CN105932140A - Near-infrared wavelength LED light source - Google Patents
Near-infrared wavelength LED light source Download PDFInfo
- Publication number
- CN105932140A CN105932140A CN201610258411.XA CN201610258411A CN105932140A CN 105932140 A CN105932140 A CN 105932140A CN 201610258411 A CN201610258411 A CN 201610258411A CN 105932140 A CN105932140 A CN 105932140A
- Authority
- CN
- China
- Prior art keywords
- light
- wavelength
- light source
- near infrared
- conversion component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 claims abstract description 120
- 238000005457 optimization Methods 0.000 claims abstract description 33
- 230000005284 excitation Effects 0.000 claims abstract description 19
- 239000011521 glass Substances 0.000 claims description 135
- 239000011347 resin Substances 0.000 claims description 133
- 229920005989 resin Polymers 0.000 claims description 133
- 239000000843 powder Substances 0.000 claims description 105
- 239000011248 coating agent Substances 0.000 claims description 82
- 238000000576 coating method Methods 0.000 claims description 82
- 239000000463 material Substances 0.000 claims description 46
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 45
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 45
- 230000003287 optical effect Effects 0.000 claims description 34
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 31
- 239000007787 solid Substances 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 23
- 238000005286 illumination Methods 0.000 claims description 22
- 239000000956 alloy Substances 0.000 claims description 18
- 229910045601 alloy Inorganic materials 0.000 claims description 18
- OCKPCBLVNKHBMX-UHFFFAOYSA-N butylbenzene Chemical compound CCCCC1=CC=CC=C1 OCKPCBLVNKHBMX-UHFFFAOYSA-N 0.000 claims description 18
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 18
- 239000012994 photoredox catalyst Substances 0.000 claims description 15
- 239000004417 polycarbonate Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 11
- 230000007704 transition Effects 0.000 claims description 11
- 238000002360 preparation method Methods 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- 229920002635 polyurethane Polymers 0.000 claims description 9
- 239000004814 polyurethane Substances 0.000 claims description 9
- 239000004677 Nylon Substances 0.000 claims description 8
- 229920001778 nylon Polymers 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 239000005416 organic matter Substances 0.000 claims description 7
- 230000002708 enhancing effect Effects 0.000 claims description 6
- 238000004020 luminiscence type Methods 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 229910004647 CaMoO4 Inorganic materials 0.000 claims description 3
- 230000008676 import Effects 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 46
- 238000000034 method Methods 0.000 description 40
- 239000010408 film Substances 0.000 description 29
- 238000005516 engineering process Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 15
- 206010028980 Neoplasm Diseases 0.000 description 12
- 239000002245 particle Substances 0.000 description 12
- 210000001519 tissue Anatomy 0.000 description 12
- 239000013078 crystal Substances 0.000 description 9
- 238000003384 imaging method Methods 0.000 description 9
- 239000002585 base Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000003814 drug Substances 0.000 description 7
- 238000002560 therapeutic procedure Methods 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- -1 oxalate ester peroxide Chemical class 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 210000004027 cell Anatomy 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 230000001235 sensitizing effect Effects 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 241001025261 Neoraja caerulea Species 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000001186 cumulative effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000004549 pulsed laser deposition Methods 0.000 description 4
- 239000011257 shell material Substances 0.000 description 4
- 239000005361 soda-lime glass Substances 0.000 description 4
- 238000004506 ultrasonic cleaning Methods 0.000 description 4
- 229910016495 ErF3 Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000003745 diagnosis Methods 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 230000007170 pathology Effects 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 230000035755 proliferation Effects 0.000 description 3
- 239000005368 silicate glass Substances 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- QGJSAGBHFTXOTM-UHFFFAOYSA-K trifluoroerbium Chemical compound F[Er](F)F QGJSAGBHFTXOTM-UHFFFAOYSA-K 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 2
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 206010006187 Breast cancer Diseases 0.000 description 2
- 208000026310 Breast neoplasm Diseases 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 102000001554 Hemoglobins Human genes 0.000 description 2
- 108010054147 Hemoglobins Proteins 0.000 description 2
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000003796 beauty Effects 0.000 description 2
- 230000037237 body shape Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000006255 coating slurry Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005469 granulation Methods 0.000 description 2
- 230000003179 granulation Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 230000003834 intracellular effect Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 150000003901 oxalic acid esters Chemical class 0.000 description 2
- 238000002428 photodynamic therapy Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000001356 surgical procedure Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- KFKRXESVMDBTNQ-UHFFFAOYSA-N 3-[18-(2-carboxylatoethyl)-8,13-bis(1-hydroxyethyl)-3,7,12,17-tetramethyl-22,23-dihydroporphyrin-21,24-diium-2-yl]propanoate Chemical compound N1C2=C(C)C(C(C)O)=C1C=C(N1)C(C)=C(C(O)C)C1=CC(C(C)=C1CCC(O)=O)=NC1=CC(C(CCC(O)=O)=C1C)=NC1=C2 KFKRXESVMDBTNQ-UHFFFAOYSA-N 0.000 description 1
- 101000642224 Apomastus schlingeri U1-cyrtautoxin-As1d Proteins 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- KSFOVUSSGSKXFI-GAQDCDSVSA-N CC1=C/2NC(\C=C3/N=C(/C=C4\N\C(=C/C5=N/C(=C\2)/C(C=C)=C5C)C(C=C)=C4C)C(C)=C3CCC(O)=O)=C1CCC(O)=O Chemical compound CC1=C/2NC(\C=C3/N=C(/C=C4\N\C(=C/C5=N/C(=C\2)/C(C=C)=C5C)C(C=C)=C4C)C(C)=C3CCC(O)=O)=C1CCC(O)=O KSFOVUSSGSKXFI-GAQDCDSVSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 244000283207 Indigofera tinctoria Species 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 206010058467 Lung neoplasm malignant Diseases 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 206010034960 Photophobia Diseases 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 244000082204 Phyllostachys viridis Species 0.000 description 1
- 208000019155 Radiation injury Diseases 0.000 description 1
- 208000005718 Stomach Neoplasms Diseases 0.000 description 1
- 229910003069 TeO2 Inorganic materials 0.000 description 1
- BHHYHSUAOQUXJK-UHFFFAOYSA-L Zinc fluoride Inorganic materials F[Zn]F BHHYHSUAOQUXJK-UHFFFAOYSA-L 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 210000003484 anatomy Anatomy 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000000118 anti-neoplastic effect Effects 0.000 description 1
- 230000006907 apoptotic process Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 210000000481 breast Anatomy 0.000 description 1
- 208000030270 breast disease Diseases 0.000 description 1
- 201000011510 cancer Diseases 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000030833 cell death Effects 0.000 description 1
- 230000003915 cell function Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000002038 chemiluminescence detection Methods 0.000 description 1
- 238000003759 clinical diagnosis Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 231100000433 cytotoxic Toxicity 0.000 description 1
- 230000001472 cytotoxic effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000013399 early diagnosis Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000000799 fluorescence microscopy Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000005337 ground glass Substances 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 201000007270 liver cancer Diseases 0.000 description 1
- 208000014018 liver neoplasm Diseases 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 201000005202 lung cancer Diseases 0.000 description 1
- 208000020816 lung neoplasm Diseases 0.000 description 1
- 210000001165 lymph node Anatomy 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 210000005075 mammary gland Anatomy 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000002539 nanocarrier Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 210000005036 nerve Anatomy 0.000 description 1
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical class N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 230000000886 photobiology Effects 0.000 description 1
- 238000007626 photothermal therapy Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002980 postoperative effect Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 229950003776 protoporphyrin Drugs 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 125000002943 quinolinyl group Chemical class N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 239000001054 red pigment Substances 0.000 description 1
- 238000002271 resection Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 210000005005 sentinel lymph node Anatomy 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 201000000498 stomach carcinoma Diseases 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 230000001225 therapeutic effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 230000000699 topical effect Effects 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 210000004881 tumor cell Anatomy 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000002792 vascular Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0085—Modulating the output, i.e. the laser beam is modulated outside the laser cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0085—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for modulating the output, i.e. the laser beam is modulated outside the laser cavity
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Abstract
The invention relates to a near-infrared wavelength LED light source comprising an excitation light source, a wavelength conversion component and a wavelength optimization component. The excitation light source is a visible light source or a near-infrared light source. The visible light source or the near-infrared light source is a single visible light or near-infrared light LED chip or multiple or multi-group visible light or near-infrared light LED chips or a visible light or near-infrared light LED integrated light source, i.e. a COB light source, or a visible light or near-infrared light laser device or a group of visible light or near-infrared light laser array so as to provide the visible light or near-infrared light luminescent source.
Description
Technical field
The present invention relates to a kind of ruddiness and infrared wavelength LED light source, manufacture method and application.
Background technology
The light source (such as ruddiness and the near infrared light of 650nm-900nm) launching certain wavelength light is used in medical industry
Carry out irradiation tumour cell with the combination of certain sensitising agent and can reach the purpose of tumor resection postoperative auxiliary treatment.Prior art is
Utilize ruddiness or near-infrared LED (or LD) as light source.This technology has its inherent defect, is first ruddiness or near-infrared
The power of LED (or LD) is less;Although ruddiness or near-infrared LED (or LD) array can provide high-power, but light
Wire harness spot is the least, and uneven, needs either scans to irradiate during use, inefficient, and reliability is low;Additionally,
Ruddiness and near infrared region cannot obtain ruddiness or the near-infrared LED (or LD) of wavelength continuous distributed.At present at 1.4-
1.6 μm near infrared regions still do not have near-infrared LED (or LD) product.Chinese invention patent CN1618481A discloses one
Planting utilizes PPLN optical superlattice technology that the near infrared light frequency multiplication of 1319nm is become the technology of 660nm ruddiness;Chinese invention
Patent CN1845405A discloses a kind of PPLN of utilization optical superlattice technology and will be converted into 660nm under the green glow of 532nm
The technology of ruddiness;Chinese invention patent CN102244354B also disclosed one and utilizes OPO technology (mid infrared laser)
The technology of the near infrared light of 1.5 μm will be converted under the near infrared light of 1064nm.Above-mentioned smooth switch technology is all to use to swash
Light device launches the incident ray of certain wavelength and certain optical crystal or optical superlattice by strict optical parameter matching technique
Obtain the light of certain specific wavelength.This smooth switch technology also has its intrinsic shortcoming, is first expensive;Its
Secondary, efficiency and reliability are the highest.Because Optical doubling frequency crystal is after the parametric process of the nonlinear crystals such as frequency multiplication and frequency,
Optical power loss is relatively big, therefore to obtain the ruddiness of enough luminous powers, needs to use large-scale laser.Additionally, frequency multiplication mistake
In journey, laser also has damage to frequency-doubling crystal, and the light conversion efficiency of frequency-doubling crystal can decline the most after long-term use.Secondly,
The wavelength adaptability of Optical doubling frequency crystal is poor.Optical frequency-doubling characteristic is by the specific nonlinear optics of nonlinear optical crystal
Character determines, the wavelength kind utilizing the obtainable light source of nonlinear optics frequency-doubling crystal is limited.
