CN106553453A - Hot bubble type ink jet printhead and preparation method thereof - Google Patents
Hot bubble type ink jet printhead and preparation method thereof Download PDFInfo
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- CN106553453A CN106553453A CN201611108856.6A CN201611108856A CN106553453A CN 106553453 A CN106553453 A CN 106553453A CN 201611108856 A CN201611108856 A CN 201611108856A CN 106553453 A CN106553453 A CN 106553453A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 119
- 238000010438 heat treatment Methods 0.000 claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 claims abstract description 50
- 239000002184 metal Substances 0.000 claims abstract description 50
- 239000007788 liquid Substances 0.000 claims abstract description 33
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 33
- 239000001301 oxygen Substances 0.000 claims description 33
- 229910052760 oxygen Inorganic materials 0.000 claims description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 238000005516 engineering process Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- 230000004888 barrier function Effects 0.000 claims description 14
- 239000002994 raw material Substances 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 8
- 230000002209 hydrophobic effect Effects 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000011946 reduction process Methods 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 22
- 238000005530 etching Methods 0.000 description 14
- 239000010408 film Substances 0.000 description 9
- 229910052715 tantalum Inorganic materials 0.000 description 9
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000001259 photo etching Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000003860 storage Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 229910003862 HfB2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910004490 TaAl Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- -1 Aluminium germanium Chemical group 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/145—Arrangement thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The present invention relates to a kind of hot bubble type ink jet printhead and preparation method thereof, it is applied to inkjet printing, the hot bubble type ink jet printhead includes substrate and the cover plate being bonded on substrate, enclose to set between the substrate and cover plate and be formed with the black chamber for storing black liquid, the ink-feed channel with ink chamber UNICOM is formed through on the substrate, the nozzle with ink chamber UNICOM is formed through on the cover plate, it is provided with the substrate to the heating element heater of the black liquid heating in ink chamber, the hot bubble type ink jet printhead also include with the heating element heater be electrically connected with drive circuit and with the heating element heater, the metal electrode that drive circuit is electrically connected with.
Description
Technical field
The present invention relates to a kind of hot bubble type ink jet printhead and preparation method thereof, is applied to inkjet printing.
Background technology
Hot bubble type ink jet printer mainly allows ink by thin nozzle, in the presence of heating pulse, on shower nozzle
Temp of heating element accumulation rises so as to which printing ink solvent nearby vaporizes the numerous minute bubbles of generation quantity, within the heat time
Bubble volume is continuously increased, and during to certain degree, produced pressure will be such that ink ejects from nozzle, eventually arrive at and hold
Print thing surface, reproduces graph text information.
Existing bubble ink-jet printing head mostly using surface sacrificial layer technology making black chamber, i.e.,：In adding thermal resistance
One layer of sacrifice layer is first grown using Surface Machining (such as plating, spin coating, thin film deposition etc.) technology, then, is made on sacrifice layer
Nozzle and side wall, discharge removal sacrifice layer afterwards again to form black chamber, but, conventionally, as receiving Surface Machining work
The restriction of skill, for up to more than ten microns of the thickness of sacrifice layer, and the uniformity of sacrificial layer thickness is also poor, so that on black chamber
The surface irregularity of wall, easily causes gathering for ink particles/dirt, and the height in black chamber is also limited by sacrificial layer thickness, difficult
To process the black chamber of high depth.Such as, Jae-Duk Lee prepare nickel using electroplating technology to make sacrifice layer (JOURNAL OF
MICROELECTROMECHANICAL SYSTEMS, VOL.8, NO.3, SEPTEMBER1999), but, because of the thickness of electroless nickel layer
Uniformity is poor, and its surface is relatively rough, the roof out-of-flatness in the black chamber for subsequently being formed, and easily causes ink particles/dirt
Gather, or even the blocking of ink channel.And for example, Yan Wang make sacrifice layer using LPCVD 10 microns of thick poly-Ge of deposit
(J.Micro/Nanolith. MEMS MOEMS 6_4_, 043009_Oct-Dec 2007_), which is sacrificial in order to eliminate poly-Ge
The roughening of domestic animal layer surface, is ground using CMP, obtains smooth sacrificial layer surface.But prepared black chamber
Highly (only 10 microns) are limited by sacrificial layer thickness, it is therefore difficult to process the black chamber of high depth.
The content of the invention
It is an object of the invention to provide a kind of hot bubble type ink jet printhead, which is not limited by surface processing technique,
Which can adjust deep silicon etching technique according to actual process demand in processing, to obtain the ink of even curface and desired height
Chamber.
To reach above-mentioned purpose, the present invention provides following technical scheme：A kind of hot bubble type ink jet printhead, including substrate
With the cover plate being bonded on substrate, enclose to set between the substrate and cover plate and be formed with the black chamber for storing black liquid, the substrate
On be formed through ink-feed channel with ink chamber UNICOM, the spray with ink chamber UNICOM is formed through on the cover plate
Mouth, is provided with the substrate to the heating element heater of the black liquid heating in ink chamber, and the hot bubble type ink jet printhead is also
The metal electricity being electrically connected with including the drive circuit being electrically connected with the heating element heater and with the heating element heater, drive circuit
Pole.
Further：It is provided with heat-conducting layer on the substrate, the heat-conducting layer abuts in the heating element heater periphery, and extremely
Less positioned at the side of ink chamber.
