CN105154934A - Yttrium-nickel alloy electroplate liquid and preparing method thereof - Google Patents
Yttrium-nickel alloy electroplate liquid and preparing method thereof Download PDFInfo
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- CN105154934A CN105154934A CN201510519601.8A CN201510519601A CN105154934A CN 105154934 A CN105154934 A CN 105154934A CN 201510519601 A CN201510519601 A CN 201510519601A CN 105154934 A CN105154934 A CN 105154934A
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Abstract
The invention provides yttrium-nickel alloy electroplate liquid and a preparing method thereof. The yttrium-nickel alloy electroplate liquid comprises 80-100 g/L of nickel sulfate, 35-55 g/L of sodium phosphate, 0.05-1 g/L of yttrium oxide, 12-18 g/L of boric acid, 12-22 g/L of citric acid, 3-8 g/L of aminosulfonic acid potassium salt and 0.2-3 g/L of edetic acid. The yttrium-nickel alloy electroplate liquid is good in stability. An electroplating layer obtained through electroplating is free of cracks, abrasion and corrosion are resistant, and the binding force of the electroplating layer and a base material is good.
Description
Technical field
The present invention relates to electroplating technology field, particularly relate to a kind of yttrium-boron-tungsten-iron-nickel alloy electroplating and preparation method thereof.
Background technology
The laudatory title that rare earth has " industrial VITAMIN ".Nowadays extremely important strategic resource has been become.Rare earth oxide refers to that period of element atom ordinal number is 15 kinds of lanthanide oxides of 57 to 71, and the oxide compound of the scandium similar to lanthanon chemical property (Sc) and yttrium (Y) totally 17 kinds of elements.Rare earth element is obtained in fields such as oil, chemical industry, metallurgy, weaving, pottery, glass, permanent magnet materials and applies widely, and along with the progress of science and technology and the continuous breakthrough of utilisation technology, the value of rare earth oxide is by increasing.
The plating solution of current nickel-phosphorus alloy mainly adopts acid system and alkaline system.Acid system composition is comparatively simple, bath stability, but uneven coating is even, affects solidity to corrosion.Alkaline system adopts alkali plating solution, and its thickness of coating is even, and plating solution is unstable.
Summary of the invention
In view of this, one aspect of the present invention provides a kind of yttrium-boron-tungsten-iron-nickel alloy electroplating, this yttrium-boron-tungsten-iron-nickel alloy electroplating good stability; Electroplate the coating flawless obtained, wear resistant corrosion resistant, good with base material bonding force.
A kind of yttrium-boron-tungsten-iron-nickel alloy electroplating comprises single nickel salt 80 ~ 100g/L, sodium phosphite 35 ~ 55g/L, yttrium oxide 0.05 ~ 1g/L, boric acid 12 ~ 18g/L, citric acid 12 ~ 22g/L, thionamic acid potassium 3 ~ 8g/L, ethylenediamine tetraacetic acid (EDTA) 0.2 ~ 3g/L.
Preferably, single nickel salt 86 ~ 92g/L, sodium phosphite 42 ~ 50g/L, yttrium oxide 0.05 ~ 0.6g/L, boric acid 12 ~ 16g/L, citric acid 16 ~ 22g/L, thionamic acid potassium 5 ~ 8g/L, ethylenediamine tetraacetic acid (EDTA) 0.5 ~ 2g/L is comprised.
Preferably, single nickel salt 88g/L, sodium phosphite 46g/L, yttrium oxide 0.06g/L, boric acid 13g/L, citric acid 18g/L, thionamic acid potassium 6g/L, ethylenediamine tetraacetic acid (EDTA) 1.2g/L is comprised.
Preferably, the pH value of described yttrium-boron-tungsten-iron-nickel alloy electroplating is 5 ~ 6.
The present invention provides a kind of method preparing above-mentioned yttrium-boron-tungsten-iron-nickel alloy electroplating on the other hand, and yttrium-boron-tungsten-iron-nickel alloy electroplating prepared by the method electroplates the coating flawless obtained, wear resistant corrosion resistant, good with base material bonding force.
Prepare a method for above-mentioned yttrium-boron-tungsten-iron-nickel alloy electroplating, comprise the following steps:
(1) in deionized water, add citric acid 12 ~ 22g, boric acid 12 ~ 18g, ethylenediamine tetraacetic acid (EDTA) 0.2 ~ 3g single nickel salt 80 ~ 100g and sodium phosphite 35 ~ 55g stirring and dissolving make mixed solution;
(2) in this mixed solution, add yttrium oxide 0.05 ~ 1g and thionamic acid potassium 3 ~ 8g/L stirring and dissolving, then the deionized water adding surplus is 1L to cumulative volume, obtains yttrium-boron-tungsten-iron-nickel alloy electroplating.
