CN105825910A - Large-power low-temperature-coefficient thick-film heating element resistor slurry and preparation method thereof - Google Patents
Large-power low-temperature-coefficient thick-film heating element resistor slurry and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a large-power low-temperature-coefficient thick-film heating element resistor slurry and a preparation method thereof. The large-power low-temperature-coefficient thick-film heating element resistor slurry comprises a functional phase, an inorganic bonding phase, a sintering promoter and an organic carrier, wherein the functional phase is composed of nanometer silver powder and ruthenium dioxide powder, the inorganic bonding phase is composed of SiO2, CaO, B2O3, Al2O3, Bi2O3, a rare earth oxide and a nucleus agent, and the organic carrier is composed of an organic solvent, a high-molecular thickening agent, a dispersant, an antifoaming agent and a thixotropic agent. The l large-power low-temperature-coefficient thick-film heating element resistor slurry is low and adjustable in sheet resistance, low and adjustable in resistor temperature coefficient and excellent in printing and sintering features, and can match an insulating stainless steel substrate.
Description
Technical field
The present invention relates to technical field of electronic materials, particularly relate to a kind of high-power low-temperature coefficient thick-film heating element resistance slurry and preparation method thereof, this high-power low-temperature coefficient thick-film heating element resistance slurry is based on stainless steel substrate.
Background technology
In electric heating field, heating element wants cube little, power is big, thermal inertia is little, surface thermal load is big, power consumption is low, the thermal efficiency is high, thermal starting is fast, power stability, stationary field is uniform, good manufacturability, body temp auto-controlled, safe and reliable to operation, life-span is long, applied widely, it is thus desirable to use thick-film heating element, thick film heating resistance is typically with gold at present, silver, platinum, the noble metal powders such as ruthenic oxide or its oxide are matrix, add the glass phase as inorganic binder, and it is mixed to form heating resistor slurry with organic carrier, then silk screen process is on ceramic substrate, at air atmosphere, in 300 DEG C of-1200 DEG C of temperature ranges, sintering is prepared from.In thick film circuit technique field, traditional substrate has polymeric substrates and ceramic substrate, but both has its limitation, and the mechanical performance that insulating stainless steel substrate is excellent, hot property, large scale and can be made into the rare characteristics such as complicated shape, make its probability applied on high-power thick-film device of people's special concern, at present, high-power resistance (> 100W-1000W), large power, electrically thermal element (> 100W-1000W) etc. the components and parts that have a large capacity and a wide range of application generally individually make of wire resistor silk, it is big that it has size, life-span is shorter, the features such as thermal design difficulty, and be increasingly difficult to meet each electric appliances miniaturization, high reliability, the rigors such as long-life.The increasingly mature urgent need of thick film circuit element preparation and application technology develops the thick-film resistor paste and thick film conductor paste matched with insulating stainless steel substrate performance, with design preparation small size, planarization, high reliability, long-life, the high-power thick-film element of low cost, to meet the growing market demand, high-power thick-film resistive element and the resistance track of heating and electrode trace are burnt till acquisition by resistance slurry and electrocondution slurry through silk screen printing and drying respectively.High power characteristics require component resistance track area compared with big, resistance is relatively low and should have alap temperature-coefficient of electrical resistance, therefore, to the requirement of resistance slurry in addition to necessary resistance and temperature-coefficient of electrical resistance, the requirement of its firing process performance is also high than low power ceramic substrate thick film circuit element.Owing to the coefficient of expansion of stainless steel substrate is much larger than ceramic substrate, therefore the resistance track film layer after thick-film resistor paste based on stainless steel substrate burns till should have the bigger coefficient of expansion to match with rustless steel, and the glass in slurry mutually also should be with the solid-phase component chemical compatibility in dielectric paste based on stainless steel substrate and electrocondution slurry simultaneously.
Summary of the invention
Present invention aims to the deficiencies in the prior art and a kind of high-power low-temperature coefficient thick-film heating element resistance slurry is provided, high-power low-temperature coefficient thick-film heating element resistance slurry sheet resistance is low and adjustable, temperature-coefficient of electrical resistance is relatively low and adjustable for this, printing characteristic and burn till characteristic good, and can match with insulating stainless steel substrate.
Another object of the present invention is to provide a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, this high-power low-temperature coefficient thick-film heating element resistance slurry preparation method can prepare above-mentioned high-power low-temperature coefficient thick-film heating element resistance slurry effectively, high-power low-temperature coefficient thick-film heating element resistance slurry sheet resistance prepared by and is low and adjustable, temperature-coefficient of electrical resistance is relatively low and adjustable, printing characteristic and burn till characteristic good, and can match with insulating stainless steel substrate.
For reaching above-mentioned purpose, the present invention is achieved through the following technical solutions.
A kind of high-power low-temperature coefficient thick-film heating element resistance slurry, includes the material of following weight portion, particularly as follows:
Function phase 60%-70%
Inorganic adhesive phase 10%-15%
Sintering aids 0.5%-5%
Organic carrier 10%-29.5%；
Function mutually by the composite powder being made up of nanometer silver powder, ruthenic oxide powder, function mutually in nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder be followed successively by 80%-90%, 10%-20%；
Inorganic adhesive is leadless crystallizing glass powder mutually, and leadless crystallizing glass powder is by SiO2、CaO、B2O3、A12O3、Bi2O3, the mixture that formed of rare earth oxide, Nucleating Agent, inorganic adhesive mutually in SiO2、CaO、B2O3、A12O3、Bi2O3, rare earth oxide, the weight portion of seven kinds of materials of Nucleating Agent be followed successively by 20%-70%, 10%-50%, 1%-15%, 5%-30%, 10%-30%, 1%-10%, 1%-10%；
Described Nucleating Agent is TiO2、ZrO2、MoO3、Fe2O3、CaF2、P2O5, the mixture that formed of a kind of or at least two in ZnO；
Described rare earth oxide is CeO2、Sm2O3、Gd2O3、Nd2O3、Dy2O3、Eu2O3In the mixture that formed of a kind of or at least two；
The mixture that described sintering aids is zinc, a kind of or at least two in stannum, aluminum, cobalt, antimony, zinc compound, tin compound, aluminium compound, cobalt compound, antimonial is formed；
The mixture that organic carrier is organic solvent, macromolecule thickener, dispersant, defoamer, thixotropic agent are formed, in organic carrier, organic solvent, macromolecule thickener, dispersant, defoamer, the weight portion of five kinds of materials of thixotropic agent are followed successively by 70%-80%, 15%-20%, 1%-5%, 1%-5%, 1%-5%；
The mixture that described organic solvent is terpineol, a kind of or at least two in butyl carbitol, butyl carbitol acetate, tributyl citrate, GBL, mixed dibasic acid ester, N-Methyl pyrrolidone is formed；
The mixture that described macromolecule thickener is ethyl cellulose, a kind of or at least two in hydroxyethyl cellulose, carboxymethyl cellulose, NC Nitroncellulose, polyvinyl alcohol, polyvinyl butyral resin, polyvinylpyrrolidone is formed；
The mixture that described dispersant is triammonium citrate, a kind of or at least two in polymethyl acid amide, 1,4-dihydroxy sulfanilic acid is formed；
Described defoamer is the one in polydimethylsiloxane, organic silicon modified by polyether；
Described thixotropic agent is the one in castor oil hydrogenated, polyamide wax；
The particle size values of described leadless crystallizing glass powder is 3 μm-5 μm, and the particle size values of nanometer silver powder is 20nm-30nm, and the particle size values of ruthenic oxide powder is 1 μm-2 μm.
