the advantages of automation is installed, lighting angle is big, color is uniform, decay is few, although typically SMD
LED has an above advantage, but there are that larger, the thermally conductive pathways length of decay, carrying electric current be low, production is complicated, and reliability is low,
Humidity resistance is low, and against weather is poor；If in the case where not changing the overall structure of product, to improve the reliability of product,
So far in the industry cycle still without preferable solution.
In existing SMD RGB LED manufactures, using the product of PLCC4 structures（Such as 3528,2121,1010 etc.
Specification）, but said structure is all by the way of common：PPA+ copper or iron pin（As shown in Figure 1）, or the plating of PCB+ copper platinum
Mode（As shown in Figure 2）.The product of this two kinds of modes has inborn deficiency, as PPA+ metal pins modes, is by injection
Thermoplastic 701 is adjacent to by machine with metal 702, is not stained with and is connected together, when expanding with heat and contract with cold, and is easily produced between them
Raw gap, when End-Customer, extraneous water and steam enters in packaging body easily by gap when in use, so as to cause product
Failure；And PCB schemes are mainly used in small spacing, it also has its inborn deficiency, and it is by glass by using resin 801 first
Compacting is surrounded, is then formed by being stained with copper platinum circuit etching, the gap of material and hydroscopicity are all very high, and this multiple material
Expansion rate it is different, and the later stage is molded one layer of flat glue 802 as protective layer again in the plane, and this mode has no idea to be formed
The protection of one cup, can have problems with：First, light is scattered very serious, causes test data consistent toward very poor, light it is uniform
Property is very poor；2nd, mechanical strength is very poor, as long as there is external force effect, sealer, which is easy to take off, causes LED failure；3rd, because
It is to be stained with conjunction by two layers, edge is not protected, water and steam are easy to, by between the two entering between lamp body, cause
Product failure；4th, circuit is to be used for conductive and radiating by electroplating the very thin metal of last layer, is radiated poor.
Therefore, prior art has yet to be improved and developed.
The content of the invention
It is an object of the invention to provide a kind of QFN surface-adhered types RGB LED package supports and its manufacture method, it is intended to
The problems such as solving existing SMD RGB LED lights scattered seriously, packaging machinery intensity difference, poor sealing, weak heat-dissipating.
To solve the above problems, technical scheme is as follows：
A kind of QFN surface-adhered types RGB LED package supports, including metal base plate and Insulating frame, the metal base plate front
Provided with luminous zone, described light divides into four regions, for die bond bonding wire, is connected between the region by Insulating frame, institute
State Insulating frame and form bowl in metal base plate front, the metal base plate reverse side, which is provided with, is used for what is be connected with external circuit
Pad.
Described QFN surface-adhered type RGB LED package supports, wherein, the metal base plate front and/or reverse side are set
There is step, for strengthening the stability that the metal base plate is combined with Insulating frame.
Described QFN surface-adhered type RGB LED package supports, wherein, four regions of the luminous zone, which are divided into, to be located at
Middle " L " shape or the chip weld zone of inverted "L" shaped and the first bonding wire for being located at the upper left corner, the upper right corner and the lower right corner respectively
Area, the second wire welding area and the 3rd wire welding area.
Described QFN surface-adhered type RGB LED package supports, wherein, the metal base plate is provided with multiple luminous zones,
The Insulating frame forms the bowl of respective amount on the luminous zone.
Described QFN surface-adhered type RGB LED package supports, wherein, the quantity of the luminous zone is 2-100.
Described QFN surface-adhered type RGB LED package supports, wherein, it is additionally provided with the metal base plate and the weldering
Disk highly concordant supporting construction.
Described QFN surface-adhered type RGB LED package supports, wherein, the metal base plate is copper coin or iron plate, surface
It is silver-plated or gold-plated.
A kind of manufacture method of such as above-mentioned QFN surface-adhered types RGB LED package supports, comprises the following steps：
Step 1：Metal base plate is made into conducting wire, pad is made at the metal base plate back side, front and/or reverse side make
Step；
Step 2：The supporting construction concordant with pad height is made at the back side of the metal base plate；
Step 3：Glue is wrapped on the metal base plate, the metal electrode of die bond and bonding wire is reserved, is formed with bowl shape
Insulating frame.
