CN105990191A - Substrate transporting stage, scribing apparatus and method for transporting substrate - Google Patents
Substrate transporting stage, scribing apparatus and method for transporting substrate Download PDFInfo
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- CN105990191A CN105990191A CN201510666645.3A CN201510666645A CN105990191A CN 105990191 A CN105990191 A CN 105990191A CN 201510666645 A CN201510666645 A CN 201510666645A CN 105990191 A CN105990191 A CN 105990191A
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- substrate
- saddle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a substrate transporting stage, a scribing apparatus including the same and a method for transporting a substrate preventing substrate damage on the state. The substrate transporting stage includes a state onto which the substrate is disposed and which rotates to transport the substrate along a direction, and an antistatic belt disposed to surround the table and preventing accumulation of static charges between the substrate and the stage, wherein the stage comprises first and second stages spaced at a preset distance along the transporting direction of the substrate, and controls rotation of the first stage and rotation of the second stage in an asynchronous manner.
Description
Technical field
The present invention relates to a kind of substrate conveying saddle, including the chalker of substrate conveying saddle and in order to prevent at saddle
The method of the conveying substrate of the substrate damage of upper conveying.
Background technology
In general, aobvious by using unit face glass (hereinafter referred to as " cell substrate ") to manufacture as flat board
Show the LCD of panel, organic EL panel, inorganic EL panel, transmission type projector substrate, opaque projector
Substrates etc., wherein by being cut to predetermine sizes by fragility mother's face glass (hereinafter referred to as " substrate ") of such as glass
Make unit face glass.
The process of cutting substrate includes moving by diamond by pressing and along the predetermined cuts line formed on the surface of the substrate
The scratching process of line is formed and along line cutting substrate to obtain the sliver of cell substrate etc. the break bar made.
Generally, the process of cutting substrate is carried out by belt chalker.
General belt chalker is provided with the single band for each process.
Such as, by supply unit, substrate is provided on any one band, then carry described substrate along conveying direction, will
The board transport of conveying carries to another, to carry out scratching process, then the board transport of line is carried to another,
To carry out sliver and pick process.
In the case, for example, it is possible to each carry between carry out such as scratching process or sliver process as a result, these
Band is necessarily positioned to form the separated space with preset space length between these carry.
In the case of these bands are positioned as described above for being spaced apart from each other with preset space length, there is problems of, work as line
Substrate or the cell substrate of disconnection through separated space, between being carried by these around the not working portion of cell substrate
Separated space fall, or the substrate carried due to these carry between flatness or height difference and do not line up.
Additionally, when being obtained cell substrate then supply unit substrate on these bands by cutting substrate, often occur
Problem is, preceding cell substrate and cell substrate subsequently are due to impinging one another and damage.
Reason is to there is predetermined frictional force between substrate and band, and because band is typically to be made up of retractable material,
So there is temporal difference between the time point that time point and the substrate of band practical operation moves.
In order to solve these problems, it is intended to make previous band and band subsequently synchronize, and operate elder generation with identical speed simultaneously
Front band and band subsequently, but in the case of said method is applied to real process, band is stretched due to the weight of substrate
Contracting, thus between the time point that time point and the substrate of band practical operation moves, still suffer from temporal difference as a result,
Previous cell substrate and cell substrate subsequently still occur due to impinging one another and damage, the problem causing defect.
Summary of the invention
This invention address that and a kind of substrate conveying saddle is provided and includes the chalker of substrate conveying saddle, when defeated by band
When sending cell substrate, reduce ratio of defects by the collision between prevention unit substrate, wherein by by line or disconnection
Cutting substrate obtains described cell substrate.
The present invention is also actively working to provide a kind of substrate conveying saddle and include the chalker of substrate conveying saddle, by reducing
Producing frictional force and the probability of electrostatic charge between substrate and band, what reduction may occur during conveying substrate lacks
The rate of falling into.
One illustrative embodiments of the present invention provides a kind of substrate conveying saddle, including: saddle, substrate is placed in described torr
On platform, and described saddle rotates, to carry substrate placed on it in one direction；And antistatic belts, described anti-
Electrostatic belt is arranged around saddle, and prevents from being formed electrostatic charge between substrate and saddle, and wherein, described saddle includes putting
It is set to the first saddle and the second saddle being spaced apart from each other along the conveying direction of substrate with preset space length, and with asynchronous side
Formula controls rotating and the rotation of the second saddle of the first saddle.
