CN105754539A - Adhesive material with humidity-heat resistant properties - Google Patents
Adhesive material with humidity-heat resistant properties Download PDFInfo
- Publication number
- CN105754539A CN105754539A CN201610147351.4A CN201610147351A CN105754539A CN 105754539 A CN105754539 A CN 105754539A CN 201610147351 A CN201610147351 A CN 201610147351A CN 105754539 A CN105754539 A CN 105754539A
- Authority
- CN
- China
- Prior art keywords
- parts
- sizing material
- adhesive material
- dicyandiamide
- oxalic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses an adhesive material with humidity-heat resistant properties.The adhesive material comprises 60-80 parts of polyamide resin, 40-50 parts of xylene resin, 10-15 parts of diphenyl-octyl phosphite ester, 7-12 parts of oxalic acid, 5-10 parts of dicyandiamide and 100 parts of water, and the adhesive material coats a base material to obtain tape.By the means, the adhesive material with the humidity-heat resistant properties can be used in hot and humid environments, and is wide in application range, easy to sell and long in service time, and influences of heat and humidity on the tape made of the adhesive material are avoided.
Description
Technical field
The present invention relates to adhesive tape and related raw material thereof and production field, particularly relate to a kind of sizing material with wet-hot aging performance.
Background technology
Adhesive tape is present conventional product, and tape performance reflects with adhesion strength, initial bonding strength and confining force three elements.After adhesion strength refers to that adhesive tape is affixed on adherend, with power required during certain speed stripping tape again.Initial bonding strength refers in less pressure condition and easy degree that in the short time, adhesive tape is bonding with adherend.Confining force refers to the cohesive strength of glue, the stability after reflection tape-stripping.Present adhesive tape uses under hygrothermal environment cannot play gluing effect, and long-time use also can produce harmful effect.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of sizing material with wet-hot aging performance, can use under hygrothermal environment.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide a kind of sizing material with wet-hot aging performance, the raw material components of described sizing material includes polyamide, xylene resin, diphenyl octyl group phosphite ester, oxalic acid, dicyandiamide, water, described sizing material is in parts by weight, including raw material components be: polyamide 60-80 part, xylene resin 40-50 part, diphenyl octyl group phosphite ester 10-15 part, oxalic acid 7-12 part, dicyandiamide 5-10 part, 100 parts of water, described sizing material is coated on base material and obtains adhesive tape.
In a preferred embodiment of the present invention, the peel strength of described adhesive tape is 200-250N/cm.
In a preferred embodiment of the present invention, described sizing material in parts by weight, including raw material components be: polyamide 70 parts, xylene resin 45 parts, diphenyl octyl group phosphite ester 13 parts, oxalic acid 10 parts, dicyandiamide 8 parts, 100 parts of water.
In a preferred embodiment of the present invention, described sizing material in parts by weight, including raw material components be: polyamide 60 parts, xylene resin 50 parts, diphenyl octyl group phosphite ester 10 parts, oxalic acid 12 parts, dicyandiamide 5 parts, 100 parts of water.
The invention has the beneficial effects as follows: the sizing material with wet-hot aging performance of the present invention, it is possible to use in damp and hot environment, the scope of application is wide, easily sells, and uses the time long, does not worries that the damp and hot meeting adhesive tape on using this sizing material to make produces impact.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, all other embodiments that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
Embodiment one:
Thering is provided a kind of sizing material with wet-hot aging performance, the raw material components of described sizing material includes polyamide, xylene resin, diphenyl octyl group phosphite ester, oxalic acid, dicyandiamide, water.Described sizing material in parts by weight, including raw material components be: polyamide 70 parts, xylene resin 45 parts, diphenyl octyl group phosphite ester 13 parts, oxalic acid 10 parts, dicyandiamide 8 parts, 100 parts of water, described sizing material is coated on base material and obtains adhesive tape.The peel strength of described adhesive tape is 200-250N/cm.
Embodiment two:
A kind of sizing material with wet-hot aging performance is provided, the raw material components of described sizing material includes polyamide, xylene resin, diphenyl octyl group phosphite ester, oxalic acid, dicyandiamide, water, described sizing material is in parts by weight, including raw material components be: polyamide 60 parts, xylene resin 50 parts, diphenyl octyl group phosphite ester 10 parts, oxalic acid 12 parts, dicyandiamide 5 parts, 100 parts of water, described sizing material is coated on base material and obtains adhesive tape.The peel strength of described adhesive tape is 200-250N/cm.
