CN105592677B - The masking structure of the anti-electromagnetic interference of electronic component - Google Patents
The masking structure of the anti-electromagnetic interference of electronic component Download PDFInfo
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- CN105592677B CN105592677B CN201410648476.6A CN201410648476A CN105592677B CN 105592677 B CN105592677 B CN 105592677B CN 201410648476 A CN201410648476 A CN 201410648476A CN 105592677 B CN105592677 B CN 105592677B
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- electronic component
- lid
- masking structure
- electromagnetic interference
- transmission element
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Abstract
A kind of masking structure of the anti-electromagnetic interference of electronic component has a lid, which is pasted with an at least thermal transmission element at the first side position, and contacts an at least electronic component in the second side position of lid；Whereby, the setting of the lid can play optimal electromagnetic shielding effect through the invention, and can achieve the effect that radiate rapidly via the configuration of thermal transmission element again.
Description
Technical field
The present invention relates to a kind of anti electromagnetic interference structure more particularly to a kind of anti-electromagnetism of electronic component with heat sinking function
The masking structure of interference.
Background technique
General electronic equipment such as mobile phone, tablet computer or other electronic devices etc. can all install many electronics
Element, when electronic equipment operates or operates, these electronic components will generate a degree of electromagnetic field, this waits electronic components
It will be generated between generated electromagnetic field and interfere with each other, obstruct, and then influence the normal operation of electronic equipment, and electromagnetic wave
It Radiation On Human body can also damage outward, this phenomenon is referred to as EMI (Electro Magnetic Interference；
Electromagnetic Interference).
Generally prevent the mode of EMI from having water power plating, electrical plating, vacuum splashing and plating and spraying conductive paint etc. at present, or directly
Electromagnetic wave is shielded plus the electromagnetic shielding of metalwork material appropriate in the outside of electronic component, and due to metalwork masking
Cost is relatively low and meets current environmental regulation for method, therefore is most often used；Common electromagnetic armouring structure be metal material such as
The integrally formed cover such as stainless steel, aluminium foil, ironware or almag or lid, the cover have roof and from roof week marginal lappets
Support (side) wall directly extended.The cover is provide with (or lid is set) on the outside of the electronic component of required shielding when use, and
By welding or other etc. modes by supporting walls, it is fixed on circuit boards.
But existing electromagnetic armouring structure only has the function of merely electromagnetic wave shielding.But in fact, electronic component exists
Operation or in use, in addition to it can generate electromagnetic wave, in actual use, in running, electronic component still can also generate heat, these
Heat, which is collected in cover, to be dissipated outward, and the heat conduction velocity of the electromagnetic armouring structure of metal material is again too slow,
Be exactly cover can not it is efficient by electronic component generate heat pass outward, will lead to electronic component generation heat
Persistently increase, causes the service life for the electronic component being provide with by cover short or efficiency reduces.Therefore how to reach optimal electromagnetic screen
Covering effect and having splendid heat dissipation effect again is project of the invention.
Summary of the invention
Therefore, effectively to solve the above problems, the main purpose of the present invention is to provide one kind to reach optimal electromagnetic screen
Cover effect, and the masking structure of the anti-electromagnetic interference of electronic component with splendid radiating efficiency.
In order to achieve the above object, the present invention provides a kind of masking structure of anti-electromagnetic interference of electronic component, covering or masking are extremely
A few electronic component, which includes: a lid, has one first side and a second side, and an at least thermal transmission element attaches
In first side, and a second side contacts at least electronic component.
The lid further includes an at least side, which is formed in around the lid and extends vertically in described first
Side and second side, and a shielding space is defined to accommodate an at least electronic component with described second side.
An at least groove is formed at first side position, and the thermal transmission element is located in the groove, and this second
Side is with respect to being formed with an at least attaching face at the groove location, electronic component described in the attaching face contact.
The lid is anti electromagnetic wave material.
The anti electromagnetic wave material includes metal.
The side is more formed with multiple fixation holes.
It is formed with an opening at a groove at least side position, and the thermal transmission element passes through the opening.
The electronic component is set on a circuit board, which sets with a center mutually group, and the thermal transmission element is logical
It crosses the opening and attaches the center.
The hot leaflet member is that heat pipe or hot plate are any.
Whereby, through the lid in addition to the electromagnetic wave of maskable electronic component, and can be first by electronics via thermal transmission element
Part heat radiates rapidly.
