CN106803079A - Fingerprint module and mobile terminal - Google Patents
Fingerprint module and mobile terminal Download PDFInfo
- Publication number
- CN106803079A CN106803079A CN201710041721.0A CN201710041721A CN106803079A CN 106803079 A CN106803079 A CN 106803079A CN 201710041721 A CN201710041721 A CN 201710041721A CN 106803079 A CN106803079 A CN 106803079A
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- Prior art keywords
- pad
- fingerprint
- fingerprint module
- circuit board
- conductive layer
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Elimination Of Static Electricity (AREA)
- Image Input (AREA)
Abstract
The present invention discloses a kind of fingerprint module, including：Circuit board, including conductive part is used to isolate electrostatic with the isolation part for being located at the conductive part periphery, the isolation part is enclosed；Fingerprint chip, is located on the circuit board and electrically connects the conductive part；And quoit, the quoit is set in the outer circumferential side of the fingerprint chip.Fingerprint module of the present invention being capable of antistatic.Invention additionally discloses a kind of mobile terminal of the application fingerprint module.
Description
Technical field
The present invention relates to technical field of communication equipment, more particularly to a kind of fingerprint module and a kind of application fingerprint mould
The mobile terminal of group.
Background technology
The case ring of the fingerprint module of existing mobile terminal uses metal material, staff touching case ring or case ring mostly
Electrostatic, the electrostatic on case ring are easily produced in friction process can exert an adverse impact to fingerprint module.
The content of the invention
The technical problems to be solved by the invention be provide one kind can antistatic fingerprint module and a kind of application it is described
The mobile terminal of fingerprint module.
To achieve these goals, embodiment of the present invention is adopted the following technical scheme that：
On the one hand, there is provided a kind of fingerprint module, including：
Circuit board, including conductive part is used to isolate quiet with the isolation part for being located at the conductive part periphery, the isolation part is enclosed
Electricity；
Fingerprint chip, is located on the circuit board and electrically connects the conductive part；And
Quoit, the quoit is set in the outer circumferential side of the fingerprint chip.
On the other hand, a kind of mobile terminal, including fingerprint module as described above and housing are also provided, the housing includes
Through hole, the quoit is arranged in the through hole.
Compared to prior art, the invention has the advantages that：
Due to being provided with isolation part on the circuit board, the isolation part can isolate electrostatic, and the isolation part is enclosed and is located at
The conductive part periphery, therefore the isolation part can avoid the electrostatic in the external world from entering the conductive part, so as to avoid the external world
Circuit board described in electrostatic breakdown, so the fingerprint module can antistatic, functional reliability is high, long service life so that institute
State mobile terminal functional reliability high.
Brief description of the drawings
In order to illustrate more clearly of technical scheme, the accompanying drawing to be used needed for implementation method will be made below
Simply introduce, it should be apparent that, drawings in the following description are only some embodiments of the present invention, general for this area
For logical technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained such as these accompanying drawings.
Fig. 1 is a kind of structural representation of mobile terminal provided in an embodiment of the present invention.
Fig. 2 is a kind of structural representation of fingerprint module of mobile terminal shown in Fig. 1.
Fig. 3 is a kind of structural representation of circuit board of fingerprint module shown in Fig. 2.
Fig. 4 is the structural representation of the conductive layer of circuit board shown in Fig. 3.
Fig. 5 is the structural representation of another circuit board of fingerprint module shown in Fig. 2.
Fig. 6 is the first conductive layer of circuit board shown in Fig. 5 and the structural representation of the second conductive layer.
Specific embodiment
Below in conjunction with the accompanying drawings, embodiments herein is described.
Fig. 1 is referred to, the embodiment of the present invention provides a kind of mobile terminal 200, including fingerprint module 100 and housing 300.Institute
Stating housing 300 includes through hole 301, and the fingerprint module 100 is arranged in the through hole 301, to be fixed in the housing 300
Portion.The mobile terminal 200 can be the electronic equipments such as mobile phone, notebook computer, panel computer.The housing 300 can be
The upper casing or shell of the mobile terminal 200.