The sheet resistance of the antistatic belts of adjacent substrate can be 106To 1010Ω/□。
The voltage of the electrostatic charge produced on the antistatic belts of adjacent substrate can be 100V or lower.
Antistatic belts can include that surface layer and intermediate layer, described surface layer adjoin substrate and have the pattern of injustice, described
Intermediate layer includes conductive material.
Conductive material in intermediate layer can be oriented parallel to the conveying direction of substrate.
Conductive material can be CNT or conducting metal.
Spacing between first saddle and the second saddle provides a space, and in described space, break bar contacts with substrate.
The rotary speed of the first saddle and the second saddle can be different from each other.
The another exemplary embodiment of the present invention provides a kind of chalker, including: substrate conveying saddle；Substrate carries
Unit, it is placed in the substrate on substrate conveying saddle along conveying direction conveying at a predetermined velocity；And scribing unit, its edge
It is orthogonal to the direction cutting substrate of the conveying direction of substrate, to produce the first module substrate being placed on the first saddle and to be placed in
Second unit substrate on second saddle.
The first saddle and the second saddle can be controlled in an asynchronous manner, in order at first module substrate and second unit substrate
Under the state contacted with each other, conveying first module substrate and second unit substrate.
The first saddle and substrate supply unit can be controlled in a synchronous manner.
The first saddle and the second saddle can be controlled in an asynchronous manner, in order at first module substrate and second unit substrate
Under the state being spaced apart from each other, conveying first module substrate and second unit substrate.
The another exemplary embodiment of the present invention provides a kind of method of conveying substrate, and described method includes: along a side
It is placed in the substrate on the first saddle to conveying, and described substrate is placed on both the first saddle and the second saddle, Qi Zhongsuo
State the second saddle and be placed as spaced apart with the first saddle；Become to be placed in the by substrate cut between the first saddle and the second saddle
First module substrate on one saddle and the second unit substrate being placed on the second saddle；Rotate the first saddle, and the most defeated
Send first module substrate and second unit substrate, in order in the state that first module substrate and second unit substrate contact with each other
Under, make both first module substrate and second unit substrate be placed on the second saddle；And rotate the second saddle, and
Under the state that one cell substrate and second unit substrate contact with each other, conveying first module substrate and second unit substrate.
The another exemplary embodiment of the present invention provides a kind of method of conveying substrate, and described method includes: along a side
It is placed in the substrate on the first saddle to conveying, and described substrate is placed on both the first saddle and the second saddle, Qi Zhongsuo
State the second saddle and be placed as spaced apart with the first saddle；Become to be placed in the by substrate cut between the first saddle and the second saddle
First module substrate on one saddle and the second unit substrate being placed on the second saddle；Rotate the second saddle, and along one
Direction conveying second unit substrate；And rotate the first saddle and the second saddle, first module substrate to be placed in simultaneously
On two saddles, and when first module substrate and second unit substrate are spaced apart from each other, carry first module substrate
With second unit substrate.
According to an illustrative embodiment of the invention, when by band supply unit substrate, prevention unit substrate can be passed through
Between collision and reduce ratio of defects, wherein by by line or disconnect cutting substrate obtain described cell substrate.
Additionally, according to the present invention it is possible to produce frictional force and the probability of electrostatic charge between substrate and band by reducing,
The defect that reduction may occur during conveying substrate.
Accompanying drawing explanation
Fig. 1 is the top view schematically showing the substrate conveying saddle according to exemplary embodiment of the invention.
Fig. 2 A and Fig. 2 B schematically shows and is arranged on substrate conveying saddle according to exemplary embodiment of the invention
The axonometric chart of the antistatic belts on the first saddle and the second saddle.
Fig. 3 is the view illustrating the antistatic belts according to exemplary embodiment of the invention.
Fig. 4 A to 4D is to schematically show the conveying according to exemplary embodiment of the invention the process of cutting substrate
View.
Fig. 5 A to 5E is to schematically show the conveying according to another exemplary embodiment of the present invention cutting substrate
The view of process.
Detailed description of the invention
Define specific term the most herein, to contribute to the present invention easy to understand.Unless defined otherwise herein, this
What all terms including technical term or scientific terminology that used of invention had that those skilled in the art are generally understood that contains
Justice.Furthermore, it is to be understood that odd number used herein is expressed includes that its plural number is expressed, and plural number is expressed and is also included that it is single
Number is expressed, unless the other clear stipulaties of context.
