CN105991043A - A power conversion device - Google Patents

Abstract

A power conversion device allowing an electronic component to be mounted on a plate part to be easily connected to a connection object is provided. A through hole (10a) is formed in a circuit substrate (10B) on which a semiconductor module (11) is mounted so that a mounting screw (B) is connected to a radiator (30) from the through hole (10a) through a screw fixing part (11a) of the semiconductor module (11). A cylindric guide part (20) for guiding the mounting screw (B) is disposed between the through hole (10a) of the circuit substrate (10B) and the screw fixing part (11a) of the semiconductor module (11).

Description

power conversion device

technical field

The present invention relates to a power conversion device.

Background technique

Regarding semiconductor modules that control relatively large power, such as IGBTs (Insulated Gate Bipolar Transistors, insulated gate bipolar transistors) mounted in power conversion devices, generally, the improvement is achieved by directly screwing such semiconductor modules on the heat sink. cooling efficiency. Specifically, the mounting screws are fixed to the screw fixing holes of the heat sink through the screw through holes provided in the screw fixing part of the semiconductor module, so that the semiconductor module and the heat sink are closely bonded to each other, and the heat generated by the semiconductor module is efficiently transferred. to a radiator (for example, refer to Patent Document 1).

prior art literature

patent documents

Patent Document 1: Japanese Patent No. 4780349

In addition, when the mounting screws are fixed to the heat sink in a state where the semiconductor module is mounted on the circuit board, the circuit board needs to be provided with through holes. That is, it is necessary to insert mounting screws through through holes formed on the circuit board to fix the mounting screws to the heat sink through the screw through holes of the semiconductor module. However, there is a gap corresponding to the height of the semiconductor module between the circuit board and the heat sink. Therefore, it is difficult to hold the mounting screws in the gap between the circuit board and the heat sink, and the work of fixing the mounting screws becomes complicated. Specifically, there is a possibility that the mounting screw to be fixed falls out of the gap between the circuit board and the heat sink and enters the inside of the housing. Moreover, when the mounting screw falls off, it is necessary to perform recovery work from the inside of the housing, which significantly affects work efficiency.

The above problems can be solved by using mounting screws longer than the length of the gap between the circuit board and the heat sink, and increasing the plate thickness of the base member of the heat sink according to the length of the mounting screws. However, in this case, a new problem arises, that is, the work efficiency is affected because the time until the mounting screws are fixed is prolonged.

In addition, the above-mentioned problem is not limited to the case where the semiconductor module mounted on the circuit board is connected to the heat sink. That is, as long as it is an electronic component mounted on a board member such as a capacitor mounted on a busbar, it will occur similarly to the case where the mounting screw is fixed through the through hole of the board member and connected to a connection object such as a mounting substrate. above question.

Contents of the invention

In view of the above circumstances, the present invention aims to provide a power conversion device that facilitates the work of connecting an electronic component mounted on a plate member to a connection partner.

In order to achieve the above object, the power conversion device of the present invention forms a through hole on the plate member on which the electronic component is installed, and the mounting screw is connected to the connection object through the through hole of the above-mentioned plate member through the screw fixing part of the above-mentioned electronic component, so that the The connection between the electronic component and the connection object is characterized in that a guide member for guiding the mounting screw is provided between the through hole of the plate member and the screw fixing portion of the electronic component.

In addition, the present invention is based on the power conversion device described above, wherein the electronic component is mounted on the circuit board, and the mounting screw is fixed via the screw fixing part to connect the semiconductor module to the heat sink. The guide member is provided between the through hole formed in the circuit board and the screw fixing portion of the semiconductor module.

In addition, the present invention is based on the above-mentioned power conversion device, wherein the above-mentioned electronic component is connected to a bus bar at the terminal, and a fixing band is wound around the outer peripheral part, and the above-mentioned mounting screw is fixed to the screw fixing part through the screw fixing part of the fixing band. The capacitor that is fixed so as to be connected to the mounting substrate is provided with the guide member between the through hole formed on the busbar plate and the screw fixing portion of the fixing band.

