CN106332475A - Manufacturing method for depth-control stepped metalized blind groove PCB - Google Patents
Manufacturing method for depth-control stepped metalized blind groove PCB Download PDFInfo
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- CN106332475A CN106332475A CN201610777316.0A CN201610777316A CN106332475A CN 106332475 A CN106332475 A CN 106332475A CN 201610777316 A CN201610777316 A CN 201610777316A CN 106332475 A CN106332475 A CN 106332475A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a manufacturing method for a depth-control stepped metalized blind groove, and the method comprises the steps: material cutting: cutting a raw material according to the specification and size of a PCB; primary drilling: enabling the PCB to be placed on a drilling floor, and drilling a via hole according to the design requirements of the PCB; groove milling: enabling the PCB to be fixed on a milled platform plate after the primary drilling, carrying out the milling of a depth control hole on the PCB through employing a flat-bottom mill tool, and then carrying out the milling of a plate edge PTH semi-groove; first plate baking; glue slag removal: removing the glue slag on the PCB after the first plate baking; copper plating: carrying out the copper plating of the PCB after glue slag removal; second plate baking; and the sequential board power, outer layer circuit, pattern plating, the first secondary plate milling, outer layer etching, outer layer AOI, welding prevention, text and surface processing, secondary plate milling, testing and FQC of the PCB after the second plate baking. The method can guarantee the bottom flatness of the blind groove, can meet a purpose that the tolerance of the depth of the milling blind groove can be controlled within the range of +/-0.15mm. Plate baking operations are carried out before and after copper plating, thereby effectively preventing a cladding layer from being separated.
Description
Technical field
The present invention relates to a kind of manufacture method controlling deep ladder metallization blind slot pcb board.
Background technology
Along with modern electronic product day by day to miniaturization, highly integrated, the trend development of high frequency, bury the stream day by day of unit's plate
OK, portioned product starts to introduce blind slot design, for mounting related components or fixing product, improves overall product integrated level or reaches
The effect of the shielding of signal.
Metallization blind slot on pcb board typically will welding component, utilize blind slot to carry out welding and fixing product, therefore
Solderability test to blind slot has strict requirements.The most easily occur blind slot to carry out during thermal stress test and produce coating and base
The segregation phenomenon of material, causes that final problem is forced to stop line or refusal because reliability testing fails to meet customer need etc.
Order, causes the biggest economic loss to company.
Summary of the invention
For the deficiencies in the prior art, it is desirable to provide a kind of making side controlling deep ladder metallization blind slot pcb board
Method, it is ensured that bottom blind slot, flatness is good, can meet the allowance control of the degree of depth of milling blind slot at ± 0.15mm, carries out before and after heavy copper
Baking sheet, effectively prevents coating from separating.
The present invention is achieved through the following technical solutions.
A kind of manufacture method controlling deep ladder metallization blind slot pcb board, it is characterised in that comprise the steps:
Sawing sheet, carries out cutting by raw material according to PCB specification；
Once hole, PCB is placed on rig floor and gets out the via required according to PCB design；
Groove milling, is fixed on the PCB after once boring on the landing slab that milling is good, uses flat gong cutter first on PCB
Mill out control deep trouth, then mill out edges of boards PTH half groove；
Baking sheet for the first time, carries out baking sheet for the first time by the PCB after groove milling；
De-smear, removes removing residual glue slag by the PCB after first time baking sheet；
Heavy copper, carries out heavy Copper treatment by the PCB after de-smear；
Baking sheet for the second time, carries out second time baking sheet by the PCB after heavy Copper treatment；
PCB through second time baking sheet is carried out successively plate electricity, outer-layer circuit, graphic plating, for the first time time milling plate, outer layer
Etching, outer layer AOI, anti-welding, word, surface process, milling plate, test, FQC for the second time.
