CN105485969B - Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig - Google Patents
Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig Download PDFInfo
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- CN105485969B CN105485969B CN201510996970.6A CN201510996970A CN105485969B CN 105485969 B CN105485969 B CN 105485969B CN 201510996970 A CN201510996970 A CN 201510996970A CN 105485969 B CN105485969 B CN 105485969B
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- exchanging part
- exchanger rig
- heat exchanging
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/09—Improving heat transfers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/12—Sound
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The present invention relates to heat-exchanger rig and the semiconductor freezer with the heat-exchanger rig.Specifically, the present invention provides a kind of heat-exchanger rigs comprising the first heat exchanging part, the first heat exchanging part have：Two fins sets, each fins set has the fin of multiple parallel intervals setting, and two fins sets are arranged along the length direction interval of fin；And wind turbine, it is set between two fins sets, is configured to that air-flow is promoted to flow from gap of the gap between each two adjacent fins in a fins set into another fins set between each two adjacent fins.In addition, the present invention also provides a kind of semiconductor freezers with the heat-exchanger rig.Between being set to two fins sets due to wind turbine in the heat-exchanger rig of the present invention, and positioned at one end outside of each fin, the thickness of heat-exchanger rig can be reduced, the heat dissipation especially suitable for semiconductor freezer.
Description
Technical field
The present invention relates to refrigerating equipments, more particularly to a kind of heat-exchanger rig and with the semiconductor of the heat-exchanger rig
Refrigerator.
Background technology
Semiconductor freezer, also referred to as thermoelectric refrigerator.It passes through heat pipe heat radiation and conduction using semiconductor chilling plate
Technology and automatic pressure-transforming Variable flow control technology realize refrigeration, are not necessarily to refrigeration working medium and mechanical moving element, solve medium pollution
With the application problem of the tradition machineries refrigerator such as mechanical oscillation.However, the cold end of semiconductor chilling plate refrigeration while, meeting
Generate a large amount of heat in its hot junction, to ensure that semiconductor chilling plate is reliably continued for work, need in time to hot junction into
Row heat dissipation, however in the prior art be directed to semiconductor chilling plate hot-side heat dissipation generally using by be arranged wind turbine to cooling fin into
The scheme of row forced convertion heat dissipation, to improve heat exchange efficiency, but radiating fin volume itself is larger；In addition, in radiating fin
Axial flow blower is arranged in the side of group, with to the gap blow flow between each two adjacent fin, or from each two adjacent
Gap suction airflow between fin.The volume of this heat exchanger is bigger, the problems such as needing installation space big, is not suitable for
It is installed in smaller space.In addition, hot-side heat dissipation is typically to achieve the purpose that heat dissipation by the rotating speed and power of increase wind turbine,
Radiating efficiency difference and the big high energy consumption of noise.
Invention content
One object of the present invention is intended to overcome at least one defect of existing heat-exchanger rig, provides a kind of structure novel
Heat-exchanger rig, have smaller thickness, the heat dissipation especially suitable for semiconductor freezer.
One of first aspect present invention is further objective is that the noise of heat-exchanger rig will be reduced as possible.
One purpose of second aspect of the present invention is to provide for a kind of semiconductor freezer with above-mentioned heat-exchanger rig.
According to an aspect of the present invention, the present invention provides a kind of heat-exchanger rigs for semiconductor freezer.It should
Heat-exchanger rig includes the first heat exchanging part, and first heat exchanging part has：
Two fins sets, each fins set have the fin of multiple parallel intervals setting, and described two fins sets
It is arranged along the length direction interval of the fin；With
Wind turbine is set between two fins sets, is configured to promote air-flow each two from a fins set
Gap flowing of the gap into another fins set between each two adjacent fins between adjacent fins.
Optionally, the wind turbine is axial flow blower, and rotation axis extends along the length direction of the fin.
Optionally, first heat exchanging part further includes two ducting assemblies, is set to the both sides of the wind turbine, and each institute
It states ducting assembly and limits gas channel, with the gap being connected in a fins set between each two adjacent fins and the wind
Machine.
Optionally, the heat-exchanger rig further includes the second heat exchanging part, with first heat exchanging part about a geometrical plane pair
Claim arrangement.
