CN105778527A - Electronic product packaging film material - Google Patents
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- CN105778527A CN105778527A CN201610368263.7A CN201610368263A CN105778527A CN 105778527 A CN105778527 A CN 105778527A CN 201610368263 A CN201610368263 A CN 201610368263A CN 105778527 A CN105778527 A CN 105778527A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
- C08L93/04—Rosin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2393/00—Characterised by the use of natural resins; Derivatives thereof
- C08J2393/04—Rosin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2427/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2427/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2427/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08J2427/06—Homopolymers or copolymers of vinyl chloride
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
- C08L2203/162—Applications used for films sealable films
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
The invention relates to an electronic product packaging film material which is prepared from, by mass, 16-20 parts of PVC, 18-22 parts of di-iso-decylphthalate, 14-18 parts of ammonium polyphosphate, 12-16 parts of polysulfide rubber, 18-22 parts of triallyl cyanurate, 14-18 parts of acetyl trioctyl citrate, 12-16 parts of pentaerythritol, 18-22 parts of dilauryl thiodipropionate, 14-18 parts of tert-Butyl peroxy benzoate, 12-16 parts of bisphenol A polycarbonate, 18-22 parts of aluminum oxide powder, 14-18 parts of dibasic lead phthalate, 14-18 parts of polyamide, 12-16 parts of bentonite powder, 18-22 parts of rosin resin, 14-18 parts of urethane acrylate, 12-16 parts of cerium oxide powder and 18-22 parts of potassium oleate. The preparation method of the electronic product packaging film material is simple, the prepared product has the excellent fire resistance, acid-base resistance and waterproof and antibacterial performance and is suitable for being used in various fields, and the product performance is improved.
Description
Technical field
The present invention relates to a kind of electronic product packaging thin-film material, belong to electronic product packaging technical field.
Background technology
The Related product that electronic product is is working foundation with electric energy, specifically includes that phone, television set, video disc player (VCD, SVCD, DVD), videocorder, video camera, radio, radio cassette player, combination sound box, compact disc player (CD), computer, mobile communication product etc..In these electronic product preparation process, it is necessary to adopt suitable mode to give subpackage and process.
Summary of the invention
It is an object of the invention to provide a kind of electronic product packaging thin-film material, in order to realize the function of electronic product packaging thin-film material better.
To achieve these goals, technical scheme is as follows.
nullA kind of electronic product packaging thin-film material，It is made up of the component of following mass fraction: PVC16～20 part、Diisooctyl phthalate 18～22 parts、APP 14～18 parts、Thiorubber. 12～16 parts、Triallyl cyanurate 18～22 parts、ATOC 14～18 parts、Tetramethylolmethane 12～16 parts、Dilauryl thiodipropionate 18～22 parts、Peroxidized t-butyl perbenzoate 14～18 parts、Bisphenol A polycarbonate 12～16 parts、Alumina powder 18～22 parts、Dythal 14～18 parts、Polyamide 14～18 parts、12～16 parts of bentonite powder、Rosin resin 18～22 parts、Urethane acrylate 14～18 parts、Ceria oxide powder 12～16 parts、Oleic acid potash soap 18～22 parts.
Further, above-mentioned electronic product packaging thin-film material, it is made up of the component of following mass fraction: PVC16 part, diisooctyl phthalate 18 parts, APP 14 parts, thiorubber. 12 parts, triallyl cyanurate 18 parts, ATOC 14 parts, tetramethylolmethane 12 parts, dilauryl thiodipropionate 18 parts, peroxidized t-butyl perbenzoate 14 parts, bisphenol A polycarbonate 12 parts, alumina powder 18 parts, Dythal 14 parts, polyamide 14 parts, 12 parts of bentonite powder, rosin resin 18 parts, urethane acrylate 14 parts, ceria oxide powder 12 parts, oleic acid potash soap 18 parts.
Further, above-mentioned electronic product packaging thin-film material, it is made up of the component of following mass fraction: PVC18 part, diisooctyl phthalate 20 parts, APP 16 parts, thiorubber. 14 parts, triallyl cyanurate 20 parts, ATOC 16 parts, tetramethylolmethane 14 parts, dilauryl thiodipropionate 20 parts, peroxidized t-butyl perbenzoate 16 parts, bisphenol A polycarbonate 14 parts, alumina powder 20 parts, Dythal 16 parts, polyamide 16 parts, 14 parts of bentonite powder, rosin resin 20 parts, urethane acrylate 16 parts, ceria oxide powder 14 parts, oleic acid potash soap 20 parts.
