CN105161601A - LED (Light Emitting Diode) packaging structure - Google Patents

Abstract

The invention discloses an LED (Light Emitting Diode) packaging structure, comprising a substrate, first LED chips, second LED chips, supports and a first packaging layer, wherein the first LED chips and the supports are arranged on the upper surface of the substrate at intervals, the first LED chips are covered by the first packaging layer, the top surface of each support extends out of the first packaging layer, and the second LED chips are arranged on the top surfaces of the supports. The LED packaging structure is provided with the first LED chips and the second LED chips on the supports, the first LED chips and the second LED chips form an up-down structure relationship, the two layers of LED chips are arranged at intervals, the light emitted by the first LED chips passes through the first packaging layer and then is mixed with the light emitted by the second LED chips, and the first packaging layer can be completely arranged with respect to the first LED chips, so that the LED packaging structure has the advantage of uniform light mixing.

Description

LED package structure

technical field

The invention relates to the field of LED lighting, in particular to an LED packaging structure.

Background technique

LED light sources have the advantages of high luminous efficiency, low heat generation, power saving and long life, so their applications are becoming more and more extensive. LED lamps will gradually replace traditional lighting fixtures such as incandescent lamps and halogen lamps. For example, the authorized announcement date is June 10, 2015, and the Chinese patent application number 201420870064.2 is a utility model named "A LED dimming light source", which includes a substrate, which is set in different areas of the substrate and driven by a unique drive circuit. Multiple groups of LED chip groups that are independent of each other, and phosphor films that are divided into at least two different color regions and the different color regions are separately arranged on the LED chip groups respectively, are composed of the The driving circuit independently adjusts the driving current of each LED chip group to control the light emission of each LED chip group, and then adjusts the luminous intensity of different color regions on the phosphor film corresponding to each LED chip group to realize Adjustment of the color temperature and brightness of the LED dimming light source. This method of setting different color temperatures in different areas, and then arranging the areas of different color temperatures at intervals often has the problem of uneven light mixing, and the color temperatures of different areas correspond to their respective phosphor films, making the production more cumbersome.

Contents of the invention

In view of this, it is necessary to provide an LED packaging structure with uniform light mixing.

An LED packaging structure, including a substrate, a first LED chip, a second LED chip, and a support and a first packaging layer, the first LED chip and the support are arranged on the upper surface of the substrate at intervals, the first The LED chip is covered by the first encapsulation layer, the top surface of the support member protrudes from the first encapsulation layer, and the second LED chip is arranged on the top surface of the support member.

Compared with the prior art, the LED packaging structure arranges the first LED chip and the second LED chip on the support so that the first LED chip and the second LED chip are in a vertical relationship, and the two-layer LED The chips are arranged at intervals, and the light emitted by the first LED chip is mixed with the light emitted by the second LED chip after passing through the first encapsulation layer, so that the first encapsulation layer can be completely set for the first LED chip, so , so that the LED packaging structure has the advantage of uniform light mixing.

Description of drawings

Fig. 1 is a front view of an LED packaging structure according to a first embodiment of the present invention.

FIG. 2 is a top view of the LED package structure shown in FIG. 1 .

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

Please refer to FIG. 1 to FIG. 2 for the LED packaging structure 100 of the first embodiment of the present invention.

