CN106465578B

CN106465578B - Element fixing apparatus

Info

Publication number: CN106465578B
Application number: CN201580025459.XA
Authority: CN
Inventors: 龟田真希夫; 渡边昭夫; 主山修二
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2014-05-30
Filing date: 2015-05-08
Publication date: 2019-08-27
Anticipated expiration: 2035-05-08
Also published as: WO2015182347A1; JP2015226037A; JP6280817B2; CN106465578A

Abstract

Element (D) is installed on the substrate (P) with hole portion (47) by a kind of element fixing apparatus (1).Element fixing apparatus (1) includes: fixed cell (33), is positioned to substrate (P) and fixes the substrate；Holding unit (40), by keeping the element (D) with lead and making element decline to make the lead (41) of the element be inserted into hole portion (47)；Bending component (44) makes the inclined surface (49) for being formed in top be crimped on the lead (41) for the element being inserted in the substrate that fixed cell (33) is fixed to make the lead bending；Lifting unit (20) rises bending component (44) relatively relative to the substrate, so that inclined surface (49) are crimped on the lead (41) of the element.

Description

Component mounting apparatus

Technical Field

The present invention relates to a component mounting apparatus that holds a component by a holding unit and mounts the component onto a substrate.

Background

For example, patent document 1 discloses the following technique: the lead of the electronic component is inserted into the hole part opened on the printed circuit board, so that the electronic component is installed on the printed circuit board.

However, the above-described conventional technique employs a device for mounting an electronic component on a paste solder which is mainly printed on a pattern (land) on the surface of a substrate. In this device, when a lead is inserted into a hole formed in a substrate, the lead is pressed into the hole so that the lead does not come off the substrate. The device does not bend the inserted lead.

In order to bend the lead wire inserted into the substrate and to easily prevent the inserted element from coming off, it is necessary to use a special mechanism called an Anvil (Anvil) disclosed in patent document 2, for example. The anvil employs the following mechanism: for example, the lead is bent by pressing the claw portion in the horizontal direction after the claw portion is brought into contact with the lead. However, the mechanism is complicated in structure and is costly. In particular, it is difficult to add a mechanism for lowering a held component in order to place the component on a substrate to a surface mounting apparatus called a chip mounter.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2011-258875

Patent document 2: japanese patent laid-open publication No. Hei 2-132899

Disclosure of Invention

The purpose of the present invention is to enable the following operations to be implemented by a simple mechanism: the lead of the element is inserted into a hole formed in the substrate and bent so that the element is not easily detached from the substrate.

A component mounting apparatus according to an aspect of the present invention is an apparatus for mounting a component on a substrate having a hole, the component mounting apparatus including: a fixing unit that positions and fixes the substrate; a holding unit for inserting the lead of the component into the hole by holding the component with the lead and lowering the component; a bending member configured to bend a lead of the element inserted into the substrate fixed by the fixing unit by pressing an inclined surface formed at an upper portion of the bending member against the lead; a lifting unit for lifting the bending member relative to the substrate to press the inclined surface to the lead of the element; and a controller that controls operations of the holding unit and the lifting unit, wherein the controller controls the lifting unit such that the bending member is located at a position away downward from the lead before the holding unit completes insertion of the lead into the hole, and the controller controls the lifting unit such that the bending member is lifted up in a state where the holding unit presses the element in which the lead is inserted into the hole of the substrate from above after the holding unit completes insertion of the lead into the hole.

The objects, features and advantages of the present invention will become more apparent from the detailed description set forth below and the accompanying drawings.

Drawings

Fig. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 2 is a side view of a substrate positioning portion in the electronic component mounting apparatus.

Fig. 3 is a side view of the substrate positioning portion.

Fig. 4 is a control block diagram relating to component mounting in the electronic component mounting apparatus.

Fig. 5 is a side view of the substrate positioning portion when the bending jig pin is provided on the support base.

Fig. 6 is a side view showing a state where the lead of the electronic component gripped by the gripping claw is bent by the bending jig pin.

Fig. 7 is a timing chart of the raising and lowering of the holding claw and the support table for the lead of the bending element.

Detailed Description

Hereinafter, an electronic component mounting apparatus 1 (component mounting apparatus) for mounting an electronic component D on a printed circuit board P as a substrate will be described with reference to fig. 1 and 2. The electronic component mounting apparatus 1 is provided with: a conveying device 2 for conveying the printed circuit boards P; component supply devices 3A, 3B provided on the near side and the far side of the device main body and supplying electronic components; a pair of beams 4A, 4B that can move in one direction (can move back and forth in the Y direction) based on the driving of a driving source; and a mounting head 6 that is independently movable in a direction along the beams 4A and 4B based on driving of the driving sources.

