CN106317652A - Ethylene-Propylene-Diene Monomer (EPDM)-silicone rubber blended thermal conductive rubber TIM and preparation method - Google Patents
Ethylene-Propylene-Diene Monomer (EPDM)-silicone rubber blended thermal conductive rubber TIM and preparation method Download PDFInfo
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- CN106317652A CN106317652A CN201610686066.XA CN201610686066A CN106317652A CN 106317652 A CN106317652 A CN 106317652A CN 201610686066 A CN201610686066 A CN 201610686066A CN 106317652 A CN106317652 A CN 106317652A
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- silicone rubber
- aluminium nitride
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- dopamine
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- 229920002379 silicone rubber Polymers 0.000 title claims abstract description 33
- 239000004945 silicone rubber Substances 0.000 title claims abstract description 28
- 229920001971 elastomer Polymers 0.000 title claims abstract description 17
- 229920002943 EPDM rubber Polymers 0.000 title claims abstract description 11
- 238000002360 preparation method Methods 0.000 title claims description 13
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims abstract description 32
- VYFYYTLLBUKUHU-UHFFFAOYSA-N dopamine Chemical compound NCCC1=CC=C(O)C(O)=C1 VYFYYTLLBUKUHU-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910017083 AlN Inorganic materials 0.000 claims abstract description 29
- 229960003638 dopamine Drugs 0.000 claims abstract description 16
- 229920001690 polydopamine Polymers 0.000 claims abstract description 15
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000243 solution Substances 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000008367 deionised water Substances 0.000 claims abstract description 10
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 10
- QKNYBSVHEMOAJP-UHFFFAOYSA-N 2-amino-2-(hydroxymethyl)propane-1,3-diol;hydron;chloride Chemical compound Cl.OCC(N)(CO)CO QKNYBSVHEMOAJP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 229910001961 silver nitrate Inorganic materials 0.000 claims abstract description 7
- 239000007853 buffer solution Substances 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims abstract description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 24
- -1 ethylene propylene diene Chemical class 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 230000004048 modification Effects 0.000 claims description 8
- 238000012986 modification Methods 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- XQSFXFQDJCDXDT-UHFFFAOYSA-N hydroxysilicon Chemical compound [Si]O XQSFXFQDJCDXDT-UHFFFAOYSA-N 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 6
- 239000003921 oil Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000000047 product Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 229960004502 levodopa Drugs 0.000 claims description 4
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000000706 filtrate Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000009747 press moulding Methods 0.000 claims description 3
- 238000007670 refining Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 239000011593 sulfur Substances 0.000 claims description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 229920002545 silicone oil Polymers 0.000 abstract 1
- 238000011049 filling Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical group OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical class O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 230000003291 dopaminomimetic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000033116 oxidation-reduction process Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000004151 quinonyl group Chemical group 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Ethene-propene or ethene-propene-diene copolymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses an EPDM-silicone rubber blended thermal conductive rubber TIM. The EPDM-silicone rubber blended thermal conductive rubber TIM comprises the following raw materials in parts by weight: 20 to 40 parts of silicone rubber matrixes, 55 to 75 parts of EPDM, 18 to 26 parts of aluminum nitride, 13 to 20 parts of dopamine, 20 to 35 parts of silver nitrate solutions with the concentration of 20 mmol/L, 1 to 3 parts of hydroxyl silicone oil, 2 to 5 parts of bi-2,5-curing agents, appropriate amounts of deionized water and Tris-HCl buffer solutions and 1.5 to 3 parts of gamma-aminopropyltriethoxysilane. According to the invention, oxidative polymerization of the dopamine is carried out on the surface of aluminium nitride to form a tightly adhered polydopamine layer, and silver nanoparticles are loaded on the surface of the polydopamine layer coating aluminium nitride, and silicone rubber is compounded and filled, so that high thermal conductivity and heat dissipation performances of the silicone rubber TIM are improved, and the EPDM-silicone rubber blended thermal conductive rubber TIM further has good flexibility, and tear strength and electric insulation properties.
Description
Technical field
The invention belongs to thermal interfacial material field, be specifically related to the heat conduction rubber of a kind of ethylene propylene diene rubber-silicone rubber
Glue thermal interfacial material and preparation method.
Background technology
Along with LED manufactures and the continuous progress of packaging technology, the power of LED is increasing.At present, commercialization is high-power
LED input power is typically at more than 1W, and chip area 1mm × 1mm, heat flow density is at 100W/cm2Above, cooling requirements is very
High.Heat passes to external environment condition from chip, if to pass through dry interface, gap, the warpage of substrate between interface all can affect key
Close and the heat radiation of local, form interface resistance.Along with LED is to high-power, high brightness development, interface resistance has become LED industry
One of difficult problem, it is necessary to solve from many-sides such as thermal interfacial material (TIM), radiator structures, and thermal interfacial material is to reduce greatly
One of effective means of Power LED lamps median surface thermal resistance.
