CN105159421B - Laptop, which is matched, applies mechanically water-cooling heat radiating device - Google Patents
Laptop, which is matched, applies mechanically water-cooling heat radiating device Download PDFInfo
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- CN105159421B CN105159421B CN201510446295.XA CN201510446295A CN105159421B CN 105159421 B CN105159421 B CN 105159421B CN 201510446295 A CN201510446295 A CN 201510446295A CN 105159421 B CN105159421 B CN 105159421B
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- water
- microchannel
- endothennic
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Abstract
It includes water pump, water storage cavity and cooling water, microchannel endothennic device, spirally coiled cooling mechanism, circulating water pipe that the invention, which belongs to laptop with water-cooling heat radiating device is applied mechanically,；The invention, which is used, to be set to spirally coiled cooling mechanism between display screen and the cover board of laptop and is close to the integral heat emission mechanism being fixed on cover board inner wall, radiating and cooling is carried out to high-temperature component CPU, north bridge etc. using microchannel endothennic device, and is connected to water storage cavity, water pump and each microchannel endothennic device with coil pipe cooling mechanism using steering gear；When high-temperature component heat flow density is 60W/cm2When, when being cooled down using flow velocity 0.5m/s, 25 DEG C of water, it can be ensured that the temperature of card microchannel endothennic device and high-temperature component contact surface is 40 DEG C or so, and heat dissipation effect is very good.To have compact-sized, the good airproof performance of cooling system, reliability is high, the features such as can effectively improving the heat dissipation effect of high-temperature component, ensure the stability that high-performance laptop is run, extend its service life.
Description
Technical field
The invention belongs to electronic equipment cooling heat radiators, especially a kind of built-in water for laptop
Cooling and radiation device.
Background technology
It is rapidly developed with the miniaturization, microminaturization and integrated technology of electronic component, the power density of electronic equipment
Gradually increase.By taking computer chip as an example, the performance of laptop increasingly improves, and processor frequencies are higher and higher, and English is special
You come into forth generation by processor now.Therefore the heat generated is also increasing, if cannot distribute will not for these heats
But the stability of the system of influence, causes computer performance to decline, and also affect the service life of computer.Desktop computer is come
It says, roomy cabinet, powerful fan, the cooling fin of large area can be such that heat dissipation problem solves very well.And for notebook
For computer, with the continuous raising of central processing unit performance and chip integration, the calorific value of central processing unit also constantly increases
Add, the requirement to radiator is higher and higher, however small due to laptop, and the solution of heat dissipation problem is often relatively tired
It is difficult.Currently, laptop mainly relies on wind-cooling heat dissipating, the great advantage of wind-cooling heat dissipating is exactly safe.But
Clemens J.M's the study found that the maximum heat flow density of air-cooled heat convection does not exceed 50W/cm2；This explanation, in height
Integrated today, wind-cooling heat dissipating are still difficult to meet high-performance laptop needs.
Water-cooling is it has been proposed that a kind of new radiating mode come.Since water is higher than the thermal coefficient of air, consuming
In the case of identical electrical power, pressure is water cooling can take away more energy than air-cooled, but water-cooling is with respect to wind-cooling heat dissipating
Greatest drawback be exactly working medium leakage problem.
Currently, being radiated to notebook by the way of water cooling, people have done many research.What is certain is that
Since the specific heat capacity of water is larger, the heat for increasing unit temperature absorption is larger, and effect is more air-cooled and heat pipe cools down, but they
There is also certain defects.Such as：Application No. is 201420027514.1 patented technologies to use external water-cooling heat radiating device, the device
The characteristics of be on the basis of original laptop, access with fin copper pipe, pass through fin on copper pipe and chip cooling
Fin contacts conduct heat to copper pipe, and finally heat is brought to being cooled down to water outside notebook by water；First, this is special
Profit so that the portability of notebook is affected, do not grow, and differs to water cooling effect and sets, while external device (ED) by external pipe
It is often detached between interior arrangement, the leakproofness of whole system will be had an impact.In addition, application No. is
In 201320607120.9 patented technologies, discloses one kind and using foldable heat sink behind display screen, below heating device
Using heat sink, water flows into heat-absorbing chamber by water pump and takes away heat, finally flows into screen rear heat sink and radiates, the dress
Radiating efficiency can be improved by setting, but this patent is radiated using external foldable type heat sink, first, volume is big, use, carrying be not square
Just, second is that heat sink is connect with lower section pipeline using hose, hose fracture can be caused by often folding, and leak working medium, poor reliability.