The conveying device 2 includes a supply conveyor 2A, a positioning portion 2B for positioning and fixing the printed circuit board P, and a discharge conveyor 2C. The supply conveyor 2A conveys each printed circuit board P received from upstream to the positioning section 2B. The electronic components D are mounted on the respective substrates P positioned at the respective positioning portions 2B by the positioning device. Thereafter, the substrate P is conveyed to the discharge conveyor 2C and then conveyed to the downstream side apparatus.

The component supply devices 3A and 3B are provided at the back side position and the near side position of the carrier device 2, and include a plurality of component supply units 8 arranged in line on feeder bases of the carriage bases 7A and 7B as mounting bases. Each of the carriage stages 7A and 7B is detachably provided to the apparatus main body by a connector so that a distal end portion of the component supply unit 8 on the component supply side faces a conveyance path of the printed circuit board P. When the respective loading platforms 7A and 7B are normally mounted on the apparatus main body, power is supplied to the component supply unit 8 mounted on the loading platforms 7A and 7B. When the operator releases the coupling and pulls the handle, the carriage platforms 7A and 7B can be moved by the casters provided on the lower surface.

The beams 4A and 4B are a pair of front and rear members long in the X direction. By driving a Y drive motor 15 (see fig. 4) which is a linear motor, sliders fixed to the beams 4A and 4B slide along a pair of left and right guides extending in the front-rear direction, and the beams 4A and 4B move independently in the Y direction. The Y drive motor 15 includes a pair of upper and lower stators fixed along the pair of left and right bases 1A, 1B, and a mover 9A fixed to a lower portion of a mounting plate provided at both end portions of the beams 4A, 4B.

The beams 4A and 4B are provided with mounting heads 6 on the inner sides thereof, respectively, and the mounting heads 6 are moved along the guide in the longitudinal direction (X direction) by driving X drive motors 16 (see fig. 4) of the linear motors. The X drive motor 16 includes a pair of front and rear stators fixed to the beams 4A and 4B, and a mover provided between the stators and to the mounting head 6.

The mounting heads 6 are disposed inside the beams 4A and 4B, respectively, in a state of facing each other. The mounting head 6 on the rear side performs a picking operation of picking up the electronic component D from the component supply unit 8 of the corresponding component supply device 3A on the rear side, and can mount the printed circuit board P on the transfer device 2. The near-side mounting head 6 can take out the electronic component D from the corresponding near-side component supply device 3B and mount the electronic component D on the printed board P.

Each mounting head 6 is movably mounted to the beams 4A, 4B by a mount 6C. In the mounting head 6, a plurality of suction nozzles 5 as component holders are provided at prescribed intervals. The suction nozzle 5 is vertically movable by driving of a nozzle lifting motor 17 (see fig. 4), and is rotatable by driving of a θ driving motor 18 (see fig. 4). The suction nozzle 5 takes out the electronic component D from the component supply unit 8 and mounts the taken-out electronic component D on the printed circuit board P.

The component supply unit 8 includes a tape feed mechanism and a cover tape exfoliating mechanism. The tape feed mechanism includes a sprocket that intermittently feeds a storage tape of the electronic component D. The storage tape includes a carrier tape for storing the electronic component D and a cover tape for covering the carrier tape, and is sequentially drawn out in a state wound around supply reels rotatably mounted on the carrier tables 7A and 7B. The storage belt is provided with feeding holes which are arranged at specified intervals, and the teeth of the chain wheel are embedded with the feeding holes. The tape feeding mechanism rotates the feed sprocket by a predetermined angle by a feed motor, and intermittently feeds the storage tape to a component suction/removal position of the electronic component D. The cover tape peeling mechanism peels the cover tape from the carrier tape in front of the suction taking-out position based on the driving of the peeling motor. The component supply unit 8 sequentially supplies the electronic components D loaded in the storage sections of the carrier tape to the component suction and pickup positions by peeling the cover tape by the cover tape peeling mechanism.

Instead of the component supply unit 8 described above, the following structure may be adopted: a tray in which electronic components D are set at a predetermined interval in the XY direction is placed on the component supplying device 3A. In this case, the mounting head 6 takes out the electronic component D from the tray and mounts it on the printed circuit board P.

Each component recognition camera 10 images an electronic component D sucked and held by each suction nozzle 5 provided to each mounting head 6 from below before the electronic component D is mounted on the printed circuit board P.