Photodynamic treatment device it is typically: sensitising agent is inputted human body, after a certain time, with certain wave in medical treatment
The light of long (infrared or near-infrared) irradiates diseased region, is reacted, at molecular oxygen by a series of photochemistry and photobiology
Participation under, produce singlet oxygen and/or free radical, the various large biological molecules in Oxidative demage tissue and cell, make exception
There is irreversible damage in the cell of active proliferation, finally makes cell death, reach therapeutic purposes.
Optical dynamic therapy topical application sensitising agent, owing to absorbing and the difference of accretion rate, sensitising agent meeting after a certain time
Gathering higher concentration in target tissue, through OPK light source, (parametric process of nonlinear crystal needs accurate temperature
Degree control system) irradiate after, rapid exciting light dynamic response, target tissue produces substantial amounts of singlet oxygen and discharges simultaneously
Fluorescence, the cytotoxic effect of singlet oxygen will cause target tissue meronecrosis or apoptosis, or affect cell function, make pathology
Tissue loss, recovers normal form and function;Normal adjacent tissue is not affected.Optical dynamic therapy is generally acknowledged
Effect is better than local carbon dioxide laser or cold therapy.
Because near-infrared is without ionization radiation injury, launching and reception facilitates implementation spectrum or monochrome (wavelength) change, it is fixed to obtain
Measure real time information and carry out experimental molecule mark (in molecular spectrum scope).Including light source, reflecting material, fibre-optic light guide,
The new components and parts such as grating, CCD camera, the ratio of performance to price is high, and is also continuing raising.Digitlization CCD has been enter into practicality,
Easy to connect with computer, as by with USB (USB) mouth, be easy to hot plug.Optical imagery is increasingly by weight
Depending on, in optical image technology, transmission imaging, infrared emission imaging are mainly continuous light imaging.
And for example as a example by HRJ series of IR breast examining device, need infrared transmission imaging device light source, light source near-infrared light source or
Claim light source probe, inside have lamp (illuminator), air cooling system, optical fiber etc., send near infrared light for transillumination mammary gland.Light
The technical performance of source probe directly affects transmission map image quality.Prior art uses infrared enhancing coating technique, has widened red
The reflected waveband of outside line, utilizes convergent type reflector to improve near infrared band emanated energy.Existing infrared illuminants needs
Improve.
Because near infrared light is best to the penetration power of human body, imaging relies primarily on this part.Owing to people can not see near infrared light,
Therefore use highly sensitive CCD imaging apparatus light activated to near-infrared to receive.Normal-fat tissue is high printing opacity, fiber
Tissue, gland tissue and skin are low light transmissions, and blood printing opacity is worst, and hemoglobin has specificabsorption near infrared light, can produce
Raw shading shade.This is the general principle of infrared transmission diagnosis of breast diseases.
Prior art discloses a kind of near-infrared fluorescence imaging system for clinical diagnosis.It is by LED source,
Light is collected optical system, wavelengths filters, video camera and systems soft ware work station and is linked in sequence, and in computer terminal imaging.
Irradiate confined surgical areas by visible ray and near-infrared excitation light source (400 nanometers are to 700 nanometers), then make visible ray (i.e.
Color) separate with near-infrared fluorescent, surgical anatomy can be obtained with near-infrared fluorescent in reflector space (i.e. vascular position simultaneously
Put, nerve location, knub position etc.) location image.It is thin that surgeon can carry out pathology accurately by location image
Born of the same parents position, and then implement surgery excision completely.
Additionally, photo-thermal therapy method is the material utilizing and having high light thermal conversion efficiency, it is injected into inside of human body, profit
It is gathered near tumor tissues by targeting identification technology, and will under the irradiation of external light source (usually near infrared light)
Luminous energy is converted into heat energy to kill a kind of methods for the treatment of of cancer cell.
Tumour is accurately positioned the challenge always perplexing doctor.When tumor tissues is excised by doctor, cut meeting less
Cause recurrence, cut more and patient can be damaged again.Optical molecular image hand disclosed in Institute of Automation, CAS Tian Jie team
Art navigation system successfully solves this difficult problem, obtains important breakthrough in the clinical practice of optical molecular image technology.
Tian Jie team develops based on biological tissue's specific high-order approximation Mathematical Modeling and quick dynamic imaging algorithm, by
(CG can launch the near infrared light of 840 nanometers under the exciting of near-infrared light source to the ICG of Bureau of Drugs Supervision of state certification
Line), in patient body's inner position, accurately display tumor boundaries information.Fluoroscopic image and colour can be provided in terms of imaging in real time
Image, for patient with breast cancer's early detection pathology and carry out precise ablation and provide a kind of new technological means.Face actual
In bed process of the test, after injection ICG about 3 minutes just it can be seen that the position of sentinel lymph node.Doctor is according to light credit
The guiding of sub-image operation guiding system is accurately positioned, and accurately excises lymph node tissue under image guides.Also can basis
The feedback of fluorescence determines whether that fluorescence is remaining, if reach the purpose accurately excised.Compared with conventional art, this skill
The application of art, shortens operating time, the method improving operation, enable the clinician in surgical procedure to find exactly,
Confirm disease, drastically reduce the area human error.This navigation system can not only be applied in the diagnosis and treatment of breast cancer,
Can be applied in the diagnosis and treatment of the kinds cancers such as liver cancer, lung cancer, cancer of the stomach, it is achieved the molecular image skill of different tumours simultaneously
Art application breakthrough.
CN201210382969.0 proposes the active treatment photo-dynamical medicine nanometer carrier of a kind of tumor signal response, to internal
Tumor signal hydrogen peroxide produces response, starts the carrier of optical dynamic therapy medicine, and medicament nano diameter of carrier is at 50-300nm
In the range of;Described medicament nano carrier is to include that amphipathic high-molecular block copolymer and oxalate ester peroxide are prepared from,
Described is based on hydrogen peroxide and the chemical reaction of oxalic acid esters to the response of in-vivo tumour signal, excites feature dyestuff
Produce chemiluminescent optical dynamic therapy process;The medicine of described optical dynamic therapy is to excite lower generation toxic activity at light
The antineoplastic of free radical, including protoporphyrin, haematoporphyrin, bamboo red pigment class or phthalein cyanogen class.Present invention incorporates nanometer skill
Art, chemiluminescence detection and PDT, prepare and be loaded with oxalic acid ester polymer and photo-dynamical medicine simultaneously
Nanoparticle, it is adaptable to the early diagnosis and therapy of tumour.Sensitising agent ALA is a kind of internal hemoglobin building-up process
Precursor.Under normal circumstances, ALA is the least in intracellular amount, and itself does not produce light sensitivity.Exogenous ALA enters internal
After, can be absorbed by the cell selective of active proliferation and accumulation, and be the porphins such as protoporphysin Ⅸ (Pp Ⅸ) at cellular transformation
Quinoline class material.Intracellular PP Ⅸ is the strongest a kind of photoactive substance, and light i.e. occurs after the red light irradiation of specific wavelength
Dynamic response, produces active oxygen such as singlet oxygen etc. and kills the cell of active proliferation.In a word in medical consultations field 840
The near infrared light of nanometer, and the IR of 1500 ran, great meaning in application.
Summary of the invention
The object of the invention, for above-mentioned traditional medical consultations light source, the scarcity of the near-infrared light source of field of scientific study,
The present invention provides a kind of near-infrared wavelength (including infrared) LED light source, manufacture method and application.Use visible ray or the reddest
Outer smooth LED (or LD) light source from comprise the fluorescent glass coating wavelength convert group with different stimulated luminescence characteristic fluorescence body
Part or fluorescence resin coating wavelength conversion component or fluorescence resin wavelength conversion component or fluorescent powder lens wavelength convert
Assembly or phosphor film wavelength conversion component and the combination of Wavelength optimization assembly obtain and can launch near infrared wavelength region
The light source of interior any specific wavelength light, has permanent service life and stability, and has suitable power (especially
Application fluorescent glass coating wavelength conversion component), especially having a medical check-up, medical treatment, beauty treatment has particularly application.
The technical scheme is that, a kind of near-infrared wavelength LED light source, it is characterised in that comprise excitation source, ripple
Long transition components and Wavelength optimization assembly;Excitation source is visible ray or near infrared light light source;Described visible ray or near-infrared
Just single LEDs (or LD) visible ray or near infrared light chip, or many or organize more LED (or LD) visible ray or
Near infrared light chip, or LED visible light or near infrared light integrated optical source i.e. COB light source, or a visible ray or near
Infrared light laser instrument, or one group of visible ray or near infrared light laser array, it is provided that visible ray or near infrared light are luminous
Light source;
Wavelength conversion component is fluorescent material and transparent material mixing preparation, including fluorescent glass coating wavelength conversion component, glimmering
Photopolymer resin coating wavelength conversion component, fluorescence resin wavelength conversion component, fluorescent powder lens wavelength conversion component;Wavelength turns
Change assembly and can also is that a kind of phosphor film;The basic configuration of transition components is light-transmitting plate or rased panel;
The equally distributed fluorophor C, fluorophor C that wavelength conversion component contains uses to be stimulated and produces the glimmering of near-infrared wavelength
Light powder, fluorophor C sends the light of specific centre wavelength under visible ray or near infrared light excite;Fluorophor C is excited
It is 700nm-2500nm that emission wavelength range covers near infrared wave-length coverage, i.e. wave-length coverage;At visible ray or near-infrared
Under the exciting of radiant, the centre wavelength of the light that fluorescent material is sent should be at the emission wavelength center of final required light source
Near or.