Further, above-mentioned electronic product packaging thin-film material, it is made up of the component of following mass fraction: PVC20 part, diisooctyl phthalate 22 parts, APP 18 parts, thiorubber. 16 parts, triallyl cyanurate 22 parts, ATOC 18 parts, tetramethylolmethane 16 parts, dilauryl thiodipropionate 22 parts, peroxidized t-butyl perbenzoate 18 parts, bisphenol A polycarbonate 16 parts, alumina powder 22 parts, Dythal 18 parts, polyamide 18 parts, 16 parts of bentonite powder, rosin resin 22 parts, urethane acrylate 18 parts, ceria oxide powder 16 parts, oleic acid potash soap 22 parts.
Further, described ceria oxide powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 30～50 orders, 50～80 orders, 80～100 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 3～7: 4～8: 1.
Further, described alumina powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 30～50 orders, 50～80 orders, 80～100 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 3～8: 2～8: 1.
Further, the viscosity of described bisphenol A polycarbonate is 12000～14000mpa.s at 25 DEG C.
Further, described bentonite powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 20～50 orders, 50～70 orders, 70～90 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 2～4: 3～5: 1.
Further, the viscosity of described rosin resin is 8000～10000mpa.s at 25 DEG C.
Further, above-mentioned electronic product packaging thin-film material preparation method step is as follows:
(1) PVC of described mass fraction, diisooctyl phthalate, APP, thiorubber., triallyl cyanurate, ATOC, bisphenol A polycarbonate, alumina powder, Dythal, polyamide, bentonite powder, oleic acid potash soap are mixed, ultrasonic high speed dispersion, ultrasonic frequency is 20～40KHz, rate of dispersion 5000～5400r/min, jitter time is 30～60min；
(2) adding the tetramethylolmethane of described mass fraction, dilauryl thiodipropionate, peroxidized t-butyl perbenzoate, ultrasonic high speed dispersion, ultrasonic frequency is 20～35KHz, rate of dispersion 4800～5200r/min, and jitter time is 30～50min；
(3) adding the rosin resin of described mass fraction, urethane acrylate, ceria oxide powder, ultrasonic high speed dispersion, ultrasonic frequency is 20～30KHz, rate of dispersion 4600～4800r/min, and jitter time is 20～40min；This product is prepared after mix homogeneously.
This beneficial effect of the invention is in that: this electronic product packaging thin-film material process of preparing is simple, and prepared product has comparatively superior fire-retardant, acid and alkali-resistance, water-proof antibiotic performance, is adapted at multiple fields and uses, improves properties of product.
Detailed description of the invention
Below in conjunction with embodiment, the specific embodiment of the present invention is described, in order to be better understood from the present invention.
Embodiment 1
Electronic product packaging thin-film material in the present embodiment, it is made up of the component of following mass fraction: PVC16 part, diisooctyl phthalate 18 parts, APP 14 parts, thiorubber. 12 parts, triallyl cyanurate 18 parts, ATOC 14 parts, tetramethylolmethane 12 parts, dilauryl thiodipropionate 18 parts, peroxidized t-butyl perbenzoate 14 parts, bisphenol A polycarbonate 12 parts, alumina powder 18 parts, Dythal 14 parts, polyamide 14 parts, 12 parts of bentonite powder, rosin resin 18 parts, urethane acrylate 14 parts, ceria oxide powder 12 parts, oleic acid potash soap 18 parts.
Described ceria oxide powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 30～50 orders, 50～80 orders, 80～100 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 3: 4: 1.
Described alumina powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 30～50 orders, 50～80 orders, 80～100 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 3: 2: 1.
The viscosity of described bisphenol A polycarbonate is 12000mpa.s at 25 DEG C.
Described bentonite powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 20～50 orders, 50～70 orders, 70～90 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 2: 3: 1.
The viscosity of described rosin resin is 8000mpa.s at 25 DEG C.
