CN106926548B - A kind of pre-heated pcb board automatic hot apparatus device - Google Patents
A kind of pre-heated pcb board automatic hot apparatus device Download PDFInfo
- Publication number
- CN106926548B CN106926548B CN201511008634.2A CN201511008634A CN106926548B CN 106926548 B CN106926548 B CN 106926548B CN 201511008634 A CN201511008634 A CN 201511008634A CN 106926548 B CN106926548 B CN 106926548B
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- China
- Prior art keywords
- oil cylinder
- screw thread
- lower die
- column
- molding seat
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- Press Drives And Press Lines (AREA)
Abstract
The invention discloses a kind of pre-heated pcb board automatic hot apparatus devices, including rack, punching press oil cylinder, pull pressure sensor, formed punch, prefabricating oil cylinder, column, lower die, first heating tube, lower molding seat, upper mold, upper molding seat, second heating tube, controller, pcb board to be processed is placed on lower molding seat and is positioned, controller control prefabricating oil cylinder drives lower die to move up, until block is triggered close to switch, at this time, upper molding seat is contacted with lower molding seat but malcompression, after controller controls the first heating tube and the second heating tube operation setup time, punching press oil cylinder pushing formed punch, which quickly moves down, quickly pushes upper mold to lower die, lower molding seat and upper molding seat treat processing PCB plate and carry out punch forming.The apparatus structure is simple, first treats processing PCB plate and is preheated, then by fast ram, so that each component part of pcb board is bonded solid and reliable, uniformly continuous, bubble-free etc. is bad, meanwhile, security performance is high, and service life of equipment is long.
Description
Technical field
The present invention relates to a kind of pcb board auxiliary units more particularly to a kind of pre-heated pcb board automatic hot apparatus devices.
Background technique
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board, is important
Electronic component, be the supporter of electronic component, be the carrier of electronic component electrical connection, printed board develops to from single layer
Two-sided, multilayer and flexibility, and respective development trend is still kept, due to constantly to high-precision, high density and Gao Ke
Develop by property direction, constantly diminution volume, reduction cost, raising performance, so that development work of the printed board in future electronic equipment
Cheng Zhong still maintains powerful vitality.Existing multi-layer board is adding man-hour requirement that different material is successively stacked to alignment, and leads to
Excess pressure machine compression moulding under certain temperature and pressure, since traditional press is without preheating device, currently, pcb board produces
Producer first preheats pcb board in baking oven, then is crimped, and due to preheating and crimping separated processing, causes temperature uneven
It is even, so as to cause pcb board crimping loosely with the generation of non-uniform phenomenon.In view of disadvantages described above, it is really necessary to design a kind of preheating
Formula pcb board automatic hot apparatus device.
Summary of the invention
Technical problem to be solved by the present invention lies in: a kind of pre-heated pcb board automatic hot apparatus device is provided, to solve
Pcb board crimping loosely with non-uniform problem.
In order to solve the above technical problems, the technical scheme is that a kind of pre-heated pcb board automatic hot apparatus device, packet
Including rack, punching press oil cylinder, pull pressure sensor, formed punch, prefabricating oil cylinder, column, lower die, the first heating tube, lower molding seat, on
Mould, upper molding seat, the second heating tube, controller, the punching press oil cylinder are located at frame upper end, the punching press oil cylinder and rack
Screw thread is connected, and the pull pressure sensor is located at punching press oil cylinder lower end, the pull pressure sensor and punching press oil cylinder screw thread
It is connected, the formed punch is located at pull pressure sensor lower end, and the formed punch is connected with pull pressure sensor screw thread, and described is pre-
Compressing cylinder is located at rack lower end, and the prefabricating oil cylinder is connected with rack screw thread, and the column is located at rack lower end and is located at
At left and right sides of prefabricating oil cylinder, the column is connected with rack screw thread and is movably connected with prefabricating oil cylinder, and the lower die is located at
Column outer wall and it is located at the top of prefabricating oil cylinder, the lower die and column, which slide, to be connected and be connected with prefabricating oil cylinder screw thread, described
The first heating tube be located at lower die top center, first heating tube is connected with lower die screw thread, the lower molding seat
At lower die top center and it is located at the first heating tube upper end, the lower molding seat is connected with lower die screw thread and adds with first
Heat pipe is movably connected, and the upper mold is located at the outer upper end of column, and the upper mold is connected with column elasticity, the upper molding seat
Positioned at upper mold bottom center, the upper molding seat is connected with upper mold screw thread, the upper molding seat and lower molding seat axis
It being overlapped, second heating tube is located at upper molding seat inner wall bottom, and second heating tube is connected with upper molding seat screw thread,
The controller is located at rack lower end, and the controller is connected with rack screw thread.
