CN105606277A - Integrated fiber F-P chamber pressure sensor - Google Patents
Integrated fiber F-P chamber pressure sensor Download PDFInfo
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- CN105606277A CN105606277A CN201610099847.9A CN201610099847A CN105606277A CN 105606277 A CN105606277 A CN 105606277A CN 201610099847 A CN201610099847 A CN 201610099847A CN 105606277 A CN105606277 A CN 105606277A
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- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052681 coesite Inorganic materials 0.000 claims description 5
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- 229910052682 stishovite Inorganic materials 0.000 claims description 5
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- 230000033558 biomineral tissue development Effects 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
- G01L1/242—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet the material being an optical fibre
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses an integrated fiber F-P chamber pressure sensor. The integrated fiber F-P chamber pressure sensor comprises a barrel-like packaging casing (1), a pressure diaphragm (2) arranged in a packaging casing cylinder, a composite medium film (3) fixedly connected with the bottom end of the pressure diaphragm, and a fiber (6) which is level with a bottom plane of an end portion groove of an insertion core (5) and penetrates through the insertion core to stretch out of the bottom portion of the packaging casing, wherein the composite medium film (3) is just opposite to the top end groove of the insertion core axially, the pressure diaphragm (2) provided with a stress release hole structure is used for packaging the insertion core groove through the bonding technology to form an F-P resonant chamber, the insertion core and the pressure diaphragm are fixedly connected to form an integrated structure, and a circumferential connection fixedly-connected member (4) is assembled on the cylinder of the packaging casing (1) in an integrated mode. According to the integrated fiber F-P chamber pressure sensor, the insertion core provided with the top end groove and the pressure diaphragm are combined with the integrated F-P chamber through the bonding technology, subsequent laser welding and adhesive gluing technologies are saved, the thermal internal stress of a system is further reduced, and performance of the F-P chamber pressure sensor is improved.
Description
Technical field
The invention belongs to technical field of optical fiber sensing, particularly relate to the pressure in a kind of high accuracy integral fibre-optic F-P chamberSensor.
Background technology
Fibre Optical Sensor, using light as information carrier, using optical fiber as letter transmission medium, carries out sensing survey to tested parameterAmount. It has simple in structure, and volume is little, high reliability, and high sensitivity, the response time is short, the transmission of single fiber signal etc., and advantage is subject toTo the general concern of people, also in the health monitoring of the buildings such as petrochemical industry, Aero-Space and bridge, have widely simultaneouslyApplication prospect is one of current study hotspot. According to the difference of sensor material, preparation method etc., fiber F-P cavity pressureSensor can be divided into all optical fibre structure and MEMS diaphragm type.
The basic structure of all optical fibre structure F-P cavity pressure sensor is using the end face of two optical fiber as reflecting surface, makes twoFiber end face is strictly parallel, coaxial, forms a cavity with hollow optical fiber. When cavity one timing, its deflection and suffered pressureBe directly proportional by force, and the variable effect of cavity length is to the interior incident light of optical fiber and catoptrical optical path difference. Due to all optical fibre structure F-PThe main part of fibre optic compression sensor all adopts fiber optic materials, and therefore its main feature is to have good heat enduranceEnergy. But can still there is many defects such as complex process, material temperature and mechanical characteristic be poor in fiber end face manufacturing technology at present,So all optical fibre structure F-P cavity pressure sensor is not suitable for mass production, has limited its application.
Proposed based on diaphragm design F-P pressure sensor structure the seventies and eighties in last century abroad, optical reflection is flatWhat face adopted is to pressure-sensitive diaphragm, and when diaphragm is along with the variation of pressure produces displacement, the chamber in F-P chamber is long also to be sent out thereuponChanging. Along with the continuous maturation of technology, there are a variety of different structures in optical fiber F-P pressure sensor, and wherein optical fiber MEMS pressesPower sensor senses device is one of them part and parcel. Since entering 21 century, microelectromechanical systems (MEMS) technologyApplication in optical arena is very noticeable, and optical fiber sensing technology and MEMS technology are combined and make novel optical fiber MEMSSensor has become Fibre Optical Sensor and has made the new focus in field. The introducing of MEMS technology, makes F-P pressure sensorReliability, anti-electromagnetic interference and corrosion resistance are all improved, and F-P chamber MEMS fibre optic compression sensor also has sizeThe plurality of advantages such as little, the degree of accuracy is high, dynamic range is large, meanwhile, produces one because MEMS device is suitable for large scale integrationDawn technology maturation, product approval, can reduce the cost of sensor greatly. Along with the continuous maturation of MEMS technology is perfect, externalDuo Jia colleges and universities and research institution have all carried out the research work of F-P pressure sensor, and have occurred different knotsThe F-P pressure sensor of structure. Wherein the pressure sensitive film of a part of sensor is to use bulk silicon technological and surfaceSacrifice layer process is made, and some sensor utilizes fiber optical corrosive fusion joining process to make.