Optionally, the heat-exchanger rig further includes：
Two heat-transfer devices, each heat-transfer device is symmetrical about the geometrical plane, and
It is configured to absorb heat or cold from heat source or low-temperature receiver in the middle part of each heat-transfer device；
One fins set of first heat exchanging part and a fins set of second heat exchanging part are set to described in one
The both ends of heat-transfer device；
Another fins set of another fins set of first heat exchanging part and second heat exchanging part is set to another described
The both ends of heat-transfer device.
Optionally, each heat-transfer device includes：
Heat-conducting substrate has and the heat source or the hot linked heat-transfer surface of low-temperature receiver；With
More heat carriers, the length direction along the fin are alternatively arranged, and the every heat carrier is described including being fixed on
The middle part heat carrier section of heat-conducting substrate and positioned at the middle part heat carrier section both sides, two perpendicular to geometrical plane ends
The straight heat carrier section in two ends of the straight heat carrier section in portion, the every heat carrier extends respectively through each wing being mounted thereon
The perforation hole of piece.
Optionally, the middle part heat carrier section of the every heat carrier includes：The straight heat carrier section in middle part, and respectively from described
Two connection heat carrier sections that the both ends of the straight heat carrier section in middle part extend to both sides；And
In each heat-transfer device, multiple straight heat carrier sections in middle part are in same plane, multiple ends
The straight heat carrier section in portion is in same plane, and the distance between straight heat carrier section in each two adjacent middle part is less than each two phase
Adjacent the distance between the straight heat carrier section in end, the straight heat carrier section in middle part between the heat-transfer surface at a distance from be less than the end
The straight heat carrier section in portion between the heat-transfer surface at a distance from.
Optionally, the width of each fin is the 1/7 to 3/7 of its length；
The width of each fins set is the 1/3 to 2/3 of the length of each fin.
According to the second aspect of the invention, the present invention provides a kind of semiconductor freezers, including liner, semiconductor system
Cold further includes particularly with the insulating layer being set on rear side of the liner：
Rear shell defines installation space with the rear surface of the insulating layer, and offers the first air inlet and thereon
One air outlet；With
Any of the above-described kind of heat-exchanger rig, two fins sets and wind turbine of the first heat exchanging part are mounted on the installation space
It is interior and between first air inlet and first air outlet；And
Two fins sets of first heat exchanging part and the hot junction of the semiconductor chilling plate are directly or indirectly thermally connected；
The wind turbine of first heat exchanging part is configured to that air-flow is promoted to enter the installation space, warp from first air inlet
By flowing out the installation space from first air outlet after two fins sets of first heat exchanging part.
Optionally, first air outlet is set to the top of first air inlet；
The second air inlet and the second air outlet above second air inlet are further opened in the rear shell；And
Two fins sets and wind turbine of second heat exchanging part of the heat-exchanger rig are mounted in the installation space and locate
Between second air inlet and second air outlet；And
Two fins sets of second heat exchanging part and the hot junction of the semiconductor chilling plate are directly or indirectly thermally connected；
The wind turbine of second heat exchanging part is configured to that air-flow is promoted to enter the installation space, warp from second air inlet
By flowing out the installation space from second air outlet after two fins sets of second heat exchanging part.
The heat-exchanger rig and semiconductor freezer of the present invention is because wind turbine is set between two fins sets, and is located at every
One end outside of a fin, can reduce the thickness of heat-exchanger rig, the heat dissipation especially suitable for semiconductor freezer.In addition,
There are two heat exchanging part that there are two tools and each heat exchanging part tool, and the heat dissipation area of heat-exchanger rig also can be improved in fins set.Using a wind
Machine makes air-flow be flowed through from two fins sets simultaneously, wind turbine utilization rate can be improved, and can reduce the noise of heat-exchanger rig.
According to the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will be brighter
The above and other objects, advantages and features of the present invention.
Description of the drawings
Some specific embodiments that the invention will be described in detail by way of example and not limitation with reference to the accompanying drawings hereinafter.
Identical reference numeral denotes same or similar component or part in attached drawing.It should be appreciated by those skilled in the art that these
What attached drawing was not necessarily drawn to scale.In attached drawing：
Fig. 1 is the schematic elevational view of heat-exchanger rig according to an embodiment of the invention；
Fig. 2 is the schematic side elevation of heat-exchanger rig according to an embodiment of the invention；
Fig. 3 is the schematic side elevation of semiconductor freezer according to an embodiment of the invention；
Fig. 4 is the schematic rear view of semiconductor freezer according to an embodiment of the invention.
