CN106304685A - System in package chip, preparation method and intelligent domestic Internet of things device - Google Patents
System in package chip, preparation method and intelligent domestic Internet of things device Download PDFInfo
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- CN106304685A CN106304685A CN201610854603.7A CN201610854603A CN106304685A CN 106304685 A CN106304685 A CN 106304685A CN 201610854603 A CN201610854603 A CN 201610854603A CN 106304685 A CN106304685 A CN 106304685A
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
- H04B5/72—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for local intradevice communication
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transceivers (AREA)
Abstract
The present invention relates to microelectronic, disclose a kind of system in package chip, preparation method and the intelligent domestic Internet of things device comprising this system in package chip, this system in package chip comprises: microcontroller processing unit；And NFC label/Modem/MCU unit, it is connected with described microcontroller processing unit, for realizing described microcontroller processing unit and extraneous near-field communication.By technique scheme, NFC communication can be realized in a system in package chip.
Description
Technical field
The present invention relates to microelectronic, in particular it relates to a kind of system in package chip, preparation method and comprise this and be
The intelligent domestic Internet of things device of irrespective of size encapsulation chip.
Background technology
Internet of Things (Internet of Things) is the important component part of generation information technology, and Internet of Things is exactly thing
The Internet that thing is connected.It utilizes the communication technology such as localized network or the Internet sensor, controller, machine, personnel and thing
It is linked togather Deng by the way of new, forms people and be connected with thing with thing, thing, it is achieved information-based, remote management and control and intellectuality
Network.It is a kind of Ubiquitous Network set up on the internet.The important foundation of technology of Internet of things and core are still interconnections
Net, by various wired and wireless network and the Internet converged, passes real-time and accurately by the information of object.At Internet of Things
On the information of sensor timing acquiring need to be transmitted by network, owing to its quantity is the hugest, define magnanimity information,
In transmitting procedure, in order to ensure correctness and the promptness of data, it is necessary to adapt to various heterogeneous network and agreement.
Along with the Internet of Things continuous demand to chips such as high integration, super-small and super low-power consumptions, and chip and
The continuous progress of mechanics of communication, networked devices needs more functional chip is encapsulated in system in package (SiP) the inside,
Estimate that the Internet of Things intelligent domestic of 80% and wearable device will use SiP module in the time of following 5 to 10 years, because of
Smaller for SiP, there is more preferable resistance to mechanical and chemical attack ability, it is possible to notable shorten product development and put on market
In the cycle, less radio-frequency performance is more stable, the more high plurality of advantages of reliability.
Fig. 1 is the block chart of existing a kind of SiP module that can be applicable to Internet of Things.This SiP module comprises BB/MAC/
PHY processing unit 100, RF front-end module 102, wave filter 110, wave filter 112, agitator 106, agitator 108, Yi Jicun
Storage 104.BB/MAC/PHY processing unit 100 is for transmitting or receiving and process signal.Radio-frequency module 102 is connected to BB/
MAC/PHY processing unit 100, for processing the agreement of radiofrequency signal and radio frequency transmission.BB/MAC/PHY processing unit 100 comprises
Transmission/reception the mode being connected to RF front-end module 102 selects port, makes BB/MAC/PHY processing unit 100 can determine one
Processing mode.Memory connects 104 and is connected to BB/MAC/PHY processing unit 100, and wherein this memory can be non-volatile (non-
Volatile) memory.RF front-end module 102 comprises first antenna port and the second antenna port, to be connected to first day
Line and the second antenna.Therefore, BB/MAC/PHY processing unit 100 comprises the antenna diversity selection end being connected to radio-frequency front-end 102
Mouthful, make the BB/MAC/PHY processing unit 100 can be to select an antenna diversity mode.BB/MAC/PHY processing unit 100 also comprises
Bluetooth port, to be connected to bluetooth module.BB/MAC/PHY processing unit 100 inclusion region bus port is to be connected to a region
Bus.In the prior art, universal input/output device (GPIO), combined testing action group adapter (JTAG
Connector), first value configuration, field bus, compact flash memory and secure digital input and output/universal serial convergence periphery
Interface (SDIO/GSPI) is respectively connecting to the corresponding connectivity port of BB/MAC/PHY processing unit 100, sets in advance performing it
Fixed function.
But, along with Internet of Things is to the chip continuous demand in its various aspects of performance, the SiP module shown in Fig. 1 is with more
More it is difficult to meet the demand of Internet of Things.This area need a kind of can be at aspect of performance more than the SiP module shown in Fig. 1.
Summary of the invention
It is an object of the invention to provide a kind of system in package chip, preparation method and comprise this system in package chip
Intelligent domestic Internet of things device, it can show and existing SiP module better performance.
To achieve these goals, the present invention provides a kind of system in package chip for household electrical appliance, and this is system-level
Encapsulation chip comprises: microcontroller processing unit；And NFC label/Modem/MCU unit, process single with described microcontroller
Unit is connected, for realizing described microcontroller processing unit and extraneous near-field communication.
Wherein, this system in package chip also comprises system bus unit, described microcontroller processing unit and described NFC
Label/Modem/MCU unit is connected via this system bus unit.
Wherein, this system in package chip also comprises: peripheral interface, is connected to described system bus unit.
Wherein, described peripheral interface comprise following one or more: pulse-width modulation PWM interface；Analog-digital converter ADC connects
Mouthful；Universal asynchronous receiving-transmitting transmitter UART interface；Serial peripheral equipment interface SPI；Universal input/output GPIO interface；And two lines
Formula universal serial bus I2C interface.