In addition, the present invention is based on the power conversion device described above, wherein the guide member is formed in a cylindrical shape, and is attached to the through hole of the plate member in a state where the front end surface is in contact with the screw fixing portion of the electronic component. .

In addition, the present invention is based on the above-mentioned power conversion device, wherein the guide member has a stopper portion, and when the front end surface is brought into contact with the screw fixing portion of the electronic component, the stopper portion and the plate The surfaces of the components are in contact.

In addition, the present invention is based on the above power conversion device, wherein the guide member has a slit formed in the axial direction from the base end portion.

In addition, the present invention is based on the power conversion device described above, wherein the guide member has an inner diameter smaller than an axial length of the mounting screw.

According to the present invention, since the guide member for guiding the mounting screw is provided between the through hole of the plate member and the screw fixing portion of the electronic component, it is impossible for the mounting screw to come off in the gap between the plate member and the connection object. Therefore, it is not necessary to use a mounting screw having a large axial length, and the work of screwing the electronic component to the connection object can be easily performed.

Description of drawings

FIG. 1 is a perspective view showing the appearance of a power conversion device according to Embodiment 1 of the present invention.

FIG. 2 is an exploded perspective view of main parts of the power conversion device shown in FIG. 1 .

FIG. 3 is a perspective view of a circuit board used in the power conversion device shown in FIG. 1 .

Fig. 4 is a side sectional view of the power conversion device shown in Fig. 1 .

Fig. 5 is an exploded side sectional view showing the power conversion device shown in Fig. 1 .

FIG. 6 is a perspective view of a guide member applied to the power conversion device shown in FIG. 1 .

Fig. 7 is a perspective view of a support plate used in the power conversion device shown in Fig. 1 .

FIG. 8 is a perspective view of a frame member constituting a ventilation unit of the power conversion device shown in FIG. 1 .

9 is a perspective view showing the appearance of a power conversion device according to Embodiment 2 of the present invention.

Fig. 10 is a side sectional view of the power conversion device shown in Fig. 9 .

11 is a perspective view showing an assembled state of a capacitor, a mounting board, and a bus bar applied to the power conversion device shown in FIG. 9 .

FIG. 12 is an exploded perspective view of capacitors, mounting substrates, and busbars used in the power conversion device shown in FIG. 9 .

13 is an exploded side cross-sectional view of a capacitor, a mounting substrate, and a bus bar used in the power conversion device shown in FIG. 9 .

14 is a cross-sectional view showing an assembled state of a capacitor, a mounting substrate, and a bus bar applied to the power conversion device shown in FIG. 9 .

(Symbol Description)

10B...circuit board

10a...through hole

11...semiconductor module

11a...Screw fixing part

20... Bootstrap components

21...bottom wall

22…Slits

23...stopper

30…radiator

30c...Screw fixing hole

60...mounting substrate

60b...Screw fixing holes

62…capacitor

63...fixing strap

63a...Screw fixing part

63b...Through hole for screw

64...the first busbar

64b...First through hole

65...Second busbar

65b...Second through hole

70...guiding member

B…Mounting screws

detailed description

Hereinafter, preferred embodiments of the power conversion device of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)

1 and 2 show a power conversion device according to Embodiment 1 of the present invention. The power conversion device exemplified here is used to convert an AC voltage supplied from a commercial power supply into a desired frequency and amplitude, and then supply it to a load such as a motor. In Embodiment 1, a power conversion device is exemplified including a housing portion 1A for housing circuit boards (board members) 10A and 10B inside, and a ventilating portion 1B for converting power The components of the device, that is, semiconductor modules (electronic components) 11 such as IGBTs and capacitors 12 are cooled.

