CN105489738B - Colour temperature is aobvious to refer to adjustable white light LED part, preparation method and regulation method - Google Patents
Colour temperature is aobvious to refer to adjustable white light LED part, preparation method and regulation method Download PDFInfo
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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Abstract
本发明揭示一种色温显指可调的白光LED器件、其制备方法及调控方法。白光LED器件包括：主体支架；形成于主体支架的第一碗杯及第二碗杯；固定于第一碗杯内的第一蓝色LED芯片；以及固定于第二碗杯内的第二蓝色LED芯片；第一荧光胶层，将第一蓝色LED芯片密封于第一碗杯内；以及，第二荧光胶层，将第二蓝色LED芯片密封于第二碗杯内；第一荧光胶层具有低色温高显指配比，第二荧光胶层具有高色温低显指配比；或，第一荧光胶层具有高色温低显指配比，第二荧光胶层具有低色温高显指配比。将两种不同荧光胶层分别注胶于两个碗杯中，分别控制两个芯片的电流，实现色温显指可控，突破传统至少需要两种颜色芯片才能实现色温可调的结构设计。
The invention discloses a white light LED device with adjustable color temperature display, a preparation method and a control method thereof. The white light LED device includes: a main body support; a first bowl and a second bowl formed on the main support; a first blue LED chip fixed in the first bowl; and a second blue LED chip fixed in the second bowl. color LED chip; the first fluorescent adhesive layer seals the first blue LED chip in the first bowl; and the second fluorescent adhesive layer seals the second blue LED chip in the second bowl; the first The fluorescent adhesive layer has a low color temperature and high CRI ratio, and the second fluorescent adhesive layer has a high color temperature and low CRI ratio; or, the first fluorescent adhesive layer has a high color temperature and low CRI ratio, and the second fluorescent adhesive layer has a low color temperature High display ratio. Two different fluorescent glue layers are injected into the two bowls respectively, and the currents of the two chips are respectively controlled to realize the controllable color temperature display. Breaking through the traditional structural design that at least two color chips are required to realize the adjustable color temperature.
Description
技术领域technical field
本发明涉及LED器件领域，尤其涉及一种色温显指可调的白光LED器件、其制备方法及调控方法。The invention relates to the field of LED devices, in particular to a white LED device with adjustable color temperature display, a preparation method and a control method thereof.
背景技术Background technique
现有技术中，实现色温可控的单颗LED器件，主要有以下结构：In the prior art, a single LED device that realizes controllable color temperature mainly has the following structure:
1.单颗LED器件负载红、绿及蓝三种颜色的芯片，通过控制电流达到色温可控；2.单颗LED器件负载红及蓝两种颜色的芯片，并使用黄色荧光粉封胶，通过控制红色芯片的电流达到色温可控；3.单颗LED器件负载白及红两种颜色芯片，通过控制红色芯片电流达到色温可控。1. A single LED device is loaded with red, green and blue chips, and the color temperature can be controlled by controlling the current; 2. A single LED device is loaded with red and blue chips, and is sealed with yellow phosphor powder. The color temperature can be controlled by controlling the current of the red chip; 3. A single LED device is loaded with white and red chips, and the color temperature can be controlled by controlling the current of the red chip.
上述三种结构的单颗LED器件虽然可以实现色温可控的目的，但需要至少两种不同颜色的LED芯片，并且还分别具有下述缺陷：Although the single LED devices with the above three structures can achieve the purpose of controlling the color temperature, they require at least two LED chips of different colors, and each has the following defects:
1.传统红、绿及蓝三种颜色芯片相互搭配的结构，对应的单颗LED器件能耗大，造价昂贵，经济效益差。2.传统红、蓝及黄三种颜色芯片相互搭配的结构，则具有如下缺点：首先，对应的单颗LED器件生产工序相对繁琐，主要体现在红色芯片与蓝色芯片、黄色芯片分别需要使用不同的底胶进行固晶，较多的焊线会降低生产的速度；其次，对应的单颗LED器件中，一旦三种颜色芯片中的其中任意一种颜色芯片的出光出现问题，整个单颗LED器件都会失效，造成其他颜色芯片的浪费；再次，传统红、蓝及黄三种芯片相互搭配的结构中，生产单颗LED器件需要使用的基板线路更为复杂，并且需要搭配相对复杂的控制电源。3.传统蓝及红色两种芯片相互搭配的结构，主要是通过封胶工序中所采用的黄色荧光粉控制色温，这种结构相对红、绿及蓝三种颜色芯片相互搭配以及红、蓝及黄三种颜色芯片相互搭配的结构来说，能耗要低，但众所周知，红色芯片利用率低，经济效益没有得到太大改善，调控的色坐标点跟普朗克曲线无法契合。4.传统白及红色两种芯片相互搭配的结构，由于白色芯片不成熟，经济效益也较差，光效低且显指不可控。1. The structure of traditional red, green and blue color chips matching with each other, the corresponding single LED device consumes a lot of energy, is expensive, and has poor economic benefits. 2. The traditional matching structure of red, blue and yellow chips has the following disadvantages: First, the production process of the corresponding single LED device is relatively cumbersome, which is mainly reflected in the need to use red chips, blue chips, and yellow chips respectively. Die-bonding with different primers, more bonding wires will reduce the production speed; secondly, in the corresponding single LED device, once there is a problem with the light emission of any one of the three color chips, the entire single LED device LED devices will fail, resulting in the waste of other color chips; thirdly, in the traditional red, blue and yellow chip structure, the substrate circuit required to produce a single LED device is more complicated, and it needs to be equipped with relatively complex control. power supply. 3. The structure of the traditional blue and red chips matching each other is mainly to control the color temperature through the yellow phosphor used in the sealing process. This structure is relatively red, green and blue. In terms of the structure in which the yellow chips are matched with each other, the energy consumption is lower, but as we all know, the utilization rate of the red chips is low, the economic benefits have not been greatly improved, and the adjusted color coordinate points cannot fit the Planck curve. 4. The traditional white and red chips match each other. Because the white chip is immature, the economic benefit is also poor, the light efficiency is low, and the CRI is uncontrollable.
发明内容Contents of the invention
针对现有技术中单颗LED器件需要至少两种不同颜色的LED芯片才能实现色温调控的问题，本发明提供一种色温显指可调的白光LED器件、其制备方法及调节方法，本发明中白光LED器件只需要一种颜色的LED芯片即能实现色温及显指的调控。Aiming at the problem in the prior art that a single LED device requires at least two LED chips of different colors to achieve color temperature control, the present invention provides a white LED device with adjustable color temperature display, its preparation method and adjustment method. In the present invention White light LED devices only need LED chips of one color to realize the control of color temperature and CRI.
为了解决上述技术问题，本发明的第一方面，揭示了一种色温显指可调的白光LED器件，其包括：In order to solve the above technical problems, the first aspect of the present invention discloses a white LED device with adjustable color temperature display, which includes:
主体支架；main frame;
形成于主体支架上的第一碗杯及第二碗杯；a first bowl and a second bowl formed on the main frame;
固定于第一碗杯内的第一蓝色LED芯片；a first blue LED chip fixed in the first bowl;
固定于第二碗杯内的第二蓝色LED芯片；a second blue LED chip fixed in the second bowl;
第一荧光胶层，用以将第一蓝色LED芯片密封于第一碗杯内；以及，The first fluorescent adhesive layer is used to seal the first blue LED chip in the first bowl; and,
第二荧光胶层，用以将第二蓝色LED芯片密封于第二碗杯内；The second fluorescent glue layer is used to seal the second blue LED chip in the second bowl;
其中，第一荧光胶层为低色温高显指配比的荧光胶层，第二荧光胶层为高色温低显指配比的荧光胶层；或，第一荧光胶层为高色温低显指配比的荧光胶层，第二荧光胶层为低色温高显指配比的荧光胶层。Wherein, the first fluorescent adhesive layer is a fluorescent adhesive layer with low color temperature and high CRI ratio, and the second fluorescent adhesive layer is a fluorescent adhesive layer with high color temperature and low CRI ratio; or, the first fluorescent adhesive layer is a fluorescent adhesive layer with high color temperature and low CRI ratio. The fluorescent adhesive layer with a finger ratio, and the second fluorescent adhesive layer is a fluorescent adhesive layer with a low color temperature and a high color rendering ratio.
