CN106996827B - Sensing diaphragm and MEMS microphone - Google Patents
Sensing diaphragm and MEMS microphone Download PDFInfo
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- CN106996827B CN106996827B CN201710297168.7A CN201710297168A CN106996827B CN 106996827 B CN106996827 B CN 106996827B CN 201710297168 A CN201710297168 A CN 201710297168A CN 106996827 B CN106996827 B CN 106996827B
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- 238000004891 communication Methods 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a sensing diaphragm and an MEMS (micro-electromechanical systems) microphone, which comprise a sensitive part and a fixed part, wherein the sensitive part is positioned in the middle area, and the fixed part is positioned on the outer edge of the sensitive part and is integrally formed with the sensitive part; the sensing diaphragm is provided with a fixed part and a sensitive part, wherein the fixed part is fixed on the sensing diaphragm; the sensitive portion is configured to be displaced relative to the holding portion upon impact to form an airflow communication channel between the holding portion and the sensitive portion. The sensing diaphragm is different from a traditional pressure release valve structure, has small influence on the vibration characteristic of the sensitive part, and has better dynamic stability of the sensitive part.
Description
Technical Field
The invention relates to a sensing diaphragm, in particular to a vibrating diaphragm suitable for sounding; the invention also relates to a MEMS microphone.
Background
The MEMS sensing device has been widely applied to consumer electronics, and how to accelerate the production process of the MEMS sensing device is a focus of attention of the supplier of the component, for example, dust generated during the assembly process of the mobile phone is directly cleaned by an air gun, which is the current solution with the lowest cost. Therefore, an anti-blowing improvement scheme with high sound pressure or atmospheric pressure must be provided for the MEMS sensor, and the microphone is prevented from cracking and failing due to air gun cleaning in the assembling process.
For example, in the field of microphones, a current improvement is to provide a pressure relief hole or a pressure relief valve structure on a diaphragm of a MEMS microphone. But the structure of the pressure relief hole can reduce the effective area of the diaphragm; the relief valve structure that sets up on the vibrating diaphragm can directly influence the vibration characteristic of vibrating diaphragm, especially influences the low frequency characteristic of vibrating diaphragm, and the dynamic stability of vibrating diaphragm is relatively poor moreover.
Disclosure of Invention
It is an object of the present invention to provide a new solution for sensing a diaphragm.
According to a first aspect of the present invention, there is provided a sensing diaphragm, including a sensing portion located in a central region, and a fixing portion located at an outer edge of the sensing portion and integrally formed with the sensing portion; the sensing diaphragm is provided with a fixed part and a sensitive part, wherein the fixed part is fixed on the sensing diaphragm; the sensitive portion is configured to be displaced relative to the holding portion upon impact to form an airflow communication channel between the holding portion and the sensitive portion.
Optionally, at least one of the holding portions is provided.
Optionally, the number of the holding parts is at least three, and the holding parts are uniformly distributed in the circumferential direction of the edge of the sensitive part.
Optionally, the gap portion includes a first section extending from the fixing portion to the sensitive portion, and a second section extending from the end of the first section to the fixing portion in a detouring manner.
Optionally, the first and second segments are symmetrical along their central axes.
Optionally, the slit portion is generally U-shaped, square, semi-circular or semi-elliptical.
Optionally, the free ends of the first section and the second section are provided with extension parts deviating from the extension direction of the free ends.
Optionally, the ratio of the area of the gap portion extending on the sensitive portion to the area of the sensitive portion is 5% -50%.
Optionally, the slit portion is formed by etching or etching.
According to another aspect of the present invention, there is also provided a MEMS microphone comprising a back pole and the sensing diaphragm described above.
The sensing diaphragm is different from the traditional pressure release valve structure, the pressure-released airflow circulation channel is generated by the self-pressure deformation of the sensitive part, and the size of the airflow circulation channel can be adjusted in real time according to the internal and external pressure difference of the sensitive part (the speed of the pressure release opening is adjusted in real time through the self-pressure deformation), so that a pressure release path is provided to protect the sensing diaphragm. According to the sensing diaphragm, the airflow circulation channel is located at the edge of the sensitive part and is formed by the displacement of the sensitive part, so that the airflow circulation channel has small influence on the vibration characteristic of the sensitive part, and the dynamic stability of the sensitive part is better.
The inventor of the present invention finds that, in the prior art, the structure of the pressure relief valve provided on the diaphragm directly affects the vibration characteristics of the diaphragm, particularly the low-frequency characteristics of the diaphragm, and the dynamic stability of the diaphragm is poor. Therefore, the technical task to be achieved or the technical problems to be solved by the present invention are never thought or anticipated by those skilled in the art, and therefore the present invention is a new technical solution.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of a MEMS microphone according to the present invention.