The housing portion 1A is a space formed between the main body plate 1a and the support plate 2 provided so as to cover the main body plate 1a. The main body plate 1a constitutes a part of the outline of the power conversion device 1, and is formed in a substantially rectangular flat plate shape from a resin material. Two circuit boards 10A and 10B having different sizes are supported on the inner surface side of the main body plate 1 a in a state of being stacked on each other. As shown in FIGS. 2, 3 and 4, the circuit board having a large external dimension (hereinafter referred to as main circuit board 10A) is formed in a rectangular shape slightly smaller than the main board 1a, and is arranged facing the inner surface of the main board 1a. The smaller circuit board (hereinafter referred to as sub-circuit board 10B) has approximately 1/2 the width of the main board 1a, and is arranged on the right half of the main board 1a in FIG. 2 . On the sub-circuit board 10B, heat-generating components such as the above-mentioned semiconductor module 11 and capacitor 12 are mainly assembled and mounted. Although not clearly shown in the figure, the above-mentioned main circuit board 10A and sub circuit board 10B are electrically connected to each other to constitute a control circuit necessary for power conversion.

As shown in FIG. 3 , the semiconductor module 11 used in Embodiment 1 is formed in a substantially rectangular parallelepiped shape, and has screw fixing portions 11 a on upper and lower side surfaces parallel to each other. The screw fixing portion 11 a is a tongue-shaped portion protruding from an edge portion on the side of the heat dissipation surface 11 b of the sub circuit board 10B away from the side surface of the semiconductor module 11 . Screw through holes 11c through which mounting screws B are inserted are provided in the respective screw fixing portions 11a. As shown in FIGS. 3 to 5 , through holes 10 a are respectively formed in portions of the main circuit board 10A and the sub circuit board 10B that face the screw through holes 11 c of the semiconductor module 11 . The through-holes 10a are circular openings having an inner diameter larger than that of the screw through-holes 11c, and each through-hole 10a has a guide member 20 inside.

As shown in FIGS. 4 to 6 , the guide member 20 is a cylindrical insulating resin member having a bottom wall 21 at its tip. The guide member 20 is disposed in the through holes 10 a of the main circuit board 10A and the sub circuit board 10B in a state where the bottom wall 21 having the screw through holes 21 a is in contact with the screw fixing portion 11 a of the semiconductor module 11 . The inner diameter of the guide member 20 is set smaller than the length of the mounting screw B in the axial direction. The guiding member 20 is provided with a plurality of slits 22 and stoppers 23 . The slit 22 is formed in the axial direction from the base end opening of the guide member 20 and divides the base end portion of the guide member 20 into four in the circumferential direction. The stopper portion 23 is a protruding portion protruding from the outer peripheral surface of the guide member 20 toward the outer periphery. The stopper portions 23 of the guide member 20 are respectively formed at positions where they abut against the portion of the main circuit board 10A that faces the main body board 1 a when the bottom wall 21 is brought into abutment with the screw fixing portion 11 a of the semiconductor module 11 . The surface and the position of the surface of the sub circuit board 10B that faces the main circuit board 10A.

As shown in FIGS. 2 , 4 and 7 , the support plate 2 is a resin molded product having a size to cover the main body plate 1 a. Capacitor accommodating portions 2 a are provided at positions corresponding to the capacitors 12 of the support plate 2 , and communication holes 2 b are provided at positions corresponding to the semiconductor modules 11 . The capacitor accommodating portion 2 a is for independently accommodating each capacitor 12 mounted on the sub circuit board 10B. Although not clearly shown in the drawings, the capacitor accommodating portion 2a is formed in a bottomed cylindrical shape that is open only on the surface of the support plate 2 that faces the main body plate 1a. The communication hole 2b is a substantially rectangular opening that can pass through the semiconductor module 11 but is smaller than the outer shape of the heat receiving surface 30a of the heat sink (connection object) 30 described later. Around the communication hole 2b, a seal groove 2c is provided on the back side that does not face the main body plate 1a. The seal groove 2c is a recess for accommodating the annular seal 3 .