本发明中的白光LED器件，突破了传统至少需要两种颜色芯片相组合才能实现色温可调的结构设计，将低色温高显指配比的荧光胶层与高色温低显指配比的荧光胶层分别注胶于两个碗杯中，通过自由控制两个蓝色LED芯片的电流，即可实现色温显指可控。本发明白光LED器件只需通过控制两个蓝色LED芯片的电流大小，即可实现色温显指的调控，有效的降低了制备成本，经济效益好。The white light LED device in the present invention breaks through the traditional structural design that requires at least two color chips to be combined to realize the adjustable color temperature. The glue layer is injected into the two bowls respectively, and the color temperature display can be controlled by freely controlling the current of the two blue LED chips. The white light LED device of the present invention can realize the regulation and control of the color temperature display finger only by controlling the current magnitude of the two blue LED chips, effectively reduces the preparation cost, and has good economic benefits.
根据本发明的一实施方式，白光LED器件还包括：According to an embodiment of the present invention, the white light LED device further includes:
第一隔离支架，第一隔离支架纵向设置于第一碗杯与第二碗杯之间，用以隔开第一蓝色LED芯片以及第二蓝色LED芯片。纵向隔离第一蓝色LED芯片及第二蓝色LED芯片，使主体支架中可以有更多有效的利用空间，利于两个蓝色LED芯片的放置，并提高白光LED器件生产工艺的可靠性及出光的均匀性。The first isolating bracket, the first isolating bracket is arranged longitudinally between the first bowl and the second bowl to separate the first blue LED chip and the second blue LED chip. Longitudinal isolation of the first blue LED chip and the second blue LED chip enables more effective use of space in the main frame, facilitates the placement of the two blue LED chips, and improves the reliability and reliability of the white LED device production process. Uniformity of light output.
根据本发明的一实施方式，白光LED器件还包括：According to an embodiment of the present invention, the white light LED device further includes:
用以隔开白光LED器件正极引脚及负极引脚的第二隔离支架及第三隔离支架；A second isolating bracket and a third isolating bracket used to separate the positive pin and the negative pin of the white light LED device;
第二隔离支架横向设置于第一碗杯内；The second isolation bracket is horizontally arranged in the first bowl;
第三隔离支架横向设置于第二碗杯内。The third isolation bracket is horizontally arranged in the second bowl.
根据本发明的一实施方式，白光LED器件中：According to an embodiment of the present invention, in the white light LED device:
第二隔离支架与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离；第三隔离支架与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离；The distance between the second isolation bracket and the positive pin of the white light LED device is equal to the distance between it and the negative pin of the white light LED device; the distance between the third isolation bracket and the positive pin of the white light LED device is equal to the distance between it and the negative pin of the white light LED device;
或，第二隔离支架与白光LED器件正极引脚的距离大于其与白光LED器件负极引脚的距离；第三隔离支架与白光LED器件的正极引脚的距离大于其与白光LED器件的负极引脚的距离。Or, the distance between the second isolation bracket and the anode pin of the white light LED device is greater than the distance between it and the cathode pin of the white light LED device; the distance between the third isolation bracket and the anode pin of the white light LED device is greater than that foot distance.
根据本发明的一实施方式，白光LED器件中：According to an embodiment of the present invention, in the white light LED device:
低色温高显指配比的荧光胶层包括以下组分：红粉、黄粉、A胶、B胶以及防沉粉；红粉、黄粉、A胶、B胶以及防沉粉的重量比依次为(0.005～0.02)：(0.12～0.48)：0.2：0.8：(0.005～0.02)；The fluorescent glue layer with low color temperature and high CRI includes the following components: red powder, yellow powder, A glue, B glue and anti-settling powder; the weight ratio of red powder, yellow powder, A glue, B glue and anti-settling powder is (0.005 ~0.02):(0.12~0.48):0.2:0.8:(0.005~0.02);
或，低色温高显指配比的荧光胶层包括以下组分：红粉、黄绿粉、A胶、B胶以及防沉粉；红粉、黄绿粉、A胶、B胶以及防沉粉的重量比依次为(0.0025～0.01)：(0.15～0.6)：0.2：0.8：(0.005～0.02)。Or, the fluorescent adhesive layer with low color temperature and high CRI includes the following components: red powder, yellow-green powder, A glue, B glue and anti-settling powder; red powder, yellow-green powder, A glue, B glue and anti-settling powder The weight ratio is (0.0025～0.01):(0.15～0.6):0.2:0.8:(0.005～0.02).
根据本发明的一实施方式，白光LED器件中：According to an embodiment of the present invention, in the white light LED device:
高色温低显指配比的荧光胶层包括以下组分：黄粉、A胶、B胶以及防沉粉，黄粉、A胶、B胶以及防沉粉的重量比依次为：(0.08～0.32)：0.2：0.8：(0.005～0.02)。The fluorescent glue layer with high color temperature and low CRI includes the following components: yellow powder, A glue, B glue and anti-settling powder. The weight ratio of yellow powder, A glue, B glue and anti-settling powder is: (0.08～0.32) :0.2:0.8:(0.005～0.02).
本发明的第二方面揭示了一种色温显指可调的白光LED器件的制备方法，其包括如下步骤：The second aspect of the present invention discloses a method for preparing a white LED device with adjustable color temperature display, which includes the following steps:
开模：在主体支架上形成第一碗杯及第二碗杯；Mold opening: form the first bowl and the second bowl on the main frame;
固晶：将第一蓝色LED芯片固定于第一碗杯内，第二蓝色LED芯片固定于第二碗杯内；Solid crystal: fix the first blue LED chip in the first bowl, and fix the second blue LED chip in the second bowl;
焊线：分别焊接第一蓝色LED芯片及第二蓝色LED芯片的正负极；Welding wire: Weld the positive and negative poles of the first blue LED chip and the second blue LED chip respectively;
封胶：将第一荧光胶层注胶于第一碗杯内，密封第一蓝色LED芯片；将第二荧光胶层注胶于第二碗杯内，密封第二蓝色LED芯片；Glue sealing: inject the first fluorescent adhesive layer into the first bowl to seal the first blue LED chip; inject the second fluorescent adhesive layer into the second bowl to seal the second blue LED chip;
其中，第一荧光胶层为低色温高显指配比的荧光胶层，第二荧光胶层为高色温低显指配比的荧光胶层；或，第一荧光胶层为高色温低显指配比的荧光胶层，第二荧光胶层为低色温高显指配比的荧光胶层。Wherein, the first fluorescent adhesive layer is a fluorescent adhesive layer with low color temperature and high CRI ratio, and the second fluorescent adhesive layer is a fluorescent adhesive layer with high color temperature and low CRI ratio; or, the first fluorescent adhesive layer is a fluorescent adhesive layer with high color temperature and low CRI ratio. The fluorescent adhesive layer with a finger ratio, and the second fluorescent adhesive layer is a fluorescent adhesive layer with a low color temperature and a high color rendering ratio.