The electronic component mounting apparatus 1 further includes a monitor 30 provided with a touch panel switch. The operator can perform operations such as starting or stopping the operation of the electronic component mounting apparatus 1 by pressing various touch panel switches displayed on the monitor 30.

Fig. 2 and 3 are side views of the substrate positioning portion in the electronic component mounting apparatus 1. As shown in the board positioning portion, the printed circuit board P is carried by the belt 32 mounted on the conveyor belts 2A and 2B, and is positioned and fixed by the clamping lever 33 (fixing means). The printed circuit board P is lifted by the holding lever 33, pressed against the groove top surface 34, positioned in the height direction and XY direction, and fixed.

The clamping rod 33 is driven by an air cylinder 35 (see fig. 4) to move up and down, thereby moving the printed circuit board P up and down. The lower surface of the printed circuit board P is supported by support pins 38 erected on a support table 37. The support pins 38 support the printed circuit board P so that the printed circuit board P does not bend downward when the electronic component D is mounted. The support table 37 moves up and down based on the driving of the support table lifting motor 20 (lifting unit). The printed circuit board P is placed on the belt 32 based on the lowering of the clamping lever 33 and the lowering of the support base 37. When the support pin 38 and the holding lever 33 are further lowered, these members are separated from the printed circuit board P.

As shown in fig. 2, the electronic component D is sucked and mounted to the fixed printed circuit board P by the suction nozzle 5 provided in the mounting head 6.

Next, an electrical structure of the electronic component mounting apparatus 1 is explained based on a control block diagram of fig. 4. The electronic component mounting apparatus 1 includes a control device 25 that collectively controls operations related to mounting of the electronic components D. The control device 25 includes a storage unit (storage device) that stores mounting coordinate information including X-direction, Y-direction, and angular position in the printed circuit board P in the mounting step number sequence (for each mounting sequence) of the electronic component D, mounting data including setting number information of each component supply unit 8, component library data including component setting position data relating to a component ID for each setting number of the component supply unit 8, size data, thickness data, and the like.

The control device 25 controls, by the drive circuit 39, the driving of the θ drive motor 18 for rotating the mounting head 6, the X drive motor 16 and the Y drive motor 15 as the movement drive sources of the mounting head 6, the nozzle elevation motor 17 for elevating the nozzles 5, and the like, based on the various data stored in the storage unit. The controller 25 also controls a support table lifting motor 20 that lifts and lowers the support table 37. The nozzle lifting motor 17 is a servo motor, and performs position control, speed control, and the like of an output shaft based on position information from a built-in encoder. Further, the magnitude of the load applied to the servomotor can be measured based on the magnitude of the current flowing through the servomotor.

The control device 25 performs image processing on the image of the electronic component D sucked to the suction nozzle 5 captured by the component recognition camera 10, and recognizes positional deviation or the like of the electronic component D with respect to the suction nozzle 5 by the image processing.

Fig. 5 is a side view of the substrate positioning portion when the electronic component D with the lead 41 is mounted on the printed circuit board P. Instead of the suction nozzles 5 for holding the electronic component D by vacuum suction, the mounting head 6 may be mounted with holding claws 40 (holding units) for holding the electronic component D so as to sandwich the left and right side surfaces thereof. The suction nozzle 5 is exchangeable with the gripping claws 40. The electronic component D provided with the lead wire 41 is gripped by the gripping claw 40, and the lead wire 41 is inserted into the hole 47 formed in the printed circuit board P (see fig. 6). The elevation of the gripping claw 40 installed in place of the suction nozzle 5 is also performed by the suction nozzle elevation motor 17. The opening and closing of the gripping claw 40 can be controlled by, for example, performing and releasing vacuum suction by the suction nozzle 5.

As shown in fig. 5, when the electronic component D is mounted by inserting the lead 41 of the electronic component D into the hole 47 (see fig. 6) bored in the printed circuit board P, the jig plate 47 is provided below the printed circuit board P. A bending jig pin 44 (bending member) for bending the lead 41 is provided upright on the jig plate. The clamp plate 46 is positioned and fixed on the support plate 37. The jig plate 46 (bending jig pin 44) is also raised and lowered in accordance with the raising and lowering of the support plate 37 by the support table raising and lowering motor 20. That is, as the lifting means for moving the bending jig pin 44 up and down, the support table lifting motor 20 which is a mechanism for lifting the support pin 38 is used.

The following describes the operation of removing and mounting the electronic component D. When the operator presses the operation start switch portion of the touch panel switch of the operation portion, not shown, the printed circuit board P is carried from the upstream side device to the board positioning portion of the electronic component mounting device 1, and the positioning operation of the printed circuit board P is executed by the positioning mechanism.