Preferably, step after baking sheet is for the second time:
Plate electricity, copper of re-plating in heavy layers of copper, make copper thickness meet requirement；
Outer-layer circuit, uses the mode of egative film exposure, is designed like on PCB by circuit；
Graphic plating, the copper face being not covered with for dry film carries out selectivity thickening, concurrently forms the circuit of needs；
Milling plate for the first time, mills out non-metallic cell wall；
Outer layer etches, and the etching after being shaped by graphic plating is out；
Outer layer AOI, inspection PCB circuit is the most defective；
Anti-welding, PCB coats protective ink；
Word, printing mark word on PCB, it is simple to identify；
Surface processes, and forms one layer of solderable coat at anti-welding unprotected copper face；
Milling plate for the second time, mills out required effective unit；
Test, to PCB electrical measurement, confirms electrical property；
FQC, appearance test.
Preferably, the baking sheet temperature in described first time baking sheet step is (Tg+10)～(Tg+20) DEG C, and the baking sheet time is 2
～4h, wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid.
Preferably, the baking sheet temperature in described first time baking sheet step is (Tg+10)～(Tg+15) DEG C, and the baking sheet time is 2
～3h, wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid.
Preferably, the baking sheet temperature in described first time baking sheet step is (Tg+10) DEG C, and the baking sheet time is 2h, wherein Tg
Refer to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid.
Preferably, the baking sheet temperature in described second time baking sheet step is (Tg+10)～(Tg+20) DEG C, and the baking sheet time is 2
～4h, wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid.
Preferably, the baking sheet temperature in described second time baking sheet step is (Tg+10)～(Tg+15) DEG C, and the baking sheet time is 3
～4h, wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid.
Preferably, the baking sheet temperature in described second time baking sheet step is (Tg+10) DEG C, and the baking sheet time is 4h, wherein Tg
Refer to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid.
Preferably, that closes milling machine in described groove milling step puts cutter function automatically, makes milling machine all the time with the milling cutter selected
Mill out control deep trouth and PTH half groove.
Preferably, also include milling landing slab, before i.e. producing, use flat gong cutter by smooth for the landing slab milling on milling machine, it is to avoid
The superposition tolerance caused because of table top out-of-flatness.
Compared with prior art, the invention have the advantage that the present invention, by carrying out baking sheet before heavy copper, is carried out after heavy copper again
Baking sheet, strictly controls baking sheet temperature and time well, it is possible to effectively prevent the separation of coating and base material；Wherein baking sheet principle is: heavy
Baking sheet before copper, when blind slot makes, the milling cutter effect run up because of sheet material PP sheet, make the blind slot top layer base material after molding relatively
For lax, if the most directly carrying out sink copper plate electric, not the most the finest and close because of substrate, once being tested it by high temperature reliability
After, produce lamination immediately, and if before heavy copper temperature through (Tg+10)～(Tg+20) DEG C carry out baking sheet, then blind slot table
Layer by resin at the glass of milling cutter garnetting can at high temperature self-regeneration, again form close base material, sink copper the most again, can increase
Add the adhesion of coating and base material；After heavy copper or plate electricity, the most residual in the small gap between coating and coating and base material have water
Point, although these moisture will not destroy the combination of coating performance and coating and base material, but have the retroaction of reduction, thus heavy
Carry out baking sheet by the temperature of sheet material (Tg+10)～(Tg+20) DEG C after copper or plate electricity, unnecessary moisture can not only be drained, also
Can further adhesion between curing substrate resin tooth coating and base material；By the present invention in that with flat gong cutter, it is ensured that blind
Trench bottom flatness is good；The present invention produces front by smooth for landing slab milling, is avoided that the superposition tolerance caused because of table top out-of-flatness, enters
One step ensures that bottom blind slot, flatness is good；The present invention is put into function automatically by closedown milling machine, mills out control deep trouth and PTH half
Groove, it is to avoid because changing the fitment tolerance superposition that cutter produces, be further ensured that bottom blind slot, flatness is good；Bottom blind slot of the present invention
Flatness is good, can meet the allowance control of the degree of depth of milling blind slot at ± 0.15mm, meet lean product requirement.
Detailed description of the invention
Below in conjunction with specific embodiment, the invention will be further described, but not as limiting to the invention.