根据本发明的一实施方式，其中的开模步骤中：According to one embodiment of the present invention, in the mold opening step wherein:
主体支架还形成有第一隔离支架：The body bracket is also formed with a first spacer bracket:
第一隔离支架纵向形成于第一碗杯与第二碗杯之间，用以隔开第一蓝色LED芯片以及第二蓝色LED芯片。The first isolating bracket is longitudinally formed between the first bowl and the second bowl to separate the first blue LED chip and the second blue LED chip.
根据本发明的一实施方式，其中的开模步骤中：According to one embodiment of the present invention, in the mold opening step wherein:
主体支架还形成有用以隔开白光LED器件正极引脚及负极引脚的第二隔离支架及第三隔离支架；The main body bracket also forms a second isolation bracket and a third isolation bracket for separating the positive pin and the negative pin of the white light LED device;
第二隔离支架横向形成于第一碗杯内；The second spacer bracket is horizontally formed in the first bowl;
第三隔离支架横向形成于第二碗杯内。The third spacer bracket is horizontally formed in the second bowl.
本发明的第三方面，揭示了一种白光LED器件色温显指调控方法，其包括如下步骤：The third aspect of the present invention discloses a method for controlling the color temperature display of a white LED device, which includes the following steps:
电流调控：调节第一碗杯的电流，第一碗杯的功率由第一功率初始百分比变为第一功率调节百分比P1；调节第二碗杯的电流，第二碗杯的功率由第二功率初始百分比变为第二功率调节百分比P2；Current regulation: adjust the current of the first bowl, the power of the first bowl changes from the initial percentage of the first power to the first power adjustment percentage P1; adjust the current of the second bowl, the power of the second bowl changes from the second The initial percentage of power becomes the second power adjustment percentage P 2 ;
亮度调控：白光LED器件的亮度由初始亮度变为：Brightness control: The brightness of white LED devices changes from the initial brightness to:
P1×第一碗杯的最高亮度+P2×第二碗杯的最高亮度；P 1 × the highest brightness of the first bowl + P 2 × the highest brightness of the second bowl;
色温调控：白光LED器件的色温由初始色温变为：Color temperature control: The color temperature of white LED devices changes from the initial color temperature to:
显指调控：白光LED器件的显指由初始显指变为：Display finger control: The display finger of the white LED device changes from the initial display finger to:
其中，电流调控步骤中，第一碗杯的电流调节及第二碗杯的电流调节顺序不分先后；在进行电流调控后，白光LED器件的亮度、色温及显指随电流调控同时发生变化。Among them, in the current regulation step, the current regulation of the first bowl and the current regulation of the second bowl are in no particular order; after the current regulation, the brightness, color temperature and CRI of the white LED device change simultaneously with the current regulation.
附图说明Description of drawings
图1为本发明实施例一中采用正装芯片时白光LED器件的正面视图；Fig. 1 is a front view of a white LED device when front-mounted chips are used in Embodiment 1 of the present invention;
图2为本发明实施例一中采用倒装芯片时白光LED器件的正面视图；2 is a front view of a white LED device when a flip chip is used in Embodiment 1 of the present invention;
图3为本发明实施例一中白光LED器件的底面视图；3 is a bottom view of a white LED device in Embodiment 1 of the present invention;
图4为本发明实施例一中白光LED器件的侧视图。FIG. 4 is a side view of a white LED device in Embodiment 1 of the present invention.
附图标记说明：10、主体支架；101、第一碗杯；102、第二碗杯；201、第一蓝色LED芯片、202、第二蓝色LED芯片；301、第一荧光胶层；302、第二荧光胶层；401、第一隔离支架；402、第二隔离支架；403、第三隔离支架；404、第一正极引脚；405、第一负极引脚；406、第二正极引脚；407、第二负极引脚；408、第一金线；409、第二金线；410、第三金线；411、第四金线；412、第一热沉；413、第二热沉；414、第一防溢胶结构；415、第二防溢胶结构。Explanation of reference signs: 10, main body bracket; 101, first bowl; 102, second bowl; 201, first blue LED chip, 202, second blue LED chip; 301, first fluorescent adhesive layer; 302, the second fluorescent adhesive layer; 401, the first isolation bracket; 402, the second isolation bracket; 403, the third isolation bracket; 404, the first positive pole pin; 405, the first negative pole pin; 406, the second positive pole Pin; 407, the second negative pin; 408, the first gold wire; 409, the second gold wire; 410, the third gold wire; 411, the fourth gold wire; 412, the first heat sink; 413, the second heat sink; 414, the first anti-overflow structure; 415, the second anti-overflow structure.
具体实施方式Detailed ways
以下将以图式揭露本发明的多个实施方式，为明确说明起见，许多实务上的细节将在以下叙述中一并说明。然而，应了解到，这些实务上的细节不应用以限制本发明。也就是说，在本发明的部分实施方式中，这些实务上的细节是非必要的。此外，为简化图式起见，一些习知惯用的结构与组件在图式中将以简单的示意的方式绘示之。A number of embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some well-known and commonly used structures and components will be shown in a simple schematic manner in the drawings.
关于本文中所使用之“第一”、“第二”等，并非特别指称次序或顺位的意思，亦非用以限定本发明，其仅仅是为了区别以相同技术用语描述的组件或操作而已。The terms "first", "second" and the like used herein do not specifically refer to a sequence or order, nor are they used to limit the present invention, but are only used to distinguish components or operations described with the same technical terms. .
本发明为有关于一种色温显指可调的白光LED器件的设计，以及白光LED器件的制备方法和白光LED器件色温显指调控方法，本发明白光LED器件一方面可以进行色温显指调控，另一方面，还具有现有技术所不具备的简单的结构设计，从而降低器件制备成本。以下，分三个实施例分别详细介绍本发明中色温显指可调的白光LED器件的结构设计，其制备方法及调控方法。The present invention relates to the design of a white LED device with adjustable color temperature display index, as well as the preparation method of the white light LED device and the control method of the color temperature display index of the white light LED device. On the other hand, it also has a simple structural design that is not available in the prior art, thereby reducing device manufacturing costs. In the following, the structural design, preparation method and control method of the white light LED device with adjustable color temperature display in the present invention will be described in detail in three embodiments.
实施例一Embodiment one
请参考图1-4，本实施例提供一种色温显指可调的白光LED器件，白光LED器件包括：主体支架10、第一碗杯101、第二碗杯102、芯片回路以及封胶体。Please refer to Figures 1-4. This embodiment provides a white LED device with adjustable color temperature and display. The white LED device includes: a main body bracket 10, a first bowl 101, a second bowl 102, a chip circuit and an encapsulant.
