CN106480433A - A kind of high viscosity glue spray site colloid amount method for improving and point glue equipment - Google Patents

Abstract

The invention provides a method for improving the quality of high-viscosity glue spraying and dispensing: cleaning the nozzle cavity of the valve seat and the inner wall of the valve body; coating the inner wall of the nozzle cavity and the inner wall of the valve body Electrochemical plating is carried out on the nanometer layer to obtain the copper sulfide nanolayer; the copper sulfide nanolayer is subjected to super-thinning treatment to improve the structural characteristics of the copper sulfide nanolayer. When the high-viscosity glue moves relative to the cavity wall, there will be a driving force in the flow direction and a viscous resistance that hinders its flow. Change the wettability of the high-viscosity glue and the cavity wall through the copper sulfide nanostructure, reduce the contact area between the two, and increase the driving resultant force in the flow direction under the condition of the same driving force, so that it acts on the high-viscosity glue The direction of the force is more consistently directed to the injection port, and the high-viscosity glue is more likely to be ejected at a high speed and in a stable state. The invention also provides a glue dispensing device, which can achieve the same technical effect.

Description

A method for improving the quality of high-viscosity glue jet dispensing and a dispensing device

technical field

The present invention relates to the technical field of microelectronic packaging, and further relates to a method and a dispensing device for improving the quality of jet dispensing of high-viscosity glue.

Background technique

Liquid dispensing technology is a key technology in the field of microelectronic packaging. This technology accurately distributes fluid in a specific way, and can transfer fluid of ideal size to a suitable position on the workpiece, and construct points, lines, surfaces, etc. Various patterns in the form of mechanical or electrical connections between components.

Jet dispensing does not rely on gravity or surface tension to separate the fluid, but by applying a sufficient force to the fluid, the fluid is automatically separated and sprayed, and the speed of dispensing is greatly improved. Due to its non-contact and high efficiency, jet dispensing technology has been more and more widely used. Because the theoretical research and practical application are not deep enough, there are still many problems in the actual production operation process. The main problems are: the applicable range of viscosity is small, the high-viscosity glue is difficult to spray during the connection process, and the spray speed is unstable.

The high-viscosity glue has a strong internal molecular bonding force, which is not easy to be broken and separated, and the high-viscosity glue is in full contact with the surface of the injection cavity. Under the action of high pressure, relatively large and complex friction resistance will be generated during relative movement. It is not conducive to the flow of high-viscosity glue in the cavity. The binding force and viscous resistance of high-viscosity glue are relatively large and complicated, which makes the speed of glue injection not only difficult to parameterize, but also easily affected and unstable, such as As shown in FIG. 6A , the arrow indicates the moving direction of the traditional dispensing head, and the size and quality of the dispensing glue are not stable. The glue is not only difficult to separate, but also easily blocks the injection cavity and is inconvenient to clean, which increases maintenance and cleaning costs and inefficiencies.

Therefore, for those skilled in the art, how to design a method that can improve the quality of jet dispensing is a technical problem that needs to be solved at present.

Contents of the invention

The invention provides a method for improving the quality of high-viscosity glue injection dispensing and a glue dispensing device, which effectively increases the external force driving the flow of high-viscosity glue, so that the direction of the force acting on the high-viscosity glue is more consistently directed to the injection High-viscosity glue is easier to spray out at high speed and in a stable state, which solves the difficult problem of high-viscosity glue injection in the current technology, and improves the efficiency of jetting and dispensing. The specific plan is as follows:

A method for improving the quality of high-viscosity glue jet dispensing, comprising:

Clean the nozzle cavity of the valve seat and the inner wall of the valve body;

Copper-containing micron layer is plated on the inner wall of the nozzle cavity and the inner wall of the valve body;

Electrochemical plating is carried out on the copper-containing micro-nano layer to obtain a copper sulfide nano-layer;

The copper sulfide nano-layer is subjected to superphobic treatment.

Optionally, the cleaning process includes:

Under the environment of 500° C., the inner wall of the nozzle chamber and the valve body is cleaned with 0.3-0.5 mol/L H ₂ SO ₄ solution.

Optionally, the copper-containing micron layer plating process includes:

Under the environment of room temperature, the inner wall of the nozzle chamber and the valve body is immersed in copper liquid to carry out chemical reaction.

Optionally, the electrochemical plating process includes:

The valve seat and the copper-containing micron layer provided on the valve body are placed in a sulfur-containing steam environment at 150° C. for 10 minutes, and an electrochemical reaction is performed to obtain a copper sulfide nano-layer.