Specific implementation mode
Fig. 1 and Fig. 2 is schematic elevational view and the side view of heat-exchanger rig 600 according to an embodiment of the invention respectively
Figure.It as depicted in figs. 1 and 2, can an embodiment of the present invention provides a kind of heat-exchanger rig 600 for semiconductor freezer
Including the first heat exchanging part 610.First heat exchanging part 610 can have there are two fins set 611 and wind turbine 612.Each fins set 611 has
The fin of multiple parallel intervals setting, and with cold end/hot junction of the semiconductor chilling plate in semiconductor freezer directly or
Ground connection is thermally connected, and two fins sets 611 can be arranged along the length direction interval of fin.Wind turbine 612 may be disposed at two fins
Between group 611, it is configured to promote air-flow from the gap between each two adjacent fins in a fins set 611 to another fins set
Gap flowing in 611 between each two adjacent fins, to take away cold/heat on fin.Wind turbine 612 is set to two fins
Between group 611, and positioned at one end outside of each fin, the thickness of heat-exchanger rig 600 can be reduced, especially suitable for semiconductor
The heat dissipation of refrigerator.Preferably, wind turbine 612 is axial flow blower, and rotation axis extends along the length direction of fin.Each wing
The width of piece is the 1/7 to 3/7 of its length.The width of each fins set 611 is the 1/3 to 2/3 of the length of each fin.
In some further embodiments of the present invention, the first heat exchanging part 610 may also include two ducting assemblies 613,
The both sides of wind turbine 612 are set to, and each ducting assembly 613 limits gas channel, each gas channel is connected to a fin
Gap between each two adjacent fins and wind turbine 612 in group 611.Specifically, a gas channel is connected in a fins set 611
The air inlet in gap and wind turbine 612 between each two adjacent fins.The air outlet of another gas channel connection wind turbine 612 and another
Gap in fins set 611 between each two adjacent fins.
Each ducting assembly 613 may include two side plates.Outermost fin of each side plate from a corresponding fins set 611
One end extend, with the fin be integrally formed；Or, each side plate is also securable to the outermost of corresponding fins set 611
One end of side fin.Further, air-flow is limited jointly with two side plates using the rear shell of semiconductor freezer 510 is equal
Channel；Each ducting assembly 613 can also further comprise bottom plate and cover board, to surround gas channel.
In some embodiments of the invention, as depicted in figs. 1 and 2, heat-exchanger rig 600 may also include the second heat exchanging part
610'.Second heat exchanging part 610' can also have there are two fins set 611, wind turbine 612 and two ducting assemblies 613, and be changed with first
Hot portion 610 is arranged symmetrically about a geometrical plane, to further increase heat exchange efficiency.
In some embodiments of the embodiment, heat-exchanger rig 600 further includes two heat-transfer devices 630, each heat conduction
Device 630 is symmetrical about above-mentioned geometrical plane, and the middle part of each heat-transfer device 630 is configured to absorb heat from heat source or low-temperature receiver
Or cold.One fins set 611 of the first heat exchanging part 610 and a fins set 611 of the second heat exchanging part 610' are set to one
The both ends of heat-transfer device 630；Another fins set 611 of another fins set 611 of first heat exchanging part 610 and the second heat exchanging part 610'
It is set to the both ends of another heat-transfer device 630.That is, the heat-exchanger rig 600 can simultaneously from two heat sources absorb heats or
Cold, and the heat or cold of a corresponding heat source or low-temperature receiver can be transferred to the first heat exchanging part 610 by each heat-exchanger rig 600
One fins set 611 of one fins set 611 and the second heat exchanging part 610'.
Specifically, each heat-transfer device 630 includes heat-conducting substrate 631 and Duo Gen heat carriers 632.Heat-conducting substrate 631 has
With heat source or the hot linked heat-transfer surface of low-temperature receiver.More heat carriers 632 can be alternatively arranged along the length direction of fin.Moreover, every
Heat carrier 632 can be heat pipe, including is fixed on the middle part heat carrier section of heat-conducting substrate 631 and is located at middle part heat carrier section both sides
, the straight heat carrier section in two ends perpendicular to geometrical plane.The middle part heat carrier section of every heat carrier 632 includes：Middle part is straight
Heat carrier section, and two connection heat carrier sections from the both ends of the straight heat carrier section in middle part to both sides that extend respectively from.Every heat conduction
The straight heat carrier section in two ends of body 632 extends respectively through the perforation hole for each fin being mounted thereon.