如图1及2所示，沿着主体支架10的纵向方向，由主体支架10顶面向主体支架10的内部凹陷，形成第一碗杯101及第二碗杯102。第一碗杯101及第二碗杯102形状及尺寸相同。在主体支架10上，还设有两组导电引脚，两组导电引脚与主体支架10一体成型；主体支架10上的两组导电引脚同时作为白光LED器件的导电引脚，与外部电源或外部电路连接。两组导电引脚分别为第一组导电引脚及第二组导电引脚；第一组导电引脚包括第一正极引脚404及第一负极引脚405；第二组导电引脚包括第二正极引脚406及第二负极引脚407，如图1及2，第一正极引脚404设于第一碗杯101的左侧，第一负极引脚405设于第一碗杯101的右侧；第二正极引脚406设于第二碗杯102的左侧，第二负极引脚407设于第二碗杯102的右侧。As shown in FIGS. 1 and 2 , along the longitudinal direction of the main body support 10 , the top surface of the main body support 10 is recessed inside the main body support 10 to form a first bowl 101 and a second bowl 102 . The first bowl 101 and the second bowl 102 have the same shape and size. On the main body bracket 10, there are also two groups of conductive pins, which are integrally formed with the main body bracket 10; the two groups of conductive pins on the main body bracket 10 serve as the conductive pins of the white light LED device at the same time, and are connected with the external power supply. or external circuit connections. The two groups of conductive pins are respectively the first group of conductive pins and the second group of conductive pins; the first group of conductive pins includes the first positive pin 404 and the first negative pin 405; the second group of conductive pins includes the first Two positive pole pins 406 and the second negative pole pin 407, as Fig. 1 and 2, the first positive pole pin 404 is located at the left side of the first bowl cup 101, and the first negative pole pin 405 is located at the left side of the first bowl cup 101 Right side; the second positive pin 406 is set on the left side of the second bowl 102 , and the second negative pin 407 is set on the right side of the second bowl 102 .
芯片回路包括第一芯片电路以及第二芯片电路。第一芯片电路包括电连接的第一电流控制电路及第一蓝色LED芯片201，第一电流控制电路用以控制第一蓝色LED芯片201的电流，第一蓝色LED芯片201固定于第一碗杯101内；第二芯片电路包括电连接的第二电流控制电路及第二蓝色LED芯片202，第二电流控制电路用以控制第二蓝色LED芯片202的电流，第二蓝色LED芯片202固定于第二碗杯102内。优选地，第一蓝色LED芯片201以及第二蓝色LED芯片202可以分别采用正装LED芯片或倒装LED芯片，第一蓝色LED芯片201及第二蓝色LED芯片202的主波长为440nm-480nm，440nm-480nm的波段包括了蓝光所有的波段，根据波段的不同，可以搭配不同的荧光粉达到更好的配光效果。The chip circuit includes a first chip circuit and a second chip circuit. The first chip circuit includes a first current control circuit electrically connected to the first blue LED chip 201, the first current control circuit is used to control the current of the first blue LED chip 201, and the first blue LED chip 201 is fixed on the first blue LED chip 201. In a bowl cup 101; the second chip circuit includes a second current control circuit and a second blue LED chip 202 electrically connected, the second current control circuit is used to control the current of the second blue LED chip 202, the second blue The LED chip 202 is fixed in the second bowl 102 . Preferably, the first blue LED chip 201 and the second blue LED chip 202 can respectively adopt front-mounted LED chips or flip-chip LED chips, and the dominant wavelength of the first blue LED chip 201 and the second blue LED chip 202 is 440nm -480nm, 440nm-480nm waveband includes all blue light wavebands, according to different wavebands, different phosphors can be used to achieve better light distribution effect.
第一电流控制电路可以采用现有技术的电路设计，第一蓝色LED芯片201采用正装芯片或倒装芯片。如图1，当第一蓝色LED芯片201采用正装芯片时，第一蓝色LED芯片201使用白胶固晶，固定于第一碗杯101内，优选固定于第一碗杯101底面正中间位置，第一蓝色LED芯片201采用第一金线408及第二金线409分别焊接其正负极，以与第一电流控制电路实现电连接，第一电流控制电路则分别连接第一正极引脚404及第一负极引脚405。当第一蓝色LED芯片201采用倒装芯片时，如图2，第一蓝色LED芯片201使用锡膏或共晶焊接，固定于第一碗杯101内，并可直接与第一电流控制电路实现电连接，第一电流控制电路则分别连接第一正极引脚404及第一负极引脚405。The first current control circuit can adopt a circuit design in the prior art, and the first blue LED chip 201 can be a front-mount chip or a flip-chip. As shown in Figure 1, when the first blue LED chip 201 is a front-mounted chip, the first blue LED chip 201 is fixed in the first bowl 101 with white glue, preferably in the middle of the bottom of the first bowl 101 position, the first blue LED chip 201 uses the first gold wire 408 and the second gold wire 409 to weld its positive and negative poles respectively to realize electrical connection with the first current control circuit, and the first current control circuit is respectively connected to the first positive pole pin 404 and a first negative pin 405 . When the first blue LED chip 201 adopts a flip chip, as shown in Figure 2, the first blue LED chip 201 is fixed in the first bowl cup 101 using solder paste or eutectic welding, and can be directly connected to the first current control The circuits are electrically connected, and the first current control circuit is respectively connected to the first positive pin 404 and the first negative pin 405 .
第二电流控制电路可以采用现有技术的电路设计，也可与第一电流控制电路的电路设计相同。第二蓝色LED芯片202采用正装芯片或倒装芯片。如图1，当第二蓝色LED芯片202采用正装芯片时，第二蓝色LED芯片202使用白胶固晶，固定于第二碗杯102内，优选固定于第二碗杯102底面正中间位置，第二蓝色LED芯片202采用第三金线410及第四金线411分别焊接其正负极，以与第二电流控制电路实现电连接，第二电流控制电路则分别连接第二正极引脚406及第二负极引脚407。当第二蓝色LED芯片202采用倒装芯片时，如图2，第二蓝色LED芯片202使用锡膏或共晶焊接，固定于第二碗杯102内，并可直接与第二电流控制电路实现电连接，第二电流控制电路则分别连接第二正极引脚406及第二负极引脚407。The second current control circuit can adopt the circuit design of the prior art, or can be the same as the circuit design of the first current control circuit. The second blue LED chip 202 is a front-mount chip or a flip-chip. As shown in Figure 1, when the second blue LED chip 202 is a front-mounted chip, the second blue LED chip 202 is fixed in the second bowl 102 with white glue, preferably in the middle of the bottom of the second bowl 102 position, the second blue LED chip 202 uses the third gold wire 410 and the fourth gold wire 411 to weld its positive and negative poles respectively to realize electrical connection with the second current control circuit, and the second current control circuit is respectively connected to the second positive pole pin 406 and the second negative pin 407 . When the second blue LED chip 202 adopts a flip chip, as shown in Figure 2, the second blue LED chip 202 is fixed in the second bowl cup 102 using solder paste or eutectic welding, and can be directly connected to the second current control The circuits are electrically connected, and the second current control circuit is respectively connected to the second positive pin 406 and the second negative pin 407 .
如图4，封胶体包括第一荧光胶层301及第二荧光胶层302。第一荧光胶层301用以将第一蓝色LED芯片201密封于第一碗杯101内；第二荧光胶层302用以将第二蓝色LED芯片202密封于第二碗杯102内。其中，第一荧光胶层301为低色温高显指配比的荧光胶层，第二荧光胶层302为高色温低显指配比的荧光胶层；或，第一荧光胶层301为高色温低显指配比的荧光胶层，第二荧光胶层302为低色温高显指配比的荧光胶层。行业中，色温分为：冷白、正白、暖白，分别以6000K，4500K，3000K为标准，本发明中，高色温指6000k，低色温指3000k；低显指一般为80及以下显指，90显指及以上则属于高显指。As shown in FIG. 4 , the encapsulant includes a first fluorescent glue layer 301 and a second fluorescent glue layer 302 . The first fluorescent adhesive layer 301 is used to seal the first blue LED chip 201 in the first bowl 101 ; the second fluorescent adhesive layer 302 is used to seal the second blue LED chip 202 in the second bowl 102 . Wherein, the first fluorescent adhesive layer 301 is a fluorescent adhesive layer with a low color temperature and a high display ratio, and the second fluorescent adhesive layer 302 is a fluorescent adhesive layer with a high color temperature and a low display ratio; or, the first fluorescent adhesive layer 301 is a high The fluorescent glue layer with a low color temperature and low color rendering ratio, and the second fluorescent glue layer 302 is a fluorescent glue layer with a low color temperature and a high color rendering ratio. In the industry, the color temperature is divided into: cool white, pure white, warm white, with 6000K, 4500K, and 3000K as the standard respectively. In the present invention, the high color temperature refers to 6000k, and the low color temperature refers to 3000k; , 90 and above belong to the high index.
