CN105116009A - Heating simulation device and heat pipe heat dispersion detection device - Google Patents
Heating simulation device and heat pipe heat dispersion detection device Download PDFInfo
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- CN105116009A CN105116009A CN201510489998.0A CN201510489998A CN105116009A CN 105116009 A CN105116009 A CN 105116009A CN 201510489998 A CN201510489998 A CN 201510489998A CN 105116009 A CN105116009 A CN 105116009A
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Abstract
The invention provides a heating simulation device and a heat pipe heat dispersion detection device. The heating simulation device comprises a central processing unit (CPU), a linear power supply, a heating element, a first temperature collector and a second temperature collector. The CPU is used for controlling the working voltage of the linear power supply and controlling the working voltage of the linear power supply to be adjusted according to the temperature values collected by the first temperature collector and the second temperature collector. The linear power supply is used for adjusting the working voltage according to working voltage control parameters sent by the CPU and supplying power to the heating element. The heating element is used for giving out heat according to the working voltage of the linear power supply. The first temperature collector is used for collecting the environment temperature and sending the environment temperature to the CPU. The second temperature collector is used for collecting the surface temperature of the heating element and sending the surface temperature of the heating element to the CPU. By means of the heating simulation device and the heat pipe heat dispersion detection device, heating of IC chips can be well simulated, heat dispersion numerical quantization of a heat pipe is achieved by simulation heating, and thus the heat pipe can be detected more quickly and efficiently.
Description
Technical field
The present invention relates to communication facilities technical field of measurement and test, particularly relate to a kind of heating analogue means and heat pipe heat radiation device for detecting performance.
Background technology
Along with densification, the complicated development of integrated circuit, the heat that its electronic devices and components operationally produce also increases severely thereupon, and components and parts temperature is raised, and has an impact to the normal work of components and parts.Therefore, heat abstractor must be installed to guarantee that the heating element such as central processing unit or other high temperature chips normally works at a proper temperature.But, how to ensure that the cooling requirements needs that the heat abstractor installed can meet components and parts or chip just can realize by repeatedly testing.In current industry, the heating of the IC chip that the thermal value such as FPGA is large and the test majority of heat radiation adopt the mode of software emulation to realize, and are simulated the thermal value size of IC by hot simulation software.And commercially to the control of temperature and gather the temperature acquisition equipment all adopting integration, the realization of steady temperature is not very desirable.
The existing hot pipe technique that utilizes of existing heat abstractor improves heat-sinking capability.But the collision of heat pipe in manufacture and transportation is all easy to produce the difficult slight crack seen of naked eyes, the vacuum tightness in cavity is caused to decline and greatly reduce its capacity of heat transmission, and these slight cracks are difficult to detect by visual inspection method, therefore the heat dispersion of opposite heat tube one by one can only carry out detecting thus determine that whether it is qualified.And the method for testing of general heat pipe for thermal conductivity performance, it is the one end with hand-held heat pipe, its other end is immersed in hot water, temperature sensation after a period of time with hand opposite heat tube handheld terminal judges whether the heat conductivility of heat pipe can meet the demands, this method of testing efficiency is lower, it mainly relies on the subjective sensation of people to judge do not have quantizating index in addition, and testing result is very inaccurate.
In prior art, the method for testing of FPGA heat radiation is realized by computer simulation emulation mostly, but actual FPGA work heat dissipation problem is also with indoor temperature and relevant to heat pipe contact face smoothness etc. practical factor, so to be worked by computer simulation emulation FPGA and the method for dispelling the heat is difficult to reflect really the real work situation of heat-pipe radiating apparatus in RRU.And the firm power of thermal source, steady temperature control method has various ways in industry, such as, adopt temperature controller, but testing efficiency too poor efficiency, be not suitable for the production of batch.
Summary of the invention
In view of the above problems, the present invention is proposed to provide a kind of the heating analogue means and the heat pipe heat radiation device for detecting performance that overcome the problems referred to above or solve or slow down the problems referred to above at least in part, to realize quick, the efficient detection of heat pipe heat radiation performance.
