CN105618936B - One kind uses laser grooving and scribing glass processing method - Google Patents
One kind uses laser grooving and scribing glass processing method Download PDFInfo
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Abstract
The present invention relates to laser glass processing technique field, discloses one kind and uses laser grooving and scribing glass processing method.This method first chooses suitable laser beam, and clean dirt is carried out to workpiece glass to be processed, and be placed horizontally on three-dimensional mobile platform, adjust the Z axis height of three-dimensional mobile platform so that the focal position of laser beam is located in the setting range of workpiece lower glass surface；Laser beam carries out delineation processing with path to workpiece glass according to set patterns, and cutting cell body is formed in the bottom of workpiece glass, and the Z axis for moving back and forth three-dimensional mobile platform completes the delineation process of workpiece glass；Finally the workpiece glass machined is cleaned and tested.The present invention disclosure satisfy that the technique of its processing method is simple in practice for the glass-cutting requirement of the low damage of high accuracy, need not subsequently increase Aided Machine operation, in the case where not increasing extra cost, can be achieved by increasing a laser.
Description
Technical field
It is in particular, more particularly to a kind of real using laser grooving and scribing the present invention relates to laser glass processing technique field
The method of existing glass-cutting processing, it is possible to achieve a variety of figures (being not only straight line) and thickness cutting.
Background technology
Glass, a kind of non-crystalline solids of random structure form contiguous network structure during melting, viscosity in cooling procedure
Gradually increase and harden, no definite melting point, its main component is silica, and species is various, along with the difference of dopant
Different shape and characteristic are showed, with the development of science and technology, what glass had been popularized now is applied to each side of life
Face, including building, chemical industry is military, family life industrial design etc., three is collectively constituted with ceramic material and high-molecular organic material
Big pillar nonmetallic materials.
With the popularization of glass applications, the requirement for product differentiation is also further urgent, this processing mould for glass
Formula and required precision generate great challenge.Traditional glass processing mainly blows drawing including hot melt, mould molding, machinery and
The methods of chemical treatment, in recent years, with the prosperity of electronic industry, the requirement for precision is harsher (micron order), tradition
Glass processing has been difficult to meet so high split requirement, and for this, the more fine quickly glass machining technique of development very must
Will.
Traditional glass processing mode (machining, ultrasonic wave processing, sandblasting processing and chemical attack processing etc.) is present
Long processing time, yield rate relative reduction, auxiliary consumptive material consumption is serious, the shortcomings of certain chemical contamination and low precision be present.
As the outstanding feature of 20th century scientific technological advance and one of the pillar of advanced information society's photoelectron technology, swash
The development of light technology and laser industry is by worldwide great attention.Laser processing technology uses laser beam and material phase
One systems such as the characteristic of interaction is cut to material (including metal with nonmetallic), welded, is surface-treated, punched, micro Process
A special kind of skill of column processing.Laser Processing is widely used to automobile, electronics, electrical equipment, aviation, smelting as advanced manufacturing technology
The national economy important department such as gold, machine-building, to improving product quality, labor productivity, automation, pollution-free, reduction material
More and more important effect is played in material consumption etc..
The research on laser glass processing is concentrated mainly on the coefficient feelings of induced with laser applied mechanical stress now
The cutting processing of glass is realized under condition, wherein especially using carbon dioxide laser as very, its principle is mainly the carbon dioxide focused on
Laser beam acts on glass surface, and glass absorbs beam energy and produces heat accumulation, simultaneously aids in quenching to live cooling
Gas is acted on laser beam scan path, and inside glass cracks along cut direction during difference variation drastically, subsequently
Cleaving operation is carried out using machining mode, such a technique has certain application market but due to the list of cutting pattern
One, there is significant limitation.
In summary, exploitation is a kind of quick, and high accuracy is pollution-free, the low glass processing of applied widely and attached loss
Mode is necessary.
The content of the invention
It is an object of the invention to for technical problem existing for prior art, there is provided one kind is added using laser grooving and scribing glass
Work method, its method is simple, yields is high and can meet the glass-cutting requirement of the low damage of high accuracy.
