CN106982514A - Single-layer multi-material conductive circuit board and preparation method thereof - Google Patents
Single-layer multi-material conductive circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN106982514A CN106982514A CN201710322381.9A CN201710322381A CN106982514A CN 106982514 A CN106982514 A CN 106982514A CN 201710322381 A CN201710322381 A CN 201710322381A CN 106982514 A CN106982514 A CN 106982514A
- Authority
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- China
- Prior art keywords
- conductive layer
- preparation
- conductive
- conducting wire
- pattern part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000463 material Substances 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 23
- 239000002356 single layer Substances 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 3
- 230000004888 barrier function Effects 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 238000000608 laser ablation Methods 0.000 claims description 4
- 238000010146 3D printing Methods 0.000 claims description 3
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910001416 lithium ion Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 229910052743 krypton Inorganic materials 0.000 claims description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910052724 xenon Inorganic materials 0.000 claims description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000005187 foaming Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 abstract 11
- 239000007767 bonding agent Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/665—Composites
- H01M4/667—Composites in the form of layers, e.g. coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a single-layer multi-material conductive circuit board and a preparation method thereof. The preparation method comprises the following steps: (1) adhering a first conductive layer on the insulating layer through an adhesive, etching the outline of a reserved pattern on the first conductive layer to separate the reserved pattern part from the non-reserved pattern part on the first conductive layer, and stripping off the non-reserved pattern part on the first conductive layer to obtain a first conductive circuit board; (2) and a second conductive layer covers one side of the conductive layer of the first conductive circuit board, is bonded with the insulating layer through a bonding agent, and is etched to form the outline of the reserved pattern on the conductive substrate of the second conductive layer, so that the reserved pattern part and the unreserved pattern part of the second conductive layer are separated, and the unreserved pattern part of the second conductive layer is stripped off to obtain the second conductive circuit board. The preparation method is simple and efficient, conductive circuits made of different materials can be arranged on the same insulating substrate, and the application field of the circuit board is greatly expanded.
Description
Technical field
The present invention relates to circuit board technology field, more particularly to a kind of many material conducting wire plates of individual layer and preparation method.
Background technology
With the development of wearable electronic, electronic device plays an increasingly important role.Conductive substrates are electronics
The carrier of function element, its importance is self-evident.Traditional circuit board, is prepared using the method for chemical etching plus mask plate
The conductive substrates of patterning, preparation technology is complicated, and environmental pollution is big.And the applicable conductive of its technique is only limitted to copper
With the conventional single conductive metal material such as aluminium, and many material conducting wires are typically realized by multilayer circuit board technique, not only greatly
It is big to add process complexity, and make it that wiring board is thickening, it significantly limit conducting wire plate, especially flexible conductive wire
The application of road plate.Moreover, the compatible conductive material of this technique is limited, these conductive materials are corrosion-resistant due to itself
Property, limit its application in various electrochemical fields.
The content of the invention
In view of this, an object of the present invention is the preparation method for providing a kind of many material conducting wire plates of individual layer,
Its preparation method is simply efficient, the conducting wire for the unlike material that can be arranged in same dielectric base, greatly expands circuit board
Application field.
The second object of the present invention is to provide a kind of individual layer many material conducting wire plates, many material conducting wires of its individual layer
Plate can arrange the conducting wire of unlike material in same dielectric base, greatly expand the application field of circuit board.
The third object of the present invention is to provide a kind of both positive and negative polarity collector for 3D printing lithium ion battery, its individual layer
Many material conducting wire plates can arrange the conducting wire of unlike material in same dielectric base, greatly expand circuit board
Application field.
For up to first purpose, the present invention uses following scheme：
A kind of preparation method of many material conducting wire plates of individual layer, comprises the following steps：
(1) there is the first conductive layer by adhesive bond on the insulating layer, etched on first conductive layer reserved
The profile of pattern so that the reserved pattern part on first conductive layer is partially separated with unreserved pattern, is peeled off described
Unreserved pattern part on first conductive layer, is made the first conducting wire plate；
(2) in the conductive layer side of the first conducting wire plate covered with the second conductive layer, second conductive layer leads to
Cross the binding agent to bond with the insulating barrier, the wheel of reserved pattern is etched in the conductive substrates of second conductive layer
It is wide so that reserved pattern part and the unreserved pattern of second conductive layer are partially separated, and peel off the non-of the second conductive layer
Reserved pattern part, is made the second conducting wire plate.
Wherein, in addition to step (3)：The 3rd conductive layer, institute are covered in the conductive layer side of the second conducting wire plate
State the 3rd conductive layer to bond by the binding agent and the insulating barrier, etched in the conductive substrates of the 3rd conductive layer
The profile of reserved pattern so that the reserved pattern part of the 3rd conductive layer is partially separated with unreserved pattern, peels off the
The unreserved pattern part of three conductive layers, is made the 3rd conducting wire plate, by that analogy, the conducting wire of various material can be made
Plate.