Embodiment 1
A kind of manufacture method controlling deep ladder metallization blind slot pcb board, it is characterised in that comprise the steps:
Milling landing slab, uses flat gong cutter by smooth for the landing slab milling on milling machine, it is to avoid because table top out-of-flatness is made before producing
The superposition tolerance become；
Sawing sheet, carries out cutting by raw material according to PCB specification；
Once hole, PCB is placed on rig floor and gets out the via required according to PCB design；
Groove milling, is fixed on the PCB after once boring on the landing slab that milling is good, and that closes milling machine puts slicing technique automatically
Can, make milling machine first mill out control deep trouth on PCB with the flat gong cutter selected all the time, then mill out edges of boards PTH half groove；
Baking sheet for the first time, carries out baking sheet for the first time by the PCB after groove milling, and baking sheet temperature is Tg+10 DEG C, the baking sheet time
For 2h, wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid；
De-smear, removes removing residual glue slag by the PCB after first time baking sheet；
Heavy copper, carries out heavy Copper treatment by the PCB after de-smear；
Baking sheet for the second time, carries out second time baking sheet by the PCB after heavy Copper treatment, and baking sheet temperature is Tg+10 DEG C, baking sheet
Time is 2h, and wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid；
PCB through second time baking sheet is carried out successively plate electricity, outer-layer circuit, graphic plating, for the first time time milling plate, outer layer
Etching, outer layer AOI, anti-welding, word, surface process, milling plate, test, FQC for the second time；
Wherein:
Plate electricity, copper of re-plating in heavy layers of copper, make copper thickness meet requirement；
Outer-layer circuit, uses the mode of egative film exposure, is designed like on PCB by circuit；
Graphic plating, the copper face being not covered with for dry film carries out selectivity thickening, concurrently forms the circuit of needs；
Milling plate for the first time, mills out non-metallic cell wall；
Outer layer etches, and the etching after being shaped by graphic plating is out；
Outer layer AOI, inspection PCB circuit is the most defective；
Anti-welding, PCB coats protective ink；
Word, printing mark word on PCB, it is simple to identify；
Surface processes, and forms one layer of solderable coat at anti-welding unprotected copper face；
Milling plate for the second time, mills out required effective unit；
Test, to PCB electrical measurement, confirms electrical property；
FQC, appearance test.
Embodiment 2
A kind of manufacture method controlling deep ladder metallization blind slot pcb board, it is characterised in that comprise the steps:
Milling landing slab, uses flat gong cutter by smooth for the landing slab milling on milling machine, it is to avoid because table top out-of-flatness is made before producing
The superposition tolerance become；
Sawing sheet, carries out cutting by raw material according to PCB specification；
Once hole, PCB is placed on rig floor and gets out the via required according to PCB design；
Groove milling, is fixed on the PCB after once boring on the landing slab that milling is good, and that closes milling machine puts slicing technique automatically
Can, make milling machine first mill out control deep trouth on PCB with the flat gong cutter selected all the time, then mill out edges of boards PTH half groove；
Baking sheet for the first time, carries out baking sheet for the first time by the PCB after groove milling, and baking sheet temperature is Tg+15 DEG C, the baking sheet time
For 3h, wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid；
De-smear, removes removing residual glue slag by the PCB after first time baking sheet；
Heavy copper, carries out heavy Copper treatment by the PCB after de-smear；
Baking sheet for the second time, carries out second time baking sheet by the PCB after heavy Copper treatment, and baking sheet temperature is Tg+15 DEG C, baking sheet
Time is 3h, and wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid；
PCB through second time baking sheet is carried out successively plate electricity, outer-layer circuit, graphic plating, for the first time time milling plate, outer layer
Etching, outer layer AOI, anti-welding, word, surface process, milling plate, test, FQC for the second time；
Wherein:
Plate electricity, copper of re-plating in heavy layers of copper, make copper thickness meet requirement；
Outer-layer circuit, uses the mode of egative film exposure, is designed like on PCB by circuit；
Graphic plating, the copper face being not covered with for dry film carries out selectivity thickening, concurrently forms the circuit of needs；
Milling plate for the first time, mills out non-metallic cell wall；
Outer layer etches, and the etching after being shaped by graphic plating is out；
Outer layer AOI, inspection PCB circuit is the most defective；
Anti-welding, PCB coats protective ink；
Word, printing mark word on PCB, it is simple to identify；
Surface processes, and forms one layer of solderable coat at anti-welding unprotected copper face；
Milling plate for the second time, mills out required effective unit；
Test, to PCB electrical measurement, confirms electrical property；
FQC, appearance test.