But pressure sensor is all separated structure at present, as China Patent Publication No.CN103644987A, CN103698080A, disclosed F-P chamber and light-conductive optic fibre are by glue bond or carbon dioxide laserBe welded. The optical fiber F-P pressure sensor of this discrete exists following problem:
1, because glue is with the difference (additional stress that laser weld is brought) of thermal coefficient of expansion between F-P chamber and light-conductive optic fibre, whenWhen variations in temperature, sensing head internal stress changes, and then it is long to change the chamber in F-P chamber, thus the zero-bit that makes sensor withSensitivity drift increases;
2, the F-P pressure sensor of this separated structure exists multiple reflectings surface, thereby forms multiple method amber resonators, makesMust export interference spectrum complexity, directly affect the demodulation accuracy (precision lower than 0.5%) of F-P pressure sensor;
3, the pressure-sensitive diaphragm glass groove of silicon materials is to be formed by connecting by the mode of anode linkage, but between this bi-materialThermal coefficient of expansion is different, and this makes silicon pressure-sensitive diaphragm produce deformation by temperature effect, causes between Silicon pressure diaphragm and pressureOccur non-linear, thereby reduce the precision of F-P pressure sensor;
4, current, the packaged type of F-P pressure sensor is that metal shell body directly welds with sensing head, and one of this modeMain shortcoming is that temperature effect is fairly obvious, and in the time of variations in temperature, metal shell and sensing head are due to the difference of storeroomProduce additional internal stress, thereby cause the long variation in chamber in F-P chamber, make the precise decreasing of F-P pressure sensor.
Summary of the invention
The object of the invention is the weak point existing for prior art, provide a kind of pressure demodulation convenient, precision is high,Can avoid the pressure sensor in the integral fibre-optic F-P chamber of additional stress.
Above-mentioned purpose of the present invention can adopt following technical scheme to realize: a kind of integral fibre-optic F-P cavity pressure sensingDevice, comprises a tubbiness package casing 1, is arranged on pressure-sensitive diaphragm 2 in described package casing cylindrical shell, is fixedly connected on described pressureComposite dielectric film 3 under power diaphragm bottom and flushing with lock pin 5 end recesses baseplanes, stretches out described package casing through lock pinOptical fiber 6 outside bottom, is characterized in that: composite dielectric film 3 axially, just to lock pin 5 top grooves, is shaped with stress release pore structurePressure-sensitive diaphragm 2, pressure-sensitive diaphragm 2 bonding regions and pressure-sensitive district by bonding technology in conjunction with lock pin 5 grooves encapsulation are formed to oneF-P single resonance chamber, lock pin 5 and the connect firmly form of pressure-sensitive diaphragm 2 with integrative-structure, connect firmly member 4 one by circumferential connectionFormula is assemblied in the cylindrical shell of above-mentioned package casing 1.
Compared with prior art, the present invention has larger breakthrough technically: main feature of the present invention is F-P resonanceThe lock pin of chamber and leaded light is one. The pressure sensor of the fiber F-P cavity of this integral structure mainly contain two hugeAdvantage:
1), its resonator is single resonance chamber, its reflectance spectrum is the standard interference peak of a series of cosine-modulation, therefore pressure solutionAdjust very conveniently, increased the precision of whole system simultaneously;
2), owing to being integral structure, can avoid the additional stress causing due to laser weld or glue. With conventional junctionThe F-P pressure sensor of structure is compared, and precision of the present invention can reach level very much, simultaneously the F-P pressure sensor work of this structureSkill is simple, is applicable to mass and makes. Simultaneously between the pressure sensor and package casing of the fiber F-P cavity of this integral structureConnect by connecting firmly member, it can alleviate the stress between package casing and pressure sensor effectively, and then improvesThe precision of system. Pressure-sensitive diaphragm has not only been introduced strain relief in addition, has also adopted composite dielectric film, and they can enter oneStep improves precision of the present invention.