In order to solve posed problems above, the technical solution adopted by the present invention is：
One kind uses laser grooving and scribing glass processing method, and the glass processing method comprises the following steps that：
Step S1：Choose suitable laser beam；
Step S2：Clean dirt is carried out to workpiece glass to be processed, and be placed horizontally at three-dimensional mobile platform it
On, adjust the Z axis of three-dimensional mobile platform highly so that the focal position of laser beam is located at the setting model of workpiece lower glass surface
In enclosing, the setting range determines according to formula (1)：
Wherein, D1 is the setting range, dfFor spot diameter size, M after focusing2For Laser Beam Quality Factor, k1 is
Correction factor, its size is between 0.1~0.9；
Step S3：Laser beam carries out delineation processing to workpiece glass with path according to set patterns, and in workpiece glass
Cutting cell body is formed on the bottom of glass, and the pattern of the setting uses helix or SPL；
Step S4：With the increase of cutting cell body depth, the adjustment step pitch obtained according to formula (2), and formula (3)
The step distance adjustment time arrived, the Z axis for moving back and forth three-dimensional mobile platform complete the delineation process of workpiece glass；
Wherein, D2 is the adjustment step pitch, dfFor spot diameter size after focusing, k2 is correction factor, its size between
Between 0.3~0.7；
Wherein, Δ T is the step distance adjustment time, and N is the delineation number of laser beam, and k3 is correction factor, its size
Between 1-10, with N into inverse correlation, n is the skew number of turns, and L is the girth that each circle delineates path, and v is the quarter of laser beam
Draw speed；
Step S5：The workpiece glass machined is cleaned and tested.
In the step S1, the wave-length coverage of laser beam is chosen between 255-532nm, the simple venation of laser beam
Rushing energy should be between 0.1~1mJ, and the spot size of laser beam should be between 20~60um, the laser of laser beam
Power should be between 5~50W.
In the step S3, the size of helix or SPL composition scored area is between 0.2~1mm, partially
The size of shifting amount is between (0.3~1.3) dfBetween；The path of setting by workpiece glass bottom to top.
In the step S2, concentration is used to wipe workpiece glass for 99% industrial alcohol.
In the step S5, the solution cleaned to the workpiece glass after machining uses the hydrofluoric acid of 40% concentration
+ lauryl sodium sulfate+the acetic acid of isopropanol+20% water+water, its respective quality proportioning is 0.5%+0.07%+8%+5%+
86.43%, test then carries out taper, edge roughness and compression test.
The system that the processing method uses includes laser, beam expanding lens, vibration mirror scanning component and three-dimensional mobile platform, its
Middle laser, beam expanding lens, vibration mirror scanning component level are set on the same line, and three-dimensional mobile platform is arranged on vibration mirror scanning group
The underface of part；
Workpiece glass horizontal to be processed is arranged in three-dimensional mobile platform, and the laser beam that laser is sent passes through successively
Beam expanding lens, the diffusion of vibration mirror scanning component form focus on light beam after focusing on, and focus on light beam is acted on workpiece glass to be processed.
The system also includes dust arrester, three-dimensional mobile platform upper shed, and workpiece glass to be processed is placed on opening
Top, dust arrester are arranged on the lower section of three-dimensional mobile platform opening.
Compared with prior art, the beneficial effects of the present invention are：
The present invention realizes the cutting processing of glass using laser grooving and scribing, disclosure satisfy that in practice for the low damage of high accuracy
Glass-cutting requirement, the technique of its processing method is simple, is readily integrated into industrialization production, need not subsequently increase Aided Machine
Operation, in the case where not increasing extra cost, it can be achieved by increasing a laser；Furthermore, it is possible to realize a variety of figures
The delineation processing of shape, that is, disclosure satisfy that the requirement of client's differentiation, and its yields is high, and uniformity is good, can be very good after avoiding
Mismatch phenomenon caused by phase assembling process, it is easy to the production in enormous quantities of commercial running and the control of yields.
Brief description of the drawings
Fig. 1 is the composition figure that glass processing method of the present invention uses system.
Fig. 2 is the schematic diagram after workpiece glass processing of the present invention.
Fig. 3 is that the processing helix of workpiece glass of the present invention illustrates figure.