Preferably, in each heat-transfer device 630, multiple straight heat carrier sections in middle part are in same plane, multiple ends
Straight heat carrier section is in same plane, and the distance between straight heat carrier section in each two adjacent middle part is adjacent less than each two
The distance between the straight heat carrier section in end, multiple straight heat carrier sections in middle part between heat-transfer surface at a distance from directly led less than multiple ends
Hot body section between heat-transfer surface at a distance from.In this way, can make heat-exchanger rig 600 that there is special structure, it is convenient for heat-exchanger rig
600 are installed on semiconductor freezer.
The straight heat carrier section in middle part is fixedly connected with mode with heat-conducting substrate 631 to be：Heat-conducting substrate 631 only has the bottom of there are one
Plate offers multiple holding tanks in heat-transfer surface side opposite to each other；The straight heat carrier section in middle part of more heat carriers 632 is embedding by pressing
Enter holding tank, this mode connects that reliable, thermal resistivity is low.The straight heat carrier section in middle part is fixedly connected with mode with heat-conducting substrate 631
Can be：Heat-conducting substrate 631 can have bottom plate and cover board, the opposite of bottom plate to offer multiple holding tanks in heat-transfer surface side；It is more
The straight heat carrier section in middle part of root heat carrier 632 passes through the embedded holding tank that presses；Cover board is installed on heat-conducting substrate 631 opposite to each other in heat exchange
Face side, with bottom plate that the straight heat carrier section in the middle part of more heat carriers 632 is sandwiched therebetween.
In some alternative embodiments, each heat-transfer device 630 can be the heat-conducting plate of strip, in one side
Portion is heat-transfer surface.Four fins sets 611 are respectively arranged at the both ends of two heat-conducting plates, and the fin of each fins set 611 is from heat conduction
Extend the another side of plate.Heat-conducting plate can be plate-type heat-pipe.In other alternative embodiments, the first heat exchanging part 610
Two fins sets 611 be mountable on a heat-transfer device 630, two fins sets 611 of the second heat exchanging part 610' can be installed
In on another heat-transfer device 630.Specifically, each heat-transfer device 630 may include heat-conducting substrate 631 and more single u-shaped heat-conductive thermo tubes.
The middle part of each U-shaped heat-conductive thermo tube can be thermally connected by the hot junction of heat-conducting substrate 631 and semiconductor chilling plate.Each U-shaped heat conduction
There are one fins sets 611 for the both ends installation of heat pipe.
Further, the embodiment of the present invention additionally provides a kind of semiconductor freezer using above-mentioned heat-exchanger rig 600,
Fig. 3 and Fig. 4 is the schematic side elevation and rearview of semiconductor freezer according to an embodiment of the invention respectively.Such as figure
3 to shown in Fig. 4, the semiconductor freezer of the present embodiment may include semiconductor module 100, liner 200, shell, chamber door 300 with
And insulating layer 400.Storage space is defined in liner 200.Generally there are two kinds of structures for the shell of semiconductor freezer, a kind of
It is pin-connected panel, a complete babinet is assembled by head cover, left side plate, rear shell 510, lower plate etc..Another kind is whole
Formula, i.e., by head cover, rolling is welded at an inverted " u " font, referred to as U shells, then with rear shell 510, lower plate point as required with left side plate
Babinet.The semiconductor freezer of the embodiment of the present invention includes U shells and rear shell 510 it is preferable to use monoblock type shell, i.e. shell.
Rear shell 510 can define installation space with the rear surface of the insulating layer 400 positioned at 200 rear side of liner, and be offered in rear shell 510
First air inlet and the first air outlet.
In this embodiment, the semiconductor module 100 of semiconductor freezer may include semiconductor chilling plate, cold end heat exchange
Device and hot junction heat-exchanger rig.Mounting hole is offered on the insulating layer 400 of 200 rear side of rear wall and liner of liner 200.Cold end is changed
Thermal may include cool guiding block, cold scattering substrate, the multiple cold scattering fins being formed on cold scattering substrate, and be dissipated for forced convertion
Cold cold scattering fan.Cool guiding block and semiconductor chilling plate are installed in mounting hole, and the rear surface and semiconductor refrigerating of cool guiding block
The cold end surface of piece thermally contacts.