Invention content
It is an object of the invention to be directed to defect existing for background technology, a kind of laptop of research and design, which is matched, applies mechanically water
Cooling and radiation device, the device is using integral heat emission mechanism and microchannel endothennic device and inside laptop, to notes
High-temperature component carries out water-cooling in this computer, under conditions of ensuring that laptop is easy to carry, to reach compact-sized,
The good airproof performance of cooling system, reliability are high, effectively improve the heat dissipation effect of high-temperature component in laptop, ensure high-performance
The stability of laptop operation, the purpose of extending its service life.
The solution of the present invention is that the external water-cooling heat radiating device of background technology is changed to integral heat emission mechanism, i.e., will
Spirally coiled cooling mechanism is set between display screen and the cover board of laptop and is close to be fixed on cover board inner wall, cold to increase
But the flow of water so that there is the sufficiently long time to carry out heat exchange between spirally coiled cooling mechanism and the cover board of laptop；
Microchannel endothennic device is anchored on computer bottom cover inner wall simultaneously, Computerized high-temperature component CPU, north bridge are then tightly attached to corresponding micro- respectively
On the heat dump of channel, to carry out pressure cooling to it；Microchannel endothennic device coolant outlet hose and water storage cavity coolant intake pipe
Respectively by it is corresponding be both secured to two steering gears of postoperculum under notebook respectively with the spirally coiled heat dissipation set on cover board inner wall
Formula can be relatively rotated between the inlet tube and outlet tube of mechanism to be tightly connected simultaneously, two steering gear center lines and notebook computer connecting shaft
Center line is located along the same line, and while coolant liquid (working medium) will not leak during ensureing use, ensures notebook electricity
Brain opening and closing are flexible and convenient；The present invention realizes its invention mesh with this.Thus laptop of the present invention is filled with water-cooling is applied mechanically
It sets including water pump, water storage cavity and cooling water, heat dump, cooling mechanism, circulating water pipe；Key is that each heat dump is microchannel
Heat dump, and cooling mechanism is then built-in coil pipe cooling mechanism；Spirally coiled cooling mechanism is then set to display screen and notebook electricity
Between the cover board of brain and it is fastened and fixed on cover board inner wall, and water storage cavity, water pump and each microchannel endothennic device are each fastened to computer
On bottom cover inner wall, the top of each microchannel endothennic device respectively with Computerized high-temperature component CPU, north bridge is corresponding is close to fix, spirally coiled
Being respectively equipped with one between cooling mechanism and the tube body of microchannel endothennic device, water storage cavity in notebook lower cover can relatively rotate
Steering gear；The water outlet of water storage cavity is connected to by water pipe with the water inlet of water pump, and the water outlet of water pump then passes through (cycle) water
Pipe is connected to the water inlet of each microchannel endothennic device respectively, and the water outlet of each microchannel endothennic device then passes through water pipe and diverted device
Formula sealing can be relatively rotated with the input terminal of coil pipe cooling mechanism to be connected to, and the water inlet of water storage cavity is also through water pipe and through another
Steering gear can relatively rotate formula sealing with the output end of coil pipe cooling mechanism and be connected to；Two steering gears are individually fixed under notebook
The postoperculum and center line of two steering gears and the center line of notebook computer upper and lower cover body connecting shaft are located along the same line, water
Pump is then connect with the power supply in laptop to obtain electric energy by conducting wire.
Microchannel endothennic device described above include bring into, the microchannel endothennic device ontology of titting water outlet, cover board and be set to
Gasket between heat dump ontology and cover board.Microchannel in the microchannel endothennic device ontology is corrugated microchannel.And
The coil pipe cooling mechanism is S-shaped bending-type coil pipe cooling mechanism, coil pipe pipeline overall length 1-2.5m.The steering gear includes in band
The inner core of heart runner, one end is open, the other end opens up the shell of centre bore and the sealing between inner core and inner walls
Ring and cylinder shape sealing ring, the inlet/outlet pipe fitting being fastened respectively in the center flow channels of on housing central bore and inner core outer end will
The gland of inner core, shell and cylinder shape sealing ring axial restraint, and be used for and the fixed fixation of postoperculum under laptop
Seat.
The present invention is due to being set between display screen and the cover board of laptop and being close to using by spirally coiled cooling mechanism
The integral heat emission mechanism being fixed on cover board inner wall radiates to high-temperature component CPU, north bridge etc. using microchannel endothennic device
Cooling, and be connected to water storage cavity, water pump and each microchannel endothennic device with coil pipe cooling mechanism using steering gear；It is surveyed by experiment
Examination, the microchannel endothennic device are 60W/cm when high-temperature component heat flow density2When, use flow velocity 0.5m/s, temperature for 25 DEG C of water
When being cooled down, it is ensured that the temperature of microchannel endothennic device ontology and high-temperature component contact surface is 40 DEG C or so, and heat dissipation effect is non-
It is often good.To have compact-sized, the good airproof performance of cooling system, reliability is high, can effectively improve high in laptop
The features such as heat dissipation effect of warm component ensures the stability that high-performance laptop is run, extends its service life
Description of the drawings
Fig. 1 is water-cooling heat radiating device structure of the present invention and laptop connection relation and working state schematic representation；
In figure：1. notebook lower cover, 2. north bridges, 3.CPU, 4. microchannel endothennic devices, 5. cooling tubes, 6. steering gears, 7. is aobvious
Display screen, 8. water cavities, 9. water pumps.