Embodiment 3
A kind of manufacture method controlling deep ladder metallization blind slot pcb board, it is characterised in that comprise the steps:
Milling landing slab, uses flat gong cutter by smooth for the landing slab milling on milling machine, it is to avoid because table top out-of-flatness is made before producing
The superposition tolerance become；
Sawing sheet, carries out cutting by raw material according to PCB specification；
Once hole, PCB is placed on rig floor and gets out the via required according to PCB design；
Groove milling, is fixed on the PCB after once boring on the landing slab that milling is good, and that closes milling machine puts slicing technique automatically
Can, make milling machine first mill out control deep trouth on PCB with the flat gong cutter selected all the time, then mill out edges of boards PTH half groove；
Baking sheet for the first time, carries out baking sheet for the first time by the PCB after groove milling, and baking sheet temperature is Tg+20 DEG C, the baking sheet time
For 4h, wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid；
De-smear, removes removing residual glue slag by the PCB after first time baking sheet；
Heavy copper, carries out heavy Copper treatment by the PCB after de-smear；
Baking sheet for the second time, carries out second time baking sheet by the PCB after heavy Copper treatment, and baking sheet temperature is Tg+20 DEG C, baking sheet
Time is 4h, and wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid；
PCB through second time baking sheet is carried out successively plate electricity, outer-layer circuit, graphic plating, for the first time time milling plate, outer layer
Etching, outer layer AOI, anti-welding, word, surface process, milling plate, test, FQC for the second time；
Wherein:
Plate electricity, copper of re-plating in heavy layers of copper, make copper thickness meet requirement；
Outer-layer circuit, uses the mode of egative film exposure, is designed like on PCB by circuit；
Graphic plating, the copper face being not covered with for dry film carries out selectivity thickening, concurrently forms the circuit of needs；
Milling plate for the first time, mills out non-metallic cell wall；
Outer layer etches, and the etching after being shaped by graphic plating is out；
Outer layer AOI, inspection PCB circuit is the most defective；
Anti-welding, PCB coats protective ink；
Word, printing mark word on PCB, it is simple to identify；
Surface processes, and forms one layer of solderable coat at anti-welding unprotected copper face；
Milling plate for the second time, mills out required effective unit；
Test, to PCB electrical measurement, confirms electrical property；
FQC, appearance test.
Embodiment 4
A kind of manufacture method controlling deep ladder metallization blind slot pcb board, it is characterised in that comprise the steps:
Milling landing slab, uses flat gong cutter by smooth for the landing slab milling on milling machine, it is to avoid because table top out-of-flatness is made before producing
The superposition tolerance become；
Sawing sheet, carries out cutting by raw material according to PCB specification；
Once hole, PCB is placed on rig floor and gets out the via required according to PCB design；
Groove milling, is fixed on the PCB after once boring on the landing slab that milling is good, and that closes milling machine puts slicing technique automatically
Can, make milling machine first mill out control deep trouth on PCB with the flat gong cutter selected all the time, then mill out edges of boards PTH half groove；
Baking sheet for the first time, carries out baking sheet for the first time by the PCB after groove milling, and baking sheet temperature is Tg+10 DEG C, the baking sheet time
For 2h, wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid；
De-smear, removes removing residual glue slag by the PCB after first time baking sheet；
Heavy copper, carries out heavy Copper treatment by the PCB after de-smear；
Baking sheet for the second time, carries out second time baking sheet by the PCB after heavy Copper treatment, and baking sheet temperature is Tg+10 DEG C, baking sheet
Time is 4h, and wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid；
PCB through second time baking sheet is carried out successively plate electricity, outer-layer circuit, graphic plating, for the first time time milling plate, outer layer
Etching, outer layer AOI, anti-welding, word, surface process, milling plate, test, FQC for the second time；
Wherein:
Plate electricity, copper of re-plating in heavy layers of copper, make copper thickness meet requirement；
Outer-layer circuit, uses the mode of egative film exposure, is designed like on PCB by circuit；
Graphic plating, the copper face being not covered with for dry film carries out selectivity thickening, concurrently forms the circuit of needs；
Milling plate for the first time, mills out non-metallic cell wall；
Outer layer etches, and the etching after being shaped by graphic plating is out；
Outer layer AOI, inspection PCB circuit is the most defective；
Anti-welding, PCB coats protective ink；
Word, printing mark word on PCB, it is simple to identify；
Surface processes, and forms one layer of solderable coat at anti-welding unprotected copper face；
Milling plate for the second time, mills out required effective unit；
Test, to PCB electrical measurement, confirms electrical property；
FQC, appearance test.