The control device 25 controls the suction nozzles 5 of the mounting heads 6 of the electronic component mounting apparatus 1 to suck and take out the electronic components D to be mounted from the component supply units 8 in accordance with mounting data and the like stored in the storage unit, the mounting data specifying the XY coordinate position, the rotational angle position around the vertical axis, the setting number, and the like of the printed circuit board P to be mounted. Each time each of the plurality of nozzles 5 of the mounting head 6 moves to a component supply position of the component supply unit 8 that supplies an electronic component D that should be taken out and stops, the electronic component D is taken out by the nozzle 5.

The electronic components D held by all the suction nozzles 5 within the same mounting head 6 are moved to above the component recognition camera 10 based on the movement of the mounting head 6 in the horizontal direction. Based on the recognition camera 10, all the electronic components D held by the plurality of suction nozzles 5 are photographed to perform position recognition in the horizontal direction with respect to the mounting head 6. The positional deviation obtained by the position recognition is corrected, and the electronic component D sucked by the suction nozzle 5 is sequentially mounted on the position to be mounted on the printed circuit board P.

After all the electronic components D designated by the mounting data are mounted on the printed circuit board P, the controller 25 controls the air cylinder 35 and the support table raising and lowering motor 20 to lower the holding rod 33 and the support table 37. As a result, as shown in fig. 3, the printed circuit board P is transferred onto the belt 32 and conveyed in the downstream direction based on the movement of the belt 32. The next printed circuit board P is transported from upstream by the belt 32, and reaches the positioning position, the controller 25 raises the support table 37 and the holding lever 33. Based on this action, the next printed circuit board P is fixed as shown in fig. 2.

Next, a case will be described in which the electronic component D with the lead 41 is taken out from the component supplying apparatus 3A by the mounting head 6 provided with the holding claw 40. In this case, as shown in fig. 5, a jig plate 46 on which bending jig pins 44 stand is fixed to the support table 37 in advance. The upright position of the bending jig pin 44 in the XY direction is set in advance at a position immediately below the hole 47 into which the lead 41 is inserted. The rotational position around the axis of the vertical shaft is positioned and fixed so that the inclination direction of the inclined surface 49 described later is directed toward the direction in which the lead 41 is bent.

The bending jig pin 44 (pin member) is vertically long, and includes a distal end portion having an inclined surface 49 formed by being cut obliquely with respect to the longitudinal direction and a proximal end portion on the opposite side of the distal end portion. The bending jig pin 44 is erected so that the longitudinal direction thereof faces the vertical direction. That is, the base end portion is attached to the upper surface of the jig plate 46 so as to be oriented in a direction perpendicular to the jig plate 46 and the support table 37. The bending jig pin 44 may have a cylindrical shape or a corner post shape having a square or rectangular cross section.

Fig. 5 shows an example in which the inclined surface 49 cut out at the distal end portion of the bending jig pin 44 has an inclination of about 45 degrees with respect to the vertical direction, but the angle formed by the inclined surface 49 and the vertically long side surface in the side view shown in fig. 5 may be set to an angle slightly larger than 45 degrees. Moreover, the inclined surface 49 may be a plane inclined with a predetermined inclination with respect to the horizontal direction. The inclined surface 49 is linear (i.e., flat) in side view, but may be a curved surface that curves upward or downward. Further, it may be a polygonal line shape having a slope varying at a middle of the inclined surface.

Since the lead 41 is usually a metal lead, the bending jig pin 44 abutting against the lead is preferably made of a harder metal than the lead 41. As described above, the bending jig pin 44 has a shape having the inclined surface 49 which is obliquely cut and chamfered at the distal end portion. The distal end portion may be cut out in the horizontal direction to form a horizontal surface portion at the upper end so that the inclined chamfered surface (inclined surface) is located beside the horizontal surface.

When the worker mounts the jig plate 46 on the support table 37 in performing the work of mounting the electronic component D with the leads 41, the printed circuit board P is conveyed from upstream, and is stopped at a positioning position, for example, by being brought into contact with a regulating pin.

Next, based on a command from the control device 25, air is supplied to the air cylinder 35, the clamping rod 33 is raised, and the printed circuit board P is lifted up, brought into contact with the groove top surface 34, and pressed and fixed. At this time, as shown in fig. 5, the support table 37 is in a lowered position, and the bending jig pins 44 are spaced apart from the back surface (lower surface) of the printed circuit board P.