Fluorescent powder lens wavelength conversion component comprises a hemispheroidal curved-surface structure of kind;The hemispheroidal curved-surface structure of class is one
The individual housing with large radius of curvature, is a kind of fluorescent glass or long-range lens arrangement prepared by fluorescence resin, comprises one
Plant the mixture of clear glass or resin matrix H and fluorophor C powder;The material of transparent base H be glass, PMMA,
PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, poly-
Ammoniacum optical resin, nylon or PMMA or the MS resin of PC enhancing or silica gel;Fluorophor C is at visible ray or near-infrared
Light or excited down the light sending specific centre wavelength by wavelength less than any light source of its emission wavelength;Fluorophor C's
Stimulated luminescence wavelength is near infrared range, i.e. wave-length coverage is 700nm-2500nm;At visible ray or near infrared light light source
Exciting down, the centre wavelength of the light that LED fluorescent powder is sent should be near the emission wavelength of final required light source, preferably
Consistent with the emission wavelength of final required light source;
Fluorescent powder lens wavelength conversion component comprises a kind hemispheroidal compound curved surface structure;The hemispheroidal compound curved surface of class
Structure is a housing with large radius of curvature and the complex of a solid curved body with less radius of curvature;
The cross section of compound curved surface structure is circular or oval, the housing of large radius of curvature and the reality with less radius of curvature
The circular cross-section of heart curved body has a center of circle;Housing has an outer surface and an inner surface;The outer surface of housing
For sphere, parabola or other smooth convex surface;The thickness of housing is uniform, it is also possible to according to the application ring that it is final
Border regulates;The thickness range of housing is 50 microns~3 millimeters;The inner surface of housing and the surface physics of solid curved body
Shape is completely the same, for sphere or parabola or other smooth convex surface;The surface of solid curved body and greater curvature half
The inner surface of the housing in footpath is fitted completely;
The solid curved body of above-mentioned less radius of curvature is a kind of transparent with machine thing or glass J, transparent with machine thing material is
PMMA, PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS,
NAS, polyurethane optical resin, nylon or PMMA or the MS resin of PC enhancing or silica gel, glass;With specific reference to making
Select with environment temperature environment;The organic matter matrix H of housing is identical or different with material J of solid curved body;Housing
Material J of organic matter matrix H and solid curved body there is same or like refractive index, to avoid the propagation of light to damage
Lose;
There is physical space between visible ray or near infrared light light source and wavelength conversion component, use remote excitation to arrange;Visible
Visible ray or near infrared light that light or near infrared light light source are sent shine directly in wavelength conversion component;The two of reflection shield
End connects visible ray or near infrared light light source and wavelength conversion component respectively, and reflector internal reflection surface is provided with reflector layer.
Described reflection shield is cylindrical, taper, semi-cylinder or half-cone, it is seen that light or near infrared light light source and wavelength convert group
Part is respectively as two basal surface positions of described reflection shield;Wavelength conversion component has installation at the basal surface position of reflection shield and connects
Mouthful.
One or one group of lens, the effect of lens are set in reflection shield between LED excitation source and wavelength conversion component
It is the beam spot expanding the sent laser beam of the excitation source region with complete illumination wavelength transition components;Or constraint LED light
Spot.
Visible ray or near infrared light light source and Wavelength converter are arranged in the plane around a light guide plate, it is seen that light
Or the light that near infrared light light source sends imports from side through light guide plate, light guide plate plane superposition wavelength conversion component.
After on visible ray that visible ray or near infrared light light source send or near infrared light light illumination wavelength transition components, wavelength
Fluorophor stimulated emission in transition components goes out to have the light of specific wavelength, and visible ray or near infrared light light source send
Some residual light in visible ray or near infrared light light is obtained with after Wavelength optimization assembly i.e. colour filter to be had
The high-quality monochrome light of specific wavelength;
Visible ray or near infrared light light source and Wavelength converter can also be arranged in the plane around a light guide plate,
The light that visible ray or near infrared light light source send imports from side through light guide plate, light guide plate plane superposition wavelength conversion component.
After on visible ray that visible ray or near infrared light light source send or near infrared light light illumination wavelength transition components, wavelength
Fluorophor stimulated emission in transition components goes out to have the light of specific wavelength, and visible ray or near infrared light light source send
Some residual light in visible ray or near infrared light light is obtained with after Wavelength optimization assembly i.e. colour filter to be had
The high-quality monochrome light of specific wavelength;
Described excitation source is not limited to visible ray or near infrared light light source, it is also possible to near ultraviolet light source, correspond
Ground, fluorophor C must be can to launch near infrared light under near ultraviolet light irradiates;
Use near-infrared fluorescent powder (Y1-xLax)2O3:Er3+;As the main wavelength conversion component to wavelength convert at 980nm LD
1.5 μm near infrared lights are sent under near infrared light;
Use near-infrared fluorescent powder Ba9.99Bi0.01(PO4)6Cl2;As the main wavelength conversion component to wavelength convert at 690nm
1.25 μm near infrared lights can be sent under red light irradiation;
Use near-infrared fluorescent powder 26.6B2O3-52.33PbO-16GeO2-4Bi2O3-1Sm2O3;As main to wavelength convert
Wavelength conversion component sends 978nm and 1.18 μm near infrared lights under 488nm blue light illumination;
Use near-infrared fluorescent powder Cr3+:GdAl3(BO3)4;As the main wavelength conversion component to wavelength convert at 420nm
720nm near infrared light can be sent under blue light illumination;
Use near-infrared fluorescent powder CaMoO4:(Tb3+,Yb3+);As the main wavelength conversion component to wavelength convert at 306nm
Ultraviolet light sends 1.05 μm near infrared lights under irradiating.
In sum, beneficial effect of the present invention, use visible ray or near infrared light light source (or near ultraviolet light source) and comprise
There is fluorescent glass coating wavelength conversion component or the fluorescence resin coating wavelength convert of different stimulated luminescence characteristic fluorescence body
Assembly or fluorescence resin wavelength conversion component or fluorescent powder lens wavelength conversion component or phosphor film wavelength convert
Assembly and the combination of Wavelength optimization assembly obtain the light source of any specific wavelength light that can launch near infrared wavelength region,
The efficiency of light source can be increased substantially, reduce manufacturing cost, improve the service life of light source, improve the security of light source,
And the light selecting specific wavelength is become easier to, more convenient operation.
The present invention is to possess permanent service life and stability and have (the especially fluorescent glass coating) of suitable power
Wavelength conversion devices, the Wavelength conversion devices being prepared as is conveniently replaceable, and adds the application of upper filter, especially by reflective
Cover, poly-mirror and multi-chip group can provide intensity and the most satisfactory near-infrared light source of light-emitting area.Use non-contacting
Reflecting drum (cone) is more convenient for side entering type using unit change and mate, having a medical check-up, medical treatment, beauty treatment has special
Application.
Accompanying drawing explanation
Fig. 1 is the structural representation of fluorescent glass coating wavelength conversion component.
Fig. 2 is the structural representation of fluorescence resin coating wavelength conversion component.
Fig. 3 is the structural representation of phosphor film wavelength conversion component.
Fig. 4 is the structural representation of fluorescence resin wavelength conversion component.
Fig. 5 is the structural representation of fluorescent powder lens wavelength conversion component.
Fig. 6 by blue light LD, reflection shield, fluorescent glass coating wavelength conversion component and Wavelength optimization assembly form straight under
Formula light-source structure schematic diagram.
Fig. 7 is blue light LD, reflection shield, fluorescence resin coating transition components and the directly-down light source of Wavelength optimization assembly composition
Structural representation.
Fig. 8 by red laser, expand spot lens, fluorescent glass wavelength conversion component and Wavelength optimization assembly and form
Directly-down light source structural representation.
Fig. 9 is made up of COB blue light source, reflection shield, fluorescent glass coating wavelength conversion component and Wavelength optimization assembly
Directly-down light source structural representation.
The directly-down light source structural representation that Figure 10 is made up of COB blue light source, fluorescent powder lens and Wavelength optimization assembly.
Figure 11 is made up of blue chip, leaded light component, fluorescent glass coating wavelength conversion component and Wavelength optimization assembly
Side entering type light-source structure schematic diagram.
Detailed description of the invention
In order to more clearly state the present invention, below in conjunction with the accompanying drawings the present invention is further described through.
Described fluorescent glass coating wavelength conversion component is glass substrate and the sub-assembly of fluorescent glass coating, its structural representation
Figure is as shown in Figure 1;The manufacture method of described fluorescent glass coating wavelength conversion component comprises the following steps:
(1) by the powder of glass B that mass ratio is 100:1~100:150 and the powder of fluorophor C, organic solvent and viscous
Knot agent, is mixed into uniform pastel;
(2) pastel is prepared as uniform flat board or lens forming fluorescent glass coating;Or pastel is coated uniformly on glass
On glass substrate A, the glass substrate A scribbling pastel is dried, makes organic solvent volatilization completely;
(3) dried fluorescent glass coating is directly sintered with reference to following technique;Or the glass substrate A scribbling pastel burns
Knot is sintered: obtain the glass coating containing fluorophor on glass substrate A surface, and the process of described sintering is: heat up
To temperature D1, after making binding agent decompose volatilization completely, then it is warming up to temperature D2, makes the powder of glass B soften, combine shape
Becoming continuous vitreum, obtain the glass coating containing fluorophor C on glass substrate A surface, temperature D1 is less than glass B's
Glass transition temperature, the temperature D2 glass transition temperature less than glass A more than 10 DEG C.Temperature D1 is not less than viscous
The decomposition volatilization temperature of knot agent, temperature D2 is not less than the softening temperature of glass B.
