CN105338225A - Camera module - Google Patents
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- CN105338225A CN105338225A CN201410355836.3A CN201410355836A CN105338225A CN 105338225 A CN105338225 A CN 105338225A CN 201410355836 A CN201410355836 A CN 201410355836A CN 105338225 A CN105338225 A CN 105338225A
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- circuit board
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Abstract
The invention discloses a camera module. The camera module comprises a camera assembly, a main circuit board, a sub-circuit board, a connector and a metal sheet, wherein the camera assembly is electrically connected to the main circuit board; the sub-circuit board comprises a first surface and a second surface which are arranged back to back; the connector is arranged on the first surface; the sub-circuit board is electrically connected to the main circuit board; the metal sheet is arranged on the second surface of the sub-circuit board; the metal sheet is electrically connected with a ground end of the sub-circuit board; one side, which is deviated from the sub-circuit board, of the metal sheet is provided with a second ink layer; the second ink layer comprises a hollowed area; and the surface of an element below the second ink layer is exposed in the hollowed area in order to form a two-dimensional code pattern. The two-dimensional code pattern has high stability, is prevented from falling off, and is convenient to store for a long time.
Description
Technical field
The present invention relates to a kind of camera module of portable type electronic product.
Background technology
Existing portable type electronic product, such as mobile phone, PAD, comprise camera module, and existing camera module does not have ID (identification number, i.e. sequence number) label, and inconvenience is numbered tracking to camera module.In some existing electronic product, by will the mark label of bar code or numbering be equipped with on camera module at product line, carry out numbering and the tracking of camera module.But such bar code or number-mark easily damage and come off, be not easy to permanent preservation, and also add and paste operation, when comparatively taking a lot of work.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of camera module, has firm Quick Response Code mark, be convenient to be numbered tracking to camera module, and Quick Response Code is not easy to come off, is convenient to permanent preservation.To achieve these goals, embodiment of the present invention provides following technical scheme:
The present invention has supplied a kind of camera module, a kind of camera module, comprise camera assembly, main circuit board, sub-circuit board and connector, described camera assembly is electrically connected to described main circuit board, described sub-circuit board comprises first surface and the second surface of back-to-back setting, described connector is arranged at described first surface, described sub-circuit board is electrically connected on described main circuit board, described camera module also comprises sheet metal, described sheet metal is located at the described second surface of described sub-circuit board, and described sheet metal is electrically connected with the ground of described sub-circuit board, the side deviating from described sub-circuit board of described sheet metal arranges the second ink layer, described second ink layer comprises void region, the surface of the element below described second ink layer is exposed at described void region place, thus formation pattern in 2 D code.
Wherein, the surface of the element below described second ink layer is the surface of sheet metal.
Wherein, between described second ink layer and sheet metal, the first ink layer is also set, described first ink layer is different from the color of described second ink layer, and described first ink layer is exposed in described void region, and the surface of the element below described second ink layer is the surface of described first ink layer.
Wherein, described first ink layer is white ink, and described second ink layer is black ink.
Wherein, the thickness of described first ink layer and described second ink layer is 25um.
Wherein, described camera module also comprises substratum transparent, and described substratum transparent covers described second ink layer.
Wherein, described sub-circuit board is flexible PCB, described sub-circuit board comprises supporting part and connecting portion, described supporting part is for installing described connector, described sheet metal is located at the side deviating from described connector of described supporting part, and described connecting portion is used for described supporting part to be connected to described main circuit board.
Wherein, described main circuit board is flexible PCB, and described camera module also comprises reinforced sheet, and described reinforced sheet is fixed on the side deviating from described camera assembly of described main circuit board.
Wherein, described camera assembly comprises camera lens, lens mount, filter and sensor chip, described sensor chip is located on described main circuit board, described camera lens is mounted in described lens mount, described lens mount is fixed to described main circuit board, and described filter is between described sensor chip and described camera lens.
Wherein, described sheet metal is steel disc, and its colouring discrimination is in described second ink layer.