Above-mentioned electronic product packaging thin-film material preparation method step is as follows:
(1) PVC of described mass fraction, diisooctyl phthalate, APP, thiorubber., triallyl cyanurate, ATOC, bisphenol A polycarbonate, alumina powder, Dythal, polyamide, bentonite powder, oleic acid potash soap are mixed, ultrasonic high speed dispersion, ultrasonic frequency is 20kHz, rate of dispersion 5400r/min, jitter time is 60min；
(2) adding the tetramethylolmethane of described mass fraction, dilauryl thiodipropionate, peroxidized t-butyl perbenzoate, ultrasonic high speed dispersion, ultrasonic frequency is 20kHz, rate of dispersion 5200r/min, and jitter time is 50min；
(3) adding the rosin resin of described mass fraction, urethane acrylate, ceria oxide powder, ultrasonic high speed dispersion, ultrasonic frequency is 20kHz, rate of dispersion 4800r/min, and jitter time is 40min；This product is prepared after mix homogeneously.
Embodiment 2
Electronic product packaging thin-film material in the present embodiment, it is made up of the component of following mass fraction: PVC18 part, diisooctyl phthalate 20 parts, APP 16 parts, thiorubber. 14 parts, triallyl cyanurate 20 parts, ATOC 16 parts, tetramethylolmethane 14 parts, dilauryl thiodipropionate 20 parts, peroxidized t-butyl perbenzoate 16 parts, bisphenol A polycarbonate 14 parts, alumina powder 20 parts, Dythal 16 parts, polyamide 16 parts, 14 parts of bentonite powder, rosin resin 20 parts, urethane acrylate 16 parts, ceria oxide powder 14 parts, oleic acid potash soap 20 parts.
Described ceria oxide powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 30～50 orders, 50～80 orders, 80～100 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 5: 6: 1.
Described alumina powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 30～50 orders, 50～80 orders, 80～100 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 5: 5: 1.
The viscosity of described bisphenol A polycarbonate is 13000mpa.s at 25 DEG C.
Described bentonite powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 20～50 orders, 50～70 orders, 70～90 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 3: 4: 1.
The viscosity of described rosin resin is 9000mpa.s at 25 DEG C.
Above-mentioned electronic product packaging thin-film material preparation method step is as follows:
(1) PVC of described mass fraction, diisooctyl phthalate, APP, thiorubber., triallyl cyanurate, ATOC, bisphenol A polycarbonate, alumina powder, Dythal, polyamide, bentonite powder, oleic acid potash soap are mixed, ultrasonic high speed dispersion, ultrasonic frequency is 30kHz, rate of dispersion 5200r/min, jitter time is 45min；
(2) adding the tetramethylolmethane of described mass fraction, dilauryl thiodipropionate, peroxidized t-butyl perbenzoate, ultrasonic high speed dispersion, ultrasonic frequency is 27kHz, rate of dispersion 5000r/min, and jitter time is 40min；
(3) adding the rosin resin of described mass fraction, urethane acrylate, ceria oxide powder, ultrasonic high speed dispersion, ultrasonic frequency is 25kHz, rate of dispersion 4700r/min, and jitter time is 30min；This product is prepared after mix homogeneously.
Embodiment 3
Electronic product packaging thin-film material in the present embodiment, it is made up of the component of following mass fraction: PVC20 part, diisooctyl phthalate 22 parts, APP 18 parts, thiorubber. 16 parts, triallyl cyanurate 22 parts, ATOC 18 parts, tetramethylolmethane 16 parts, dilauryl thiodipropionate 22 parts, peroxidized t-butyl perbenzoate 18 parts, bisphenol A polycarbonate 16 parts, alumina powder 22 parts, Dythal 18 parts, polyamide 18 parts, 16 parts of bentonite powder, rosin resin 22 parts, urethane acrylate 18 parts, ceria oxide powder 16 parts, oleic acid potash soap 22 parts.
Described ceria oxide powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 30～50 orders, 50～80 orders, 80～100 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 7: 8: 1.
Described alumina powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 30～50 orders, 50～80 orders, 80～100 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 8: 8: 1.
The viscosity of described bisphenol A polycarbonate is 14000mpa.s at 25 DEG C.
Described bentonite powder is made up of the powder body of three kinds of particle diameter order numbers, and its particle diameter order number respectively 20～50 orders, 50～70 orders, 70～90 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 4: 5: 1.
The viscosity of described rosin resin is 10000mpa.s at 25 DEG C.