The present invention further improves as follows:
Further, the formed punch is additionally provided with nylon cushion, and the nylon cushion is located at ram bottom, the nylon cushion
It is connected with formed punch screw thread.
Further, the column is additionally provided with boss, and the boss is located at the upper end of the column, the boss and column
It is integrally connected.
Further, the boss is additionally provided with close to switch, described to be located at boss side close to switch, and described connects
Nearly switch is connected with boss screw thread.
Further, the column is additionally provided with limited block, and the limited block is located at the top of column, the limited block
It is integrally connected with column.
Further, the limited block is additionally provided with the first neonychium, and first neonychium is located at limited block bottom
And it is located at column outer wall, first neonychium is connected with limited block screw thread and is connected with column gap.
Further, the lower die is additionally provided with block, and the block is located at lower die side, the block and lower die
Screw thread is connected, and the block is overlapped with close to switch axis.
Further, the lower die is additionally provided with the second neonychium, and second neonychium is located at left and right at the top of lower die
Two sides and it is located at column outer wall, second neonychium is connected with lower die screw thread and is connected with column gap.
Further, the upper mold is additionally provided with spring, and the spring is located at upper mold bottom and is located at boss upper end, institute
The spring stated is connected with upper mold screw thread and is connected with boss screw thread.
Compared with prior art, when work, pcb board to be processed is placed in down for the pre-heated pcb board automatic hot apparatus device
On molding seat and position, controller control prefabricating oil cylinder drive lower die move up, until block trigger close to switch, at this point, at
Type seat is contacted with lower molding seat but malcompression, after controller controls the first heating tube and the second heating tube operation setup time, punching
Compressing cylinder promotion formed punch, which quickly moves down, quickly pushes upper mold to lower die, and lower molding seat and upper molding seat treat the progress of processing PCB plate
Punch forming, pull pressure sensor is for preventing the excessively high damage upper die and lower die of stamping press.The apparatus structure is simple, first to be added
Work pcb board is preheated, then by fast ram, so that each component part of pcb board is bonded solid and reliable, uniformly continuous, no gas
Bubble etc. is bad, meanwhile, security performance is high, and service life of equipment is long.
Detailed description of the invention
Fig. 1 shows main view of the present invention
Fig. 2 shows partial views of the present invention
1 punching press oil cylinder 2 of rack
3 formed punch 4 of pull pressure sensor
5 column 6 of prefabricating oil cylinder
7 first heating tube 8 of lower die
Lower 9 upper mold 10 of molding seat
Upper 11 second heating tube 12 of molding seat
13 nylon cushion 401 of controller
The close switch 602 of boss 601
603 first neonychium 604 of limited block
701 second neonychium 702 of block
Spring 1001
Specific embodiment
As shown in Figure 1 and Figure 2, a kind of pre-heated pcb board automatic hot apparatus device, including rack 1, punching press oil cylinder 2, pressure
Sensor 3, formed punch 4, prefabricating oil cylinder 5, column 6, lower die 7, the first heating tube 8, lower molding seat 9, upper mold 10, upper molding seat 11,
Second heating tube 12, controller 13, the punching press oil cylinder 2 are located at 1 upper end of rack, the punching press oil cylinder 2 and 1 screw thread of rack
It is connected, the pull pressure sensor 3 is located at 2 lower end of punching press oil cylinder, the pull pressure sensor 3 and 2 screw thread of punching press oil cylinder
It is connected, the formed punch 4 is located at 3 lower end of pull pressure sensor, and the formed punch 4 is connected with 3 screw thread of pull pressure sensor, described
Prefabricating oil cylinder 5 be located at 1 lower end of rack, the prefabricating oil cylinder 5 is connected with 1 screw thread of rack, and the column 6 is located at rack 1
Lower end and it is located at the left and right sides of prefabricating oil cylinder 5, the column 6 is connected with 1 screw thread of rack and is movably connected with prefabricating oil cylinder 5,
The lower die 7 is located at 6 outer wall of column and is located at the top of prefabricating oil cylinder 5, the lower die 7 slided with column 6 be connected and with it is pre-
5 screw thread of compressing cylinder is connected, and first heating tube 8 is located at 7 top center of lower die, first heating tube 8 and lower die 7
Screw thread is connected, and the lower molding seat 9 is located at 7 top center of lower die and is located at 8 upper end of the first heating tube, the lower molding
Seat 9 is connected with 7 screw thread of lower die and is movably connected with the first heating tube 8, and the upper mold 10 is located at the outer upper end of column 6, described
6 elasticity of upper mold 10 and column is connected, and the upper molding seat 11 is located at 10 bottom center of upper mold, the upper molding seat 11 and
10 screw thread of upper mold be connected, the upper molding seat 11 is overlapped with lower 9 axis of molding seat, second heating tube 12 positioned at
11 inner wall bottom of type seat, second heating tube 12 are connected with upper 11 screw thread of molding seat, and the controller 13 is located at rack 1
Lower end, the controller 13 are connected with 1 screw thread of rack, and the formed punch 4 is additionally provided with nylon cushion 401, the nylon cushion 401
