CN106654818B - A kind of high power solid state laser heat management system - Google Patents
A kind of high power solid state laser heat management system Download PDFInfo
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- CN106654818B CN106654818B CN201611198177.2A CN201611198177A CN106654818B CN 106654818 B CN106654818 B CN 106654818B CN 201611198177 A CN201611198177 A CN 201611198177A CN 106654818 B CN106654818 B CN 106654818B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
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- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
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Abstract
The invention discloses a kind of high power solid state laser heat management systems.The system includes: sequentially connected first cooling chamber, the first filling liquid chamber, the second filling liquid chamber and the second cooling chamber；Wherein, first refrigeration unit, the first cooling chamber, the first filling liquid chamber and the second refrigeration unit, the second cooling chamber, the second filling liquid chamber are using laser gain medium as the symmetrical structure of center axis, the filling liquid of any side of symmetrical structure is intracavitary to be filled with liquid metal, and the heat of laser gain medium passes to liquid metal by heat transfer；Refrigeration working medium is filled in cooling chamber, refrigeration working medium is undergone phase transition in cooling chamber to absorb and conduct the heat to cooling chamber by liquid metal；The refrigeration working medium undergone phase transition is cooled to boiling point or less and is again introduced into cooling chamber by refrigeration unit.This invention removes solders in conventional bonding technique and the unmatched problem of gain media thermal expansion coefficient, and can be farthest by the heat loss of laser gain medium into external environment.
Description
Technical field
The present invention relates to field of electronic devices, in particular to a kind of high power solid state laser heat management system.
Background technique
In high power solid state laser system, the pump light overwhelming majority that laser gain medium absorbs is converted to waste heat deposition
Inside gain media, gain media temperature is caused to increase.The characteristics of due to external cooling and pump light Gaussian Profile, gain
There are biggish temperature gradient, corresponding thermal stress and thermal strain and the changes of gain media refractive index for media interior most
Lead to the reduction of laser output power and the decline of beam quality eventually.In the development course of laser, fuel factor problem is always
It is the major obstacle for restricting laser and developing to ultra high power and quality light beam quality direction.
In world wide, the type of cooling that solid state laser is widely used be by welding manner by gain media with it is heat sink
It is welded as a whole, then provides the lower deionized water of temperature refrigeration equipment and take away laser generation in a manner of forced convertion
Heat.Can not overcome the problems, such as to be always in which to weld and need to use particular solder, and the thermal expansion coefficient of solder without
Method and gain media exactly match, and the thermal contact resistance welded is considerably beyond acceptable range, it is therefore necessary to use novel heat
Boundary material and heat-seal technique and more efficient radiating mode meet the cooling needs of laser.
Summary of the invention
In order to meet the needs of laser is cooling, the present invention provides a kind of high power solid state laser heat management systems.
A kind of high power solid state laser heat management system provided by the invention, comprising: sequentially connected first cooling chamber,
First filling liquid chamber, the second filling liquid chamber and the second cooling chamber；
First cooling chamber and the first filling liquid chamber share cavity wall A, the first filling liquid chamber and second filling liquid
Chamber shares cavity wall B, and the second filling liquid chamber and second cooling chamber share cavity wall C, wherein first refrigeration unit, the
One cooling chamber, the first filling liquid chamber and second refrigeration unit, the second cooling chamber, the second filling liquid chamber are using cavity wall B as center axis
Symmetrical structure, the cavity wall B be laser gain medium；
The filling liquid of any side of symmetrical structure is intracavitary to be filled with liquid metal, and the heat of the laser gain medium is logical
It crosses heat transfer and passes to the liquid metal；The heat of absorption is passed through the filling liquid chamber and the cooling chamber by the liquid metal
Contact surface pass to the cooling chamber；Refrigeration working medium is filled in the cooling chamber, the refrigeration working medium is in the cooling chamber
It inside undergoes phase transition to absorb and be conducted by the liquid metal to the heat in the cooling chamber；Phase will occur for the refrigeration unit
The refrigeration working medium of change is cooled to boiling point or less and is again introduced into cooling chamber, so that the refrigeration working medium is in steady flow condition
And it can be recycled.