Fig. 6 (a) to (D) are side views sequentially showing a process in which the bending jig pin 44 bends the lead 41 of the electronic component D gripped by the gripping claw 40. The overall structure of the grasping claw 40 is schematically shown in fig. 6 (a). The grasping claw 40 includes a clamping portion 401, a push plate 402, a lifting member 403, and a spring 404. The clamping portion 401 is a member that grips a side portion of the electronic component D, and can be changed in posture between a gripping posture when pressed against the side portion and a releasing posture when separated from the side portion. The pusher 402 has a pressing surface which is in contact with the upper surface of the electronic component D and can press the electronic component D. The elevation member 403 is a member that is elevated by the nozzle elevation motor 17. The spring 404 is located between the upper surface of the push plate 402 and the lower surface of the elevation member 403.

Next, based on the mounting data, the electronic component D with the lead 41 is taken out from the component supply devices 3A and 3B, held and held by the holding claws 40, and conveyed in the same manner as described above. As shown in fig. 6 (a), the electronic component D is stopped at a position designated by the mounting data of the printed circuit board P. With the mounting head 6 thus stopped, the lead 41 is positioned directly above the hole portion 47 of the printed circuit board P. The bending jig pins 44 erected on the jig plate 46 are located at a distance from the printed circuit board P directly below the hole 47.

Next, based on the control of the control device 25, the drive of the nozzle lifting motor 17 and the support table lifting motor 20 is controlled to lift the gripping claws 40 and the support table 37 as shown in the timing chart shown in fig. 7. However, the height position of the support table 37 is a lowered position at the time of mounting the electronic component D with leads which is mounted on the printed circuit board P at the beginning, which is different from fig. 7.

First, the holding claw 40 holding the electronic component D is lowered from the mounting head 6 from the state of fig. 6 (a). Specifically, both side surfaces of the electronic component D, in which the lead 41 is directed vertically downward, are held by the holding portion 401, and the elevation member 403 is lowered by the nozzle elevation motor 17 in a state where the upper surface of the electronic component D is in contact with the push plate 402, whereby the electronic component D is lowered together with the holding portion 401 and the push plate 402. Based on this lowering, lead 41 of electronic component D enters hole 47. When the holding claw 40 is further lowered, the lead 41 is further lowered in the hole 47, and the electronic component D is lowered to a position where the bottom surface of the main body portion thereof abuts on the upper surface of the printed circuit board P (fig. 6 (b)). Since the diameter of the lead 41 is substantially the same as the diameter of the hole 47, even if there is a sliding resistance when the lead 41 passes through the hole 47, the nozzle elevation motor 17 can push the lead 41 by a driving force larger than the resistance.

At this time, the control device 25 monitors whether or not the gripping claws 40 are lowered to the positions in accordance with the lowering command of the gripping claws 40 from the control device 25, based on the output of an encoder, not shown, in order to check that the lead wire 41 is inserted into the hole portion 47 without hindrance. When it is detected that the distal end portion of the lead wire 41 has been inserted into the hole portion 41 and reaches a specific position that is lowered by a specified distance, it is determined that the lead wire 41 has been correctly inserted into the hole portion 41. When the arrival at the specific position is not detected after a predetermined time has elapsed since the instruction was issued, it is determined that the lead 41 is not correctly inserted into the hole 41. At this time, the driving force of the nozzle lifting motor 17, that is, the force applied to the gripping claws 40 is limited to such a small force that the lead wire 41 is not bent. If it is determined that lead 41 is not in the hole 47 and electronic component D cannot be lowered, controller 25 stops lowering of nozzle raising/lowering motor 17, for example, stops the operation of electronic component mounting apparatus 1.

After the electronic component D is lowered to a position where the bottom surface of the main body of the electronic component D abuts on the upper surface of the printed circuit board P, the controller 25 slightly further lowers the holding claw 40 (the raising and lowering member 403) and presses the electronic component D against the printed circuit board P by the push plate 402. A driving force for lowering the lifting member 403 relative to the mounting head 6 is applied to the push plate 402 via a spring 404. The spring 404 contracts, and only the lifting member 403 descends by the stroke amount of the pressing down, with the height direction position of the electronic component D unchanged. The spring 404 allows the elevation member 403 to descend by the amount of the stroke of the depression, absorbing the amount of descent of the elevation member 403. The pressing operation for compressing the spring 404 is the same as the operation when mounting the electronic component D without the lead 41 on the printed circuit board P coated with the cream solder.

At the time shown in fig. 6 (b), the support table 46 is in the lowered position, and the bending jig pin 44 is spaced downward from the lead 41. The nozzle elevation motor 17 is a servo motor, and presses the electronic component D downward by the holding claw 40. The control device 25 controls the driving force so that the output position (rotational position) of the nozzle elevation motor 17 is maintained at a constant position, without changing the height position of the gripping claw 40. Specifically, the control device 25 controls the motor current in accordance with the load based on the feedback of the position information from the encoder, and controls the driving force so that the rotor of the nozzle lifting motor 17 is at the rotational position indicated by the command. Further, the speed and acceleration of the output shaft of the nozzle lifting motor 1 obtained from the position information from the encoder may be controlled.