Wherein, this system in package chip also comprises: RF front-end module；Analog-digital converter and digital to analog converter；And
BT BB/MAC/PHY processing unit, is used for the signal from described microcontroller processing unit via described digital to analog converter
After carrying out digital-to-analogue conversion, sent by described RF front-end module；And/or receive by RF front-end module receive and
Carried out the signal after analog digital conversion by described analog-digital converter, and transmit the signal to described microcontroller processing unit.
Wherein, this system in package chip also comprises: safety chip unit, for described microcontroller processing unit institute
The signal of output is encrypted.
Wherein, this system in package chip also comprise following one or more: temperature sensor, for by Temperature Quantity change
For the signal of telecommunication, and send to by described microcontroller processing unit via described system bus unit；And humidity sensor, use
In humidity amount being converted to the signal of telecommunication, and send to by described microcontroller processing unit via described system bus unit.
Wherein, this system in package chip also comprises: infrared ray sensor, is used for producing whether reaction exists human body or dynamic
The signal of telecommunication that thing is movable, and send to by described microcontroller processing unit.
Wherein, this system in package chip also comprises: the first agitator, for producing the first frequency of oscillation, for described
Other modules in system in package chip use at normal manipulation mode；And second agitator, for producing the second vibration
Frequency, uses at electricity-saving operation mode for other modules in described system in package chip.
Wherein, this system in package chip also comprise following one or more: flash memory access memorizer, with described microcontroller
Device processing unit and described system bus unit are connected；And random access memory, with described microcontroller processing unit and
Described system bus unit is connected.
Wherein, this system in package chip also comprises Power Management Unit, in described system in package chip
Electricity consumption module for power supply.
Wherein, this system in package chip also comprises: RF front-end module；Analog-digital converter and digital to analog converter；And
Wifi BB/MAC/PHY unit, is connected with described microcontroller processing unit, for performing the one or many in following operation
Person: after carrying out digital-to-analogue conversion from the signal of described microcontroller processing unit via described digital to analog converter, by institute
State RF front-end module to send；And receive by the reception of described RF front-end module and carried out by described analog-digital converter
Signal after analog digital conversion, and transmit the signal to described microcontroller processing unit.
Wherein, this system in package chip also comprises: coupling and wave filter, is connected to described RF front-end module with described
Between the antenna of system in package chip exterior.
Correspondingly, the present invention also provides for a kind of intelligent domestic Internet of things device, and this device comprises said system level encapsulation core
Sheet.
Correspondingly, the present invention also provides for a kind of method preparing said system level encapsulation chip, and the method includes: to PCB
Substrate carries out paste solder printing, tin cream print is placed on the pad of pcb board；The pcb board that print is equipped with tin cream carries out chip attachment；Right
The pcb board being pasted with chip carries out Reflow Soldering, so that chip is fixed on described pcb board；To the PCB being fixed with described chip
Plate carries out nude film welding and epoxy cure, so that nude film is fixed on described pcb board；And to being fixed with described chip
And the pcb board of nude film carries out go between welding, sky wire bonding, injection mo(u)lding, injection mo(u)lding after-hardening and coating electro-magnetic screen layer,
Thus produce described system in package chip.
Wherein, before PCB substrate is carried out paste solder printing, the method also includes preheating described PCB substrate.
Wherein, after the pcb board being pasted with chip is carried out Reflow Soldering, the method also includes: after Reflow Soldering
Pcb board is carried out, the scaling powder of residual during to remove Reflow Soldering；And the PCB substrate after cleaning is dried.
Wherein, the welding that goes between is carried out after described pcb board is carried out epoxy cure and/or to described pcb board
After, the method also includes: described pcb board is carried out plasma cleaning.
Wherein, carrying out described pcb board between injection mo(u)lding after-hardening and coating electro-magnetic screen layer, the method also includes
Below one or more: pcb board is carried out laser marking, integrated circuit testing, cuts and dry.
Wherein, to described pcb board coating electro-magnetic screen layer after, the method also include following one or more: to institute
State pcb board and carry out system level testing, Defect Scanning, drying and tape package.
Other features and advantages of the present invention will be described in detail in detailed description of the invention part subsequently.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, and constitutes the part of description, with following tool
Body embodiment is used for explaining the present invention together, but is not intended that limitation of the present invention.In the accompanying drawings:
Fig. 1 is the block chart of existing a kind of SiP module that can be applicable to Internet of Things；
The block chart of the SiP module that Fig. 2 provides for one embodiment of the invention；
The block chart of the SiP module that Fig. 3 provides for another embodiment of the present invention；And
Fig. 4 is the fabrication processing figure of the SiP module of the present invention.
Description of reference numerals
100 BB/MAC/RF processing unit 102 radio-frequency front-ends
104 memory 106 first agitators
108 second agitator 110 wave filter
112 wave filter 200 MCU
201 system bus unit 202 FLASH
203 RAM 204 WiFi BB/MAC/PHY unit
205 BT BB/MAC/PHY unit 206 analog-digital converters
207 digital to analog converter 208 RF front-end modules
209 coupling and wave filter 210 peripheral interfaces
211 Temperature Humidity Sensor 212 Power Management Unit PMU
213 first agitator 214 second agitators
215 infrared sensor 216 NFC label/Modem/MCU unit
217 safety chip unit
Detailed description of the invention
Below in conjunction with accompanying drawing, the detailed description of the invention of the present invention is described in detail.It should be appreciated that this place is retouched
The detailed description of the invention stated is merely to illustrate and explains the present invention, is not limited to the present invention.
The block chart of the SiP module that Fig. 2 provides for one embodiment of the invention.As in figure 2 it is shown, one embodiment of the invention provides
SiP module comprise: microcontroller processing unit (Mirco Controller Unit；MCU)200；And NFC label/
Modem (modem)/MCU unit 216, is connected via system bus unit 201 with microcontroller processing unit 200, uses
In realizing microcontroller processing unit 200 and extraneous near-field communication.
