CN105184349A

CN105184349A - Intelligent card and manufacturing method thereof

Info

Publication number: CN105184349A
Application number: CN201510456793.2A
Authority: CN
Inventors: 陆舟; 于华章
Original assignee: Feitian Technologies Co Ltd
Current assignee: Feitian Technologies Co Ltd
Priority date: 2015-07-29
Filing date: 2015-07-29
Publication date: 2015-12-23
Anticipated expiration: 2035-07-29
Also published as: CN105184349B

Abstract

The invention discloses an intelligent card and a manufacturing method thereof. The manufacturing method comprises the steps of: respectively hollowing a first substrate, a second substrate and a third substrate to obtain a bottom layer hollowed substrate, a middle layer hollowed substrate and a top layer hollowed substrate; synthesizing the bottom layer hollowed substrate, the middle layer hollowed substrate and the top layer hollowed substrate to obtain a synthetic hollowed substrate; filling inner inserts into the synthetic hollowed substrate; and painting an adhesive on the synthetic hollowed substrate to obtain the intelligent card. The manufacturing method adopts the technical scheme of synthesizing the three hollowed substrates to obtain the synthetic hollowed substrate and filling the inner inserts into the synthetic hollowed substrate, reduces production difficulty of the intelligent card with a human-computer interaction function, and improves production efficiency.

Description

A kind of smart card and manufacture method thereof

Technical field

The present invention relates to field of intelligent cards, particularly a kind of smart card and manufacture method thereof.

Background technology

Smart card mainly contains two kinds, and a kind of is smart card with contact chip; Another kind is the smart card with contactless chip.Current appearance can the smart card of compatible above-mentioned two kinds of functions, i.e. two interface chip smart card.But no matter be which kind of smart card, the ability of its man-machine interaction is all very weak.

In prior art, although there is the smart card that can carry out man-machine interaction, the production difficulty in prior art with the smart card of human-computer interaction function is large, and production efficiency is low.

Summary of the invention

The invention provides a kind of smart card and manufacture method thereof, the production difficulty solving in prior art the smart card with human-computer interaction function is large, the technical matters that production efficiency is low.

The invention provides a kind of smart card, comprising: synthesis hollow out substrate and the overlayer be covered on described synthesis hollow out substrate; Interior mold insert is accommodated in described synthesis hollow out substrate; Described synthesis hollow out substrate comprises: bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate.

Alternatively, described interior mold insert comprises mutual circuit module.

Alternatively, described interior mold insert also comprises nonreciprocal circuit module.

Alternatively, described mutual circuit module comprises: key-press module and display module; Described nonreciprocal circuit module comprises: power module and control module.

Alternatively, the height of described mutual circuit module is greater than the height of described nonreciprocal circuit module;

Described mutual circuit module is at least arranged in the void region of described top layer hollow out substrate; Described nonreciprocal circuit module is at least arranged in the void region of one deck hollow out substrate of described bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate.

Alternatively, described mutual circuit module comprises: key-press module and display module; Described nonreciprocal circuit module comprises: power module and control module;

The height of described key-press module and the height of described display module are greater than the height of described power module and the height of described control module;

Described key-press module is arranged in the void region of described bottom hollow out substrate, the void region of described middle level hollow out substrate and the void region of described top layer hollow out substrate;

Described display module is arranged in the void region of described bottom hollow out substrate, the void region of described middle level hollow out substrate and the void region of described top layer hollow out substrate;

Described power module is at least arranged in the void region of described bottom hollow out substrate;

Described control module is at least arranged in the void region of described bottom hollow out substrate.

Alternatively, described power module is different with the height of described control module;

When the height of described power module is greater than the height of described control module, described power module is at least also arranged in the void region of described middle level hollow out substrate;

When the height of described control module is greater than the height of described power module, described control module is at least also arranged in the void region of described middle level hollow out substrate.

Alternatively, described control module comprises: circuit board and microcontroller.

Alternatively, described overlayer comprises: the first printing pattern layer, the first printing bed of material and the first printing protective seam; The described first printing bed of material is between described synthesis hollow out substrate and described first printing pattern layer, and described first printing pattern layer is between the described first printing bed of material and described first printing protective seam.

Alternatively, described overlayer also comprises overlay film; Described overlay film is between described synthesis hollow out substrate and the described first printing bed of material.

Alternatively, described overlayer comprises: the second printing pattern layer and the second printing bed of material; Described second printing pattern layer is between the described second printing bed of material and described synthesis hollow out substrate; The described second printing bed of material is transparent.

Alternatively, described overlayer also comprises overlay film; Described overlay film is between described synthesis hollow out substrate and described second printing pattern layer.

Alternatively, described tectal starting material are at least one in PVC, PC, PETG, PET or ABSPVC resin.

Present invention also offers a kind of manufacture method of smart card, comprising:

Step s1: hollow out first substrate, second substrate and the 3rd substrate respectively, obtains bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate;

Step s2: synthesize described bottom hollow out substrate, described middle level hollow out substrate and described top layer hollow out substrate, obtains synthesis hollow out substrate;

Step s3: interior mold insert is filled in described synthesis hollow out substrate;

Step s4: adhesive-applying on described synthesis hollow out substrate, obtains smart card.

Alternatively, described step s1 specifically comprises: adopt die-cut, vexed cutting or milling bottom technique, first substrate, described second substrate and described 3rd substrate described in hollow out, obtain described bottom hollow out substrate, described middle level hollow out substrate and described top layer hollow out substrate respectively.

Alternatively, described step s1 specifically comprises:

Preset void region according to first, first substrate described in hollow out obtains described bottom hollow out substrate, and described bottom hollow out substrate comprises bottom void region;

Preset void region according to second, second substrate described in hollow out obtains described middle level hollow out substrate, and described middle level hollow out substrate comprises void region, middle level;

Preset void region according to the 3rd, the 3rd substrate described in hollow out obtains described top layer hollow out substrate, and described top layer hollow out substrate comprises top layer void region.

Alternatively, described step s1 specifically comprises:

Preset void region and the first preset thickness according to first, first substrate described in hollow out obtains described bottom hollow out substrate, and described bottom hollow out substrate comprises bottom void region;

Preset void region and the second preset thickness according to second, second substrate described in hollow out obtains described middle level hollow out substrate, and described middle level hollow out substrate comprises void region, middle level;

Preset void region and the 3rd preset thickness according to the 3rd, the 3rd substrate described in hollow out obtains described top layer hollow out substrate, and described top layer hollow out substrate comprises top layer void region.