The manufacture method of described QFN surface-adhered type RGB LED package supports, wherein, in addition to step 4：Described
Metal is plated on metal electrode.
The manufacture method of described QFN surface-adhered type RGB LED package supports, wherein, in addition to step 5：Dried
Roasting aging, baking temperature is 100-300 degrees Celsius.
Beneficial effects of the present invention include：QFN surface-adhered types RGB LED package supports and its manufacture that the present invention is provided
Method, the mode of existing plating thin metal is replaced by using metal base plate, electric conductivity is enhanced, straight by metal base plate
Connect and contacted with pcb board, heat dissipation path is shorter, chip heat can be exported quickly；The structure of bowl is formed by front, light is concentrated
Line, makes light-emitting area unique, and then makes display resolution, the bright dark contrast made etc. more excellent；By being made on metal base plate
Make step, it is ensured that the compactness and the stability of package support combined with Insulating frame；Multiple luminescence units are integrated in one
On package support, production efficiency is further increased, production cost is reduced.
Brief description of the drawings
The structural representation of the existing PPA supports of Fig. 1.
The structural representation of the existing CHIP type packages supports of Fig. 2.
A kind of profile for QFN surface-adhered types RGB LED package supports that Fig. 3 provides for the present invention.
A kind of front elevation for QFN surface-adhered types RGB LED package supports that Fig. 4 provides for the present invention.
A kind of back view for QFN surface-adhered types RGB LED package supports that Fig. 5 provides for the present invention.
The profile for another QFN surface-adhered types RGB LED package supports that Fig. 6 provides for the present invention.
The front elevation for another QFN surface-adhered types RGB LED package supports that Fig. 7 provides for the present invention.
The back view for another QFN surface-adhered types RGB LED package supports that Fig. 8 provides for the present invention.
A kind of manufacturing flow chart for QFN surface-adhered types RGB LED package supports that Fig. 9 provides for the present invention.
Description of reference numerals：101st, bowl；102nd, metal base plate；103rd, pad；104th, Insulating frame；105th, step；
106th, supporting construction；107th, the first wire welding area；108th, the second wire welding area；109th, the 3rd wire welding area；110 chip weld zones；701、
Thermoplastic；702nd, metal；801st, resin；802nd, flat glue.
Embodiment
To make the objects, technical solutions and advantages of the present invention clearer, clear and definite, develop simultaneously embodiment pair referring to the drawings
The present invention is further described.
Fig. 1 is the structural representation of the package support of existing PPA+ copper pin, because the package support of the type passes through
Thermoplastic is adjacent to by injection machine with metal, is not stained with and is connected together, when expanding with heat and contract with cold, and is easily produced between them
Gap, when End-Customer, extraneous water and steam enters in packaging body easily by gap when in use, so as to cause product to lose
Effect.Fig. 2 is the structural representation of existing CHIP type packages support, surrounds glass by using resin 801 and is compacted, then passes through
It is stained with copper platinum circuit etching to form, the gap of material and hydroscopicity are all very high, and the expansion rate of this multiple material is different, and
Later stage is molded one layer of flat glue 802 as protective layer again in the plane, and this mode has no idea to form the protection of a cup, will
There are problems.
Referring to Fig. 3 to Fig. 5, a kind of QFN surface-adhered types RGB LED package supports provided for the present invention, including metal
Bottom plate 102 and Insulating frame 104, the material of metal base plate 102 can be copper or iron etc., electroplate or gold-plated.Insulating frame
104, which are preferably used thermosets, is made, further, and its material can be the materials such as epoxy resin, PPA, PCT, at this
It is epoxy resin in embodiment.The front of metal base plate 102 is provided with luminous zone, and described light divides into four regions, for die bond
It is connected between bonding wire, the region by Insulating frame 104, Insulating frame 104 forms bowl 101, bowl in the front of metal base plate 102
Light is focused on front by the setting of cup 101, it is ensured that light-emitting area is unique, and then improves the resolution for the display screen thus made
Rate, its bright dark contrast etc. is more excellent.In actual applications, the metal base plate fixed LED chip in bowl 101 using crystal-bonding adhesive
On 102, the translucent epoxy glue with diffusant is used to be encapsulated in bowl 101 chip and key and line after bonding wire
It is interior.Because glue and the adhesion of bowl 101 are good, water and steam is more difficult penetrates into inside bowl improves the LED use longevity
Life.The pad 103 for being used for being connected with external circuit is provided with the reverse side of metal base plate 102, in actual applications, pad will be passed through
103 directly contact connection with pcb board, and by way of this metal base plate 102 is directly contacted with pcb board, heat dissipation path is shorter,
Chip heat can be exported quickly.