Fig. 2 is microchannel endothennic device structural schematic diagram；
In figure：4-1. cover boards, 4-2. gaskets, 4-3. microchannel endothennic device ontologies.
Fig. 3 is microchannel endothennic device body construction schematic diagram；
In figure：4-3.1. cooling waters go out (into) water pipe head, 4-3.2. heat dump bottom plates, the corrugated microchannels 4-3.3.,
The corrugated microchannel parting beads of 4-3.4., 4-3.5. cooling waters are into (going out) water pipe head；
Fig. 4 is diverter structure schematic diagram；Wherein：Fig. 4 a are structural schematic diagram (sectional view), and Fig. 4 b are side view；
In figure：6. steering gear, 6-1. goes out into (going out) water pipe head, 6-2. glands, 6-3. sealing rings, 6-4. shells, 6-5.
(into) water pipe head, 6-6. inner cores, 6-7. sealing rings, 1-1. steering gear fixed seats.
Specific implementation mode
Two 45 × 45 × 8mm of microchannel endothennic device 4 (length × width x thickness) of present embodiment, wherein：Water pipe head 4-
3.1,4-3.5,
Heat dump bottom plate 4-3.2, corrugated microchannel parting bead 4-3.4 and cover board 4-1 materials are aluminium alloy；It is corrugated micro-
Channel parting bead 4-3.4 thickness 2mm, both ends are 2.5mm away from the both sides heat dump bottom plate 4-3.2 inner wall, and upper and lower parting bead is away from heat dump bottom
The upper and lower inner wall of plate is 5.0mm, and corrugated microchannel (4-3.3) curve shape present embodiment presses cosine curve equation y=A*
Cos (2 π fx) is determined, in formula：Amplitude A=1, frequency f=0.25, it is 2 × 2mm that microchannel (4-3.3) is deep × wide, and water pipe connects
Head 4-3.1,4-3.5 outer diameter is Φ 4mm；Respectively connection is used in (cycle) water pipe and spirally coiled cooling mechanism in present embodiment
5 outer diameter of cooling tube is Φ 5mm, and 5 total 1.8m of spirally coiled cooling tube, material are aluminium alloy；The internal diameter of 6 middle casing 6-4 of steering gear
And the major diameter of inner core 6-6 be Φ 14mm, inner core 6-6 path be Φ 11.0mm, axial length is 15mm, in inner core 6-6
The a diameter of Φ 3mm of center flow channels, sealing ring 6-3 internal diameters Φ 10.8mm, wall thickness 1.6mm, material are latex, inlet and outlet pipes connector 6-
1,6-5 outer diameters are Φ 4mm, and gland 6-2 present embodiments use elastic bayonet lock to lock formula gland, material in as engineering plastics；Water
8 volume 20mL of chamber, water pump 9 are directly connected with 5V power supplys inside computer and obtain driving force.
Start first when present embodiment works water pump 9 cooling water is extracted out from water cavity 8 be pumped into respectively through water pipe two it is micro-
Channel heat dump 4 carries out heat exchange with CPU, north bridge thereon respectively through two heat dumps, and the cooling water after heat absorption is by microchannel
The cooling water outlet of heat dump takes the working heat of CPU, north bridge out of, then inputs S-shaped bending-type coil pipe through water pipe, steering gear 6 and dissipate
Cooling tube 5 in heat engine structure inputs water cavity 8, to enter next cooling cycle through another steering gear 6 again after cooling.This embodiment party
The channel heat dump that declines is 60W/cm when high-temperature component heat flow density2When, use flow velocity 0.5m/s, temperature to be carried out for 25 DEG C of water
When cooling, it is ensured that the temperature of microchannel endothennic device ontology and high-temperature component contact surface is 40 DEG C or so, the non-convention of heat dissipation effect
Think.