The present invention has the beneficial effect that:
The embodiment of the present invention serves as laser gain medium and heat sink hot interface using liquid metal, increases hot interface
The capacity of heat transmission, while eliminating solder and the unmatched problem of gain media thermal expansion coefficient, Er Qieke in conventional bonding technique
Laser gain medium temperature is effectively reduced, subtracts farthest by the heat loss of laser gain medium into external environment
The thermal stress deformation because of caused by non-uniform temperature of small laser gain medium improves laser beam quality and output power.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the high power solid state laser heat management system of the embodiment of the present invention；
Fig. 2 is the top view of laser gain medium in the embodiment of the present invention；
Wherein, the 1, first refrigeration unit；2, the first cooling chamber；3, the first filling liquid chamber；4, the second filling liquid chamber；5, second is cooling
Chamber；6, the second refrigeration unit；7, metal porous medium；8, wire spring；9, laser gain medium.
Specific embodiment
Exemplary embodiments of the present disclosure are described in more detail below with reference to accompanying drawings.Although showing the disclosure in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here
It is limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure
It is fully disclosed to those skilled in the art.
In order to meet the needs of laser is cooling, the present invention provides a kind of high power solid state laser heat management system,
Below in conjunction with attached drawing and embodiment, the present invention will be described in further detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the present invention, does not limit the present invention.
According to an embodiment of the invention, providing a kind of high power solid state laser heat management system, Fig. 1 is of the invention real
The cross-sectional view of the high power solid state laser heat management system of example is applied, as shown in Figure 1, high power according to an embodiment of the present invention is solid
Body laser heat management system includes: sequentially connected first refrigeration unit 1, the first cooling chamber 2, the first filling liquid chamber 3, second fills
Sap cavity 4, the second cooling chamber 5 and the second refrigeration unit 6, are below described in detail the modules of the embodiment of the present invention.
Specifically, first cooling chamber 2 shares cavity wall A, the first filling liquid chamber 3 and institute with the first filling liquid chamber 3
It states the second filling liquid chamber 4 and shares cavity wall B, the second filling liquid chamber 5 shares cavity wall C with second cooling chamber 5, wherein described the
One refrigeration unit 1, the first cooling chamber 2, the first filling liquid chamber 3 and second refrigeration unit 6, the second cooling chamber 5, the second filling liquid chamber
4 is, using cavity wall B as the symmetrical structure of center axis, the cavity wall B are laser gain medium；
The filling liquid of any side of symmetrical structure is intracavitary to be filled with liquid metal, the heat of the laser gain medium one side
Amount passes to the liquid metal by heat transfer；The liquid metal by the heat of absorption by the filling liquid chamber with it is described cold
But the contact surface of chamber passes to the cooling chamber；Refrigeration working medium is filled in the cooling chamber, the refrigeration working medium is described cold
Intracavitary to undergo phase transition to absorb and be conducted by the liquid metal to the heat in the cooling chamber；The refrigeration unit will be sent out
The refrigeration working medium of raw phase transformation is cooled to boiling point or less and is again introduced into cooling chamber, so that the refrigeration working medium is in steady flow
It state and can be recycled.
Laser gain medium is located between two duplicate cooling structures, guarantees the heat dissipation of laser gain medium two sides
Uniformity.Liquid metal be filled in served as in filling liquid chamber laser gain medium and copper it is heat sink between hot interface.In this hair
In bright, the structure being made of the first cooling chamber 2, the first filling liquid chamber 3, the second filling liquid chamber 4 and the second cooling chamber 5 is referred to as heat sink, tool
Body, it is described it is heat sink can for copper it is heat sink.
