CN106993373A - Circuit board assemblies - Google Patents
Circuit board assemblies Download PDFInfo
- Publication number
- CN106993373A CN106993373A CN201710335790.2A CN201710335790A CN106993373A CN 106993373 A CN106993373 A CN 106993373A CN 201710335790 A CN201710335790 A CN 201710335790A CN 106993373 A CN106993373 A CN 106993373A
- Authority
- CN
- China
- Prior art keywords
- pad
- circuit board
- board assemblies
- weld part
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000712 assembly Effects 0.000 title claims abstract description 26
- 238000000429 assembly Methods 0.000 title claims abstract description 26
- 239000004020 conductor Substances 0.000 claims abstract description 39
- 238000003466 welding Methods 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 230000004888 barrier function Effects 0.000 claims description 11
- 241001442589 Convoluta Species 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 230000015556 catabolic process Effects 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910001385 heavy metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0221—Laser welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A kind of circuit board assemblies, including：One circuit board, with circuit board described in a upper surface there is one first pad to be revealed in the upper surface, one second pad has a relative bottom surface and a top surface, wherein, the bottom surface first pad in electrical contact, a conductor, with a weld part, the weld part laser welding, by presetting second pad on first pad, makes first pad will not be by laser breakdown in the top surface.
Description
Technical field
The present invention relates to a kind of circuit board assemblies, espespecially a kind of circuit board assemblies being considerably inhibited.
Background technology
The pad of circuit board is generally formed by thickness for 0.5 ounce or 1 ounce of copper foil etching, is added using thicker copper foil
Work can increase etching cost into pad, production efficiency be reduced, while also resulting in the increase of heavy metal discarded object；However, using
The pad of 0.5 ounce or 1 ounce of copper foil etching, due to its thinner thickness, by itself and a butting conductors --- such as
Terminal or cable --- when laser welding, pad causes welding to fail easily by laser breakdown, or even to board structure of circuit
Do great damage.
The present invention, there is provided a kind of new circuit board assemblies, uses new methods and techniques means to solve for problem above
Certainly these problems.
The content of the invention
For background technology problem encountered, the purpose that the present invention is created is to provide a kind of welding in original pad
One pad is set in addition on face, in circuit board and butting conductors laser welding, the circuit board group that original pad will not be breakdown
Part.
To achieve the above object, the present invention uses following technological means：
The present invention provides a kind of circuit board assemblies, and it includes a circuit board, with a upper surface, including：One first pad, appears
In the upper surface；One second pad, second pad has a relative bottom surface and a top surface, wherein, the bottom surface electricity
Property contact first pad；One conductor, with a weld part, the weld part laser welding is in the top surface.
Further, the weld part has a laser welding area positioned at the surface of first pad.
Further, second pad is welded in first pad.
Further, the thickness of second pad is more than or equal to the thickness of first pad.
Further, the length of second pad is less than or equal to the length of first pad, the width of second pad
Width of the degree less than or equal to first pad.
Further, the circuit board has a lower surface and is revealed in one the 3rd pad of the lower surface, one the 4th pad
Piece correspondence is in electrical contact with the 3rd pad.
Further, the quantity of second pad is multiple and is arranged in a row, the 4th pad and second pad
It is oppositely arranged, the conductor is a conductor wire core, the conductor wire core is divided into two rows correspondence and second pad and institute
State the 4th pad laser welding.
Further, the conductor is a conductor wire core, and an insulating barrier is coated on outside the conductor wire core, a screen layer, bag
It is overlying on outside the insulating barrier, the screen layer includes multiple continuous curled portions, wherein, each curled portion winding is described absolutely
Edge layer one is enclosed, each curled portion have close to one first of the conductor wire core, 1 away from the conductor wire core the
Two and a connecting portion of connection described first and described second, one first breach are recessed in outside described first
Side, one second breach is recessed in the inner side of described second, wherein, the first position is in previous second breach, together
When, the previous second position is in first breach so that previous described first of second contact.
Further, the conductor is a conductor wire core, and the weld part has one first plane and second pad electricity
Property contact, the weld part has one second plane, and a laser welding area is located at second plane, and laser irradiates the laser
Weld zone, makes the weld part be welded and fixed with second pad.
Further, first pad and second pad are copper foil.
Further, the thickness of second pad is more than or equal to 0.5 ounce.
Compared with prior art, the invention has the advantages that：
The circuit board assemblies of the present invention, the top surface of the first pad sets one second pad, and only the first pad is thickeied, it is to avoid
The copper foil thickeied by monoblock etches to thicken the first pad, reduces processing cost, improves production efficiency, reduces heavy metal and discards
Thing, improves stock utilization；One conductor Laser is welded in the second pad, because the thickness of the second pad can be according to laser beam
Power is artificially adjusted, it is to avoid the first pad or the second pad realize the laser welding of circuit board and conductor by laser breakdown.