Claims (2)
1. a kind of laptop is with water-cooling heat radiating device, including water pump, water storage cavity and cooling water is applied mechanically, heat dump, radiate machine
Structure, circulating water pipe；It is characterized in that each heat dump is microchannel endothennic device, and cooling mechanism is then built-in coil pipe heat dissipation machine
Structure；Spirally coiled cooling mechanism is then set between display screen and the cover board of laptop and is fastened and fixed on cover board inner wall, and
Water storage cavity, water pump and each microchannel endothennic device are each fastened on computer bottom cover inner wall, the top of each microchannel endothennic device respectively with
Computerized high-temperature component CPU, north bridge correspondence are close to fix, spirally coiled cooling mechanism and the microchannel endothennic in notebook lower cover
Device, water storage cavity tube body between be respectively equipped with a relatively turnable steering gear；The water outlet of water storage cavity passes through water pipe and water pump
Water inlet connection, the water outlet of water pump is then connected to the water inlet of each microchannel endothennic device by water pipe respectively, each microchannel
The water outlet of heat dump then can relatively rotate formula sealing with the input terminal of coil pipe cooling mechanism by water pipe and diverted device and be connected to,
And the water inlet of water storage cavity also through water pipe and the output end through another steering gear and coil pipe cooling mechanism can to relatively rotate formula close
Envelope connection；Two steering gears are individually fixed in postoperculum under notebook and the center line of two steering gears and notebook computer are upper and lower
The center line of lid connecting shaft is located along the same line, and water pump is then connect with the power supply in laptop to obtain by conducting wire
Electric energy；
Above-mentioned microchannel endothennic device include bring into, the microchannel endothennic device ontology of titting water outlet, cover board and be set to heat dump sheet
Gasket between body and cover board；
Microchannel in the microchannel endothennic device ontology is corrugated microchannel；
And the steering gear includes the inner core with center flow channels, one end is open, the other end opens up the shell of centre bore and is set to
Sealing ring between inner core and inner walls and cylinder shape sealing ring, are fastened respectively on housing central bore and inner core outer end center
Inlet/outlet pipe fitting on runner by inner core, the gland of shell and cylinder shape sealing ring axial restraint, and is used for and notes
The fixed fixed seat of postoperculum under this computer.
2. matching by laptop described in claim 1 and applying mechanically water-cooling heat radiating device, it is characterised in that the coil pipe cooling mechanism
For S-shaped bending-type coil pipe cooling mechanism, coil pipe pipeline overall length 1-2.5m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510446295.XA CN105159421B (en) | 2015-07-27 | 2015-07-27 | Laptop, which is matched, applies mechanically water-cooling heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510446295.XA CN105159421B (en) | 2015-07-27 | 2015-07-27 | Laptop, which is matched, applies mechanically water-cooling heat radiating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105159421A CN105159421A (en) | 2015-12-16 |
| CN105159421B true CN105159421B (en) | 2018-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510446295.XA Expired - Fee Related CN105159421B (en) | 2015-07-27 | 2015-07-27 | Laptop, which is matched, applies mechanically water-cooling heat radiating device |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018094877A1 (en) * | 2016-11-25 | 2018-05-31 | 华为技术有限公司 | Heat dissipation panel, heat dissipation device and electronic apparatus |
| CN107329546A (en) * | 2017-07-13 | 2017-11-07 | 电子科技大学 | The experimental system and method for a kind of heat abstractor, cooling system and heat abstractor |
| DK3620741T3 (en) | 2018-09-04 | 2021-03-01 | Ovh | THERMAL TRANSFER DEVICE WITH A FLUID LINE |
| CN109872646B (en) * | 2019-03-29 | 2021-08-20 | 凯扬光电(苏州)有限公司 | Graphene display screen capable of dissipating heat quickly |
| CN110418549B (en) | 2019-06-18 | 2021-01-29 | 华为技术有限公司 | Heat dissipation assembly and electronic equipment |
| CN113487969B (en) * | 2021-07-20 | 2022-07-12 | 武汉华星光电技术有限公司 | Folding display panel |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1456038A (en) * | 2001-09-04 | 2003-11-12 | 株式会社日立制作所 | Electronic device |
| CN1738521A (en) * | 2004-08-20 | 2006-02-22 | 株式会社日立制作所 | A liquid cooling system and an electronic apparatus applying the same therein |
| CN101636068A (en) * | 2009-08-22 | 2010-01-27 | 刘青长 | Heat radiating device of flat water tank for computers and electrical apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7140753B2 (en) * | 2004-08-11 | 2006-11-28 | Harvatek Corporation | Water-cooling heat dissipation device adopted for modulized LEDs |
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2015
- 2015-07-27 CN CN201510446295.XA patent/CN105159421B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1456038A (en) * | 2001-09-04 | 2003-11-12 | 株式会社日立制作所 | Electronic device |
| CN1738521A (en) * | 2004-08-20 | 2006-02-22 | 株式会社日立制作所 | A liquid cooling system and an electronic apparatus applying the same therein |
| CN101636068A (en) * | 2009-08-22 | 2010-01-27 | 刘青长 | Heat radiating device of flat water tank for computers and electrical apparatus |
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| CN105159421A (en) | 2015-12-16 |
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