Fig. 4 is the flow chart of glass processing method of the present invention.
Description of reference numerals：110- lasers；111- beam expanding lens；112- vibration mirror scanning components；113- focus on light beam；
120- workpiece glass；130- three-dimensional mobile platforms；140- dust arresters；200- workpiece substrate of glass；201- cutting grooves
Body；300- helixes.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give presently preferred embodiments of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes
The embodiment of description.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more thorough
Comprehensively.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
As shown in fig.1, one kind provided by the invention uses laser grooving and scribing glass processing method, the system that this method uses
Including laser 110, beam expanding lens 111, vibration mirror scanning component 112, three-dimensional mobile platform 130 and dust arrester 140, wherein expanding
Mirror 111 uses 2-8X beam expanding lens, and laser 110, beam expanding lens 111, vibration mirror scanning component 112 are horizontally disposed on the same line,
Three-dimensional mobile platform 130 is arranged on the underface of vibration mirror scanning component 112, the upper shed of three-dimensional mobile platform 130, its lower section that is open
It is provided with dust arrester 140.
Workpiece glass 120 to be processed is horizontally set on the overthe openings of three-dimensional mobile platform 130, is sent out by laser 110
Beam of laser light beam is penetrated, the laser beam forms poly- after beam expanding lens 111 and the diffusion of vibration mirror scanning component 112 focus on successively
Defocused laser beam 113, focus on light beam 113 carry out delineation scanning along setting path on the surface of workpiece glass 120 and form line of cut and cut
Cell body 201 is cut, the line of cut is made up of a series of helixes or SPL, and the cutting cell body 201 is formed at workpiece
The bottom of glass 120, i.e. the cutting path of workpiece glass 120 is to be moved to top from bottom to complete cutting process, with workpiece glass
The increase of the depth of cell body 201 is cut in the bottom of glass 120, and the Z axis of three-dimensional mobile platform 130 moves according to setting step pitch, so
Back and forth, until workpiece glass 120 is completely through cutting sample departs from workpiece substrate of glass 200.
The method of laser cut workpieces glass described above is due to being cut upwards step by step from bottom, so right
It can also be processed in the workpiece glass of higher thickness, whole processing graphic pattern is made up of a series of helixes or SPL, spiral shell
The starting point and ending point that the both ends of spin line or SPL process respectively as laser beam, laser beam are opened from starting point
Begin, workpiece glass is cut along the track of helix or SPL, and terminates in terminating point so as to obtain cutting groove
Body, i.e., be located on diverse location using starting point and ending point, can so avoid frequently switching on light and laser first and last arteries and veins
Quick-fried point and sliver phenomenon caused by punching delay, so as to improve cut quality and yield rate.
As shown in Figure 4, the glass processing method comprises the following steps that：
Step S1：Suitable laser beam is chosen, that is, chooses suitable laser 110 or laser cavity.
In this step, the wave-length coverage of laser beam is chosen between 255-532nm, the single pulse energy of laser beam
Amount should be between 0.1~1mJ, and the spot size of laser beam should be between 20~60um, the laser power of laser beam
Should be between 5~50W.
Step S2：Clean dirt is carried out to workpiece glass 120 to be processed, and is placed horizontally at three-dimensional mobile platform
On 130, the Z axis height of three-dimensional mobile platform 130 is adjusted so that the focal position of laser beam is located under workpiece glass 120
In the setting range on surface.
In this step, concentration is used to wipe workpiece glass 120 for 99% industrial alcohol, its convenient and reliable and effect
It is good.
In this step, three-dimensional mobile platform 130 is by the XY mobile platforms perpendicular to beam direction and along beam direction
Z axis motion platform composition, the focal position is located in the lower surface setting range of workpiece glass 120, the setting range it is big
I is determined by formula (1)：
Wherein, D1 is the setting range, dfFor spot diameter size, M after focusing2For Laser Beam Quality Factor, k1 is
Correction factor, its size should be between 0.1~0.9.
Step S3：Laser beam carries out delineation processing with path to workpiece glass 120 according to set patterns, and in workpiece
Cutting cell body is formed on the bottom of glass 120.