As can be clearly seen from FIG. 2 , the support plate 2 is provided with a partition wall portion 2d so as to divide the back surface into left and right halves, and a ventilating plate portion 2e is provided at the upper edge of a part that becomes the right half in FIG. 2 . The partition wall portion 2d is a flat plate-shaped member erected so as to be substantially perpendicular to the main body plate 1a. The ventilation plate portion 2e is a flat member having many ventilation holes 2f, and is provided so as to cover the upper part of the right half of the support plate 2 in FIG. 2 .

The ventilation part 1B is a rectangular tube-shaped space along the vertical direction formed between the support plate 2 and the frame member 4 . The upper end opening of the ventilation part 1B is in the state covered with the ventilation board part 2e provided in the support plate 2. As shown in FIG. The frame member 4 is molded from a high thermal conductivity material having good thermal conductivity such as aluminum and aluminum alloy. As shown in FIGS. 2 and 8 , the frame member 4 has a main plate portion 4 a, a side plate portion 4 b, and an auxiliary side plate portion 4 c. The main plate portion 4a has an external dimension capable of covering a portion of the support plate 2 located on the right side of the partition wall portion 2d. A large number of fin fitting grooves 4d are provided in the vertical direction on the inner surface of the main plate portion 4a facing the support plate 2 . The side plate portion 4b is a portion extending from one edge of the main plate portion 4a toward the support plate 2 in a direction substantially perpendicular to the main plate portion 4a. When the main plate portion 4 a is opposed to the support plate 2 , the side plate portion 4 b is arranged to face the partition wall portion 2 d of the support plate 2 . The auxiliary side plate portion 4c is a portion extending from the other edge of the main plate portion 4a toward the support plate 2 in a direction substantially perpendicular to the main plate portion 4a. As can also be clearly seen from the drawings, the extension length of the auxiliary side plate portion 4c extending from the main plate portion 4a is configured to be shorter than the side plate portion 4b. When the main plate portion 4a is made to face the support plate 2, the auxiliary side plate portion 4c is superimposed on the partition wall portion 2d.

On the inner surface of the frame member 4, a ventilation fan 40 and a radiator 30 are provided. As shown in FIG. 2 , the ventilation fan 40 is disposed on the lower end of the inner surface of the frame member 4 . When the ventilation fan 40 is driven, the ventilation fan 40 introduces external air into the ventilation part 1B through the ventilation hole 2f of the ventilation plate part 2e, and discharges the air of the ventilation part 1B from the opening at the lower end. way to act.

Like the frame member 4, the heat sink 30 is molded from a high thermal conductivity material having good thermal conductivity such as aluminum or an aluminum alloy. In Embodiment 1, a heat sink 30 having a flat heat receiving surface 30 a on one surface of a base member and a plurality of cooling fins 30 b erected on the other surface is used. The heat receiving surface 30 a of the heat sink 30 is formed into a rectangular shape of a size capable of contacting the entire circumference of the seal 3 housed in the seal groove 2 c of the support plate 2 . The heat sink 30 is attached to the frame member 4 in a state of being thermally connected to the frame member 4 by fitting the front ends of the cooling fins 30b of the heat sink 30 into the fin fitting grooves 4d of the main plate portion 4a. The position where the heat sink 30 is attached to the frame member 4 is a position where the communication hole 2b of the support plate 2 is covered and the entire circumference of the sealing member 3 is exposed to heat when the main plate portion 4a is opposed to the support plate 2 . The position facing the peripheral portion of the surface 30a.