Optionally, the superphobic treatment process includes:

At room temperature, place the copper sulfide nanolayer in an ozone system with a flow rate of 0.6 cm ³ /min for 30 minutes, then place the treated surface in a fluorosilane solution for 30 minutes, take it out and wash it once with ethane and ethanol; The polymerization process with a duration of 20 min was carried out in an environment of 120°C.

In addition, the present invention also provides a glue dispensing device, which includes a valve rod driven by a driving device to reciprocate, the valve rod extends into the valve body and slides through the valve body; the end of the valve body can be The valve seat is disassembled and set, and the valve seat is opened for spraying the glue nozzle, and the side wall of the valve body is provided with a glue supply port for providing glue through the glue supply device; the valve seat and the valve stem form On the inner wall of the nozzle chamber and on the inner wall of the valve body close to the nozzle chamber, a copper sulfide nano layer for contacting with the glue solution is arranged.

Optionally, the valve stem is a stepped cylindrical body whose size decreases from top to bottom, and the inner cavity of the valve is a stepped cylindrical cavity matched with the valve stem.

Optionally, the inlet of the injection nozzle is a conical surface with a taper of 100-130 degrees.

Optionally, the valve body is threadedly connected to the valve seat, the valve seat is provided with internal threads, and the valve body is provided with external threads.

Optionally, both the valve body and the valve seat are made of stainless steel.

The invention provides a method for improving the quality of high-viscosity glue spraying and dispensing, which includes cleaning, plating copper-containing micron layer, electrochemical plating, and superphobic treatment. Clean the nozzle cavity of the valve seat and the inner wall of the valve body to obtain a good processing base; plate a copper-containing micron layer on the inner wall of the nozzle cavity and the inner wall of the valve body; perform electrochemical plating on the copper-containing micro-nano layer to obtain copper sulfide Nano-layer: super-thorbify the copper sulfide nano-layer, improve the structural characteristics of the copper sulfide nano-layer, improve the bonding performance of the copper sulfide nano-layer and the base structure, and improve the viscous resistance with the high-viscosity glue through the nano-coating.

When the high-viscosity glue moves relative to the cavity wall, there will be a driving force in the flow direction and a viscous resistance that hinders its flow, as well as a pressure in the direction perpendicular to the flow direction. Through the special copper sulfide nanostructure, it can change the wettability of the high-viscosity glue and the cavity wall by using its superphobic properties to the high-viscosity glue, and reduce the contact area between the two, which can effectively reduce the flow of glue droplets. Viscous resistance in the direction, so under the condition that the driving force remains unchanged, increasing the driving resultant force in the flow direction effectively increases the external force driving the flow of high-viscosity glue, so that the force acting on the high-viscosity glue The direction is more consistent to the injection port, and the high-viscosity glue is more likely to be ejected at a high speed and in a stable state, which solves the difficult problem of high-viscosity glue injection in the current technology, and at the same time improves the efficiency of jet dispensing.

The present invention also provides a dispensing device, which includes a valve stem driven to and fro by a driving device, the valve stem extends into the valve body and slides through the valve body limit; the end of the valve body is detachably provided with a valve seat, and the valve seat It is used to spray the glue nozzle. The side wall of the valve body is provided with a glue supply port through the glue supply device; the inner wall of the nozzle cavity formed by the valve seat and the valve stem and the inner wall of the valve body close to the nozzle cavity are set. on the copper sulfide nanolayer in contact with the glue. The same technical effect can be achieved.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1 is the flowchart of the method for improving the quality of high-viscosity glue jet dispensing provided by the present invention;

Fig. 2 is the sectional structure diagram of the dispensing device provided by the present invention;

Fig. 3 A is a schematic diagram of the contact situation between the high-viscosity glue liquid and the inner wall in the traditional dispensing head;

3B is a schematic diagram of the contact situation between the high-viscosity glue and the inner wall in the dispensing device provided by the present invention;

Fig. 4A is a schematic diagram of the stress situation of the traditional structure high-viscosity glue on the cavity wall;

4B is a schematic diagram of the force characteristics of the dispensing device provided by the present invention on the wall of the cavity;

Figure 5A is a schematic diagram of the macroscopic stress characteristics of high-viscosity glue in a traditional dispensing head;

Figure 5B is a schematic diagram of the macroscopic stress characteristics of the high-viscosity glue in the dispensing device provided by the present invention;

Fig. 6A is a schematic diagram of the traditional dispensing head dispensing molding effect;

Fig. 6B is a schematic diagram of the dispensing and forming effect of the dispensing device provided by the present invention.