The present invention adopts the reeded lock pin of top system and pressure-sensitive diaphragm by the bonding technology F-P chamber forming that integrally combines,Save follow-up laser weld and glue technique, reduced the hot internal stress of system simultaneously, improved F-P pressure sensorPerformance.
The present invention in pressure-sensitive diaphragm surrounding along adopt strain relief. The Main Function of these structures is alleviated silicon diaphragmAnd thermal mismatching between lock pin and the internal stress that produces, thereby improve the precision of system.
The present invention is coated with reflectivity in the lower surface of pressure-sensitive diaphragm be 30% composite dielectric film, this composite dielectric film toolThere is higher temperature stability.
Lock pin of the present invention is combined by connecting firmly the member holder housing such with casing cylinder, and connecting firmly member can fully releasePut the thermal stress between lock pin and holder housing. This sensor construction is simple, volume is little, cost of manufacture is low, temperature and pressure is handed overFork sensitiveness is little, good stability.
Brief description of the drawings
Fig. 1 is the system architecture principle cutaway view of integral fibre-optic F-P cavity pressure sensor of the present invention.
Fig. 2 is the strain relief schematic diagram of Fig. 1 of the present invention, and wherein (a) is top view, (b) is side view.
Fig. 3 is the schematic diagram of Fig. 1.
In figure: 1, package casing, 2, pressure-sensitive diaphragm, 3, composite dielectric film, 4, connect firmly member, 5, lock pin, 6, optical fiber, 7,Anchor tip.
Detailed description of the invention
In a most preferred embodiment of describing as shown in Figure 1, integral fibre-optic F-P cavity pressure sensor is by outside encapsulatingShell 1, pressure-sensitive diaphragm 2, composite dielectric film 3, connects firmly member 4, lock pin 5, optical fiber 6, anchor tip 7 forms. Mainly comprise a bucketShape package casing 1, be arranged on pressure-sensitive diaphragm 2 in described package casing 1 cylindrical shell, be fixedly connected on described pressure-sensitive diaphragm 2 bottomsUnder composite dielectric film 3 and flush with lock pin 5 end recesses baseplanes, stretch out the light outside described package casing bottom through lock pinFibre 6, optical fiber 6 stretches out outside package casing 1 cylindrical shell by anchor tip 7. Composite dielectric film 3 on optical fiber 6 front ends and pressure-sensitive diaphragm 2Form a pair of reflecting surface, and form interference fringe, measure ambient pressure by measuring stripe information. Composite dielectric film 3 is grownAt the back side of pressure-sensitive diaphragm 2, as light reflection surface, pressure-sensitive diaphragm 2 is connected to form F-P chamber by anode linkage, lock pin 5 with lock pin 5Be connected with package casing 1 by connecting firmly member 4, optical fiber 6 part is inserted lock pins 5, parallel at the bottom of the chamber in top and F-P chamber, optical fiberA part insert lock pin, top is parallel with the bottom, chamber in F-P chamber, optical fiber another part is positioned at outside lock pin, as conduction optical fiber andDemodulated equipment connects, and is fixed on the lower end of holder housing 1 by anchor tip 7.
Consult Fig. 2. It is 30% composite dielectric film that the lower surface of pressure-sensitive diaphragm is coated with reflectivity. The shape of pressure-sensitive diaphragm canCarry out the shape of selection pressure diaphragm according to the requirement of different packing forms and system accuracy, the shape of pressure-sensitive diaphragm just can beSquare, rhombus, circle, hexagonal one or more. The strain relief of the bonding zone design of pressure-sensitive diaphragm is by dividingThe stress relief hole of cloth in above-mentioned bonding region and pressure-sensitive region composition, the thermal mismatching between pressure-sensitive diaphragm and upper lock pin andThe stress producing discharges by these difform through holes. The stress relief hole of these planforms can be square, water chestnutShape, circle, hexagon through hole. The degree of depth of stress relief hole is 1/3 of pressure-sensitive diaphragm thickness. Select according to the requirement of system accuracySelect the shape of strain relief, by these difform stress relief holes discharge due to pressure-sensitive diaphragm and upper lock pin itBetween thermal mismatching and the stress that produces.