FIG. 2 is a top view of the sensing diaphragm of the present invention.
Fig. 3 is a schematic view of the structure of the slit portion in fig. 2.
Fig. 4 is a schematic view of the sensing diaphragm of fig. 1 displaced upon impact.
Fig. 5 is a schematic structural view of another embodiment of the gap portion of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The sensing diaphragm provided by the invention can be a diaphragm applied to a microphone structure, and can also be a sensitive film applied to other sensor structures, such as a sensitive film layer in a pressure sensor and a gas sensor. The structure, material and application environment of these sensing diaphragms are common knowledge in the field of various sensors, and are not specifically described here.
For convenience of description, the technical solution of the present invention will now be described in detail by taking a microphone as an example, and it should be understood that it may be sensors with other structures for those skilled in the art.
Referring to fig. 1, the present invention provides a MEMS microphone, which includes a substrate 1, and a capacitor structure formed on the substrate 1, the capacitor structure including a sensing diaphragm (diaphragm), a back electrode 6; the sensing diaphragm and the back electrode 6 are supported by a supporting part 7, so that a certain gap is formed between the sensing diaphragm and the back electrode 6. The capacitor structure may be a structure with the back electrode 6 above and the sensing diaphragm below, as shown in fig. 1; it is also possible for a person skilled in the art to have a structure with the back electrode 6 below and the sensing diaphragm above, which will not be described in detail here.
The sensing diaphragm of the present invention, referring to fig. 2, includes a sensitive portion 2 located in a middle region, and a fixing portion 5 located at an outer edge of the sensitive portion 2 and integrally formed with the sensitive portion 2; the sensitive part 2 serves as a vibration part of the microphone, and the sound collection of the microphone mainly depends on the vibration characteristics of the sensitive part 2. The fixing part 5 is used to connect the whole sensing diaphragm on the substrate 1 so that the sensitive part 2 can be suspended above the back cavity of the substrate 1. In a specific manufacturing process, a thin film layer is firstly deposited on the substrate 1 or on an insulating layer above the substrate 1, and then the fixed part 5 at the outer side and the sensitive part 2 at the middle area are formed by etching or corrosion.
Of course, for the person skilled in the art, in order to improve the vibration characteristics of the sensitive part 2, a folded loop part (not shown) is further provided between the sensitive part 2 and the fixed part 5, by which the sensitivity of the sensitive part 2 to vibrations can be significantly improved.
The sensing diaphragm of the present invention further includes a slit portion 4 extending from the fixing portion 5 to the edge position of the sensitive portion 2, the slit portion 4 is not closed, a holding portion 3 is enclosed on the sensing diaphragm through the non-closed slit portion 4, the root of the holding portion is located on the fixing portion 5, and the free end of the holding portion extends to the edge position of the sensitive portion 2, refer to fig. 1 and 2. The holding portion 3 is a part of the sensing diaphragm, and the shape of the holding portion 3 is determined by the shape of the slit portion 4. The slit portion 4 may be formed by, for example, etching or etching a silicon film layer at the time of molding.
Since the root of the holding part 3 is located at the fixing part 5 of the sensing diaphragm and the free end is located at the edge of the sensitive part 2, when the sensing diaphragm is impacted by large sound pressure or large air flow after being connected to the substrate, the sensitive part 2 is displaced upwards or downwards relative to the holding part 3 due to large impact, so that an air flow passage capable of releasing pressure is formed between the holding part 3 and the sensitive part 2.
In a specific embodiment of the present invention, referring to fig. 3, the gap portion 4 includes a first segment 40 extending from the fixed portion 5 to the sensitive portion 2, and a second segment 41 extending from the first segment 40 to the fixed portion 5 in a winding manner. That is, the open end of the slit portion 4 is located at the position of the fixing portion 5, and the closed end surrounded by the first section 40 and the second section 41 is located on the sensitive portion 2, so that the root of the holding portion 3 surrounded by the first section 40 and the second section 41 is located at the position of the fixing portion 5, and the free end of the holding portion 3 is located at the position of the sensitive portion 2 of the sensing diaphragm.
Referring to fig. 4, when the sensing diaphragm receives a large sound pressure from top to bottom, since the free end of the holding portion 3 only extends to the edge of the sensitive portion 2, the pressure receiving surface of the sensitive portion 2 is far larger than that of the holding portion 3, the sensitive portion 2 can be displaced downward due to a large impact, and the holding portion 3 is kept stationary, so that the sensitive portion 2 and the holding portion 3 can be staggered with each other, and an air flow passage between the holding portion 3 and the sensitive portion 2 is opened, so that the pressure can be quickly released.