As shown in FIG. 8 , a pair of screw fixing holes 30 c are provided on the heat receiving surface 30 a of the radiator 30 . The screw fixing holes 30 c are provided corresponding to the screw through holes 11 c provided in the screw fixing portion 11 a of the semiconductor module 11 . 4, the mounting screws B are fixed in the screw fixing holes 30c of the heat sink 30 through the through holes 10a of the main circuit board 10A, the through holes 10a of the sub circuit board 10B and the screw through holes 11c of the semiconductor module 11. The mounting screw B has the function of bringing the heat dissipation surface 11b of the semiconductor module 11 into close contact with the heat receiving surface 30a of the heat sink 30, and of bringing the sealing member 3 of the support plate 2 into close contact with the heat receiving surface 30a of the heat sink 30. .

The power conversion device 1 configured as described above is installed, for example, in a state where the ventilation portion 1B is exposed to the outside. The support plate 2 insulates between the housing portion 1A that accommodates the main circuit board 10A and the sub circuit board 10B, and the ventilation portion 1B that is exposed to the outside. Therefore, even if water such as rainwater enters the ventilator 1B, it does not affect the control circuit and electronic components mounted on the main circuit board 10A and the sub circuit board 10B.

When the ventilation fan 40 is driven in the above-mentioned installation state, outside air is introduced into the inside of the ventilation part 1B through the ventilation hole 2f of the ventilation plate part 2e. The air introduced into the ventilation part 1B is discharged to the outside of the ventilation part 1B through the opening at the lower end after exchanging heat with the capacitor housing part 2 a and the heat sink 30 in this order. Therefore, when the power conversion device 1 operates, the heat generated in the capacitor 12 and the semiconductor module 11 can be dissipated by the air passing through the ventilation part 1B through the capacitor housing part 2a and the heat sink 30, and it is possible to prevent damage to the heat sink mounted on the main body. Electronic components on the circuit board 10A and the sub circuit board 10B are affected by heat. In particular, since the heat dissipation surface 11b of the semiconductor module 11 can be brought into close contact with the heat receiving surface 30a of the heat sink 30 by the mounting screws B, a high heat dissipation effect can be expected by the heat sink 30 .

In addition, in the power conversion device 1 described above, since the guide member 20 is arranged in the through hole 10a provided in the main circuit board 10A and the sub circuit board 10B, the operation for fixing the mounting screw B is extremely easy. That is, since the mounting screw B is guided to the screw fixing portion 11 a of the semiconductor module 11 by the guide member 20 , the mounting screw B does not come off midway. Furthermore, since the inner diameter of the guide member 20 is set to be smaller than the length of the mounting screw B in the axial direction, it does not cause a situation where the mounting screw B is skewed midway or its orientation is changed. Therefore, as long as the mounting screw B and the tool are inserted into the guide member 20, the mounting screw B can be reliably guided into the screw fixing hole 30c of the heat sink 30, and the mounting screw B can be fixed.

In addition, after the mounting screws B are fixed, the stopper portion 23 provided on the guide member 20 is in a state of being in contact with the surfaces of the main circuit board 10A and the sub circuit board 10B. Therefore, the main circuit board 10A and the sub circuit board 10B can be supported by the stopper portion 23 without causing problems such as bending of the circuit boards 10A and 10B. In addition, since the guide member 20 is provided with the slit 22, when the guide member 20 is inserted into the through hole 10a, the stopper portion 23 supporting the auxiliary circuit board 10B does not become a barrier for the guide member 20 to pass through the main circuit board 10A. Obstacles when passing through hole 10a.

In addition, in the first embodiment described above, the guide member 20 is provided on both the main circuit board 10A and the sub circuit board 10B, but the guide member 20 does not necessarily have to be provided at a position passing through the plurality of circuit boards 10A, 10B. The semiconductor module 11 to which the mounting screw B is fixed does not necessarily have to be an IGBT, and may be other heat-generating electronic components.