Also referring to Fig. 1 to Fig. 6, the fingerprint module 100, including circuit board 1, fingerprint chip 2 and quoit 3.
The circuit board 1 includes conductive part 11 and encloses the isolation part 12 for being located at the periphery of the conductive part 11, the isolation part 12 be used for every
From electrostatic.The fingerprint chip 2 is located on the circuit board 1 and electrically connects the conductive part 11.The quoit 3 is set in institute
State the outer circumferential side of fingerprint chip 2.The quoit 3 is arranged in the through hole 301, so that the fingerprint module 100 is fixed to institute
State housing 300.In other words, the quoit 3 encloses and sets out receiving space, and the fingerprint chip 2 is contained in the receiving space.
In the present embodiment, due to being provided with isolation part 12 on the circuit board 1, the isolation part 12 can isolate quiet
Electricity, the isolation part 12 is enclosed and is located at the periphery of the conductive part 11, therefore the isolation part 12 can avoid the electrostatic in the external world from entering
The conductive part 11, so as to avoid the external world electrostatic breakdown described in circuit board 1, so the fingerprint module 100 can antistatic,
Functional reliability is high, long service life so that the functional reliability of the mobile terminal 1 00 is high.
Optionally, the isolation part 12 is using conductive material and ground connection setting, the isolation part 12 and the conductive part 11
It is insulated from each other.The isolation part 12 is grounded so as to constitute Electro-static Driven Comb path, when the quoit 3 imports extraneous static, electrostatic
Ground is rapidly imported by the isolation part 12, so as to avoid extraneous static from entering the conductive part 11.
Gap is formed between the isolation part 12 and the conductive part 11, it is insulated from each other to realize.Or, the isolation part
Sandwiched insulating materials between 12 and the conductive part 11, it is insulated from each other to realize.
The conductive material includes but is not limited to metal material, such as copper, silver, aluminium etc..Optionally, the conductive material choosing
With having mercy on property conductive material.
Also referring to Fig. 2 to Fig. 4, in one embodiment, the circuit board 1 includes substrate layer 13 and is formed in institute
State the conductive layer 14 on substrate layer 13.The conductive part 11 includes multiple first pads 111 and electricity positioned at the conductive layer 14
The holding wire 112 of the multiple first pad 111 is connected, the multiple first pad 111 is used to electrically connect the fingerprint chip
2。
The isolation part 12 includes that positioned at the earth polar 121 of the conductive layer 14 earth polar 121 is enclosed and is located at the multiple the
The periphery of one pad 111 and the periphery of the holding wire 112.In this way, the earth polar 121 is grounded to form Electro-static Driven Comb path, it is described
When quoit 3 imports extraneous static, electrostatic rapidly imports ground by the earth polar 121, so as to avoid extraneous static from entering institute
State multiple first pads 111 and the holding wire 112.
Optionally, the substrate layer 13 is made of flexible material so that the circuit board 1 is flexible PCB.It is described
Flexible material includes but is not limited to polyimides (PI) or polyethylene terephthalate (Polyethylene
Terephthalate, PET), in order to set the conductive layer 14 on the substrate layer 13, and dead ring can be provided
Border, in order to realize the etching of the conductive layer 14.The conductive layer 14 is the copper foil layer of patterning.
The circuit board 1 also includes the first cover layer 15 and the second cover layer 16.First cover layer 15 is located at described
Away from the side of the substrate layer 13, first cover layer 15 covers the holding wire 112 and the earth polar 121 to conductive layer 14
And expose the multiple first pad 111.Second cover layer 16 is located at the substrate layer 13 away from the conductive layer 14
Side.Specifically, first cover layer 15 can be carried out using polyester material it is hot-forming.First cover layer 15 leads to
Paste adhesive is crossed on the conductive layer 14, so as to protect the holding wire 112 and the earth polar 121 not to be lost or damaged
It is bad.Meanwhile, by the way of paste adhesive, it is also possible to so that first cover layer 15 is tighter with the connection of the conductive layer 14
It is close, prevent first cover layer 15 from shifting or departing from and cannot be to exposing the holding wire 112 of first cover layer 15
Protected with the earth polar 121.Likewise, second cover layer 16 can be carried out using polyester material it is hot-forming.Institute
The second cover layer 16 is stated by paste adhesive in the substrate layer 13, so as to protect the substrate layer 13 not lost or damaged
It is bad.Meanwhile, by the way of paste adhesive, it is also possible to so that second cover layer 16 is tighter with the connection of the substrate layer 13
It is close, prevent second cover layer 16 from shifting or departing from.