Including ordinal number, such as, the term of " first ", " second " etc. can be used to describe different element, but
Element should not be limited by these terms.These terms are only used for distinguishing an element and another element.
Substrate conveying saddle according to exemplary embodiment of the invention and bag are explained in more detail hereinafter with reference to accompanying drawing
The configuration including the chalker of substrate conveying saddle and the principle of the method using these configuration conveying substrates.
Fig. 1 is the top view schematically showing the substrate conveying saddle according to exemplary embodiment of the invention.
Substrate conveying saddle according to exemplary embodiment of the invention includes substrate P saddle placed on it and sets respectively
It is set to the antistatic belts around saddle.
More specifically, saddle includes the first saddle being set to be spaced apart from each other along the conveying direction of substrate P with preset space length
100 and second saddle 200, and the first saddle 100 and the second saddle 200 rotate, and is placed in it to carry in one direction
On substrate P.
In the case, rotating and the rotation of the second saddle 200 of the first saddle 100 is controlled in an asynchronous manner.
Here, asynchronous controlling may imply that the first saddle 100 rotate and the rotation of the second saddle 200 is not with the same time
Start, the i.e. first saddle 100 start rotate time point and the second saddle 200 start rotate time point different from each other.
Additionally, the rotary speed that asynchronous controlling may imply that the rotary speed of the first saddle 100 and the second saddle 200 is different from each other.
Although the most separately shown, but can drive by means of the control being separately positioned in the first saddle 100 and the second saddle 200
Moving cell controls the first saddle 100 and the second saddle 200 starts the time point of rotation, its rotary speed etc..
The substrate P being placed on substrate conveying saddle is kept by substrate supply unit 120, then along conveying direction with pre-constant speed
Degree conveying.Substrate supply unit 120 has the multiple grip unit 121 for the end clamping substrate P.
In the case of an end of substrate P is kept by substrate supply unit 120, have been provided that on the first saddle 100
Substrate P carried, and in the case of an end of substrate P is kept by substrate supply unit 120, along conveying side
To being sent to the second saddle 200.For follow-up process, again passed along conveying direction conveying by substrate supply unit 120
Deliver to the substrate P of the second saddle 200.
Fig. 2 A and Fig. 2 B schematically shows and is arranged on substrate conveying saddle according to exemplary embodiment of the invention
The axonometric chart of the antistatic belts on the first saddle and the second saddle.
See Fig. 2 A and Fig. 2 B, for accommodating the receiving part 130 of multiple grip unit 121 of substrate supply unit 120
Deflector roll 140 and 240 with 230 and for the rotation that supports antistatic belts 110 and 210 is arranged on antistatic belts 110
In 210, wherein antistatic belts 110 and 210 is respectively set to around the first saddle 100 and the second saddle 200.
More specifically, accommodate part 130 and 230 there is multiple grooves 131 He for accommodating multiple grip unit 121
231, and multiple groove 131 and 231 is set to the spacing that is spaced apart from each other with grip unit 121, along antistatic belts
The width of 110 and 210 is spaced apart from each other.
Additionally, accommodate part 130 and 230 to be set to the longitudinal direction along antistatic belts 110 and 210 with preset space length d
It is spaced apart from each other, to accommodate substrate supply unit 120 continuously.Here, can be according to the rotation of the first saddle 100, base
The transporting velocity of plate supply unit 120 and driving distance etc., proportionally set spacing d with the transporting velocity of substrate P.
Here, antistatic belts 110 and 210 can be configured to flat rubber belting.
Generally, use multiple bands extendable in the longitudinal direction by be arrangeding in parallel, but in the case, multiple bands flat
Face degree (highly) needs to remain to be equal to each other.
If arranging multiple band with different height, then substrate can not be made to be steadily placed on band when conveying substrate, this can
Substrate can be caused not line up and increase the inexactness of subsequent process.
Therefore, in the present invention, substrate P band placed on it is configured to flat rubber belting, thus allows to carry on corresponding saddle
The whole basal surface of substrate P be placed on band.
Additionally, the flat rubber belting of composition antistatic belts 110 and 210 is rotatably arranged with the form of crawler belt, and the two of flat rubber belting
Individual end is attached to one another by binding agent, in order to configure flat rubber belting with the form of crawler belt.