The preparation method of aforementioned high-power low-temperature coefficient thick-film heating element resistance slurry, includes following processing step, particularly as follows:
A, prepare inorganic adhesive phase: by SiO2、CaO、B2O3、A12O3、Bi2O3, rare earth oxide, Nucleating Agent mix homogeneously in three-dimensional material mixer, then at smelting furnace melting after mix homogeneously, smelting temperature is 1200 DEG C-1600 DEG C, temperature retention time is i.e. to obtain glass melts in 3-6 hour, then glass melts carried out shrend and obtain glass, finally with distilled water for medium to glass ball milling 4-6 hour, i.e. obtain the leadless crystallizing glass powder that particle size values is 3 μm-5 μm；
B, preparation function phase: by nanometer silver powder, ruthenic oxide powder mix homogeneously to prepare silver-ruthenic oxide composite powder；
C, prepare organic carrier: by organic solvent, macromolecule thickener, dispersant, defoamer, thixotropic agent dissolve to obtain organic carrier in 80 DEG C of water-baths, and by adjusting the content of macromolecule thickener, so that the viscosity of organic carrier controls in the range of 200mPa s-300mPa s；
Prepared by d, resistance slurry: by function phase, inorganic adhesive phase, sintering aids, organic carrier dispersed with stirring in container, carry out three-roll rolling the most again, to obtain the range of viscosities resistance slurry for 200Pa s ± 20Pa s.
The invention have the benefit that one of the present invention high-power low-temperature coefficient thick-film heating element resistance slurry, it includes the material of following weight portion, particularly as follows: function phase 60%-70%, inorganic adhesive phase 10%-15%, sintering aids 0.5%-5%, organic carrier 10%-29.5%；Function mutually by the composite powder being made up of nanometer silver powder, ruthenic oxide powder, function mutually in nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder be followed successively by 80%-90%, 5%-20%；Inorganic adhesive is leadless crystallizing glass powder mutually, and leadless crystallizing glass powder is by SiO2、CaO、B2O3、A12O3、Bi2O3, the mixture that formed of rare earth oxide, Nucleating Agent, inorganic adhesive mutually in SiO2、CaO、B2O3、A12O3、Bi2O3, rare earth oxide, the weight portion of seven kinds of materials of Nucleating Agent be followed successively by 20%-70%, 10%-50%, 1%-15%, 5%-30%, 10%-30%, 1%-10%, 1%-10%；The mixture that organic carrier is organic solvent, macromolecule thickener, dispersant, defoamer, thixotropic agent are formed, in organic carrier, organic solvent, macromolecule thickener, dispersant, defoamer, the weight portion of five kinds of materials of thixotropic agent are followed successively by 70%-80%, 15%-20%, 1%-5%, 1%-5%, 1%-5%.By above-mentioned material proportion, the high-power low-temperature coefficient thick-film heating element resistance slurry sheet resistance of the present invention is low and adjustable, temperature-coefficient of electrical resistance is relatively low and adjustable, printing characteristic and burn till characteristic good, and can match with insulating stainless steel substrate.
Another of the present invention has the beneficial effect that one of the present invention high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, and it includes following processing step, particularly as follows: a, prepare inorganic adhesive phase: by SiO2、CaO、B2O3、A12O3、Bi2O3, rare earth oxide, Nucleating Agent mix homogeneously in three-dimensional material mixer, SiO in mixture2、CaO、B2O3、A12O3、Bi2O3, rare earth oxide, the weight portion of seven kinds of materials is followed successively by 20%-70%, 10%-50%, 1%-15%, 5%-30%, 10%-30%, 1%-10%, 1%-10% in Nucleating Agent, then at smelting furnace melting after mix homogeneously, smelting temperature is 1200 DEG C-1600 DEG C, temperature retention time is i.e. to obtain glass melts in 3-6 hour, then glass melts carried out shrend and obtain glass, finally with distilled water for medium to glass ball milling 4-6 hour, i.e. obtain the leadless crystallizing glass powder that particle size values is 3 μm-5 μm；B, preparation function phase: by nanometer silver powder, ruthenic oxide powder mix homogeneously to prepare silver-ruthenic oxide composite powder, in silver-ruthenic oxide composite powder, nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder are followed successively by 80%-90%, 5%-20%, the particle size values of nanometer silver powder is 20nm-30nm, and the particle size values of ruthenic oxide powder is 1 μm-2 μm；C, prepare organic carrier: by organic solvent, macromolecule thickener, dispersant, defoamer, thixotropic agent dissolve to obtain organic carrier in 80 DEG C of water-baths, and by adjusting the content of macromolecule thickener, so that the viscosity of organic carrier controls in the range of 200mPa s-300mPa s, wherein, in organic carrier, organic solvent, macromolecule thickener, dispersant, defoamer, the weight portion of five kinds of materials of thixotropic agent are followed successively by 70%-80%, 15%-20%, 1%-5%, 1%-5%, 1%-5%；Prepared by d, resistance slurry: by function phase, inorganic adhesive phase, sintering aids, organic carrier dispersed with stirring in container, carry out three-roll rolling the most again, to obtain the resistance slurry that range of viscosities is 200Pa s ± 20Pa s, wherein, in resistance slurry, function phase, inorganic adhesive phase, sintering aids, the weight portion of four kinds of materials of organic carrier are followed successively by 60%-70%, 10%-15%, 0.5%-5%, 10%-29.5%.Being designed by above-mentioned processing step, the high-power low-temperature coefficient thick-film heating element resistance slurry preparation method of the present invention can produce effectively prepares above-mentioned high-power low-temperature coefficient thick-film heating element resistance slurry.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention will be described.