Further, thickness and the multiple first pad of the thickness in the earth polar 121 more than the holding wire 112
111 thickness.Now, the earth polar 121 with the distance of the quoit 3 closer to electrostatic is more easy to be flowed to from the earth polar 121
Ground, the antistatic performance of the fingerprint module 100 is more preferably.Meanwhile, the earth polar 121 of larger thickness can be used as the circuit board
1 stiffening plate, the structural strength for increasing the circuit board 1.
Also referring to Fig. 2, Fig. 5 and Fig. 6, in another embodiment, the circuit board 1 includes substrate layer 13, position
In the substrate layer 13 towards the first conductive layer 17 of the side of fingerprint chip 2 and positioned at the substrate layer 13 away from the finger
Second conductive layer 18 of the side of line chip 2.The conductive part 11 includes multiple first pads positioned at first conductive layer 17
111st, positioned at multiple second pads 113 and the signal of the multiple second pad 113 of electrical connection of second conductive layer 18
Line 112, the multiple first pad 111 is used to electrically connect the fingerprint chip 2, and the multiple second pad 113 is corresponded
The multiple first pad 111 of ground electrical connection.
The isolation part 12 is included positioned at the first earth polar 122 of first conductive layer 17 and positioned at second conductive layer
Enclose and be located at the multiple periphery of first pad 111, second earth polar 123 in 18 the second earth polar 123, first earth polar 122
Enclose and be located at the multiple periphery of second pad 113 and the periphery of the holding wire 112.Now, first earth polar 122 is grounded and institute
State the second earth polar 123 to be grounded to form Electro-static Driven Comb path, first earth polar 122 avoids electrostatic from entering the multiple first weldering
Disk 111, second earth polar 123 avoids electrostatic from entering the multiple second pad 113 and the holding wire 112.The metal
When circle 3 imports extraneous static, electrostatic rapidly imports ground by first earth polar 122 and second earth polar 123, so as to keep away
Exempt from extraneous static into the multiple first pad 111, the multiple second pad 113 and the holding wire 112.
It should be understood that due to first conductive layer 17, second conductive layer 18 closer to the quoit 3, because
The Electro-static Driven Comb effect in this first earth polar 122 becomes apparent, and in one embodiment, also can only set first earth polar
122 and save second earth polar 123.Certainly, in another embodiment, also second earth polar 123 can be only set and is saved
Go to first earth polar 122.
The substrate layer 13 includes multiple vias 131, and the multiple via 131 is described more for electrically connecting correspondingly
Individual second pad 113 and the multiple first pad 111.Certainly, the substrate layer 13 may also include for electrically connecting described
One earth polar 122 and the via in second earth polar 123.
Optionally, the substrate layer 13 is made of flexible material so that the circuit board 1 is flexible PCB.It is described
Flexible material includes but is not limited to polyimides (PI) or polyethylene terephthalate (Polyethylene
Terephthalate, PET), in order to set the conductive layer 14 on the substrate layer 13, and dead ring can be provided
Border, in order to realize the etching of the conductive layer 14.First conductive layer 17 is the copper foil layer of patterning.Described second is conductive
Layer 18 is the copper foil layer of patterning.