【Brief description of the drawings】
Fig. 1 is the part isometric decomposing schematic representation of circuit board assemblies of the present invention；
Fig. 2 is the sectional view in Fig. 1 along A-A directions；
Fig. 3 is the partial top view of circuit board assemblies of the present invention；
Fig. 4 is the sectional view in Fig. 3 along B-B directions.
The pad 13 of 100 circuit board of circuit board assemblies, 1 upper surface, 11 lower surface 12 first
The pad 16 of second pad, 14 bottom surface, 141 the 3rd pad 15 of top surface 142 the 4th
The laser welding area 2121 of 2 weld part of conductor, 21 first 211 second plane of plane 212
3 screen layer of insulating barrier, 4 curled portion 41 first 411 second 412
The laser L of 413 first 414 second breach of breach of connecting portion 415
【Embodiment】
As depicted in figs. 1 and 2, circuit board assemblies 100 of the present invention include：One circuit board 1, with a upper surface 11, the circuit
There is plate 1 one first pad 13 to be revealed in the upper surface 11, and one second pad 14 has a relative bottom surface 141 and a top surface
142, wherein, first pad 13 in electrical contact of bottom surface 141, a conductor 2, with a weld part 21, the weld part
21 laser weldings are in the top surface 142.
As shown in Figure 1 to Figure 3, first pad 13 and second pad 14 are copper foil, and second pad 14 is welded
First pad 13 is connected to, the mode of prioritizing selection is to add solder between（It is not shown）Afterwards, using SMT modes
Welding, due to SMT technology maturations, and will not cause to damage to the circuit board 1, be easier to realize, certainly, in other embodiments
In can also use other welding manners, even described second pad 14 and first pad 13 can use conductive material
It is mutually glued, without welding, it can be seen that, the mode in electrical contact of second pad 14 and first pad 13 is a variety of
It is various, it is not limited to this；Second pad 14 is in cuboid-type, and its thickness is more than or equal to the thickness of first pad 13,
Even if so that in the case of the very thin thickness of first pad 13, such as less than 0.5 ounce, first pad 13 and institute
The integral thickness for stating the second pad 14 can also be thicker, at least not less than 0.5 ounce, i.e., by artificially adjusting second pad
14 thickness is realized so that it is considerably inhibited and is unlikely to breakdown；The length of second pad 14 is less than or equal to
The length of first pad 13, the width of second pad 14 is less than or equal to the width of first pad 13, and this also makes
Obtain first pad 13 just to be covered or partly appeared by second pad 14, observation during the two convenient welding is fixed
Position, while also causing second pad 14 to be unlikely to protrude out first pad 13 and produce antenna effect, influences signal
Transmission quality, particularly influence high-frequency signal transmission quality, it should be noted that it is described due to the presence of fabrication error
Second pad 14 still may partly protrude out first pad 13 in error range, and this is acceptable.
As shown in Figures 2 and 3, the quantity of first pad 13 be it is multiple and be arranged in a row, it is multiple be arranged in a row the
Two pads 14 are corresponding with first pad 13, and the circuit board 1 has a lower surface 12 and is revealed in the lower surface 12
Multiple 3rd pads 15, multiple 4th pads 16 are oppositely arranged with multiple second pads 14, each 3rd pad
4th pad 16 described in 15 in electrical contact one；The conductor 2 is a conductor wire core, and the quantity of the conductor wire core is lined up to be multiple
Two rows correspondence and second pad 14 and the laser welding of the 4th pad 16.
As shown in Figure 1 to Figure 3, the weld part 21 has one first plane 211 and the top surface 142 in electrical contact, this
The contact area of the weld part 21 and second pad 14 is increased, makes the two that there is good electric property after welding,
The weld part 21 has one second plane 212, and a laser welding area 2121 is located at second plane 212 and is placed exactly in institute
The surface of the first pad 13 is stated, the laser welding area 2121 is irradiated by laser L, makes the weld part 21 and described second
Pad 14 is welded and fixed, because the surface that laser is beaten in out-of-flatness easily dissipates, and frequently results in welding failure, the second plane 212
Setting, be conducive to the focusing of laser L energy, improve the stability of laser welding.