Positioned at 4 bottom of formed punch, the nylon cushion 401 is connected with 4 screw thread of formed punch, and the column 6 is additionally provided with boss 601, described
Boss 601 is located at 6 upper end of column, and the boss 601 is integrally connected with column 6, and the boss 601 is additionally provided with close to switch
602, it is described to be located at 601 side of boss close to switch 602, it is described to be connected close to switch 602 with 601 screw thread of boss, it is described
Column 6 be additionally provided with limited block 603, the limited block 603 is located at 6 top of column, the limited block 603 and column 6 one
Body is connected, and the limited block 603 is additionally provided with the first neonychium 604, and first neonychium 604 is located at 603 bottom of limited block
Portion and it is located at 6 outer wall of column, first neonychium 604 is connected with 603 screw thread of limited block and is connected with 6 gap of column, institute
The lower die 7 stated is additionally provided with block 701, and the block 701 is located at 7 side of lower die, the block 701 and 7 screw thread phase of lower die
Even, the block 701 is overlapped with 602 axis of switch is approached, and the lower die 7 is additionally provided with the second neonychium 702, and described the
Two neonychiums 702 are located at the 7 top left and right sides of lower die and are located at 6 outer wall of column, second neonychium 702 and 7 spiral shell of lower die
Line is connected and is connected with 6 gap of column, and the upper mold 10 is additionally provided with spring 1001, and the spring 1001 is located at 10 bottom of upper mold
Portion and it is located at 601 upper end of boss, the spring 1001 is connected with 10 screw thread of upper mold and is connected with 601 screw thread of boss, the preheating
Pcb board to be processed when work, is placed on lower molding seat 9 and is positioned by formula pcb board automatic hot apparatus device, and controller 13 controls
Prefabricating oil cylinder 5 drives lower die 7 to move up, until block 701 is triggered close to switch 602, at this point, upper molding seat 11 and lower molding seat 9
Contact but malcompression, after controller 13 controls the first heating tube 8 and 12 operation setup time of the second heating tube, punching press oil cylinder 2 is pushed away
Dynamic formed punch 4, which quickly moves down, quickly pushes upper mold 10 to lower die 7, and lower molding seat 9 is treated processing PCB plate with upper molding seat 11 and rushed
Molded, pull pressure sensor 3 is for preventing the excessively high damage upper mold 10 of stamping press and lower die 7.The apparatus structure is simple, first treats
Processing PCB plate is preheated, then by fast ram, so that each component part of pcb board is bonded solid and reliable, uniformly continuous, nothing
Bubble etc. is bad, meanwhile, security performance is high, and service life of equipment is long.
The present invention is not limited to above-mentioned specific embodiment, those skilled in the art from the above idea,
Without creative labor, the various transformation made are within the scope of the present invention.
Claims (4)
1. a kind of pre-heated pcb board automatic hot apparatus device, it is characterised in that including rack, punching press oil cylinder, pull pressure sensor, punching
Head, prefabricating oil cylinder, column, lower die, the first heating tube, lower molding seat, upper mold, upper molding seat, the second heating tube, controller, institute
The punching press oil cylinder stated is located at frame upper end, and the punching press oil cylinder is connected with rack screw thread, and the pull pressure sensor is located at
Punching press oil cylinder lower end, the pull pressure sensor are connected with punching press oil cylinder screw thread, and the formed punch is located at pull pressure sensor
Lower end, the formed punch are connected with pull pressure sensor screw thread, and the prefabricating oil cylinder is located at rack lower end, the pre- pressure oil
Cylinder is connected with rack screw thread, and the column is located at rack lower end and is located at left and right sides of prefabricating oil cylinder, the column and machine
Frame screw thread is connected and is movably connected with prefabricating oil cylinder, and the lower die is located at column outer wall and is located at the top of prefabricating oil cylinder, described
The sliding of lower die and column be connected and be connected with prefabricating oil cylinder screw thread, first heating tube is located at lower die top center,
First heating tube is connected with lower die screw thread, and the lower molding seat is located at lower die top center and is located at the first heating
Pipe upper end, the lower molding seat are connected with lower die screw thread and are movably connected with the first heating tube, and the upper mold is located at column
Outer upper end, the upper mold are connected with column elasticity, and the upper molding seat is located at upper mold bottom center, the upper molding
Seat is connected with upper mold screw thread, and the upper molding seat is overlapped with lower molding seat axis, and second heating tube is located at upper molding
Seat inner wall bottom, second heating tube are connected with upper molding seat screw thread, and the controller is located at rack lower end, described
Controller is connected with rack screw thread；The formed punch is additionally provided with nylon cushion, and the nylon cushion is located at ram bottom, the Buddhist nun
Dragon pad is connected with formed punch screw thread, and the column is additionally provided with limited block, and the limited block is located at the top of column, the limit
Block is integrally connected with column.