Wherein, first conductive layer is different with the material of second conductive layer.
Wherein, the reserved pattern of first conductive layer and the second conductive layer can not be overlapping.
Wherein, the material of first conductive layer and the second conductive layer is selected from metallic film material and its alloy material, gold
Belong to one in the alloy film material of foamed material and its alloy material, conductive C film, conductive carbon cloth material or metal and carbon
Kind or at least two combination.
Wherein, the material of first conductive layer and the second conductive layer is selected from copper foil or aluminium foil.
Wherein, etching mode is laser ablation in the step (1) and step (2).
Wherein, the laser of the laser ablation is CO2 lasers, krypton flashlamp-pumped YAG laser, xenon flash lamp pumping YAG laser
Device, semiconductor side pumped YAG laser.
For up to second purpose, the present invention uses following scheme：
A kind of many material conducting wire plates of individual layer, are made using above-mentioned preparation method.
For up to the 3rd purpose, the present invention uses following scheme：
A kind of both positive and negative polarity collector for 3D printing lithium ion battery, including the above-mentioned many material conducting wires of individual layer
Plate.
Compared with prior art, beneficial effects of the present invention are：The present invention insulating barrier upper casing arrange the first conductive layer and
Second conductor layer, and conducting wire is etched into it, greatly expand the application field of circuit board.Preparation method of the present invention
Simple efficient, the conducting wire for the unlike material that can be arranged in same dielectric base greatly expands the application field of circuit board.
Brief description of the drawings
Fig. 1 is the structural representation that the first conductive layer is bonded on the insulating barrier of the embodiment of the present invention；
Fig. 2 is the structural representation of the first conducting wire plate of the embodiment of the present invention；
Fig. 3 is the structural representation that the second conductive layer is covered with the first conducting wire plate of the embodiment of the present invention；
Fig. 4 etches the structural representation of reserved pattern for the second conductive layer of the embodiment of the present invention；
Fig. 5 is the structural representation of many material conducting wire plates of individual layer of the embodiment of the present invention.
Accompanying drawing is indicated：1- insulating barriers, 2- binding agents, the conductive layers of 3- first, the conductive layers of 4- second, 31- first conductive layers
Reserved pattern part, the reserved pattern part of the conductive layers of 41- second.
Embodiment
Further illustrate technical scheme in conjunction with the embodiments separately below.
The preparation method of many material conducting wire plates of individual layer, comprises the following steps in the present embodiment：
(1) layer binder 2 is applied on insulating barrier 1, such as Kapton, first is covered on binding agent 2 conductive
Layer 3, for example, can be aluminium foil, reserved pattern part 31 is etched on the first conductive layer 3 with laser, makes the first conductive layer 3
Reserved pattern part 31 is partially separated with unreserved pattern, is peeled off unreserved pattern part, is obtained the first conducting wire plate,
The second conductive layer 4, such as copper foil, because the unreserved pattern part of the first conductive layer 3 has been divided are covered with first conducting wire plate
From the second conductive layer 4 is bonded in the position of the unreserved pattern part of the first conductive layer 3 with insulating barrier 1, is led with laser second
Electric layer 4 etches reserved pattern, the reserved pattern part 41 of the second conductive layer 4 is partially separated with unreserved pattern, peels off
Unreserved pattern part, obtains the copper aluminium circuit board of individual layer, by that analogy, the conducting wire plate of various material can be made.
The conductive material of the compatible all energy film forming of the inventive method, and be all the time individual layer by conductive layer control, can be significantly simple
Change the structure of conductive layer, expand its application.Particularly, method of the invention, is equally applicable to flexible many material conductor wires
The preparation of road plate.
It should be noted that and understand, do not departing from the spirit and scope of appended claims the present invention for required protection
In the case of, various modifications and improvements can be made to the present invention of foregoing detailed description.It is therefore desirable to the technical scheme of protection
Scope do not limited by given any specific exemplary teachings.
Applicant states that the present invention illustrates detailed process equipment and the technological process of the present invention by above-described embodiment,
But the invention is not limited in above-mentioned detailed process equipment and technological process, that is, do not mean that the present invention has to rely on above-mentioned detailed
Process equipment and technological process could be implemented.Person of ordinary skill in the field it will be clearly understood that any improvement in the present invention,
Addition, selection of concrete mode of equivalence replacement and auxiliary element to each raw material of product of the present invention etc., all fall within the present invention's
Within the scope of protection domain and disclosure.