On the described pressure-sensitive diaphragm back side and described F-P chamber bottom portion of groove silicon chip, growth has at least one deck complex mediaFilm, described composite dielectric film is SiO2/Ta2O5Film, Si3N4/Ta2O5Film or SiO2/Ta2O5/Si3N4In at least oneThe plural layers of combination form. The composite dielectric film at the described pressure-sensitive diaphragm back side is or silicon nitride Si3N4, tantalum pentoxide Ta2O5Plural layers, or SiO2、Ta2O5、Si3N4Plural layers.
Processing technology step with the preparation method of the F-P pressure sensor of composite dielectric film is as follows: choose without sticking upSong, surface smoothness good (fluctuating is less than 1nm), using the high-quality silicon chip in 100 crystal orientation as pressure-sensitive diaphragm 1, thickness is 50-300Um, utilizes magnetron sputtering at the silicon chip one side at least one deck Si that grows3N4/Ta2O5Film, the thickness of plural layers is 50/100Nm; Utilize standard MEMS technique, upper lock pin 3 is made to groove according to designing requirement, the thickness of plural layers is 50/100/60Nm; By anode linkage technique, pressure-sensitive diaphragm 1 and upper lock pin 3 are connected to form to F-P chamber; To conduct optical fiber 5 one end fully grindsSmooth, and in the jack of fixing and lower lock pin 4, and flush with the top of lower lock pin 4; Utilize laser bonding or glue techniqueUpper lock pin 3 is connected with lower lock pin 4, completes the making of fiber F-P cavity pressure sensor.
The preparation method of the present embodiment fiber F-P cavity pressure sensor, its processing technology step is as follows:
Choose the high-quality silicon chip without warpage, surface smoothness good (fluctuating is less than 1nm), 100 crystal orientation, pass through magnetic in its silicon chip one sideThe control sputter composite dielectric film being formed by multilayer dielectric film of growing, mineralization pressure diaphragm 2; Utilize standard MEMS technique, to holesLock pin 5 make groove according to designing requirement, and be connected formation F-P chamber with pressure-sensitive diaphragm 2 by anode linkage technique; Pass throughConnect firmly member 4 lock pin 5 is connected with package casing, complete forming the protection to F-P pressure sensor; The front end of optical fiber 6After polishing, puts into polished machine lock pin with holes 5, and parallel with bottom surface, F-P chamber, and the tail end anchor tip 7 of optical fiber 6 is fixingIn the lower end of holder housing 1, and with outside demodulation equipment connection.
Operation principle of the present invention: fibre optic compression sensor sensing principle is to cause the long variation of Fa-Po cavity by pressure, passes throughAccurate measurement change of cavity length amount realizes pressure sensing demodulation. Figure 3 shows that Fabry-Perot sensor structural representation, before Fa-Po cavity existsLatter two reflecting surface. The reflectivity of first reflecting surface is definite by controlling coated reflection rate, and second reflecting surface is that diaphragm is anti-Penetrate rate. The light intensity that incides Fa-Po cavity reflecting surface can be considered Gaussian distribution, and two reflecting surface reverberation are coupled into multimode againOptical fiber, reflectivity and the loss factor of establishing two reflectings surface are respectively: R1、a1、R2、a2。
If incident intensity is I0, the coupling light intensity of two faces is respectively:。
Interference fringe is expressed as:
Wherein represent phasic difference. The variation that the variation of ambient pressure can cause, knows extraneous pressure by measurement.
Although describe the present invention in detail with reference to above-described embodiment, should be appreciated that the present invention is not limited to disclosedEmbodiment.