2. pre-heated pcb board automatic hot apparatus device as described in claim 1, it is characterised in that the limited block is additionally provided with the
One neonychium, first neonychium are located at limited block bottom and are located at column outer wall, first neonychium and limit
Block screw thread is connected and is connected with column gap.
3. pre-heated pcb board automatic hot apparatus device as claimed in claim 2, it is characterised in that the lower die is additionally provided with gear
Block, the block are located at lower die side, and the block is connected with lower die screw thread, the block and close switch axis weight
It closes.
4. pre-heated pcb board automatic hot apparatus device as claimed in claim 3, it is characterised in that the lower die is additionally provided with second
Neonychium, second neonychium are located at the left and right sides at the top of lower die and are located at column outer wall, second neonychium with
Lower die screw thread is connected and is connected with column gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511008634.2A CN106926548B (en) | 2015-12-29 | 2015-12-29 | A kind of pre-heated pcb board automatic hot apparatus device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511008634.2A CN106926548B (en) | 2015-12-29 | 2015-12-29 | A kind of pre-heated pcb board automatic hot apparatus device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106926548A CN106926548A (en) | 2017-07-07 |
| CN106926548B true CN106926548B (en) | 2019-03-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511008634.2A Active CN106926548B (en) | 2015-12-29 | 2015-12-29 | A kind of pre-heated pcb board automatic hot apparatus device |
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| CN (1) | CN106926548B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108326104B (en) * | 2018-01-20 | 2024-02-06 | 梵利特智能科技（苏州）有限公司 | Card hot press device |
| CN111266450A (en) * | 2020-02-17 | 2020-06-12 | 王成科 | Non-mould multi-point forming mould for forming computer mainboard |
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|---|---|---|---|---|
| CN1436643A (en) * | 2001-11-20 | 2003-08-20 | 日本碍子株式会社 | Die for punching & laminating simultaneously |
| CN2855717Y (en) * | 2005-12-16 | 2007-01-10 | 比亚迪股份有限公司 | Hot press |
| CN101474876A (en) * | 2007-12-14 | 2009-07-08 | 米卡多机器贩卖株式会社 | Hot press apparatus and a hot press method for thin plate-like workpieces |
| CN101966760A (en) * | 2010-06-18 | 2011-02-09 | 东莞市飞新达精密机械科技有限公司 | Hot press |
| CN102700126A (en) * | 2011-04-22 | 2012-10-03 | 苏州市科林源电子有限公司 | PCB plate hot-pressing tool |
| CN202462555U (en) * | 2012-02-20 | 2012-10-03 | 青岛良木股份有限公司 | Timed preheating hot press device for plates |
| CN205255688U (en) * | 2015-12-29 | 2016-05-25 | 苏州市迪飞特电子有限公司 | Automatic hot press unit of preheating -type PCB board |
-
2015
- 2015-12-29 CN CN201511008634.2A patent/CN106926548B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1436643A (en) * | 2001-11-20 | 2003-08-20 | 日本碍子株式会社 | Die for punching & laminating simultaneously |
| CN2855717Y (en) * | 2005-12-16 | 2007-01-10 | 比亚迪股份有限公司 | Hot press |
| CN101474876A (en) * | 2007-12-14 | 2009-07-08 | 米卡多机器贩卖株式会社 | Hot press apparatus and a hot press method for thin plate-like workpieces |
| CN101966760A (en) * | 2010-06-18 | 2011-02-09 | 东莞市飞新达精密机械科技有限公司 | Hot press |
| CN102700126A (en) * | 2011-04-22 | 2012-10-03 | 苏州市科林源电子有限公司 | PCB plate hot-pressing tool |
| CN202462555U (en) * | 2012-02-20 | 2012-10-03 | 青岛良木股份有限公司 | Timed preheating hot press device for plates |
| CN205255688U (en) * | 2015-12-29 | 2016-05-25 | 苏州市迪飞特电子有限公司 | Automatic hot press unit of preheating -type PCB board |
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| Publication number | Publication date |
|---|---|
| CN106926548A (en) | 2017-07-07 |
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