Further：The cover plate has the bottom surface and top surface being disposed opposite to each other, and towards substrate, the cover plate is certainly for the bottom surface
Its bottom surface is recessed upwards and is formed with upper cavity, and the upper cavity is sealed to form ink chamber by the substrate；Or, the lining
Bottom has the first surface and second surface being disposed opposite to each other, and, towards cover plate, the substrate is from its first surface for the first surface
Depression is formed with lower chamber downwards, and the lower chamber is sealed to form ink chamber by the cover plate；Or, the cover plate has
The bottom surface being disposed opposite to each other and top surface, towards substrate, the cover plate is recessed from its bottom surface upwards and is formed with upper cavity, institute for the bottom surface
State substrate and there is the first surface that is disposed opposite to each other and second surface, the first surface towards cover plate, the substrate from its first
Depression is formed with lower chamber downwards on surface, and ink chamber is put together by the upper cavity and lower chamber.
Further：The cover plate has the bottom surface that is disposed opposite to each other and top surface, the bottom surface towards substrate, the cover plate
Top surface is deposited with hydrophobic layer.
Present invention also offers a kind of preparation method of hot bubble type ink jet printhead, as follows：
S1：Substrate is provided, the substrate has the first surface and second surface being disposed opposite to each other, the first of the substrate
Drive circuit, heating element heater and metal electrode are formed on surface, the metal electrode is electrically connected with heating element heater, drive circuit
Connect；Ink-feed channel figure is formed in the top of the first surface of the substrate, then deposit forms a layer insulating；
S2：Cover plate is provided, the cover plate has the bottom surface and top surface being disposed opposite to each other, and the cover plate is recessed towards top surface from its bottom surface
Fall into and be formed with upper cavity, the top surface of the cover plate is provided with oxygen buried layer；
S3：By the underrun bonding technology and substrate bonding of the cover plate, the first surface of the substrate will be described on
Cavity covers to form black chamber to enclose to set, and the ink-feed channel figure is located at the underface in black chamber；
S4：By the use of oxygen buried layer as mask to form nozzle, and form metal electrode passage to expose metal electrode, institute's shape
Into nozzle and Mo Qiang UNICOMs；
S5：Ink-feed channel is formed according to ink-feed channel figure；
S6：The insulating barrier positioned at black chamber side is removed so that ink-feed channel and Mo Qiang UNICOMs, remove oxygen buried layer.
Further：Step S1 specifically includes following steps：
S11：Substrate is provided, drive circuit is formed on the first surface of the substrate, the drive circuit has electrode
Connecting portion, the deposit on the drive circuit form insulating oxide, remove SI semi-insulation oxide layer to expose drive circuit
Electrode connecting portion；
S12：Formation heating element heater and metal electrode on the insulating oxide, the metal electrode and heating element heater,
The electrode connecting portion of drive circuit is electrically connected with；
S13：SI semi-insulation oxide layer is removed forming ink-feed channel figure, then is deposited and to be formed insulating barrier, then removal portion
Divide insulating barrier to expose metal electrode；
S14：Deposit on the insulating layer forms the first bonding material layer, by being graphically bonded window material to form first
With thickening metal electrode.
Further：Include between step S12 and step S13：Deposit on the heating element forms heat-conducting layer；
In step S13, when SI semi-insulation oxide layer is removed, while removing part heat-conducting layer to form the ink-feed channel figure
Shape, the insulating barrier are formed on the heat-conducting layer.
Further：
S21：Cover plate raw material is provided, the cover plate raw material includes body silicon layer, oxygen buried layer and device layer, institute from top to bottom successively
State the lower surface that device layer has the dorsad oxygen buried layer；
S22：Second is formed on the lower surface of the device layer and is bonded window material；
S22：Upper cavity is formed on the lower surface of the device layer；
S23：Body silicon layer on cover plate raw material is removed using reduction process, oxygen buried layer is thinned to.
Further：The preparation method also includes：The outgrowth that oxygen buried layer is removed in the cover plate forms hydrophobic layer.
Further：In step S1, on the substrate, lower chamber is formed with；In step S3, when described
When cover plate is with substrate bonding, the lower chamber of the substrate is docked with the upper cavity of cover plate, and ink chamber is by lower chamber and upper cavity
Merging is formed.
Present invention also offers a kind of preparation method of hot bubble type ink jet printhead, as follows：
S1：Substrate is provided, the substrate has the first surface and second surface being disposed opposite to each other, the first of the substrate
Drive circuit, heating element heater and metal electrode are formed on surface, the metal electrode is electrically connected with heating element heater, drive circuit
Connect, lower chamber is formed on the first surface of the substrate；Ink-feed channel figure is formed in the top of the first surface of the substrate
Shape, then deposit form a layer insulating, and the ink-feed channel figure is located in lower chamber；
S2：Cover plate is provided, the cover plate has the bottom surface and top surface being disposed opposite to each other, is provided with and buries on the top surface of the cover plate
Oxygen layer；
S3：By the underrun bonding technology and substrate bonding of the cover plate, lower chamber is covered by the bottom surface of the cover plate
Black chamber to be formed to enclose to set；
S4：By the use of oxygen buried layer as mask to form nozzle, and form metal electrode passage to expose metal electrode, institute's shape
Into nozzle and Mo Qiang UNICOMs；
S5：Ink-feed channel is formed according to ink-feed channel figure；
S6：The insulating barrier positioned at black chamber side is removed so that ink-feed channel and Mo Qiang UNICOMs, remove oxygen buried layer.