As shown in figure 4, an insulating barrier 3 is coated on outside the conductor wire core, the weld part 21 is revealed in the insulating barrier 3
And with the laser welding of top surface 142, a screen layer 4 is coated on outside the insulating barrier 3, and the screen layer 4 includes multiple continuous
Curled portion 41, wherein, each curled portion 41 winds the circle of insulating barrier 3 one, and each curled portion 41 has close
One first 411, one second 412 away from the conductor wire core and described first 411 of connection of the conductor wire core
With a connecting portion 413 of described second 412, one first breach 414 is recessed in the outside of described first 411, and one second lacks
Mouth 415, it is recessed in the inner side of described second 412, wherein, described first 411 is located at previous second breach 415,
Meanwhile, previous described second 412 is located at first breach 414 so that previous second 412 contact described the
One 411, an insulation sleeve（Non- label）It is coated on outside the screen layer 4.
In the present embodiment, first pad 13 and second pad 14 are copper foil, be with reference to it is most of at this stage
Connector（It is not shown）Performance requirement choices made, this also causes between first pad 13 and second pad 14
It is easier to reach the requirement of the parameter designings such as impedance matching, certainly, first pad 13 and second pad 14 can also
Using other materials, especially described second pad 14 can be made of aluminium foil, silver foil even goldleaf, be come depending on different demands
Selection.
In the present embodiment, the thickness of second pad 14 is more than or equal to the thickness of first pad 13, and this is to consider
To the circuit board 1 of conventional design, its described first pad 13 is generally relatively thin, be now accomplished by by increase it is one piece thicker described in
Second pad 14 achieves the goal；But for special circumstances, such as circuit board 1 employs thicker described first at the beginning of designing
Pad 13, later stage discovery is still easily punctured by laser L, at this moment can also increase by one piece of relatively thin second pad 14 to repair
Just, at this moment the thickness of second pad 14 may also be less than the thickness of first pad 13.
Circuit board assemblies of the present invention have the advantages that：
1st, the top surface 142 of first pad 13 sets second pad 14, only first pad 13 is thickeied, phase
Etch to thicken first pad 13 for the copper foil thickeied by monoblock, reduce copper foil consumption, reduction is etched needed for copper foil
Chemical liquids consumption, reduce processing cost, improve production efficiency, reduce the growing amount of heavy metal discarded object, it is not only environmentally friendly, also
Stock utilization can be improved；By the laser welding of conductor 2 in second pad 14, due to the thickness of second pad 14
Can artificially it be adjusted according to laser L power so that first pad 13 or second pad 14 will not be punctured by laser L,
The laser welding of the circuit board 1 and the conductor 2 is realized, and ensure that the integrality of the structure of the circuit board 1.
2nd, the thickness of second pad 14 is more than or equal to the thickness of first pad 13 so that even in described first
The thickness of pad 13 is not more than in the case of 0.5 ounce, artificially adjusts the thickness of second pad 14, you can realize the circuit
The good laser weldability of plate 1 and the conductor 2.
3rd, the length of second pad 14 is less than or equal to the length of first pad 13, the width of second pad 14
Width of the degree less than or equal to first pad 13 so that the bottom surface 141 can be with firm welded in first pad 13, together
When to it also avoid second pad 14 wide and cause second pad 14 of adjacent two to be in contact and short-circuit；It is more important
Be, it is to avoid second pad 14 is long and makes its end（Non- label）Protrude out first pad 13 and produce antenna effect
Should, and then influence the signal transmission quality of the circuit board assemblies 100.
4th, second pad 14 and first pad 13 are all copper foil, improve matching degree therebetween so that institute
Circuit board assemblies 100 are stated with excellent electric property.
Detailed description above is only the explanation of the preferred embodiments of the invention, non-therefore the limitation present invention the scope of the claims,
So, all with this creation specification and diagramatic content institute, equivalence techniques changes for it, is both contained in the scope of the claims of this creation
It is interior.
Claims (11)
1. a kind of circuit board assemblies, it is characterised in that including：
One circuit board, with a upper surface, including：One first pad, is revealed in the upper surface；One second pad, described
Two pads have a relative bottom surface and a top surface, wherein, bottom surface first pad in electrical contact；
One conductor, with a weld part, the weld part laser welding is in the top surface.
2. circuit board assemblies as claimed in claim 1, it is characterised in that:There is the weld part laser welding area to be located at institute
State the surface of the first pad.
3. circuit board assemblies as claimed in claim 1, it is characterised in that:Second pad is welded in first pad.
4. circuit board assemblies as claimed in claim 1, it is characterised in that:The thickness of second pad is more than or equal to described
The thickness of first pad.
5. circuit board assemblies as claimed in claim 1, it is characterised in that:The length of second pad is less than or equal to described the
The length of one pad, the width of second pad is less than or equal to the width of first pad.