It is also possible to adopt a solution not provided with the spring 404 that allows the holding claw 40 to further press the electronic component D when the electronic component D reaches the printed circuit board P. In this case, the controller 25 may stop the lowering of the holding claw 40 at a position where the bottom surface of the main body of the electronic component D abuts against the printed circuit board P, and servo-control the driving force of the nozzle lifting motor 17 based on the monitoring of the encoder to maintain the position. In this case, the following control may be performed: the sensor is used to detect that the bottom of the main body of the electronic component D has come into contact with (landed on) the printed circuit board P, and the nozzle elevation motor 17 is stopped at this position and the height position is maintained.

Next, after the holding claw 40 is lowered and maintained at the position for a predetermined time (after counting by the raising timer), the control device 25 raises the support table 37 by driving the support table raising/lowering motor 20. Thereby, the bending jig pin 44 is raised toward the lead 41 (relative raising of the bending member with respect to the substrate). The lead 41 of the electronic component D in a state of being pressed down from above by the holding claw 40 (push plate 402) abuts against an inclined surface formed on the upper end of the bending jig pin 44. When the bending jig pin 44 is further raised, the lower end of the lead 41 is bent outward along the inclined surface 49 of the bending jig pin 44 as the raising is performed. The lead 41 is bent with the lower end position of the hole 47, which is the position of the opening of the hole 47 on the lower end surface of the printed circuit board P, as a fulcrum. Since the electronic component D is pressed from above by the push plate 402, the position of the fulcrum of the bending does not change depending on the rising position of the bending jig pin 44. Therefore, the lead 41 is easily bent.

In this way, the lead 41 is bent along the inclination of the inclined surface 49 of the bending jig pin 44 with the lower end position of the hole 47 as a fulcrum, to both outer sides as shown in fig. 6 (c), and the electronic component D is mounted on the printed circuit board P. Since the lead is bent along the inclination of the inclined surface 49 of the bending jig pin 44 at an angle of about 45 degrees with respect to the horizontal plane, that is, with respect to the bottom surface of the printed circuit board P, even if vibration occurs during transportation of the belt 32 of the printed circuit board P or the like, it is possible to avoid the lead 41 from coming off upward from the hole 47 and the electronic component D from falling. Further, even if the printed circuit board P is inverted by 180 degrees in this state and the electronic component D is directed downward, the electronic component D is not easily detached. If the inclined surface 49 of the bending jig pin 44 is inclined at an angle smaller than 45 degrees with respect to the bottom surface of the printed circuit board P and the lead 41 is bent along the angle, the electronic component D can be made more difficult to detach.

In the middle of the bending of the lead 41, the pressing force of the bending jig pin 44, that is, the driving force of the support table elevating motor 20 that pushes up the support table 37 is divided into a force in the direction of bending the lead 41 and a force of pushing up the electronic component D via the lead 41. The control device 25 controls the nozzle elevation motor 17 to apply a driving force (holding force) to the gripping claws 40 with respect to the force for pushing up the electronic component D so that the height position of the gripping claws 40 can be maintained. Therefore, the electronic component D is not pushed up. Therefore, the height position of the lead 41 does not change, and the position of the fulcrum of bending of the lead 41 does not change.

When the aforementioned electronic component D reaches the printed circuit board P, the spring 404 allowing further depression of the elevation member 403 is compressed to some extent based on the upward urging force from the bending jig pin 44. Even if the electronic component D is raised by a slight amount in this manner, if the change in the position of the fulcrum of the bending of the lead 41 is small, the bending operation of the lead 41 is less affected.

Generally, the amount of displacement of the spring 404 is small. Therefore, the spring 404 reaches the limit position such as the compression of the spring 404 immediately by the pressing of the bending jig pin 44, and the spring 404 does not displace beyond the limit. Thereafter, the height position of the holding claw 40, that is, the height of the lead 41 of the electronic component D can be kept unchanged based on the holding force of the nozzle elevation motor 17, and the position of the fulcrum at which the lead 41 is bent can be maintained. Further, when the holding claw 40 (the elevation member 403) is further lowered after the electronic component D is brought into contact with the printed circuit board P, the elevation member 403 may be lowered to a position at which the spring 404 is compressed to the limit and then stopped. In this case, the force generated when the spring 404 is compressed to the limit is set to be smaller than the driving force that can be generated by the nozzle lifting motor 17 and does not damage the electronic component D such as damage.