The beneficial effects of the present invention is：By cover plate is bonded on substrate, nozzle is arranged on cover plate, ink supply is led to
Road is arranged on substrate, and the black chamber of storage black liquid is arranged between cover plate and substrate, by this kind of structure design, can be caused
When processing forms hot bubble type ink jet printhead so as to do not limited by surface processing technique, its can processing when according to
Actual process demand adjusts deep silicon etching technique, to obtain the black chamber of even curface and desired height.And pass through using this
The preparation method of bright hot bubble type ink jet printhead can obtain the black chamber of even curface and desired height.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
Description of the drawings
Fig. 1 is the longitudinal profile schematic diagram of hot bubble type ink jet printhead in one embodiment of the invention；
Cross-sectional views of the Fig. 2 for the ink-feed channel in Fig. 1；
Fig. 3 is the longitudinal profile schematic diagram of hot bubble type ink jet printhead in another embodiment of the present invention；
Fig. 4 .1～4.14 are the fabrication processing figure of hot bubble type ink jet printhead in one embodiment of the invention.
Specific embodiment
With reference to the accompanying drawings and examples, the specific embodiment of the present invention is described in further detail.Hereinafter implement
Example is for illustrating the present invention, but is not limited to the scope of the present invention.
Fig. 1 is referred to, a kind of hot bubble type ink jet printhead shown in a preferred embodiment of the present invention includes substrate 1, key
Close cover plate 13 on substrate 1 and the heating element heater 4 being arranged on the substrate 1, CMOS drive circuits 2 and metal electrode 5.Institute
Substrate 1 is stated by made by insulating materials, silicon is included but are not limited to；The cover plate 13 by made by insulating materials, including but not
It is only limitted to silicon.The substrate 1 and cover plate 13 are realized being bonded by bonding technology, and the bonding technology employed in the present embodiment is preferably
Aluminium germanium is bonded or golden tin bonding, and substrate 1 and cover plate 13 form bonded layer therebetween by bonding technology, and the bonded layer includes
First bonding window material 9 and the second bonding window material 14.Enclose to set between the substrate 1 and cover plate 13 and be formed with to store
The black chamber 15 of black liquid (not shown), is formed through the ink-feed channel 18 with 15 UNICOM of ink chamber, the lid on the substrate 1
The nozzle 17 with 15 UNICOM of ink chamber is formed through on piece 13, the black liquid in black chamber 15 is by ink-feed channel 18 from outside stream
Enter to black chamber 15.The ink-feed channel 18, black chamber 15 and nozzle 17 form the circulation passage of black liquid.The heating element heater 4 sets
Put on the substrate 1, the heating element heater 4 to the black liquid heating in ink chamber 15 so that in black chamber 15 positioned at plus
Black liquid vaporization near thermal element 4 produces large number of minute bubbles, and bubble volume is continuously increased within the heat time, so that arriving
When to a certain degree, produced pressure makes black liquid eject from nozzle 17.The metal electrode 5 and drive circuit 2, heating
Element 4 is electrically connected with.In the present embodiment, the metal electrode 5 and drive circuit 2 are arranged on substrate 1, in other embodiment
In, which not only can be provided only on substrate 1, as long as finally realizing that more than 5 drive circuit 2 of metal electrode, heating element heater 4 connect i.e.
Can.In the present embodiment, the ink-feed channel 18 is in filter structure, incorporated by reference to Fig. 2.Really, the ink-feed channel 18 can also be
Other structures.But using " filter structure " compared with other structures, " filter structure " can play a role in filtering, such that it is able to hinder
Only relatively large black liquid " particle " enters black chamber 15, to prevent the circulation passage of plug nozzle 17 and black liquid.In the present embodiment,
The depth of ink chamber 15 is preferably 10～100 microns, and width is preferably 50～150 microns；The height of the nozzle 17 is 10
～50 microns, width is 10～50 microns.As black chamber 15 is used to store black liquid, nozzle 17 will be extruded the ink droplet for producing by bubble
Spray, so, if nozzle 17 is wide or depth is excessive, the power of bubble extruding may be not enough to extrude black liquid completely, and if
Nozzle 17 is too small, then can reduce ink ejection amount, affects ink-jet effect, therefore the height of nozzle 17 is 10～50 microns, and width is 10～
50 microns is optimum valuing range；And if 15 depth of black chamber is excessive, the ink amount of its storage is sufficient, but heating element heater 4 and nozzle
Distance between 17 is increased, and caused by heat, the extruding force of bubble may be not enough to extrude black liquid, if as black chamber 15 is excessively shallow, which stores
Ink amount may be not enough, can also affect ink-jet effect, therefore the depth in black chamber 15 is preferably 10～100 microns, width is preferably
50～150 microns.
In the present embodiment, ink chamber 15 is to be formed by upper cavity is formed on cover plate 13, and which is specially：It is described
Cover plate 13 has the bottom surface 131 and top surface 132 being disposed opposite to each other, and towards substrate 1, the cover plate 13 is from its bottom surface for the bottom surface 131
131 are recessed upwards forms upper cavity, and the upper cavity is sealed to form ink chamber 15 by the substrate 1.In other embodiment party
In formula, ink chamber 15 can be to be formed by forming lower chamber (not shown) on substrate 1, specially：The substrate 1 has
There is the first surface 101 and second surface 102 being disposed opposite to each other, towards cover plate 13, the substrate 1 is from which for the first surface 101
Depression forms lower chamber to first surface 101 downwards, and the lower chamber is sealed to form ink chamber 15 by the cover plate 13；Or
Person, by forming lower chamber respectively on substrate 1, forms upper cavity on cover plate 13, and then black chamber 15 is by lower chamber and epicoele
Body (not shown) is put together, specially：The cover plate 13 has the bottom surface 131 and top surface 132 being disposed opposite to each other, the bottom surface
131 are recessed from its bottom surface 131 upwards and form upper cavity towards substrate 1, the cover plate 13, and the substrate 1 has what is be disposed opposite to each other
First surface 101 and second surface 102, the first surface 101 towards cover plate 13, the substrate 1 from its first surface 101 to
Lower recess forms lower chamber, and ink chamber 15 is put together by the upper cavity and lower chamber.