In the present embodiment, MAC 200 can use ARMCortex-M4 processor, and this processor cores is at Cortex-
Growing up on the basis of M3 kernel, its performance improves 20% than Cortex-M3.Floating-point, DSP, parallel computation are newly increased
Deng.Effective and wieldy control and the Digital Signals market of signal processing function mixing in order to satisfied needs.It is high
The signal processing function of effect combines with the low-power consumption of Cortex-M processor family, low cost and wieldy advantage.
Cortex-M4 provides unrivaled function, controls 32 integrated with leading Digital Signal Processing to meet need
Will the market of very high energy efficiency rank.Cortex-M4 processor uses single clock cycle multiply-accumulate (MAC) list of an extension
Unit, single-instruction multiple-data (SIMD) instruction optimized, saturation arithmetic instruction and an optional single-precision floating point unit (FPU).
These functions are based on the innovative technology of performance ARMCortex-M series processors feature, including risc processor kernel, high
Performance 32 bit CPU, there is deterministic computing, low latency 3 stage pipeline, up to 1.25DMIPS/MHz；Thumb-2 instruction set,
The optimal mixing of 16/32 bit instruction, less than 8 equipment 3 times code size, performance is had no adverse effect, it is provided that optimal
Code density；Low-power consumption mode, integrated sleep state support, multi-power domain, software based on framework control；In nested vector
Disconnected controller (NVIC), low latency, low jitter interrupt response, need not assemble programming, the interruption service example write with pure C language
Journey, can complete outstanding interrupt processing；Instrument and RTOS support, widely third party's instrument support, Cortex microcontroller soft
Part interface standard (CMSIS), to greatest extent increase software achievement are reused；CoreSight debugging and tracking, JTAG or 2 pin strings
Line debugging (SWD) connects, supports multiprocessor, supports real-time tracking.Additionally, this processor additionally provide one optional in
Deposit protected location (MPU), it is provided that the debugging/tracking function of low cost and integrated resting state, to increase motility.Embedded
Developer will quickly be designed and released the end product attracted people's attention, and possesses most functions and minimum power consumption and chi
Very little.
In the present embodiment, described NFC label/Modem/MCU processing unit 205 can be the wireless of a kind of short distance high frequency
Power technology, in 13.56MHz frequency runs on 20 cm distance, can pass through coupled antenna 2 and sends and receive signal,
It is contained within NFC label, NFC modem and NFC MCU.Its transmission speed have the 106Kbit/ second, the 212Kbit/ second or
The 424Kbit/ second three kinds, future can bring up to more than 848kbit/s.NFC antenna operating frequency is 13.56MHz, uses inductance coupling
Conjunction mode transmits radiofrequency signal.
The operation principle of NFC system is as follows: first, the information that read write line will send, encoded and be loaded into high frequency carry
It is sent out through antenna again on ripple signal.When the electronic tag entering read write line working region receives this signal, its card inner core
The relevant circuit of sheet carries out voltage multiplying rectifier, modulates, decodes, deciphers this signal, then enters command request, password, authority etc.
Row judges.The topmost feature of NFC is that safety is high, and connection speed is fast, with low cost, but its operating distance is closer.Relatively
In bluetooth, NFC is compatible with existing passive RFID (13.56MHz ISO/IEC 18000-3) facility.The energy requirement of NFC is more
Low, similar with bluetooth V4.0 mental retardation agreement.When NFC is in (such as, the mobile phone of a shutdown, the noncontact of a motorless equipment
Formula smart credit card or smart poster) on when working, the energy expenditure of NFC can be greater than low-power bluetooth V4.0.For moving
For mobile phone or action consumption electronic products, the use of NFC is more convenient.The short haul connection characteristic of NFC just its
Advantage, owing to power consumption is low, once only with a machine link, have higher confidentiality and safety, NFC is conducive to credit
Avoid stolen during card transaction.The target of NFC is not to replace other wireless technologys such as bluetooth, but in different occasions, no
The effect being complementary to one another is played in same field.
This near-field communication (NFC) label Modem/MCU processing unit 205 has low-power consumption, low cost, high benefit, and
Can substitute present substantial amounts of IC-card (including the credit card) occasion market swipe the card, mass transit card, gate inhibition's control, ticket, admission ticket etc..
Under this kind of mode, there is a great advantage, that is, card is powered by the RF territory of contactless card reader, even if host
Equipment (such as mobile phone) does not has electricity to work.Near-field communication (NFC) label Modem/MCU processing unit 205 is compatible and props up completely
Hold ISO/IEC IS 18092 international standard, EMCA-340 standard and ETSI TS 102 190 standard.The pattern that this NFC uses
Compatible NFC Type2, has literacy.1KB internal memory (only NFC) is saved as, with Cortex-M3 shared system internal memory in NFC
(512KB SRAM and 2MB flash memory).NFC supports electric source modes to include, and the power-down mode of band 60ms recovery time and band 30us recover
Time sleep pattern (150uA).The operating distance of NFC is 6cm (HDK antenna), uses 3.3V running voltage.
The block chart of the SiP module that Fig. 3 provides for another embodiment of the present invention.Below in conjunction with Fig. 3 to this another embodiment
It is described further.It should be noted that this embodiment illustrated in fig. 3 comprises number of modules or unit, these modules or unit
Can form individually or in any combination be comprised in SiP module.For the mould being discussed in detail in above-mentioned embodiment illustrated in fig. 2
Block or unit, repeat no more in this.