Claims (10)
1. an integral fibre-optic F-P cavity pressure sensor, comprises a tubbiness package casing (1), is arranged on outside described encapsulationPressure-sensitive diaphragm (2) in thimble body, be fixedly connected on composite dielectric film (3) under described pressure-sensitive diaphragm bottom and with lock pin (5)End recesses baseplane flushes, and stretches out the optical fiber (6) outside described package casing bottom through lock pin, it is characterized in that: compound JiePlasma membrane (3), axially just to lock pin top groove, is shaped with the pressure-sensitive diaphragm (2) of stress release pore structure, pressure-sensitive diaphragm (2) bondingRegion and pressure-sensitive district form a F-P resonator, lock pin (5) and pressure-sensitive diaphragm by bonding technology combination by the encapsulation of lock pin groove(2) with the form that connects firmly of integrative-structure, be assemblied in above-mentioned package casing (1) by member (4) integral type that connects firmly of circumferential connectionCylindrical shell in.
2. integral type F-P pressure sensor according to claim 1, is characterized in that, optical fiber (6) front end and pressure membraneComposite dielectric film (3) on sheet (2) forms a pair of reflecting surface, and forms interference fringe, outside measuring by measurement stripe informationBoundary's pressure.
3. integral type F-P pressure sensor according to claim 1, is characterized in that, the shape of pressure-sensitive diaphragm (2) isA kind of planform in square, rhombus, circle or hexagon.
4. integral type F-P pressure sensor according to claim 1, is characterized in that, the bonding region of pressure-sensitive diaphragm (2)The strain relief in territory is square, rhombus, circle or hexagon through hole.
5. integral type F-P pressure sensor according to claim 1, is characterized in that, pressure-sensitive diaphragm (2) pressure-sensitive districtSquare, rhombus, circle or the hexagonal hole of strain relief, the degree of depth in hole is 1/3 of pressure-sensitive diaphragm thickness.
6. integral type F-P pressure sensor according to claim 1, is characterized in that, the lower surface of pressure-sensitive diaphragm (2)Be coated with reflectivity and be 30% composite dielectric film.
7. integral type F-P pressure sensor according to claim 1, is characterized in that, in described pressure-sensitive diaphragm (2)On the back side, growth has at least one deck composite dielectric film, and described composite dielectric film is SiO2/Ta2O5Film, Si3N4/Ta2O5Film orSiO2/Ta2O5/Si3N4In the plural layers of at least one combination form.
8. integral type F-P pressure sensor according to claim 7, is characterized in that, described pressure-sensitive diaphragm (2) back sideComposite dielectric film be or silicon nitride Si3N4, tantalum pentoxide Ta2O5Plural layers, or SiO2、Ta2O5、Si3N4Plural layers.
9. integral type F-P pressure sensor according to claim 1, is characterized in that, pressure-sensitive diaphragm (2) is with 100 crystal orientationHigh-quality silicon chip, at its silicon chip one side sputter composite dielectric film being formed by multilayer dielectric film of growing, mineralization pressure diaphragm (2).
10. integral type F-P pressure sensor according to claim 1, is characterized in that, composite dielectric film (3) is grown inThe back side of pressure-sensitive diaphragm (2) is as light reflection surface, and pressure-sensitive diaphragm (2) is connected to form F-P chamber with lock pin (5) by anode linkage,Lock pin (5) is connected with package casing (1) by connecting firmly member (4).
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| CN201610099847.9A CN105606277A (en) | 2016-02-23 | 2016-02-23 | Integrated fiber F-P chamber pressure sensor |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106247161A (en) * | 2016-07-19 | 2016-12-21 | 昆山雅宝信息科技有限公司 | Use the high accuracy LNG gas station of incorporated light fiber sensor |
| CN106287223A (en) * | 2016-07-19 | 2017-01-04 | 昆山雅宝信息科技有限公司 | LNG gas station metering device based on optical fiber F P cavity pressure sensor |
| WO2019109905A1 (en) * | 2017-12-05 | 2019-06-13 | 北京佰为深科技发展有限公司 | Fabry-perot sensor and method for manufacturing same |
| CN110160913A (en) * | 2019-06-24 | 2019-08-23 | 南方科技大学 | Liquid densimeter and liquid density measurement system |
| CN112345153A (en) * | 2020-10-29 | 2021-02-09 | 中国地质调查局水文地质环境地质调查中心 | High-temperature-resistant optical fiber pressure sensor and packaging process thereof |
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Application publication date: 20160525 |