Hot junction heat-exchanger rig can be the heat-exchanger rig 600 in any of the above-described embodiment, two wings of the first heat exchanging part 610
Piece group 611 and wind turbine 612 are mounted in installation space and between the first air inlet and the first air outlet.Moreover, first
Two fins sets 611 of heat exchanging part 610 and the hot junction of semiconductor chilling plate are directly or indirectly thermally connected.First heat exchanging part 610
Wind turbine 612 be configured to that air-flow is promoted to enter installation space from the first air inlet, via two fins sets of the first heat exchanging part 610
After 611 installation space is flowed out from the first air outlet.
In order to improve heat exchange efficiency, heat-exchanger rig 600 further comprises the second heat exchanging part 610'.First air outlet is set to
The top of first air inlet；The second air inlet and the second air outlet above the second air inlet are further opened in rear shell 510.
At sustained height, the first air outlet and the second air outlet are at sustained height for first air inlet and the second air inlet.It changes
Two fins sets 611 and wind turbine 612 of second heat exchanging part 610' of thermal 600 are mounted in installation space and are in second
Between air inlet and the second air outlet.Moreover, the hot junction of two fins sets 611 and semiconductor chilling plate of the second heat exchanging part 610'
Directly or indirectly it is thermally connected；The wind turbine 612 of second heat exchanging part 610' is configured to that air-flow is promoted to enter installation from the second air inlet
Installation space is flowed out in space via after two fins sets 611 of the second heat exchanging part 610' from the second air outlet.
In this embodiment, semiconductor module 100 can be two, vertically interval setting, to improve refrigerating efficiency.
Heat-exchanger rig 600 may also include two heat-transfer devices 630.The heat-transfer surface of the heat-conducting substrate 631 of each heat-transfer device 630 and one
The hot junction of semiconductor chilling plate contacts against, by the heat transfer of each semiconductor chilling plate to the first heat exchanging part 610 and
Two heat exchanging part 610'.
So far, although those skilled in the art will appreciate that present invention has been shown and described in detail herein multiple shows
Example property embodiment still without departing from the spirit and scope of the present invention, still can according to the present disclosure directly
Determine or derive many other variations or modifications consistent with the principles of the invention.Therefore, the scope of the present invention is understood that and recognizes
It is set to and covers other all these variations or modifications.
Claims (6)
1. a kind of heat-exchanger rig for semiconductor freezer, it is characterised in that including the first heat exchanging part and the second heat exchanging part,
Second heat exchanging part is arranged symmetrically with first heat exchanging part about a geometrical plane；First heat exchanging part has：
Two fins sets, each fins set has the fin of multiple parallel intervals setting, and described two fins sets are along institute
State the length direction interval setting of fin；With
Wind turbine is set between two fins sets, is configured to promote air-flow each two from a fins set adjacent
Gap flowing of the gap into another fins set between each two adjacent fins between fin；And the heat-exchanger rig also wraps
It includes：
Two heat-transfer devices, each heat-transfer device is symmetrical about the geometrical plane, and
It is configured to absorb heat or cold from heat source or low-temperature receiver in the middle part of each heat-transfer device；
One fins set of first heat exchanging part and a fins set of second heat exchanging part are set to the heat conduction
The both ends of device；
Another fins set of another fins set of first heat exchanging part and second heat exchanging part is set to another heat conduction
The both ends of device；And
Each the heat-transfer device includes：
Heat-conducting substrate has and the heat source or the hot linked heat-transfer surface of low-temperature receiver；With
More heat carriers, the length direction along the fin are alternatively arranged, and the every heat carrier includes being fixed on the heat conduction
The middle part heat carrier section of substrate and positioned at the middle part heat carrier section both sides, two ends perpendicular to the geometrical plane it is straight
The straight heat carrier section in two ends of heat carrier section, the every heat carrier extends respectively through each fin being mounted thereon
Perforation hole；
The middle part heat carrier section of the every heat carrier includes：With the straight straight heat conduction in heat carrier section middle part disposed in parallel in the end
Body section, and two connection heat carrier sections from the both ends of the straight heat carrier section in the middle part to both sides that extend respectively from；And
In each heat-transfer device, multiple straight heat carrier sections in middle part are in same plane, and multiple ends are straight
Heat carrier section is in same plane, and the distance between straight heat carrier section in each two adjacent middle part is less than each two adjacent
The distance between straight heat carrier section in end, the straight heat carrier section in middle part between the heat-transfer surface at a distance from be less than the end it is straight
Heat carrier section between the heat-transfer surface at a distance from.