In the present embodiment, the section below of ink chamber 15 is formed with the heating element heater 4, the material of the heating element heater 4
Material is using TaAl alloys or Ti/Pt/Ti or poly-Si or HfB2.The heating element heater 4 is by forming adding thermal resistance in depositing technics
Layer and formed, which can also be referred to as adding thermal resistance.The thickness of the heating element heater 4 is 100～300 nanometers, using this kind of thickness
Purpose is：It is low needed for the performance (heating effect) and the hot bubble type ink jet printhead of heating element heater 4 by considering
Power consumption, the complexity of the preparation technology of heating element heater 4 and cost-effectivenes, therefore the thickness is set, if excessively thin, possible heating effect is not
Foot, if blocked up, required power consumption increases, and processing cost can also increase.
In order that the heat of heating element heater 4 is quickly transferred to black liquid, i.e. the heat produced by heating element heater 4 is passed as early as possible
Black liquid is delivered to produce bubble, so that bubble volume increases, produced pressure will be such that ink ejects from nozzle 17,
In the present embodiment, heat-conducting layer on the substrate 1, is provided with, the heat-conducting layer abuts in 4 periphery of the heating element heater, and at least position
In the side of ink chamber 15.In view of MEMS preparation technologies and the compatibility with CMOS technology, the heat-conducting layer includes SiN
Film layer 6 and tantalum layer 7, tantalum layer 7 are located at the top of SiN film layers 6, with the black liquid directly contact in black chamber 15.In the present embodiment
In, in order to realize electric insulation, between the heating element heater 4 and drive circuit 2, be provided with insulating oxide 3, the bonded layer with
Insulating barrier 8 is provided between tantalum layer 7.
Incorporated by reference to Fig. 3, discharge from nozzle 1717 to be beneficial to black liquid, in the deposit of top surface 132 one of the cover plate 13
Hydrophobic layer 19, the hydrophobic layer 19 are preferably Al2O3ALD layers or DLC film, and its thickness is preferably 10～20 nanometers.
Incorporated by reference to Fig. 1 and Fig. 4 .1～4.14, the preparation method of above-mentioned hot bubble type ink jet printhead comprises the steps S1
To S6.
Incorporated by reference to Fig. 4 .1～4.6, S1：Substrate 1 is provided, the substrate 1 for a crystal orientation is<100>Silicon substrate 1, certainly,
In other embodiment, the substrate 1 can be other insulating materials.The substrate 1 has 101 He of first surface being disposed opposite to each other
Second surface 102, forms drive circuit 2, heating element heater 4 and metal electrode 5 on the first surface 101 of the substrate 1, described
Metal electrode 5 is electrically connected with heating element heater 4, drive circuit 2；Ink supply is formed in the top of the first surface 101 of the substrate 1
Passageway pattern, then deposit form a layer insulating 8.The step is specifically included：
S11：Refer to Fig. 4 .1, there is provided a crystal orientation is<100>Silicon substrate 1, on the first surface 101 of the substrate 1
The CMOS drive circuits 2 of control ink-jet are prepared using stand CMOS, there is the drive circuit 2 electrode connecting portion (not mark
Number)；Refer to Fig. 4 .2, the deposit on the drive circuit 2 and substrate 1 forms insulating oxide 3, and using photoetching, etching or
Wet corrosion technique is patterned, to remove SI semi-insulation oxide layer 3 so as to expose the electrode connecting portion of drive circuit 2；
S12：Fig. 4 .3 are referred to, heating resistor layer and connection metal level is deposited on the insulating oxide 3 successively, and
Photoetching, etching or wet corrosion technique is respectively adopted to be patterned to connecting metal level, heating resistor layer, to form heating unit
Part 4 and the metal electrode 5 being electrically connected with heating element heater 4, meanwhile, the electrode connecting portion of the metal electrode 5 and drive circuit 2
It is electrically connected with；The material of adding thermal resistance 4 is preferably TaAl alloys or Ti/Pt/Ti or poly-Si or HfB2, and thickness is preferably 100
～300 nanometers, using the purpose of this kind of thickness it is：By the performance (heating effect) and the heat that consider heating element heater 4
Low-power consumption, the complexity of the preparation technology of heating element heater 4 and cost-effectivenes needed for bubble ink-jet printing head, therefore the thickness is set
Degree, if excessively thin possible heating effect is not enough, blocked up required power consumption increases, and processing cost can also increase.Metal electrode 55 is excellent
Elect Al or Pt or Au or Cu as.