(Embodiment 2)

9 and 10 show a power conversion device according to Embodiment 2 of the present invention. The power conversion device 1' exemplified here is used to convert the AC voltage supplied from a commercial power supply into a desired frequency and amplitude, and then supply it to a load such as a motor, as in the first embodiment. The power conversion device 1' includes a main body housing 50 . The main body housing 50 is formed in a rectangular parallelepiped shape with an open back, and semiconductor modules 61 such as IGBTs and a plurality of capacitors (electronic components) 62 are disposed inside via a mounting substrate (connection object) 60 made of sheet metal. In the second embodiment, a power conversion device 1' including six capacitors (electrolytic capacitors) 62 formed in a cylindrical shape is specifically exemplified. Ventilation holes 51 are respectively provided on the upper surface and the lower surface of the main body frame 50 , and a ventilation fan 52 is provided inside the main body frame 50 . When the ventilation fan 52 is driven, outside air is introduced into the inside of the main body housing 50 through the ventilation holes 51 . In addition, reference numeral 53 in FIG. 10 is a heat sink for dissipating heat generated in the semiconductor module 61 .

The mounting substrate 60 is a flat member provided inside the main body housing 50 so as to be parallel to the front surface of the main body housing 50 . As shown in FIGS. 11 and 12 , the mounting substrate 60 has mounting holes 60 a respectively provided at positions where capacitors 62 are mounted, and two screw fixing holes 60 b are respectively provided corresponding to the mounting holes 60 a. The mounting holes 60a are circular cutouts through which the capacitors 62 can pass, and are arranged in two rows, three each in the left-right direction. The two screw fixing holes 60b are provided at positions shifted from each other by 180° around the mounting hole 60a.

The capacitor 62 includes two positive and negative terminals 62 b and 62 c on one end surface of a cylindrical capacitor main body 62 a . In each capacitor 62 , the fixing tape 63 is wound around the capacitor main body 62 a, and the respective terminals 62 b and 62 c are connected to different bus bars (plate members) 64 and 65 .

As shown in FIGS. 13 and 14 , the fixing band 63 is a metal ring-shaped member configured in the shape of a belt, and is attached around the capacitor main body 62 a. Two screw fixing portions 63 a are respectively provided on the fixing band 63 . The screw fixing portion 63a is a tongue-shaped portion provided to protrude from the peripheral surface of the capacitor body 62a, and extends in a direction perpendicular to the central axis of the capacitor body 62a. A screw through hole 63b is formed in each screw fixing portion 63a along the central axis of the capacitor body 62a.

The bus bar connected to one terminal 62b (hereinafter referred to as the first terminal 62b and the first bus bar 64 when distinguishing) has a first window hole 64a and a first through hole 64b at a position corresponding to each capacitor 62 . The first window hole 64a is for exposing the other terminal of the capacitor 62 (hereinafter referred to as the second terminal 62c when distinguishing) when the first bus bar 64 is connected to the terminal 62b of the capacitor 62 . The outer notch is formed in a rectangular shape so as to include one screw fixing hole 60 b of the mounting substrate 60 . The first through hole 64 b is a circular opening formed at a position corresponding to the other screw fixing hole 60 b of the mounting substrate 60 on the outer periphery of the capacitor main body 62 a.

The bus bar connected to the second terminal 62c (hereinafter referred to as the second bus bar 65 when distinguishing) has a second window hole 65a and a second through hole 65b at a position corresponding to each capacitor 62 . The second window 65a is a notch for exposing the other first terminal 62b and the first through hole 64b to the outside when the second bus bar 65 is connected to the second terminal 62c of the capacitor 62. The hole 65a is formed in a rectangular shape. The second through hole 65 b is a circular opening formed at a position corresponding to the screw fixing hole 60 b of the mounting substrate 60 on the outer periphery of the capacitor main body 62 a.