Liquid metal is filled in the i.e. described first filling liquid chamber 3, the heat of the laser gain medium one side is passed by heat
It leads and passes to the liquid metal；The heat of absorption is passed to first cooling by the cavity wall A by the liquid metal
Chamber 2；Be filled with refrigeration working medium in first cooling chamber 2, the refrigeration working medium undergone phase transition in first cooling chamber 2 with
Absorption is conducted by the liquid metal to the heat in first cooling chamber 2；First refrigeration unit 1 will be undergone phase transition
Refrigeration working medium be cooled to boiling point or less and be again introduced into the first cooling chamber 2 so that the refrigeration working medium is in steady flow
It state and can be recycled；
Second filling liquid intracavitary 4 is filled with the liquid metal, and the heat of the laser gain medium another side passes through
Heat transfer passes to the liquid metal；The heat of absorption is passed to described second by the cavity wall C by the liquid metal
Cooling chamber 5；It is filled with the refrigeration working medium in second cooling chamber 5, the refrigeration working medium is sent out in second cooling chamber 5
Raw phase transformation is conducted by the liquid metal to the heat in second cooling chamber 5 with absorbing；Second refrigeration unit 6 will
The refrigeration working medium undergone phase transition is cooled to boiling point or less and is again introduced into the second cooling chamber 5, so that the refrigeration working medium is in
It steady flow condition and can be recycled.
The liquid metal is that in liquid and have the special material of high thermal conductivity coefficient, good conductive ability under a kind of room temperature
Material.Specifically, the fusing point of the liquid metal (such as gallium, gallium-indium alloy etc.) is 20~30 DEG C in the present invention, and will not be with
The filling liquid chamber chemically reacts.
Specifically, the chamber of the filling liquid chamber (including the first filling liquid chamber and the second filling liquid chamber) in any side of the symmetrical structure
Setting vacuumizes hole and liquid metal filling hole on wall；Low vacuum is pumped by filling liquid is intracavitary by vacuumizing hole, then passes through liquid
Liquid metal is filled into filling liquid chamber by metal-filled holes.
Specifically, it further includes that be suspended in the filling liquid intracavitary that the filling liquid of any side of symmetrical structure is intracavitary, not with fill
The metal porous medium that the cavity wall of sap cavity is in contact.
More specifically, the metal porous medium is connected by several one metal wire springs and the cavity wall in the filling liquid chamber
It connects, i.e., one end of the described wire spring is welded on the metal porous medium, and the other end is welded on the chamber of the filling liquid chamber
On wall, to make metal porous dielectric suspension in filling liquid chamber without contacting with the side wall of filling liquid chamber and bottom surface.
More specifically, the metal porous medium can be a monolith porous material, or muti-piece small size is more
Porous materials, and an entirety is interconnected as by wire.
Specifically, the metal porous medium can have high thermal conductivity for metal foam, metallic fiber, metal braid etc.
The porous media of coefficient, macroporosity.
More specifically, the diameter of the wire spring is nanoscale or micron order (10 microns or less).
Specifically, design evaporating temperature of the refrigeration working medium (such as R152a, R134a etc.) in refrigeration unit is 15
~20 DEG C.
Specifically, the geometric configuration of the laser gain medium is lath-shaped or disk shape.
Fig. 2 is the top view of laser gain medium in the embodiment of the present invention, as described in Figure 2, the laser gain medium packet
Include the crystal block section of rare earth doped element and the undoped rare earth element positioned at the rare earth doped element crystal block section surrounding
Crystal block section, the laser gain medium are described undoped with the contact surface of the first filling liquid chamber and the second fliud flushing chamber
The crystal block section of rare earth element.The rare earth element includes Nd, Er, Yb etc..
Wherein, in the crystal block section of the rare earth doped element, the doping concentration of rare earth element is in crystal width and thickness
Uniformity on direction then first increases on crystal length direction and reduces again, and using the median plane on length direction as the plane of symmetry
It is symmetric.