S13：Refer to Fig. 4 .4, deposited on heating element heater 4, metal electrode 5 and insulating oxide 3 successively SiN films and
Tantalum films, to form SiN film layers 6 and tantalum layer 7, the SiN film layers 6 and tantalum layer 7 are collectively referred to as heat-conducting layer.Using photoetching,
Etching or wet corrosion technique are patterned to SiN film layers 6, tantalum layer 7 and insulating oxide 3, to remove part SiN films
Layer 6, tantalum layer 7 and insulating oxide 3, so as to form ink-feed channel figure；Wherein, the ink-feed channel figure is in filter screen shape
(as shown in Figure 2)；
S14：Fig. 4 .5 are referred to, one layer of SiO2 insulating barrier 8 is deposited on tantalum layer 7, using photoetching, etching or wet etching
Technique is graphical to which, to remove partial insulative layer 8 and then expose metal electrode 5；
S15：Fig. 4 .6 are referred to, the deposit on insulating barrier 8 forms the first bonding material layer, using photoetching, etching or wet method
Etching process is patterned to which, to form the first bonding window material 9 and thicken metal electrode 5.This layer of bonding material is excellent
Elect Al or Au as, thickness is preferably 0.5～1.5 micron, substrate is mutually bonded for 1 with cover plate 13 by the bonding material, is formed
The black chamber 15 of storage black liquid, and black liquid should not be from bond area infiltration outflow, this requires that substrate 1 and cover plate 13 will be with reference to jails
Gu, bonding material will dissolve each other, and not have larger cavity.If the excessively thin possible bonding of thickness is insecure, if blocked up may affect material
That what is expected dissolves each other, and manufacturing cost can also increase.
In other embodiments, heat-conducting layer can not be generated.The purpose of the heat-conducting layer is：In order that heating element heater 4
Heat be quickly transferred to black liquid, i.e. make the heat produced by heating element heater 4 be delivered to black liquid as early as possible to produce bubble, and then
So that bubble volume increases, produced pressure will be such that ink ejects from nozzle 17.
Incorporated by reference to Fig. 4 .7～4.10, S2：Cover plate 13 is provided, 13 1 crystal orientation of cover plate is<100>Silicon cover plate 13 or SOI
Cover plate 13, certainly, in other embodiments, the substrate 1 can be other insulating materials.The cover plate 13 have be disposed opposite to each other
Bottom surface 131 and top surface 132, the cover plate 13 from its bottom surface 131 towards top surface 132 depression be formed with upper cavity, the cover plate 13
Top surface 132 be provided with oxygen buried layer 12.The step is specific as follows：
S21：Refer to Fig. 4 .7, there is provided a crystal orientation is<100>SOI cover plates raw material 10, the cover plate raw material 10 is from up to
Under include body silicon layer 11, oxygen buried layer 12 and device layer 13 successively, the device layer 13 has the lower end of the dorsad oxygen buried layer 12
Face；Wherein, can be according to the depth in black chamber 15 come the thickness from device layer 13, the device layer 13 is final cover plate.
S22：Fig. 4 .8 are referred to, using micro- on the lower surface 131 (bottom surface of as final cover plate) of the device layer 13
Processing technology of receiving forms second and is bonded window material 14；
S22：Fig. 4 .9 are referred to, photoetching and deep silicon etching technique is adopted on the lower surface of the device layer 13, is etched
For forming upper cavity 151, its depth can be controlled by deep silicon etching process adjustments, preferably 10～100 microns of depth, and width is excellent
Elect 50～150 microns as.The upper cavity 151 to be formed used by follow-up ink chamber 15, its depth and width be the depth in black chamber 15 and
Width, and as black chamber 15 is used to store black liquid, if 15 depth of black chamber is excessive, the ink amount of its storage is sufficient, but heating element heater 4
Increase with the distance between nozzle 17, caused by heat, the extruding force of bubble may be not enough to extrude black liquid, if such as black chamber 15 is excessively shallow,
The ink amount of its storage may be not enough, can also affect ink-jet effect, therefore be preferably 10～100 microns using depth, and width is preferred
It is optimal for 50～150 microns.Metal electrode channel groove 16 is formed while upper cavity 151 are formed.
S23：Fig. 4 .10 are referred to, the body silicon layer 11 on cover plate raw material 10 is removed using reduction process, oxygen buried layer is thinned to
12。
Refer to Fig. 4 .11, S3：The bottom surface 131 of the cover plate 13 is bonded with substrate 1 by bonding technology, the substrate
The upper cavity is covered to form black chamber 15 to enclose to set by 1 first surface, the ink-feed channel figure be located at black chamber 15 just under
Side.
Refer to Fig. 4 .12, S4：By the use of oxygen buried layer 12 as mask to form nozzle 17, and by metal electrode channel groove
Insertion forming metal electrode passage to expose metal electrode 5, nozzle 17 and 15 UNICOMs of Mo Qiang for being formed.Specially：Using
Photoetching, etching technics, etch oxygen buried layer 12, and using oxygen buried layer 12 be mask, by deep silicon etching technique carve nozzle 17 with
And expose metal electrode 5, and nozzle 17 is connected with black chamber 15, the height of nozzle 17 is 10～50 microns, and width is 10～50
Micron, nozzle 17 will be sprayed by the ink droplet that the bubble extruding in black liquid is produced, so, if nozzle 17 is wide or depth is excessive, gas
The power of bubble extruding may be not enough to extrude black liquid completely, and nozzle 17 is too small, then can reduce ink ejection amount, affects ink-jet effect
Really.