Since the driving force of the nozzle elevation motor 17 is limited to a predetermined force, when a force more than necessary is applied to the electronic component D due to a phenomenon that the lead 41 cannot be bent as usual, it is possible to avoid the occurrence of damage to the electronic component D. The force for lifting the electronic component D by the driving force of the support base lifting motor 20 is larger than the driving force of the nozzle lifting motor 17 restricted in this way, and there is a possibility that the electronic component D is lifted and the holding claw 40 is lifted. In view of such a situation, for example, the following embodiments may be adopted: the rise of the gripping claw 40 is detected based on the output of the encoder of the nozzle lifting motor 17, the driving of the support table lifting motor 20 is stopped, and the state is notified to the operator.

In the above case, the support table lifting motor 20 does not need to be a servo motor, but the driving force may be controlled and the position may be monitored by using a servo motor. If the driving force of the support table lifting motor 20 is also controlled by using it as a servo motor, the force applied to the electronic component D can be controlled to such an extent that the electronic component is not damaged. Alternatively, the following embodiments may be adopted: the bending jig pin 44 is vertically movable with respect to the jig plate 46 via a spring. In this case, when the support table 37 is raised, the bending jig pin 44 is pushed up by the force of the spring, and the lead 41 abuts against the inclined surface 49. Thereby, the lead 41 is bent.

When the support table 37 is raised to a position where the upper end portion of the bending jig pin 44 almost abuts on the lower end surface of the printed circuit board P, the controller 25 stops the raising of the support table 37 as shown in fig. 6 (c). Then, the grip portion 401 of the holding claw 40 is opened in the horizontal direction, and the grip, that is, the holding of the electronic component D is released. After that, after a predetermined time (the mounting stay time of fig. 7) has elapsed, the control device 25 controls the driving of the nozzle lifting motor 17 to lift the gripping claw 40.

Next, the controller 25 starts lowering the support table 37 before performing the mounting operation (lowering operation) of the next leaded electronic component D, and stops it at the lowered position before starting lowering of the next leaded electronic component D ((D) of fig. 6). The next mounting operation of the electronic component D is also performed in the same manner as described above.

In the electronic component mounting apparatus 1, after the mounting of all the electronic components D specified by the mounting data to be mounted on the printed circuit board P is completed, the support table 37 is lowered and the holding lever 33 is lowered. The printed circuit board P is placed on the belt 32 and is transported to a downstream device by the movement of the belt 32.

In the above-described embodiment, the case where the servo motor is used as the nozzle lifting motor 17 is described. Instead of this embodiment, a pulse motor or the like that does not perform position monitoring by an encoder may be used as the nozzle lifting motor 17 to perform the above-described operations. Further, an air cylinder may be used. In this case, the air cylinder is stopped in a state where the holding claw 40 is lowered to insert the lead 41 into the hole 47 and the lead 41 protrudes from the lower end surface of the printed circuit board P by a predetermined length. It is sufficient to fix the air cylinder in such a manner that the height position is maintained with a force greater than the upward thrust from below. In this state, the bending jig pins 44 are pushed up from below by the driving of the support table lifting motor 20, so that the leads 41 can be bent without changing the height position of the electronic component D.

The stop position of the nozzle elevation motor 17 may be controlled so that the lead 41 is not completely inserted into the hole 47 of the printed circuit board P and the main body bottom surface of the electronic component D is spaced apart from the upper surface of the printed circuit board P, and a caulking (pinching) operation, that is, a bending operation of bending the lead 41 by pushing up the bending jig pin 44 may be performed. Even in this case, since the position of the fulcrum of the bending of the lead 41 does not change, the lead 41 can be easily bent. The stop position of the grasping claw 40 can be changed variously for each element D, and the lead wire 41 can be swaged at a desired position.

The holding unit that holds the electronic component D with leads and inserts the leads 41 into the hole portions 47 of the printed circuit board P may use the suction nozzle 5 that vacuum-sucks the electronic component D instead of the holding claw 40 of the present embodiment. In this case as well, the lead 41 can be bent. However, when the electronic component D is held by the holding claws 40 from the lateral direction, it is advantageous to avoid a positional deviation in the horizontal direction when the electronic component D is inserted and pushed into the hole 47, as compared with the case where the electronic component D is held by the suction nozzle 5 only by vacuum suction.