The sensing diaphragm is different from the traditional pressure release valve structure, the pressure-released airflow circulation channel is generated by the self-pressure deformation of the sensitive part, and the size of the airflow circulation channel can be adjusted in real time according to the internal and external pressure difference of the sensitive part (the speed of the pressure release opening is adjusted in real time through the self-pressure deformation), so that a pressure release path is provided to protect the sensing diaphragm. According to the sensing diaphragm, the airflow circulation channel is located at the edge of the sensitive part and is formed by the displacement of the sensitive part, so that the influence of the airflow circulation channel on the vibration characteristic of the sensitive part is very small, and the dynamic stability of the sensitive part is better.
The holding portion 3 of the present invention may be provided with one, two, three, or more. It is preferable in the present invention that the holding portions 3 are provided at least three, and the three holding portions 3 are uniformly distributed in the circumferential direction of the edge of the sensitive portion 2. For example, when the sensitive part 2 is of a circular structure, the three holding parts 3 are uniformly distributed in the circumferential direction of the edge of the sensitive part 2, so as to ensure the uniformity of pressure relief and the stability of displacement of the sensitive part 2.
In a preferred embodiment of the present invention, the first and second segments 40, 41 are symmetrical along their central axes, so that the holding part 3 is formed as a central symmetrical structure. Of course, it is obvious to those skilled in the art that the holding part 3 may also have an asymmetric structure, and when the sensitive part 2 is displaced, an air flow channel for releasing pressure may also be formed.
The slit portion may be formed in a regular or irregular U-shape, square, semi-circular, semi-elliptical shape as a whole, refer to fig. 5, or other shapes known to those skilled in the art, etc.
Preferably, the free ends of the first and second segments 40 and 41 are provided with extensions 42 deviating from their extension direction. Referring to fig. 3, the two extending portions 42 may extend toward the center of the slit portion 4 or may extend toward opposite directions. The extension portion 42 is provided to well release stress when the slit portion 4 is formed on the film layer, so as to ensure flatness and stability of the sensing diaphragm.
The extension of the slit portion 4 of the present invention on the sensitive portion 2 represents the extension of the holding portion 3 on the sensitive portion 2, which determines the size of the airflow passage after the displacement of the sensitive portion 2. That is, the greater the extension length of the slit portion 4 on the sensitive portion 2, the greater the pressure relief capacity of the airflow communication channel between the sensitive portion 2 and the holding portion 3.
In addition, if the holding part 3 occupies too large an area of the sensitive part 2, the holding part 3 may be relatively displaced even under a large sound pressure, which is contrary to the technical solution of the present application. Therefore, it is necessary to design a dimensional proportional relationship between the holding portion 3 and the sensitive portion 2, which can be obtained by a person skilled in the art through effective secondary experiments. In a specific embodiment of the present invention, the ratio of the area of the slit portion 4 extending on the sensitive portion 2 to the area of the sensitive portion 2 is preferably set to 5% to 50%.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (8)
1. A sensing diaphragm, characterized by: the sensor comprises a sensitive part (2) positioned in the middle area and a fixed part (5) which is positioned on the outer edge of the sensitive part (2) and is integrally formed with the sensitive part (2), wherein the sensitive part (2) and the fixed part (5) are formed on the same thin film layer through an etching or corrosion process; the sensor further comprises a gap part (4) which extends from the fixing part (5) to the edge position of the sensitive part (2) and is not closed, wherein the gap part (4) surrounds a holding part (3) with a root part positioned on the fixing part (5) and a free end extending to the upper edge position of the sensitive part (2) on the sensing membrane; the sensitive part (2) is configured to be displaced relative to the holding part (3) upon impact to form an airflow communication channel between the holding part (3) and the sensitive part (2);
the gap part (4) comprises a first section (40) extending from the fixing part (5) to the sensitive part (2), and a second section (41) extending from the end of the first section (40) to the fixing part (5) in a roundabout manner;
the free ends of the first section (40) and the second section (41) are provided with extension parts (42) deviating from the extension direction of the free ends.
2. The sensing diaphragm of claim 1, wherein: at least one holding part (3) is provided.
3. The sensing diaphragm of claim 2, wherein: the number of the holding parts (3) is at least three, and the holding parts are uniformly distributed on the periphery of the edge of the sensitive part (2).
4. The sensing diaphragm of claim 1, wherein: the first section (40) and the second section (41) are symmetrical along the central axis.
5. The sensing diaphragm of claim 1, wherein: the whole gap part (4) is U-shaped, square, semicircular or semi-elliptical.