The circuit board 1 also includes the first cover layer 15 and the second cover layer 16.First cover layer 15 is located at described
First conductive layer 17 away from the substrate layer 13 side, first cover layer 15 cover first earth polar 122 and exposure
Go out the multiple first pad 111.It is remote away from the substrate layer 13 that second cover layer 16 is located at second conductive layer 18
From side, second cover layer 16 covers the multiple second pad 113, the holding wire 112 and second ground
Pole 123.Specifically, first cover layer 15 can be carried out using polyester material it is hot-forming.First cover layer 15 leads to
Paste adhesive is crossed on first conductive layer 17, so as to protect first earth polar 122 not lost or damaged.Together
When, by the way of paste adhesive, it is also possible to so that first cover layer 15 is tighter with the connection of first conductive layer 17
It is close, prevent first cover layer 15 from shifting or departing from and cannot be to exposing first earth polar of first cover layer 15
122 are protected.Likewise, second cover layer 16 can be carried out using polyester material it is hot-forming.Second covering
Film 16 passes through paste adhesive in second conductive layer 18, so as to protect the multiple second pad 113, the holding wire 112
And second earth polar 123 is not lost or is damaged.Meanwhile, by the way of paste adhesive, it is also possible to so that described
Second cover layer 16 is tightr with the connection of second conductive layer 18, prevents second cover layer 16 from shifting or departing from.
Further, thickness of the thickness in first earth polar 122 more than the multiple first pad 111.Now, it is described
The distance of the first earth polar 122 and the quoit 3 is closer to electrostatic is more easy to flow to ground, the fingerprint mould from first earth polar 122
The antistatic performance of group 100 is more preferably.Meanwhile, first earth polar 122 of larger thickness can be used as the reinforcement of the circuit board 1
Plate, the structural strength for increasing the circuit board 1.
Also referring to Fig. 2 to Fig. 6, used as a kind of alternative embodiment, the fingerprint chip 2 includes multiple connection pads
21, the multiple connection pad 21 is located at the fingerprint chip 2 towards the side of the printed circuit board (PCB) 1, the multiple first
Pad 111 is corresponded with the multiple connection pad 21 and abutted.Now, the multiple first pad 111 is located at the fingerprint
Chip 2 is in the range of the upright projection on the circuit board 1.
In the present embodiment, abutted because the multiple first pad 111 is corresponded with the multiple connection pad 21,
Therefore the fingerprint chip 2 is inverted on the circuit board 1, and flip-assembled mode can reduce the entirety of the fingerprint module 100
Highly.Because the multiple first pad 111 is located at the fingerprint chip 2 in the range of the upright projection on the circuit board 1,
Therefore the multiple first pad 111 is distant with the quoit 3, can further avoid on the quoit 3
Electrostatic enters the multiple first pad 111.
The multiple first pad 111 can be by being welded to connect with the multiple connection pad 21.
Optionally, the holding wire 112 (and the multiple second pad 113) also is located at the fingerprint chip 2 described
In the range of upright projection on circuit board 1, so that the holding wire 112 (and the multiple second pad 113) and the gold
Category circle 3 it is distant, can further avoid electrostatic on the quoit 3 from entering the holding wire 112 (and the multiple
Second pad 113).
Fig. 2 is referred to, used as a kind of alternative embodiment, the fingerprint module 100 also includes stiffening plate 4, the stiffening plate 4
Positioned at the circuit board 1 away from the fingerprint chip 2 side.The stiffening plate 4 is fitted the circuit board 1, for increasing
The structural strength of circuit board 1 is stated, prevents the circuit board 1 from bending and damaging.Particularly, the circuit board 1 is flexible PCB
When, the strengthening action of the stiffening plate 4 is even more important.
Optionally, the stiffening plate 4 is set using metal material and ground connection.For example, the stiffening plate 4 is reinforcement steel plate.
Now, the stiffening plate 4 can also be used for absorbing electrostatic that the quoit 3 imported and discharge to ground.
Also referring to Fig. 1 and Fig. 2, used as a kind of alternative embodiment, the fingerprint module 100 also includes the first insulation division
5, first insulation division 5 is filled in the gap between the quoit 3 and the fingerprint chip 2.First insulation division 5 is adopted
It is made from an insulative material, for example insulating cement.
In the present embodiment, first insulation division 5 can isolate electrostatic, prevent the electrostatic of the quoit 3 from directly entering
Enter the fingerprint chip 2 and damage fingerprint chip 2, therefore first insulation division 5 can further improve the fingerprint module
100 antistatic performance.