According to an aspect of the present invention, provide a kind of heating analogue means, this device comprises central processing unit, linear power supply, heater element, the first Temperature sampler and the second Temperature sampler;
Central processing unit, for controlling the operating voltage of described linear power supply, and controls the adjustment of the operating voltage of described linear power supply according to the temperature value of described first Temperature sampler and the second Temperature sampler collection;
Linear power supply, carries out operating voltage adjustment for the operating voltage controling parameters sent according to described central processing unit, and powers to described heater element;
Heater element, for generating heat according to the operating voltage of described linear power supply;
First Temperature sampler, for gathering environment temperature, and is sent to described central processing unit by described environment temperature;
Second Temperature sampler, for gathering the surface temperature of heater element, and is sent to described central processing unit by the surface temperature of described heater element.
Optionally, described linear power supply is linear programmable power supply, and the operating voltage of described linear programmable power supply is 24V-32V.
Optionally, described device also comprises change-over switch, described change-over switch is connected between described central processing unit and linear power supply, for receiving the operating voltage controling parameters that described central processing unit sends, and switch according to the operating voltage of described operating voltage controling parameters to described linear power supply.
Optionally, described first Temperature sampler is room temperature collector, and the environment temperature collected is sent to described central processing unit by CDMA/GPRS wireless network by described room temperature collector.
According to another aspect of the present invention, provide a kind of heat pipe heat radiation device for detecting performance, this device comprises temperature-detecting device and above-mentioned arbitrary described heating analogue means;
Described heating analogue means, is placed in heat pipe side to be measured, heats described heat pipe to be measured for analog IC chip; Temperature-detecting device, for detecting the temperature value of described heat pipe to be measured in real time, the temperature value of the heat pipe described to be measured that described heating analogue means detects according to described temperature-detecting device determines the rate of heat dissipation of heat pipe to be measured.
Optionally, described heat pipe to be measured is the heat pipe being arranged on cabinet inside.
Optionally, the central processing unit in described heating analogue means receives the temperature value of heat pipe described to be measured that described temperature-detecting device detects, and the temperature value of the heat pipe described to be measured arrived according to different reception calculates the rate of heat dissipation of described heat pipe to be measured.
Optionally, described central processing unit is specifically according to the difference of temperature value and the ratio in the time interval of this twice detection time of any heat pipe described to be measured detected for twice of described temperature-detecting device, and obtain the rate of heat dissipation of described heat pipe to be measured, formula is:
Wherein, h is rate of heat dissipation, C
1be the first collecting temperature value, C
2be the second collecting temperature value, t is the time interval of twice collection.
Optionally, the central processing unit in described heating analogue means is also for controlling the cut-out of the linear power supply in described heating analogue means.
Beneficial effect of the present invention is:
Heating analogue means provided by the invention and heat pipe heat radiation device for detecting performance, the power adopting CPU and linear power supply to control heating block carrys out the operational heat amount of analog IC chip, and its opposite heat tube is heated, by reading the heat dispersal situations of heat pipe in real time thus digital quantity dissolves the heat dispersion of heat pipe, realize the heat dispersion detection more rapidly and efficiently of heat pipe, and heat pipe heat radiation performance can also be carried out digital quantization, make the production of heat pipe heat radiation Performance Detection.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to technological means of the present invention can be better understood, and can be implemented according to the content of instructions, and can become apparent, below especially exemplified by the specific embodiment of the present invention to allow above and other objects of the present invention, feature and advantage.
Accompanying drawing explanation
By reading hereafter detailed description of the preferred embodiment, various other advantage and benefit will become cheer and bright for those of ordinary skill in the art.Accompanying drawing only for illustrating the object of preferred implementation, and does not think limitation of the present invention.And in whole accompanying drawing, represent identical parts by identical reference symbol.In the accompanying drawings:
The structural representation of a kind of analogue means that generates heat that Fig. 1 provides for the embodiment of the present invention;
The structural representation of a kind of heat pipe heat radiation device for detecting performance that Fig. 2 provides for the embodiment of the present invention.
Embodiment
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the present invention, and can not limitation of the present invention being interpreted as.
Those skilled in the art of the present technique are appreciated that unless expressly stated, and singulative used herein " ", " one ", " described " and " being somebody's turn to do " also can comprise plural form.Should be further understood that, the wording used in instructions of the present invention " comprises " and refers to there is described feature, integer, step, operation, element and/or assembly, but does not get rid of and exist or add other features one or more, integer, step, operation, element, assembly and/or their group.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, and all terms used herein (comprising technical term and scientific terminology), have the meaning identical with the general understanding of the those of ordinary skill in field belonging to the present invention.Should also be understood that those terms defined in such as general dictionary, should be understood to that there is the meaning consistent with the meaning in the context of prior art, unless and by specific definitions, otherwise can not explain by idealized or too formal implication.