Embodiment one, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry, include the material of following weight portion, particularly as follows:
Function phase 70%
Inorganic adhesive phase 15%
Zinc powder 2.5%
Organic carrier 12.5%；
Function is mutually by the composite powder being made up of nanometer silver powder, ruthenic oxide powder, the particle size values of nanometer silver powder is 20nm-30nm, the particle size values of ruthenic oxide powder is 1 μm-2 μm, and function middle nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder mutually are followed successively by 90%, 10%；
Inorganic adhesive is leadless crystallizing glass powder mutually, and leadless crystallizing glass powder is by SiO2、CaO、B2O3、A12O3、Bi2O3、CeO2、TiO2The mixture formed, inorganic adhesive middle SiO mutually2、CaO、B2O3、A12O3、Bi2O3、CeO2、TiO2The weight portion of seven kinds of materials is followed successively by 40%, 15%, 15%, 12%, 13%, 2.5%, 2.5%；
The mixture that organic carrier is terpineol, ethyl cellulose, triammonium citrate, polydimethylsiloxane, castor oil hydrogenated are formed, in organic carrier, terpineol, ethyl cellulose, triammonium citrate, polydimethylsiloxane, the weight portion of five kinds of materials of castor oil hydrogenated are followed successively by 80%, 17%, 1%, 1%, 1%.
By above-mentioned material proportion, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment one has the following advantages, particularly as follows:
1, SiO is selected2、CaO、B2O3、A12O3、Bi2O3、CeO2、TiO2Prepare leadless crystallizing glass powder body system, and then avoid lead research and development, use and be discarded after injury that environment, human body are caused, high-power resistance or heating manufacturing urgent problem can be solved, meet RoHS Directive (2002/95/EC) requirement；2, rare earth oxide CeO2Microcrystal glass material and the sintering character of function phase, microstructure, consistency, phase composition and physical and mechanical property can be changed greatly, the compatibility of slurry, wettability, hot property, electrical property, manufacturability, adaptability is made to have a significant improvement raising, while regulation resistance slurry sintering temperature, effectively regulate sheet resistance scope and the temperature-coefficient of electrical resistance of resistive layer；3, silver-ruthenic oxide composite powder and the organic carrier of leadless crystallizing glass powder body system with proper proportion are combined, add sintering aids simultaneously, prepare medium or low resistance section, the coefficient of expansion of resistor track layer mates with stainless steel substrate and the rare earth thick film circuit resistance slurry of good combination；4, printing characteristic based on stainless steel substrate medium or low resistance section rare earth thick film circuit resistance slurry and burn till characteristic good, reheating rate of change is less than 5%, the preparation of this resistance slurry have that sheet resistance is low and adjustable, temperature-coefficient of electrical resistance is low and adjustable and with the advantage such as the compatibility having had based on stainless steel substrate thick film circuit dielectric paste, electrocondution slurry.
Wherein, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment one can use following preparation method to be prepared from, concrete, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, include following processing step, particularly as follows:
A, prepare inorganic adhesive phase: by SiO2、CaO、B2O3、A12O3、Bi2O3、CeO2、TiO2Mix homogeneously in three-dimensional material mixer, SiO in mixture2、CaO、B2O3、A12O3、Bi2O3、CeO2、TiO2In the weight portion of seven kinds of materials be followed successively by 40%, 15%, 15%, 12%, 13%, 2.5%, 2.5%, then at smelting furnace melting after mix homogeneously, smelting temperature is 1200 DEG C, temperature retention time is i.e. to obtain glass melts in 3 hours, then glass melts carried out shrend and obtain glass, finally with distilled water for medium to glass ball milling 6 hours, i.e. obtain the leadless crystallizing glass powder that particle size values is 3 μm-5 μm；
B, preparation function phase: by nanometer silver powder, ruthenic oxide powder mix homogeneously to prepare silver-ruthenic oxide composite powder, in silver-ruthenic oxide composite powder, nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder are followed successively by 95%, 5%, the particle size values of nanometer silver powder is 20nm-30nm, and the particle size values of ruthenic oxide powder is 1 μm-2 μm；
C, prepare organic carrier: dissolve to obtain organic carrier in 80 DEG C of water-baths by terpineol, ethyl cellulose, triammonium citrate, polydimethylsiloxane, castor oil hydrogenated, and by adjusting the content of ethyl cellulose, so that the viscosity of organic carrier controls in the range of 200mPa s-300mPa s, wherein, in organic carrier, terpineol, ethyl cellulose, triammonium citrate, polydimethylsiloxane, the weight portion of five kinds of materials of castor oil hydrogenated are followed successively by 80%, 17%, 1%, 1%, 1%；
Prepared by d, resistance slurry: by function phase, inorganic adhesive phase, zinc powder, organic carrier dispersed with stirring in container, carry out three-roll rolling the most again, to obtain the resistance slurry that range of viscosities is 150Pa s-200Pa s, wherein, in resistance slurry, function phase, inorganic adhesive phase, zinc powder, the weight portion of four kinds of materials of organic carrier are followed successively by 70%, 15%, 2.5%, 12.5%.
Being designed by above-mentioned processing step, this high-power low-temperature coefficient thick-film heating element resistance slurry preparation method production can prepare the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment one effectively.
Embodiment two, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry, include the material of following weight portion, particularly as follows:
Function phase 70%
Inorganic adhesive phase 15%
Zinc powder 1%
Organic carrier 14%；
Function is mutually by the composite powder being made up of nanometer silver powder, ruthenic oxide powder, the particle size values of nanometer silver powder is 20nm-30nm, the particle size values of ruthenic oxide powder is 1 μm-2 μm, and function middle nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder mutually are followed successively by 90%, 10%；
Inorganic adhesive is leadless crystallizing glass powder mutually, and leadless crystallizing glass powder is by SiO2、CaO、B2O3、A12O3、Bi2O3、Sm2O3、ZrO2The mixture formed, inorganic adhesive middle SiO mutually2、CaO、B2O3、A12O3、Bi2O3、Sm2O3、ZrO2The weight portion of seven kinds of materials is followed successively by 45%, 12%, 13%, 14%, 11%, 3%, 2%；
The mixture that organic carrier is N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, polydimethylsiloxane, castor oil hydrogenated are formed, in organic carrier, N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, polydimethylsiloxane, the weight portion of five kinds of materials of castor oil hydrogenated are followed successively by 80%, 16%, 2%, 1%, 1%.