In this embodiment, SiP module also can comprise: bluetooth (BT) BB/MAC/PHY processing unit 205, for will be from
After the signal of described MCU 200 carries out digital-to-analogue conversion via described digital to analog converter 207, by described RF front-end module
208 send；And/or reception is received by RF front-end module 208 and is carried out analog digital conversion by described analog-digital converter 206
Signal afterwards, and transmit the signal to described MCU 200.
In the present embodiment, this BTBB/MAC/PHY processing unit 205 can be 2.4/5GHz frequency modulation, Baseband processor
(baseband processor), multimedia agreement medium plan (multi-media protocol media access
Control) or central authorities process (central processing) unit.This BTBB/MAC/PHY processing unit 205 has low merit
Consumption, low cost, high benefit and be applicable to mouse, earphone, printer, wireless microphone, keyboard, personal digital assistant
(PDA), smart mobile phone, mobile phone, panel computer and multimedia player.BTBB/MAC/PHY processing unit 205 compatibility is also
Support bluetooth 4.0+BLE agreement, bluetooth 4.1 agreement, bluetooth 4.2 agreement completely.
RF front-end module 208 is connected to BT BB/MAC/PHY processing unit 205 by analog-digital converter 206, to receive
Signal.BT BB/MAC/PHY processing unit 205 is connected to RF front-end module 208, to send letter by digital to analog converter 207
Number.BT BB/MAC/PHY processing unit 205 comprises transmission/reception mode and selects port, delivery port, receiving port, Yi Ji electricity
Source controls port.This transmission/reception mode selects port to be connected to penetrate by digital to analog converter 207/ analog-digital converter 206 respectively
Frequently transmission/the receiving port of front-end module 208, makes BT BB/MAC/PHY processing unit 205 can control RF front-end module
208, with the signal in processing in transmission or receiving.
In this embodiment, SiP module also can comprise: RF front-end module 208；Analog-digital converter 206 and digital-to-analogue conversion
Device 207；And Wireless Fidelity (WiFi) base band/medium plan/radio frequency (Base Band/Media Access
Control/Radio Frequency；BB/MAC/PHY) unit 204, with described microcontroller processing unit (Mirco
Controller Unit；MCU) 200 are connected via described system bus unit 201, for perform one in following operation or
Many persons: by from described microcontroller processing unit 200 signal via described digital to analog converter 207 carry out digital-to-analogue conversion it
After, sent by described RF front-end module 208；And reception is received and by described by described RF front-end module 208
Analog-digital converter 206 carries out the signal after analog digital conversion, and transmits the signal to described microcontroller processing unit 200.
In the present embodiment, WiFi BB/MAC/PHY processing unit 204 can be 2.4/5GHz frequency modulation, Baseband processor
(baseband processor), multimedia agreement medium plan (multi-media protocol media access
Control) or central authorities process (central processing) unit.WiFi BB/MAC/PHY processing unit 204 has height
Usefulness, power saving and be applicable to the characteristic such as intelligent domestic and Internet of Things application device, and wherein this intelligent domestic and Internet of Things
Net application device can be dehumidifier, air-conditioning, depurator, air cooler, fan, warmer, refrigerator, rotary drum washing machine, rolling
Cylinder washing machine, electric heater, electric cooking pot, electric cooker, mobile phone, mobile phone, personal digital assistant (PDA), voice-over-net transmission
(VoIP), MP3/MP4 player.The transmitter of WiFi BB/MAC/PHY processing unit 204 combines homophase and quadrature baseband letter
Number, and convert the signal into the frequency to be sent.The receptor of WiFi BB/MAC/PHY processing unit 204 uses double frequency that changes to tie
Structure and be not required to the plug-in intermediate-frequency filter of chip.Frequency synthesizer is supported by frequency defined in 802.11 specifications.WiFi BB/
MAC/PHY processing unit 204 orthogonal frequency domain to be supported multiplexing (Orthogonal Frequency Division
Multiplexing；OFDM), and medium plan also support IEEE 802.11 wireless medium access control agreement and
802.11i confidentiality (security).
RF front-end module 208 is connected to WiFi BB/MAC/PHY processing unit 204, to connect by analog-digital converter 206
The collection of letters number.WiFi BB/MAC/PHY processing unit 204 is connected to RF front-end module 208 by digital to analog converter 207, to send out
The number of delivering letters.WiFi BB/MAC/PHY processing unit 204 comprise transmission/reception mode select port, delivery port, receiving port,
And power control terminal mouth.This transmission/reception mode selects port respectively by digital to analog converter 207/ analog-digital converter 206 even
It is connected to the transmission/receiving port of radio-frequency front-end 208, makes WiFi BB/MAC/PHY processing unit 204 can control radio-frequency front-end mould
Block 208, with the signal in processing in transmission or receiving.
Coupling and wave filter 209 can separately exist in the SiP module of this embodiment, also can be included in RF front-end module
In 208.Antenna, by coupling and wave filter 209, is connected to the connectivity port of RF front-end module 208, and it provides a road
Footpath, to transmit/to receive signal to antenna.Therefore, the signal of WiFi BB/MAC/PHY processing unit 204 is via digital to analog converter
207, RF front-end module 208, coupling and wave filter 209 and antenna are launched.Equally, WiFi BB/MAC/PHY processes single
Unit 204 also can receive signal via antenna, coupling and wave filter 209, RF front-end module 208 and analog-digital converter 206.