These include:

Valve stem 1, valve body 2, glue supply port 21, valve seat 3, nozzle cavity 31, injection nozzle 32, copper sulfide nano layer 4, driving device 5, glue supply device 6.

detailed description

The core of the present invention is to provide a high-viscosity glue jet dispensing quality improvement method and a glue dispensing device, through the copper sulfide nanostructure on the surface of the inner wall, the super-phobic properties of the high-viscosity glue are effectively increased to drive the high-viscosity glue The flowing external force makes the direction of the force acting on the high-viscosity glue point to the injection port more consistently, and the high-viscosity glue is more likely to be ejected at a high speed and in a stable state, which solves the difficult problem of high-viscosity glue injection at the current stage. At the same time improve the efficiency of jet dispensing.

In order for those skilled in the art to better understand the technical solution of the present invention, the method for improving the quality of high-viscosity glue jet dispensing and the dispensing device of the present application will be described in detail below in conjunction with the accompanying drawings and specific implementation methods .

As shown in FIG. 1 , it is a flow chart of the method for improving the quality of high-viscosity glue jet dispensing provided by the present invention. The method for improving the quality of high-viscosity glue jet dispensing provided by the present invention includes cleaning, plating copper-containing micron layer, electrochemical plating of copper sulfide nano-layer 4, and superphobic treatment. The structure targeted by this method includes the nozzle chamber 31 of the valve seat 3 and the valve body 2. Such a split structure is a specific way of setting the dispensing port. If the integral structure only needs to be processed on the inner wall of one of the chambers.

Step S1 is performed first: cleaning the nozzle cavity 31 of the valve seat 3 and the inner wall of the valve body 2 to obtain a good processed surface. Then proceed to step S2: plate a copper-containing micron layer on the cleaned inner wall of the nozzle cavity 31 and the inner wall of the valve body 2 . Then proceed to step S3: perform electrochemical plating on the copper-containing micron layer to obtain the copper sulfide nano-layer 4 . Finally, step S4 is carried out: performing superphobic treatment on the copper sulfide nano-layer 4 to improve the bonding performance between the copper sulfide nano-layer 4 and the substrate.

When the high-viscosity glue moves relative to the cavity wall, there will be a driving force in the flow direction and a viscous resistance that hinders its flow, as well as a pressure in the direction perpendicular to the flow direction. Through the special copper sulfide nanostructure, it can change the wettability of the high-viscosity glue and the cavity wall by using its superphobic properties to the high-viscosity glue, and reduce the contact area between the two, which can effectively reduce the flow of glue droplets. Viscous resistance in the direction, so under the condition that the driving force remains unchanged, increasing the driving resultant force in the flow direction effectively increases the external force driving the flow of high-viscosity glue, so that the force acting on the high-viscosity glue The direction is more consistent to the injection port, and the high-viscosity glue is more likely to be ejected at a high speed and in a stable state, which solves the difficult problem of high-viscosity glue injection in the current technology, and at the same time improves the efficiency of jet dispensing.

Based on the above, the cleaning process of the present invention includes: cleaning the inner wall of the nozzle cavity 31 and the valve body 2 with 0.3-0.5 mol/L H ₂ SO ₄ solution at 500°C. After high temperature pickling, the cleaning effect is more thorough.

Further, the process of plating the copper-containing micron layer includes: immersing the inner wall of the nozzle cavity 31 and the valve body 2 in the copper liquid to carry out chemical reaction at room temperature. With the nozzle cavity 31 and the valve body 2 as the base, non-electrochemical plating is performed to obtain a copper-containing micron structure. When the reaction time is the same, the thickness of the copper plating layer is controlled by controlling the ratio of Cu ²⁺ .

Electrochemical plating is carried out after the copper-containing micron layer is plated. The process includes: placing the valve seat 3 and valve body 2 in a sulfur-containing steam environment, specifically placing the set copper-containing micron layer in sulfur-containing steam at 150 ° C. In the environment for 10 minutes, the copper sulfide nano-layer 4 is obtained by inducing it to perform an electrochemical reaction. The longer the evaporation time is, the greater the surface roughness of the copper sulfide nano-layer 4 is, and the roughness of the copper sulfide nano-layer 4 is controlled by controlling the evaporation time.

Further, the superphobic treatment process includes: at room temperature, placing the copper sulfide nanolayer 4 in an ozone system with a flow rate of 0.6 cm ³ /min for 30 minutes, then placing the treated surface in a fluorosilane solution for 30 minutes, and taking it out Wash once with ethane and ethanol respectively; finally carry out the polymerization process with a duration of 20min in an environment of 120°C. The structural properties of the copper sulfide nano-layer 4 are improved through super-thinning treatment, and the bonding performance between the copper sulfide nano-layer 4 and the substrate is improved.