But, when two ends of flat rubber belting are attached to one another, the surfaces for attachment formed by binding agent need to be positioned at flat rubber belting with
Between saddle.If surfaces for attachment is formed on the upper surface of substrate P flat rubber belting placed on it, then it is applied in substrate P
The amount of frictional force neutralize in the region forming surfaces for attachment be formed without in the region of surfaces for attachment inevitable different as a result, flat
The tension force of band can change according to substrate P position placed on it.
See Fig. 2 A, in the case of an end of substrate P is kept by substrate supply unit 120, substrate P is carried
It is fed to the first saddle 100, and in the case, substrate supply unit 120 can be along vertically or horizontally providing substrate P.
That is, when accommodating the starting point that part 130 is positioned at the first saddle 100, substrate supply unit 120 can be along conveying
It is oriented parallel to the first saddle 100 move, in order to multiple grip unit 121 are contained in multiple groove 131, Qi Zhongduo
Individual groove 131 is arranged in the receiving part 130 of antistatic belts 110.
In another amendment embodiment, when accommodating the starting point that part 130 is positioned at the first saddle 100, substrate is defeated
Send unit 120 can move vertically from the top side of the first saddle 100, in order to multiple grip unit 121 are contained in multiple recessed
In groove 131, plurality of groove 131 is arranged in the receiving part 130 of antistatic belts 110.
In this way, substrate supply unit 120 can along vertically or horizontally substrate P being provided to the first saddle 100,
As a result, substrate supply unit 120 may be used on different types of device.Additionally, in some cases, substrate conveying is single
The direction that unit 120 is configured to along being perpendicular to the first saddle 100 provides substrate P, thus reduces the overall dimensions of device.
As it has been described above, substrate supply unit 120 allows multiple grip unit 121 to be contained in multiple groove 131, wherein
Multiple grooves 131 be arranged in the receiving part 130 of antistatic belts 110 as a result, held unit 121 clamping base
The whole basal surface of plate can be steadily placed on antistatic belts 110.
Additionally, because multiple grip unit 121 are contained in multiple groove 131, it is possible to prevent grip unit 121
And the interference between antistatic belts 110.
It follows that due to the rotation of the first saddle 100 and the movement of substrate supply unit 120, move along conveying direction
Substrate P is sent to the second saddle 200.
In the case, the first saddle 100 and the second saddle 200 can have identical height, resisting of the i.e. first saddle 100
The antistatic belts 210 of electrostatic belt 110 and the second saddle 200 can have identical height.
Because the antistatic belts of two saddles is formed with identical height, so the difference in height between not considering by two saddles is drawn
The collision risen is applied to from the substrate P that the first saddle 100 is sent to the second saddle 200, is therefore prevented from the right of substrate P
The problem that neat state changes.
Additionally, when substrate P is kept by substrate supply unit 120, substrate P is sent to the second saddle 200.
That is, substrate supply unit 120 moves, in order to multiple grip unit 121 of substrate supply unit 120 can be passed through
The rotation of the first saddle 100, removes multiple groove 131 when multiple grooves 131 are positioned at the destination county of the first saddle 100,
And multiple grip unit 121 can be contained in multiple when multiple grooves 231 are positioned at the starting point of the second saddle 200
In groove 231, thus substrate P is sent to the second saddle 200.
In the case, in the case of substrate P is kept by substrate supply unit 120, it is sent to the base of the second saddle 200
Distance spaced apart from bottom surface for plate P keeps constant, is therefore prevented from during substrate P is sent to the second saddle 200,
The problem being caused the aligned condition change of shock or substrate P by the difference in height being applied to substrate P.
The first saddle 100 and the time point of the second saddle 200 rotation and the first torr can be controlled the most in an asynchronous manner
Platform 100 and the rotary speed of the second saddle 200, but the substrate supply unit 120 moving away the first saddle 100 arrives
The time of the starting point reaching the second saddle 200 can be positioned at the time of the starting point of the second saddle 200 with multiple grooves 231
Synchronize.
Therefore, it can significantly decrease required for the process that substrate P is sent to the second saddle 200 from the first saddle 100
The overall time, even and if process time shorten and also can keep further with the stablizing of process of high level conveying substrate P
Property.
Fig. 3 schematically shows antistatic belts according to exemplary embodiment of the invention 110 or 210 and be arranged on anti-
The top view of intermediate layer 110a or 210a in electrostatic belt 110 or 210 and surface layer 110b's or 210b is transversal
Face figure.