In actual applications, the front of metal base plate 102 and/or reverse side are provided with step 105, for strengthening the metal bottom
Compactness and stability that plate 102 is combined with Insulating frame 104, prevent the entrance of water and steam, while further enhancing branch
The mechanical strength of frame.Preferably, the tow sides of metal base plate 102 are provided with step 105.
Referring to Fig. 4, four regions of the luminous zone be divided into positioned at the chip weld zone 110 of middle inverted "L" shaped and
It is located at the upper left corner, first wire welding area 107 in the upper right corner and the lower right corner, the second wire welding area 108 and the 3rd wire welding area 109 respectively.
In actual applications, red, green, blue LED chip is fixed on chip weld zone 110 using crystal-bonding adhesive, the first wire welding area 107,
Second wire welding area 108 and the 3rd wire welding area 109 are connected as stent electrode by key and line with the chip.Preferably,
One wire welding area 107 is used as public polar region.
Referring to Fig. 5, it is additionally provided with the reverse side of metal base plate 102 and the highly concordant supporting construction 106 of pad 103.Support knot
The setting of structure 106 can ensure the planarization of metal base plate 102 in support manufacturing process.Preferably, supporting construction 106 can be
Circular, square or irregular shape Support or support column.
In actual applications, to improve production efficiency, production technology is simplified, reducing can on production cost, metal base plate 102
So that provided with multiple luminous zones, Insulating frame 104 forms the bowl 101 of respective amount on the luminous zone.Preferably, the hair
The quantity in light area is 2-100.Existing package support is generally single form（As depicted in figs. 1 and 2）, in practical application by
In enormous amount, low production efficiency, easily there is quality problem.And the present invention on metal base plate 102 by that will set multiple
Luminous zone, multiple luminescence units are integrated on a packaging body, production efficiency is drastically increased.
Referring to Fig. 6 to Fig. 8, another embodiment provided for the present invention.4 are provided with metal base plate 102 to light
It is provided with area, the luminous zone in bowl 101, each luminous zone and configures one group of RGB chips formation illuminator, Mei Gefa
Body of light is by the effect of bowl 101, and light-emitting area is unique, is unaffected each other, improves the resolution ratio of LED display
And contrast.
Referring to Fig. 9, present invention also offers a kind of manufacturer such as above-mentioned QFN surface-adhered types RGB LED package supports
Method, comprises the following steps：
Step 1：Metal base plate 102 is made into conducting wire by way of etching or punching press, made at the back side of metal base plate 102
Pad 103, obverse and reverse makes step 105, in actual production, to improve production efficiency, disposably produces multiple encapsulation
Support, can be processed to one piece big metallic plate, while etching multiple metal base plates 102, and be cut in subsequent handling；
Step 2：Made at the back side of metal base plate 102 by way of etching or punching press and the highly concordant support of pad 103
Structure 106, it is ensured that the planarization being subsequently molded, to ensure swelling stress release of the metal base plate 102 under subsequent high temperature, with list
Individual metal base plate 102 is unit, and release hollow out is made on each unit periphery, and takes datum line as follow-up cutting around
The datum line of process；
Step 3：Glue is wrapped on metal base plate 102 by moulding press, the metal electrode of die bond and bonding wire is reserved, formation has
The Insulating frame 104 of bowl shape, it is preferable that wrapped up using epoxide-resin glue.
In actual production, formed after package support, metal can plated by plating or depositional mode, be conducive to follow-up
Weld, it is conductive and reflective.
Baking aging is carried out to the package support, it is further stablized, baking temperature is 100-300 degrees Celsius, then
Single led product is cut into by cutting machine.