Detailed description of the invention
Figure 1A is the stereogram exploded view of the first preferred embodiment of masking structure of the present invention；
Figure 1B is the three-dimensional combination figure of the first preferred embodiment of masking structure of the present invention；
Fig. 1 C is the assembled sectional view of the first preferred embodiment of masking structure of the present invention；
Fig. 2A is the implementation diagram for the first preferred embodiment that the present invention is provide with electronic component；
Fig. 2 B is the schematic cross-sectional view for the first preferred embodiment that the present invention is provide with electronic component；
Fig. 3 A is the stereogram exploded view of the second preferred embodiment of masking structure of the present invention；
Fig. 3 B is the three-dimensional combination figure of the second preferred embodiment of masking structure of the present invention；
Fig. 3 C is another angle stereoscopic schematic diagram of the second preferred embodiment of masking structure of the present invention；
Fig. 3 D is the assembled sectional view of the second preferred embodiment of masking structure of the present invention；
Fig. 4 A is the implementation diagram one for the second preferred embodiment that the present invention is provide with electronic component；
Fig. 4 B is the implementation diagram two for the second preferred embodiment that the present invention is provide with electronic component；
Fig. 4 C is the schematic cross-sectional view for the second preferred embodiment that the present invention is provide with electronic component；
Fig. 5 A is the implementation diagram one for the third preferred embodiment that the present invention is provide with electronic component；
Fig. 5 B is the implementation diagram two for the third preferred embodiment that the present invention is provide with electronic component；
Fig. 5 C is the schematic cross-sectional view for the third preferred embodiment that the present invention is provide with electronic component；
Fig. 6 A is the implementation diagram one for the 4th preferred embodiment that the present invention is provide with electronic component；
Fig. 6 B is the implementation diagram two for the 4th preferred embodiment that the present invention is provide with electronic component.
Symbol description
Masking structure 1
Lid 2
Thermal transmission element 3
First side 21
Groove 211
Opening 212
Second side 22
Attaching face 221
Side 23
Shielding space 24
Fixation hole 231
Circuit board 4
Electronic component 41
Center 5
Bottom case 6
LCD MODULE 7
Specific embodiment
Below with reference to drawing, the embodiment of the present invention is explained in detail:
Above-mentioned purpose and its structure of the invention and characteristic functionally, the preferred embodiment according to institute's attached drawing is said
It is bright.
Please refer to shown in Figure 1A and Figure 1B and Fig. 1 C, be the first preferred embodiment of masking structure of the present invention stereo decomposing and
Solid combination and assembled sectional view, as shown, masking structure of the present invention includes a lid 2 and an at least thermal transmission element 3, wherein
The lid 2 is anti electromagnetic wave material, and its anti electromagnetic wave material includes metal, and the lid 2 has one first side 21 and one
Second side 22 of opposite first side 21, wherein first side 21 is presented in planar fashion in this present embodiment, and the heat passes member
Part 3 attaches first side 21, and the thermal transmission element 3 is that heat pipe or hot plate (temperature-uniforming plate) are any, in this present embodiment with
Heat pipe is embodiment, but is not therefore limited, and second side of the another lid 2 is also to present in planar fashion, and the lid 2 more wraps
An at least side 23 is included, which is formed in around the lid 2 and extends vertically in first side 21 and second side 22,
And the side and described second side 22 define a shielding space 24, the another side 23 is more formed with multiple fixation holes 231.
It separately please refers to shown in Fig. 2A and Fig. 2 B, the reality of the first preferred embodiment of electronic component is provide with for masking structure of the present invention
Schematic diagram and schematic cross-sectional view are applied, wherein the masking structure 1 is arranged on the circuit board 4 for being provide with and covering a circuit board 4
There is an at least electronic component 41, and in this present embodiment, second side 22 of the lid 2 is attached on the electronic component 41, separately
The shielding space 24 defined between side 23 and second side 22 around its lid 2 then shields its circuit board 4, and is secured by it hole
231 connect with the fixed group of circuit board 4, are attached at the fixation of its second side 22 on the electronic component 41 that need to be radiated, and then reach
Its lid 2 can play optimal shield effectiveness, the electromagnetic wave of maskable electronic component 41, and can be attached by second side 22 described
Electronic component 41 and absorb its heat, enable thermal transmission element 3 can by by the heat of 22 stick electronic components 41 of second side through described
The conduction of side 21 to cold end radiates.