Static shape is in when not heated in embodiments of the present invention in the filling liquid chamber of any side of liquid metal symmetrical structure
State.Preferably, receiving containing surfactant package in the liquid metal of the filling liquid chamber filling of any side of the symmetrical structure
Rice magnetic-particle；It further include the connecting pipeline and electricity being connect with the filling liquid chamber in the cooling chamber of any side of symmetrical structure
Magnetic pumping；The electromagnetic pump drives the liquid metal containing nano magnetic particle by the connecting pipeline in the filling liquid chamber
It is circulated in cooling chamber.
It further include the first connecting pipeline being connect with the first filling liquid chamber 3 and the first electricity in i.e. described first cooling chamber 2
Magnetic pumping, first electromagnetic pump drive the liquid metal containing nano magnetic particle to flow in first connecting pipeline
It is dynamic；It further include the second connecting pipeline and the second electromagnetic pump being connect with the second filling liquid chamber 4, institute in second cooling chamber 5
Stating the second electromagnetic pump drives the liquid metal containing nano magnetic particle to flow in second connecting pipeline.
Specifically, the cavity wall of any side cooling chamber of symmetrical structure is cellular, needle rib shape, cylindric or ripple
Shape micro-structure；Or the cavity wall of any side cooling chamber of symmetrical structure adheres to carbon nanotube cilium array.I.e. described first
The cavity wall of cooling chamber 2 and second cooling chamber 5 is cellular, needle rib shape, cylindric or corrugated micro-structure；Or it is described
The cavity wall of first cooling chamber 2 and second cooling chamber 5 adheres to carbon nanotube cilium array.
Specifically, the cooling chamber of any side of symmetrical structure is provided with the inlet and outlet that refrigeration working medium flows in and out.
The refrigeration unit of any side of symmetrical structure can be mechanical compression type refrigeration unit, may be absorption
Refrigeration unit or it is other all can guarantee to circulate refrigeration working medium and undergo phase transition absorption heat in cooling chamber
The refrigeration unit of amount.
A kind of working principle of the heat management system of high power solid state laser provided in an embodiment of the present invention is as follows: when solid
In the body laser course of work, the heat in gain media passes to the liquid metal contacted, liquid gold by heat transfer
Belong to because faint flowing will occur for uneven heating, causes wire spring to vibrate, then drive metal porous vibration of media, from
And accelerate heat in the conduction of liquid metal internal.Refrigeration when heat passes to cooling chamber by liquid metal, in cooling chamber
Evaporation or boiling phase transformation occur for working medium, realize efficient heat transfer, the refrigeration working medium undergone phase transition is cooled to boiling point by refrigeration unit
Hereinafter, and be fed again into cooling chamber, with provide continue efficient cooling effect.
Preferably, can be added in liquid metal surfactant package nano magnetic particle (such as Fe/Co/Ni and
Its alloying pellet, Fe-N compound particle etc.), inlet and outlet are set on filling liquid cavity wall face, and add connecting pipeline and electromagnetic pump,
Liquid metal flows are driven, the heat transfer of liquid metal and gain medium facet on the one hand can be increased, make the heat of gain media
It is transmitted in liquid metal as early as possible, on the other hand connecting pipeline can be arranged inside cooling chamber, liquid metal can be absorbed
Partial heat be directly passed to refrigeration working medium, increase heat and be transmitted to the approach of refrigeration working medium from liquid metal, to accelerate
Rate of heat transfer.