A guide member 70 is arranged in the first through hole 64 b and the second through hole 65 b of each of the bus bars 64 , 65 . The guide member 70 is a cylindrical insulating resin member having a center hole 70a. A stopper portion 71 is provided on the outer peripheral surface of the base end portion of the guide member 70 . The stopper portion 71 has an outer diameter larger than the inner diameter of the through holes 64b, 65b. Each guide member 70 is disposed in the through-holes 64b, 65b of the busbars 64, 65 in a state where the front end surface is in contact with the screw fixing portion 63a of the fixing band 63, and the stopper portion 71 is in contact with the peripheral edge of the opening of the through-hole 64b, 65b. Inside. The inner diameter of the guide member 70 is set to be smaller than the axial length of the mounting screw B used.

By inserting the capacitor main body 62a into the mounting hole 60a of the mounting substrate 60, and fixing the mounting screw B in the screw fixing hole 60b of the mounting substrate 60 via the screw fixing portion 63a of the fixing band 63, the capacitor 62 having the above-mentioned structure can be mounted by The mounting board 60 is mounted on the main body frame 50 .

Here, also in the power conversion device 1' of Embodiment 2, the guide member 70 is arranged between the through holes 64b, 65b of the respective busbars 64, 65 and the screw fixing portion 63a of the fixing band 63. Therefore, when the mounting screws B are fixed to the screw fixing holes 60b of the mounting substrate 60 via the screw fixing portions 63a, the mounting screws B are unlikely to come off midway, and the fixing work of the mounting screws B can be performed extremely easily. Furthermore, since the inner diameter of the guide member 70 is set to be smaller than the length of the mounting screw B in the axial direction, the mounting screw B will not be skewed or changed in the middle. As a result, just by inserting a tool together with the mounting screws B into the guide member 70, the mounting screws B can be reliably guided into the screw fixing holes 60b of the mounting substrate 60, and the mounting screws B can be fixed.

In addition, in the above-mentioned Embodiment 1 and Embodiment 2, members each having a cylindrical shape were exemplified as the guide member, but the guide member may be configured in a polygonal cylindrical shape. In addition, as long as the mounting screws B can be prevented from coming off to the surroundings, a mesh-shaped or lattice-shaped guide member can also be applied. In addition, as a guide member, it does not necessarily need to be an independent member. For example, the guide member 20 may be provided on the screw fixing portion 11 a of the semiconductor module 11 , and the guide member may be provided on the screw fixing portion 63 a of the fixing band 63 .

Claims (7)

1. a power inverter, is formed with through hole on the board member be provided with electronic component, makes Screw is installed from the through hole of described board member via the screw fixed part of described electronic component and connecting object Connect, thus will be connected between described electronic component with described connecting object, it is characterised in that

It is provided with guiding institute from the through hole of described board member to the screw fixed part of described electronic component State the guiding elements installing screw.

2. power inverter as claimed in claim 1, it is characterised in that

Described electronic component is mounted on circuit substrate, and via described screw fixed part to described Screw is installed be fixed, thus the semiconductor module being connected with radiator,

From the through hole being formed at described circuit substrate to the screw fixed part of described semiconductor module It is provided with described guiding elements.

3. power inverter as claimed in claim 1, it is characterised in that

Described electronic component is to be connected with bus bar plate at terminal, and is wound with fixed band at peripheral part, Described installation screw is fixed by the screw fixed part via described fixed band, thus and installation base plate The capacitor connecting,

It is provided with to the screw fixed part of described fixed band from the through hole being formed at described bus bar plate Described guiding elements.

4. power inverter as claimed in claim 1, it is characterised in that

Described guiding elements is formed as tubular, and the screw fixed part at front end face and described electronic component supports It is arranged in the state of connecing in the through hole of described board member.

5. power inverter as claimed in claim 4, it is characterised in that

Described guiding elements has stopper section, at the screw fixed part making front end face and described electronic component In the case of abutting, described stopper section abuts with the surface of described board member.

6. power inverter as claimed in claim 4, it is characterised in that

Described guiding elements has the slit being axially formed from base end part.

7. power inverter as claimed in claim 1, it is characterised in that

Described guiding elements has the internal diameter less than the length vertically of described installation screw.