Embodiment 5
A kind of manufacture method controlling deep ladder metallization blind slot pcb board, it is characterised in that comprise the steps:
Milling landing slab, uses flat gong cutter by smooth for the landing slab milling on milling machine, it is to avoid because table top out-of-flatness is made before producing
The superposition tolerance become；
Sawing sheet, carries out cutting by raw material according to PCB specification；
Once hole, PCB is placed on rig floor and gets out the via required according to PCB design；
Groove milling, is fixed on the PCB after once boring on the landing slab that milling is good, and that closes milling machine puts slicing technique automatically
Can, make milling machine first mill out control deep trouth on PCB with the flat gong cutter selected all the time, then mill out edges of boards PTH half groove；
Baking sheet for the first time, carries out baking sheet for the first time by the PCB after groove milling, and baking sheet temperature is Tg+10 DEG C, the baking sheet time
For 3h, wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid；
De-smear, removes removing residual glue slag by the PCB after first time baking sheet；
Heavy copper, carries out heavy Copper treatment by the PCB after de-smear；
Baking sheet for the second time, carries out second time baking sheet by the PCB after heavy Copper treatment, and baking sheet temperature is Tg+10 DEG C, baking sheet
Time is 4h, and wherein Tg refers to that described raw material is by the critical temperature that solid-state thawing is rubbery state liquid；
PCB through second time baking sheet is carried out successively plate electricity, outer-layer circuit, graphic plating, for the first time time milling plate, outer layer
Etching, outer layer AOI, anti-welding, word, surface process, milling plate, test, FQC for the second time；
Wherein:
Plate electricity, copper of re-plating in heavy layers of copper, make copper thickness meet requirement；
Outer-layer circuit, uses the mode of egative film exposure, is designed like on PCB by circuit；
Graphic plating, the copper face being not covered with for dry film carries out selectivity thickening, concurrently forms the circuit of needs；
Milling plate for the first time, mills out non-metallic cell wall；
Outer layer etches, and the etching after being shaped by graphic plating is out；
Outer layer AOI, inspection PCB circuit is the most defective；
Anti-welding, PCB coats protective ink；
Word, printing mark word on PCB, it is simple to identify；
Surface processes, and forms one layer of solderable coat at anti-welding unprotected copper face；
Milling plate for the second time, mills out required effective unit；
Test, to PCB electrical measurement, confirms electrical property；
FQC, appearance test.
Use traditional method and embodiment of the present invention 1-5 method respectively to produce 100 pieces and control deep ladder metallization blind slot PCB, point
The other blind slot to the PCB after producing carries out thermal stress test, show that the PCB reliability testing using produced in conventional processes was lost efficacy,
The PCB reliability testing using the present invention respectively to implement to produce is qualified.
The foregoing is only preferred embodiment of the present invention, not thereby limit embodiments of the present invention and protection model
Enclose, to those skilled in the art, it should can appreciate that the equivalent done by all utilization description of the invention contents is replaced
Change and obviously change obtained scheme, all should be included in protection scope of the present invention.