Glass substrate A can be to have alkali glass, alkali-free glass or quartz glass etc., it is also possible to is to utilize to have alkali glass, nothing
The ground glass that alkali glass or quartz glass are prepared as.
The thermal coefficient of expansion of coupling should be had, after non-sintered as general knowledge known in this field, glass substrate A and glass B
There is cracking phenomena.
The preferred SiO of glass B2-Nb2O5System, B2O3-F system, P2O5-ZnO system, P2O5-F system, SiO2-B2O3-La2O3System or SiO2-B2O3
The low-melting glasses such as system.
Described fluorescence resin coating wavelength conversion component is transparent resin substrate and the sub-assembly of fluorescence resin coating, its structure
Schematic diagram is as shown in Figure 2;The manufacture method of described fluorescence resin coating comprises the following steps:
(1) toner E, fluorophor C powder, binding agent and solvent are blended into uniform slurry, wherein toner
E, the mass ratio of fluorophor C powder are 100:1-20:150, and solvent is 100:1-100 with the mass ratio of binding agent:
100, fluorophor C powder adds the volume of the cumulative volume of resin E mixture of powders and the cumulative volume of solvent adding additives mixture
Than be 1:100-300:100, and the particle diameter of the powder of the powder E and fluorophor C of resin 1 micron to 60 micron it
Between;
(2) above-mentioned slurry is coated uniformly on resin substrate F, the resin substrate F of coating slurry is dried, baking temperature
Being 40 DEG C-130 DEG C, drying time is 5 minutes-10 hours;
(3) by the dried resin substrate F baking scribbling slurry, baking temperature is 100 DEG C-260 DEG C, and heating rate is
1-10 DEG C/min, baking time is 5 minutes-20 hours, and temperature fall time is 20 minutes-10 hours, at resin substrate F
Surface obtains the mixed coating containing fluorophor C Yu resin E.
Wherein in step (2), dry run can be carried out in atmosphere, also can carry out in a vacuum.
Wherein in step (3), baking process can be carried out in atmosphere, and also can carry out roasting mode in a vacuum is to utilize infrared ray
Direct baking or utilize electric-heating-wire-heating to toast;
Wherein step (2) and (3) can be merged into a step heating step and carry out.
In order to prevent resinous coat aging, it is also possible to add few in the fluorophor C powder mixed-powder with toner E
Amount ultra-violet absorber (such as UV-327, UV326, UV328, UV531, UV-9 etc.) or antioxidant are (such as antioxidant
1076, antioxidant 2246, antioxidant 245, antioxidant 1010 and auxiliary antioxidant 168 etc.);Toner and ultraviolet
The mass ratio of light absorbers and toner and antioxidant is 100:0.01~100:0.7.
The material of resin substrate F be PMMA, PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene,
PMMA or the MS resin that benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC strengthen;Resin
The material of powder be PMMA, PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin,
PMMA or the MS resin that CR-39, MS, NAS, polyurethane optical resin, nylon or PC strengthen;Resin substrate F and tree
Fat E powder can be material of the same race, it is also possible to be different material.
Described fluorescence resin wavelength conversion component is the compound of a kind of resin G fluorophor C, its structural representation such as Fig. 4
Shown in;Its preparation method is as follows:
The powder of transparent or semitransparent resin G and the fluorophor C that mass ratio is 100:1~100:150 is sufficiently mixed uniformly
Or granulation;
Mixture of powders or the granulation of transparent or semitransparent resin G and fluorophor C are utilized heating and mould pressing, cooled
Or after annealing, it is achieved with resin G sheet material or the material of other shapes comprising fluorophor;
Transparent or semitransparent resin G in step (1) can be acrylic (PMMA), PMMA alloy resin, gather
Carbonic ester, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, Buddhist nun
PMMA or the MS resin etc. that dragon or PC strengthen;
The particle diameter of the fluorophor C powder in step (1) is between 1 micron to 60 micron;
In step (2), the temperature of mold pressing is between 90 DEG C to 270 DEG C;But less than transparent or semitransparent resin G
Decomposition temperature;
Resin in step (1) can use powder, and particle diameter is between 1 micron to 60 micron;
In step (2), heated mould end finger thermoplastic or thermosetting technology, also include the methods such as injection or extrusion molding, however not excluded that
Other moulding process, but need to be in view of fluorophor powder poor fluidity during hot-forming;
In step (2), not having mobility or poor fluidity due to fluorophor powder, other molding mode may cause
Phosphor particle is skewness in resin;
In view of described situation, after step (2) completes, can use mould that the fluorescence resin sheet material obtained is carried out two
Secondary shaping, it is thus achieved that the device of required shape.
In order to strengthen the ageing resistace of transparent or semitransparent resin G in step (1), appropriate ultraviolet can be added
Light absorber (such as UV-327, UV326, UV328, UV531, UV-9 etc.) or antioxidant (as antioxidant 1076,
Antioxidant 2246, antioxidant 245, antioxidant 1010 and auxiliary antioxidant 168 etc.);Resin and ultra-violet absorber and
Resin is 100:0.01~100:0.7 with the mass ratio of antioxidant.
Described fluorescent powder lens wavelength conversion component comprises a hemispheroidal curved-surface structure of kind, its structural representation such as Fig. 5
Shown in;The hemispheroidal curved-surface structure of class is a housing with large radius of curvature, is a kind of fluorescent glass or fluorescence tree
Long-range lens arrangement prepared by fat, comprises the mixture of a kind of clear glass or resin matrix H and fluorophor C powder;Thoroughly
The material of bright matrix H is PMMA, PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulfone tree
Fat, CR-39, MS, NAS, polyurethane optical resin, nylon or PMMA or the MS resin of PC enhancing or silica gel;
Fluorescent powder lens wavelength conversion component comprises a kind hemispheroidal compound curved surface structure;The hemispheroidal compound curved surface of class
Structure is a housing with large radius of curvature and the complex of a solid curved body with less radius of curvature;
The cross section of compound curved surface structure is circular or oval, the housing of large radius of curvature and the reality with less radius of curvature
The circular cross-section of heart curved body has a center of circle;Housing has an outer surface and an inner surface;The outer surface of housing
For sphere, parabola or other smooth convex surface;The thickness of housing is uniform, it is also possible to according to the application ring that it is final
Border regulates;The thickness range of housing is 50 microns~3 millimeters;The inner surface of housing and the surface physics of solid curved body
Shape is completely the same, for sphere or parabola or other smooth convex surface;The surface of solid curved body and greater curvature half
The inner surface of the housing in footpath is fitted completely;
The solid curved body of less radius of curvature is a kind of transparent with machine thing or glass J, transparent with machine thing material be PMMA,
PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, poly-
Ammoniacum optical resin, nylon or PMMA or the MS resin of PC enhancing or silica gel, glass;With specific reference to using environment temperature
Degree environment selects;The organic matter matrix H of housing is identical or different with material J of solid curved body;The organic matter of housing
Matrix H has same or like refractive index, to avoid the propagation loss of light with material J of solid curved body;
Described phosphor film wavelength conversion component be a kind of grow on the transparent substrate there is certain thickness fluorescent membrane,
Its structural representation is as shown in Figure 3;Described fluorescent membrane can be the fluorescent membrane of inorganic, it is also possible to be organic material
The fluorescent membrane of matter;
Described transparency carrier refer to can through near ultraviolet and the transparent glass substrate of excited by visible light light source emitted light,
Transparent resin substrate or other any transparency carriers;Or the sent near infrared light in near-infrared excitation light source can be passed through
Other any substrates.
The thickness of described fluorescent membrane is between 50 microns-1000 microns;
The preparation method of described inorganic phosphor film includes sol-gel process (sol-gel), rf-magnetron sputtering method, electronics
Beam evaporation method, chemical vapor deposition method (CVD), organic chemistry vapour phase sedimentation (MOCVD), pulsed laser deposition (PLD)
The physics such as method and chemical method.
For the near-infrared fluorescent body of glass material, directly phosphor glass direct pouring can be become specific shape, so
By operations such as cutting, polishings, it is prepared as certain thickness phosphor glass;The thickness range of glass is 50 micron-5
Millimeter;Glue can be used on a transparent substrate bonding afterwards or be heat-treated and soften the technique such as bonding to be prepared as fluorophor thick
Film.
The preparation method of the fluorescent membrane of described organic material includes that method etc. is put in spin-coating method (spin-coating) and leaching.
Term " black light " refers to centre wavelength light between 315 nanometers and 400 nanometers;Term " blue light "
Refer to centre wavelength light between 400 nanometers and 500 nanometers;Term " green light " is particularly to centre wavelength position
Light between 500 nanometers to 560 nanometers;Term " sodium yellow " is located approximately at 560 nanometers particularly to centre wavelength and arrives
Light between 590 nanometers;Term " red light " is located approximately between 590 nanometers to 700 nanometers particularly to centre wavelength
Light;Term " near infrared light " refers to centre wavelength light between 700 nanometers and 2500 nanometers;Term " near-infrared
Emitting phosphor " refer to, under being excited less than the light of self emission wavelength by wavelength, centre wavelength can be sent and be located approximately at
The luminescent material of the Stimulated Light between 700 nanometers to 2500 nanometers;
At some under LED light source monochromaticjty (half-peak breadth) less demanding situation, described a kind of Wavelength tunable LED light
Source, can only comprise excitation source and wavelength conversion component;The wavelength characteristic of described LED light source and its wavelength conversion component
Used in the emission wavelength of fluorophor C consistent.
Embodiment 1.
Fig. 1 is the structural representation of fluorescent glass coating wavelength conversion component, and 1 is glass substrate, and 2 is coated glass, 3
For fluorophor C.