By above-mentioned material proportion, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment two has the following advantages, particularly as follows:
1, SiO is selected2、CaO、B2O3、A12O3、Bi2O3、Sm2O3、ZrO2Prepare leadless crystallizing glass powder body system, and then avoid lead research and development, use and be discarded after injury that environment, human body are caused, high-power resistance or heating manufacturing urgent problem can be solved, meet RoHS Directive (2002/95/EC) requirement；2, rare earth oxide Sm2O3Microcrystal glass material and the sintering character of function phase, microstructure, consistency, phase composition and physical and mechanical property can be changed greatly, the compatibility of slurry, wettability, hot property, electrical property, manufacturability, adaptability is made to have a significant improvement raising, while regulation resistance slurry sintering temperature, effectively regulate sheet resistance scope and the temperature-coefficient of electrical resistance of resistive layer；3, silver-ruthenic oxide composite powder and the organic carrier of leadless crystallizing glass powder body system with proper proportion are combined, add sintering aids simultaneously, prepare medium or low resistance section, the coefficient of expansion of resistor track layer mates with stainless steel substrate and the rare earth thick film circuit resistance slurry of good combination；4, printing characteristic based on stainless steel substrate medium or low resistance section rare earth thick film circuit resistance slurry and burn till characteristic good, reheating rate of change is less than 5%, the preparation of this resistance slurry have that sheet resistance is low and adjustable, temperature-coefficient of electrical resistance is low and adjustable and with the advantage such as the compatibility having had based on stainless steel substrate thick film circuit dielectric paste, electrocondution slurry.
Wherein, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment two can use following preparation method to be prepared from, concrete, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, include following processing step, particularly as follows:
A, prepare inorganic adhesive phase: by SiO2、CaO、B2O3、A12O3、Bi2O3、Sm2O3、ZrO2Mix homogeneously in three-dimensional material mixer, SiO in mixture2、CaO、B2O3、A12O3、Bi2O3、Sm2O3、ZrO2In the weight portion of seven kinds of materials be followed successively by 45%, 12%, 13%, 14%, 11%, 3%, 2%, then at smelting furnace melting after mix homogeneously, smelting temperature is 1400 DEG C, temperature retention time is i.e. to obtain glass melts in 4 hours, then glass melts carried out shrend and obtain glass, finally with distilled water for medium to glass ball milling 6 hours, i.e. obtain the leadless crystallizing glass powder that particle size values is 3 μm-5 μm；
B, preparation function phase: by nanometer silver powder, ruthenic oxide powder mix homogeneously to prepare silver-ruthenic oxide composite powder, in silver-ruthenic oxide composite powder, nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder are followed successively by 96%, 4%, the particle size values of nanometer silver powder is 20nm-30nm, and the particle size values of ruthenic oxide powder is 1 μm-2 μm；
C, prepare organic carrier: dissolve to obtain organic carrier in 80 DEG C of water-baths by N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, polydimethylsiloxane, castor oil hydrogenated, and by adjusting the content of polyvinylpyrrolidone, so that the viscosity of organic carrier controls in the range of 200mPa s-300mPa s, wherein, in organic carrier, N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, polydimethylsiloxane, the weight portion of five kinds of materials of castor oil hydrogenated are followed successively by 80%, 16%, 2%, 1%, 1%；
Prepared by d, resistance slurry: by function phase, inorganic adhesive phase, zinc powder, organic carrier dispersed with stirring in container, carry out three-roll rolling the most again, to obtain the resistance slurry that range of viscosities is 150Pa s-200Pa s, wherein, in resistance slurry, function phase, inorganic adhesive phase, zinc powder, the weight portion of four kinds of materials of organic carrier are followed successively by 70%, 15%, 1%, 14%.
Being designed by above-mentioned processing step, this high-power low-temperature coefficient thick-film heating element resistance slurry preparation method production can prepare the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment two effectively.
Embodiment three, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry, include the material of following weight portion, particularly as follows:
Function phase 70%
Inorganic adhesive phase 15%
Aluminium powder 2.5%
Organic carrier 12.5%；
Function is mutually by the composite powder being made up of nanometer silver powder, ruthenic oxide powder, the particle size values of nanometer silver powder is 20nm-30nm, the particle size values of ruthenic oxide powder is 1 μm-2 μm, and function middle nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder mutually are followed successively by 80%, 20%；
Inorganic adhesive is leadless crystallizing glass powder mutually, and leadless crystallizing glass powder is by SiO2、CaO、B2O3、A12O3、Bi2O3、Gd2O3、P2O5The mixture formed, inorganic adhesive middle SiO mutually2、CaO、B2O3、A12O3、Bi2O3、Gd2O3、P2O5The weight portion of seven kinds of materials is followed successively by 55%, 10%, 10%, 10%, 10%, 2.5%, 2.5%；
Organic carrier be N-Methyl pyrrolidone, polyvinylpyrrolidone, 1, the mixture that 4-dihydroxy sulfanilic acid, polydimethylsiloxane, castor oil hydrogenated are formed, in organic carrier, N-Methyl pyrrolidone, polyvinylpyrrolidone, Isosorbide-5-Nitrae-dihydroxy sulfanilic acid, polydimethylsiloxane, the weight portion of five kinds of materials of castor oil hydrogenated are followed successively by 80%, 17%, 1%, 1%, 1%.