Claims (10)
1. the manufacture method controlling deep ladder metallization blind slot pcb board, it is characterised in that comprise the steps:
Sawing sheet, carries out cutting by raw material according to PCB specification；
Once hole, PCB is placed on rig floor and gets out the via required according to PCB design；
Groove milling, is fixed on the PCB after once boring on the landing slab that milling is good, uses flat gong cutter first to mill out on PCB
Control deep trouth, then mill out edges of boards PTH half groove；
Baking sheet for the first time, carries out baking sheet for the first time by the PCB after groove milling；
De-smear, removes removing residual glue slag by the PCB after first time baking sheet；
Heavy copper, carries out heavy Copper treatment by the PCB after de-smear；
Baking sheet for the second time, carries out second time baking sheet by the PCB after heavy Copper treatment；
PCB through second time baking sheet is carried out successively plate electricity, outer-layer circuit, graphic plating, for the first time time milling plate, outer layer erosion
Quarter, outer layer AOI, anti-welding, word, surface process, milling plate, test, FQC for the second time.
The manufacture method of control the most according to claim 1 deep ladder metallization blind slot pcb board, it is characterised in that for the second time
Step after baking sheet is:
Plate electricity, copper of re-plating in heavy layers of copper, make copper thickness meet requirement；
Outer-layer circuit, uses the mode of egative film exposure, is designed like on PCB by circuit；
Graphic plating, the copper face being not covered with for dry film carries out selectivity thickening, concurrently forms the circuit of needs；
Milling plate for the first time, mills out non-metallic cell wall；
Outer layer etches, and the etching after being shaped by graphic plating is out；
Outer layer AOI, inspection PCB circuit is the most defective；
Anti-welding, PCB coats protective ink；
Word, printing mark word on PCB, it is simple to identify；
Surface processes, and forms one layer of solderable coat at anti-welding unprotected copper face；
Milling plate for the second time, mills out required effective unit；
Test, to PCB electrical measurement, confirms electrical property；
FQC, appearance test.
The manufacture method of control the most according to claim 1 deep ladder metallization blind slot pcb board, it is characterised in that described the
Baking sheet temperature in baking sheet step is (Tg+10)～(Tg+20) DEG C, and the baking sheet time is 2～4h, and wherein Tg refers to described former
Material is by the critical temperature that solid-state thawing is rubbery state liquid.
The manufacture method of control the most according to claim 1 deep ladder metallization blind slot pcb board, it is characterised in that described the
Baking sheet temperature in baking sheet step is (Tg+10)～(Tg+15) DEG C, and the baking sheet time is 2～3h, and wherein Tg refers to described former
Material is by the critical temperature that solid-state thawing is rubbery state liquid.
The manufacture method of control the most according to claim 1 deep ladder metallization blind slot pcb board, it is characterised in that described the
Baking sheet temperature in baking sheet step is (Tg+10) DEG C, and the baking sheet time is 2h, and wherein Tg refers to that described raw material is melted by solid-state
Turn to the critical temperature of rubbery state liquid.
The manufacture method of control the most according to claim 1 deep ladder metallization blind slot pcb board, it is characterised in that described the
Baking sheet temperature in secondary baking sheet step is (Tg+10)～(Tg+20) DEG C, and the baking sheet time is 2～4h, and wherein Tg refers to described former
Material is by the critical temperature that solid-state thawing is rubbery state liquid.
The manufacture method of control the most according to claim 1 deep ladder metallization blind slot pcb board, it is characterised in that described the
Baking sheet temperature in secondary baking sheet step is (Tg+10)～(Tg+15) DEG C, and the baking sheet time is 3～4h, and wherein Tg refers to described former
Material is by the critical temperature that solid-state thawing is rubbery state liquid.
The manufacture method of control the most according to claim 1 deep ladder metallization blind slot pcb board, it is characterised in that described the
Baking sheet temperature in secondary baking sheet step is (Tg+10) DEG C, and the baking sheet time is 4h, and wherein Tg refers to that described raw material is melted by solid-state
Turn to the critical temperature of rubbery state liquid.
The manufacture method of control the most according to claim 1 deep ladder metallization blind slot pcb board, it is characterised in that described milling
That closes milling machine in groove step puts cutter function automatically, makes milling machine mill out control deep trouth and PTH half groove with the milling cutter selected all the time.