Alternatively, described step s2 specifically comprises:

Adopt the technique of stickup and/or lamination, according to the size of described bottom void region, void region, described middle level and described top layer void region, described bottom hollow out substrate, described middle level hollow out substrate and described top layer hollow out substrate are synthesized, obtains the described synthesis hollow out substrate that can hold described interior mold insert.

Alternatively, described step s2 specifically comprises: the technique adopting stickup and/or lamination, synthesizes, obtain the described synthesis hollow out substrate that can hold described interior mold insert to described bottom hollow out substrate, described middle level hollow out substrate and described top layer hollow out substrate.

Alternatively, describedly synthesis is carried out to middle level hollow out substrate described in described bottom hollow out substrate and described top layer hollow out substrate be specially: single sintering or multi-stage synthesis are carried out to described bottom hollow out substrate, described middle level hollow out substrate and described top layer hollow out substrate.

Alternatively, described step s3 specifically comprises: the technique adopting stickup and/or lamination, is filled into described interior mold insert in described synthesis hollow out substrate.

Alternatively, also comprise after described step s3: in the space between described interior mold insert and described synthesis hollow out substrate, fill bonding agent.

Alternatively, describedly after adhesive-applying, also to comprise on described synthesis hollow out substrate: on described synthesis hollow out substrate, paste overlayer.

Alternatively, described overlayer comprises: the second printing pattern layer and the second printing bed of material, and the described second printing bed of material is transparent; Described second printing pattern layer is between the described second printing bed of material and described synthesis hollow out substrate.

Alternatively, before described step s4, also comprise: on described top layer hollow out substrate, paste overlay film.

Alternatively, described interior mold insert comprises mutual circuit module.

The invention has the beneficial effects as follows: the invention provides a kind of smart card and manufacture method thereof, described manufacture method obtains synthesis hollow out substrate by adopting the substrate of synthesis three layers of hollow out, interior mold insert is filled into the technical scheme in synthesis hollow out substrate, reduce the production difficulty of the smart card with human-computer interaction function, improve production efficiency.

Accompanying drawing explanation

The process flow diagram of a kind of manufacture method of intelligent cards that Fig. 1 provides for the embodiment of the present invention 1;

The process flow diagram of a kind of manufacture method of intelligent cards that Fig. 2 provides for the embodiment of the present invention 2;

The schematic diagram of the substrate that Fig. 3-Fig. 5 embodiment of the present invention 2 provides;

The schematic diagram of the hollow out substrate that Fig. 6-8 provides for the embodiment of the present invention 2;

Fig. 9 for the embodiment of the present invention 2 provide in the floor map of mold insert;

Figure 10 for the embodiment of the present invention 2 provide in the structural representation of mold insert;

The sectional view of the synthesis hollow out substrate that Figure 11 provides for the embodiment of the present invention 2;

The sectional view accommodating the synthesis hollow out substrate of interior mold insert that Figure 12 provides for the embodiment of the present invention 2;

The sectional view of the smart card that Figure 13, Figure 14, Figure 16 and Figure 17 provide for the embodiment of the present invention 2;

The tectal structural drawing of one that Figure 15 provides for the embodiment of the present invention 2;

The process flow diagram of a kind of manufacture method of intelligent cards that Figure 18 provides for the embodiment of the present invention 3;

The schematic diagram of the substrate that Figure 19-Figure 21 embodiment of the present invention 3 provides;

The schematic diagram of the hollow out substrate that Figure 22-24 provides for the embodiment of the present invention 3;

Figure 25 for the embodiment of the present invention 3 provide in mold insert floor map;

Figure 26 for the embodiment of the present invention 3 provide in the structural representation of mold insert;

The sectional view of the synthesis hollow out substrate that Figure 27 provides for the embodiment of the present invention 3;

The sectional view accommodating the synthesis hollow out substrate of interior mold insert that Figure 28 provides for the embodiment of the present invention 3.

Embodiment

Below in conjunction with accompanying drawing of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those skilled in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.

Embodiment 1

Present embodiments provide a kind of smart card, comprising: synthesis hollow out substrate and the overlayer be covered on synthesis hollow out substrate.

Interior mold insert is accommodated in synthesis hollow out substrate.

Synthesis hollow out substrate comprises three layers of hollow out substrate, is respectively bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate.

In the present embodiment, the thickness sum of three layers of hollow out substrate is for presetting gross thickness.

In the present embodiment, interior mold insert can comprise mutual circuit module, and mutual circuit module is the circuit module with human-computer interaction function.

In the present embodiment, interior mold insert can also comprise nonreciprocal circuit module.Nonreciprocal circuit module is the circuit module without human-computer interaction function.

In the present embodiment, the height between each circuit module can be identical or different, and preferably, the height of mutual circuit module is greater than the height of nonreciprocal circuit module.Accordingly, mutual circuit module is at least arranged in the void region of top layer hollow out substrate; Nonreciprocal circuit module is at least arranged in the void region of one deck hollow out substrate of bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate.Preferably, mutual circuit module is arranged in the void region of the void region of bottom hollow out substrate, the void region of middle level hollow out substrate and top layer hollow out substrate; Nonreciprocal circuit module is at least arranged in the void region of bottom hollow out substrate.

In the present embodiment, mutual circuit module can comprise key-press module and display module etc.Nonreciprocal circuit module can comprise power module and control module etc.

Particularly, when the height of key-press module and the height of display module are all greater than the height of the height of power module and control module, key-press module is arranged in the void region of the void region of bottom hollow out substrate, the void region of middle level hollow out substrate and top layer hollow out substrate; Display module is arranged in the void region of the void region of bottom hollow out substrate, the void region of middle level hollow out substrate and top layer hollow out substrate; Power module is at least arranged in the void region of bottom hollow out substrate; Control module is at least arranged in the void region of bottom hollow out substrate.

When the height of key-press module and the height of display module are all greater than the height of power module and the height of control module and the height of power module is greater than the height of control module, key-press module and display module lay respectively in the void region of the void region of bottom hollow out substrate, the void region of middle level hollow out substrate and top layer hollow out substrate; Power module is at least arranged in the void region of bottom hollow out substrate and middle level hollow out substrate; Control module is at least arranged in the void region of bottom hollow out substrate.