2. heat-exchanger rig according to claim 1, which is characterized in that
The wind turbine is axial flow blower, and rotation axis extends along the length direction of the fin.
3. heat-exchanger rig according to claim 1, which is characterized in that first heat exchanging part further includes：
Two ducting assemblies are set to the both sides of the wind turbine, and each ducting assembly limits gas channel, with connection
Gap between each two adjacent fins and the wind turbine in one fins set.
4. heat-exchanger rig according to claim 1, which is characterized in that
The width of each fin is the 1/7 to 3/7 of its length；
The width of each fins set is the 1/3 to 2/3 of the length of each fin.
5. a kind of semiconductor freezer, including liner, semiconductor chilling plate and the insulating layer being set on rear side of the liner,
It is characterized in that, further includes：
Rear shell defines installation space with the rear surface of the insulating layer, and offers the first air inlet and first thereon and go out
Air port；With
Heat-exchanger rig according to any one of claim 1 to 4, two fins sets and wind turbine of the first heat exchanging part are pacified
Loaded in the installation space and between first air inlet and first air outlet；And
Two fins sets of first heat exchanging part and the hot junction of the semiconductor chilling plate are directly or indirectly thermally connected；
The wind turbine of first heat exchanging part is configured to that air-flow is promoted to enter the installation space from first air inlet, via institute
It states and flows out the installation space from first air outlet after two fins sets of the first heat exchanging part.
6. semiconductor freezer according to claim 5, which is characterized in that
First air outlet is set to the top of first air inlet；
The second air inlet and the second air outlet above second air inlet are further opened in the rear shell；And
Two fins sets and wind turbine of second heat exchanging part of the heat-exchanger rig are mounted in the installation space and are in institute
It states between the second air inlet and second air outlet；And
Two fins sets of second heat exchanging part and the hot junction of the semiconductor chilling plate are directly or indirectly thermally connected；
The wind turbine of second heat exchanging part is configured to that air-flow is promoted to enter the installation space from second air inlet, via institute
It states and flows out the installation space from second air outlet after two fins sets of the second heat exchanging part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510996970.6A CN105485969B (en) | 2015-12-24 | 2015-12-24 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510996970.6A CN105485969B (en) | 2015-12-24 | 2015-12-24 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
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| Publication Number | Publication Date |
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| CN105485969A CN105485969A (en) | 2016-04-13 |
| CN105485969B true CN105485969B (en) | 2018-10-12 |
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| CN108562090A (en) * | 2018-05-24 | 2018-09-21 | 澳柯玛股份有限公司 | A kind of semiconductor refrigerating air-cooled freezer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2236638Y (en) * | 1995-09-05 | 1996-10-02 | 白雪 | Heat pipe radiator |
| CN104197612A (en) * | 2014-09-03 | 2014-12-10 | 四川航天系统工程研究所 | High-efficiency cooling assembly of semiconductor refrigerator |
| CN104329850A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN204612555U (en) * | 2015-04-30 | 2015-09-02 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
| CN205537253U (en) * | 2015-12-24 | 2016-08-31 | 青岛海尔电冰箱有限公司 | Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW545883U (en) * | 2002-11-20 | 2003-08-01 | Sunonwealth Electr Mach Ind Co | Heat dissipating device |
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| CN2236638Y (en) * | 1995-09-05 | 1996-10-02 | 白雪 | Heat pipe radiator |
| CN104329850A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN104197612A (en) * | 2014-09-03 | 2014-12-10 | 四川航天系统工程研究所 | High-efficiency cooling assembly of semiconductor refrigerator |
| CN204612555U (en) * | 2015-04-30 | 2015-09-02 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
| CN205537253U (en) * | 2015-12-24 | 2016-08-31 | 青岛海尔电冰箱有限公司 | Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator |
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| CN105485969A (en) | 2016-04-13 |
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