By above-mentioned material proportion, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment three has the following advantages, particularly as follows:
1, SiO is selected2、CaO、B2O3、A12O3、Bi2O3、Gd2O3、P2O5Prepare leadless crystallizing glass powder body system, and then avoid lead research and development, use and be discarded after injury that environment, human body are caused, high-power resistance or heating manufacturing urgent problem can be solved, meet RoHS Directive (2002/95/EC) requirement；
2, rare earth oxide Gd2O3Microcrystal glass material and the sintering character of function phase, microstructure, consistency, phase composition and physical and mechanical property can be changed greatly, the compatibility of slurry, wettability, hot property, electrical property, manufacturability, adaptability is made to have a significant improvement raising, while regulation resistance slurry sintering temperature, effectively regulate sheet resistance scope and the temperature-coefficient of electrical resistance of resistive layer；
3, silver-ruthenic oxide composite powder and the organic carrier of leadless crystallizing glass powder body system with proper proportion are combined, add sintering aids simultaneously, prepare medium or low resistance section, the coefficient of expansion of resistor track layer mates with stainless steel substrate and the rare earth thick film circuit resistance slurry of good combination；
4, printing characteristic based on stainless steel substrate medium or low resistance section rare earth thick film circuit resistance slurry and burn till characteristic good, reheating rate of change is less than 5%, the preparation of this resistance slurry have that sheet resistance is low and adjustable, temperature-coefficient of electrical resistance is low and adjustable and with the advantage such as the compatibility having had based on stainless steel substrate thick film circuit dielectric paste, electrocondution slurry.
Wherein, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment three can use following preparation method to be prepared from, concrete, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, include following processing step, particularly as follows:
A, prepare inorganic adhesive phase: by SiO2、CaO、B2O3、A12O3、Bi2O3、Gd2O3、P2O5Mix homogeneously in three-dimensional material mixer, SiO in mixture2、CaO、B2O3、A12O3、Bi2O3、Gd2O3、P2O5In the weight portion of seven kinds of materials be followed successively by 55%, 10%, 10%, 10%, 10%, 2.5%, 2.5%, then at smelting furnace melting after mix homogeneously, smelting temperature is 1400 DEG C, temperature retention time is i.e. to obtain glass melts in 4 hours, then glass melts carried out shrend and obtain glass, finally with distilled water for medium to glass ball milling 6 hours, i.e. obtain the leadless crystallizing glass powder that particle size values is 3 μm-5 μm；
B, preparation function phase: by nanometer silver powder, ruthenic oxide powder mix homogeneously to prepare silver-ruthenic oxide composite powder, in silver-ruthenic oxide composite powder, nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder are followed successively by 97%, 3%, the particle size values of nanometer silver powder is 20nm-30nm, and the particle size values of ruthenic oxide powder is 1 μm-2 μm；
C, prepare organic carrier: by N-Methyl pyrrolidone, polyvinylpyrrolidone, 1,4-dihydroxy sulfanilic acid, polydimethylsiloxane, castor oil hydrogenated dissolve to obtain organic carrier in 80 DEG C of water-baths, and by adjusting the content of polyvinylpyrrolidone, so that the viscosity of organic carrier controls in the range of 200mPa s-300mPa s, wherein, in organic carrier, N-Methyl pyrrolidone, polyvinylpyrrolidone, Isosorbide-5-Nitrae-dihydroxy sulfanilic acid, polydimethylsiloxane, the weight portion of five kinds of materials of castor oil hydrogenated are followed successively by 80%, 17%, 1%, 1%, 1%；
Prepared by d, resistance slurry: by function phase, inorganic adhesive phase, aluminium powder, organic carrier dispersed with stirring in container, carry out three-roll rolling the most again, to obtain the resistance slurry that range of viscosities is 150Pa s-200Pa s, wherein, in resistance slurry, function phase, inorganic adhesive phase, aluminium powder, the weight portion of four kinds of materials of organic carrier are followed successively by 70%, 15%, 2.5%, 12.5%.
Being designed by above-mentioned processing step, this high-power low-temperature coefficient thick-film heating element resistance slurry preparation method production can prepare the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment three effectively.
Embodiment four, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry, include the material of following weight portion, particularly as follows:
Function phase 70%
Inorganic adhesive phase 15%
Zinc powder 2.5%
Organic carrier 12.5%；
Function is mutually by the composite powder being made up of nanometer silver powder, ruthenic oxide powder, the particle size values of nanometer silver powder is 20nm-30nm, the particle size values of ruthenic oxide powder is 1 μm-2 μm, and function middle nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder mutually are followed successively by 80%, 20%；
Inorganic adhesive is leadless crystallizing glass powder mutually, and leadless crystallizing glass powder is by SiO2、CaO、B2O3、A12O3、Bi2O3、Nd2O3、CAF2The mixture formed, inorganic adhesive middle SiO mutually2、CaO、B2O3、A12O3、Bi2O3、Nd2O3、CAF2The weight portion of seven kinds of materials is followed successively by 55%, 10%, 10%, 10%, 10%, 2.5%, 2.5%；
The mixture that organic carrier is N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, organic silicon modified by polyether, castor oil hydrogenated are formed, in organic carrier, N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, organic silicon modified by polyether, the weight portion of five kinds of materials of castor oil hydrogenated are followed successively by 80%, 17%, 1%, 1%, 1%.
By above-mentioned material proportion, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment four has the following advantages, particularly as follows:
1, SiO is selected2、CaO、B2O3、A12O3、Bi2O3、Nd2O3、CAF2Prepare leadless crystallizing glass powder body system, and then avoid lead research and development, use and be discarded after injury that environment, human body are caused, high-power resistance or heating manufacturing urgent problem can be solved, meet RoHS Directive (2002/95/EC) requirement；
2, rare earth oxide Nd2O3Microcrystal glass material and the sintering character of function phase, microstructure, consistency, phase composition and physical and mechanical property can be changed greatly, the compatibility of slurry, wettability, hot property, electrical property, manufacturability, adaptability is made to have a significant improvement raising, while regulation resistance slurry sintering temperature, effectively regulate sheet resistance scope and the temperature-coefficient of electrical resistance of resistive layer；
3, silver-ruthenic oxide composite powder and the organic carrier of leadless crystallizing glass powder body system with proper proportion are combined, add sintering aids simultaneously, prepare medium or low resistance section, the coefficient of expansion of resistor track layer mates with stainless steel substrate and the rare earth thick film circuit resistance slurry of good combination；
4, printing characteristic based on stainless steel substrate medium or low resistance section rare earth thick film circuit resistance slurry and burn till characteristic good, reheating rate of change is less than 5%, the preparation of this resistance slurry have that sheet resistance is low and adjustable, temperature-coefficient of electrical resistance is low and adjustable and with the advantage such as the compatibility having had based on stainless steel substrate thick film circuit dielectric paste, electrocondution slurry.