Antistatic belts 110 and 210 is for preventing formation electrostatic between substrate P and saddle or between substrate P and band
The band of lotus, and as it is shown on figure 3, antistatic belts 110 and 210 includes intermediate layer 110a and 210a and surface layer 110b
And 210b, wherein intermediate layer 110a and 210a includes that conductive material C, surface layer 110b and 210b have the mould of injustice
Formula.
The conductive material C being included in 110a with 210a of intermediate layer can be oriented to parallel with the conveying direction of substrate, with
Improve antistatic property.That is, the shape extended with the longitudinal direction along antistatic belts 110 and 210 places conductive material C.
Can be used for providing the example of the conductive material C of antistatic property to include CNT, conducting metal etc..
Owing to including intermediate layer 110a and 210a of conductive material C, according to the antistatic of exemplary embodiment of the invention
Band 110 and 210 can have 106To 1010The sheet resistance of Ω/, and can be by antistatic belts 110 and 210
The voltage of the electrostatic charge of upper generation remains to 100V or lower.
Additionally, because antistatic belts 110 and 210 be provided with on 110a and 210a of intermediate layer be formed the most flat-die type powdered
Surface layer 110b and 210b, it is possible to reduce the frictional force between substrate P and antistatic belts 110 and 210.As long as
Reduce the frictional force between antistatic belts 110 and 210 and the substrate P being placed on surface layer 110b and 210b, uneven
The shape of pattern is not particularly limited.
Antistatic belts 110 and 210 according to exemplary embodiment of the invention prevents at put base not only by improvement
The performance of build up of electrostatic charge on plate P and prevent the substrate P that is damaged due to electrostatic charge, and antistatic belts can be reduced
Frictional force between 110 and 210 and the substrate P being placed on antistatic belts 110 and 210, thus reduces antistatic belts 110
And 210 operation time point and the actual time point moved of substrate P being placed on antistatic belts 110 and 210 between time
Difference between.
Fig. 4 A to 4D is to schematically show the conveying according to exemplary embodiment of the invention the process of cutting substrate
View.
See Fig. 4 A, antistatic belts 110 rotation on the first saddle 100 as crawler belt that substrate P is placed on it.
See Fig. 4 B, substrate P according to the rotation of the first saddle 100 1. by the crawler-type rotating of antistatic belts 100 along one
Individual direction carries, and is then concurrently placed on the first saddle 100 and the second saddle 200, and wherein the second saddle 200 is placed as
Spaced apart with the first saddle 100.
Here, the spacing that the first saddle 100 and the second saddle 200 are spaced apart from each other defines a space, at described sky
In between, break bar 300 contacts with substrate, and break bar 300 is along the direction cutting substrate orthogonal with the conveying direction of substrate P
The upper surface of P and/or lower surface.
Therefore, produce the first module substrate P 1 being placed on the antistatic belts 110 of the first saddle 100 and be placed in the second torr
Second unit substrate P 2 on the antistatic belts 210 of platform 200.
See Fig. 4 C, after completing to use break bar 300 cutting substrate P, at first module substrate P 1 and second unit
In the case of substrate P 2 contacts with each other, first module substrate P 1 and second unit substrate P 2 are by antistatic belts 110
Crawler-type rotating carries the most simultaneously, in order to be placed on the antistatic belts 210 of the second saddle 200.
In the case, antistatic belts 110 and antistatic belts 210 are controlled in an asynchronous manner, in order to antistatic belts 110
Rotate as crawler belt, and under the state that antistatic belts 210 is maintained at stopping.
Furthermore, it is possible to the mode synchronized or in an asynchronous manner control substrate supply unit 120 and antistatic belts 110.Example
As, antistatic belts 110 can be first begin to rotate as crawler belt, and then substrate supply unit 120 can move.
Due to crawler-type rotating and the movement of substrate supply unit 120 of antistatic belts 110, in first module substrate P 1
In the case of contacting with each other with second unit substrate P 2, both first module substrate P 1 and second unit substrate P 2 are placed in
On the antistatic belts 210 of the second saddle 200.