When the height of key-press module and the height of display module are all greater than the height of power module and the height of control module and the height of power module is less than the height of control module, key-press module and display module lay respectively in the void region of the void region of bottom hollow out substrate, the void region of middle level hollow out substrate and top layer hollow out substrate; Control module is at least arranged in the void region of bottom hollow out substrate and the void region of middle level hollow out substrate; Power module is at least arranged in the void region of bottom hollow out substrate.

When the height of key-press module and the height of display module be all greater than the height of power module with the height of control module and power module is identical with the height of control module time, key-press module and display module lay respectively in the void region of the void region of bottom hollow out substrate, the void region of middle level hollow out substrate and top layer hollow out substrate; Power module and control module are at least arranged in the void region of bottom hollow out substrate.

In the present embodiment, key-press module specifically can comprise the electronic packages such as button, display module specifically can comprise the electronic packages such as display screen, power module specifically can comprise the electronic packages such as battery, control module can specifically comprise the electronic package such as circuit board and microcontroller, wherein, the electronic package such as display screen, battery, microcontroller and button is on circuit boards integrated.

In the present embodiment, provide a kind of overlayer of smart card, overlayer can comprise: the first printing pattern layer, the first printing bed of material and the first printing protective seam; The first printing bed of material is between synthesis hollow out substrate and the first printing pattern layer, and the first printing pattern layer is between the first printing bed of material and the first printing protective seam.Overlayer can also comprise: overlay film; Wherein, overlay film is between synthesis hollow out substrate and the first printing bed of material.

In the present embodiment, the first printing pattern layer is the layer with printed patterns, and the first printing bed of material is the bed of material for printed patterns of undertaking the printing of, and the first printing protective seam is the bed of material for the protection of the first printing pattern layer.Wherein, the first printing bed of material can be transparent also can be opaque, and the first printing protective seam can be all transparent or the part that contacts with the printed patterns of the first printing pattern layer is transparent.

In the present embodiment, additionally provide a kind of overlayer, overlayer comprises: the second printing pattern layer and the second printing bed of material; The second printing bed of material is transparent.Second printing pattern layer is between the second printing bed of material and synthesis hollow out substrate.Overlayer can also comprise: overlay film; Wherein, overlay film is between synthesis hollow out substrate and the second printing pattern layer.

In the present embodiment, the second printing pattern layer is the layer with printed patterns, and the second printing bed of material is the bed of material for printed patterns of undertaking the printing of.Wherein, the second printing bed of material can be all transparent also can be the part contacted with the printed patterns of the second printing pattern layer be transparent.

In the present embodiment, tectal starting material are PVC (Polyvinylchloride, Polyvinylchloride), PC (Polycarbonate, polycarbonate), PETG (Poly (ethyleneterephthalateco-1,4-cylclohexylenedimethyleneterephthalate), non-crystalline type copolyesters), at least one in PET (poly (ethyleneterephthalate), pet resin) or ABSPVC resin.

In the present embodiment; when seeing the second printing pattern layer through the transparent second printing bed of material; it is seen that the printed patterns on the second printing pattern layer, when seeing the first printing pattern layer through the first printing protective seam, it is seen that the printed patterns on the first printing pattern layer.Meanwhile, the second printing bed of material, on the second printing pattern layer, also can play the effect of protection second printing pattern layer.Like this, the overlayer comprising the second printing pattern layer and the second printing bed of material with comprise the first printing pattern layer, first and print the bed of material and compare while realizing identical function with the first overlayer printing protective seam, reduce the thickness of smart card better.

In the present embodiment, overlay film is suitable for the plate-shaped material adopting synthetic resin to make, and its starting material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.

The smart card with human-computer interaction function provided in the present embodiment, the overlayer that smart card comprises synthesis hollow out substrate and is covered on substrate, synthesis hollow out substrate comprises the substrate of three layers of hollow out, the substrate of three layers of hollow out is respectively bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, and synthesize in hollow out substrate and accommodate interior mold insert, such structure had both enhanced interior mold insert stability within a smart card, also improve bending resistance and the folding resistance of smart card simultaneously.Interior mold insert in the present embodiment, comprises mutual circuit module, can also comprise nonreciprocal circuit module.The smart card provided in the present embodiment; based on the different height of mutual circuit module and nonreciprocal circuit module; mutual circuit module is at least arranged in the void region of top layer hollow out substrate; and nonreciprocal circuit module is at least arranged in the void region of any one deck of three layers of hollow out substrate; such structure; while protecting nonreciprocal circuit module better; enhance nonreciprocal circuit module and mutual circuit module stability within a smart card; and further increasing bending resistance and the folding resistance of smart card, extend the serviceable life of smart card.

The present embodiment additionally provides a kind of manufacture method of smart card, as shown in Figure 1, specifically comprises:

Step 101: hollow out first substrate, second substrate and the 3rd substrate respectively, obtains bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate;

In the present invention, first substrate, second substrate and the 3rd substrate can be same substrate.In the present embodiment, preferably, first substrate, second substrate and the 3rd substrate are three substrates, and wherein, the shape of first substrate, second substrate and the 3rd substrate can be the same or different.First substrate, second substrate and the 3rd substrate are suitable for adopting the plate-shaped material that synthetic resin is made, and its starting material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.

In the present embodiment, can adopt die-cut, vexed cutting or the technique such as at the bottom of milling, hollow out first substrate, second substrate and the 3rd substrate, obtain bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate respectively.

In the present embodiment, hollow out first substrate, second substrate and the 3rd substrate respectively, obtains bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, can specifically comprise:

Preset void region according to first, hollow out first substrate obtains bottom hollow out substrate, and bottom hollow out substrate comprises bottom void region;

Preset void region according to second, hollow out second substrate obtains middle level hollow out substrate, and middle level hollow out substrate comprises void region, middle level;

Preset void region according to the 3rd, hollow out the 3rd substrate obtains top layer hollow out substrate, and top layer hollow out substrate comprises top layer void region.

In the present embodiment, hollow out first substrate, second substrate and the 3rd substrate respectively, obtaining bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate can also specifically comprise:

Preset void region and the first preset thickness according to first, hollow out first substrate obtains bottom hollow out substrate, and bottom hollow out substrate comprises bottom void region;

Preset void region and the second preset thickness according to second, hollow out second substrate obtains middle level hollow out substrate, and middle level hollow out substrate comprises void region, middle level;

Preset void region and the 3rd preset thickness according to the 3rd, hollow out the 3rd substrate obtains top layer hollow out substrate, and top layer hollow out substrate comprises top layer void region.