Wherein, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment four can use following preparation method to be prepared from, concrete, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, include following processing step, particularly as follows:
A, prepare inorganic adhesive phase: by SiO2、CaO、B2O3、A12O3、Bi2O3、Nd2O3、CAF2Mix homogeneously in three-dimensional material mixer, SiO in mixture2、CaO、B2O3、A12O3、Bi2O3、Nd2O3、CAF2In the weight portion of seven kinds of materials be followed successively by 55%, 10%, 10%, 10%, 10%, 2.5%, 2.5%, then at smelting furnace melting after mix homogeneously, smelting temperature is 1600 DEG C, temperature retention time is i.e. to obtain glass melts in 4 hours, then glass melts carried out shrend and obtain glass, finally with distilled water for medium to glass ball milling 6 hours, i.e. obtain the leadless crystallizing glass powder that particle size values is 3 μm-5 μm；
B, preparation function phase: by nanometer silver powder, ruthenic oxide powder mix homogeneously to prepare silver-ruthenic oxide composite powder, in silver-ruthenic oxide composite powder, nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder are followed successively by 95%, 5%, the particle size values of nanometer silver powder is 20nm-30nm, and the particle size values of ruthenic oxide powder is 1 μm-2 μm；
C, prepare organic carrier: dissolve to obtain organic carrier in 80 DEG C of water-baths by N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, organic silicon modified by polyether, castor oil hydrogenated, and by adjusting the content of polyvinylpyrrolidone, so that the viscosity of organic carrier controls in the range of 200mPa s-300mPa s, wherein, in organic carrier, N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, organic silicon modified by polyether, the weight portion of five kinds of materials of castor oil hydrogenated are followed successively by 80%, 17%, 1%, 1%, 1%；
Prepared by d, resistance slurry: by function phase, inorganic adhesive phase, zinc powder, organic carrier dispersed with stirring in container, carry out three-roll rolling the most again, to obtain the resistance slurry that range of viscosities is 150Pa s-200Pa s, wherein, in resistance slurry, function phase, inorganic adhesive phase, zinc powder, the weight portion of four kinds of materials of organic carrier are followed successively by 70%, 15%, 2.5%, 12.5%.
Being designed by above-mentioned processing step, this high-power low-temperature coefficient thick-film heating element resistance slurry preparation method production can prepare the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment four effectively.
Embodiment five, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry, include the material of following weight portion, particularly as follows:
Function phase 70%
Inorganic adhesive phase 15%
Aluminium powder 2.5%
Organic carrier 12.5%；
Function is mutually by the composite powder being made up of nanometer silver powder, ruthenic oxide powder, the particle size values of nanometer silver powder is 20nm-30nm, the particle size values of ruthenic oxide powder is 1 μm-2 μm, and function middle nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder mutually are followed successively by 85%, 15%；
Inorganic adhesive is leadless crystallizing glass powder mutually, and leadless crystallizing glass powder is by SiO2、CaO、B2O3、A12O3、Bi2O3、Dy2O3, the mixture that formed of ZnO, inorganic adhesive mutually in SiO2、CaO、B2O3、A12O3、Bi2O3、Dy2O3, the weight portion of seven kinds of materials of ZnO be followed successively by 55%, 10%, 10%, 10%, 10%, 2.5%, 2.5%；
The mixture that organic carrier is N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, organic silicon modified by polyether, polyamide wax are formed, in organic carrier, N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, organic silicon modified by polyether, the weight portion of five kinds of materials of polyamide wax are followed successively by 75%, 22%, 1.5%, 1%, 0.5%.
By above-mentioned material proportion, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment five has the following advantages, particularly as follows:
1, SiO is selected2、CaO、B2O3、A12O3、Bi2O3、Dy2O3, ZnO prepare leadless crystallizing glass powder body system, and then avoid lead research and development, use and be discarded after injury that environment, human body are caused, high-power resistance or heating manufacturing urgent problem can be solved, meet RoHS Directive (2002/95/EC) requirement；
2, rare earth oxide Dy2O3Microcrystal glass material and the sintering character of function phase, microstructure, consistency, phase composition and physical and mechanical property can be changed greatly, the compatibility of slurry, wettability, hot property, electrical property, manufacturability, adaptability is made to have a significant improvement raising, while regulation resistance slurry sintering temperature, effectively regulate sheet resistance scope and the temperature-coefficient of electrical resistance of resistive layer；
3, silver-ruthenic oxide composite powder and the organic carrier of leadless crystallizing glass powder body system with proper proportion are combined, add sintering aids simultaneously, prepare medium or low resistance section, the coefficient of expansion of resistor track layer mates with stainless steel substrate and the rare earth thick film circuit resistance slurry of good combination；
4, printing characteristic based on stainless steel substrate medium or low resistance section rare earth thick film circuit resistance slurry and burn till characteristic good, reheating rate of change is less than 5%, the preparation of this resistance slurry have that sheet resistance is low and adjustable, temperature-coefficient of electrical resistance is low and adjustable and with the advantage such as the compatibility having had based on stainless steel substrate thick film circuit dielectric paste, electrocondution slurry.
Wherein, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment five can use following preparation method to be prepared from, concrete, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, include following processing step, particularly as follows:
A, prepare inorganic adhesive phase: by SiO2、CaO、B2O3、A12O3、Bi2O3、Dy2O3, ZnO mix homogeneously in three-dimensional material mixer, SiO in mixture2、CaO、B2O3、A12O3、Bi2O3、Dy2O3, the weight portion of seven kinds of materials is followed successively by 55%, 10%, 10%, 10%, 10%, 2.5%, 2.5% in ZnO, then at smelting furnace melting after mix homogeneously, smelting temperature is 1600 DEG C, temperature retention time is i.e. to obtain glass melts in 5 hours, then glass melts carried out shrend and obtain glass, finally with distilled water for medium to glass ball milling 6 hours, i.e. obtain the leadless crystallizing glass powder that particle size values is 3 μm-5 μm；
B, preparation function phase: by nanometer silver powder, ruthenic oxide powder mix homogeneously to prepare silver-ruthenic oxide composite powder, in silver-ruthenic oxide composite powder, nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder are followed successively by 96%, 4%, the particle size values of nanometer silver powder is 20nm-30nm, and the particle size values of ruthenic oxide powder is 1 μm-2 μm；
C, prepare organic carrier: dissolve to obtain organic carrier in 80 DEG C of water-baths by N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, organic silicon modified by polyether, polyamide wax, and by adjusting the content of polyvinylpyrrolidone, so that the viscosity of organic carrier controls in the range of 200mPa s-300mPa s, wherein, in organic carrier, N-Methyl pyrrolidone, polyvinylpyrrolidone, polymethyl acid amide, organic silicon modified by polyether, the weight portion of five kinds of materials of polyamide wax are followed successively by 75%, 22%, 1.5%, 1%, 0.5%；
Prepared by d, resistance slurry: by function phase, inorganic adhesive phase, aluminium powder, organic carrier dispersed with stirring in container, carry out three-roll rolling the most again, to obtain the resistance slurry that range of viscosities is 150Pa s-200Pa s, wherein, in resistance slurry, function phase, inorganic adhesive phase, aluminium powder, the weight portion of four kinds of materials of organic carrier are followed successively by 70%, 15%, 2.5%, 12.5%.