Heat-conducting silicon rubber has the insulating properties of excellence, can fast and effeciently remove the heat that electronic equipment produces simultaneously
Amount, improves service life and the work efficiency of electronic equipment.High thermal conductivity silicone rubber is mainly filled-type thermally conductive rubber, by high score
Subbase body and high heat filling composition, wherein heat filling is main heat conduction carrier.Conventional heat filling has metal class, oxygen
Compound class, nitride-based, carbon compound etc..Wherein aluminium nitride high purity single crystal body theory thermal conductivity is up to 320W/ (m K), has
Reliably electrical insulation capability, relatively low dielectric loss and dielectric constant, be preferable heat filling, but due to the aluminium nitride moisture absorption after
Can be with water generation hydrolysis, the Al (OH) of generation3Thermal conducting path can be made to produce interrupt, and then affect the transmission of phonon, therefore
Doing finished product after heat conductance on the low side, even if using silane coupler to carry out surface process, cannot guarantee that 100% filling surface is wrapped
Cover.
The most another, Jiang Jinhong et al. in " dopamine surface-functionalized from poly-attachment behavior and the film " literary composition delivered,
Review dopamine progress in surface modification, to dopamine from poly-composite modification theory and surface-functionalized
The application of aspect is described above in detail.Under aqueous conditions, dopaminergic aoxidizes-cross-linking reaction, shape under the effect of dissolved oxygen
The poly-dopamine becoming strength to be attached to a series of solid material surfaces such as polymer, metal, pottery, glass, timber is combined thin layer,
And with there is reactivity poly-dopamine composite bed as platform, film is carried out further surface and modifies and can realize the merit of film
Energyization.
Therefore, the present invention utilizes poly-dopamine to be coated with aluminium nitride, improves its thermal conductivity, and a kind of heat conductivity of preparation is high, absolutely
The high thermal conductive silicon rubber thermal interfacial material that edge performance is good, the poly-Dopamine of good stability is modified.
Summary of the invention
For above-mentioned deficiency, the present invention provides the heat conductive rubber hot interface material of a kind of ethylene propylene diene rubber-silicone rubber
Material and preparation method.
The heat conductive rubber thermal interfacial material of a kind of ethylene propylene diene rubber-silicone rubber, by the raw material group of following weight portion
Become: silicone rubber matrix 20-40 part, ethylene propylene diene rubber 55-75 part, aluminium nitride 18-26 part, dopamine 13-20 part, 20mmol/L
Silver nitrate solution 20-35 part, hydroxy silicon oil 1-3 part, double-2,5 vulcanizing agent 2-5 parts, deionized water is appropriate, and Tris-HCl buffers
Solution is appropriate, gamma-aminopropyl-triethoxy-silane 1.5-3 part.
Specifically comprise the following steps that
(1) preparation of poly-Dopamine modification aluminium nitride:
Being added by aluminium nitride in deionized water, in ultrasonic container, ultrasonic disperse 30-50 minute, is subsequently adding aqueous dopamine solution
Uniform by magnetic stirrer, regulating its pH value with Tris-HCl buffer solution is 8.5, stirs sample reaction at ambient temperature
20-24 hour filter, deionized water wash becomes colorless to filtrate, in drying baker 50-70 DEG C dry 20-24 hour, gained produce
Product are the aluminium nitride of Surface coating poly-DOPA amine layer；
(2) preparation of the aluminium nitride that nanometer silver is modified:
Poly-Dopamine step (1) obtained is modified aluminium nitride and is immersed in the silver nitrate solution of 20mmol/L, in stirring
Under state, centrifugal after reacting 6-10 hour, it is washed with deionized, nitrogen dries up, and obtains the aluminium nitride that nanometer silver is modified；
(3) refining glue:
1., by ethylene propylene diene rubber together with silicone rubber matrix on twin-screw extruder mixing to hard-pressed bale preliminary roller, add γ-ammonia
Propyl-triethoxysilicane and hydroxy silicon oil, mixing 40-60 minute；
2. the aluminium nitride adding the nanometer silver modification obtained by step (2), afterwards continues mixing 20-30 minute, and discharging is cooled to
Room temperature, stands 20-24 hour, obtains heat-conducting silicon rubber elastomeric compound；
(4) by the elastomeric compound obtained by step (3) on twin shaft mixing roll thin logical 4-6 time, thin logical during add double-2,5 sulfur
Agent, after thin pass-out sheet, at 160-190 DEG C, hot press moulding vulcanizes 10-30 minute, obtains the sheet silicon glue material of forming；
(5) by sheet silicon glue material post-cure 3-5 hour at 190-220 DEG C of the forming obtained by step (4), obtain
A kind of heat conductive rubber thermal interfacial material of ethylene propylene diene rubber-silicone rubber.