In the case, as it has been described above, substrate supply unit 120 moves, in order to multiple folders of substrate supply unit 120
Hold unit 121 to remove from multiple grooves 131 when multiple grooves 131 are positioned at the destination county of the first saddle 100, and
And multiple grip unit 121 can be contained in multiple recessed when multiple grooves 231 are positioned at the starting point of the second saddle 200
In groove 231, thus both first module substrate P 1 and second unit substrate P 2 are sent to the second saddle 200.
It follows that see Fig. 4 D, in the case of first module substrate P 1 and second unit substrate P 2 contact with each other,
First module substrate P 1 and second unit substrate P 2 according to the rotation of the second saddle 200 2. by the crawler belt of antistatic belts 210
Formula rotates and carries along conveying direction, to stand process subsequently.
The conveying according to exemplary embodiment of the invention shown in Fig. 4 A to 4D the spy of the process of cutting substrate
Levy and be, it is contemplated that due between antistatic belts 110 and 210 and the substrate P being placed on antistatic belts 110 and 210
Frictional force, especially because the friction between antistatic belts 210 and the second unit substrate P 2 being placed on antistatic belts 210
Power, in the time point of antistatic belts 210 operation and the actual movement of the second unit substrate P 2 that is placed on antistatic belts 210
Temporal difference is produced, so controlling rotation and second torr of the first saddle 100 in an asynchronous manner between time point
The rotation of platform 200, to prevent first module substrate P 1 and second unit substrate P 2 anti-due to stretching of antistatic belts 210
Collide with one another with covering and separate.
The substrate P being placed on the first saddle 100 and the second saddle 200 i.e., at the same time is cut into first module substrate
Under the state of P1 and second unit substrate P 2, the first saddle 100 rotated before the rotation of the second saddle 200, in order to
When first module substrate P 1 and second unit substrate P 2 contact with each other on the second saddle 200, first module
Substrate P 1 and second unit substrate P 2 both can be carried.
Fig. 5 A to 5E is to schematically show the conveying according to another exemplary embodiment of the present invention cutting substrate
The view of process.
See Fig. 5 A, antistatic belts 110 rotation on the first saddle 100 as crawler belt that substrate P is placed on it.
See Fig. 5 B, substrate P according to the rotation of the first saddle 100 1. by the crawler-type rotating of antistatic belts 110 along one
Individual direction carries, and is then concurrently placed on the first saddle 100 and the second saddle 200, and wherein the second saddle 200 is placed as
Spaced apart with the first saddle 100.
Here, the spacing that the first saddle 100 and the second saddle 200 are spaced apart from each other defines a space, at described sky
In between, break bar 300 contacts with substrate, and break bar 300 is along the direction cutting substrate orthogonal with the conveying direction of substrate P
The upper surface of P and/or lower surface.
Therefore, produce the first module substrate P 1 being placed on the antistatic belts 110 of the first saddle 100 and be placed in the second torr
Second unit substrate P 2 on the antistatic belts 210 of platform 200.
See Fig. 5 C, after completing to use break bar 300 cutting substrate P, in the case of antistatic belts 110 stopping,
2. first module substrate P 1 and second unit substrate P 2 become to be spaced apart from each other by the crawler-type rotating of antistatic belts 210,
And only second unit substrate P 2 is placed on the antistatic belts 210 of the second saddle 200 and at the antistatic of the second saddle 200
Carry on band 210.
In the case, antistatic belts 110 and antistatic belts 210 are controlled in an asynchronous manner, in order to antistatic belts 110
Rotate as crawler belt, and under the state that antistatic belts 210 is maintained at stopping.Equally, base is controlled the most in an asynchronous manner
Plate supply unit 120 and antistatic belts 210, in order to substrate supply unit 120 is maintained at as antistatic belts 210 and stops
Under state only.
In the case of substrate supply unit 120 does not moves, second unit substrate P 2 can be with first module substrate P 1 point
Leave, then when second unit substrate P 2 is placed in antistatic belts 210 of the second saddle 200, second unit base
Plate P2 is carried along conveying direction by the crawler-type rotating of antistatic belts 210.
It follows that see Fig. 5 D, both first module substrate P 1 and second unit substrate P 2 can be according to the first saddles
The rotation of rotation 1. with the second saddle 200 of 100 2., by the crawler-type rotating of antistatic belts 110 and 210 along conveying side
To conveying, and in the case, first module substrate P 1 can be placed on antistatic belts 210.At first module substrate
In the case of one end of P1 is kept by substrate supply unit 120, first module substrate P 1 is placed in antistatic belts 210
On process same as described above.