Glass substrate 1 is common soda lime glass, and thickness is 1 millimeter, is about 1.52 in 460 nanometer wave strong point refractive indexes, glass
Glass transition temperature 570 DEG C, softening temperature 620 DEG C;Coated glass 2 is a kind of low melting point phosphate glass, and component comprises
P2O5: 41%, ZnO:34%, B2O3: 19%, (Li2O 3%+Na2O1.5%+K2O1.5%): 6%.In 460 nanometer wave strong points
Refractive index is about 1.49, and glass transition temperature 480 DEG C, softening temperature is 526 DEG C.
Fluorophor 3 is near-infrared fluorescent powder (Y1-xLax)2O3:Er3+(Journal of Rare Earths, 125 (2016) 34),
Its particle diameter distribution d50It it is 10 microns.
Coated glass 2 Jet Mill is pulverized, and its particle diameter is distributed as d50=15 microns.
3.5 grams of 20 grams of glass 2 powder and near-infrared fluorescent powder adds organic liquid 4g, and (terpinol is mixed with butyral resin
Compound, mass ratio is 6:1) carry out mixing acquisition pastel.
Blade type coating machine is used to be coated uniformly on by above-mentioned pastel on the glass substrate 1 cleaned, coating pastel
Thickness is controlled by the distance of regulation blade to glass substrate, and the distance of blade to glass substrate is 0.2 millimeter.
Composition phase counterdiffusion in sintering process below of composition with coated glass 2 in order to prevent glass substrate 1, can
First to coat one layer of SiO before coating on glass substrate 12Film.Coating SiO2Film can use chemical method, such as colloidal sol
-gel method, or use physical method, such as sputtering method etc..
The glass plate being coated with pastel is dried 1 hour at 160 DEG C, is the most first cooled to room temperature.Heated up with 1 hour
It is incubated 1 hour to 430 DEG C, is then incubated 1 hour with within 21 minutes, being rapidly heated to 540 DEG C, then dropped with 2 hours
Warm to room temperature.On the substrate of glass A, so just obtain the glass coating comprising fluorophor.Comprise in this embodiment
The glass coating of fluorophor is the most transparent, smooth surface, and edge is without rake angle.This fluorescent glass coating wavelength convert group
Part can send 1.5 μm near infrared lights under 980nm LD near infrared light.
Embodiment 2.
The present embodiment is with the difference of embodiment 1, by 20 grams of glass 2 powder and near-infrared fluorescent powder
Ba9.99Bi0.01(PO4)6Cl23.5 grams add organic liquid 4.5g (mixture of terpinol and butyral resin, mass ratio is 6:
1) mixing acquisition pastel is carried out.
Sintering process in the present embodiment is: be dried 1 hour at 170 DEG C by the glass plate being coated with pastel, then first
It is cooled to room temperature.It was warmed up to 450 DEG C with 1 hour and is incubated 1 hour, be then rapidly heated to 550 DEG C with 21 minutes
It is incubated 1 hour, then is cooled to room temperature with 2 hours.On the substrate of glass 1, so just obtain the glass comprising fluorophor
Glass coating.
The glass coating comprising fluorophor in this embodiment is the most transparent, smooth surface, and edge is without rake angle.
This fluorescent glass coating wavelength conversion component can send 1.25 μm near infrared lights under 690nm red light irradiation.
Embodiment 3.
The present embodiment is with the difference of embodiment 1, by 20 grams of glass 2 powder and near-infrared fluorescent powder
26.6B2O3-52.33PbO-16GeO2-4Bi2O3-1Sm2O33.5 grams add organic liquid 4.5g (terpinol and butyral resin
Mixture, mass ratio is 6:1) carry out mixing acquisition pastel.
Sintering process in the present embodiment is: be dried 1 hour at 170 DEG C by the glass plate being coated with pastel, then first
It is cooled to room temperature.It was warmed up to 450 DEG C with 1 hour and is incubated 1 hour, be then rapidly heated to 550 DEG C with 21 minutes
It is incubated 1 hour, then is cooled to room temperature with 2 hours.On the substrate of glass 1, so just obtain the glass comprising fluorophor
Glass coating.
The glass coating comprising fluorophor in this embodiment is the most transparent, smooth surface, and edge is without rake angle.
This fluorescent glass coating wavelength conversion component can send 978nm under 488nm blue light illumination and 1.18 μm are the reddest
UV light.
Embodiment 4.
The present embodiment is with the difference of embodiment 1, by 20 grams of glass 2 powder and near-infrared fluorescent powder Cr3+:GdAl3(BO3)4
3.5 grams add organic liquid 4.5g (terpinol and the mixture of butyral resin, mass ratio is 6:1) and carry out mixing acquisition
Pastel.
Sintering process in the present embodiment is: be dried 1 hour at 170 DEG C by the glass plate being coated with pastel, then first
It is cooled to room temperature.It was warmed up to 450 DEG C with 1 hour and is incubated 1 hour, be then rapidly heated to 550 DEG C with 21 minutes
It is incubated 1 hour, then is cooled to room temperature with 2 hours.On the substrate of glass 1, so just obtain the glass comprising fluorophor
Glass coating.
The glass coating comprising fluorophor in this embodiment is the most transparent, smooth surface, and edge is without rake angle.
This fluorescent glass coating wavelength conversion component can send 720nm near infrared light under 420nm blue light illumination.
Embodiment 5.
The present embodiment is with the difference of embodiment 1, by 20 grams of glass 2 powder and near-infrared fluorescent powder
CaMoO4:(Tb3+,Yb3+) 3.5 grams add organic liquid 4.5g (mixture of terpinol and butyral resin, mass ratio is 6:
1) mixing acquisition pastel is carried out.
Sintering process in the present embodiment is: be dried 1 hour at 170 DEG C by the glass plate being coated with pastel, then first
It is cooled to room temperature.It was warmed up to 450 DEG C with 1 hour and is incubated 1 hour, be then rapidly heated to 550 DEG C with 21 minutes
It is incubated 1 hour, then is cooled to room temperature with 2 hours.On the substrate of glass 1, so just obtain the glass comprising fluorophor
Glass coating.
The glass coating comprising fluorophor in this embodiment is the most transparent, smooth surface, and edge is without rake angle.
This fluorescent glass coating wavelength conversion component can send 1.05 μm near infrared lights under 306nm ultraviolet light irradiates.
Embodiment 6.
With Fig. 2, embodiment 6 is specifically described below.
Fig. 2 is the structural representation of fluorescence resin coating wavelength conversion component, and 4 is PC substrate, and 5 are coated with for polyurethane resin
Layer, 6 is near-infrared fluorescent powder (Y1-xLax)2O3:Er3+。
Polyurethane resin powder, fluorophor powder, binding agent and solvent are blended into uniform slurry, wherein toner,
The mass ratio of fluorophor powder is 100:1-20:150, and solvent is 100:1-100:100 with the mass ratio of binding agent, glimmering
It is 1:100 that body of light powder adds the volume ratio of the cumulative volume of toner mixture and the cumulative volume of solvent adding additives mixture
-300:100, and the particle diameter of the powder of the powder of resin and fluorophor is between 1 micron to 60 micron;By above-mentioned slurry
Being coated uniformly on PC resin substrate, by the PC resin substrate freeze-day with constant temperature of coating slurry, baking temperature is 40 DEG C-130 DEG C,
Drying time is 5 minutes-10 hours;
By the dried resin substrate baking scribbling slurry, baking temperature is 100 DEG C-260 DEG C, and heating rate is 1-10 DEG C
/ minute, baking time is 5 minutes-20 hours, and temperature fall time is 20 minutes-10 hours, obtains on resin substrate A surface
To the mixed coating containing fluorophor Yu resin.Baking is to make organic solvent volatilize completely or decompose so that polyurethane
Powder softens and fluorescent powder grain adhesion, final coating fluorescent powder particle, and is connected with resin substrate PC;In order to make
Obtain PC resin substrate indeformable in baking process, it is also possible to utilize mould to keep its physical form in baking process;Dry
Roasting mode can be to utilize infrared ray direct baking, it is also possible to utilizes electric-heating-wire-heating to toast.
It is the reddest that this fluorescence resin coating wavelength conversion component can send 1.5 μm under 980nm LD near infrared light irradiates
UV light.
Embodiment 7.
The present embodiment is with the difference of embodiment 6, and near-infrared fluorescent powder is Ba9.99Bi0.01(PO4)6Cl2。
This fluorescence resin coating wavelength conversion component can send 1.25 μm near infrared lights under 690nm red light irradiation.
Embodiment 8.
With Fig. 3, embodiment 8 is specifically described below.
Fig. 3 is the structural representation of phosphor film wavelength conversion component, and 7 is quartz glass substrate, and 8 is Fluoropher thin film
0.7%ErF3:74.6TeO2-8.8ZnO-16.6ZnF2。
This Fluoropher thin film uses pulsed laser deposition (PLD) method to prepare, and concrete preparation technology is as follows:
Prepare target and use casting method, by high-purity raw material ErF3、TeO2, ZnO and ZnF2Claim by stoicheiometry accurately
After amount, it is sufficiently mixed, is subsequently placed in platinum crucible.It is slowly heated to 1100 DEG C and is incubated 30 minutes, by melted glass
Glass liquid is poured in special metal die, then cuts and polish, it is thus achieved that thickness be 5 mm dias be the glass of 1.5 centimetres
Glass disk.
Sputtering light source used is KrF Excimer UV pulse laser (COMPex, Lambda Physik), and wavelength is
248nm, pulse width is 30ns, and sputtering frequency is 10Hz, and power density is 1.5J/cm2, underlayer temperature is room
Temperature.
Before deposition film, quartz glass ultrasonic cleaning 5 minutes the most in acetone, then utilize deionized water ultrasonic cleaning
10 minutes, dry.
Distance between target and substrate is set as 8cm, and base vacuum is 1 × 10-5Pa, sputter gas is O2, bias
For 10Pa.