It should be noted that, can determine that first presets void region, void region is preset in the second default void region and the 3rd according to interior mold insert, particularly, can according to the position of the mutual circuit module of interior mold insert and nonreciprocal circuit module and height, determine that first presets void region, second and preset void region and the 3rd and preset void region; Can also determine that presetting void region, second to first presets void region first preset thickness, second preset thickness and three preset thickness corresponding respectively with the 3rd default void region according to interior mold insert.Particularly, and highly can determine and preset void region, second and preset void region and the 3rd to first and preset void region corresponding respectively the first preset thickness, the second preset thickness and the 3rd preset thickness according to the position of the mutual circuit module of interior mold insert and nonreciprocal circuit module.The thickness sum of bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate at least equals the height of interior mold insert.The thickness sum of bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate is for presetting gross thickness.

Step 102: synthesize bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, obtains synthesis hollow out substrate;

Particularly, synthesis process is carried out to bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, obtains the synthesis hollow out substrate that can hold interior mold insert.

In the present embodiment, can be, but not limited to the concrete technique adopting stickup and/or lamination, synthesis process is carried out to bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, obtains the synthesis hollow out substrate that can hold interior mold insert.

Also it should be noted that, in the present embodiment, according to the void region of bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, preferably, according to the size of the void region of bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, to bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate carry out single sintering process or repeatedly (at least twice) synthesis process obtain holding the synthesis hollow out substrate of interior mold insert.

Step 103: interior mold insert is filled in synthesis hollow out substrate;

In the present embodiment, particularly, can be, but not limited to the concrete technique adopting stickup and/or lamination, interior mold insert is filled into the synthesis hollow out substrate obtaining accommodating interior mold insert in synthesis hollow out substrate.

Step 104: adhesive-applying on synthesis hollow out substrate, obtains smart card;

Can by automatic coating equipment as bonding agent be evenly equidistantly coated on the surface of synthesis hollow out substrate by automatic dispensing machine strip; Cylinder is adopted to smooth process to covered bonding agent.

It should be noted that, the present embodiment, in order to ensure the laminating of interior mold insert and synthesis hollow out substrate, fills bonding agent in the space after step 103 between interior mold insert and synthesis hollow out substrate.

In the present embodiment, synthesis hollow out substrate also comprises after adhesive-applying: on synthesis hollow out substrate, paste overlayer.

In the present embodiment, the plate-shaped material accommodating the overlayer that the surface of the synthesis hollow out substrate of interior mold insert pastes and be suitable for adopting synthetic resin to make, its starting material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.

It should be noted that, in the present embodiment, the upper and lower surface of upper surface of synthesis hollow out substrate can be covered with respectively the overlayer comprising the first printing pattern layer, the first printing bed of material and the first printing protective seam or the overlayer comprising the second printing pattern layer and the second printing bed of material, or the upper and lower surface of upper surface of synthesis hollow out substrate all be covered with the overlayer comprising the first printing pattern layer, the first printing bed of material and the first printing protective seam; Or the upper and lower surface of upper surface of synthesis hollow out substrate is all covered with the overlayer comprising the second printing pattern layer and the second printing bed of material.Correspondingly, when overlayer also comprises overlay film, can also be covered with overlay film on the surface above and/or under the upper surface of synthesis hollow out substrate, wherein, overlay film is between the first printing bed of material and synthesis hollow out substrate or between the second printing pattern layer and synthesis hollow out substrate.

Also it should be noted that, when overlayer also comprises overlay film, paste in coating process and need to adopt drum, ensure that overlay film used progressively can contact with the synthesis hollow out substrate accommodating interior mold insert, when avoiding pasting overlay film, a large amount of bubble can be produced.The overlay film pasted can be all transparent also can be the region corresponding with the mutual circuit module of interior mold insert be transparent so that holder can carry out such as input through keyboard and/or check the information of display.

In the present embodiment, reprint typography can be adopted printed patterns to be printed on the overlayer second printing bed of material obtaining comprising the second printing pattern layer and the second printing bed of material.

In the present embodiment, can also comprise before step 104: on top layer hollow out substrate, paste overlay film.

In conjunction with multiple active and/or passive electronic package, can comprise: intelligent card chip, RFID chip and antenna, fingerprint Identification sensor, capacitance-resistance, crystal oscillator and chip etc. in production technology of the present invention.

The manufacture method provided in the present embodiment obtains the substrate of three hollow outs by adopting hollow out three substrates respectively, the substrate of three hollow outs is respectively bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, the substrate of synthesis three hollow outs obtains the synthesis hollow out substrate of three layers, interior mold insert is filled into the technical scheme in synthesis hollow out substrate, reduce the production difficulty of smart card, improve the production efficiency of smart card.When mold insert comprises mutual circuit module and comprises nonreciprocal circuit module in the present embodiment, the manufacture method of the smart card provided in the present embodiment, can also according to the different height of mutual circuit module and nonreciprocal circuit module, hollow out three substrates obtain the substrate of three hollow outs respectively, the substrate of synthesis three hollow outs obtains the synthesis hollow out substrate of three layers, mutual circuit module is made at least to be arranged in the void region of the top layer hollow out substrate of synthesis hollow out substrate, nonreciprocal circuit module is made at least to be arranged in the void region of one deck hollow out substrate of synthesis hollow out substrate, this enhance operability, reduce the production difficulty of smart card, improve the production efficiency of smart card.

Embodiment 2

Present embodiments provide a kind of manufacture method of smart card, as shown in Figure 2, specifically comprise:

Step 201: hollow out first substrate, second substrate and the 3rd substrate respectively, obtains bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate;

In the present embodiment, preferably, first substrate J01, as shown in Figure 3; Wherein second substrate J02, as shown in Figure 4; Wherein the 3rd substrate J03, as shown in Figure 5.

This step specifically comprises:

Preset void region and the first preset thickness according to first, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, hollow out first substrate J01 obtains bottom hollow out substrate L01;

In the present embodiment, bottom hollow out substrate L01 can be as shown in Figure 6.

Preset void region and the second preset thickness according to second, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, hollow out second substrate J02 obtains middle level hollow out substrate L02;

In the present embodiment, middle level hollow out substrate L02 can be as shown in Figure 7.

Preset void region and the 3rd preset thickness according to the 3rd, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, hollow out the 3rd substrate J03 obtains top layer hollow out substrate L03;

In the present embodiment, top layer hollow out substrate L03 can be as shown in Figure 8.