The present invention arranges sheet metal by the second surface at sub-circuit board, the side deviating from described sub-circuit board of described sheet metal arranges the second ink layer, described second ink layer comprises void region, the surface of the element below described second ink layer is exposed at described void region place, thus forms pattern in 2 D code.Realize arranging Quick Response Code on camera module by technical scheme of the present invention, there is steadiness, difficult drop-off, be convenient to permanent preservation, be convenient to be numbered tracking to camera module.And sheet metal is electrically connected with the ground of sub-circuit board and can makes camera module ground connection better, there is the beneficial effect of electrostatic protection.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in execution mode below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained as these accompanying drawings.
Fig. 1 is the floor map of the camera module that one embodiment of the present invention provides.
Fig. 2 is the floor map of the other direction of the camera module that one embodiment of the present invention provides.
Fig. 3 is the side schematic view of the camera module that one embodiment of the present invention provides.
Fig. 4 is the enlarged diagram of the sub-circuit board part of the camera module that the first execution mode of the present invention provides.
Fig. 5 is the enlarged diagram of the sub-circuit board part of the camera module that the second execution mode of the present invention provides.
Fig. 6 is the enlarged diagram of the sub-circuit board part of the camera module that the third execution mode of the present invention provides.
Fig. 7 is the enlarged diagram of the sub-circuit board part of the present invention's the 4th kind of camera module that execution mode provides.
Fig. 8 is the perspective exploded view of the camera module that one embodiment of the present invention provides.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Refer to Fig. 1 to Fig. 3, the present invention has supplied a kind of camera module 100, is applied in the portable type electronic product such as mobile phone or flat board.Described camera module 100 comprises camera assembly 10, main circuit board 20, sub-circuit board 30 and connector 40.Described camera assembly 10 is electrically connected to described main circuit board 20.In a kind of execution mode, refer to Fig. 8, camera assembly 10 comprises camera lens 12, microscope base 14, filter 16 and sensor chip 18, sensor chip 18 is arranged on main circuit board 20, camera lens 12 is arranged in microscope base 14, microscope base 14 is arranged on main circuit board 20, and camera lens 12 is positioned at directly over sensor chip 18, and filter 16 is arranged between sensor chip 18 and camera lens 12.Described sub-circuit board 30 comprises first surface 301 and the second surface 302 of back-to-back setting, and alternatively first surface 301 and second surface 302 are respectively the front and back of sub-circuit board 30.Described connector 40 is arranged at described first surface 301, described sub-circuit board 30 is electrically connected on described main circuit board 20, described connector 40 is electrically connected to the sensor chip 18 of the camera assembly 10 on main circuit board 20 by the inside cabling of circuit board, connector 40 is electrically connected with the mainboard of portable type electronic product inside, make the sensor chip 18 of the control module on mainboard and camera assembly 10 carry out Signal transmissions, realize the process of image.
Described camera module 100 also comprises sheet metal 70, described sheet metal 70 is located at the described second surface of described sub-circuit board 30, and described sheet metal 70 is electrically connected with the ground of described sub-circuit board 30, such as, be electrically connected with realizing by conducting resinl between sheet metal 70 with sub-circuit board 30.
As shown in Figure 4, the structure at sub-circuit board 30 place of camera module 100 that provides of the first execution mode of the present invention is as follows.The side deviating from described sub-circuit board 30 of described sheet metal 70 arranges the second ink layer 60, described second ink layer 60 comprises void region, the surface of the element be arranged at below described second ink layer 60 is exposed at described void region place, the element blocked between the second ink layer 60 and sheet metal 70 and by the second ink layer 60 is namely located at by the element be arranged at below the second ink layer 60, in present embodiment, element below described second ink layer 60 is described sheet metal 70, the described surface of the second ink layer 60 lower element and the surface of described sheet metal 70, thus form pattern in 2 D code A.The void region of the second ink layer 60 is formed on the surface at sheet metal 70 by the mode of laser-induced thermal etching.