As it is shown on figure 3, in this embodiment, SiP module also can comprise system bus unit 201, system bus unit 201
Only by the assistance of storage buffer, and not by any bridger (bridge) and/or the assistance of I/O interface, data, address and control
Signal processed is along advanced high-performance system bus (Advanced High Speed Buses；AHB) line is connected at microcontroller
Reason unit.Compared with the processing speed of system bus, the processing speed of bridger and/or I/O interface is the most relatively low.System bus
An advantage be high data throughput (Throughput), the data processing amount in the unit interval is significantly larger than the number of SDIO/SPI
According to treating capacity.System bus simplifies the design of hardware.Being easy to use Modular Structure Design method, bus-oriented chip sets
As long as meter makes MCU plug-in unit, memory card and I/O plug-in unit etc. according to the rules, they are connected into bus just can work, and not
The detailed operation of bus must be considered.System bus simplifies system structure simultaneously.Whole system clear in structure.Line is few, base plate
Line can printing.System bus makes system expansibility good.One is that scale expands, and scale expansion needs only to insert more
Plug-in unit with type.Two is that function expands, and function expansion needs only to design new plug-in unit according to bus standard, and plug-in unit inserts machine
Position often there is no strict restriction.System bus is connectable to microcontroller storage bus, or is directly connected to microcontroller
Device processing unit.System bus makes system update performance good.Because MCU, memorizer, I/O interface etc. are all to specify by bus
Be suspended in bus, as long as thus bus design is appropriate, can at any time along with processor chip and other are about chip
The plug-in unit that progress design is new, new plug-in unit is inserted on base plate and is updated system, and other plug-in units and base plate line are typically not required to
Change.
It should be noted that said system bus unit 201 can as MCU 200 and the miscellaneous part in SiP module it
Between the bridge that is connected, in the case of there is not this system bus unit 201, described MCU200 also can directly and SiP mould
Miscellaneous part in block is connected.
As it is shown on figure 3, in this embodiment, SiP module also can comprise peripheral interface 210, is connected to described system bus
Unit 201.
As it is shown on figure 3, this peripheral interface 210 can comprise following one or more: pulse-width modulation PWM interface；Analog digital conversion
Device ADC interface；Universal asynchronous receiving-transmitting transmitter UART interface；Serial peripheral equipment interface SPI；Universal input/output GPIO interface；With
And twin wire universal serial bus I2C interface.Certainly, the present invention is not limited to this, also can be arranged as required to other interfaces.Thereby,
All kinds of peripheral hardware can be facilitated to access SiP module.
As it is shown on figure 3, in this embodiment, SiP module also can comprise safety chip unit 217, for described MCU
200 signals exported are encrypted.
This safety chip unit 217 is a to be applied to the low-power consumption of USBKEY, low cost, high security, multi-functional
Crypto chip.This chip has key management on sheet (include password generate, store, renewal etc.), RSA, ECC (SM2) association in sheet
Processor, it is achieved digital signature and authentication, SM1, SM4, DES (TDES) hardware algorithm core, SM3, SHA hardware in sheet in sheet
Algorithm core, supports the various communication interfaces such as USB, SPI, UART.
As it is shown on figure 3, in this embodiment, SiP module also can comprise following one or more: temperature sensor, be used for
Temperature Quantity is converted to the signal of telecommunication, and sends to by described microcontroller processing unit；And humidity sensor, for by humidity
Amount is converted to the signal of telecommunication, and sends to by described microcontroller processing unit.This temperature sensor and humidity sensor are in figure 3
It is shown generally as Temperature Humidity Sensor 211.
Specifically, Temperature Humidity Sensor 211 refers to Temperature Quantity and humidity amount are converted into easy measured process
The equipment of the signal of telecommunication or device, Temperature Humidity Sensor is usually measures Temperature Quantity and relative humidity amount.In relative humidity i.e. gas
Steam vapour amount (water vapor pressure) contained by (usually in air) and saturated steam amount (saturated vapor under its air same case
Pressure) percentage ratio.
Humidity sensor can be capacitance type humidity sensor, this capacitance type humidity sensor by polymer, finger electrodes and
Silicon substrate is constituted, and have employed distribution of electrodes and the coating technique of uniqueness so that induction apparatus not only will not aoxidize, moreover it is possible to quickly receives water
Molecule.Temperature sensor can be made up of the PNP transistor being in diode mode, and during variations in temperature, output voltage will become
Change.
Generally speaking, the energy consumption of Temperature Humidity Sensor is 80 μ W (at 12,3V, under the conditions of 1 measurement/second)；RH works
Scope is 0-100%RH；Calibrate completely, linearisation, and the numeral output of temperature-compensating；Wide power voltage scope, from 2.4 to
5.5V；I2C interface communication speed is up to 1MHz and carries 2 optional addresses of user；Typical accuracy reaches 2%RH and 0.3 DEG C；Start
Speed is fast and the time of measurement is short；Long-term work is reliable and stable, temperature year drift value < 0.03 degree/year；Humidity year drift value <
0.25%RH/year is long-lasting and concordance is good；Temperature and moisture sensors integration, it is simple to produce, saves PCB surface and amasss and produce
Product miniaturization.
As it is shown on figure 3, in this embodiment, SiP module also can comprise: infrared ray sensor 215, is used for producing reaction and is
The no signal of telecommunication that there is human body or animal activity, and send to by described microcontroller processing unit 200.
This infrared ray sensor 215 can be Thermoelectric Infrared Sensor, and this Thermoelectric Infrared Sensor includes optics
System, detecting element and change-over circuit.Pyroelectric infrared sensor is thermally sensitive sensor.It by ceramic oxide or
Piezolectric crystal unit forms, and makes electrode on two surfaces of element, when in the range of Sensor monitoring, temperature has the change of Δ T,
Pyroelectric effect can produce electric charge Δ Q on two electrodes, produces a faint voltage Δ V the most between electrodes.Due to
Its output impedance is high, has a field effect transistor to carry out impedance transformation in the sensor.Electric charge produced by pyroelectric effect
Δ Q can be combined by the ion in air and disappear, and i.e. when ambient temperature-stable is constant, Δ T=0, then sensor is without output.