It should be noted that, in the present embodiment, according to position and the height of each circuit module of interior mold insert, determine default void region and preset thickness.

In the present embodiment, provide a kind of interior mold insert planar structure schematic diagram, as shown in Figure 9, interior mold insert comprises control module R01, power module R02, display module R03 and key-press module R04.

In the present embodiment, control module R01 can specifically comprise the electronic package such as circuit board and microcontroller, wherein, microcontroller and key-press module R04 on circuit boards integrated.

In the present embodiment, the perspective view of interior mold insert, as shown in Figure 10, comprises the circuit modules such as control module R01, power module R02, display module R03 and key-press module R04.Wherein, control module R01 can specifically comprise the electronic package such as circuit board and microcontroller, wherein, microcontroller and key-press module R04 on circuit boards integrated.Wherein, the height of control module R01 is h01, and the height of power module R02 is h02, and the height of display module R03 is h03, and the height of key-press module R04 is h04.

In the present embodiment, preferably, h04>h03>h02>h0 1.

Wherein display module R03 and key-press module R04 is the mutual circuit module with human-computer interaction function; Control module R01 and power module R02 is the nonreciprocal circuit module without human-computer interaction function.

In the present embodiment, void region and the first preset thickness is preset according to first, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, the whole circuit modules in interior mold insert at least can be filled in the void region of the bottom hollow out substrate L01 that hollow out first substrate J01 obtains, and namely control module R01, power module R02, display module R03 and key-press module R04 at least can be filled in the void region of bottom hollow out substrate L01; The thickness of the bottom hollow out substrate L01 obtained at least equals the height of the highest circuit module cannot filled in the hollow out substrate L02 of middle level, and namely the thickness of bottom hollow out substrate L01 at least equals the height h01 of control module R01;

Void region and the second preset thickness is preset according to second, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, the void region of the middle level hollow out substrate L02 that hollow out second substrate J02 obtains at least can be filled the circuit module with human-computer interaction function and is highly greater than the first preset thickness and cannot be filled in the circuit module in top layer hollow out substrate L03, and namely display module R03, key-press module R04 and power module R02 at least can be filled in the void region of middle level hollow out substrate L02;

The height that the thickness of middle level hollow out substrate L02 at least equals the highest circuit module cannot filled in top layer hollow out substrate L03 and the difference of the height of the highest circuit module cannot filled in the hollow out substrate L02 of middle level, namely the thickness of middle level hollow out substrate L02 at least equals the difference (h02-h01) of the height h02 of power module R02 and the height h01 of control module R01.

Void region and the 3rd preset thickness is preset according to the 3rd, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, the circuit module with human-computer interaction function at least can be filled in the void region that hollow out the 3rd substrate J03 obtains top layer hollow out substrate L03, namely display module R03 and key-press module R04 at least can be filled in the void region of top layer hollow out substrate L03

The thickness of top layer hollow out substrate L03 at least equal the highest circuit module be filled in top layer hollow out substrate height and in top layer hollow out substrate L03 on the difference of the height of the highest circuit module that cannot fill, namely the thickness of top layer hollow out substrate L03 at least equals: the difference (h04-h02) of the height h04 of key-press module R04 and the height h02 of power module R02.

Also it should be noted that, the thickness sum of the thickness of bottom hollow out substrate L01, the thickness of middle level hollow out substrate L02 and top layer hollow out substrate L03 equals default gross thickness at the most.

Step 202: synthesize bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, obtains synthesis hollow out substrate;

In the present embodiment, can be, but not limited to the concrete technique adopting stickup and/or lamination, synthesis bottom hollow out substrate L01, middle level hollow out substrate L02 and top layer hollow out substrate L03 obtain synthesis hollow out substrate C01, preferably, according to the size of the void region of bottom hollow out substrate L01, middle level hollow out substrate L02 and top layer hollow out substrate L03, synthesis process is carried out to bottom hollow out substrate L01, middle level hollow out substrate L02 and top layer hollow out substrate L03, obtains the synthesis hollow out substrate C01 that can hold interior mold insert.In the present embodiment, provide the sectional view of synthesis hollow out substrate C01, can be, but not limited to as shown in figure 11.

Also it should be noted that, in the present embodiment, to bottom hollow out substrate L01, middle level hollow out substrate L02 and top layer hollow out substrate L03 carry out single sintering process or repeatedly (at least twice) synthesis process obtain holding the synthesis hollow out substrate C01 of interior mold insert.

Such as: according to the size of the void region of bottom hollow out substrate L01, middle level hollow out substrate L02 and top layer hollow out substrate L03, bottom hollow out substrate L01 is placed on bottom, middle level hollow out substrate L02 is placed on centre, top layer hollow out substrate L03 is placed on top layer, adopt the technique of the stickup of silk screen brush coating and/or lamination, synthesize three layers of hollow out substrate and obtain interior mold insert to be held the synthesis hollow out substrate C01 entered;

Or the size of the void region according to bottom hollow out substrate L01, middle level hollow out substrate L02 and top layer hollow out substrate L03, bottom hollow out substrate L01 is placed on bottom, middle level hollow out substrate L02 is placed on top layer, adopt the technique of the stickup of silk screen brush coating and/or lamination, synthesis bottom hollow out substrate L01 and middle level hollow out substrate L02 obtains the first synthesis hollow out substrate; First synthesis hollow out substrate is placed on bottom, top layer hollow out substrate L03 is placed on top layer, adopt the technique of the stickup of silk screen brush coating and/or lamination, synthesis top layer hollow out substrate L03 and first synthesis hollow out substrate obtains interior mold insert to be held the synthesis hollow out substrate C01 entered;

Middle level hollow out substrate L02 and top layer hollow out substrate L03 first can also be synthesized, and then synthesize with bottom hollow out substrate L01.

In the present embodiment, can have in addition and multiple synthesis process be carried out to bottom hollow out substrate L01, middle level hollow out substrate L02 and top layer hollow out substrate L03, obtain the synthetic method of synthesizing hollow out substrate, illustrate no longer one by one in the present embodiment.

Step 203: interior mold insert is filled in synthesis hollow out substrate;

In the present embodiment, can be, but not limited to the concrete technique adopting stickup and/or lamination, interior mold insert is filled into synthesis hollow out substrate C01, obtains the synthesis hollow out substrate accommodating interior mold insert.