As shown in FIG. 2 , the present invention also provides a dispensing device, which includes a valve stem 1 , a valve body 2 , a valve seat 3 and other structures. The valve stem 1 moves reciprocatingly and linearly through the driving device 5. One end of the valve stem 1 extends into the valve body 2 and slides through the valve body 2 to limit the position; the end of the valve body 2 is detachably provided with a valve seat 3. One end of the opening is provided with a spray nozzle 32 for spraying glue. A glue supply port 21 is provided on the side wall of the valve body 2 , and glue liquid is supplied to the glue supply port 21 through the glue supply device 6 . The inner wall of the nozzle cavity 31 formed by the valve seat 3 and the valve stem 1 and the inner wall of the valve body 2 close to the nozzle cavity 31 are provided with a copper sulfide nano layer 4 for contacting the glue. The layers 4 are squeezed and sprayed out from the spray nozzle 32 . As shown in FIG. 3A and FIG. 3B , respectively represent the state diagrams of the inner wall of the traditional dispensing head and the inner wall of the dispensing device provided by the present invention, wherein the copper sulfide nanolayer 4 is represented by a tooth-like structure.

On the basis of the above, the valve stem 1 is a stepped cylindrical body whose size decreases from top to bottom, and the inner cavity of the valve body 2 is a stepped cylindrical cavity that cooperates with the valve stem 1 . The valve body 2 will not hinder the movement of the valve rod 1 .

The inlet of the injection nozzle 32 is a conical surface with a taper of 100-130 degrees, more preferably 120 degrees. The end of the valve stem 1 is a spherical surface, which contacts the conical surface when extruded, and cuts off the glue. The fitting form has good tightness and simple processing, and its tightness is not easily affected by the angle of the valve stem.

The valve body 2 and the valve seat 3 are connected by threads, the valve seat 3 is provided with internal threads, and the valve body 2 is provided with external threads. The outer wall and the inner wall of the valve body 2 and the valve seat 3 are all flush, and the appearance is smooth and consistent. This split structure is a preferred solution, the valve seat 3 can be replaced to adjust the size of the injection nozzle 32, if the valve body 2 and the valve seat 3 are integral structure is also possible.

Both the valve body 2 and the valve seat 3 are made of stainless steel, which is convenient for vapor deposition on the copper sulfide nanostructure surface and better bonding performance.

The dispensing device provided by the present invention is equipped with copper sulfide nanostructures, the distance between the surfaces is very small, the gap between the nanostructures is difficult to be immersed by high-viscosity glue, the contact angle exceeds 160°, and has a low Hysteretic contact angle, very stable super-thinning properties, excellent drag reduction effect. In addition, the bonding performance with the cavity is good, and the mechanical stability is high. The nanostructure has simple processing technology, high processing precision and good adjustability.

The present invention provides that the glue dispensing device includes three stages in use, which are glue supply stage, injection stage and closing stage.

1) Glue supply stage: the end of the valve stem 1 is in contact with the tapered surface of the valve seat 3, the injection nozzle 32 is in a closed state, and the glue supply device 6 performs glue filling through the glue supply port 21, so that the valve stem 1 and the valve seat 3 1. The gap between the valve stem 1 and the valve body 2 is evenly filled with high-viscosity glue, and a certain pressure is generated, so that the glue is in a suitable state to be sprayed.

2) Injection stage: Driven by the driving device 5, the valve rod 1 makes a linear motion upward for a fixed distance. At this time, the injection nozzle 32 is opened, and the glue rushes out of the injection nozzle 32 under a suitable pressure. Under the guidance of , a jet with a steady speed is formed.

3) Closing stage: After the injection nozzle 32 is opened for a period of time, the valve stem 1 is driven by the driving device 5 and descends to the position of the glue supply stage, the injection nozzle 32 is closed, and the jet is cut off immediately. The jet flies away from the nozzle 32 at a certain speed and volume to reach the substrate.

Repeat 1) to 3) for continuous jet dispensing operations.