Above-mentioned electronic product packaging thin-film material preparation method step is as follows:
(1) PVC of described mass fraction, diisooctyl phthalate, APP, thiorubber., triallyl cyanurate, ATOC, bisphenol A polycarbonate, alumina powder, Dythal, polyamide, bentonite powder, oleic acid potash soap are mixed, ultrasonic high speed dispersion, ultrasonic frequency is 40kHz, rate of dispersion 5000r/min, jitter time is 30min；
(2) adding the tetramethylolmethane of described mass fraction, dilauryl thiodipropionate, peroxidized t-butyl perbenzoate, ultrasonic high speed dispersion, ultrasonic frequency is 35kHz, rate of dispersion 4800r/min, and jitter time is 30min；
(3) adding the rosin resin of described mass fraction, urethane acrylate, ceria oxide powder, ultrasonic high speed dispersion, ultrasonic frequency is 30kHz, rate of dispersion 4600r/min, and jitter time is 20min；This product is prepared after mix homogeneously.
Carrying out performance measurement for the product in embodiment 1, embodiment 2 and embodiment 3 and certain commercially available prod, measured data are as shown in table 1.Fire protection flame retarding level estimate adopts UL94 standard.
Table 1 the performance test results
Visible, product of the present invention has corrosion-resistant, fire protection flame retarding, waterproof, anti-microbial property preferably.
The above is the preferred embodiment of the present invention; it should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention; can also making some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
- null1. an electronic product packaging thin-film material，It is characterized in that: be made up of the component of following mass fraction: PVC16～20 part、Diisooctyl phthalate 18～22 parts、APP 14～18 parts、Thiorubber. 12～16 parts、Triallyl cyanurate 18～22 parts、ATOC 14～18 parts、Tetramethylolmethane 12～16 parts、Dilauryl thiodipropionate 18～22 parts、Peroxidized t-butyl perbenzoate 14～18 parts、Bisphenol A polycarbonate 12～16 parts、Alumina powder 18～22 parts、Dythal 14～18 parts、Polyamide 14～18 parts、12～16 parts of bentonite powder、Rosin resin 18～22 parts、Urethane acrylate 14～18 parts、Ceria oxide powder 12～16 parts、Oleic acid potash soap 18～22 parts.
- 2. electronic product packaging thin-film material according to claim 1, it is characterized in that: described electronic product packaging thin-film material is made up of the component of following mass fraction: PVC16 part, diisooctyl phthalate 18 parts, APP 14 parts, thiorubber. 12 parts, triallyl cyanurate 18 parts, ATOC 14 parts, tetramethylolmethane 12 parts, dilauryl thiodipropionate 18 parts, peroxidized t-butyl perbenzoate 14 parts, bisphenol A polycarbonate 12 parts, alumina powder 18 parts, Dythal 14 parts, polyamide 14 parts, 12 parts of bentonite powder, rosin resin 18 parts, urethane acrylate 14 parts, ceria oxide powder 12 parts, oleic acid potash soap 18 parts.
- 3. electronic product packaging thin-film material according to claim 1, it is characterized in that: described electronic product packaging thin-film material is made up of the component of following mass fraction: PVC18 part, diisooctyl phthalate 20 parts, APP 16 parts, thiorubber. 14 parts, triallyl cyanurate 20 parts, ATOC 16 parts, tetramethylolmethane 14 parts, dilauryl thiodipropionate 20 parts, peroxidized t-butyl perbenzoate 16 parts, bisphenol A polycarbonate 14 parts, alumina powder 20 parts, Dythal 16 parts, polyamide 16 parts, 14 parts of bentonite powder, rosin resin 20 parts, urethane acrylate 16 parts, ceria oxide powder 14 parts, oleic acid potash soap 20 parts.
- 4. electronic product packaging thin-film material according to claim 1, it is characterized in that: described electronic product packaging thin-film material is made up of the component of following mass fraction: PVC20 part, diisooctyl phthalate 22 parts, APP 18 parts, thiorubber. 16 parts, triallyl cyanurate 22 parts, ATOC 18 parts, tetramethylolmethane 16 parts, dilauryl thiodipropionate 22 parts, peroxidized t-butyl perbenzoate 18 parts, bisphenol A polycarbonate 16 parts, alumina powder 22 parts, Dythal 18 parts, polyamide 18 parts, 16 parts of bentonite powder, rosin resin 22 parts, urethane acrylate 18 parts, ceria oxide powder 16 parts, oleic acid potash soap 22 parts.