Preferably, the first acidification of yttrium oxide in step (2), then join in mixed solution.
Beneficial effect of the present invention: yttrium-boron-tungsten-iron-nickel alloy electroplating of the present invention comprises single nickel salt 80 ~ 100g/L, sodium phosphite 35 ~ 55g/L, yttrium oxide 0.05 ~ 1g/L, boric acid 12 ~ 18g/L, citric acid 12 ~ 22g/L, thionamic acid potassium 3 ~ 8g/L, ethylenediamine tetraacetic acid (EDTA) 0.2 ~ 3g/L.Yttrium of the present invention-boron-tungsten-iron-nickel alloy electroplating good stability; Electroplate the coating flawless obtained, wear resistant corrosion resistant, good with base material bonding force.
Embodiment
Come that the invention will be further described below respectively in conjunction with specific embodiments.
Raw material involved in following examples is commercially available.
Embodiment 1: the yttrium-boron-tungsten-iron-nickel alloy electroplating of the present embodiment comprises following component:
The method preparing this yttrium-boron-tungsten-iron-nickel alloy electroplating is as follows:
In deionized water, add citric acid 12g, boric acid 12g, ethylenediamine tetraacetic acid (EDTA) 0.2g, single nickel salt 80g and sodium phosphite 35g stirring and dissolving make mixed solution, yttrium oxide 0.05g and thionamic acid potassium 3g/L stirring and dissolving is added in this mixed solution, deionized water to the cumulative volume adding surplus is again 1L, regulate PH to 5, obtain yttrium-boron-tungsten-iron-nickel alloy electroplating.
Embodiment 2: the yttrium-nickel-phosphor alloy electroplate liquid of the present embodiment comprises following component:
The method preparing this yttrium-boron-tungsten-iron-nickel alloy electroplating is as follows:
In deionized water, add citric acid 16g, boric acid 12g, ethylenediamine tetraacetic acid (EDTA) 0.5g, single nickel salt 86g and sodium phosphite 42g stirring and dissolving make mixed solution, yttrium oxide 0.05g and thionamic acid potassium 5g/L stirring and dissolving is added in this mixed solution, deionized water to the cumulative volume adding surplus is again 1L, regulate PH to 5, obtain yttrium-boron-tungsten-iron-nickel alloy electroplating.
Embodiment 3: the yttrium-nickel-phosphor alloy electroplate liquid of the present embodiment comprises following component:
The method preparing this yttrium-boron-tungsten-iron-nickel alloy electroplating is as follows:
In deionized water, add citric acid 18g, boric acid 13g, ethylenediamine tetraacetic acid (EDTA) 1.2g, single nickel salt 88g and sodium phosphite 46g stirring and dissolving make mixed solution, yttrium oxide 0.06g and thionamic acid potassium 6g/L stirring and dissolving is added in this mixed solution, deionized water to the cumulative volume adding surplus is again 1L, regulate PH to 5, obtain yttrium-boron-tungsten-iron-nickel alloy electroplating.
The yttrium that embodiment 1 ~ 3 obtains-nickel-phosphor alloy electroplate liquid uses and good stability in storage process; Yttrium-boron-tungsten-iron-nickel alloy electroplating is electroplated, the coating flawless obtained, good with base material bonding force.
Adopt testing method known in the field to carry out cathode efficiency test to the electroplate liquid of embodiment 1 ~ 3 and the coating that obtained carries out salt-fog test to measure solidity to corrosion, test result is as following table.
Can find out that the corrosion resistance of coating using electroplate liquid of the present invention to obtain is obviously good than existing coating by upper table.
Yttrium of the present invention-boron-tungsten-iron-nickel alloy electroplating good stability; Electroplate the coating flawless obtained, wear resistant corrosion resistant, good with base material bonding force.
It should be noted that and understand, when not departing from the spirit and scope of accompanying claim the present invention for required protection, various amendment and improvement can be made to the present invention of foregoing detailed description.Therefore, the scope of claimed technical scheme is not by the restriction of given any specific exemplary teachings.