Being designed by above-mentioned processing step, this high-power low-temperature coefficient thick-film heating element resistance slurry preparation method production can prepare the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment five effectively.
Embodiment six, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry, include the material of following weight portion, particularly as follows:
Function phase 70%
Inorganic adhesive phase 15%
Zinc powder 2.5%
Organic carrier 12.5%；
Function is mutually by the composite powder being made up of nanometer silver powder, ruthenic oxide powder, the particle size values of nanometer silver powder is 20nm-30nm, the particle size values of ruthenic oxide powder is 1 μm-2 μm, and function middle nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder mutually are followed successively by 85%, 15%；
Inorganic adhesive is leadless crystallizing glass powder mutually, and leadless crystallizing glass powder is by SiO2、CaO、B2O3、A12O3、Bi2O3、Eu2O3, the mixture that formed of ZnO, inorganic adhesive mutually in SiO2、CaO、B2O3、A12O3、Bi2O3、Eu2O3, the weight portion of seven kinds of materials of ZnO be followed successively by 55%, 10%, 10%, 10%, 10%, 2.5%, 2.5%；
The mixture that organic carrier is N-Methyl pyrrolidone, polyvinyl butyral resin, polymethyl acid amide, organic silicon modified by polyether, polyamide wax are formed, in organic carrier, N-Methyl pyrrolidone, polyvinyl butyral resin, polymethyl acid amide, organic silicon modified by polyether, the weight portion of five kinds of materials of polyamide wax are followed successively by 75%, 22%, 1%, 1%, 1%.
By above-mentioned material proportion, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment six has the following advantages, particularly as follows:
1, SiO is selected2、CaO、B2O3、A12O3、Bi2O3、Eu2O3, ZnO prepare leadless crystallizing glass powder body system, and then avoid lead research and development, use and be discarded after injury that environment, human body are caused, high-power resistance or heating manufacturing urgent problem can be solved, meet RoHS Directive (2002/95/EC) requirement；
2, rare earth oxide Eu2O3Microcrystal glass material and the sintering character of function phase, microstructure, consistency, phase composition and physical and mechanical property can be changed greatly, the compatibility of slurry, wettability, hot property, electrical property, manufacturability, adaptability is made to have a significant improvement raising, while regulation resistance slurry sintering temperature, effectively regulate sheet resistance scope and the temperature-coefficient of electrical resistance of resistive layer；
3, silver-ruthenic oxide composite powder and the organic carrier of leadless crystallizing glass powder body system with proper proportion are combined, add sintering aids simultaneously, prepare medium or low resistance section, the coefficient of expansion of resistor track layer mates with stainless steel substrate and the rare earth thick film circuit resistance slurry of good combination；
4, printing characteristic based on stainless steel substrate medium or low resistance section rare earth thick film circuit resistance slurry and burn till characteristic good, reheating rate of change is less than 5%, the preparation of this resistance slurry have that sheet resistance is low and adjustable, temperature-coefficient of electrical resistance is low and adjustable and with the advantage such as the compatibility having had based on stainless steel substrate thick film circuit dielectric paste, electrocondution slurry.
Wherein, the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment six can use following preparation method to be prepared from, concrete, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, a kind of high-power low-temperature coefficient thick-film heating element resistance slurry preparation method, include following processing step, particularly as follows:
A, prepare inorganic adhesive phase: by SiO2、CaO、B2O3、A12O3、Bi2O3、Eu2O3, ZnO mix homogeneously in three-dimensional material mixer, SiO in mixture2、CaO、B2O3、A12O3、Bi2O3、Eu2O3, the weight portion of seven kinds of materials is followed successively by 55%, 10%, 10%, 10%, 10%, 2.5%, 2.5% in ZnO, then at smelting furnace melting after mix homogeneously, smelting temperature is 1600 DEG C, temperature retention time is i.e. to obtain glass melts in 5 hours, then glass melts carried out shrend and obtain glass, finally with distilled water for medium to glass ball milling 6 hours, i.e. obtain the leadless crystallizing glass powder that particle size values is 3 μm-5 μm；
B, preparation function phase: by nanometer silver powder, ruthenic oxide powder mix homogeneously to prepare silver-ruthenic oxide composite powder, in silver-ruthenic oxide composite powder, nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder are followed successively by 98%, 2%, the particle size values of nanometer silver powder is 20nm-30nm, and the particle size values of ruthenic oxide powder is 1 μm-2 μm；
C, prepare organic carrier: dissolve to obtain organic carrier in 80 DEG C of water-baths by N-Methyl pyrrolidone, polyvinyl butyral resin, polymethyl acid amide, organic silicon modified by polyether, polyamide wax, and by adjusting the content of polyvinyl butyral resin, so that the viscosity of organic carrier controls in the range of 200mPa s-300mPa s, wherein, in organic carrier, N-Methyl pyrrolidone, polyvinyl butyral resin, polymethyl acid amide, organic silicon modified by polyether, the weight portion of five kinds of materials of polyamide wax are followed successively by 75%, 22%, 1%, 1%, 1%；
Prepared by d, resistance slurry: by function phase, inorganic adhesive phase, zinc powder, organic carrier dispersed with stirring in container, carry out three-roll rolling the most again, to obtain the resistance slurry that range of viscosities is 150Pa s-200Pa s, wherein, in resistance slurry, function phase, inorganic adhesive phase, zinc powder, the weight portion of four kinds of materials of organic carrier are followed successively by 70%, 15%, 2.5%, 12.5%.