Refer to Fig. 4 .13, S5：Substrate 1 is carried out it is thinning, and according to ink-feed channel figure adopt photoetching, deep silicon etching work
Skill forms the formation ink-feed channel 18 for penetrating substrate 1.Due in step s 13, the ink-feed channel figure is in filter screen shape, institute
So that the shape of the ink-feed channel 18 eventually formed in this step is in filter structure, certainly, in other embodiments, in step
Ink-feed channel figure formed in S13 can also be other shapes, and then cause last ink-feed channel 18 corresponding for other
Shape, but using " filter structure " compared with other structures, " filter structure " can play a role in filtering, such that it is able to prevent
Relatively large black liquid " particle " enters black chamber 15, to prevent the circulation passage of plug nozzle 17 and black liquid.
Refer to Fig. 4 .14, S6：Using HF, the method for stifling or wet etching removes the insulating barrier 8 positioned at 15 side of black chamber
So that ink-feed channel 18 and 15 UNICOMs of Mo Qiang, the method removal oxygen buried layer 12 of or wet etching stifling using HF.
Incorporated by reference to Fig. 3, the preparation method of above-mentioned hot bubble type ink jet printhead also includes：Remove in the cover plate 13 and bury oxygen
One outgrowth of layer 12 forms hydrophobic layer 19.
In the present embodiment, the black chamber 15 is formed by upper cavity 151, in other embodiments, can be with substrate 1
Upper formation lower chamber, so that the black chamber 15 is put together by upper cavity 151 and lower chamber, specially：In step S1
In, lower chamber is formed with the substrate 1；In step S3, when the cover plate 13 is bonded with substrate 1, the substrate 1
Lower chamber dock with the upper cavity 151 of cover plate 13, ink chamber 15 is merged by lower chamber and upper cavity 151 and forms.Or, only
Lower chamber is formed on substrate 1, i.e., the black chamber 15 is formed by the lower chamber, the preparation method of this kind of hot bubble type ink jet printhead
It is as follows：
S1：Substrate 1 is provided, the substrate 1 has the first surface 101 and second surface 102 being disposed opposite to each other, in the lining
Drive circuit 2, heating element heater 4 and metal electrode 5, the metal electrode 5 and heating element heater are formed on the first surface 101 at bottom 1
4th, drive circuit 2 is electrically connected with, and on the first surface 101 of the substrate 1 forms lower chamber；In the first table of the substrate 1
The top in face 101 forms ink-feed channel figure, and then deposit forms a layer insulating 8, and the ink-feed channel figure is located at cavity of resorption
In vivo；
S2：Cover plate 13 is provided, the cover plate 13 has the bottom surface 131 and top surface 132 being disposed opposite to each other, the top of the cover plate 13
Oxygen buried layer 12 is provided with face 132；
S3：The bottom surface 131 of the cover plate 13 is bonded with substrate 1 by bonding technology, the bottom surface 131 of the cover plate 13 will
Lower chamber covers to form black chamber 15 to enclose to set；
S4：, and form metal electrode passage to expose metal electricity to form nozzle 17 by the use of oxygen buried layer 12 as mask
Pole 5, nozzle 17 and 15 UNICOMs of Mo Qiang for being formed；
S5：Ink-feed channel 18 is formed according to ink-feed channel figure；
S6：The insulating barrier 8 positioned at 15 side of black chamber is removed so that ink-feed channel 18 and 15 UNICOMs of Mo Qiang, remove oxygen buried layer
12。
In sum：By being bonded cover plate 13 on substrate 1, nozzle 17 is arranged on cover plate 13, by ink-feed channel 18
Arrange on substrate 1, the black chamber 15 of storage black liquid is arranged between cover plate 13 and substrate 1, by this kind of structure design, can be with
So that when processing forms hot bubble type ink jet printhead so as to do not limited by surface processing technique, which can be in processing
Deep silicon etching technique is adjusted according to actual process demand, to obtain the black chamber 15 of even curface and desired height.And pass through to adopt
The black chamber 15 of even curface and desired height can be obtained with the preparation method of the hot bubble type ink jet printhead of the present invention.
Each technical characteristic of embodiment described above arbitrarily can be combined, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more concrete and detailed, but and
Therefore can not be construed as limiting the scope of the patent.It should be pointed out that for one of ordinary skill in the art comes
Say, without departing from the inventive concept of the premise, some deformations and improvement can also be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (11)
1. a kind of hot bubble type ink jet printhead, it is characterised in that including substrate and bonding cover plate over the substrate, described
Enclose to set between substrate and cover plate and be formed with the black chamber for storing black liquid, be formed through on the substrate and ink chamber UNICOM
Ink-feed channel, the nozzle with ink chamber UNICOM is formed through on the cover plate, is provided with the substrate to the ink
The heating element heater of the black liquid heating in chamber, the hot bubble type ink jet printhead also include and heating element heater electric connection
Drive circuit and the metal electrode being electrically connected with the heating element heater, drive circuit.
2. hot bubble type ink jet printhead as claimed in claim 1, it is characterised in that be provided with heat-conducting layer on the substrate,
The heat-conducting layer abuts in the heating element heater periphery, and is located at least in the side of ink chamber.