Wherein, in described step (1), the concentration of aqueous dopamine solution is 1.5-2.5g/L.
The present invention compared with prior art has the advantage that
(1) in aqueous, the most oxidized generation of the catechol group of dopamine has the dopamine of adjacent benzene two quinone structure
Naphtoquinone compounds, occurs anti-dismutation reaction to produce Semiquinone Radicals then, and then coupling forms cross-bond, simultaneously at aln surface
Form the poly-DOPA amine layer of close attachment, effectively prevent aluminium nitride from hydrolyzing, ensure the thermal conductivity that aluminium nitride is excellent, improve silicon
The high heat conduction and heat radiation performance of rubber thermal interfacial material.
(2) catechol group and the quinoid group on poly-dopamine surface has complexing to silver ion, makes silver ion
Absorption is on its surface, and the most poly-dopamine utilizes the oxidation-reduction quality silver ion in-situ chemical reduction by absorption of surface phenolic hydroxyl group
Becoming Nano silver grain to be fixed on the poly-DOPA amine layer surface of cladding aluminium nitride, heat carrier cording has higher compactness, in order to fill out
Filling silicone rubber makes product have higher heat-conductivity, and has good compliance, tearing strength and electrical insulation capability simultaneously.
(3) ethylene propylene diene rubber has good tolerance to cold, thermostability, resistance to acids and bases, electric insulating quality and higher machine
Tool intensity, price ratio is less expensive in addition, and the present invention uses silicone rubber and ethylene propylene diene rubber and with reducing the hot interface of silicone rubber
The cost of material, and be effectively improved the mechanical strength of product, the electric property after water-fast vapor permeability and immersion.
Detailed description of the invention
The heat conductive rubber thermal interfacial material of a kind of ethylene propylene diene rubber-silicone rubber, by following weight portion (kilogram)
Raw material forms: silicone rubber matrix 30, ethylene propylene diene rubber 65, aluminium nitride 23, dopamine 17, the silver nitrate solution of 20mmol/L
28, hydroxy silicon oil 2, double-2,5 vulcanizing agents 4, deionized water is appropriate, and Tris-HCl buffer solution is appropriate, γ-aminopropyl three ethoxy
Base silane 2.
Specifically comprise the following steps that
(1) preparation of poly-Dopamine modification aluminium nitride:
Aluminium nitride is added in deionized water, ultrasonic disperse 40 minutes in ultrasonic container, be subsequently adding aqueous dopamine solution and use
Magnetic stirrer is uniform, and regulating its pH value with Tris-HCl buffer solution is 8.5, and stirring sample at ambient temperature, to react 24 little
Time filter, deionized water wash becomes colorless to filtrate, in drying baker 60 DEG C be dried 24 hours, obtain the poly-dopamine of Surface coating
The aluminium nitride of layer；
(2) preparation of the aluminium nitride that nanometer silver is modified:
Poly-Dopamine step (1) obtained is modified aluminium nitride and is immersed in the silver nitrate solution of 20mmol/L, in stirring
Under state, centrifugal after reacting 9 hours, it is washed with deionized, nitrogen dries up, and obtains the aluminium nitride that nanometer silver is modified；
(3) refining glue:
1., by ethylene propylene diene rubber together with silicone rubber matrix on twin-screw extruder mixing to hard-pressed bale preliminary roller, add γ-ammonia
Propyl-triethoxysilicane and hydroxy silicon oil, mixing 50 minutes；
2. the aluminium nitride adding the nanometer silver modification obtained by step (2), afterwards continues mixing 25 minutes, and discharging is cooled to room
Temperature, stands 24 hours, obtains heat-conducting silicon rubber elastomeric compound；
(4) by the elastomeric compound obtained by step (3) on twin shaft mixing roll thin logical 6 times, thin logical during add double-2,5 sulfurations
Agent, after thin pass-out sheet, at 170 DEG C, hot press moulding vulcanizes 20 minutes, obtains the sheet silicon glue material of forming；
(5) by sheet silicon glue material post-cure 4 hours at 200 DEG C of the forming obtained by step (4), a kind of three are obtained
The heat conductive rubber thermal interfacial material of unit's EP rubbers-silicone rubber.
Wherein, in step (1), the concentration of aqueous dopamine solution is 2g/L.