As shown in Figure 5, the structure at sub-circuit board 30 place of camera module 100 that provides of the second execution mode of the present invention is as follows.On the basis of the first execution mode as shown in Figure 4, the surface of described sheet metal 70 pastes the first ink layer 50, described second ink layer 60 hides described first ink layer 50, described first ink layer 50 is different from the color of described second ink layer 60, namely on Fig. 4 execution mode basis, between sheet metal 70 and the second ink layer 60, the first ink layer 50 is set, same second ink layer 60 forms void region, the surface of the element be arranged at below described second ink layer 60 is exposed at described void region place, in present embodiment, described second ink layer 60 lower element is described first ink layer 50, the surface of described second ink layer 60 lower element and the surface of described first ink layer 50.Thus make described first ink layer 50 jointly form pattern in 2 D code A with described second ink layer 60.First ink layer 50 and the second ink layer 60 can firmly be attached on sheet metal 70, are not easy to come off.The void region of the second ink layer 60 is formed on the second ink layer 60 by the mode of laser-induced thermal etching, because the first ink layer 50 is different with the second ink layer 60 color, expose the first oil lamella at void region place, this makes it possible to form the pattern according to certain coding rule, camera module 100 being carried out to the Quick Response Code of unique identity coding.
As shown in Figure 6 and Figure 7, the structure of the sub-circuit board part of camera module that provides of the present invention the 3rd and the 4th kind of execution mode is as follows.Divide separately on the basis of the second execution mode shown in the first execution mode shown in Fig. 4 and Fig. 5, described camera module 100 also comprises substratum transparent 80, and described substratum transparent 80 covers described second ink layer, prevents wearing and tearing pattern in 2 D code A.
By the label of pattern in 2 D code as camera module 100, camera module 100 is made to have unique ID (identification number, i.e. sequence number), the information such as module date of manufacture batch can be inquired about, the more detailed information of module can be read further as details such as factory setting, each station tuning parameter historical records according to database data in background system again, be convenient to follow-up analysis tracking work.In camera module 100 in the present invention, Quick Response Code is arranged at the one side towards operator of sub-circuit board 30, and namely on second surface 302, handled easily person is scanned, and can make full use of this face originally not needing to arrange other elements.
In a kind of execution mode, described first ink layer 50 is white ink, and described second ink layer 60 is black ink.In other execution mode, also the first ink layer 50 can be set is as black, and the second ink layer 60 is arranged in white.
In a kind of execution mode, described first ink layer 50 is 25um with the thickness of described second ink layer 60.This thickness can be saved ink and can form described vacancy section.
Described sub-circuit board 30 is electrically connected to described main circuit board 20 by winding displacement or flexible PCB.In a kind of execution mode, sub-circuit board 30 and main circuit board 20 are for being arranged on two parts on one piece of flexible PCB, and outside sub-circuit board 30 and main circuit board 20, add hard plate respectively, hard plate can the shape of firmly sub-circuit board 30 and main circuit board 20, prevents from being arranged on coming off of electronic component (the such as sensor chip and connector 40) above the two.
In a kind of execution mode, described sub-circuit board 30 is flexible PCB, described sub-circuit board 30 comprises supporting part 32 and connecting portion 34, and described supporting part 32 is for installing described connector 40, and described sheet metal 70 is located at the side deviating from described connector of described supporting part.Connecting portion 34 is for being connected to main circuit board 20 by supporting part 32.
Described main circuit board 20 is flexible PCB, and as shown in Figure 3, described camera module 100 also comprises reinforced sheet 90, and described reinforced sheet 90 is fixed on the side deviating from described camera assembly 10 of described main circuit board 20.