3. hot bubble type ink jet printhead as claimed in claim 1, it is characterised in that the cover plate has the bottom being disposed opposite to each other
Face and top surface, towards the substrate, the cover plate is recessed from its bottom surface upwards and is formed with upper cavity for the bottom surface, and the substrate will
The upper cavity seals to form ink chamber；Or, the substrate has the first surface and second surface being disposed opposite to each other, institute
First surface is stated towards cover plate, depression is formed with lower chamber to the substrate downwards from its first surface, under the cover plate will be described
Cavity seals to form ink chamber；Or, the cover plate has the bottom surface and top surface being disposed opposite to each other, and the bottom surface is towards lining
Bottom, the cover plate are recessed from its bottom surface upwards and are formed with upper cavity, and the substrate has the first surface and second being disposed opposite to each other
Surface, towards cover plate, from its first surface, downwards depression is formed with lower chamber to the substrate to the first surface, ink chamber by
The upper cavity and lower chamber are put together.
4. hot bubble type ink jet printhead as claimed in claim 1, it is characterised in that the cover plate has the bottom being disposed opposite to each other
Face and top surface, the bottom surface are deposited with hydrophobic layer towards substrate, the top surface of the cover plate.
5. a kind of preparation method of hot bubble type ink jet printhead, it is characterised in that the preparation method is as follows：
S1：Substrate is provided, the substrate has the first surface and second surface being disposed opposite to each other, in the first surface of the substrate
Upper formation drive circuit, heating element heater and metal electrode, the metal electrode are electrically connected with heating element heater, drive circuit；
The top of the first surface of the substrate forms ink-feed channel figure, and then deposit forms a layer insulating；
S2：Cover plate is provided, the cover plate has the bottom surface and top surface being disposed opposite to each other, and the cover plate is from its bottom surface towards top surface concave shape
The top surface for having upper cavity, the cover plate is provided with oxygen buried layer；
S3：By the underrun bonding technology and substrate bonding of the cover plate, the first surface of the substrate is by the upper cavity
Cover to form black chamber to enclose to set, the ink-feed channel figure is located at the underface of ink chamber；
S4：By the use of oxygen buried layer as mask to form nozzle, and form metal electrode passage to expose metal electrode, formed
Nozzle and Mo Qiang UNICOMs；
S5：Ink-feed channel is formed according to ink-feed channel figure；
S6：The insulating barrier positioned at ink chamber side is removed so that the ink-feed channel and Mo Qiang UNICOMs, remove oxygen buried layer.
6. the preparation method of hot bubble type ink jet printhead as claimed in claim 5, it is characterised in that step S1 is concrete
Comprise the steps：
S11：Substrate is provided, drive circuit is formed on the first surface of the substrate, there is the drive circuit electrode to connect
Portion, the deposit on the drive circuit form insulating oxide, remove SI semi-insulation oxide layer to expose the electrode of drive circuit
Connecting portion；
S12：Heating element heater and metal electrode, the metal electrode and heating element heater, driving are formed on the insulating oxide
The electrode connecting portion of circuit is electrically connected with；
S13：SI semi-insulation oxide layer is removed forming ink-feed channel figure, then is deposited and to be formed insulating barrier, then remove part absolutely
Edge layer is exposing metal electrode；
S14：Deposit on the insulating layer forms the first bonding material layer, by being graphically bonded window material and adding to form first
Thick metal electrode.
7. the preparation method of hot bubble type ink jet printhead as claimed in claim 6, it is characterised in that in step S12
Include and step S13 between：Deposit on the heating element forms heat-conducting layer；In step S13, SI semi-insulation oxygen is being removed
When changing layer, while removing part heat-conducting layer to form the ink-feed channel figure, the insulating barrier is formed on the heat-conducting layer.
8. the preparation method of the hot bubble type ink jet printhead as described in any one in claim 5 to 7, its feature exist
In step S2 specifically includes following steps：
S21：Cover plate raw material is provided, the cover plate raw material includes body silicon layer, oxygen buried layer and device layer, the device from top to bottom successively
Part layer has the lower surface of the dorsad oxygen buried layer；
S22：Second is formed on the lower surface of the device layer and is bonded window material；
S22：Upper cavity is formed on the lower surface of the device layer；
S23：Body silicon layer on cover plate raw material is removed using reduction process, oxygen buried layer is thinned to.
9. the preparation method of hot bubble type ink jet printhead as claimed in claim 5, it is characterised in that the preparation method is also
Including：The outgrowth that oxygen buried layer is removed in the cover plate forms hydrophobic layer.
10. the preparation method of hot bubble type ink jet printhead as claimed in claim 5, it is characterised in that in step S1
In, lower chamber is formed with the substrate；In step S3, when the cover plate is with substrate bonding, under the substrate
Cavity is docked with the upper cavity of cover plate, and ink chamber is formed by lower chamber and upper cavity merging.
11. a kind of preparation methods of hot bubble type ink jet printhead, it is characterised in that the preparation method is as follows：
S1：Substrate is provided, the substrate has the first surface and second surface being disposed opposite to each other, in the first surface of the substrate
Upper formation drive circuit, heating element heater and metal electrode, the metal electrode are electrically connected with heating element heater, drive circuit,
Lower chamber is formed on the first surface of the substrate；Ink-feed channel figure is formed in the top of the first surface of the substrate, so
Deposit afterwards forms a layer insulating, and the ink-feed channel figure is located in lower chamber；
S2：Cover plate is provided, and the cover plate has the bottom surface and top surface being disposed opposite to each other, is provided with oxygen is buried on the top surface of the cover plate
Layer；
S3：Lower chamber is covered to enclose by the underrun bonding technology and substrate bonding of the cover plate, the bottom surface of the cover plate
If forming black chamber；
S4：By the use of oxygen buried layer as mask to form nozzle, and form metal electrode passage to expose metal electrode, formed
Nozzle and Mo Qiang UNICOMs；
S5：Ink-feed channel is formed according to ink-feed channel figure；
S6：The insulating barrier positioned at black chamber side is removed so that ink-feed channel and Mo Qiang UNICOMs, remove oxygen buried layer.