By the present invention in that replacing the mode of existing plating thin metal with metal base plate, electric conductivity is enhanced, is passed through
Metal base plate is directly contacted with pcb board, and heat dissipation path is shorter, and chip heat can be exported quickly；Bowl is formed by front
Structure, concentrates light, makes light-emitting area unique, and then makes display resolution, the bright dark contrast made etc. more excellent；By in gold
Step is made on category bottom plate, it is ensured that the compactness and the stability of package support combined with Insulating frame；By multiple luminescence units
It is integrated on a package support, further increases production efficiency, reduces production cost.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (10)
1. a kind of QFN surface-adhered types RGB-LED package supports, it is characterised in that described including metal base plate and Insulating frame
Metal base plate front is provided with luminous zone, it is described it is luminous divide into four regions, for die bond bonding wire, by insulating between the region
Framework be connected, the Insulating frame the metal base plate front formed bowl, the metal base plate reverse side be provided be used for it is outer
The pad of portion's circuit connection.
2. QFN surface-adhered types RGB-LED package supports according to claim 1, it is characterised in that the metal base plate
Front and/or reverse side are provided with step.
3. QFN surface-adhered types RGB-LED package supports according to claim 1, it is characterised in that the luminous zone
Four regions are divided into positioned at the chip weld zone of middle " L " shape or inverted "L" shaped and are located at the upper left corner, the upper right corner and the right side respectively
The first wire welding area, the second wire welding area and the 3rd wire welding area of inferior horn.
4. QFN surface-adhered types RGB-LED package supports according to claim 1, it is characterised in that the metal base plate
Multiple luminous zones are provided with, the Insulating frame forms the bowl of respective amount on the luminous zone.
5. QFN surface-adhered types RGB-LED package supports according to claim 4, it is characterised in that the luminous zone
Quantity is 2-100.
6. QFN surface-adhered types RGB-LED package supports according to claim 1, it is characterised in that the metal base plate
On be additionally provided with the supporting construction concordant with the pad height.
7. QFN surface-adhered types RGB-LED package supports according to claim 1, it is characterised in that the metal base plate
For copper coin or iron plate, electroplate or gold-plated.
8. a kind of manufacture method of QFN surface-adhered type RGB-LED package supports as described in claim 1-7, its feature exists
In comprising the following steps：
Step 1：Metal base plate is made into conducting wire, pad is made at the metal base plate back side, front and/or reverse side make
Step；
Step 2：The supporting construction concordant with pad height is made at the back side of the metal base plate；
Step 3：Glue is wrapped on the metal base plate, the metal electrode of die bond and bonding wire is reserved, is formed with bowl shape
Insulating frame.
9. the manufacture method of QFN surface-adhered types RGB-LED package supports according to claim 8, it is characterised in that also
Including step 4：By plating metal on the metal electrode.
10. the manufacture method of QFN surface-adhered types RGB-LED package supports according to claim 8, it is characterised in that
Also include step 5：Baking aging is carried out, baking temperature is 100-300 degrees Celsius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710194336.XA CN107017329A (en) | 2017-03-28 | 2017-03-28 | QFN surface-adhered types RGB LED package supports and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710194336.XA CN107017329A (en) | 2017-03-28 | 2017-03-28 | QFN surface-adhered types RGB LED package supports and its manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107017329A true CN107017329A (en) | 2017-08-04 |
Family
ID=59445536
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710194336.XA Pending CN107017329A (en) | 2017-03-28 | 2017-03-28 | QFN surface-adhered types RGB LED package supports and its manufacture method |
Country Status (1)
| Country | Link |
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| CN (1) | CN107017329A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204289443U (en) * | 2014-12-25 | 2015-04-22 | 深圳市安普光光电科技有限公司 | Disjunctor full-color light-emitting diode and LED show module |
| US20150349224A1 (en) * | 2014-05-29 | 2015-12-03 | Nichia Corporation | Light emitting device |
| CN206340574U (en) * | 2017-03-28 | 2017-07-18 | 山东晶泰星光电科技有限公司 | A kind of QFN surface-adhered types RGB LED package supports |
-
2017
- 2017-03-28 CN CN201710194336.XA patent/CN107017329A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150349224A1 (en) * | 2014-05-29 | 2015-12-03 | Nichia Corporation | Light emitting device |
| CN204289443U (en) * | 2014-12-25 | 2015-04-22 | 深圳市安普光光电科技有限公司 | Disjunctor full-color light-emitting diode and LED show module |
| CN206340574U (en) * | 2017-03-28 | 2017-07-18 | 山东晶泰星光电科技有限公司 | A kind of QFN surface-adhered types RGB LED package supports |
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