Applicant states, the present invention illustrates detailed process equipment and process flow process of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned detailed process equipment and process flow process, namely do not mean that the present invention must rely on above-mentioned detailed process equipment and process flow process and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (6)
1. yttrium-boron-tungsten-iron-nickel alloy electroplating, it is characterized in that, comprise single nickel salt 80 ~ 100g/L, sodium phosphite 35 ~ 55g/L, yttrium oxide 0.05 ~ 1g/L, boric acid 12 ~ 18g/L, citric acid 12 ~ 22g/L, thionamic acid potassium 3 ~ 8g/L, ethylenediamine tetraacetic acid (EDTA) 0.2 ~ 3g/L.
2. yttrium-boron-tungsten-iron-nickel alloy electroplating according to claim 1, it is characterized in that, comprise single nickel salt 86 ~ 92g/L, sodium phosphite 42 ~ 50g/L, yttrium oxide 0.05 ~ 0.6g/L, boric acid 12 ~ 16g/L, citric acid 16 ~ 22g/L, thionamic acid potassium 5 ~ 8g/L, ethylenediamine tetraacetic acid (EDTA) 0.5 ~ 2g/L.
3. yttrium-boron-tungsten-iron-nickel alloy electroplating according to claim 1, is characterized in that, comprises single nickel salt 88g/L, sodium phosphite 46g/L, yttrium oxide 0.06g/L, boric acid 13g/L, citric acid 18g/L, thionamic acid potassium 6g/L, ethylenediamine tetraacetic acid (EDTA) 1.2g/L.
4. yttrium-boron-tungsten-iron-nickel alloy electroplating according to claim 1, is characterized in that, the pH value of described yttrium-boron-tungsten-iron-nickel alloy electroplating is 5 ~ 6.
5. prepare a method for yttrium-boron-tungsten-iron-nickel alloy electroplating described in claim 1, it is characterized in that, comprise the following steps:
(1) in deionized water, add citric acid 12 ~ 22g, boric acid 12 ~ 18g, ethylenediamine tetraacetic acid (EDTA) 0.2 ~ 3g, single nickel salt 80 ~ 100g and sodium phosphite 35 ~ 55g stirring and dissolving make mixed solution;
(2) in this mixed solution, add yttrium oxide 0.05 ~ 1g and thionamic acid potassium 3 ~ 8g/L stirring and dissolving, then the deionized water adding surplus is 1L to cumulative volume, obtains yttrium-boron-tungsten-iron-nickel alloy electroplating.
6. preparation method according to claim 7, is characterized in that, the first acidification of yttrium oxide in step (2), then joins in mixed solution.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108779568A (en) * | 2016-03-11 | 2018-11-09 | 应用材料公司 | The method of electrochemical growth yttria or yttrium oxide on semiconductor processing equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05217744A (en) * | 1992-02-06 | 1993-08-27 | Tdk Corp | Plated magnetic film and manufacture thereof |
| CN102383151A (en) * | 2011-09-23 | 2012-03-21 | 湖州金泰科技股份有限公司 | Nano semibright nickel plating solution |
| CN102747389A (en) * | 2012-07-03 | 2012-10-24 | 中国科学院宁波材料技术与工程研究所 | Electroplating solution for preparation of nanocrystalline nickel alloy plating and application thereof |
-
2015
- 2015-08-21 CN CN201510519601.8A patent/CN105154934A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05217744A (en) * | 1992-02-06 | 1993-08-27 | Tdk Corp | Plated magnetic film and manufacture thereof |
| CN102383151A (en) * | 2011-09-23 | 2012-03-21 | 湖州金泰科技股份有限公司 | Nano semibright nickel plating solution |
| CN102747389A (en) * | 2012-07-03 | 2012-10-24 | 中国科学院宁波材料技术与工程研究所 | Electroplating solution for preparation of nanocrystalline nickel alloy plating and application thereof |
Non-Patent Citations (4)
| Title |
|---|
| 朱福良 等: "稀土氧化钐对直流电沉积纳米镍铁合金箔的影响", 《兰州理工大学学报》 * |
| 王保玉 等: "稀土在镍铁合金电沉积中的作用", 《材料保护》 * |
| 申晨: "超声场中电沉积二元纳米复合镀层的试验研究", 《河南科技大学硕士学位论文》 * |
| 韩勇 等: "稀土氧化物对Ni-Fe合金镀层耐蚀性的影响", 《煤炭学报》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108779568A (en) * | 2016-03-11 | 2018-11-09 | 应用材料公司 | The method of electrochemical growth yttria or yttrium oxide on semiconductor processing equipment |
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