The present invention is by overlapping the first different ink layer 50 and the second ink layer 60 of color at the second surface of sub-circuit board 30, described second ink layer 60 blocks described first ink layer 50, described second ink layer 60 comprises void region, described first ink layer 50 is exposed at described void region place, thus makes described first ink layer 50 jointly form pattern in 2 D code with described second ink layer 60.Realize arranging Quick Response Code on camera module 100 by technical scheme of the present invention, form pattern in 2 D code by stacked two-layer ink, such Quick Response Code mark has steadiness, difficult drop-off, be convenient to permanent preservation, be convenient to be numbered tracking to camera module 100.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a camera module, comprise camera assembly, main circuit board, sub-circuit board and connector, described camera assembly is electrically connected to described main circuit board, described sub-circuit board comprises first surface and the second surface of back-to-back setting, described connector is arranged at described first surface, described sub-circuit board is electrically connected on described main circuit board, it is characterized in that, described camera module also comprises sheet metal, described sheet metal is located at the described second surface of described sub-circuit board, and described sheet metal is electrically connected with the ground of described sub-circuit board, the side deviating from described sub-circuit board of described sheet metal arranges the second ink layer, described second ink layer comprises void region, the surface of the element below described second ink layer is exposed at described void region place, thus formation pattern in 2 D code.
2. camera module as claimed in claim 1, is characterized in that: the surface of the element below described second ink layer is the surface of sheet metal.
3. camera module as claimed in claim 1, it is characterized in that, between described second ink layer and sheet metal, the first ink layer is also set, described first ink layer is different from the color of described second ink layer, described first ink layer is exposed in described void region, and the surface of the element below described second ink layer is the surface of described first ink layer.
4. camera module as claimed in claim 3, it is characterized in that, described first ink layer is white ink, and described second ink layer is black ink.
5. camera module as claimed in claim 4, it is characterized in that, the thickness of described first ink layer and described second ink layer is 25um.
6. the camera module as described in claim 1-5 any one claim, is characterized in that, described camera module also comprises substratum transparent, and described substratum transparent covers described second ink layer.
7. camera module as claimed in claim 6, it is characterized in that, described sub-circuit board is flexible PCB, described sub-circuit board comprises supporting part and connecting portion, described supporting part is for installing described connector, described sheet metal is located at the side deviating from described connector of described supporting part, and described connecting portion is used for described supporting part to be connected to described main circuit board.
8. camera module as claimed in claim 6, it is characterized in that, described main circuit board is flexible PCB, and described camera module also comprises reinforced sheet, and described reinforced sheet is fixed on the side deviating from described camera assembly of described main circuit board.
9. camera module as claimed in claim 8, it is characterized in that, described camera assembly comprises camera lens, lens mount, filter and sensor chip, described sensor chip is located on described main circuit board, described camera lens is mounted in described lens mount, described lens mount is fixed to described main circuit board, and described filter is between described sensor chip and described camera lens.
10. camera module as claimed in claim 2, it is characterized in that, described sheet metal is steel disc, and its colouring discrimination is in described second ink layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410355836.3A CN105338225B (en) | 2014-07-24 | 2014-07-24 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410355836.3A CN105338225B (en) | 2014-07-24 | 2014-07-24 | Camera module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105338225A true CN105338225A (en) | 2016-02-17 |
| CN105338225B CN105338225B (en) | 2019-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410355836.3A Expired - Fee Related CN105338225B (en) | 2014-07-24 | 2014-07-24 | Camera module |
Country Status (1)
| Country | Link |
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| CN (1) | CN105338225B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107766911A (en) * | 2017-12-06 | 2018-03-06 | 深圳同兴达科技股份有限公司 | A kind of LCM for being easy to management and control |
| WO2020192437A1 (en) * | 2019-03-22 | 2020-10-01 | 宁波舜宇光电信息有限公司 | Camera module, lens assembly of same, and assembly method therefor |
| CN112020205A (en) * | 2020-08-13 | 2020-12-01 | 歌尔光学科技有限公司 | Printed circuit board and manufacturing method thereof |
| WO2022016686A1 (en) * | 2020-07-24 | 2022-01-27 | 广州方邦电子股份有限公司 | Shielding film and circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022016686A1 (en) * | 2020-07-24 | 2022-01-27 | 广州方邦电子股份有限公司 | Shielding film and circuit board |
| CN112020205A (en) * | 2020-08-13 | 2020-12-01 | 歌尔光学科技有限公司 | Printed circuit board and manufacturing method thereof |
| CN112020205B (en) * | 2020-08-13 | 2022-03-25 | 歌尔光学科技有限公司 | Printed circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105338225B (en) | 2019-03-26 |
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