Here, the first saddle 100 and the second saddle 200 at same time point and rotate as a result, the with identical speed
In the case of one cell substrate P1 and second unit substrate P 2 are spaced apart from each other with preset space length, first module substrate P 1
It is placed on antistatic belts 210 with second unit substrate P 2.
It follows that see Fig. 5 E, in the case of first module substrate P 1 and second unit substrate P 2 are spaced apart from each other,
First module substrate P 1 and second unit substrate P 2 both according to the rotation of the second saddle 200 2. by antistatic belts 210
Crawler-type rotating along conveying direction carry.
In the process carrying also cutting substrate according to another exemplary embodiment of the present invention shown in Fig. 5 A to 5E
It is characterised by, it is contemplated that at time point and the second unit substrate being placed on antistatic belts 210 of antistatic belts 210 operation
Temporal difference is produced, in first module substrate P 1 and second unit substrate P 2 between the actual time point moved of P2
Under the state being spaced apart from each other, by controlling rotating and the rotation of the second saddle 200 of the first saddle 100 in an asynchronous manner
Transfer conveying first module substrate P 1 and second unit substrate P 2.
The substrate P being placed on the first saddle 100 and the second saddle 200 i.e., at the same time is cut into first module substrate
Under the state of P1 and second unit substrate P 2, the second saddle 200 rotated before the rotation of the first saddle 100, in order to
When first module substrate P 1 and second unit substrate P 2 are spaced apart from each other on the second saddle 200, first is single
Unit's substrate P 1 and second unit substrate P 2 both can be carried.
According to above-mentioned each illustrative embodiments of the present invention, when becoming cell substrate right substrate cut by line or disconnection
Time afterwards by band conveying substrate, the state that unit substrate can be kept to contact with each other or be spaced apart from each other, it is therefore prevented from
Defect is produced due to the collision between unit substrate.
Although being described above the illustrative embodiments of the present invention, but this disclosed in without departing from claim
In the case of bright purport, those skilled in the art can be by adding, change, be deleted or modified element with various
Mode revises the change present invention, and these modifications and changes also term the scope of the present invention.
Claims (14)
1. a substrate conveying saddle, including:
Saddle, substrate is placed on described saddle, and described saddle rotates, to carry base placed on it in one direction
Plate；And
Antistatic belts, described antistatic belts is arranged around described saddle, and prevents between described substrate and described saddle
Build up of electrostatic charge,
Wherein, described saddle includes the first torr being set to be spaced apart from each other along the conveying direction of described substrate with preset space length
Platform and the second saddle, and control rotating and the rotation of described second saddle of described first saddle in an asynchronous manner.
2. substrate conveying saddle as claimed in claim 1, wherein, the sheet resistance of the antistatic belts of adjacent described substrate
It is 106To 1010Ω/□。
3. substrate conveying saddle as claimed in claim 2, wherein, produces on the antistatic belts of adjacent described substrate
The voltage of electrostatic charge is 100V or lower.
4. substrate conveying saddle as claimed in claim 1, wherein, described antistatic belts includes surface layer and intermediate layer,
Described surface layer adjoins described substrate and has the pattern of injustice, and described intermediate layer includes conductive material.
5. substrate conveying saddle as claimed in claim 4, wherein, the conductive material in described intermediate layer is oriented to parallel
Conveying direction in described substrate.
6. substrate conveying saddle as claimed in claim 5, wherein, described conductive material is CNT or conducting metal.
7. substrate conveying saddle as claimed in claim 1, wherein, between described first saddle and described second saddle
Spacing provides a space, and in described space, break bar contacts with described substrate.
8. substrate conveying saddle as claimed in claim 1, wherein, described first saddle and the rotation of described second saddle
Speed is different from each other.
9. a chalker, including:
Substrate conveying saddle as according to any one of claim 1 to 8；
Substrate supply unit, described substrate supply unit carries at a predetermined velocity along conveying direction and is placed in described substrate conveying torr
Substrate on platform；
Scribing unit, described scribing unit cuts described substrate, with life along the direction of the conveying direction being orthogonal to described substrate
Produce the first module substrate being placed on described first saddle and the second unit substrate being placed on described second saddle.
10. chalker as claimed in claim 9, wherein, controls described first saddle and described in an asynchronous manner
Second saddle, in order to when described first module substrate and described second unit substrate contact with each other, conveying is described
First module substrate and described second unit substrate.