In the above embodiment, an example is shown in which the support base 37 on which the bending jig pin 44 is mounted is raised and the bending jig pin 44 is brought into pressure contact with the lead 41. Instead of this example, the following technical solution may be adopted: the printed circuit board P is lowered, and the inclined surface 49 of the upper portion of the bending jig pin 44 is pressed against the lead 41 to be bent. That is, the bending jig pins 44 may be raised relative to the printed circuit board P. In this case, the holding claws 40 also need to be lowered together with the substrate P in the case of press-contacting the component D to the substrate P. That is, the bending jig pin 44 is brought into relative proximity to the substrate P, and the inclined surface 49 is pressed against the lead 41.

The electronic component mounting apparatus 1 is preferably capable of mounting not only the electronic component D with leads on the printed circuit board P but also an electronic component without the leads 41 inserted into the hole portions 47 on the printed circuit board P. In this case, a support pin 38 is also erected on the support table 37 on which a jig plate 46 on which the bending jig pin 44 is erected is provided. In this embodiment, the electronic component D with leads can be mounted on the printed circuit board P, and another electronic component mounted on the surface of the printed circuit board P without the leads 41 can be attached to the same substrate surface of the printed circuit board P by suction by the suction nozzle 5 or by holding by the holding claw 40.

While the embodiments of the present invention have been described above, those skilled in the art can make various substitutions, modifications, and alterations based on the above description, and the present invention includes the various substitutions, modifications, and alterations described above without departing from the spirit of the present invention.

As described above, according to the present invention, the following operations can be realized by a simple mechanism: the lead of the element is inserted into a hole formed in the substrate and bent so that the element is not easily detached from the substrate.

Claims

1. A component mounting apparatus (1) for mounting a component (D) on a substrate (P) having a hole portion (47), comprising:

a fixing unit (33) for positioning the substrate (P) and fixing the substrate;

a holding unit (40) which holds a leaded component (D) and lowers the component so as to insert the lead (41) of the component into the hole (47);

a bending member (44) that bends a lead (41) of the element inserted into the substrate fixed by the fixing unit (33) by pressing an inclined surface (49) formed at the upper portion of the bending member against the lead;

a lifting unit for lifting the bending member (44) relative to the substrate to press the inclined surface (49) to the lead (41) of the element;

a control device (25) for controlling the operations of the holding unit (40) and the lifting unit,

the control device (25) controls the lifting unit so that the bending member (44) is at a position separated downward from the lead (41) before the holding unit (40) finishes inserting the lead (41) into the hole (47),

the control device (25) controls the lifting unit so that the bending member (44) is lifted in a state where the holding unit (40) presses the element (D) in which the lead (41) is inserted into the hole (47) of the substrate (P) from above after the holding unit (40) completes insertion of the lead (41) into the hole (47).

2. The component mounting apparatus according to claim 1, characterized by further comprising:

support pins (38) for supporting the substrate (P) so that the substrate (P) does not bend downward when the component (D) is mounted; wherein,

a mechanism that raises and lowers the support pin (38) is used as the raising and lowering unit.

3. The component mounting apparatus according to claim 2, characterized by further comprising:

a support table (37) provided below the substrate (P) and provided with the support pins (38) upright; wherein,

the bending member (44) is positioned and fixed on the support table (37) when the leaded component (D) is mounted,

the lifting unit lifts the support table (37).

4. A component mounting apparatus according to any one of claims 1 to 3, wherein:

the bending member (44) is formed by a pin member which is long in the vertical direction,

the inclined surface (49) is formed by obliquely cutting the distal end portion of the pin member with respect to the longitudinal direction of the pin member.

5. A component mounting apparatus according to any one of claims 1 to 3, wherein:

the lifting unit relatively lifts the bending member (44) to bend the lead in a state where the holding unit (40) presses the lead from above by an element inserted in the substrate.

6. A component mounting apparatus according to any one of claims 1 to 3, characterized by further comprising:

and a servo motor (17) for moving up and down the holding unit (40).

7. The component mounting apparatus according to claim 5, wherein:

the lifting unit is a first motor for lifting the bending member (44),

the component mounting apparatus further includes:

a second motor (17) that raises and lowers the holding unit (40);

a control device (25) that controls driving of the first motor and the second motor (17); wherein,

the control device (25) causes the second motor (17) to generate a driving force and to form a state of pressing the element from above, and causes the first motor to operate to raise the bending member (44),

the control device (25) controls the driving force of the second motor (17) so as to maintain the height position of the holding unit (40) against the upward pushing force applied to the element (D) via the lead wire (41) due to the elevation.

8. A component mounting apparatus in accordance with claim 1, wherein:

the component mounting device (1) is capable of mounting a component, which does not have a lead inserted into the hole, on the substrate.