第一荧光胶层301及第二荧光胶层302由荧光粉及封装用的外封胶配置而成，根据第一蓝色LED芯片201及第二蓝色LED芯片202选用的主波长为440nm-480nm的波段，为了达到更好的配光效果，荧光粉搭配如下：荧光粉为黄粉与红粉组合，或者为单黄粉，再或者为黄绿粉与红粉的组合。具体地，进行第一荧光胶层301及第二荧光胶层302的配置时，低色温高显指配比的荧光胶层包括以下组分：红粉、黄粉、A胶、B胶以及防沉粉，其中，红粉、黄粉、A胶、B胶以及防沉粉的重量比依次为(0.005～0.02)：(0.12～0.48)：0.2：0.8：(0.005～0.02)；优选为，红粉、黄粉、A胶、B胶以及防沉粉的重量比依次为0.01：0.24：0.2：0.8:0.01；或者，低色温高显指配比的荧光胶层包括以下组分：红粉、黄绿粉、A胶、B胶以及防沉粉，其中，红粉、黄绿粉、A胶、B胶以及防沉粉的重量比依次为(0.0025～0.01)：(0.15～0.6)：0.2：0.8：(0.005～0.02)，优选为，红粉、黄绿粉、A胶、B胶以及防沉粉的重量比依次为0.005：0.3：0.2：0.8：0.01。高色温低显指配比的荧光胶层包括以下组分：黄粉、A胶、B胶以及防沉粉，其中，黄粉、A胶、B胶以及防沉粉的重量比依次为：(0.08～0.32)：0.2：0.8：(0.005～0.02)；优选为，黄粉、A胶、B胶以及防沉粉的重量比依次为0.16：0.2：0.8:0.01。The first fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302 are configured by phosphor powder and outer sealant for packaging, and the dominant wavelength selected according to the first blue LED chip 201 and the second blue LED chip 202 is 440nm- In the 480nm wavelength band, in order to achieve better light distribution effect, the matching of phosphor powder is as follows: the phosphor powder is a combination of yellow powder and red powder, or a single yellow powder, or a combination of yellow-green powder and red powder. Specifically, when configuring the first fluorescent glue layer 301 and the second fluorescent glue layer 302, the fluorescent glue layer with low color temperature and high CRI includes the following components: red powder, yellow powder, A glue, B glue and anti-sinking powder , wherein, the weight ratios of red powder, yellow powder, A glue, B glue and anti-settling powder are (0.005～0.02):(0.12～0.48):0.2:0.8:(0.005～0.02); preferably, red powder, yellow powder, The weight ratio of A glue, B glue and anti-settling powder is 0.01:0.24:0.2:0.8:0.01 in sequence; or, the fluorescent glue layer with low color temperature and high CRI includes the following components: red powder, yellow-green powder, A glue , B glue and anti-settling powder, wherein, the weight ratio of red powder, yellow-green powder, A glue, B glue and anti-settling powder is (0.0025～0.01):(0.15～0.6):0.2:0.8:(0.005～0.02 ), preferably, the weight ratios of red powder, yellow-green powder, A glue, B glue and anti-settling powder are 0.005:0.3:0.2:0.8:0.01 in sequence. The fluorescent glue layer with high color temperature and low CRI includes the following components: yellow powder, A glue, B glue and anti-settling powder, wherein the weight ratio of yellow powder, A glue, B glue and anti-settling powder is: (0.08～ 0.32):0.2:0.8:(0.005-0.02); preferably, the weight ratio of yellow powder, glue A, glue B and anti-settling powder is 0.16:0.2:0.8:0.01 in sequence.
本实施例中的白光LED器件，将低色温高显指配比的荧光胶层与高色温低显指配比的荧光胶层分别注胶于两个碗杯中，通过分别自由控制两个蓝色LED芯片的电流，即可实现色温显指可控，有效的降低了现有技术中白光LED器件的制备成本。另外，相对于现有技术中需要使用两种不同以上不同色温的LED器件，本实施例的单颗白光LED器件更加节省空间面积。In the white LED device in this embodiment, the fluorescent glue layer with low color temperature and high CRI ratio and the fluorescent glue layer with high color temperature and low CRI ratio are respectively injected into two bowls, and the two blue The current of the color LED chip can realize the controllable color temperature display, which effectively reduces the manufacturing cost of the white light LED device in the prior art. In addition, compared with the prior art that needs to use two or more LED devices with different color temperatures, the single white LED device of this embodiment saves more space and area.
更进一步而言，主体支架10的材料选用PPA或EMC树脂材料，为了使主体支架10中可以有更多有效的利用空间，利于两个蓝色LED芯片的放置，并提高白光LED器件生产工艺的可靠性，提高白光LED器件出光的均匀性，白光LED器件还包括第一隔离支架401，如图1及2，第一隔离支架401纵向设置于第一碗杯101与第二碗杯102之间，用以隔开第一蓝色LED芯片以及第二蓝色LED芯片，具体的，用于隔开第一芯片电路及第二芯片电路。第一隔离支架401的材料与主体支架10的材料一致，可以与主体支架10一体成型，或者第一隔离支架401为主体支架10的一部分，在开模步骤中直接形成。Furthermore, the material of the main body support 10 is selected from PPA or EMC resin material, in order to make more effective use of space in the main body support 10, which is beneficial to the placement of two blue LED chips, and improves the production process efficiency of the white light LED device. Reliability, improve the uniformity of light emitted by the white LED device, the white LED device also includes a first isolation bracket 401, as shown in Figures 1 and 2, the first isolation bracket 401 is longitudinally arranged between the first bowl 101 and the second bowl 102 , used to separate the first blue LED chip and the second blue LED chip, specifically, used to separate the first chip circuit and the second chip circuit. The material of the first spacer bracket 401 is consistent with that of the body bracket 10 and can be formed integrally with the body bracket 10 , or the first spacer bracket 401 is a part of the body bracket 10 and is directly formed in the mold opening step.