When human body enters detection zone, because human body temperature and ambient temperature have difference, produce Δ T, then have Δ T to export；If human body enters inspection
Survey behind district motionless, then temperature is not changed in, and sensor does not the most output.So this sensor for human detection or animal
Movable sensing.
Pyroelectric infrared sensor sensitivity up to 3.6mVpp and there is splendid signal to noise ratio；Height during variations in temperature is steady
Qualitative；It is suitable for the reflow soldering of 240 DEG C of peak values；The ken reaches ± 50 °；Wide supply voltage scope reaches 2 to 15V；To outside
The high noise immunity of noise (vibration, RFI etc.).
As it is shown on figure 3, in this embodiment, SiP module also can comprise following one or more: flash memory access memorizer
(flash) 202, it is connected with described MCU 200 and described system bus unit 201；And random access memory (RAM) 203,
With described MCU 200 and described system bus unit 201.Described MCU 200 can to this flash memory access memorizer 202 and/or with
Machine access memorizer 203 is written and read operation.
As it is shown on figure 3, in this embodiment, SiP module also can comprise: the first agitator 213, for producing the first vibration
Frequency, uses at normal manipulation mode for other modules in described system in package chip；And second agitator 214,
For producing the second frequency of oscillation, use at electricity-saving operation mode for other modules in described system in package chip.
Such as, the first agitator 213 can produce the first frequency of oscillation, and this first frequency of oscillation is sent to NFC label/
Modem/MCU unit 216, WiFi BB/MAC/PHY unit 204, BT BB/MAC/PHY unit 205, infrared sensor 215, temperature
Humidity sensor 211 grade uses for it.In the present embodiment, the first frequency of oscillation is about 40MHz.Second agitator 214 can
Producing the second frequency of oscillation, about 32KHz, this second frequency of oscillation also can be transferred into NFC label/Modem/MCU unit
216, WiFi BB/MAC/PHY unit 204, BT BB/MAC/PHY unit 205, infrared sensor 215, Temperature Humidity Sensor 211
Use Deng for it.WiFi BB/MAC/PHY unit 204, BT BB/MAC/PHY unit 205, infrared sensor 215, humiture
Sensor 211 grade works in 40MHz when general operation mode, then works in 32kHz when saving electrically.
As it is shown on figure 3, in this embodiment, SiP module also can comprise: Power Management Unit 212, for described system
Electricity consumption module for power supply in level encapsulation chip, such as NFC label/Modem/MCU unit 216, WiFi BB/MAC/PHY unit
204, BT BB/MAC/PHY unit 205, infrared sensor 215, Temperature Humidity Sensor the 211, first agitator 213 and second shake
Swing device 214 etc..
In the embodiment shown in fig. 3, described MCU 200, FLASH 202, RAM 203, NFC label/Modem/MCU unit
216, WiFi BB/MAC/PHY unit 204, BT BB/MAC/PHY unit 205, peripheral interface 210, infrared sensor 215, temperature
Humidity sensor 211, safety chip unit 217 etc. are all connected with described system bus unit 201, thus realize each other
Communication.Safety chip unit 217 is by system bus unit 201 and MCU 200, WiFi BT BB/MAC/PHY processing unit
204BT BB/MAC/PHY processing unit 205 and NFC label/Modem (modem)/MCU unit 216 links together.
Data carry out retransmiting away after safety is encrypted by safety chip unit 217.Receiving terminal also has corresponding decryption method to decipher,
Ensure the safety of data transmission.
In the present embodiment, NFC label/Modem/MCU unit 216 is to be intelligent domestic and the single core of Internet of Things application
Sheet, WiFi BB/MAC/PHY processing unit 204 can be intelligent domestic and the one chip of Internet of Things application, BT BB/MAC/
PHY unit 205 can be intelligent domestic and the one chip of Internet of Things application, and MCU 200 can be intelligent domestic and Internet of Things
The one chip of application, Temperature Humidity Sensor 211 can be intelligent domestic and the one chip of Internet of Things application, infrared sensor
Unit 215 can be intelligent domestic and the one chip of Internet of Things application, such as complementary metal oxide layer semiconductor
(Complementary Metal Oxide Semiconductor；CMOS) chip.
Fig. 4 is the fabrication processing figure of the SiP module of the present invention.The SiP module of the present invention is described below in conjunction with Fig. 4
Fabrication processing.First, PCB substrate is preheated；Then, PCB substrate is carried out paste solder printing, tin cream print is placed in
On the pad of pcb board；Afterwards, pcb board print being equipped with tin cream carries out chip attachment so that the contact wire on chip connects
On the pin of pcb board, these pins are connected with the foundation of other devices further through the wire on pcb board, and this chip attachment operates
Fuji chip mounter can be used to complete；Afterwards, the pcb board being pasted with chip carries out Reflow Soldering, in order to chip can be soldered to PCB
On substrate；Afterwards, the scaling powder of residual when removing Reflow Soldering；Afterwards, PCB substrate drying is again carried out；Afterwards, chip weldering is carried out
Connect and epoxy cure；Afterwards, the epoxy resin of residual is removed by plasma cleaning；Afterwards, carrying out lead-in wire welding, this draws
Wire bonding operation can use K&S wire bonder to carry out；Afterwards, carry out antenna processing and sky wire bonding, this antenna be with NFC label/
The antenna 2 that Modem/MCU unit 216 is connected, specifically processes and welding can comprise employing Reflow Soldering and weld, design and printing work
It is filled with and printing web plate carries out smearing soldering paste, design reflux temperature curve and chain speed, need during welding to make Welder simultaneously
Dress fixes weldment；Afterwards, plasma cleaning is carried out；Afterwards, carrying out injection mo(u)lding, this injection mo(u)lding operation can use
The forming machines such as TOWA；After moulding, injection hardening is carried out；Afterwards, chip being carried out laser marking, mark is carried out after completing
Chip cutting, drying, coating for EMI shielding, this chip cutting can use the cutting machines such as DFD, and this coating for EMI shielding can use
The coating machines such as LINCOTEC are carried out；Afterwards, carry out system level testing and Defect Scanning to be confirmed whether to have wafer damage, finally compile
Band is packed.Afterwards, finished product OQC OQC, and transport away after finished product OQC is qualified.