Embodiment three:
A kind of sizing material with wet-hot aging performance is provided, the raw material components of described sizing material includes polyamide, xylene resin, diphenyl octyl group phosphite ester, oxalic acid, dicyandiamide, water, described sizing material is in parts by weight, including raw material components be: polyamide 80 parts, xylene resin 40 parts, diphenyl octyl group phosphite ester 15 parts, oxalic acid 7 parts, dicyandiamide 10 parts, 100 parts of water, described sizing material is coated on base material and obtains adhesive tape.The peel strength of described adhesive tape is 200-250N/cm.
The invention has the beneficial effects as follows:
The sizing material described in one, with wet-hot aging performance can use in damp and hot environment, and the scope of application is wide, easily sells；
Two, use the time long, do not worry that the damp and hot meeting adhesive tape on using this sizing material to make produces impact.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the invention content to be made or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical field, the most in like manner it is included in the scope of patent protection of the present invention.
Claims (4)
1. a sizing material with wet-hot aging performance, it is characterized in that, the raw material components of described sizing material includes polyamide, xylene resin, diphenyl octyl group phosphite ester, oxalic acid, dicyandiamide, water, described sizing material in parts by weight, including raw material components be: polyamide 60-80 part, xylene resin 40-50 part, diphenyl octyl group phosphite ester 10-15 part, oxalic acid 7-12 part, dicyandiamide
100 parts of 5-10 part, water, described sizing material is coated on base material and obtains adhesive tape.
The sizing material with wet-hot aging performance the most according to claim 1, it is characterised in that the peel strength of described adhesive tape is 200-250N/cm.
The sizing material with wet-hot aging performance the most according to claim 1, it is characterized in that, described sizing material in parts by weight, including raw material components be: polyamide 70 parts, xylene resin 45 parts, diphenyl octyl group phosphite ester 13 parts, oxalic acid 10 parts, dicyandiamide 8 parts, 100 parts of water.
The sizing material with wet-hot aging performance the most according to claim 1, it is characterized in that, described sizing material in parts by weight, including raw material components be: polyamide 60 parts, xylene resin 50 parts, diphenyl octyl group phosphite ester 10 parts, oxalic acid 12 parts, dicyandiamide 5 parts, 100 parts of water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610147351.4A CN105754539A (en) | 2016-03-16 | 2016-03-16 | Adhesive material with humidity-heat resistant properties |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610147351.4A CN105754539A (en) | 2016-03-16 | 2016-03-16 | Adhesive material with humidity-heat resistant properties |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105754539A true CN105754539A (en) | 2016-07-13 |
Family
ID=56333185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610147351.4A Pending CN105754539A (en) | 2016-03-16 | 2016-03-16 | Adhesive material with humidity-heat resistant properties |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105754539A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1422316A (en) * | 2000-04-10 | 2003-06-04 | 汉高两合股份公司 | Impact-resistant epoxy resin compositions |
| CN102057012A (en) * | 2008-06-11 | 2011-05-11 | 三菱树脂株式会社 | Flame-retardant adhesive composition and laminated film |
| CN103173187A (en) * | 2011-12-21 | 2013-06-26 | 深圳市宏商材料科技股份有限公司 | Polyamide hot melt adhesive and production process thereof |
| CN103242760A (en) * | 2013-05-31 | 2013-08-14 | 苏州华周胶带有限公司 | Composite-film-based adhesive tape |
-
2016
- 2016-03-16 CN CN201610147351.4A patent/CN105754539A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1422316A (en) * | 2000-04-10 | 2003-06-04 | 汉高两合股份公司 | Impact-resistant epoxy resin compositions |
| CN102057012A (en) * | 2008-06-11 | 2011-05-11 | 三菱树脂株式会社 | Flame-retardant adhesive composition and laminated film |
| CN103173187A (en) * | 2011-12-21 | 2013-06-26 | 深圳市宏商材料科技股份有限公司 | Polyamide hot melt adhesive and production process thereof |
| CN103242760A (en) * | 2013-05-31 | 2013-08-14 | 苏州华周胶带有限公司 | Composite-film-based adhesive tape |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160713 |
|
| RJ01 | Rejection of invention patent application after publication |