另一优选方案中，白光LED器件还包括第二隔离支架402及第三隔离支架403。如图1及2，第二隔离支架402横向设置于第一碗杯101内，用以隔开白光LED器件的正极引脚及负极引脚，具体的，第二隔离支架402用于隔开第一正极引脚404及第一负极引脚405；第三隔离支架403横向设置于第二碗杯102内，用以隔开白光LED器件的正极引脚及负极引脚，具体的，第三隔离支架403用于隔开第二正极引脚406及第二负极引脚407。第二隔离支架402及第三隔离支架403的材料与主体支架10的材料一致，可以与主体支架10一体成型，或者第二隔离支架402及第三隔离支架403均为主体支架10的一部分，在开模步骤中直接形成。具体来说，第二隔离支架402及第三隔离支架403的具体设置位置包括以下两种：(1)第二隔离支架402设置于第一碗杯101中间位置，其与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离；第三隔离支架403设置于第二碗杯102中间位置，其与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离。如图2，第二隔离支架402到第一正极引脚404的距离与其到第一负极引脚405的距离相等；第三隔离支架403到第二正极引脚406的距离与其到第二负极引脚407的距离相等。(2)第二隔离支架402与白光LED器件正极引脚的距离大于其与白光LED器件负极引脚的距离；第三隔离支架403与白光LED器件的正极引脚的距离大于其与白光LED器件的负极引脚的距离。如图1，第二隔离支架402到第一正极引脚404的距离大于其到第一负极引脚405的距离；第三隔离支架403到第二正极引脚406的距离大于其到第二负极引脚407的距离。采用第二隔离支架402以及第三隔离支架403分隔白光LED器件的正负极引脚，有效防止白光LED器件的正负极引脚导电，并能合理规划芯片放置位置及空间。另外，需要说明的是，本发明中所说的纵向及横向，根据工程学解释，如图1及2正面视图中，平行较长边所在的方向称为纵向，平行较短边所在的方向称为横向。In another preferred solution, the white LED device further includes a second isolation bracket 402 and a third isolation bracket 403 . As shown in Figures 1 and 2, the second isolation bracket 402 is horizontally arranged in the first bowl 101 to separate the positive and negative pins of the white LED device. Specifically, the second isolation bracket 402 is used to separate the first A positive pole pin 404 and a first negative pole pin 405; a third isolation bracket 403 is arranged laterally in the second bowl 102 to separate the positive pole pin and the negative pole pin of the white light LED device, specifically, the third isolation bracket 403 The bracket 403 is used to separate the second positive pin 406 and the second negative pin 407 . The material of the second isolation bracket 402 and the third isolation bracket 403 is consistent with the material of the main body bracket 10, and can be integrally formed with the main body bracket 10, or the second isolation bracket 402 and the third isolation bracket 403 are both part of the main body bracket 10. Formed directly in the mold opening step. Specifically, the specific setting positions of the second isolation bracket 402 and the third isolation bracket 403 include the following two types: (1) The second isolation bracket 402 is arranged at the middle position of the first bowl cup 101, and it is connected to the positive pin of the white LED device. The distance is equal to the distance between it and the negative pin of the white light LED device; the third isolation bracket 403 is arranged in the middle position of the second bowl cup 102, and the distance between it and the positive pin of the white light LED device is equal to the distance between it and the negative pin of the white light LED device . As shown in Figure 2, the distance from the second isolation bracket 402 to the first positive pin 404 is equal to the distance to the first negative pin 405; the distance from the third isolation bracket 403 to the second positive pin 406 is equal to the distance to the second negative pin The feet 407 are equally spaced. (2) The distance between the second isolation bracket 402 and the positive pin of the white light LED device is greater than the distance between it and the negative pin of the white light LED device; the distance between the third isolation bracket 403 and the positive pin of the white light LED device is greater than that of the white light LED device The distance of the negative pin. As shown in Figure 1, the distance from the second isolation bracket 402 to the first positive pin 404 is greater than its distance to the first negative pin 405; the distance from the third isolation bracket 403 to the second positive pin 406 is greater than its distance to the second negative pin distance from pin 407. Using the second isolation bracket 402 and the third isolation bracket 403 to separate the positive and negative pins of the white light LED device can effectively prevent the positive and negative pins of the white light LED device from being conductive, and can reasonably plan the placement position and space of the chip. In addition, it should be noted that the longitudinal and transverse directions mentioned in the present invention are explained according to engineering, as shown in the front views of Figures 1 and 2, the direction parallel to the longer side is called the longitudinal direction, and the direction parallel to the shorter side is called the vertical direction. for landscape.
另外，由于本实施例中的白光LED器件具有第一碗杯101及第二碗杯102两个碗杯，为了防止两个碗杯发生溢胶互相影响的境况，白光LED器件中设置第一防溢胶结构414及第二防溢胶结构415，如图4所示。在第一碗杯101及第二碗杯102的底部，还分别设置了第一热沉412及第二热沉413，如图3所示，第一热沉412及第二热沉413用以提高白光LED器件的散热功能。第一热沉412及第二热沉413具体使用铜镀银，更有利于白光LED器件中热量的传导，提高第一蓝色LED芯片201以及第二蓝色LED芯片202的寿命。In addition, since the white light LED device in this embodiment has two bowls, the first bowl 101 and the second bowl 102, in order to prevent the two bowls from overflowing and interacting with each other, the white light LED device is provided with a first anti- The glue overflow structure 414 and the second glue overflow prevention structure 415 are shown in FIG. 4 . At the bottom of the first bowl 101 and the second bowl 102, a first heat sink 412 and a second heat sink 413 are respectively provided, as shown in FIG. 3 , the first heat sink 412 and the second heat sink 413 are used for The heat dissipation function of the white light LED device is improved. The first heat sink 412 and the second heat sink 413 are copper-plated with silver, which is more conducive to heat conduction in the white LED device, and improves the lifespan of the first blue LED chip 201 and the second blue LED chip 202 .
需要说明的是，根据本发明相同原理进行技术延伸，本发明白光LED器件还可以包括第三碗杯和第三蓝色LED芯片，或者更多碗杯及与碗杯个数相同的蓝色LED芯片。在大于两个碗杯及两个蓝色LED芯片的白光LED器件结构中，每个蓝色LED芯片之间及每个碗杯之间各自独立，每个碗杯内部用一荧光胶层密封一个蓝色LED芯片。若碗杯个数及蓝色LED芯片个数为偶数个，荧光胶层则按照一高色温低显指配比搭配一低色温高显指的配比依次进行配置；若碗杯个数及蓝色LED芯片为奇数个，荧光胶层先按照一高色温低显指配比搭配一低色温高显指的配比依次进行配置，剩余一个碗杯内采用的荧光胶层可以为高色温低显指配比或低色温高显指配比的荧光胶层，具体不做限制，白光LED器件按照上述同原理实现色温及显指可调。It should be noted that, according to the technical extension of the same principle of the present invention, the white light LED device of the present invention may also include a third bowl and a third blue LED chip, or more bowls and blue LEDs with the same number of bowls chip. In a white LED device structure larger than two bowls and two blue LED chips, each blue LED chip and each bowl are independent, and each bowl is sealed with a fluorescent glue layer inside each bowl. Blue LED chips. If the number of bowls and the number of blue LED chips are an even number, the fluorescent adhesive layer is configured in sequence according to the ratio of a high color temperature and low CRI paired with a low color temperature and high CRI ratio; There are an odd number of color LED chips, and the fluorescent adhesive layer is first configured according to the ratio of a high color temperature and low display index and a low color temperature and high display index. The fluorescent adhesive layer used in the remaining bowl can be high color temperature and low display. There is no specific limitation on the fluorescent adhesive layer with low color temperature and high CRI ratio. The white light LED device realizes the adjustable color temperature and CRI according to the same principle as above.