It should be understood that the insulation division may also function as sealing function simultaneously, the quoit 3 and the fingerprint core are sealed
Gap between piece 2 such that it is able to avoid environmental liquids (such as user's sweat on hand) or dust from entering the mobile terminal
The parts damaged inside the mobile terminal 200 inside 200, play water proof and dust proof effect, it is ensured that the mobile terminal 200
The reliability of work.
Optionally, the quoit 3 includes body 31 and the flange 32 extended from the one end of the body 31, the body
31 enclose and set out the receiving space, and the flange 32 abuts the circuit board 1.
Further, also referring to Fig. 2 to Fig. 6, the fingerprint module 100 also includes the second insulation division 6, described second
Insulation division 6 is located between the flange 32 and the circuit board 1.Now, the quoit 3, second insulation division 6 and institute
State the common shape in the isolation part 12 (i.e. described earth polar 121, first earth polar 122 or second earth polar 123) of circuit board 1
Into coupled capacitor, the coupled capacitor can absorb electrostatic, and then discharges to ground, therefore, it is possible to prevent fingerprint mould described in electrostatic damage
Group 100.
One end that the body 31 connects the flange 32 is provided with chamfering 311, so as to increase the coupled capacitor.Meanwhile,
First insulation division 5 and second insulation division 6 are integrally formed, and the chamfering 311 makes first insulation division 5 with described
Sound construction, the reliability of the junction of two insulation division 6.
Fig. 2 is referred to, used as a kind of alternative embodiment, the fingerprint module 100 also includes cover plate 7, and the cover plate 7 is located at
Side of the fingerprint chip 2 away from the circuit board 1.The cover plate 7 covers the fingerprint chip 2, for protecting the finger
Line chip 2.The cover plate 7 is contained in the receiving space.Described first is filled between the cover plate 7 and the quoit 3 exhausted
Edge 5.
Optionally, the cover plate 7 is glass cover-plate or ceramic cover plate.
The embodiment of the present invention is described in detail above, specific case used herein to principle of the invention and
Implementation method is set forth, and the explanation of above example is only intended to help and understands the method for the present invention and its core concept；
Simultaneously for those of ordinary skill in the art, according to thought of the invention, can in specific embodiments and applications
There is change part, in sum, this specification content should not be construed as limiting the invention.
Claims (14)
1. a kind of fingerprint module, it is characterised in that including：
Circuit board, including conductive part is used to isolate electrostatic with the isolation part for being located at the conductive part periphery, the isolation part is enclosed；
Fingerprint chip, is located on the circuit board and electrically connects the conductive part；And
Quoit, the quoit is set in the outer circumferential side of the fingerprint chip.
2. fingerprint module as claimed in claim 1, it is characterised in that the isolation part is set using conductive material and ground connection,
The isolation part is insulated from each other with the conductive part.
3. fingerprint module as claimed in claim 2, it is characterised in that the circuit board includes substrate layer and is formed in the base
Conductive layer on material layer, the conductive part includes multiple first pads and electrical connection the multiple first positioned at the conductive layer
The holding wire of pad, the multiple first pad is used to electrically connect the fingerprint chip.
4. fingerprint module as claimed in claim 3, it is characterised in that the isolation part is included positioned at the ground of the conductive layer
Enclose and be located at the multiple first pad peripheral and the holding wire periphery in pole, the earth polar.
5. fingerprint module as claimed in claim 2, it is characterised in that the circuit board includes substrate layer, positioned at the base material
Layer is towards the first conductive layer of the fingerprint chip-side and positioned at the substrate layer away from the second of the fingerprint chip-side
Conductive layer, the conductive part is including multiple first pads positioned at first conductive layer, positioned at many of second conductive layer
The holding wire of individual second pad and the multiple second pad of electrical connection, the multiple first pad is used to electrically connect the finger
Line chip, the multiple second pad electrically connects the multiple first pad correspondingly.