Step 204: adhesive-applying on synthesis hollow out substrate, obtains smart card;

Can by automatic coating equipment as bonding agent be evenly equidistantly coated on the surface of the synthesis hollow out substrate accommodating interior mold insert by automatic dispensing machine strip; Cylinder is adopted to smooth process to covered bonding agent.

In the present embodiment, provide a kind of sectional view accommodating the synthesis hollow out substrate C01 of interior mold insert, can be, but not limited to as shown in figure 12.It should be noted that, in order to ensure the laminating of interior mold insert and synthesis hollow out substrate C01 in the present embodiment, the space in can filling with bonding agent after step 203 between mold insert and synthesis hollow out substrate C01.

In the present embodiment, on synthesis hollow out substrate after adhesive-applying, also comprise: on synthesis hollow out substrate, paste overlayer;

When overlayer specifically comprises: when the first printing pattern layer, the first printing bed of material and the first printing protective seam; through above technique; the sectional view of the smart card obtained can be as shown in figure 13; wherein; first printing bed of material Y01 is between synthesis hollow out substrate C01 and the first printing pattern layer T01, and the first printing pattern layer T01 is between the first printing bed of material Y01 and first printing protective seam P01.

When overlayer specifically comprises: when overlay film, the first printing pattern layer, the first printing bed of material and first print protective seam; through above technique; the sectional view of the smart card obtained can be as shown in figure 14; overlay film M01 is between synthesis hollow out substrate C01 and first printing bed of material Y01; first printing bed of material Y01 is between overlay film M01 and the first printing pattern layer T01, and the first printing pattern layer T01 is between the first printing bed of material Y01 and first printing protective seam P01.

In the present embodiment, additionally provide a kind of overlayer, overlayer can as shown in figure 15, comprise: the second printing pattern layer T02 and second printing bed of material Y02, and the second printing bed of material Y02 is transparent.Second printing bed of material Y02 is suitable for the plate-shaped material adopting synthetic resin to make, and its starting material can be at least one of PVC, PC, PETG, PET or ABSPVC resin.

When overlayer specifically comprises: when the second printing pattern layer and the second printing bed of material, the sectional view of the smart card obtained can be as shown in figure 16.Wherein, the second printing pattern layer T02 is between the second printing bed of material Y02 and synthesis hollow out substrate C01.

When overlayer specifically comprises: when overlay film, the second printing pattern layer and the second printing bed of material, the smart card sectional view obtained can be as shown in figure 17.Wherein, overlay film M01 is between synthesis hollow out substrate C01 and the second printing pattern layer T02, and the second printing pattern layer T02 is between the second printing bed of material Y02 and overlay film M01.

When overlayer also comprises overlay film, paste in coating process and need to adopt drum, ensure that overlay film used progressively can contact with the synthesis hollow out substrate accommodating interior mold insert, avoid producing a large amount of bubble during overlay film.

In the present embodiment, the overlay film pasted on the surface at the synthesis hollow out substrate C01 accommodating interior mold insert is plastic foil.In the present embodiment, overlay film is suitable for the plate-shaped material adopting synthetic resin to make, and its starting material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.The transparent state in region corresponding with display module R03 and key-press module R04 in the overlay film pasted, so that holder can carry out input through keyboard and check display information.

In the present embodiment, the first printing pattern layer is the layer with printed patterns, and the first printing bed of material is the bed of material for printed patterns of undertaking the printing of, and the first printing protective seam is the bed of material for the protection of the first printing pattern layer.Wherein, the first printing bed of material can be transparent also can be opaque, the first printing protective seam can be all transparent or the part that contacts with the printed patterns of the first printing pattern layer is transparent.

In the present embodiment, can also comprise before step 204: overlay film on top layer hollow out substrate.

Embodiment 3

Present embodiments provide a kind of manufacture method of smart card, as shown in figure 18, specifically comprise:

Step 301: hollow out first substrate, second substrate and the 3rd substrate respectively, obtains bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate;

In the present embodiment, preferably, first substrate J11, as shown in figure 19; Second substrate J12, as shown in figure 20; 3rd substrate J13, as shown in figure 21.

This step specifically comprises:

Preset void region and the first preset thickness according to first, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, hollow out first substrate J11 obtains bottom hollow out substrate L11;

In the present embodiment, bottom hollow out substrate L11 can be as shown in figure 22.

Preset void region and the second preset thickness according to second, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, hollow out second substrate J12 obtains middle level hollow out substrate L12;

In the present embodiment, middle level hollow out substrate L12 can be as shown in figure 23.

Preset void region and the 3rd preset thickness according to the 3rd, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, hollow out the 3rd substrate J13 obtains top layer hollow out substrate L13;

In the present embodiment, top layer hollow out substrate L13 can be as shown in figure 24.

It should be noted that, in the present embodiment, according to each circuit module of interior mold insert position and height, determine default void region and preset thickness.

In the present embodiment, provide a kind of interior mold insert planar structure schematic diagram, as shown in figure 25, interior mold insert comprises the circuit modules such as control module R11, power module R12, display module R13 and key-press module R14.

In the present embodiment, control module R11 can specifically comprise the electronic package such as circuit board and microcontroller, wherein, microcontroller and key-press module R14 on circuit boards integrated.

In the present embodiment, the perspective view of interior mold insert, as shown in figure 26, comprises the circuit modules such as control module R11, power module R12, display module R13 and key-press module R14.Wherein, control module R11 can specifically comprise the electronic package such as circuit board and microcontroller, wherein, microcontroller and key-press module R14 on circuit boards integrated.Wherein, the height of control module R11 is h11, and the height of power module R12 is h12, and the height of display module R13 is h13, and the height of key-press module R14 is h14.

In the present embodiment, preferably, h14>h13>h12=h11.

Wherein display module R13 and key-press module R14 is the mutual circuit module with human-computer interaction function; Control module R11 and power module R12 is the nonreciprocal circuit module without human-computer interaction function.