实施例二Embodiment two
本实施例提供一种色温显指可调的白光LED器件的制备方法，其包括如下步骤：This embodiment provides a method for preparing a white light LED device with adjustable color temperature display, which includes the following steps:
开模：在主体支架10顶面形成第一碗杯101及第二碗杯102。如图1及2，用CAD设计SMD白光LED器件的模型，进行注塑开模。白光LED器件尺寸可为5730，也可为2835或者其他。主体支架10为PPA也可为EMC树脂材料。优选方案中，开模步骤中，主体支架10上还形成有第一隔离支架401；第一隔离支架401纵向形成于第一碗杯101与第二碗杯102之间，用以隔开第一蓝色LED芯片以及第二蓝色LED芯片。第一隔离支架401的材料与主体支架10的材料一致，可以与主体支架10一体成型。另一优选方案中，开模步骤中：主体支架10上还形成有第二隔离支架402及第三隔离支架403；第二隔离支架402横向形成于第一碗杯101内，用以隔开白光LED器件的正极引脚及负极引脚；第三隔离支架403横向形成于第二碗杯102内，用以隔开白光LED器件的正极引脚及负极引脚。第二隔离支架402及第三隔离支架403的材料与主体支架10的材料一致，可以与主体支架10一体成型。具体来说，第二隔离支架402及第三隔离支架403的具体设置位置与实施例一相同，这里不再赘述。Mold opening: Form the first bowl 101 and the second bowl 102 on the top surface of the main body support 10 . As shown in Figures 1 and 2, the model of the SMD white light LED device is designed with CAD, and the injection mold is opened. The size of the white LED device can be 5730, 2835 or others. The main frame 10 is made of PPA or EMC resin material. In a preferred solution, in the mold opening step, a first spacer bracket 401 is also formed on the main body bracket 10; the first spacer bracket 401 is longitudinally formed between the first bowl cup 101 and the second bowl cup 102 to separate the first bowl cup 101 and the second bowl cup 102 a blue LED chip and a second blue LED chip. The material of the first spacer bracket 401 is consistent with that of the main body bracket 10 , and can be integrally formed with the main body bracket 10 . In another preferred solution, in the mold opening step: a second isolation bracket 402 and a third isolation bracket 403 are also formed on the main body bracket 10; the second isolation bracket 402 is formed laterally in the first bowl 101 to separate the white light The positive pin and the negative pin of the LED device; the third isolation bracket 403 is formed laterally in the second bowl 102 to separate the positive pin and the negative pin of the white LED device. The material of the second isolation bracket 402 and the third isolation bracket 403 is consistent with that of the main body bracket 10 , and can be integrally formed with the main body bracket 10 . Specifically, the specific installation positions of the second isolation bracket 402 and the third isolation bracket 403 are the same as those in the first embodiment, and will not be repeated here.
固晶：将第一蓝色LED芯片201固定于第一碗杯101内，第二蓝色LED芯片202固定于第二碗杯102内。第一蓝色LED芯片201及第二蓝色LED芯片202可以采用分别正装芯片或倒装芯片。当第一蓝色LED芯片201及第二蓝色LED芯片202采用正装芯片时，第一蓝色LED芯片201及第二蓝色LED芯片202都使用白胶固晶，使二者分别固定于第一碗杯101及第二碗杯102内；当第一蓝色LED芯片201及第二蓝色LED芯片202采用倒装芯片时，二者都使用锡膏或共晶焊接，使第一蓝色LED芯片201及第二蓝色LED芯片202分别固定于第一碗杯101及第二碗杯102内。Die bonding: fix the first blue LED chip 201 in the first bowl 101 , and fix the second blue LED chip 202 in the second bowl 102 . The first blue LED chip 201 and the second blue LED chip 202 can be front-chip or flip-chip respectively. When the first blue LED chip 201 and the second blue LED chip 202 are front-mounted chips, the first blue LED chip 201 and the second blue LED chip 202 are all fixed with white glue, so that the two are respectively fixed on the first blue LED chip 201 and the second blue LED chip 202. Inside a bowl 101 and a second bowl 102; when the first blue LED chip 201 and the second blue LED chip 202 adopt flip chip, both use solder paste or eutectic soldering, so that the first blue The LED chip 201 and the second blue LED chip 202 are respectively fixed in the first bowl 101 and the second bowl 102 .
焊线：分别焊接第一蓝色LED芯片201及第二蓝色LED芯片202的正负极；当第一蓝色LED芯片201及第二蓝色LED芯片202采用正装芯片时，第一蓝色LED芯片201分别采用第一金线408及第二金线409分别焊接其正负极，第二蓝色LED芯片202分别采用第三金线410及第四金线411分别焊接其正负极；二者分别连接于第一芯片电路及第二芯片电路中。当第一蓝色LED芯片201及第二蓝色LED芯片202采用倒装正装芯片时，二者使用锡膏或共晶焊接时，不需要采用金线，二者便直接分别连接于第一芯片电路及第二芯片电路中。Welding wire: weld the positive and negative poles of the first blue LED chip 201 and the second blue LED chip 202 respectively; The LED chip 201 uses the first gold wire 408 and the second gold wire 409 to weld its positive and negative electrodes respectively, and the second blue LED chip 202 uses the third gold wire 410 and the fourth gold wire 411 to respectively weld its positive and negative electrodes; The two are respectively connected to the first chip circuit and the second chip circuit. When the first blue LED chip 201 and the second blue LED chip 202 are flip-chip front-mount chips, when solder paste or eutectic soldering is used for the two, there is no need to use gold wires, and the two are directly connected to the first chip respectively. circuit and the second chip circuit.
封胶：将第一荧光胶层301注胶于第一碗杯101内，密封第一蓝色LED芯片201；将第二荧光胶层302注胶于第二碗杯102内，密封第二蓝色LED芯片202。本实施例中，第一荧光胶层301及第二荧光胶层302具有与实施例一相同的参数特性：第一荧光胶层301为低色温高显指配比的荧光胶层，第二荧光胶层302为高色温低显指配比的荧光胶层；或，第一荧光胶层301为高色温低显指配比的荧光胶层，第二荧光胶层302为低色温高显指配比的荧光胶层。第一荧光胶层301及第二荧光胶层302由荧光粉及封装用的外封胶配置而成，荧光粉为黄粉与红粉组合，或者为单黄粉，再或者为黄绿粉与红粉的组合。进行第一荧光胶层301及第二荧光胶层302的配置时，低色温高显指的配比及高色温低显指的配比与实施例一相同，这里不再赘述。Glue sealing: inject the first fluorescent adhesive layer 301 into the first bowl 101 to seal the first blue LED chip 201; inject the second fluorescent adhesive layer 302 into the second bowl 102 to seal the second blue LED chip 201; color LED chip 202. In this embodiment, the first fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302 have the same parameter characteristics as in the first embodiment: the first fluorescent adhesive layer 301 is a fluorescent adhesive layer with a low color temperature and a high CRI ratio, and the second fluorescent adhesive layer The adhesive layer 302 is a fluorescent adhesive layer with a high color temperature and a low CRI ratio; or, the first fluorescent adhesive layer 301 is a fluorescent adhesive layer with a high color temperature and a low CRI ratio, and the second fluorescent adhesive layer 302 is a low color temperature and high CRI ratio. Compared with the fluorescent glue layer. The first fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302 are composed of fluorescent powder and an outer sealant for packaging. The fluorescent powder is a combination of yellow powder and red powder, or a single yellow powder, or a combination of yellow-green powder and red powder. . When configuring the first fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302 , the ratio of low color temperature and high CRI and the ratio of high color temperature and low CRI are the same as those in Embodiment 1, and will not be repeated here.
由于本实施方式只采用蓝色LED芯片，一方面，对应的单颗LED器件能耗小，造价相对传统技术较低。使用的基板线路也相对简单得多；另一方面，固晶步骤中采用的底胶相同；焊线步骤中，采用正装LED芯片，焊线数量较少，采用倒装LED芯片时，更无需焊线，工序简单，提高生产效率；再者，即使其中一颗蓝色LED芯片的出光出现问题，也不会造成整个白光LED器件的浪费，另一颗蓝色LED芯片仍然能够正常出光。Since this embodiment only uses blue LED chips, on the one hand, the corresponding single LED device consumes less energy, and its manufacturing cost is lower than that of traditional technologies. The substrate circuit used is also relatively simple; on the other hand, the primer used in the die-bonding step is the same; in the wire-bonding step, the front-mounted LED chip is used, and the number of bonding wires is small. When the flip-chip LED chip is used, there is no need for soldering. line, the process is simple, and the production efficiency is improved; moreover, even if there is a problem with the light output of one of the blue LED chips, it will not cause waste of the entire white LED device, and the other blue LED chip can still emit light normally.