A kind of heat management system of high power solid state laser provided in an embodiment of the present invention has the advantage that 1, utilizes
Liquid metal serves as gain media and the heat sink hot interface of copper, increases the capacity of heat transmission at hot interface, while eliminating traditional weldering
Connect solder and the unmatched problem of gain media thermal expansion coefficient in technique；2, in the heat sink closing chamber of copper high thermal conductivity coefficient metal
Porous media can accelerate the conduction of liquid metal internal heat, and the heat in gain media is promoted to pass as early as possible by liquid metal
The refrigeration working medium being delivered in cooling chamber；3, when the liquid metal in the heat sink closing chamber of copper because faint flowing occurs for non-uniform temperature
When, the outstanding wire spring for tiing up metal porous medium will be caused, microvibration occurs, and then drives the vibration of metal porous medium,
Accelerate the mixing of the liquid metal of different temperatures in closing chamber；4, after the refrigeration working medium absorption heat in the heat sink cooling chamber of copper directly
Evaporation or boiling, heat transfer efficiency are high；5, refrigeration unit can guarantee that refrigeration working medium is in flow regime always, and enter cooling chamber
Shi Wendu is lower than its boiling point, guarantees the stabilization clean boot of entire cooling system, there is no startup separators；6, the heat management
Refrigeration working medium in system can be recycled, and not will cause the harm of environment.
The above description is only an embodiment of the present invention, is not intended to restrict the invention, for those skilled in the art
For member, the invention may be variously modified and varied.All within the spirits and principles of the present invention, it is made it is any modification,
Equivalent replacement, improvement etc., should be included within scope of the presently claimed invention.
Claims (10)
1. a kind of high power solid state laser heat management system characterized by comprising sequentially connected first refrigeration unit,
First cooling chamber, the first filling liquid chamber, the second filling liquid chamber, the second cooling chamber and the second refrigeration unit；
First cooling chamber and the first filling liquid chamber share cavity wall A, and the first filling liquid chamber and the second filling liquid chamber are total
With cavity wall B, the second filling liquid chamber and second cooling chamber share cavity wall C, wherein first refrigeration unit, first cold
But chamber, the first filling liquid chamber and second refrigeration unit, the second cooling chamber, the second filling liquid chamber are using cavity wall B as pair of center axis
Claim structure, the cavity wall B is laser gain medium；
The filling liquid of any side of symmetrical structure is intracavitary to be filled with liquid metal, and the heat of the laser gain medium passes through heat
Pass to the liquid metal；The liquid metal connecing by the filling liquid chamber and the cooling chamber by the heat of absorption
Contacting surface passes to the cooling chamber；Refrigeration working medium is filled in the cooling chamber, the refrigeration working medium is sent out in the cooling chamber
Raw phase transformation is conducted by the liquid metal to the heat in the cooling chamber with absorbing；The refrigeration unit will be undergone phase transition
Refrigeration working medium is cooled to boiling point or less and is again introduced into cooling chamber so that the refrigeration working medium be in steady flow condition and
It can be recycled.
2. high power solid state laser heat management system as described in claim 1, which is characterized in that
It further includes being suspended in that the filling liquid is intracavitary that the filling liquid of any side of symmetrical structure is intracavitary, not with the cavity wall phase of filling liquid chamber
The metal porous medium of contact.
3. high power solid state laser heat management system as claimed in claim 2, which is characterized in that the metal porous medium
It is connect by several one metal wire springs with the cavity wall of the filling liquid chamber.
4. high power solid state laser heat management system as claimed in claim 3, which is characterized in that the wire spring
Diameter is nanoscale or micron order.
5. high power solid state laser heat management system as described in claim 1, which is characterized in that the liquid metal melts
Point is 20~30 DEG C, and will not be chemically reacted with the filling liquid chamber；Temperature is evaporated in the design of refrigeration working medium in the cooling chamber
Degree is 15~20 DEG C.
6. high power solid state laser heat management system as described in claim 1, which is characterized in that the laser gain medium
Geometric configuration be lath-shaped or disk shape.
7. high power solid state laser heat management system as described in claim 1, which is characterized in that the laser gain medium
Crystal block section including rare earth doped element and the undoped rare earth element positioned at the rare earth doped element crystal block section surrounding
Crystal block section, the contact surface of the laser gain medium and the filling liquid chamber of any side of the symmetrical structure is described undoped
The crystal block section of rare earth element.