In the present embodiment, void region and the first preset thickness is preset according to first, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, the whole circuit modules in interior mold insert at least can be filled in the void region that hollow out first substrate J11 obtains bottom hollow out substrate L11, and namely control module R11, power module R12, display module R13 and key-press module R14 at least can be filled in the void region of bottom hollow out substrate L11; The thickness of bottom hollow out substrate L11 at least equals the height of the highest circuit module cannot filled in the hollow out substrate L12 of middle level, and namely the thickness of bottom hollow out substrate L11 at least equals the height h11 of control module R11 or the height h12 of power module R12;

Void region and the second preset thickness is preset according to second, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, the void region that hollow out second substrate J12 obtains middle level hollow out substrate L12 at least can be filled the circuit module with human-computer interaction function and is highly greater than the first preset thickness and cannot be filled in the circuit module in top layer hollow out substrate L13, and namely display module R13 and key-press module R14 can be filled in the void region of middle level hollow out substrate L12;

The height that the thickness of middle level hollow out substrate L12 is greater than the highest circuit module cannot filled in top layer hollow out substrate L13 and the difference of the height of the highest circuit module cannot filled in the hollow out substrate L12 of middle level, namely the thickness of middle level hollow out substrate L12 is greater than the difference of the height h12 of power module R12 and the height h11 of control module R11, and namely the thickness of middle level hollow out substrate L12 is greater than 0.

Void region and the 3rd preset thickness is preset according to the 3rd, adopt die-cut, vexed cutting or the technique such as at the bottom of milling, the circuit module with human-computer interaction function at least can be filled in the void region that hollow out the 3rd substrate J13 obtains top layer hollow out substrate L13, namely display module R13 and key-press module R14 at least can be filled in the void region of top layer hollow out substrate L13

The thickness of middle level hollow out substrate L12 and the thickness sum of top layer hollow out substrate L13 at least equal, the height that can be filled in the highest circuit module in top layer hollow out substrate L13 with in top layer hollow out substrate L13 on the difference of the height of the highest circuit module that cannot fill, namely the thickness of middle level hollow out substrate L12 and the thickness sum of top layer hollow out substrate L13 at least equal the difference (h14-h12) of the height h14 of key-press module R14 and the height h12 of power module R12 or the difference (h14-h11) of the height h14 of key-press module R14 and the height h11 of control module R11.

It should be noted that, in the present embodiment, display module R03 and key-press module R04 can both be filled in the void region of middle level hollow out substrate L12 and the void region of top layer hollow out substrate L13; The void region of middle level hollow out substrate L12 and the void region of top layer hollow out substrate L13 can be identical or different.

Also it should be noted that, the thickness sum of the thickness of bottom hollow out substrate L11, the thickness of middle level hollow out substrate L12 and top layer hollow out substrate L13 is for presetting gross thickness.

Step 302: synthesize bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate, obtains synthesis hollow out substrate;

In the present embodiment, can be, but not limited to the concrete technique adopting stickup and/or lamination, hollow out substrate is synthesized according to bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out substrate L12, preferably, according to the size of the void region of bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out substrate L13, synthesis process is carried out to bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out substrate L13, obtains the synthesis hollow out substrate C11 that can hold interior mold insert.In the present embodiment, provide the sectional view of synthesis hollow out substrate C11, can be, but not limited to as shown in figure 27.

Also it should be noted that, in the present embodiment, to bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out substrate L13 carry out single sintering process or repeatedly (at least twice) synthesis process obtain holding the synthesis hollow out substrate C11 of interior mold insert.

Such as: according to the size of the void region of bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out substrate L13, bottom hollow out substrate L11 is placed on bottom, middle level hollow out substrate L12 is placed on centre, top layer hollow out substrate L13 is placed on top layer, adopt the technique of the stickup of silk screen brush coating and/or lamination, synthesize three layers of hollow out substrate and obtain interior mold insert to be held the synthesis hollow out substrate C11 entered;

Or the size of the void region according to bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out substrate L13, bottom hollow out substrate L11 is placed on bottom, middle level hollow out substrate L12 is placed on top layer, adopt the technique of the stickup of silk screen brush coating and/or lamination, synthesis bottom hollow out substrate L11 and middle level hollow out substrate L12 obtains the first synthesis hollow out substrate; First synthesis hollow out substrate C11-1 is placed on bottom, top layer hollow out substrate L13 is placed on top layer, adopt the technique of the stickup of silk screen brush coating and/or lamination, synthesis top layer hollow out substrate L13 and first synthesis hollow out substrate obtains interior mold insert to be held the synthesis hollow out substrate C11 entered;

Middle level hollow out substrate L12 and top layer hollow out substrate L13 first can also be synthesized, and then synthesize with bottom hollow out substrate L11.

In the present embodiment, can have in addition and multiple synthesis process be carried out to bottom hollow out substrate L11, middle level hollow out substrate L12 and top layer hollow out substrate L13, obtain the synthetic method of synthesizing hollow out substrate, illustrate no longer one by one in the present embodiment.

Step 303: interior mold insert is filled in synthesis hollow out substrate;

In the present embodiment, can be, but not limited to the concrete technique adopting stickup and/lamination, internal mold insert is filled into synthesis hollow out substrate C11, obtains the synthesis hollow out substrate C11 accommodating interior mold insert.In the present embodiment, provide the sectional view of the synthesis hollow out substrate C11 accommodating interior mold insert, can be, but not limited to as shown in figure 28.

Step 304: adhesive-applying on synthesis hollow out substrate, obtains smart card;

Can by automatic coating equipment as bonding agent be evenly equidistantly coated on the surface of the substrate accommodating interior mold insert by automatic dispensing machine strip; Cylinder is adopted to smooth process to covered bonding agent.

It should be noted that, in order to ensure the laminating of interior mold insert and synthesis hollow out substrate C11, the space in can being held by the method for adhesive-applying after step 303 between mold insert and synthesis hollow out substrate C11.

In the present embodiment, the plate-shaped material accommodating the overlayer that the surface of the synthesis hollow out substrate C11 of interior mold insert pastes and be suitable for adopting synthetic resin to make, its starting material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.

When overlayer specifically comprises: when the first printing pattern layer, the first printing bed of material and the first printing protective seam; the first printing bed of material is between synthesis hollow out substrate and the first printing pattern layer, and the first printing pattern layer is between the first printing bed of material and the first printing protective seam.

When overlayer specifically comprises: when overlay film, the first printing pattern layer, the first printing bed of material and first print protective seam; overlay film is between synthesis hollow out substrate and the first printing bed of material; the first printing bed of material is between overlay film and the first printing pattern layer, and the first printing pattern layer is between the first printing bed of material and the first printing protective seam.

In the present embodiment, additionally provide a kind of overlayer, comprising: the second printing pattern layer and the second printing bed of material, the second printing bed of material is transparent.The second printing bed of material is suitable for the plate-shaped material adopting synthetic resin to make, and its starting material can be at least one of PVC, PC, PETG, PET or ABSPVC resin.