After thin film deposition in air atmosphere 300 DEG C anneal 30 minutes, just obtain phosphor film, film thickness is 5
μm。
This phosphor film wavelength conversion component sends 1.53 μm near infrared lights under 980nm LD near infrared light irradiates.
Embodiment 9.
The present embodiment is with the difference of embodiment 8, and fluorophor is the near-infrared fluorescent body of glass material
77.29SiO2-11.86K2O-10.37PbO-0.48Sb2O3(Optical Materials 1325(2006)28)。
The present embodiment is with the difference of embodiment 8, and the preparation method of phosphor film is different, and its preparation method is: first
First just phosphor glass 0.7%ErF3:74.6TeO2-8.8ZnO-16.6ZnF21100 DEG C of thawings, and it is cast into 1 centimetre
Thick phosphor glass thin plate, is cut into the thin plate of 0.5 mm of thickness;Re-polishing becomes the fluorophor of 0.3 millimeters thick
Sheets of glass;
The quartz base plate being coated with 0.3 millimeter of phosphor glass thin plate is warmed up to 650 DEG C with 1 hour and is incubated 1 hour,
It is cooled to room temperature the most again with 2 hours.The most just obtain the phosphor film of glass material.
This phosphor film wavelength conversion component sends 1.53 μm near infrared lights under 980nm LD near infrared light irradiates.
Embodiment 10.
The difference of the present embodiment and embodiment 8 is that the transparency carrier of phosphor film wavelength conversion component is PMMA.
It is organic near-infrared fluorescent body (dpdq) that the difference of the present embodiment and embodiment 8 also resides in fluorophor2Ir(bpiq)(Can.
J.Chem.309(2006)84)。
It is electron-beam vapor deposition method that the difference of the present embodiment and embodiment 8 also resides in the preparation method of phosphor film, the most such as
Under:
After PMMA substrate is utilized alcohol wipe, utilize deionized water ultrasonic cleaning 10 minutes, then dry.
By (dpdq)2Ir (bpiq) black powder is placed in molybdenum crucible, and electron beam evaporation equipment base vacuum is 1 × 10-5
Pa, underlayer temperature 200 DEG C, electron gun power 1500W, 60 minutes plated film time, thickness is 2500nm.
This phosphor film wavelength conversion component sends 922nm near infrared light under 514nm green glow irradiates.
Embodiment 11.
The difference of the present embodiment and embodiment 8 is that the transparency carrier of phosphor film wavelength conversion component is PMMA.
It is organic near-infrared fluorescent body (dpdq) that the difference of the present embodiment and embodiment 8 also resides in fluorophor2Ir(bpiq)。
It is spin-coating method (spin-coating) that the difference of the present embodiment and embodiment 8 also resides in the preparation method of phosphor film,
Specific as follows:
After PMMA substrate is utilized alcohol wipe, utilize deionized water ultrasonic cleaning 10 minutes, then dry.
By (dpdq)2Ir (bpiq) black powder (d50=50 microns) put in the toluene solution of dilution, utilize the spin-coating equipment will
Mixed solution is repeated multiple times to be spun on PMMA substrate, anneals 40 minutes at 145 DEG C afterwards, has i.e. obtained phosphor film,
Thickness is 2000nm.
This phosphor film wavelength conversion component sends 922nm near infrared light under 514nm green glow irradiates.
Embodiment 12.
With Fig. 4, embodiment 12 is specifically described below.
Fig. 4 is the structural representation of fluorescence resin wavelength conversion component, and 9 is PMMA, and 10 is near-infrared fluorescent powder
(Y1-xLax)2O3:Er3+。
PMMA resin raw material is optical grade acrylic (PMMA VH001), and particle diameter is 5 microns.Near-infrared fluorescent powder
(Y1-xLax)2O3:Er3+Particle diameter is 5 μm.Ruddiness light absorbers is UV-327, and antioxidant is antioxidant 1010.
Acrylic is 100:15% with the volume ratio of fluorophor;Acrylic with the mass ratio of ruddiness light absorbers UV-327 is
100:0.25;Acrylic is 100:0.25 with the mass ratio of antioxidant 1010.
After phosphor powder and acrylic powder being sufficiently mixed, it is molded into, at 160 DEG C, the sheet material that thickness is 0.4 millimeter, cold
But fluorescence resin is i.e. obtained to room temperature.The fluorescence resin smooth surface obtained, impulse-free robustness.
This fluorescence resin wavelength conversion component can send 1.5 μm near infrared lights under 980nm LD near infrared light irradiates
Line.
Embodiment 13.
With Fig. 5, embodiment 13 is specifically described below.
Fig. 5 is the structural representation of fluorescent powder lens wavelength conversion component.Wherein 12 are one and have large radius of curvature
Long-distance fluorescent powder dome-type housing, 11 is a solid hemisphere with less radius of curvature, and O is long-distance fluorescent powder half
Spherical shell 12 and the common centre of sphere of solid hemisphere 11.
Wherein, the housing 12 of large radius of curvature is a kind of long-distance fluorescent powder structure, comprises a kind of transparent organic matrix K
Mixture with fluorescent material 13 particle;
The material of transparent organic matrix K is PMMA, and fluorescent material 11 is near-infrared fluorescent powder (Y1-xLax)2O3:Er3+;
Solid curved body 9 material with less radius of curvature is PMMA.
The particle of resin PMMA is added the barrel fusing of injection machine, obtains solid curved surface by means of mould by Shooting Technique
Body 9;
Injecting machine material tube fusing is added, by means of mould after being sufficiently mixed by the powder of the powder of resin PMMA Yu fluorescent material C
Long-distance fluorescent powder housing 10 is obtained by Shooting Technique;
Putting in long-distance fluorescent powder housing 10 by solid curved body 9, baking makes the appearance of solid curved body 9 in a vacuum
The inner surface of face and long-distance fluorescent powder housing 10 is fully fitted;Wherein baking temperature is characterised by so that organic matter C and has
Machine thing A occurs to soften adhesion, but does not forms molten state.
This fluorescence resin wavelength conversion component can send 1.5 μm near infrared lights under 980nmLD near infrared light irradiates.
Embodiment 14.
With Fig. 6, embodiment 14 is specifically described below.
Fig. 6 is by blue light LD (488nm), reflection shield, fluorescent glass coating wavelength conversion component and Wavelength optimization assembly group
The directly-down light source structural representation become.14 is blue light LD, and 15 is cylindrical reflection shield, and 16 is fluorescent glass coating
Wavelength conversion component, 17 is Wavelength optimization assembly (colour filter).
In fluorescent glass coating wavelength conversion component, base plate glass is common soda lime glass, and coated glass is a kind of low melting point phosphorus
Silicate glass, contained fluorophor is LED near-infrared fluorescent powder 77.29SiO2-11.86K2O-10.37PbO-0.48Sb2O3。
Reflection shield 15 is in cylinder, and internal reflection surface can plate metallic film to strengthen light reflecting effect.
The blue light illumination that blue light LD 14 sends in fluorescent glass coating wavelength conversion component, the LED in fluorescent glass coating
Near-infrared fluorescent powder sends 1530nm near infrared light after blue light illumination.The blueness that near infrared light and some residual pass through
Light after Wavelength optimization component filters, the near infrared light of outgoing pure color, a width of 20nm of half-peak.
Embodiment 15.
With Fig. 7, embodiment 15 is specifically described below.
Fig. 7 is blue light LD (488nm), reflection shield, fluorescence resin coating wavelength conversion component and Wavelength optimization assembly composition
Directly-down light source structural representation.14 is blue light LD, and 18 is reflection shield, and 19 is fluorescence resin coating wavelength convert group
Part, 20 is Wavelength optimization assembly (colour filter).
In fluorescence resin coating wavelength conversion component, resin substrate is PC, and coating resin material is polyurethane, and fluorescent material is LED
Near-infrared fluorescent powder 77.29SiO2-11.86K2O-10.37PbO-0.48Sb2O3。
Reflection shield is bowl shaped structure, and internal reflection surface can plate metallic film to strengthen light reflecting effect.
The blue light illumination that blue light LD 14 sends in fluorescence resin coating wavelength conversion component, the LED in fluorescence resin coating
Near-infrared fluorescent powder sends near infrared light after blue light illumination.The blue ray warp that near infrared light and some residual pass through
After Wavelength optimization component filters, the near infrared light of outgoing pure color, a width of 20nm of half-peak.
Embodiment 16.
The present embodiment is with the difference of embodiment 15, and excitation source is near-infrared LD (810nm).
The present embodiment is with the difference of embodiment 15, and fluorescent material is near-infrared fluorescent powder Bi:CsI (Optical
Materials Letter 400(2013)3)。
The near infrared light that near-infrared LD14 sends is irradiated in fluorescence resin coating wavelength conversion component, fluorescence resin coating
In LED near-infrared fluorescent powder through near infrared light irradiate after send 1580nm near infrared light, through Wavelength optimization assembly mistake
The near infrared light of outgoing pure color after filter, a width of 20nm of half-peak.
Embodiment 17.
The present embodiment is with the difference of embodiment 15, and wavelength conversion component is fluorescence resin.
Fluorescence resin is PMMA and near-infrared fluorescent powder 77.29SiO2-11.86K2O-10.37PbO-0.48Sb2O3Mixture.
The blue light illumination that blue light LD 14 sends in fluorescence resin wavelength conversion component, the LED near-infrared in fluorescence resin
Fluorescent material sends near infrared light after blue light illumination.The blue ray that near infrared light and some residual pass through is excellent through wavelength
After changing component filters, the near infrared light of outgoing pure color, a width of 20nm of half-peak.
Embodiment 18.
The present embodiment is with the difference of embodiment 15, and wavelength conversion component is fluorescence resin.
Fluorescence resin is PMMA and near-infrared fluorescent powder Ca2.86Tm0.07Na0.07(PO4)2(Journal of Applied Physics
023517 (2014) 116) mixture.