11. chalkers as claimed in claim 10, wherein, control described first saddle and described in a synchronous manner
Substrate supply unit.
12. chalkers as claimed in claim 9, wherein, control described first saddle and described in an asynchronous manner
Second saddle, in order to when described first module substrate and described second unit substrate are spaced apart from each other, carries institute
State first module substrate and described second unit substrate.
The method of 13. 1 kinds of conveying substrates, described method includes:
Conveying is placed in the substrate on the first saddle in one direction, and described substrate is placed in described first saddle and the second torr
On both platforms, wherein said second saddle is placed as spaced apart with described first saddle；
Between described first saddle with described second saddle, described substrate cut is become first be placed on described first saddle
Cell substrate and the second unit substrate being placed on described second saddle；
Rotate described first saddle, and carry described first module substrate and described second unit substrate simultaneously, in order in institute
State first module substrate and under state that described second unit substrate contacts with each other, make described first module substrate and described
Both two cell substrates are placed on described second saddle；And
Rotate described second saddle, and when described first module substrate and described second unit substrate contact with each other,
Carry described first module substrate and described second unit substrate.
The method of 14. 1 kinds of conveying substrates, described method includes:
Conveying is placed in the substrate on the first saddle in one direction, and described substrate is placed in described first saddle and the second torr
On both platforms, wherein said second saddle is placed as spaced apart with described first saddle；
Between described first saddle with described second saddle, described substrate cut is become first be placed on described first saddle
Cell substrate and the second unit substrate being placed on described second saddle；
Rotate described second saddle, and carry described second unit substrate in one direction；And
Rotate described first saddle and described second saddle, so that described first module substrate is placed in described second saddle simultaneously
On, and when described first module substrate and described second unit substrate are spaced apart from each other, carry described first single
Unit's substrate and described second unit substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150036259A KR102400552B1 (en) | 2015-03-16 | 2015-03-16 | Substrate transporting stage, scribing apparatus comprising the same and method for transporting substrate |
| KR10-2015-0036259 | 2015-03-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105990191A true CN105990191A (en) | 2016-10-05 |
| CN105990191B CN105990191B (en) | 2022-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510666645.3A Active CN105990191B (en) | 2015-03-16 | 2015-10-15 | Substrate transfer stage, scribing device, and method of transferring substrate |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102400552B1 (en) |
| CN (1) | CN105990191B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109824253A (en) * | 2017-11-23 | 2019-05-31 | 塔工程有限公司 | Cutter for substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102461594B1 (en) * | 2017-12-27 | 2022-11-01 | 주식회사 케이씨텍 | Substrate procesing apparatus and transfer belt using the same |
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| JPH1179456A (en) * | 1997-09-10 | 1999-03-23 | Gunze Ltd | Paper feeding endless belt and its manufacture and use |
| JP2002068439A (en) * | 2000-08-28 | 2002-03-08 | Mitsuboshi Belting Ltd | Antistatic carrier belt |
| JP4308071B2 (en) | 2004-04-19 | 2009-08-05 | 株式会社リコー | Image forming apparatus |
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| CN1633466A (en) * | 2002-02-20 | 2005-06-29 | 电气化学工业株式会社 | Static electricity preventing method and method using the method |
| CN103449714A (en) * | 2012-06-01 | 2013-12-18 | 三星钻石工业股份有限公司 | Panel cutting device and method of conveying panel in the same |
| CN102795502A (en) * | 2012-09-06 | 2012-11-28 | 东莞市五株电子科技有限公司 | Method for picking and placing base plate during conveyance of base plate |
| CN103993275A (en) * | 2014-05-09 | 2014-08-20 | 浙江上方电子装备有限公司 | Quasi-static coating system and quasi-static coating method by utilization of quasi-static coating system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109824253A (en) * | 2017-11-23 | 2019-05-31 | 塔工程有限公司 | Cutter for substrate |
| TWI697068B (en) * | 2017-11-23 | 2020-06-21 | 韓商塔工程有限公司 | Substrate cutting apparatus |
| CN109824253B (en) * | 2017-11-23 | 2021-07-06 | 塔工程有限公司 | Substrate cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102400552B1 (en) | 2022-05-23 |
| KR20160111605A (en) | 2016-09-27 |
| CN105990191B (en) | 2022-02-08 |
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