When overlayer specifically comprises: when the second printing pattern layer and the second printing bed of material, the second printing pattern layer is between the second printing bed of material and synthesis hollow out substrate.

When overlayer specifically comprises: when overlay film, the second printing pattern layer and the second printing bed of material, overlay film is between synthesis hollow out substrate and the second printing pattern layer, and the second printing pattern layer is between the second printing bed of material and overlay film.

When overlayer also comprises overlay film, the overlay film pasted on the surface at the synthesis hollow out substrate C11 accommodating interior mold insert is plastic foil, be suitable for the plate-shaped material adopting synthetic resin to make, its starting material can be at least one in PVC, PC, PETG, PET or ABSPVC resin.Paste in coating process and need to adopt drum, ensure that overlay film used progressively can contact with the synthesis hollow out substrate accommodating interior mold insert, when avoiding pasting overlay film, a large amount of bubble can be produced.The transparent state in region corresponding with display module R13 and key-press module R14 in the overlay film pasted, so that holder can carry out input through keyboard and check display information.

In the present embodiment, can also comprise before step 304: overlay film on top layer hollow out substrate.

The above; be only the present invention's preferably embodiment, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in technical scope disclosed by the invention; the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of claim.

Claims

1. a smart card, is characterized in that, comprising: synthesis hollow out substrate and the overlayer be covered on described synthesis hollow out substrate; Interior mold insert is accommodated in described synthesis hollow out substrate; Described synthesis hollow out substrate comprises: bottom hollow out substrate, middle level hollow out substrate and top layer hollow out substrate.

2. smart card according to claim 1, is characterized in that, described interior mold insert comprises mutual circuit module.

3. smart card according to claim 2, described interior mold insert also comprises nonreciprocal circuit module.

4. smart card according to claim 3, is characterized in that, described mutual circuit module comprises: key-press module and display module; Described nonreciprocal circuit module comprises: power module and control module.

5. smart card according to claim 3, is characterized in that, the height of described mutual circuit module is greater than the height of described nonreciprocal circuit module;

6. smart card according to claim 5, is characterized in that, described mutual circuit module comprises: key-press module and display module; Described nonreciprocal circuit module comprises: power module and control module;

7. smart card according to claim 6, is characterized in that, described power module is different with the height of described control module;

8. the smart card according to claim 4 or 6 or 7, it is characterized in that, described control module comprises: circuit board and microcontroller.

9. smart card according to claim 1, is characterized in that, described overlayer comprises: the first printing pattern layer, the first printing bed of material and the first printing protective seam; The described first printing bed of material is between described synthesis hollow out substrate and described first printing pattern layer, and described first printing pattern layer is between the described first printing bed of material and described first printing protective seam.

10. smart card according to claim 9, is characterized in that, described overlayer also comprises overlay film; Described overlay film is between described synthesis hollow out substrate and the described first printing bed of material.

11. smart cards according to claim 1, is characterized in that, described overlayer comprises: the second printing pattern layer and the second printing bed of material; Described second printing pattern layer is between the described second printing bed of material and described synthesis hollow out substrate; The described second printing bed of material is transparent.

12. smart cards according to claim 11, is characterized in that, described overlayer also comprises overlay film; Described overlay film is between described synthesis hollow out substrate and described second printing pattern layer.

13. smart cards according to claim 1, is characterized in that, described tectal starting material are at least one in PVC, PC, PETG, PET or ABSPVC resin.

The manufacture method of 14. 1 kinds of smart cards, is characterized in that, comprising:

15. methods according to claim 14, it is characterized in that, described step s1 specifically comprises: adopt die-cut, vexed cutting or milling bottom technique, first substrate, described second substrate and described 3rd substrate described in hollow out, obtain described bottom hollow out substrate, described middle level hollow out substrate and described top layer hollow out substrate respectively.

16. methods according to claim 14, is characterized in that, described step s1 specifically comprises:

17. methods according to claim 14, is characterized in that, described step s1 specifically comprises:

18. methods according to claim 16 or 17, it is characterized in that, described step s2 specifically comprises:

19. methods according to claim 14, it is characterized in that, described step s2 specifically comprises: the technique adopting stickup and/or lamination, described bottom hollow out substrate, described middle level hollow out substrate and described top layer hollow out substrate are synthesized, obtains the described synthesis hollow out substrate that can hold described interior mold insert.

20. methods according to claim 14, it is characterized in that, describedly synthesis is carried out to middle level hollow out substrate described in described bottom hollow out substrate and described top layer hollow out substrate be specially: single sintering or multi-stage synthesis are carried out to described bottom hollow out substrate, described middle level hollow out substrate and described top layer hollow out substrate.

21. methods according to claim 14, is characterized in that, described step s3 specifically comprises: the technique adopting stickup and/or lamination, is filled into described interior mold insert in described synthesis hollow out substrate.

22. methods according to claim 14, is characterized in that, also comprise after described step s3: fill bonding agent in the space between described interior mold insert and described synthesis hollow out substrate.

23. methods according to claim 14, is characterized in that, describedly after adhesive-applying, also comprise on described synthesis hollow out substrate: on described synthesis hollow out substrate, paste overlayer.

24. methods according to claim 23, is characterized in that, described overlayer comprises: the first printing pattern layer, the first printing bed of material and the first printing protective seam; The described first printing bed of material is between described synthesis hollow out substrate and described first printing pattern layer, and described first printing pattern layer is between the described first printing bed of material and described first printing protective seam.

25. methods according to claim 24, is characterized in that, described overlayer also comprises overlay film; Described overlay film is between described synthesis hollow out substrate and the described first printing bed of material.

26. methods according to claim 23, is characterized in that, described overlayer comprises: the second printing pattern layer and the second printing bed of material, and the described second printing bed of material is transparent; Described second printing pattern layer is between the described second printing bed of material and described synthesis hollow out substrate.

27. methods according to claim 26, is characterized in that, described overlayer also comprises overlay film; Described overlay film is between described synthesis hollow out substrate and described second printing pattern layer.

28. methods according to claim 23, is characterized in that, described tectal starting material are at least one in PVC, PC, PETG, PET or ABSPVC resin.

29. methods according to claim 14, is characterized in that, before described step s4, also comprise: on described top layer hollow out substrate, paste overlay film.

30. methods according to claim 14, is characterized in that, described interior mold insert comprises mutual circuit module.