Please refer to FIG. 1 and FIG. 2 , an LED packaging structure 100 includes a substrate 60, a first LED chip 10, and a second LED chip 20. In this embodiment, the first LED chip 10 and the second LED chip 20 are respectively Includes multiple LED chips. It also includes a support 30 and a first encapsulation layer 40 , the first LED chip 10 and the support 30 are disposed on the upper surface of the substrate 60 at intervals. A plurality of LED chips in the first LED chip 10 are respectively arranged around these support members 30, so that the two are crossed and adjacent to each other, which helps to improve the mixing of the first LED chip 10 and the second LED chip 20 on the support member 30. uniformity of light. The first LED chip 10 is covered by the first encapsulation layer 40 , and the top surface of the support member 30 protrudes out of the first encapsulation layer 40 . On the premise that the first encapsulation layer 40 is a continuous encapsulation layer, the first encapsulation layer 40 will cover the bottom of the support member 30 . On the premise that the first encapsulation layer 40 is a discontinuous encapsulation layer, the first encapsulation layer 40 may not cover the bottom of the support member 30 . The second LED chip 20 is disposed on the top surface of the supporting member 30 . By arranging the first LED chip 10 and the second LED chip 20, it is possible to arrange the fluorescent powder on the first encapsulation layer 40, so that the light emitted by the first LED chip 10 and the second LED chip 20 are different, and then through the driving control Realize dimming and color adjustment. Alternatively, it is possible to realize dimming and color adjustment by arranging LED chips of different colors on the first LED chip 10 and the second LED chip 20 . At the same time, the first LED chip 10 and the second LED chip 20 are in a vertical structure relationship, and the LED chips of the two layers are intersected and arranged at intervals, so it has the advantage of uniform light mixing. Preferably, the light emitted by the first LED chip 10 is mixed with the light emitted by the second LED chip 20 to form white light.

The supporting member 30 is made of heat-conducting material, and the supporting member 30 is thermally connected with the substrate 60 and the second LED chip 20 respectively, so as to transfer the heat generated by the second LED chip 20 to the substrate 60 . The supporting member 30 is integrally formed with the base plate 60 . By using heat-conducting material to make the support 30 , on the one hand, the second LED chip 20 disposed on the support 30 can transfer heat to the substrate 60 through the support 30 , which has better heat dissipation effect. On the other hand, the second LED chip 20 is raised upwards, so the second LED chip 20 and the first LED chip 10 are in a vertically distributed structure, which can facilitate dimming and color adjustment by setting an encapsulation layer.

Please refer to FIG. 1 and FIG. 2 , further comprising a second encapsulation layer 50 covering the second LED chip 20 and located above the first encapsulation layer 40 . The first encapsulation layer 40 is a mixture of phosphor powder and encapsulation glue. The phosphor in the first encapsulation layer 40 is formed by mixing green phosphor and red phosphor in a ratio of 1.3:1 to 1.7:1, the second encapsulation layer 50 is a mixture of phosphor and glue, and the second encapsulation layer 50 The phosphor powder is formed by mixing green phosphor powder and red phosphor powder in a ratio of 20:1 to 30:1. By disposing the first encapsulation layer 40 and the second encapsulation layer 50 , phosphor powder is respectively disposed on the first encapsulation layer 40 and the second encapsulation layer 50 . The light emitted by the first LED chip 10 passes through the first encapsulation layer 40 and the second encapsulation layer 50 to form light of one color temperature, and the light emitted by the second LED chip 20 passes through the second encapsulation layer 50 to form light of another color temperature . Finally, white light with different color temperatures is realized. Adopting upper and lower packaging levels, the manufacturing process is more convenient, and the effect of dimming and color adjustment is good.

Please refer to FIG. 1 and FIG. 2, the first LED chip 10 includes a plurality of LED chips, the second LED chip 20 also includes a plurality of LED chips, the number of the support member 30 is multiple, the first LED chip 10 and all The support members 30 are alternately arranged at intervals, and the second LED chips 20 are respectively arranged on the top surfaces of the support members 30 . Since both the first LED chip 10 and the second LED chip 20 can be a plurality of LED chips, and the first LED chip 10 and the second LED chip 20 are spaced alternately, the areas of different color temperatures are refined to each chip alternately spaced. , so that light with different color temperatures can be mixed evenly. Through this structure, the effect of uniform light mixing is achieved, which meets the high-quality demand of the market.

Please refer to FIG. 1 and FIG. 2 , the first LED chip 10 includes a plurality of LED chips, and the light emitted by the first LED chip 10 is different from the light emitted by the second LED chip 20 . That is, in the source, the first LED chip 10 and the second LED chip 20 use different LED chips, such as different light emitting colors and different color temperatures. This technical solution can be combined with the above-mentioned solution, and it is also possible to realize dimming and color adjustment by using different LED chips and combining an encapsulation layer.