In this step, the pattern of setting is made up of a series of helixes or SPL, avoids laser beam first and last arteries and veins
Punching delay and frequently switch on the influence caused by light, the size of helix or SPL the composition scored area should be between
To reach optimal output ratio between 0.2~1mm, the size of the offset of the helix or SPL should be between (0.3
~1.3) dfBetween, to ensure that the pulse train of continuous-stable can be formed between hot spot.
Step S4：With the increase of the bottom of workpiece glass 120 cutting cell body depth, the Z axis of three-dimensional mobile platform 130 is carried out
Corresponding step pitch movement, and so on, completes the delineation process of workpiece glass 120.
In this step, with the progress of cutting process, there is cutting cell body in the bottom of workpiece glass 120, with cutting cell body
Deepen, the Z axis of three-dimensional mobile platform 130 carries out corresponding step distance adjustment, and the adjustment step pitch can be drawn by equation below (2)：
Wherein, D2 is the adjustment step pitch, dfFor spot diameter size after focusing, k2 is correction factor, and its size should be situated between
Between 0.3~0.7.
The size of the step distance adjustment time should be obtained by equation below (3)：
Wherein, Δ T is the step distance adjustment time, and N is the delineation number of laser beam, and k3 is correction factor, its size
Should be between 1-10, with N into inverse correlation, n is the skew number of turns, and L is the girth that each circle delineates path, and v is laser beam
Delineate speed, that is, scan rate of vibrating mirror.
In this step, in order to protect the stability of the cleanliness factor of working environment and cutting, adopted in the bottom of workpiece glass
Dust granules caused by laser cutting are extracted with dust arrester 140.
Step S5：The workpiece glass machined is cleaned and tested.
In this step, the solution that is cleaned to the workpiece glass after machining be preferably 40% concentration hydrofluoric acid+
Lauryl sodium sulfate+the acetic acid of isopropanol+20% water+water, its respective quality proportioning is 0.5%+0.07%+8%+5%+
86.43%, its cleaning performance is good and conveniently；Test is then preferred to carry out taper, edge roughness and compression test, disclosure satisfy that
It is actually needed.
As shown in Figure 3, work is processed according to helix 300 using pattern of the helix 300 as setting, laser beam root
Part glass 120, you can obtain the cutting cell body (shown in Fig. 2) of annular, the cutting cell body obtained using helix is smooth, and side
Just process, processing reliably is also easy to realize.
In above-mentioned, it can include ellipse for the pattern of glass pieces processing, straight line, polygon, not exclusively be defined in straight
Line and circle, i.e. its applicability are wide, easy to process reliable.
Above-described embodiment is the preferable embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any Spirit Essences without departing from the present invention with made under principle change, modification, replacement, combine, simplification,
Equivalent substitute mode is should be, is included within protection scope of the present invention.
Claims (6)
1. one kind uses laser grooving and scribing glass processing method, it is characterised in that：The glass processing method comprises the following steps that：
Step S1：Choose suitable laser beam；
Step S2：Clean dirt is carried out to workpiece glass to be processed, and is placed horizontally on three-dimensional mobile platform, is adjusted
Save the Z axis height of three-dimensional mobile platform so that the focal position of laser beam is located in the setting range of workpiece lower glass surface,
The setting range determines according to formula (1)：
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<mo>(</mo>
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</mrow>
</mrow>
Wherein, D1 is the setting range, dfFor spot diameter size, M after focusing2For Laser Beam Quality Factor, k1 is amendment
Coefficient, its size is between 0.1~0.9；
Step S3：Laser beam carries out delineation processing to workpiece glass with path according to set patterns, and in workpiece glass
Cutting cell body is formed on bottom, and the pattern of the setting uses helix or SPL；The helix or SPL
The size of scored area is formed between 0.2~1mm, the size of offset is between (0.3~1.3) dfBetween, it is set
Path by workpiece glass bottom to top；
Step S4：With the increase of cutting cell body depth, the adjustment step pitch obtained according to formula (2), and formula (3) obtain
Step distance adjustment time, the Z axis for moving back and forth three-dimensional mobile platform complete the delineation process of workpiece glass；
<mrow>
<mi>D</mi>
<mn>2</mn>
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Wherein, D2 is the adjustment step pitch, dfFor spot diameter size after focusing, k2 is correction factor, its size between 0.3~
Between 0.7；
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<mi>&Delta;</mi>
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</mrow>
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Wherein, Δ T is the step distance adjustment time, and N is the delineation number of laser beam, and k3 is correction factor, its size between
Between 1-10, with N into inverse correlation, n is the skew number of turns, and L is the girth that each circle delineates path, and v is the delineation speed of laser beam
Degree；
Step S5：The workpiece glass machined is cleaned and tested.