The structural representation of a kind of analogue means that generates heat that Fig. 1 provides for the embodiment of the present invention, as shown in Figure 1, this device comprises central processing unit 110, linear power supply 120, heater element 130, first Temperature sampler 140 and the second Temperature sampler 150;
Described central processing unit 110, for controlling the operating voltage of described linear power supply, and controls the adjustment of the operating voltage of described linear power supply according to the temperature value of described first Temperature sampler and the second Temperature sampler collection;
Described linear power supply 120, carries out operating voltage adjustment for the operating voltage controling parameters sent according to described central processing unit, and powers to described heater element;
Described heater element 130, for generating heat according to the operating voltage of described linear power supply;
The first described Temperature sampler 140, for gathering environment temperature, and is sent to described central processing unit by described environment temperature;
The second described Temperature sampler 150, for gathering the surface temperature of heater element, and is sent to described central processing unit by the surface temperature of described heater element.
In the embodiment of the present invention, by realizing the control of heating analogue means to the linear voltage regulation of heater element, by sampling to the real time temperature of heater element in this device, and sample temperature is fed back to central processor CPU, CPU, through the operating voltage of internal preset algorithm Linear Control linear power supply, realizes the control of heating element generating heat power further, its heating temp is made to remain on steady state value, thus reach the effect of steady temperature, simulate IC chip, as the real work effect of FPGA etc.
Further, the heating analogue means that the embodiment of the present invention proposes also comprises change-over switch, described change-over switch is connected between described central processing unit and linear power supply, for receiving the operating voltage controling parameters that described central processing unit sends, and switch according to the operating voltage of described operating voltage controling parameters to described linear power supply.
Described heating analogue means realizes the process of simulation heating by three phases, specific as follows:
First stage, high-power Fast Heating adapted to the demand that batch production detects fast, and subordinate phase is turned down power and reached analog chip heating temp comparatively accurately; Phase III continuous power heating, approaches the product work truth simulation heat pipe course of work according to hot emulated data.Automatic lifting controller realizes in conjunction with three stepwise heating mode completion systems.
In the embodiment of the present invention, described linear power supply is linear programmable power supply, and the operating voltage of described linear programmable power supply is 24V-32V.CPU carrys out control linear power supply by change-over switch and works between 24V ~ 32V, thus control the power of heating block from 115W to 180W between work, collection room temperature and heating block temperature feedback are to CPU simultaneously, the power that CPU controls heating block through series of algorithms makes it reach constant 150 degree of temperature, for keeping heating block constant constant at 150 degree, we need once monitoring every 1S kind, monitoring value is two Temperature samplers that device configures, device is outside external cavity respectively, heating block outside surface.To gather 2 temperature value: indoor temperature C1, heating block temperature C2, the voltage-controlled coefficient of conversion h of temperature
v/1 DEG C, by the cutting edge aligned voltage-controlled value V of following formula scales:
V＝(150℃-C
2-C
1)*h
v/1℃
Further, described first Temperature sampler is room temperature collector, and the environment temperature collected is sent to described central processing unit by CDMA/GPRS wireless network by described room temperature collector.Add in testing process of the present invention and carry out according to indoor environment temperature the step revised, the temperature that CPU gathers according to room temperature collector, and using the reference value of this temperature as temperature variation curve, for the environmental error introduced in subsequent correction simulation heating and digital quantization heat pipe heat radiation ability process.
In order to realize the quantification to the heating simulation of the IC chips such as FPGA and the heat pipe heat radiation performance of measured workpiece, embodiments provide a kind of heat pipe heat radiation device for detecting performance, as shown in Figure 2, described heat pipe heat radiation device for detecting performance comprises temperature-detecting device 200 and above-mentioned arbitrary described heating analogue means 100;
Described heating analogue means 100, is placed in heat pipe side to be measured, heats described heat pipe to be measured for analog IC chip; Temperature-detecting device 200, for detecting the temperature value of described heat pipe to be measured in real time, the temperature value of the heat pipe described to be measured that described heating analogue means 100 detects according to described temperature-detecting device 200 determines the rate of heat dissipation of heat pipe to be measured.