The present embodiment also resides in the difference of embodiment 15, and excitation source is purple light chip (359nm).
The ultraviolet lighting that LED purple light chip 14 sends is mapped to the LED in fluorescence resin wavelength conversion component, in fluorescence resin
Near-infrared fluorescent powder sends 1461nm near infrared light after violet exposure.The ultraviolet that near infrared light and some residual pass through
Light after Wavelength optimization component filters, the near infrared light of outgoing pure color, a width of 20nm of half-peak.
Embodiment 19.
The present embodiment is with the difference of embodiment 15, and wavelength conversion component is fluorescence resin.
Fluorescence resin is PMMA and near-infrared fluorescent powder Bi+:CsCdCl3(Journal of Luminescence
371 (2015) 167) mixture).
The present embodiment also resides in the difference of embodiment 15, and excitation source is LED red light chips (625nm).
The red light irradiation that LED red light chips 14 sends is in fluorescence resin wavelength conversion component, and the LED in fluorescence resin is near
IR fluorescence powder sends 1053nm near infrared light after red light irradiation.The ruddiness warp that near infrared light and some residual pass through
After Wavelength optimization component filters, the near infrared light of outgoing pure color, a width of 20nm of half-peak.
Embodiment 20.
With Fig. 8, embodiment 20 is specifically described below.
Fig. 8 is by red laser (650nm, 1500mW), expands spot lens, fluorescence resin coating wavelength conversion component
And the directly-down light source structural representation of Wavelength optimization assembly composition.21 is red laser, and 23 is extender lens, and 25 are
Fluorescent glass coating wavelength conversion component, 26 is Wavelength optimization assembly.
Substrate P MMA in fluorescence resin coating wavelength conversion component 25, the resin in coating is also PMMA, contained fluorophor
For near-infrared fluorescent powder Bi+:CsCdCl3。
Red laser 21 sends the blue light 22 of less beam spot, and after lens 23 expand, uniform irradiation is to fluorescence resin coating
In wavelength conversion component, the near-infrared fluorescent powder in fluorescence resin coating sends 1053nm near-infrared coloured light after red light irradiation
Line.The red light that near infrared light and some residual pass through after Wavelength optimization component filters, the near-infrared of outgoing pure color
Light, a width of 20nm of half-peak.
Embodiment 21.
With Fig. 9, embodiment 21 is specifically described below.
Fig. 9 is by COB blue light source (455nm), reflection shield, fluorescent glass coating wavelength conversion component and Wavelength optimization
The directly-down light source structural representation of assembly composition.27 is COB blue light source, and 28 is reflection shield, and 29 are coated with for fluorescent glass
Layer wavelength conversion component, 30 is Wavelength optimization assembly.
In fluorescent glass coating wavelength conversion component, base plate glass is common soda lime glass, and coated glass is a kind of low melting point phosphorus
Silicate glass, contained fluorophor is LED near-infrared fluorescent powder 77.29SiO2-11.86K2O-10.37PbO-0.48Sb2O3。
Reflection shield is paraboloidal, and internal reflection surface can plate metallic film to strengthen light reflecting effect.
The blue light illumination that COB blue light source 27 sends is in fluorescent glass coating wavelength conversion component, in fluorescent glass coating
Near-infrared fluorescent powder after blue light illumination, send 1530nm near infrared light.The indigo plant that near infrared light and some residual pass through
Coloured light line after Wavelength optimization component filters, the near infrared light of outgoing pure color, a width of 20nm of half-peak.
Embodiment 22.
With Figure 10, embodiment 22 is specifically described below.
The directly-down light source that Figure 10 is made up of COB blue light source (455nm), fluorescent powder lens and Wavelength optimization assembly
Structural representation.31 is LED blue chip, and 32 is fluorescent powder lens, and 33 is reflection shield, and 34 is Wavelength optimization assembly.
The shell material of large radius of curvature is PMMA, and the material of the solid curved body of less radius of curvature is also PMMA.
Fluorophor in fluorescent powder lens shell is LED near-infrared fluorescent powder
77.29SiO2-11.86K2O-10.37PbO-0.48Sb2O3;
Reflection shield is cylinder, and internal reflection surface can plate metallic film to strengthen light reflecting effect.
The blue light illumination that COB blue light source 31 sends in fluorescent lens wavelength conversion component, the LED near-infrared in shell
Fluorescent material sends near infrared light after blue light illumination.The blue ray that near infrared light and some residual pass through is excellent through wavelength
After changing component filters, the near infrared light of outgoing pure color, a width of 20nm of half-peak.
Embodiment 23.
With Figure 11, embodiment 23 is specifically described below.
Figure 11 is excellent by LD blue chip (455nm), leaded light component, fluorescent glass coating wavelength conversion component and wavelength
Change the side entering type light-source structure schematic diagram of assembly composition.35,36 is LD blue chip, and 37 is light guide plate, and 38 is reflective
Plate, 39 is fluorescent glass coating wavelength conversion component, and 40 is Wavelength optimization assembly.
In fluorescent glass coating wavelength conversion component, base plate glass is common soda lime glass, and coated glass is a kind of low melting point phosphorus
Silicate glass, contained fluorophor is LED near-infrared fluorescent powder 77.29SiO2-11.86K2O-10.37PbO-0.48Sb2O3。
The blue light that LD blue chip 35,36 sends is derived through light guide plate 37, and is irradiated to fluorescent glass coating wavelength convert
On assembly 39, the blue light that part is exposed also is reflexed in fluorescent glass coating wavelength conversion component by reflector 38.Fluorescence
LED near-infrared fluorescent powder in glass coating sends near infrared light after blue light illumination.Near infrared light and some residual
The blue ray passed through after Wavelength optimization component filters, the near infrared light of outgoing pure color, a width of 20nm of half-peak.
Claims (10)
1. a near-infrared wavelength LED light source, it is characterised in that comprise excitation source, wavelength conversion component and Wavelength optimization assembly;Excitation source is visible light source or near infrared light light source;Described visible light source or near-infrared light source are single visible ray or near infrared light LED chip, or many or many group visible rays or near infrared light LED chip, or visible ray or the near infrared light i.e. COB light source of LED integrated optical source, or a visible ray or near infrared light laser instrument, or one group of visible ray or near infrared light laser array, it is provided that visible ray or near infrared light illuminating source;
Wavelength conversion component is fluorescent material and transparent material mixing preparation, including fluorescent glass coating wavelength conversion component, fluorescence resin coating wavelength conversion component, fluorescence resin wavelength conversion component or fluorescent powder lens wavelength conversion component and phosphor film wavelength conversion component;The basic configuration of transition components is light-transmitting plate or rased panel;
The equally distributed fluorophor C that wavelength conversion component contains, fluorophor C uses to be stimulated and produces the fluorescent material of near infrared light, and fluorophor C sends the light of specific centre wavelength less than any light source of its emission wavelength under visible ray or near infrared light or other wavelength excite;The stimulated luminescence wavelength of fluorophor C is near infrared range, i.e. wave-length coverage is 700nm-2500nm;Under the exciting of visible ray or near infrared light light source, the centre wavelength of the light that fluorescent material is sent should the emission wavelength center of final required light source or near.
2. near-infrared wavelength LED light source as claimed in claim 1, it is characterised in that fluorescent powder lens wavelength conversion component comprises a hemispheroidal curved-surface structure of kind;The hemispheroidal curved-surface structure of class is a housing with large radius of curvature, is a kind of fluorescent glass or long-range lens arrangement prepared by fluorescence resin, comprises the mixture of a kind of clear glass or resin matrix H and fluorophor C powder;The material of transparent base H is glass, PMMA, PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PMMA or the MS resin of PC enhancing or silica gel;Fluorophor C is at visible ray or near infrared light or the light sending specific centre wavelength under being excited less than any light source of its emission wavelength by wavelength;The stimulated luminescence wavelength of fluorophor C is near infrared range, i.e. wave-length coverage is 700nm-2500nm;Under the exciting of visible ray or near infrared light light source, the centre wavelength of the light that LED fluorescent powder is sent should be preferably consistent with the emission wavelength of final required light source near the emission wavelength of final required light source.
3. near-infrared wavelength LED light source as claimed in claim 1, it is characterised in that described fluorescent powder lens wavelength conversion component comprises a kind hemispheroidal compound curved surface structure;Class hemispheroidal compound curved surface structure is a housing with large radius of curvature and the complex of a solid curved body with less radius of curvature;The cross section of compound curved surface structure is circular or oval, and the housing of large radius of curvature has a center of circle with the circular cross-section of the solid curved body with less radius of curvature;Housing has an outer surface and an inner surface;The outer surface of housing is sphere, parabola or other smooth convex surface;The thickness of housing is uniform, it is also possible to regulate according to the applied environment that it is final;The thickness range of housing is 50 microns~3 millimeters;The inner surface of housing is completely the same with the surface physics shape of solid curved body, for sphere or parabola or other smooth convex surface;The inner surface of the surface of solid curved body and the housing of large radius of curvature is fitted completely.
4. near-infrared wavelength LED light source as claimed in claim 3, it is characterized in that, the solid curved body of less radius of curvature is a kind of transparent with machine thing or glass J, transparent with machine thing material be PMMA, PMMA or the MS resin that strengthens of PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC or silica gel, glass;Select with specific reference to using environment temperature environment;The organic matter matrix H of housing is identical or different with material J of solid curved body;The organic matter matrix H of housing and material J of solid curved body have same or like refractive index, to avoid the propagation loss of light.
5. the near-infrared wavelength LED light source as described in one of claim 1-4, it is characterised in that have physical space between visible ray or near infrared light light source and wavelength conversion component, uses remote excitation to arrange;Visible ray or near infrared light that visible ray or near infrared light light source are sent shine directly in wavelength conversion component;The two ends of reflection shield connect visible ray or near infrared light light source and wavelength conversion component respectively, and reflector internal reflection surface is provided with reflector layer.