The manufacture method of control the most according to claim 1 deep ladder metallization blind slot pcb board, it is characterised in that also include
Milling landing slab, uses flat gong cutter by smooth for the landing slab milling on milling machine, it is to avoid because of folding that table top out-of-flatness causes before i.e. producing
Add tolerance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610777316.0A CN106332475A (en) | 2016-08-30 | 2016-08-30 | Manufacturing method for depth-control stepped metalized blind groove PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610777316.0A CN106332475A (en) | 2016-08-30 | 2016-08-30 | Manufacturing method for depth-control stepped metalized blind groove PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106332475A true CN106332475A (en) | 2017-01-11 |
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| CN201610777316.0A Pending CN106332475A (en) | 2016-08-30 | 2016-08-30 | Manufacturing method for depth-control stepped metalized blind groove PCB |
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| CN108174517A (en) * | 2018-01-04 | 2018-06-15 | 苏州统硕科技有限公司 | Full-automatic PCB substrate processing system |
| CN108381119A (en) * | 2018-01-29 | 2018-08-10 | 奥士康精密电路（惠州）有限公司 | A kind of PCB buries copper coin copper billet blind slot control depth method |
| CN108521713A (en) * | 2018-03-23 | 2018-09-11 | 珠海市金顺电子科技有限公司 | A kind of production method of the padded wiring board of Halogen |
| CN110881246A (en) * | 2019-12-04 | 2020-03-13 | 深圳市景旺电子股份有限公司 | Manufacturing method for improving routing white edge of golden finger PCB |
| CN112074095A (en) * | 2020-10-10 | 2020-12-11 | 黄石星河电路有限公司 | Thin plate processing method with 0.4MM metal half-holes designed around |
| CN113242653A (en) * | 2021-04-28 | 2021-08-10 | 定颖电子（昆山）有限公司 | Blind groove processing technology of circuit board |
| CN116329881A (en) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | Semi-groove product fishing processing method |
| CN117835599A (en) * | 2024-01-04 | 2024-04-05 | 清远市富盈电子有限公司 | Manufacturing method of PCB (printed circuit board) capable of reducing board explosion rate and PCB |
| CN117835592A (en) * | 2024-01-04 | 2024-04-05 | 清远市富盈电子有限公司 | PCB manufacturing method for preventing slotted hole copper layer from layering and PCB |
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| CN108174517A (en) * | 2018-01-04 | 2018-06-15 | 苏州统硕科技有限公司 | Full-automatic PCB substrate processing system |
| CN108381119A (en) * | 2018-01-29 | 2018-08-10 | 奥士康精密电路（惠州）有限公司 | A kind of PCB buries copper coin copper billet blind slot control depth method |
| CN108521713A (en) * | 2018-03-23 | 2018-09-11 | 珠海市金顺电子科技有限公司 | A kind of production method of the padded wiring board of Halogen |
| CN110881246A (en) * | 2019-12-04 | 2020-03-13 | 深圳市景旺电子股份有限公司 | Manufacturing method for improving routing white edge of golden finger PCB |
| CN110881246B (en) * | 2019-12-04 | 2021-06-04 | 深圳市景旺电子股份有限公司 | Manufacturing method for improving routing white edge of golden finger PCB |
| CN112074095A (en) * | 2020-10-10 | 2020-12-11 | 黄石星河电路有限公司 | Thin plate processing method with 0.4MM metal half-holes designed around |
| CN113242653A (en) * | 2021-04-28 | 2021-08-10 | 定颖电子（昆山）有限公司 | Blind groove processing technology of circuit board |
| CN116329881A (en) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | Semi-groove product fishing processing method |
| CN117835599A (en) * | 2024-01-04 | 2024-04-05 | 清远市富盈电子有限公司 | Manufacturing method of PCB (printed circuit board) capable of reducing board explosion rate and PCB |
| CN117835592A (en) * | 2024-01-04 | 2024-04-05 | 清远市富盈电子有限公司 | PCB manufacturing method for preventing slotted hole copper layer from layering and PCB |
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Application publication date: 20170111 |