CN105405805A - 切断装置、吸附机构及具备吸附机构的装置 - Google Patents
切断装置、吸附机构及具备吸附机构的装置 Download PDFInfo
- Publication number
- CN105405805A CN105405805A CN201510490571.2A CN201510490571A CN105405805A CN 105405805 A CN105405805 A CN 105405805A CN 201510490571 A CN201510490571 A CN 201510490571A CN 105405805 A CN105405805 A CN 105405805A
- Authority
- CN
- China
- Prior art keywords
- adsorption
- absorption
- hole
- base plate
- workbench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-180254 | 2014-09-04 | ||
| JP2014180254A JP6382039B2 (ja) | 2014-09-04 | 2014-09-04 | 切断装置並びに吸着機構及びこれを用いる装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105405805A true CN105405805A (zh) | 2016-03-16 |
Family
ID=55471207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510490571.2A Pending CN105405805A (zh) | 2014-09-04 | 2015-08-11 | 切断装置、吸附机构及具备吸附机构的装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6382039B2 (ko) |
| KR (1) | KR20160028953A (ko) |
| CN (1) | CN105405805A (ko) |
| MY (1) | MY173967A (ko) |
| TW (1) | TWI566291B (ko) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108074841A (zh) * | 2016-11-11 | 2018-05-25 | 株式会社迪思科 | 封装基板切断用治具工作台 |
| CN108435714A (zh) * | 2018-04-12 | 2018-08-24 | 环维电子(上海)有限公司 | 一种新型干冰清洗底座及其清洗方法 |
| CN109585352A (zh) * | 2017-09-28 | 2019-04-05 | 东和株式会社 | 保持构件、保持构件的制造方法、检查装置及切断装置 |
| CN110137101A (zh) * | 2018-02-08 | 2019-08-16 | 东和株式会社 | 切断装置以及切断品的制造方法 |
| US20220314595A1 (en) * | 2021-03-31 | 2022-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chuck, lamination process, and manufacturing method of semiconductor package using the same |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101899653B1 (ko) * | 2016-10-05 | 2018-09-18 | 주식회사 포스코 | 소재 안착장치 |
| JP6626027B2 (ja) * | 2017-03-16 | 2019-12-25 | Ｔｏｗａ株式会社 | 製造装置および電子部品の製造方法 |
| JP2019016700A (ja) * | 2017-07-07 | 2019-01-31 | Ｔｏｗａ株式会社 | 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置 |
| JP6746756B1 (ja) * | 2019-05-24 | 2020-08-26 | Ｔｏｗａ株式会社 | 吸着プレート、切断装置および切断方法 |
| JP7390855B2 (ja) * | 2019-10-24 | 2023-12-04 | 株式会社ディスコ | 切削装置のチャックテーブル |
| JP7423161B2 (ja) | 2020-06-30 | 2024-01-29 | 株式会社ディスコ | チャックテーブル |
| KR20230135661A (ko) * | 2021-03-18 | 2023-09-25 | 토와 가부시기가이샤 | 가공 장치 및 가공품의 제조 방법 |
| CN118235234A (zh) | 2022-10-21 | 2024-06-21 | 株式会社东光高岳 | 工件检查装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040084128A (ko) * | 2003-03-26 | 2004-10-06 | 한미반도체 주식회사 | 반도체 쏘잉장치의 척테이블 |
| JP2004330417A (ja) * | 2003-04-30 | 2004-11-25 | Towa Corp | 基板の切断方法、切断装置および基板吸着固定機構 |
| JP2008221391A (ja) * | 2007-03-13 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 基板吸着固定機構 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62234685A (ja) * | 1986-04-02 | 1987-10-14 | Mitsubishi Electric Corp | 加工材料の切断方法 |
| JPS62234686A (ja) * | 1986-04-02 | 1987-10-14 | Mitsubishi Electric Corp | 加工材料の切断方法 |
| JP2006229129A (ja) * | 2005-02-21 | 2006-08-31 | Fujitsu Ltd | 真空吸着装置 |
| JP2006344827A (ja) * | 2005-06-09 | 2006-12-21 | Renesas Technology Corp | 半導体装置の製造方法 |
| FR2893873B1 (fr) * | 2005-11-25 | 2008-12-12 | Air Liquide | Procede de coupage avec un laser a fibre d'acier inoxydable |
| JP5086690B2 (ja) * | 2007-05-18 | 2012-11-28 | 日本特殊陶業株式会社 | セラミック基板の製造方法 |
| JP5117772B2 (ja) * | 2007-06-28 | 2013-01-16 | 株式会社ディスコ | 切削装置 |
| JP2011040542A (ja) | 2009-08-10 | 2011-02-24 | Disco Abrasive Syst Ltd | パッケージ基板の分割方法 |
| JP2011216704A (ja) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | 半導体ウェハ加工用粘着テープ |
-
2014
- 2014-09-04 JP JP2014180254A patent/JP6382039B2/ja active Active
-
2015
- 2015-08-11 CN CN201510490571.2A patent/CN105405805A/zh active Pending
- 2015-08-12 TW TW104126196A patent/TWI566291B/zh active
- 2015-08-20 KR KR1020150117404A patent/KR20160028953A/ko not_active Application Discontinuation
- 2015-09-03 MY MYPI2015002168A patent/MY173967A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040084128A (ko) * | 2003-03-26 | 2004-10-06 | 한미반도체 주식회사 | 반도체 쏘잉장치의 척테이블 |
| JP2004330417A (ja) * | 2003-04-30 | 2004-11-25 | Towa Corp | 基板の切断方法、切断装置および基板吸着固定機構 |
| JP2008221391A (ja) * | 2007-03-13 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 基板吸着固定機構 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108074841A (zh) * | 2016-11-11 | 2018-05-25 | 株式会社迪思科 | 封装基板切断用治具工作台 |
| CN108074841B (zh) * | 2016-11-11 | 2023-04-07 | 株式会社迪思科 | 封装基板切断用治具工作台 |
| CN109585352A (zh) * | 2017-09-28 | 2019-04-05 | 东和株式会社 | 保持构件、保持构件的制造方法、检查装置及切断装置 |
| CN110137101A (zh) * | 2018-02-08 | 2019-08-16 | 东和株式会社 | 切断装置以及切断品的制造方法 |
| CN110137101B (zh) * | 2018-02-08 | 2023-03-10 | 东和株式会社 | 切断装置以及切断品的制造方法 |
| CN108435714A (zh) * | 2018-04-12 | 2018-08-24 | 环维电子(上海)有限公司 | 一种新型干冰清洗底座及其清洗方法 |
| CN108435714B (zh) * | 2018-04-12 | 2023-08-29 | 环维电子(上海)有限公司 | 一种新型干冰清洗底座及其清洗方法 |
| US20220314595A1 (en) * | 2021-03-31 | 2022-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chuck, lamination process, and manufacturing method of semiconductor package using the same |
| US20240017538A1 (en) * | 2021-03-31 | 2024-01-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lamination process, and manufacturing method of semiconductor package using a chuck |
| US11993066B2 (en) * | 2021-03-31 | 2024-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chuck, lamination process, and manufacturing method of semiconductor package using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201616566A (zh) | 2016-05-01 |
| TWI566291B (zh) | 2017-01-11 |
| MY173967A (en) | 2020-02-28 |
| JP2016054256A (ja) | 2016-04-14 |
| KR20160028953A (ko) | 2016-03-14 |
| JP6382039B2 (ja) | 2018-08-29 |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160316 |
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