2. according to claim 1 use laser grooving and scribing glass processing method, it is characterised in that：In the step S1, choosing
The wave-length coverage of laser beam is taken between 255-532nm, the single pulse energy of laser beam should between 0.1~1mJ it
Between, the spot size of laser beam should be between 20~60um, and the laser power of laser beam should be between 5~50W.
3. according to claim 1 use laser grooving and scribing glass processing method, it is characterised in that：In the step S2, adopt
Workpiece glass is wiped with the industrial alcohol that concentration is 99%.
4. according to claim 1 use laser grooving and scribing glass processing method, it is characterised in that：It is right in the step S5
The solution that workpiece glass after machining is cleaned using 40% concentration hydrofluoric acid+lauryl sodium sulfate+isopropanol+
20% acetic acid water+water, its respective quality proportioning is 0.5%+0.07%+8%+5%+86.43%, and test then carries out taper, side
Edge roughness and compression test.
5. according to claim 1 use laser grooving and scribing glass processing method, it is characterised in that：The processing method uses
System include laser, beam expanding lens, vibration mirror scanning component and three-dimensional mobile platform, wherein laser, beam expanding lens, vibration mirror scanning
Component level is set on the same line, and three-dimensional mobile platform is arranged on the underface of vibration mirror scanning component；
Workpiece glass horizontal to be processed is arranged in three-dimensional mobile platform, and the laser beam that laser is sent is successively by expanding
Mirror, the diffusion of vibration mirror scanning component form focus on light beam after focusing on, and focus on light beam is acted on workpiece glass to be processed.
6. according to claim 5 use laser grooving and scribing glass processing method, it is characterised in that：The system also includes removing
Dirt device, three-dimensional mobile platform upper shed, workpiece glass to be processed are placed on overthe openings, and dust arrester is arranged on three-dimensional shifting
The lower section of moving platform opening.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101613181A (en) * | 2009-07-24 | 2009-12-30 | 深圳市大族激光科技股份有限公司 | A kind of method of cutting glass by laser |
| CN202207858U (en) * | 2011-06-16 | 2012-05-02 | 上海市激光技术研究所 | Ultraviolet laser fine processing device with double laser heads for different limited apertures |
| CN103011171A (en) * | 2011-09-28 | 2013-04-03 | 深圳市木森科技有限公司 | Glass processing method |
| CN103212856A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Technological method for processing thicker material by using ultraviolet laser |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011129827A (en) * | 2009-12-21 | 2011-06-30 | Sharp Corp | Solar cell system |
| KR101244352B1 (en) * | 2010-01-29 | 2013-03-18 | 가부시키가이샤 사무코 | Method for producing silicon wafer, epitaxial wafer and solid imaging device, and apparatus for producing silicon wafer |
-
2014
- 2014-11-21 CN CN201410670288.3A patent/CN105618936B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101613181A (en) * | 2009-07-24 | 2009-12-30 | 深圳市大族激光科技股份有限公司 | A kind of method of cutting glass by laser |
| CN202207858U (en) * | 2011-06-16 | 2012-05-02 | 上海市激光技术研究所 | Ultraviolet laser fine processing device with double laser heads for different limited apertures |
| CN103011171A (en) * | 2011-09-28 | 2013-04-03 | 深圳市木森科技有限公司 | Glass processing method |
| CN103212856A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Technological method for processing thicker material by using ultraviolet laser |
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| CN107962305A (en) * | 2017-12-21 | 2018-04-27 | 英诺激光科技股份有限公司 | A kind of high index of refraction, low-rigidity transparent material laser cutter device and cutting method |
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