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| CN201611108856.6A CN106553453A (en) | 2016-12-06 | 2016-12-06 | Hot bubble type ink jet printhead and preparation method thereof |
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|---|---|---|---|
| CN201611108856.6A CN106553453A (en) | 2016-12-06 | 2016-12-06 | Hot bubble type ink jet printhead and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111216452A (en) * | 2018-11-27 | 2020-06-02 | 西安增材制造国家研究院有限公司 | Piezoelectric type MEMS ink-jet printing head and manufacturing method |
| CN114368222A (en) * | 2022-01-21 | 2022-04-19 | 武汉敏捷微电子有限公司 | Microfluid device and manufacturing method thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06183008A (en) * | 1992-12-19 | 1994-07-05 | Fuji Xerox Co Ltd | Thermal ink jet recording head and fabrication thereof |
| CN1286168A (en) * | 1999-08-27 | 2001-03-07 | 惠普公司 | Full-integrated hot ink-jet print head having silicophosphate glass layer with etched back |
| US6387719B1 (en) * | 2001-02-28 | 2002-05-14 | Lexmark International, Inc. | Method for improving adhesion |
| CN1572505A (en) * | 2003-06-23 | 2005-02-02 | 佳能株式会社 | Method for manufacturing liquid ejection head |
| CN1579778A (en) * | 2003-08-11 | 2005-02-16 | 兄弟工业株式会社 | Methods for producing a nozzle plate and nozzle plate |
| CN1636730A (en) * | 2003-12-26 | 2005-07-13 | 佳能株式会社 | Manufacturing method of ink jet recording head and ink jet recording head manufactured by manufacturing method |
| CN1771132A (en) * | 2003-07-22 | 2006-05-10 | 佳能株式会社 | Ink-jet head and method of manufacturing the same |
| CN101035682A (en) * | 2004-08-05 | 2007-09-12 | 富士胶卷迪马蒂克斯股份有限公司 | Print head nozzle formation |
| CN101130300A (en) * | 2007-09-20 | 2008-02-27 | 华中科技大学 | Jet printing valve based on carbon nano-tube tiny bubble generator and method of producing the same |
| CN101607476A (en) * | 2008-06-20 | 2009-12-23 | 佳能株式会社 | Fluid ejection head and manufacture method thereof |
| CN101688084A (en) * | 2007-07-11 | 2010-03-31 | 精工爱普生株式会社 | Junction structure and method of joining |
| CN206242688U (en) * | 2016-12-06 | 2017-06-13 | 苏州工业园区纳米产业技术研究院有限公司 | Hot bubble type ink jet printhead |
-
2016
- 2016-12-06 CN CN201611108856.6A patent/CN106553453A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06183008A (en) * | 1992-12-19 | 1994-07-05 | Fuji Xerox Co Ltd | Thermal ink jet recording head and fabrication thereof |
| CN1286168A (en) * | 1999-08-27 | 2001-03-07 | 惠普公司 | Full-integrated hot ink-jet print head having silicophosphate glass layer with etched back |
| US6387719B1 (en) * | 2001-02-28 | 2002-05-14 | Lexmark International, Inc. | Method for improving adhesion |
| CN1572505A (en) * | 2003-06-23 | 2005-02-02 | 佳能株式会社 | Method for manufacturing liquid ejection head |
| CN1771132A (en) * | 2003-07-22 | 2006-05-10 | 佳能株式会社 | Ink-jet head and method of manufacturing the same |
| CN1579778A (en) * | 2003-08-11 | 2005-02-16 | 兄弟工业株式会社 | Methods for producing a nozzle plate and nozzle plate |
| CN1636730A (en) * | 2003-12-26 | 2005-07-13 | 佳能株式会社 | Manufacturing method of ink jet recording head and ink jet recording head manufactured by manufacturing method |
| CN101035682A (en) * | 2004-08-05 | 2007-09-12 | 富士胶卷迪马蒂克斯股份有限公司 | Print head nozzle formation |
| CN101688084A (en) * | 2007-07-11 | 2010-03-31 | 精工爱普生株式会社 | Junction structure and method of joining |
| CN101130300A (en) * | 2007-09-20 | 2008-02-27 | 华中科技大学 | Jet printing valve based on carbon nano-tube tiny bubble generator and method of producing the same |
| CN101607476A (en) * | 2008-06-20 | 2009-12-23 | 佳能株式会社 | Fluid ejection head and manufacture method thereof |
| CN206242688U (en) * | 2016-12-06 | 2017-06-13 | 苏州工业园区纳米产业技术研究院有限公司 | Hot bubble type ink jet printhead |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111216452A (en) * | 2018-11-27 | 2020-06-02 | 西安增材制造国家研究院有限公司 | Piezoelectric type MEMS ink-jet printing head and manufacturing method |
| CN111216452B (en) * | 2018-11-27 | 2021-08-17 | 西安增材制造国家研究院有限公司 | Piezoelectric type MEMS ink-jet printing head and manufacturing method |
| CN114368222A (en) * | 2022-01-21 | 2022-04-19 | 武汉敏捷微电子有限公司 | Microfluid device and manufacturing method thereof |
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