Being designed by above-mentioned processing step, this high-power low-temperature coefficient thick-film heating element resistance slurry preparation method production can prepare the high-power low-temperature coefficient thick-film heating element resistance slurry of the present embodiment six effectively.
Above content is only presently preferred embodiments of the present invention, for those of ordinary skill in the art, according to the thought of the present invention, the most all will change, and this specification content should not be construed as limitation of the present invention.
Claims (2)
1. a high-power low-temperature coefficient thick-film heating element resistance slurry, it is characterised in that include the material of following weight portion, particularly as follows:
Function phase 60%-70%
Inorganic adhesive phase 10%-15%
Sintering aids 0.5%-5%
Organic carrier 10%-29.5%；
Function mutually by the composite powder being made up of nanometer silver powder, ruthenic oxide powder, function mutually in nanometer silver powder, the weight portion of two kinds of materials of ruthenic oxide powder be followed successively by 80%-90%, 10%-20%；
Inorganic adhesive is leadless crystallizing glass powder mutually, and leadless crystallizing glass powder is by SiO2、CaO、B2O3、A12O3、Bi2O3, the mixture that formed of rare earth oxide, Nucleating Agent, inorganic adhesive mutually in SiO2、CaO、B2O3、A12O3、Bi2O3, rare earth oxide, the weight portion of seven kinds of materials of Nucleating Agent be followed successively by 20%-70%, 10%-50%, 1%-15%, 5%-30%, 10%-30%, 1%-10%, 1%-10%；
Described Nucleating Agent is TiO2、ZrO2、MoO3、Fe2O3、CaF2、P2O5, the mixture that formed of a kind of or at least two in ZnO；
Described rare earth oxide is CeO2、Sm2O3、Gd2O3、Nd2O3、Dy2O3、Eu2O3In the mixture that formed of a kind of or at least two；
The mixture that described sintering aids is zinc, a kind of or at least two in stannum, aluminum, cobalt, antimony, zinc compound, tin compound, aluminium compound, cobalt compound, antimonial is formed；
The mixture that organic carrier is organic solvent, macromolecule thickener, dispersant, defoamer, thixotropic agent are formed, in organic carrier, organic solvent, macromolecule thickener, dispersant, defoamer, the weight portion of five kinds of materials of thixotropic agent are followed successively by 70%-80%, 15%-20%, 1%-5%, 1%-5%, 1%-5%；
The mixture that described organic solvent is terpineol, a kind of or at least two in butyl carbitol, butyl carbitol acetate, tributyl citrate, GBL, mixed dibasic acid ester, N-Methyl pyrrolidone is formed；
The mixture that described macromolecule thickener is ethyl cellulose, a kind of or at least two in hydroxyethyl cellulose, carboxymethyl cellulose, NC Nitroncellulose, polyvinyl alcohol, polyvinyl butyral resin, polyvinylpyrrolidone is formed；
The mixture that described dispersant is triammonium citrate, a kind of or at least two in polymethyl acid amide, 1,4-dihydroxy sulfanilic acid is formed；
Described defoamer is the one in polydimethylsiloxane, organic silicon modified by polyether；
Described thixotropic agent is the one in castor oil hydrogenated, polyamide wax；
The particle size values of described leadless crystallizing glass powder is 3 μm-5 μm, and the particle size values of nanometer silver powder is 20nm-30nm, and the particle size values of ruthenic oxide powder is 1 μm-2 μm.
2. the preparation method of a high-power low-temperature coefficient thick-film heating element resistance slurry as claimed in claim 1, it is characterised in that include following processing step, particularly as follows:
A, prepare inorganic adhesive phase: by SiO2、CaO、B2O3、A12O3、Bi2O3, rare earth oxide, Nucleating Agent mix homogeneously in three-dimensional material mixer, then at smelting furnace melting after mix homogeneously, smelting temperature is 1200 DEG C-1600 DEG C, temperature retention time is i.e. to obtain glass melts in 3-6 hour, then glass melts carried out shrend and obtain glass, finally with distilled water for medium to glass ball milling 4-6 hour, i.e. obtain the leadless crystallizing glass powder that particle size values is 3 μm-5 μm；
B, preparation function phase: by nanometer silver powder, ruthenic oxide powder mix homogeneously to prepare silver-ruthenic oxide composite powder；
C, prepare organic carrier: by organic solvent, macromolecule thickener, dispersant, defoamer, thixotropic agent dissolve to obtain organic carrier in 80 DEG C of water-baths, and by adjusting the content of macromolecule thickener, so that the viscosity of organic carrier controls in the range of 200mPa s-300mPa s；
Prepared by d, resistance slurry: by function phase, inorganic adhesive phase, sintering aids, organic carrier dispersed with stirring in container, carry out three-roll rolling the most again, to obtain the range of viscosities resistance slurry for 200Pa s ± 20Pa s.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110085346A (en) * | 2019-04-30 | 2019-08-02 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of heating resistor slurry and its preparation method and application of adaptation nitridation silicon substrate |
| CN110880376A (en) * | 2019-12-18 | 2020-03-13 | 广东顺德弘暻电子有限公司 | Thick film dielectric paste with high thermal expansion coefficient for stainless steel base material and preparation method thereof |
| CN112967833A (en) * | 2021-02-04 | 2021-06-15 | 上海日御新材料科技有限公司 | Organic carrier for solar cell electrode slurry and preparation method thereof |
| CN113772959A (en) * | 2021-09-14 | 2021-12-10 | 黄山市晶特美新材料有限公司 | High-reflection low-temperature crystallized glass slurry for double-glass solar cell module and preparation method thereof |
-
2016
- 2016-04-07 CN CN201610212565.5A patent/CN105825910A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110085346A (en) * | 2019-04-30 | 2019-08-02 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of heating resistor slurry and its preparation method and application of adaptation nitridation silicon substrate |
| CN110880376A (en) * | 2019-12-18 | 2020-03-13 | 广东顺德弘暻电子有限公司 | Thick film dielectric paste with high thermal expansion coefficient for stainless steel base material and preparation method thereof |
| CN112967833A (en) * | 2021-02-04 | 2021-06-15 | 上海日御新材料科技有限公司 | Organic carrier for solar cell electrode slurry and preparation method thereof |
| CN113772959A (en) * | 2021-09-14 | 2021-12-10 | 黄山市晶特美新材料有限公司 | High-reflection low-temperature crystallized glass slurry for double-glass solar cell module and preparation method thereof |
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Application publication date: 20160803 |