Claims (10)
1. a kind of preparation method of many material conducting wire plates of individual layer, it is characterised in that comprise the following steps：
(1) the first conductive layer (3) is bonded with by binding agent (2) on insulating barrier (1), carved on first conductive layer (3)
Lose the profile of reserved pattern so that the reserved pattern part (31) of first conductive layer (3) and unreserved pattern part point
From, peel off the unreserved pattern part on first conductive layer (3), be made the first conducting wire plate；
(2) in the conductive layer side of the first conducting wire plate covered with the second conductive layer (4), second conductive layer (4)
Bonded, etched in the conductive substrates of second conductive layer (4) pre- by the binding agent (2) and the insulating barrier (1)
Stay the profile of pattern so that the reserved pattern part (41) of second conductive layer (4) is partially separated with unreserved pattern, peel off
Fall the unreserved pattern part of the second conductive layer (4), the second conducting wire plate is made.
2. preparation method according to claim 1, it is characterised in that also including step (3)：In second conducting wire
The conductive layer side of plate covers the 3rd conductive layer, and the 3rd conductive layer is glued by the binding agent (2) and the insulating barrier (1)
Knot, etches the profile of reserved pattern in the conductive substrates of the 3rd conductive layer so that the 3rd conductive layer it is reserved
Pattern part is partially separated with unreserved pattern, peels off the unreserved pattern part of the 3rd conductive layer, and the 3rd conductor wire is made
Road plate, by that analogy, can be made the conducting wire plate of various material.
3. preparation method according to claim 1, it is characterised in that first conductive layer (3) and second conduction
The material of layer (4) is different.
4. preparation method according to claim 1, it is characterised in that first conductive layer (3) and the second conductive layer (4)
Reserved pattern can not be overlapping.
5. preparation method according to claim 1, it is characterised in that first conductive layer (3) and the second conductive layer (4)
Material be selected from metallic film material and its alloy material, metal foaming material and its alloy material, conductive C film, conductive carbon
One kind or at least two combination in the alloy film material of cloth material or metal and carbon.
6. preparation method according to claim 1, it is characterised in that first conductive layer (3) and the second conductive layer (4)
Material be selected from copper foil or aluminium foil.
7. preparation method according to claim 1, it is characterised in that etching mode is in the step (1) and step (2)
Laser ablation.
8. preparation method according to claim 7, it is characterised in that the laser of the laser ablation is CO2 lasers, krypton
Lamp pumping YAG laser, xenon flash lamp pumping YAG laser, semiconductor side pumped YAG laser.
9. a kind of many material conducting wire plates of individual layer, it is characterised in that using the preparation method described in claim any one of 1-8
It is made.
10. a kind of both positive and negative polarity collector for 3D printing lithium ion battery, it is characterised in that including described in claim 9
The many material conducting wire plates of individual layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710322381.9A CN106982514B (en) | 2017-05-09 | 2017-05-09 | Single-layer multi-material conductive circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710322381.9A CN106982514B (en) | 2017-05-09 | 2017-05-09 | Single-layer multi-material conductive circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106982514A true CN106982514A (en) | 2017-07-25 |
| CN106982514B CN106982514B (en) | 2020-09-18 |
Family
ID=59343589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710322381.9A Active CN106982514B (en) | 2017-05-09 | 2017-05-09 | Single-layer multi-material conductive circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106982514B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108282964A (en) * | 2018-01-31 | 2018-07-13 | 深圳光韵达激光应用技术有限公司 | A kind of circuit board machining process forming circuit and figure using laser ablation |
| CN111935909A (en) * | 2020-07-31 | 2020-11-13 | 上海安费诺永亿通讯电子有限公司 | Recyclable electronic circuit with paper substrate and preparation method and recycling method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101126893A (en) * | 2006-08-18 | 2008-02-20 | 山荣化学株式会社 | Forming method for protecting image |
| JP4919921B2 (en) * | 2007-10-02 | 2012-04-18 | 東洋アルミニウム株式会社 | Antenna circuit assembly for IC card / tag and manufacturing method thereof |
| US20140259658A1 (en) * | 2013-03-15 | 2014-09-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of cutting conductive patterns |
-
2017
- 2017-05-09 CN CN201710322381.9A patent/CN106982514B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101126893A (en) * | 2006-08-18 | 2008-02-20 | 山荣化学株式会社 | Forming method for protecting image |
| JP4919921B2 (en) * | 2007-10-02 | 2012-04-18 | 東洋アルミニウム株式会社 | Antenna circuit assembly for IC card / tag and manufacturing method thereof |
| US20140259658A1 (en) * | 2013-03-15 | 2014-09-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of cutting conductive patterns |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108282964A (en) * | 2018-01-31 | 2018-07-13 | 深圳光韵达激光应用技术有限公司 | A kind of circuit board machining process forming circuit and figure using laser ablation |
| CN111935909A (en) * | 2020-07-31 | 2020-11-13 | 上海安费诺永亿通讯电子有限公司 | Recyclable electronic circuit with paper substrate and preparation method and recycling method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106982514B (en) | 2020-09-18 |
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