6. The sensing diaphragm of claim 1, wherein: the ratio of the area of the gap part (4) extending on the sensitive part (2) to the area of the sensitive part (2) is 5-50%.
7. The sensing diaphragm of claim 1, wherein: the gap part (4) is formed by means of corrosion or etching.
8. A MEMS microphone comprising a back pole and a sensing diaphragm according to any of claims 1-7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710297168.7A CN106996827B (en) | 2017-04-28 | 2017-04-28 | Sensing diaphragm and MEMS microphone |
| PCT/CN2017/083569 WO2018196036A1 (en) | 2017-04-28 | 2017-05-09 | Sensing diaphragm and mems microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710297168.7A CN106996827B (en) | 2017-04-28 | 2017-04-28 | Sensing diaphragm and MEMS microphone |
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| Publication Number | Publication Date |
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| CN106996827A CN106996827A (en) | 2017-08-01 |
| CN106996827B true CN106996827B (en) | 2020-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710297168.7A Active CN106996827B (en) | 2017-04-28 | 2017-04-28 | Sensing diaphragm and MEMS microphone |
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| Country | Link |
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| CN (1) | CN106996827B (en) |
| WO (1) | WO2018196036A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10343898B1 (en) * | 2018-01-08 | 2019-07-09 | Fortemedia, Inc. | MEMS microphone with tunable sensitivity |
| US10715924B2 (en) * | 2018-06-25 | 2020-07-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | MEMS microphone having diaphragm |
| CN111137842B (en) * | 2019-12-31 | 2023-06-23 | 共达电声股份有限公司 | MEMS membrane and MEMS sensor chip |
| CN112087698B (en) * | 2020-10-15 | 2021-07-23 | 潍坊歌尔微电子有限公司 | MEMS microphone |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103338427A (en) * | 2013-07-18 | 2013-10-02 | 山东共达电声股份有限公司 | MEMS (micro-electromechanical systems) chip and MEMS microphone |
| CN204316746U (en) * | 2014-11-28 | 2015-05-06 | 歌尔声学股份有限公司 | A kind of MEMS sensor and MEMS microphone |
| CN204425633U (en) * | 2014-11-28 | 2015-06-24 | 歌尔声学股份有限公司 | A kind of MEMS microphone, MEMS capacitance sensor and a kind of vibrating diaphragm |
| CN106375912A (en) * | 2016-08-31 | 2017-02-01 | 歌尔股份有限公司 | Vibration diaphragm in MEMS microphone, and MEMS microphone |
| CN206024109U (en) * | 2016-08-04 | 2017-03-15 | 北京卓锐微技术有限公司 | MEMS microphone vibrating diaphragm and MEMS microphone |
| CN206905882U (en) * | 2017-04-28 | 2018-01-19 | 歌尔股份有限公司 | One kind sensing diaphragm and MEMS microphone |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060280319A1 (en) * | 2005-06-08 | 2006-12-14 | General Mems Corporation | Micromachined Capacitive Microphone |
| CN101453683A (en) * | 2008-12-26 | 2009-06-10 | 瑞声声学科技(深圳)有限公司 | Silicon capacitor type microphone |
| CN203206466U (en) * | 2013-03-12 | 2013-09-18 | 北京卓锐微技术有限公司 | Silicon capacitor microphone |
-
2017
- 2017-04-28 CN CN201710297168.7A patent/CN106996827B/en active Active
- 2017-05-09 WO PCT/CN2017/083569 patent/WO2018196036A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103338427A (en) * | 2013-07-18 | 2013-10-02 | 山东共达电声股份有限公司 | MEMS (micro-electromechanical systems) chip and MEMS microphone |
| CN204316746U (en) * | 2014-11-28 | 2015-05-06 | 歌尔声学股份有限公司 | A kind of MEMS sensor and MEMS microphone |
| CN204425633U (en) * | 2014-11-28 | 2015-06-24 | 歌尔声学股份有限公司 | A kind of MEMS microphone, MEMS capacitance sensor and a kind of vibrating diaphragm |
| CN206024109U (en) * | 2016-08-04 | 2017-03-15 | 北京卓锐微技术有限公司 | MEMS microphone vibrating diaphragm and MEMS microphone |
| CN106375912A (en) * | 2016-08-31 | 2017-02-01 | 歌尔股份有限公司 | Vibration diaphragm in MEMS microphone, and MEMS microphone |
| CN206905882U (en) * | 2017-04-28 | 2018-01-19 | 歌尔股份有限公司 | One kind sensing diaphragm and MEMS microphone |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106996827A (en) | 2017-08-01 |
| WO2018196036A1 (en) | 2018-11-01 |
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