The embodiment of the present invention is by being applied on heat pipe to be measured by proposing heating analogue means position in another embodiment of the present invention by different heat amount, adopt the heating power simulating the IC chips such as FPGA in this way, wherein said heater element can adopt electrical heating block to realize.
Further, described heat pipe to be measured is the heat pipe being arranged on cabinet inside, and the heat dispersion for cabinet inside heat pipes such as such as RRU cabinets makes express-analysis, and then reaches the quality of evaluation case radiation ability.The heat pipe heat radiation device for detecting performance proposed in the embodiment of the present invention, realizes the digital quantization function of heat pipe heat radiation performance by the fall off rate of heat pipe temperature after pyrotoxin contact heat pipe.。
Further, the central processing unit in described heating analogue means receives the temperature value of heat pipe described to be measured that described temperature-detecting device detects, and the temperature value of the heat pipe described to be measured arrived according to different reception calculates the rate of heat dissipation of described heat pipe to be measured.
Further, described central processing unit is specifically according to the difference of temperature value and the ratio in the time interval of this twice detection time of any heat pipe described to be measured detected for twice of described temperature-detecting device, and obtain the rate of heat dissipation of described heat pipe to be measured, formula is:
Wherein, h is rate of heat dissipation, C
1be the first collecting temperature value, C
2be the second collecting temperature value, t is the time interval of twice collection.
The embodiment of the present invention,
Temperature-detecting device laid by the lower chamber pipe of our heat pipe in cabinet, utilize the heat pipe temperature Real-time Obtaining that CPU collects temperature-detecting device, according to the temperature value in good time obtained, the time declined by temperature judges the heat-sinking capability of RRU heat pipe, expects rate of heat dissipation h
1 DEG C/S, require that the heat-sinking capability reached is described for tested RRU cavity below:
The rate of heat dissipation expected is: h
1=5 DEG C/s, we implement the heat pipe temperature gathered, at interval of 15S collecting temperature C
1, C
2, obtain actual rate of heat dissipation:
Work as h
2>h
1can judge that the heat radiation of heat pipe likes that ability meets the requirements.
Further, the central processing unit in described heating analogue means is also for controlling the cut-out of the linear power supply in described heating analogue means.In production run, heat pipe heat radiation device for detecting performance, consideration to safety test aspect adds heartbeat detection mechanism, when causing having no progeny in communication restricting the number without response or human factor for the top level computer of detection control and information displaying in testing process, CPU can cut off linear Power supply automatically according to the result of heartbeat detection, ensures the safety of producing.
Through the above description of the embodiments, those skilled in the art can be well understood to the present invention can by hardware implementing, and the mode that also can add necessary general hardware platform by software realizes.Based on such understanding, technical scheme of the present invention can embody with the form of software product, it (can be CD-ROM that this software product can be stored in a non-volatile memory medium, USB flash disk, portable hard drive etc.) in, comprise some instructions and perform method described in each embodiment of the present invention in order to make a computer equipment (can be personal computer, server, or the network equipment etc.).
It will be appreciated by those skilled in the art that accompanying drawing is the schematic diagram of a preferred embodiment, the module in accompanying drawing or flow process might not be that enforcement the present invention is necessary.
It will be appreciated by those skilled in the art that the module in the device in embodiment can carry out being distributed in the device of embodiment according to embodiment description, also can carry out respective change and be arranged in the one or more devices being different from the present embodiment.The module of above-described embodiment can merge into a module, also can split into multiple submodule further.
Be only several specific embodiment of the present invention above, but the present invention is not limited thereto, the changes that any person skilled in the art can think of all should fall into protection scope of the present invention.
Claims (9)
1. a heating analogue means, is characterized in that, comprises central processing unit, linear power supply, heater element, the first Temperature sampler and the second Temperature sampler;
Central processing unit, for controlling the operating voltage of described linear power supply, and controls the adjustment of the operating voltage of described linear power supply according to the temperature value of described first Temperature sampler and the second Temperature sampler collection;
Linear power supply, carries out operating voltage adjustment for the operating voltage controling parameters sent according to described central processing unit, and powers to described heater element;
Heater element, for generating heat according to the operating voltage of described linear power supply;
First Temperature sampler, for gathering environment temperature, and is sent to described central processing unit by described environment temperature;
Second Temperature sampler, for gathering the surface temperature of heater element, and is sent to described central processing unit by the surface temperature of described heater element.