A driving circuit is also included, and the driving circuit provides different dimming signals to the first LED chip 10 and the second LED chip 20 respectively. The dimming signal is further controlled by the driving circuit, such as by controlling the power supply voltage or current of the first LED chip 10 and the second LED chip 20 to control the dimming.

To sum up, by arranging the first LED chip 10 and the second LED chip 20 distributed up and down, the light emitted by the first LED chip 10 passes through the first encapsulation layer 40 and the second encapsulation layer 50 to form light with a color temperature. The light emitted by the two LED chips 20 passes through the second encapsulation layer 50 to form light of another color temperature. Finally, white light with different color temperatures is realized. Adopting upper and lower packaging levels, the manufacturing process is more convenient, and the effect of dimming and color adjustment is good. Since both the first LED chip 10 and the second LED chip 20 can be a plurality of LED chips, and the first LED chip 10 and the second LED chip 20 are spaced alternately, the areas of different color temperatures are refined to each chip alternately spaced. , so that light with different color temperatures can be mixed evenly. The first LED chip 10 and the second LED chip 20 can also use different LED chips for dimming and toning, and combine with different encapsulation layers to realize dimming and toning.

It can be understood that the material of the second encapsulation layer and the first encapsulation layer can be made of the same material and be packaged in one piece, which can simplify the encapsulation operation. In this case, preferably, the first LED chip 10 and the second LED chip 20 may use LED chips of different colors. Since the working temperature of LED chips of different colors is different, if it exceeds the range that the LED chip can withstand, it will affect the light effect and life. However, the setting of the supporting member can cause a temperature difference between the operating temperatures of the first LED chip 10 and the second LED chip 20 , so as to provide the LED chips of different colors with their respective required operating temperatures.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the present invention. within the scope of protection.

Claims (10)

1. An LED packaging structure, comprising a substrate, a first LED chip, and a second LED chip, characterized in that it also includes a support and a first packaging layer, and the first LED chip and the support are arranged at intervals on the substrate On the upper surface, the first LED chip is covered by the first encapsulation layer, the top surface of the support member protrudes from the first encapsulation layer, and the second LED chip is arranged on the top surface of the support member. 2. The LED packaging structure according to claim 1, further comprising a second packaging layer, the second packaging layer covers the second LED chip, the material of the second packaging layer is the same as that of the first packaging layer The materials are different, or the material of the second encapsulation layer is the same as that of the first encapsulation layer and is integrally encapsulated. 3. The LED packaging structure according to claim 1, wherein the first LED chip comprises a plurality of LED chips, and the LED chips are arranged around the supporting member. 4 . The LED packaging structure according to claim 1 , wherein the supporting member is made of heat-conducting material, and the supporting member is thermally connected to the substrate and the second LED chip respectively. 5. The LED packaging structure according to claim 3, wherein the light emitted by the first LED chip is different from the light emitted by the second LED chip. 6. The LED packaging structure according to claim 1, wherein the first LED chip includes a plurality of LED chips, the second LED chip also includes a plurality of LED chips, the number of the support members is multiple, and the first LED chip includes a plurality of LED chips. One LED chip is arranged alternately and spaced apart from the support member, and the second LED chip is respectively arranged on the top surface of the support member. 7. The LED packaging structure according to claim 2, wherein the first packaging layer is a mixture of phosphor powder and packaging glue. 8. The LED packaging structure according to claim 8, wherein the phosphor in the first encapsulation layer is formed by mixing green phosphor and red phosphor in a ratio of 1.3:1 to 1.7:1, and the second encapsulation The first layer is a mixture of fluorescent powder and glue, and the fluorescent powder of the second encapsulation layer is formed by mixing green fluorescent powder and red fluorescent powder in a ratio of 20:1 to 30:1. 9. The LED package structure according to claim 1, wherein the light emitted by the first LED chip is mixed with the light emitted by the second LED chip to form white light. 10. The LED packaging structure according to claim 1, further comprising a driving circuit, the driving circuit provides different dimming signals to the first LED chip and the second LED chip respectively.