It please refers to shown in Fig. 3 A and Fig. 3 B and Fig. 3 C and Fig. 3 D, is the solid of the second preferred embodiment of masking structure of the present invention
Decomposition and three-dimensional combination and another angle stereoscopic schematic diagram and assembled sectional view, the present embodiment part-structure and aforementioned first are implemented
Example is identical, therefore will not be described in great detail herein, and only the present embodiment and aforementioned first embodiment do not exist together for 21 position of the first side
Place is formed with an at least groove 211, and its groove 211 is formed at least one opening 212 at an at least side position, and the heat passes
Element 3 is installed in the groove 211 and attaches the groove 211, and the thermal transmission element 3 is that heat pipe or hot plate are any, in
Using heat pipe as embodiment in the present embodiment, but therefore it is not limited, the another lid 2 is formed at least one at 22 position of second side
Attaching face 221, the opposite side being formed at 211 position of groove in the attaching face 221.
It separately please refers to shown in Fig. 4 A and Fig. 4 B and Fig. 4 C, is provide with electronic component second for masking structure of the present invention and preferably implements
The implementation diagram one and implementation diagram two and schematic cross-sectional view of example, wherein the masking structure 1 is used to be provide with and shelter
Circuit board 4 is stated, the electronic component 41 is provided on the circuit board 4, and in this present embodiment, lid 2 is in the first side 21
Groove 211 is sticked for the thermal transmission element 3, and the another groove 211 is also opposite simultaneously to form in 41, electronic component for need to radiating
Place is set, and the opposite attaching face 221 being formed at 211 1 side position of groove of its second side 22 is then attached at the electronic component 41
On, the shielding space 24 defined between the side 23 and second side 22 around its another lid 2 then shields its circuit board 4, and is consolidated by it
Determine hole 231 to connect with the fixed group of circuit board 4, fix its attaching face 221 must and be attached on the electronic component 41 that need to be radiated, into
And optimal shield effectiveness, the electromagnetic wave of maskable electronic component 41 can be played by reaching its lid 2, and can pass through thermal transmission element
3 provide the effect to radiate rapidly.
It is please referred to shown in Fig. 5 A and Fig. 5 B and Fig. 5 C again, is provide with electronic component third for masking structure of the present invention and preferably implements
The implementation diagram one and implementation diagram two and schematic cross-sectional view of example, in this present embodiment, single lid 2 is corresponding but one needs
The electronic component 41 of heat dissipation, the first side 21 of each lid 2 all have the groove 211, and the attaching face 221 of second side 22
Then corresponding to attach each electronic component 41, its another groove 211 is formed with the opening 212 at an at least side position, so that its
When thermal transmission element 3 is set on the groove 211 of one, thermal transmission element 3 can pass through the recessed of the opening 212 to another lid 2
Slot 211, enabling its each electronic component 41 that need to be radiated all can be carried out thermally conductive and be radiated by its thermal transmission element 3, and then reach it
Lid 2 can play optimal shield effectiveness, the electromagnetic wave of maskable circuit board 4 and electronic component 41, and thermal transmission element 3 is enabled to mention
The effect to radiate rapidly for one.
It is please referred to shown in Fig. 6 A and Fig. 6 B again, the reality of the 4th preferred embodiment of electronic component is provide with for masking structure of the present invention
Schematic diagram one and implementation diagram two are applied, the present embodiment part-structure is identical as aforementioned first embodiment, therefore will no longer go to live in the household of one's in-laws on getting married herein
It states, only 5 mutual groups of center not existed together for the circuit board 4 with hand-hold device of the present embodiment and aforementioned first embodiment
It connects, and its groove 211 is formed with the opening 212 at an at least side position, and the thermal transmission element 3 on its groove 211 passes through
The opening 212 and is attached on the center 5, its heat of its electronic component 41 can be made to be absorbed by lid 2, and thermal transmission element 3
It absorbs the heat of its lid 2 and conducts heat on center 5 by center 5 while carrying out thermally conductive, and then reach this and can pass through heat
Pass the effect that element 3 radiates rapidly；The another hand-held device has more a bottom case 6 and a LCD MODULE 7, and the circuit board 4
It is to be set on the bottom case 6, and its 3 one end of thermal transmission element can pass through center 5 and attach bottom case 6, and be somebody's turn to do after being connect with 5 groups of center
LCD MODULE 7 is then set on the thermal transmission element 3 and center 5, therefore and the thermal transmission element 3 is removed and can be carried out by center 5
It is thermally conductive outer, it can separately be carried out via the bottom case 6 with LCD MODULE 7 thermally conductive, and then reaching this can be by thermal transmission element 3 rapidly
The effect of heat dissipation.