- 5. electronic product packaging thin-film material according to claim 1, it is characterized in that: described ceria oxide powder is made up of the powder body of three kinds of particle diameter order numbers, its particle diameter order number respectively 30～50 orders, 50～80 orders, 80～100 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 3～7: 4～8: 1.
- 6. electronic product packaging thin-film material according to claim 1, it is characterized in that: described alumina powder is made up of the powder body of three kinds of particle diameter order numbers, its particle diameter order number respectively 30～50 orders, 50～80 orders, 80～100 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 3～8: 2～8: 1.
- 7. electronic product packaging thin-film material according to claim 1, it is characterised in that: the viscosity of described bisphenol A polycarbonate is 12000～14000mpa.s at 25 DEG C.
- 8. electronic product packaging thin-film material according to claim 1, it is characterized in that: described bentonite powder is made up of the powder body of three kinds of particle diameter order numbers, its particle diameter order number respectively 20～50 orders, 50～70 orders, 70～90 orders, the mixing quality ratio of above-mentioned three kinds of powder body is 2～4: 3～5: 1.
- 9. electronic product packaging thin-film material according to claim 1, it is characterised in that: the viscosity of described rosin resin is 8000～10000mpa.s at 25 DEG C.
- 10. electronic product packaging thin-film material according to claim 1, it is characterised in that: described electronic product packaging thin-film material preparation method step is as follows:(1) PVC of described mass fraction, diisooctyl phthalate, APP, thiorubber., triallyl cyanurate, ATOC, bisphenol A polycarbonate, alumina powder, Dythal, polyamide, bentonite powder, oleic acid potash soap are mixed, ultrasonic high speed dispersion, ultrasonic frequency is 20～40KHz, rate of dispersion 5000～5400r/min, jitter time is 30～60min；(2) adding the tetramethylolmethane of described mass fraction, dilauryl thiodipropionate, peroxidized t-butyl perbenzoate, ultrasonic high speed dispersion, ultrasonic frequency is 20～35KHz, rate of dispersion 4800～5200r/min, and jitter time is 30～50min；(3) adding the rosin resin of described mass fraction, urethane acrylate, ceria oxide powder, ultrasonic high speed dispersion, ultrasonic frequency is 20～30KHz, rate of dispersion 4600～4800r/min, and jitter time is 20～40min；This product is prepared after mix homogeneously.
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| CN201610368263.7A CN105778527A (en) | 2016-05-27 | 2016-05-27 | Electronic product packaging film material |
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| CN201610368263.7A CN105778527A (en) | 2016-05-27 | 2016-05-27 | Electronic product packaging film material |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106189187A (en) * | 2016-07-29 | 2016-12-07 | 华蓥伟创立电子科技有限公司 | A kind of earphone encapsulated plastic material |
| CN106243679A (en) * | 2016-07-29 | 2016-12-21 | 华蓥友达精密模具制造有限公司 | A kind of charger encapsulating material |
| CN107200960A (en) * | 2017-06-20 | 2017-09-26 | 苏州奥宇包装科技有限公司 | A kind of preparation method of waterproofing packing PVC film |
| CN107841019A (en) * | 2017-10-25 | 2018-03-27 | 高兴国 | A kind of use for electronic products thin-film material and preparation method thereof |
| CN109679319A (en) * | 2018-11-12 | 2019-04-26 | 许文强 | A kind of preparation method of the electronic package material of high thermal conductivity low thermal expansion |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106189187A (en) * | 2016-07-29 | 2016-12-07 | 华蓥伟创立电子科技有限公司 | A kind of earphone encapsulated plastic material |
| CN106243679A (en) * | 2016-07-29 | 2016-12-21 | 华蓥友达精密模具制造有限公司 | A kind of charger encapsulating material |
| CN107200960A (en) * | 2017-06-20 | 2017-09-26 | 苏州奥宇包装科技有限公司 | A kind of preparation method of waterproofing packing PVC film |
| CN107841019A (en) * | 2017-10-25 | 2018-03-27 | 高兴国 | A kind of use for electronic products thin-film material and preparation method thereof |
| CN109679319A (en) * | 2018-11-12 | 2019-04-26 | 许文强 | A kind of preparation method of the electronic package material of high thermal conductivity low thermal expansion |
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Application publication date: 20160720 |