After above-mentioned part steps, need to carry out visual inspection (FVI) or automated optical inspection (AOI), and inspection qualified it
After carry out to next step just now.The above step flow process of the present invention is the technological process of innovation, to ensureing wireless fidelity systems
The performance of level encapsulating products has important effect.Product is made to have compact, multi-functional, the characteristic of low-power consumption.
The Form Factor of the present invention, its area is less than or much smaller than 150 square millimeters, and height is less than or is much smaller than 2.0 in the least
Rice, this highly comprises weld pad or soldered ball (soldering pads or balls) and isolation cover structure or shapes material (shield
Structure or molding material) thickness.The present invention also uses and is generally of six or four layers of (layer) lamination
Structure (stack-up structure), or the thin printed circuit board (PCB) of the most multilayer laminated structure is as substrate
(substrate), such as when using LTCC (Low Temperature Cofired Ceramic；LTCC) make
During for substrate, use 12 or the printed circuit board (PCB) of ten layer laminate structure.Surface then part (Surface Mount
Devices；SMDs), flip package part (Flip Chip Packaged Device) or other there is wafer-level package
The part of (Chip Scaled Package) was embedded in the upper strata copper film (top-side copper) of substrate in the past, and these
Part also can be embedded in lower floor's copper film (bottom-side copper) or internal layer copper film (inner-side according to design
copper)。
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, but, the present invention is not limited to above-mentioned reality
Execute the detail in mode, in the technology concept of the present invention, technical scheme can be carried out multiple letter
Monotropic type, these simple variant belong to protection scope of the present invention.
It is further to note that each the concrete technical characteristic described in above-mentioned detailed description of the invention, at not lance
In the case of shield, can be combined by any suitable means.In order to avoid unnecessary repetition, the present invention to various can
The compound mode of energy illustrates the most separately.
Additionally, combination in any can also be carried out between the various different embodiment of the present invention, as long as it is without prejudice to this
The thought of invention, it should be considered as content disclosed in this invention equally.
Claims (20)
1. the system in package chip for household electrical appliance, it is characterised in that this system in package chip comprises:
Microcontroller processing unit；And
NFC label/Modem/MCU unit, is connected with described microcontroller processing unit, is used for realizing described microcontroller and processes
Unit and extraneous near-field communication.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises system
Bus unit, for described microcontroller processing unit with described NFC label/Modem/MCU unit via this system bus list
Unit is connected.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises periphery
Interface, is connected to described system bus unit.
System in package chip the most according to claim 3, it is characterised in that described peripheral interface comprise following one or
Many persons:
Pulse-width modulation PWM interface；
Analog-digital converter ADC interface；
Universal asynchronous receiving-transmitting transmitter UART interface；
Serial peripheral equipment interface SPI；
Universal input/output GPIO interface；And
Twin wire universal serial bus I2C interface.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:
RF front-end module；
Analog-digital converter and digital to analog converter；And
BT BB/MAC/PHY processing unit, for turning from the signal of described microcontroller processing unit via described digital-to-analogue
After parallel operation carries out digital-to-analogue conversion, sent by described RF front-end module；And/or reception is connect by RF front-end module
Receive and carried out the signal after analog digital conversion by described analog-digital converter, and transmitting the signal to the process of described microcontroller
Unit.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:
Safety chip unit, is encrypted for the signal being exported described microcontroller processing unit.
System in package chip the most according to claim 2, it is characterised in that this system in package chip also comprises following
One or more:
Temperature sensor, for Temperature Quantity is converted to the signal of telecommunication, and sends to by described micro-via described system bus unit
Controller processing unit；And
Humidity sensor, for humidity amount is converted to the signal of telecommunication, and sends to by described micro-via described system bus unit
Controller processing unit.
System in package chip the most according to claim 2, it is characterised in that this system in package chip also comprises:
Whether infrared ray sensor, exist the signal of telecommunication of human body or animal activity, and send to by described micro-for producing reaction
Controller processing unit.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:
First agitator, for producing the first frequency of oscillation, for other modules in described system in package chip normally
Operator scheme uses；And
Second agitator, for producing the second frequency of oscillation, for other modules in described system in package chip in power saving
Operator scheme uses.
System in package chip the most according to claim 2, it is characterised in that this system in package chip also comprise with
Lower one or many persons:
Flash memory access memorizer, is connected with described microcontroller processing unit and described system bus unit；And
Random access memory, is connected with described microcontroller processing unit and described system bus unit.
11. system in package chips according to claim 1, it is characterised in that this system in package chip also comprises:
Power Management Unit, for the electricity consumption module for power supply in described system in package chip.
12. system in package chips according to claim 1, it is characterised in that this system in package chip also comprises:
RF front-end module；
Analog-digital converter and digital to analog converter；
Wifi BB/MAC/PHY unit, is connected with described microcontroller processing unit, for perform one in following operation or
Many persons:
After carrying out digital-to-analogue conversion from the signal of described microcontroller processing unit via described digital to analog converter, by institute
State RF front-end module to send；And
Receive and received and carried out by described analog-digital converter the signal after analog digital conversion by described RF front-end module, and will
This signal sends to described microcontroller processing unit.