The process of changing the motion characteristics of the high-viscosity glue by the nanostructure occurs in the above-mentioned injection stage 2), specifically, the valve stem 1 is driven up by the driving device 5, and the high-viscosity glue flows through the gap of the valve stem 1 under the action of pressure During the process, its microcosmic action principle is shown in Figure 4A and Figure 4B, which are schematic diagrams of the force characteristics on the cavity wall of the traditional structure and the dispensing device provided by the present invention, respectively. When the high-viscosity glue moves relative to the cavity wall, there will be a driving force in the flow direction and a viscous resistance that hinders its flow, as well as a pressure in the direction perpendicular to the flow direction. Through the copper sulfide nanostructure, using its super-phobic properties for high-viscosity glue, changing the wettability of the high-viscosity glue and the cavity wall, reducing the contact area between the two, and under the condition of constant pressure F1, it can effectively Reduce the viscous resistance of glue droplets in the flow direction, so under the condition of constant driving force, increase the driving resultant force F2 in the flow direction, which is specifically manifested in the clamping force between the total resultant force F and the driving resultant force F2 in the flow direction The angle becomes smaller, that is, α>β shown in Figure 4A and Figure 4B, which can be obtained through the sine formula of the triangle, and F2(α)<F2(β) in the flow direction effectively increases the flow of high-viscosity glue. 5A and 5B, which are schematic diagrams of the macro force characteristics of the traditional dispensing head and the dispensing device provided by the present invention, respectively. The glue dispensing device of the present invention acts on the force direction of the high-viscosity glue to point to the injection port more consistently, making it easier for the high-viscosity glue to be ejected at a high-speed and stable speed, solving the problem of high-viscosity glue in the current technology Solve difficult jetting challenges while improving jet dispensing efficiency. As shown in FIG. 6A and FIG. 6B , respectively represent the schematic diagrams of the molding effect of the traditional glue dispensing head and the glue dispensing device provided by the present invention. Using the glue dispensing device of the invention can realize uniform and consistent glue dispensing effect.

The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A method for improving the quality of high-viscosity glue jet dispensing, characterized in that, comprising: Clean the nozzle cavity (31) of the valve seat (3) and the inner wall of the valve body (2); Copper-containing micron layer is plated on the inner wall of the nozzle cavity (31) and the inner wall of the valve body (2); Electrochemical plating is carried out on the copper-containing micro-nano layer to obtain a copper sulfide nano-layer (4); The copper sulfide nano-layer (4) is subjected to super-thinning treatment. 2. The method for improving the quality of high-viscosity glue jet dispensing according to claim 1, wherein the cleaning process comprises: Under the environment of 500°C, the inner wall of the nozzle chamber (31) and the valve body (2) is cleaned with 0.3-0.5mol/L H ₂ SO ₄ solution. 3. The method for improving the quality of high-viscosity glue jet dispensing according to claim 1, wherein the process of plating a copper-containing micron layer comprises: Under room temperature environment, the inner wall of the nozzle cavity (31) and the valve body (2) is immersed in copper liquid to carry out chemical reaction. 4. high-viscosity glue jet dispensing quality promotion method according to claim 1, is characterized in that, described electrochemical plating process comprises: The valve seat (3) and the copper-containing micron layer provided on the valve body (2) are placed in a sulfur-containing steam environment at 150° C. for 10 minutes, and an electrochemical reaction is performed to obtain a copper sulfide nano-layer (4). 5. The method for improving the quality of high-viscosity glue jetting and dispensing according to claim 1, wherein the superphobic treatment process comprises: At room temperature, place the copper sulfide nanolayer (4) in an ozone system with a flow rate of 0.6cm ³ /min for 30 minutes, then place the treated surface in a fluorosilane solution for 30 minutes, take it out and wash it with ethane and ethanol Once; a polymerization process with a duration of 20 minutes was carried out in an environment of 120°C. 6. A dispensing device, characterized in that it comprises a valve stem (1) driven by a driving device (5) to reciprocate, the valve stem (1) extends into the valve body (2) and passes through the valve stem (1). body (2) limit sliding; the end of the valve body (2) is detachably provided with a valve seat (3), and the valve seat (3) is provided with a nozzle (32) for spraying glue, and the valve body The side wall of (2) is provided with the glue supply port (21) that provides the glue solution by the glue supply device (6); the inner wall of the nozzle chamber (31) formed by the valve seat (3) and the valve stem (1) A copper sulfide nanolayer (4) for contacting with the glue is arranged on the inner wall of the valve body (2) close to the nozzle chamber (31). 7. The glue dispensing device according to claim 6, characterized in that, the valve stem (1) is a stepped cylinder whose size is reduced from top to bottom, and the inner cavity of the valve body (2) is the same as that of the valve body (2). The step-shaped cylindrical cavity matched with the valve stem (1). 8. The glue dispensing device according to claim 6, characterized in that, the entrance of the injection nozzle (32) is a conical surface with a taper of 100-130 degrees. 9. The dispensing device according to any one of claims 6 to 8, characterized in that, the valve body (2) is threadedly connected to the valve seat (3), and the valve seat (3) is provided with internal threads, external threads are arranged on the valve body (2). 10. The glue dispensing device according to claim 9, characterized in that, both the valve body (2) and the valve seat (3) are made of stainless steel.