6. fingerprint module as claimed in claim 5, it is characterised in that the isolation part is included positioned at first conductive layer
Enclose and be located at the multiple first pad week in first earth polar and the second earth polar positioned at second conductive layer, first earth polar
Enclose and be located at the multiple second pad peripheral and the holding wire periphery in side, second earth polar.
7. fingerprint module as claimed in claim 5, it is characterised in that the substrate layer includes multiple vias, the multiple mistake
Hole is used to electrically connect the multiple second pad and the multiple first pad correspondingly.
8. the fingerprint module as described in any one of claim 3 to 7, it is characterised in that the fingerprint chip includes multiple connection
Pad, the multiple connection pad is located at the fingerprint chip towards the side of the printed circuit board (PCB), the multiple first weldering
Disk is corresponded with the multiple connection pad and abutted.
9. the fingerprint module as described in any one of claim 3 to 7, it is characterised in that the fingerprint module also includes stiffening plate,
The stiffening plate is located at side of the circuit board away from the fingerprint chip.
10. fingerprint module as claimed in claim 9, it is characterised in that the stiffening plate is set using metal material and ground connection.
11. fingerprint modules as claimed in claim 1, it is characterised in that the fingerprint module also includes the first insulation division, described
First insulation division is filled in the gap between the quoit and the fingerprint chip.
The 12. fingerprint module as described in claim 1 or 11, it is characterised in that the quoit includes body and from described
The flange that body one end is extended, the body encloses and sets out the receiving space, and the flange abuts the circuit board.
13. fingerprint modules as claimed in claim 12, it is characterised in that the fingerprint module also includes the second insulation division, institute
The second insulation division is stated to be located between the flange and the circuit board.
14. a kind of mobile terminals, it is characterised in that including fingerprint module and housing as described in any one of claim 1~13,
The housing includes through hole, and the quoit is arranged in the through hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710041721.0A CN106803079B (en) | 2017-01-20 | 2017-01-20 | Fingerprint module and mobile terminal |
| PCT/CN2018/071934 WO2018133707A1 (en) | 2017-01-20 | 2018-01-09 | Fingerprint module and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710041721.0A CN106803079B (en) | 2017-01-20 | 2017-01-20 | Fingerprint module and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106803079A true CN106803079A (en) | 2017-06-06 |
| CN106803079B CN106803079B (en) | 2020-08-21 |
Family
ID=58987202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710041721.0A Active CN106803079B (en) | 2017-01-20 | 2017-01-20 | Fingerprint module and mobile terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106803079B (en) |
| WO (1) | WO2018133707A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108304771A (en) * | 2017-12-22 | 2018-07-20 | 维沃移动通信有限公司 | A kind of fingerprint module fixing means, mobile terminal |
| WO2018133707A1 (en) * | 2017-01-20 | 2018-07-26 | 广东欧珀移动通信有限公司 | Fingerprint module and mobile terminal |
| CN108764104A (en) * | 2018-05-22 | 2018-11-06 | 宇龙计算机通信科技(深圳)有限公司 | A kind of fingerprint recognition component and mobile terminal |
| CN111753779A (en) * | 2020-06-29 | 2020-10-09 | 维沃移动通信有限公司 | Key structure and electronic equipment |
| CN112232112A (en) * | 2020-09-03 | 2021-01-15 | 江西合力泰科技有限公司 | Fingerprint module with strong antistatic property |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113065389A (en) * | 2021-02-03 | 2021-07-02 | 深圳阜时科技有限公司 | Fingerprint chip, fingerprint chip module and electronic equipment |
| CN114120837B (en) * | 2021-11-30 | 2024-01-30 | 昆山国显光电有限公司 | Display module and mobile terminal |
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| CN111753779A (en) * | 2020-06-29 | 2020-10-09 | 维沃移动通信有限公司 | Key structure and electronic equipment |
| CN112232112A (en) * | 2020-09-03 | 2021-01-15 | 江西合力泰科技有限公司 | Fingerprint module with strong antistatic property |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106803079B (en) | 2020-08-21 |
| WO2018133707A1 (en) | 2018-07-26 |
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