6. circuit board assemblies as claimed in claim 1, it is characterised in that:The circuit board has a lower surface and is revealed in institute
One the 3rd pad of lower surface is stated, one the 4th pad correspondence is in electrical contact with the 3rd pad.
7. circuit board assemblies as claimed in claim 6, it is characterised in that:The quantity of second pad is multiple and line up one
Row, the 4th pad is oppositely arranged with second pad, and the conductor is a conductor wire core, and the conductor wire core is divided into
Lower two rows correspondence and second pad and the 4th pad laser welding.
8. circuit board assemblies as claimed in claim 1, it is characterised in that:The conductor is a conductor wire core, an insulating barrier bag
It is overlying on outside the conductor wire core, the weld part is revealed in the insulating barrier, a screen layer is coated on outside the insulating barrier, institute
Stating screen layer includes multiple continuous curled portions, wherein, each curled portion winds the insulating barrier one and enclosed, each volume
Pars convoluta has one first close to the conductor wire core, one second away from the conductor wire core and connection described first
Portion and a connecting portion of described second, one first breach are recessed in the outside of described first, one second breach, it is recessed in
The inner side of described second, wherein, the first position in previous second breach, meanwhile, previous described second
Positioned at first breach so that previous described first of second contact.
9. circuit board assemblies as claimed in claim 1, it is characterised in that:The conductor is a conductor wire core, the weld part
In electrical contact with one first plane and second pad, the weld part has one second plane, a laser welding position
In second plane, laser irradiates the laser welding area, the weld part is welded and fixed with second pad.
10. circuit board assemblies as claimed in claim 1, it is characterised in that:First pad and second pad are copper
Paper tinsel.
11. circuit board assemblies as claimed in claim 10, it is characterised in that:The thickness of second pad is more than or equal to
0.5 ounce.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710335790.2A CN106993373B (en) | 2017-05-12 | 2017-05-12 | Circuit board assemblies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710335790.2A CN106993373B (en) | 2017-05-12 | 2017-05-12 | Circuit board assemblies |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106993373A true CN106993373A (en) | 2017-07-28 |
| CN106993373B CN106993373B (en) | 2019-07-30 |
Family
ID=59419294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710335790.2A Active CN106993373B (en) | 2017-05-12 | 2017-05-12 | Circuit board assemblies |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106993373B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201018661Y (en) * | 2007-03-07 | 2008-02-06 | 潍坊共达电讯有限公司 | PCB thickening solder pad of solder reflow resistant digitization electret microphone |
| CN102427659A (en) * | 2011-11-14 | 2012-04-25 | 李天池 | Novel solder pad structure |
| CN102623090A (en) * | 2011-01-27 | 2012-08-01 | 日立电线株式会社 | Differential signal transmission cable and method for fabricating the same |
| CN103715164A (en) * | 2012-09-29 | 2014-04-09 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and chip package structure |
| CN204179789U (en) * | 2014-11-05 | 2015-02-25 | 湘潭电机股份有限公司 | A kind of motor coil lead-in wire and cable connectors |
| CN204271304U (en) * | 2014-11-05 | 2015-04-15 | 佛山市中研非晶科技股份有限公司 | A copper foil cable connection terminal |
| CN105684222A (en) * | 2013-11-06 | 2016-06-15 | 古河电气工业株式会社 | Terminal and wire assembly |
-
2017
- 2017-05-12 CN CN201710335790.2A patent/CN106993373B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201018661Y (en) * | 2007-03-07 | 2008-02-06 | 潍坊共达电讯有限公司 | PCB thickening solder pad of solder reflow resistant digitization electret microphone |
| CN102623090A (en) * | 2011-01-27 | 2012-08-01 | 日立电线株式会社 | Differential signal transmission cable and method for fabricating the same |
| CN102427659A (en) * | 2011-11-14 | 2012-04-25 | 李天池 | Novel solder pad structure |
| CN103715164A (en) * | 2012-09-29 | 2014-04-09 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and chip package structure |
| CN105684222A (en) * | 2013-11-06 | 2016-06-15 | 古河电气工业株式会社 | Terminal and wire assembly |
| CN204179789U (en) * | 2014-11-05 | 2015-02-25 | 湘潭电机股份有限公司 | A kind of motor coil lead-in wire and cable connectors |
| CN204271304U (en) * | 2014-11-05 | 2015-04-15 | 佛山市中研非晶科技股份有限公司 | A copper foil cable connection terminal |
Non-Patent Citations (1)
| Title |
|---|
| 美国防火协会: "《NEC美国国家电气法规》", 31 March 1984 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106993373B (en) | 2019-07-30 |
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