6. near-infrared wavelength LED light source as claimed in claim 5, it is characterised in that reflection shield is cylindrical, taper, semi-cylinder or half-cone, it is seen that light or near infrared light light source and wavelength conversion component are respectively as two basal surface positions of described reflection shield;Wavelength conversion component has mounting interface at the basal surface position of reflection shield.
7. near-infrared wavelength LED light source as claimed in claim 5, it is characterized in that, arranging one or one group of lens in reflection shield between LED excitation source and wavelength conversion component, the effect of lens is the beam spot expanding the sent laser beam of the excitation source region with complete illumination wavelength transition components;Or constraint LED light spot.
8. infrared wavelength LED light source as claimed in claim 5, it is characterized in that, visible ray or near infrared light light source and Wavelength converter are arranged in the plane around a light guide plate, the light that visible ray or near infrared light light source send imports from side through light guide plate, light guide plate plane superposition wavelength conversion component.
9. near-infrared wavelength LED light source as claimed in claim 5, it is characterized in that, after on visible ray that visible ray or near infrared light light source send or near infrared light light illumination wavelength transition components, fluorophor stimulated emission in wavelength conversion component goes out to have the light of specific wavelength, and the some residual light in the visible ray that sends of visible ray or near infrared light light source or near infrared light light is obtained with having the high-quality monochrome light of specific wavelength after Wavelength optimization assembly i.e. colour filter.
10. near-infrared wavelength LED light source as claimed in claim 9, it is characterised in that use near-infrared fluorescent powder (Y1-xLax)2O3:Er3+;Under 980nm LD near infrared light, 1.5 μm near infrared lights are sent as the main wavelength conversion component to wavelength convert;
Use near-infrared fluorescent powder Ba9.99Bi0.01(PO4)6Cl2;1.25 μm near infrared lights can be sent under 690nm red light irradiation as the main wavelength conversion component to wavelength convert;
Use near-infrared fluorescent powder 26.6B2O3-52.33PbO-16GeO2-4Bi2O3-1Sm2O3;Under 488nm blue light illumination, 978nm and 1.18 μm near infrared lights are sent as the main wavelength conversion component to wavelength convert;
Use near-infrared fluorescent powder Cr3+:GdAl3(BO3)4;720nm near infrared light can be sent under 420nm blue light illumination as the main wavelength conversion component to wavelength convert;
Or use near-infrared fluorescent powder CaMoO4:(Tb3+,Yb3+);Under 306nm ultraviolet light irradiates, 1.05 μm near infrared lights are sent as the main wavelength conversion component to wavelength convert.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610258411.XA CN105932140A (en) | 2016-04-22 | 2016-04-22 | Near-infrared wavelength LED light source |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610258411.XA CN105932140A (en) | 2016-04-22 | 2016-04-22 | Near-infrared wavelength LED light source |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105932140A true CN105932140A (en) | 2016-09-07 |
Family
ID=56837011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610258411.XA Pending CN105932140A (en) | 2016-04-22 | 2016-04-22 | Near-infrared wavelength LED light source |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105932140A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107676638A (en) * | 2017-08-17 | 2018-02-09 | 江苏脉锐光电科技有限公司 | A kind of LED light source |
CN108174467A (en) * | 2017-06-01 | 2018-06-15 | 欧普照明股份有限公司 | LED heating means, device, component and super bath, heater |
CN108224361A (en) * | 2018-01-18 | 2018-06-29 | 云南裕光科技有限公司 | A kind of laser illuminator system and laser lighting method |
CN108346733A (en) * | 2018-04-10 | 2018-07-31 | 江苏华旦科技有限公司 | A kind of light engine and application thereof |
CN109148672A (en) * | 2018-08-10 | 2019-01-04 | 国红(深圳)光电科技有限公司 | A kind of near-infrared optical device |
CN109860374A (en) * | 2017-11-30 | 2019-06-07 | 首尔半导体株式会社 | Light emitting device including light emitting diode |
CN111936786A (en) * | 2018-04-12 | 2020-11-13 | 松下知识产权经营株式会社 | Lighting device |
CN113348322A (en) * | 2019-02-05 | 2021-09-03 | 松下知识产权经营株式会社 | Lighting device and optical component |
CN113831837A (en) * | 2021-10-18 | 2021-12-24 | 中国科学院苏州纳米技术与纳米仿生研究所 | Particle size controllable laser scatterer and preparation method and application thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101162745A (en) * | 2006-10-09 | 2008-04-16 | 李屹 | High-efficiency fluorescent converted LED light source and backlight module |
CN101741008A (en) * | 2008-11-12 | 2010-06-16 | 中国科学院半导体研究所 | Method for preparing microminiaturized solid state white light source |
CN102142510A (en) * | 2010-02-01 | 2011-08-03 | 深圳市光峰光电技术有限公司 | Solid light source based on optical wavelength conversion and application of solid light source |
CN103022328A (en) * | 2013-01-17 | 2013-04-03 | 上海中科高等研究院 | Solar simulator light source and realizing method thereof |
-
2016
- 2016-04-22 CN CN201610258411.XA patent/CN105932140A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101162745A (en) * | 2006-10-09 | 2008-04-16 | 李屹 | High-efficiency fluorescent converted LED light source and backlight module |
CN101741008A (en) * | 2008-11-12 | 2010-06-16 | 中国科学院半导体研究所 | Method for preparing microminiaturized solid state white light source |
CN102142510A (en) * | 2010-02-01 | 2011-08-03 | 深圳市光峰光电技术有限公司 | Solid light source based on optical wavelength conversion and application of solid light source |
CN103022328A (en) * | 2013-01-17 | 2013-04-03 | 上海中科高等研究院 | Solar simulator light source and realizing method thereof |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108174467A (en) * | 2017-06-01 | 2018-06-15 | 欧普照明股份有限公司 | LED heating means, device, component and super bath, heater |
CN108174467B (en) * | 2017-06-01 | 2024-05-14 | 欧普照明股份有限公司 | LED heating method, device, assembly, bathroom heater and warmer |
CN107676638A (en) * | 2017-08-17 | 2018-02-09 | 江苏脉锐光电科技有限公司 | A kind of LED light source |
CN109860374A (en) * | 2017-11-30 | 2019-06-07 | 首尔半导体株式会社 | Light emitting device including light emitting diode |
CN109860374B (en) * | 2017-11-30 | 2022-04-29 | 首尔半导体株式会社 | Light emitting device comprising light emitting diodes |
CN108224361A (en) * | 2018-01-18 | 2018-06-29 | 云南裕光科技有限公司 | A kind of laser illuminator system and laser lighting method |
CN108346733A (en) * | 2018-04-10 | 2018-07-31 | 江苏华旦科技有限公司 | A kind of light engine and application thereof |
CN111936786A (en) * | 2018-04-12 | 2020-11-13 | 松下知识产权经营株式会社 | Lighting device |
CN109148672A (en) * | 2018-08-10 | 2019-01-04 | 国红(深圳)光电科技有限公司 | A kind of near-infrared optical device |
CN113348322A (en) * | 2019-02-05 | 2021-09-03 | 松下知识产权经营株式会社 | Lighting device and optical component |
CN113831837A (en) * | 2021-10-18 | 2021-12-24 | 中国科学院苏州纳米技术与纳米仿生研究所 | Particle size controllable laser scatterer and preparation method and application thereof |
CN113831837B (en) * | 2021-10-18 | 2022-12-23 | 中国科学院苏州纳米技术与纳米仿生研究所 | Particle size controllable laser scatterer and preparation method and application thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105932140A (en) | Near-infrared wavelength LED light source | |
CN105870304A (en) | LED light source with adjustable wavelength | |
TWI493242B (en) | Color regulating device for illumination and apparatus using the same, and method of adjusting color | |
Dong et al. | Recent developments in luminescent nanoparticles for plant imaging and photosynthesis | |
JP2016518149A (en) | Quantum dot light emitting diodes for phototherapy | |
CN105199732A (en) | Near-infrared long-afterglow material with dual functions of bioimaging and photo-thermal treating and preparation method of near-infrared long-afterglow material | |
TW201319709A (en) | Color regulating device for illumination and apparatus using the same, and method of regulating color | |
CN110869750A (en) | Optical fiber coupling broadband light source | |
Chan et al. | The optical research progress of nanophosphors composed of transition elements in the fourth period of near-infrared windows I and II for deep-tissue theranostics | |
CN110518004A (en) | Special light source and lamps and lanterns suitable for diabetic retinopathy | |
ES2752050T3 (en) | Ceramic glass article with light display | |
CN103656868A (en) | Neonatal jaundice therapeutic equipment optical device based on LED light source | |
Morassuti et al. | Spectroscopic investigation and interest of Pr3+-doped calcium aluminosilicate glass | |
CN103028197A (en) | Medical A-type infrared treatment equipment and light-filtering liquid | |
Nimbalkar et al. | Potential of luminescent materials in phototherapy | |
CN109037404B (en) | Plant germination irradiates diode and preparation method thereof and plant germination irradiation light | |
Yang et al. | Pr 3+-doped heavy metal germanium tellurite glasses for irradiative light source in minimally invasive photodynamic therapy surgery | |
CN102809779B (en) | Method for preparing praseodymium-doped ion exchange aluminate and germanate glass waveguide | |
An et al. | Multichannel control of PersL/upconversion/down-shifting luminescence in a single core–shell nanoparticle for information encryption | |
Yang et al. | Recent advances in light-conversion phosphors for plant growth and strategies for the modulation of photoluminescence properties | |
CN115287067B (en) | Ultraviolet and near infrared double-emission long afterglow material and preparation method thereof | |
Yang et al. | Rare-earth ions doped heavy metal germanium tellurite glasses for fiber lighting in minimally invasive surgery | |
Bispo et al. | Red-emitting coatings for multifunctional UV/Red emitting LEDs applied in plant circadian rhythm control | |
CN103768728A (en) | Tumor photodynamic/photo-thermal therapy instrument based on 3D-LED array cold light source | |
WO2018235169A1 (en) | Photoirradiation device for photodynamic therapy |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160907 |