实施例三Embodiment three
本实施例提供一种白光LED器件色温显指调控方法，其包括如下步骤：This embodiment provides a method for controlling the color temperature display of a white LED device, which includes the following steps:
电流调控：调节第一碗杯101的电流，第一碗杯101的功率由第一功率初始百分比变为第一功率调节百分比P1；调节第二碗杯102的电流，第二碗杯102的功率由第二功率初始百分比变为第二功率调节百分比P2；其中，每个碗杯中电流大小的调节范围根据碗杯中固定的蓝色LED芯片而变化，可以为0-700mA。每个碗杯中功率的变化对应可以为0-100％。Current regulation: adjust the current of the first bowl 101, the power of the first bowl 101 becomes the first power adjustment percentage P 1 from the initial percentage of the first power; adjust the current of the second bowl 102, the power of the second bowl 102 The power is changed from the second initial power percentage to the second power adjustment percentage P 2 ; wherein, the adjustment range of the current in each bowl varies according to the blue LED chip fixed in the bowl, and can be 0-700mA. The variation of power in each bowl corresponds to 0-100%.
亮度调控：白光LED器件的亮度由初始亮度变为：Brightness control: The brightness of white LED devices changes from the initial brightness to:
P1×第一碗杯的最高亮度+P2×第二碗杯的最高亮度。P 1 × the highest brightness of the first bowl + P 2 × the highest brightness of the second bowl.
色温调控：白光LED器件的色温由初始色温变为：Color temperature control: The color temperature of white LED devices changes from the initial color temperature to:
显指调控：白光LED器件的显指由初始显指变为：Display finger control: The display finger of the white LED device changes from the initial display finger to:
其中，电流调控步骤中，第一碗杯101的电流调节及第二碗杯102的电流调节顺序不分先后；在进行电流调控后，白光LED器件的亮度、色温及显指随电流调控同时发生变化。Wherein, in the current regulation step, the current regulation of the first bowl 101 and the current regulation of the second bowl 102 are in no particular order; after the current regulation, the brightness, color temperature and CRI of the white LED device occur simultaneously with the current regulation. Variety.
本实施例中，第一碗杯101的色温显指由第一碗杯101中填充的第一荧光胶层301决定，第一碗杯101的色温显指与第一荧光胶层301的色温显指相同；第二碗杯102的色温显指由第二碗杯102中填充的第二荧光胶层302决定，第二碗杯102的色温显指与第二荧光胶层302的色温显指相同；第一荧光胶层301的配比及第二荧光胶层302的配比与实施例一相同，这里不再赘述。白光LED器件的初始亮度、初始色温以及初始显指分别指：第一碗杯101以及第二碗杯102分别在第一功率初始百分比及第二功率初始百分比的情况下，白光LED器件的亮度、色温以及显指。In this embodiment, the color temperature display of the first bowl 101 is determined by the first fluorescent adhesive layer 301 filled in the first bowl 101, and the color temperature display of the first bowl 101 is related to the color temperature display of the first fluorescent adhesive layer 301. The index is the same; the color temperature index of the second bowl 102 is determined by the second fluorescent adhesive layer 302 filled in the second bowl 102, and the color temperature index of the second bowl 102 is the same as that of the second fluorescent adhesive layer 302 ; The ratio of the first fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302 are the same as those in Embodiment 1, and will not be repeated here. The initial brightness, initial color temperature and initial display index of the white LED device respectively refer to: the brightness, Color temperature and CRI.
该实施例中以第一碗杯101中注入的第一荧光胶层301为高色温低显指的荧光胶层，第二碗杯102中注入的第二荧光胶层302为低色温高显指的荧光胶层为例进行说明，第一碗杯101中注入的第一荧光胶层301的色温为6000K，第二碗杯102中注入的第二荧光胶层302的色温为3000K，本领域技术人员可以理解的是，该例仅用以使本领域技术人员更加清楚的理解白光LED器件的色温显指调控方法，不用以限定本发明。In this embodiment, the first fluorescent adhesive layer 301 injected into the first bowl 101 is a fluorescent adhesive layer with high color temperature and low CRI, and the second fluorescent adhesive layer 302 injected into the second bowl 102 is a fluorescent adhesive layer with low color temperature and high CRI. Taking the fluorescent adhesive layer as an example for illustration, the color temperature of the first fluorescent adhesive layer 301 injected into the first bowl 101 is 6000K, and the color temperature of the second fluorescent adhesive layer 302 injected into the second bowl 102 is 3000K. Persons can understand that this example is only used to enable those skilled in the art to more clearly understand the color temperature display control method of white LED devices, and is not intended to limit the present invention.
亮度调控：白光LED器件亮度范围可为0-280lm，最高亮度为280lm，对应的，第一碗杯101及第二碗杯102的最高亮度均为140lm，调节第一碗杯101及第二碗杯102的电流分别为60-350mA之间的一个电流，使第一碗杯101的功率由第一功率初始百分比变为第一功率调节百分比P1，P1为50％，第二碗杯102的功率由第二功率初始百分比变为第二功率调节百分比P2，P2为50％，此时，白光LED器件的亮度变为0.5*140+0.5*140＝140lm。Brightness control: the brightness range of the white LED device can be 0-280lm, and the maximum brightness is 280lm. Correspondingly, the maximum brightness of the first bowl 101 and the second bowl 102 are both 140lm. Adjust the first bowl 101 and the second bowl The current of the cup 102 is a current between 60-350mA, so that the power of the first bowl 101 is changed from the first power initial percentage to the first power adjustment percentage P 1 , P 1 is 50%, and the second bowl 102 The power is changed from the second initial power percentage to the second power adjustment percentage P 2 , and P 2 is 50%. At this time, the brightness of the white LED device becomes 0.5*140+0.5*140=140lm.
色温调控：第一碗杯101的色温为6000k，第二碗杯102的色温为3000k，调节第一碗杯301及第二碗杯302的电流，第一碗杯101的功率由第一功率初始百分比变为第一功率调节百分比P1，P1为50％，第二碗杯102的功率由第二功率初始百分比变为第二功率调节百分比P2，P2为50％，白光LED器件的色温则变为[0.5/(0.5+0.5)]*6000+[0.5/(0.5+0.5)]*3000＝4500K。显指调控原理与色温调控相同，这里不再详述。Color temperature control: the color temperature of the first bowl 101 is 6000k, the color temperature of the second bowl 102 is 3000k, adjust the current of the first bowl 301 and the second bowl 302, the power of the first bowl 101 is initially from the first power The percentage becomes the first power adjustment percentage P 1 , P 1 is 50%, the power of the second bowl cup 102 is changed from the second power initial percentage to the second power adjustment percentage P 2 , P 2 is 50%, and the white light LED device The color temperature becomes [0.5/(0.5+0.5)]*6000+[0.5/(0.5+0.5)]*3000=4500K. The principle of display finger control is the same as that of color temperature control, and will not be described in detail here.
因此，调控第一碗杯301及第二碗杯302的电流，即为控制二者的功率百分比，这样通过控制电流，就可以实现色温以及显指还有亮度的调控。Therefore, adjusting the current of the first bowl 301 and the second bowl 302 is to control the power percentage of the two, so that by controlling the current, the color temperature, display finger and brightness can be adjusted.
上所述仅为本发明的实施方式而已，并不用于限制本发明。对于本领域技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原理的内所作的任何修改、等同替换、改进等，均应包括在本发明的权利要求范围之内。The above description is only an embodiment of the present invention, and is not intended to limit the present invention. Various modifications and variations of the present invention will occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.
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