13. according to the system in package chip described in claim 5 or 12, it is characterised in that this system in package chip also wraps
Contain:
Coupling and wave filter, be connected between the antenna of described RF front-end module and described system in package chip exterior.
14. 1 kinds of intelligent domestic Internet of things devices, it is characterised in that this device comprises to be weighed according to any one of claim 1-13
System in package chip described in profit requirement.
15. 1 kinds of methods prepared according to the system in package chip described in claim any one of claim 1-13, should
Method includes:
PCB substrate is carried out paste solder printing, tin cream print is placed on the pad of pcb board；
The pcb board that print is equipped with tin cream carries out chip attachment；
The pcb board being pasted with chip is carried out Reflow Soldering, so that chip is fixed on described pcb board；
The pcb board being fixed with described chip is carried out nude film welding and epoxy cure, so that nude film is fixed on described PCB
On plate；And
Carry out going between after welding, sky wire bonding, injection mo(u)lding, injection mo(u)lding firmly to the pcb board being fixed with described chip and nude film
Change and coating electro-magnetic screen layer, thus produce described system in package chip.
16. methods according to claim 15, it is characterised in that before PCB substrate is carried out paste solder printing, the method
Also include described PCB substrate is preheated.
17. methods according to claim 15, it is characterised in that the pcb board being pasted with chip is carried out Reflow Soldering it
After, the method also includes:
Pcb board after Reflow Soldering is carried out, the scaling powder of residual during to remove Reflow Soldering；And
PCB substrate after cleaning is dried.
18. methods according to claim 15, it is characterised in that after described pcb board is carried out epoxy cure
And/or after described pcb board carries out lead-in wire welding, the method also includes:
Described pcb board is carried out plasma cleaning.
19. methods according to claim 15, it is characterised in that described pcb board is carried out injection mo(u)lding after-hardening with
Coating electro-magnetic screen layer between, the method also include following one or more:
Pcb board is carried out laser marking, integrated circuit testing, cuts and dry.
20. methods according to claim 15, it is characterised in that after to described pcb board coating electro-magnetic screen layer, should
Method also include following one or more:
Described pcb board is carried out system level testing, Defect Scanning, drying and tape package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610854603.7A CN106304685A (en) | 2016-09-27 | 2016-09-27 | System in package chip, preparation method and intelligent domestic Internet of things device |
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|---|---|---|---|
| CN201610854603.7A CN106304685A (en) | 2016-09-27 | 2016-09-27 | System in package chip, preparation method and intelligent domestic Internet of things device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106844285A (en) * | 2017-01-20 | 2017-06-13 | 中颖电子股份有限公司 | A kind of MCU chip architecture system |
| CN110931008A (en) * | 2019-12-06 | 2020-03-27 | 广东美的白色家电技术创新中心有限公司 | Voice control device and electrical equipment |
| CN113014287A (en) * | 2021-02-24 | 2021-06-22 | 广州朗国电子科技有限公司 | IOT module and electrical apparatus that collection wiFi and NFC function are as an organic whole |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070155430A1 (en) * | 2005-12-30 | 2007-07-05 | Sung-Rock Cheon | External device for mobile communication terminal and NFC method using the same |
| CN101047136A (en) * | 2006-03-27 | 2007-10-03 | 深圳市易方数码科技有限公司 | Manufacturing method of mobile storage equipment |
| CN102484499A (en) * | 2010-07-07 | 2012-05-30 | 松下电器产业株式会社 | Communication device and communication method |
| CN104093218A (en) * | 2014-07-09 | 2014-10-08 | 深圳市杰瑞特科技有限公司 | Mobile internet of things built based on NFC technology and information exchange method thereof |
| CN105388989A (en) * | 2014-09-02 | 2016-03-09 | 三星电子株式会社 | Application processor for adjusting clock signal using hardware power management unit and devices including same |
-
2016
- 2016-09-27 CN CN201610854603.7A patent/CN106304685A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070155430A1 (en) * | 2005-12-30 | 2007-07-05 | Sung-Rock Cheon | External device for mobile communication terminal and NFC method using the same |
| CN101047136A (en) * | 2006-03-27 | 2007-10-03 | 深圳市易方数码科技有限公司 | Manufacturing method of mobile storage equipment |
| CN102484499A (en) * | 2010-07-07 | 2012-05-30 | 松下电器产业株式会社 | Communication device and communication method |
| CN104093218A (en) * | 2014-07-09 | 2014-10-08 | 深圳市杰瑞特科技有限公司 | Mobile internet of things built based on NFC technology and information exchange method thereof |
| CN105388989A (en) * | 2014-09-02 | 2016-03-09 | 三星电子株式会社 | Application processor for adjusting clock signal using hardware power management unit and devices including same |
Non-Patent Citations (1)
| Title |
|---|
| 陈启军: "《嵌入式系统及其应用 第3版》", 31 December 2015 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106844285A (en) * | 2017-01-20 | 2017-06-13 | 中颖电子股份有限公司 | A kind of MCU chip architecture system |
| CN106844285B (en) * | 2017-01-20 | 2020-11-03 | 中颖电子股份有限公司 | MCU chip architecture system |
| CN110931008A (en) * | 2019-12-06 | 2020-03-27 | 广东美的白色家电技术创新中心有限公司 | Voice control device and electrical equipment |
| CN113014287A (en) * | 2021-02-24 | 2021-06-22 | 广州朗国电子科技有限公司 | IOT module and electrical apparatus that collection wiFi and NFC function are as an organic whole |
| CN113014287B (en) * | 2021-02-24 | 2022-05-31 | 广州朗国电子科技股份有限公司 | IOT module and electrical apparatus that collection wiFi and NFC function are as an organic whole |
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Application publication date: 20170104 |