8. high power solid state laser heat management system as claimed in claim 7, which is characterized in that the rare earth doped element
Crystal block section in, the doping concentration of rare earth element uniformity on crystal width and thickness direction, in crystal length direction
Upper first increase reduces again, and is symmetric using the median plane on length direction as the plane of symmetry.
9. high power solid state laser heat management system as described in claim 1, which is characterized in that the symmetrical structure is any
Nano magnetic particle containing surfactant package in the liquid metal of the filling liquid chamber filling of side；
It further include the connecting pipeline and electromagnetic pump being connect with the filling liquid chamber in the cooling chamber of any side of symmetrical structure；Institute
Stating electromagnetic pump drives the liquid metal containing nano magnetic particle by the connecting pipeline in the filling liquid chamber and cooling
It is circulated in chamber.
10. high power solid state laser heat management system as described in claim 1, which is characterized in that
The cavity wall of any side cooling chamber of symmetrical structure is cellular, needle rib shape, cylindric or corrugated micro-structure；Or
The cavity wall of any side cooling chamber of symmetrical structure described in person adheres to carbon nanotube cilium array.
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| CN201611198177.2A CN106654818B (en) | 2016-12-22 | 2016-12-22 | A kind of high power solid state laser heat management system |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108233155B (en) * | 2018-01-11 | 2020-03-27 | 中国电子科技集团公司第十一研究所 | Solid laser cooling heat sink |
| CN111711054A (en) * | 2020-06-24 | 2020-09-25 | 中国工程物理研究院激光聚变研究中心 | Novel laser amplifier |
| CN113889836B (en) * | 2021-11-01 | 2023-05-23 | 上海科技大学 | High-precision multi-section cooling type deflection mirror |
| CN115347440B (en) * | 2022-10-20 | 2023-03-24 | 安徽华创鸿度光电科技有限公司 | Slab solid laser crystal air-flotation heat sink |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2922219Y (en) * | 2006-06-22 | 2007-07-11 | 广州工业发展集团有限公司 | Cooling temperature controlling device for solid laser device |
| CN101640366A (en) * | 2009-07-03 | 2010-02-03 | 西安电子科技大学 | Heat radiating method of crystal bar of pumping solid laser at end surface of laser diode |
| CN103928826A (en) * | 2014-04-04 | 2014-07-16 | 中国科学院理化技术研究所 | High-efficient refrigerated large face pump lath laser module |
| CN104124605A (en) * | 2014-07-02 | 2014-10-29 | 中国电子科技集团公司第十一研究所 | Cooling device of high-power solid laser |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070104233A1 (en) * | 2005-11-09 | 2007-05-10 | Jan Vetrovec | Thermal management system for high energy laser |
-
2016
- 2016-12-22 CN CN201611198177.2A patent/CN106654818B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2922219Y (en) * | 2006-06-22 | 2007-07-11 | 广州工业发展集团有限公司 | Cooling temperature controlling device for solid laser device |
| CN101640366A (en) * | 2009-07-03 | 2010-02-03 | 西安电子科技大学 | Heat radiating method of crystal bar of pumping solid laser at end surface of laser diode |
| CN103928826A (en) * | 2014-04-04 | 2014-07-16 | 中国科学院理化技术研究所 | High-efficient refrigerated large face pump lath laser module |
| CN104124605A (en) * | 2014-07-02 | 2014-10-29 | 中国电子科技集团公司第十一研究所 | Cooling device of high-power solid laser |
Non-Patent Citations (2)
| Title |
|---|
| Forced convective cooling of a high-power solid-state laser slab;J.R.Wang et al.;《Applied Thermal Engineering》;20061231;第26卷;第549-558页 |
| 相变散热技术在小型高效半导体抽运激光器中的应用研究;程勇等;《中国激光》;20160131;第43卷(第1期);第0102005(1)页-第0102005(7)页 |
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