2. heating analogue means according to claim 1, is characterized in that, described linear power supply is linear programmable power supply, and the operating voltage of described linear programmable power supply is 24V-32V.
3. heating analogue means according to claim 1, it is characterized in that, described device also comprises change-over switch, described change-over switch is connected between described central processing unit and linear power supply, for receiving the operating voltage controling parameters that described central processing unit sends, and switch according to the operating voltage of described operating voltage controling parameters to described linear power supply.
4. heating analogue means according to claim 1, is characterized in that, described first Temperature sampler is room temperature collector, and the environment temperature collected is sent to described central processing unit by CDMA/GPRS wireless network by described room temperature collector.
5. a heat pipe heat radiation device for detecting performance, is characterized in that, described device comprises temperature-detecting device and the analogue means that generates heat as described in any one of claim 1-4;
Described heating analogue means, is placed in heat pipe side to be measured, heats described heat pipe to be measured for analog IC chip; Temperature-detecting device, for detecting the temperature value of described heat pipe to be measured in real time, the temperature value of the heat pipe described to be measured that described heating analogue means detects according to described temperature-detecting device determines the rate of heat dissipation of heat pipe to be measured.
6. device according to claim 5, is characterized in that, described heat pipe to be measured is the heat pipe being arranged on cabinet inside.
7. device according to claim 5, it is characterized in that, central processing unit in described heating analogue means receives the temperature value of heat pipe described to be measured that described temperature-detecting device detects, and the temperature value of the heat pipe described to be measured arrived according to different reception calculates the rate of heat dissipation of described heat pipe to be measured.
8. device according to claim 7, it is characterized in that, described central processing unit is specifically according to the difference of temperature value and the ratio in the time interval of this twice detection time of any heat pipe described to be measured detected for twice of described temperature-detecting device, obtain the rate of heat dissipation of described heat pipe to be measured, formula is:
Wherein, h is rate of heat dissipation, C
1be the first collecting temperature value, C
2be the second collecting temperature value, t is the time interval of twice collection.
9. device according to claim 5, is characterized in that, the central processing unit in described heating analogue means is also for controlling the cut-out of the linear power supply in described heating analogue means.
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| CN106093797B (en) * | 2016-08-17 | 2020-03-06 | 北京新能源汽车股份有限公司 | Battery temperature field simulation device and system and verification method for battery thermal management |
| CN107589142A (en) * | 2017-07-28 | 2018-01-16 | 天津源达日化股份有限公司 | A kind of method for rapidly testing applied to heating power patch batch mixing heating property |
| CN109188237A (en) * | 2018-06-12 | 2019-01-11 | 中车大连电力牵引研发中心有限公司 | Heat dissipation for circuit board emulation component |
| CN109582552A (en) * | 2018-10-31 | 2019-04-05 | 山东超越数控电子股份有限公司 | A kind of simulating test device of CPU heat dissipation capacity |
| CN110673015A (en) * | 2019-09-28 | 2020-01-10 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Test method for simulating heating power and surface temperature of chip |
| CN110673015B (en) * | 2019-09-28 | 2021-09-03 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Test method for simulating heating power and surface temperature of chip |
| US20230229209A1 (en) * | 2020-09-08 | 2023-07-20 | Inspur Suzhou Intelligent Technology Co., Ltd. | Heat dissipation control method, apparatus and device |
| US11853135B2 (en) * | 2020-09-08 | 2023-12-26 | Inspur Suzhou Intelligent Technology Co., Ltd. | Heat dissipation control method, apparatus and device |
| CN112268924A (en) * | 2020-10-19 | 2021-01-26 | 郑州轻冶科技股份有限公司 | Detection method and detection system for heat pipe exchanger |
| CN114325343A (en) * | 2021-12-31 | 2022-04-12 | 山石网科通信技术股份有限公司 | Method and device for simulating heat dissipation of mainboard system |
| CN115064044A (en) * | 2022-08-05 | 2022-09-16 | 南昌三瑞智能科技有限公司 | Motor heating simulation and control assembly and experimental method |
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