Test its performance data as follows: hardness 49shore A；Tearing strength 5.1kN/m；Heat conductivity 6.2W/ (m K)；
Specific insulation > 1013Ω·cm。
Claims (3)
1. the heat conductive rubber thermal interfacial material of ethylene propylene diene rubber-silicone rubber, it is characterised in that by following weight portion
Raw material composition: silicone rubber matrix 20-40 part, ethylene propylene diene rubber 55-75 part, aluminium nitride 18-26 part, dopamine 13-20 part,
Silver nitrate solution 20-35 part of 20mmol/L, hydroxy silicon oil 1-3 part, double-2,5 vulcanizing agent 2-5 parts, deionized water is appropriate,
Tris-HCl buffer solution is appropriate, gamma-aminopropyl-triethoxy-silane 1.5-3 part.
2. according to the heat conductive rubber thermal interfacial material of a kind of ethylene propylene diene rubber-silicone rubber described in claims 1
Preparation method, it is characterised in that specifically comprise the following steps that
(1) preparation of poly-Dopamine modification aluminium nitride:
Being added by aluminium nitride in deionized water, in ultrasonic container, ultrasonic disperse 30-50 minute, is subsequently adding aqueous dopamine solution
Uniform by magnetic stirrer, regulating its pH value with Tris-HCl buffer solution is 8.5, stirs sample reaction at ambient temperature
20-24 hour filter, deionized water wash becomes colorless to filtrate, in drying baker 50-70 DEG C dry 20-24 hour, gained produce
Product are the aluminium nitride of Surface coating poly-DOPA amine layer；
(2) preparation of the aluminium nitride that nanometer silver is modified:
Poly-Dopamine step (1) obtained is modified aluminium nitride and is immersed in the silver nitrate solution of 20mmol/L, in stirring
Under state, centrifugal after reacting 6-10 hour, it is washed with deionized, nitrogen dries up, and obtains the aluminium nitride that nanometer silver is modified；
(3) refining glue:
1., by ethylene propylene diene rubber together with silicone rubber matrix on twin-screw extruder mixing to hard-pressed bale preliminary roller, add γ-ammonia
Propyl-triethoxysilicane and hydroxy silicon oil, mixing 40-60 minute；
2. the aluminium nitride adding the nanometer silver modification obtained by step (2), afterwards continues mixing 20-30 minute, and discharging is cooled to
Room temperature, stands 20-24 hour, obtains heat-conducting silicon rubber elastomeric compound；
(4) by the elastomeric compound obtained by step (3) on twin shaft mixing roll thin logical 4-6 time, thin logical during add double-2,5 sulfur
Agent, after thin pass-out sheet, at 160-190 DEG C, hot press moulding vulcanizes 10-30 minute, obtains the sheet silicon glue material of forming；
(5) by sheet silicon glue material post-cure 3-5 hour at 190-220 DEG C of the forming obtained by step (4), obtain
A kind of heat conductive rubber thermal interfacial material of ethylene propylene diene rubber-silicone rubber.
3. according to the heat conductive rubber thermal interfacial material of a kind of ethylene propylene diene rubber-silicone rubber described in claims 2
Preparation method, it is characterised in that in described step (1), the concentration of aqueous dopamine solution is 1.5-2.5g/L.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610686066.XA CN106317652A (en) | 2016-08-19 | 2016-08-19 | Ethylene-Propylene-Diene Monomer (EPDM)-silicone rubber blended thermal conductive rubber TIM and preparation method |
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| CN201610686066.XA CN106317652A (en) | 2016-08-19 | 2016-08-19 | Ethylene-Propylene-Diene Monomer (EPDM)-silicone rubber blended thermal conductive rubber TIM and preparation method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108219299A (en) * | 2018-02-05 | 2018-06-29 | 哈尔滨理工大学 | A kind of preparation method of ethylene-propylene-diene monomer matrix cable accessory material and its ethylene-propylene-diene monomer matrix cable accessory material |
| CN108968703A (en) * | 2017-06-01 | 2018-12-11 | 佛山市顺德区美的电热电器制造有限公司 | Pot and cooking apparatus in ceramic inserts metal |
| CN110467779A (en) * | 2019-07-25 | 2019-11-19 | 安徽电缆股份有限公司 | A kind of harsh cable high-performance synthetic rubber of three generations's nuclear power station and preparation method thereof |
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| CN108219299A (en) * | 2018-02-05 | 2018-06-29 | 哈尔滨理工大学 | A kind of preparation method of ethylene-propylene-diene monomer matrix cable accessory material and its ethylene-propylene-diene monomer matrix cable accessory material |
| CN110467779A (en) * | 2019-07-25 | 2019-11-19 | 安徽电缆股份有限公司 | A kind of harsh cable high-performance synthetic rubber of three generations's nuclear power station and preparation method thereof |
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