Although the embodiments of the present invention have been disclosed as above, but its is not only in the description and the implementation listed
With it can be fully applied to various fields suitable for the present invention, for those skilled in the art, can be easily
Realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is simultaneously unlimited
In specific details and legend shown and described herein.
Claims (6)
1. a kind of masking structure of the anti-electromagnetic interference of electronic component, covering or the plural electronic component of masking, the masking structure include:
There is one lid one first side and a second side and an at least side, the side to be formed in around the lid and extend vertically
A shielding space is defined to accommodate the plural number electronic component, at least in first side and second side, and with described second side
One thermal transmission element radially extends along the lid and is attached at first side, and the opposite end of the thermal transmission element is respectively correspondingly arranged in
The opposite end of the lid, and second side contacts plural number electronic components are formed with plural groove at first side position, institute
It states and is formed with an opening at a groove at least side position, the open communication plural number groove, and the thermal transmission element is opened by described
Mouth is located in the plural number groove, and the second side is pasted with respect to the plural number for protruding from second side is formed at the plural number groove location
Attached face, the plural number attach electronic component described in face contact.
2. the masking structure of the anti-electromagnetic interference of electronic component as described in claim 1, wherein the lid is anti electromagnetic wave material
Matter.
3. the masking structure of the anti-electromagnetic interference of electronic component as claimed in claim 2, wherein the anti electromagnetic wave material includes gold
Belong to.
4. the masking structure of the anti-electromagnetic interference of electronic component as described in claim 1, wherein the side be more formed with it is multiple
Fixation hole.
5. the masking structure of the anti-electromagnetic interference of electronic component as described in claim 1, wherein the electronic component is set to one
On circuit board, which sets with a center mutually group, and the thermal transmission element by the opening and attaches the center.
6. the masking structure of the anti-electromagnetic interference of electronic component as described in claim 1, wherein the hot leaflet member be heat pipe or
Hot plate is any.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410648476.6A CN105592677B (en) | 2014-11-14 | 2014-11-14 | The masking structure of the anti-electromagnetic interference of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410648476.6A CN105592677B (en) | 2014-11-14 | 2014-11-14 | The masking structure of the anti-electromagnetic interference of electronic component |
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| Publication Number | Publication Date |
|---|---|
| CN105592677A CN105592677A (en) | 2016-05-18 |
| CN105592677B true CN105592677B (en) | 2019-09-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410648476.6A Active CN105592677B (en) | 2014-11-14 | 2014-11-14 | The masking structure of the anti-electromagnetic interference of electronic component |
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| CN (1) | CN105592677B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801353B (en) * | 2016-09-07 | 2019-08-06 | 宏碁股份有限公司 | Portable electronic device |
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| CN204578967U (en) * | 2014-11-14 | 2015-08-19 | 奇鋐科技股份有限公司 | The masking structure of the anti-electromagnetic interference of electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN202496170U (en) * | 2011-11-24 | 2012-10-17 | 比亚迪股份有限公司 | Shielding structure and mobile terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2572732Y (en) * | 2002-09-26 | 2003-09-10 | 纬创资通股份有限公司 | Heat sink for heat-producing component on circuit board |
| CN1503357A (en) * | 2002-11-27 | 2004-06-09 | 国际商业机器公司 | Colling mechanism for electronic equipment |
| CN1642401A (en) * | 2004-01-16 | 2005-07-20 | 华硕电脑股份有限公司 | Electronic device and its screening element |
| CN102412215A (en) * | 2010-09-23 | 2012-04-11 | 富瑞精密组件（昆山）有限公司 | Heat radiation module and electronic device using the same |
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| CN203167516U (en) * | 2013-01-21 | 2013-08-28 | 吴哲元 | Electric conduction and heat conduction apparatus for electronic shielding cover |
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| Publication number | Publication date |
|---|---|
| CN105592677A (en) | 2016-05-18 |
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