CN105062201B - LED flexible printed-circuit boards white encapsulated membranes ink and preparation method thereof - Google Patents
LED flexible printed-circuit boards white encapsulated membranes ink and preparation method thereof Download PDFInfo
- Publication number
- CN105062201B CN105062201B CN201510478788.1A CN201510478788A CN105062201B CN 105062201 B CN105062201 B CN 105062201B CN 201510478788 A CN201510478788 A CN 201510478788A CN 105062201 B CN105062201 B CN 105062201B
- Authority
- CN
- China
- Prior art keywords
- ink
- encapsulated membranes
- white
- flexible printed
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to a kind of LED flexible printed-circuit boards new white encapsulated membranes ink and preparation method thereof.A kind of LED flexible printed-circuit boards are with new white encapsulated membranes ink, it is characterised in that the mass fraction proportioning of each component is：18.3 25.1 parts of diallyl epoxy resin, 1.88 5.1 parts of bimaleimide resin, 2.07 3.9 parts of ethylene-acrylate rubber, 1.45 2.6 parts of polyethers amine hardener, 17.1 23.6 parts of pigment, 0.85 1.45 parts of inorganic filler, 0.19 0.34 parts of dispersant, 44.0 56.4 parts of organic solvent.White encapsulated membranes prepared by the ink have that high covering power, high-flexibility, tack are strong, whiteness is high, reflectance good, the high temperature excellent performance of resistance to scaling powder (resistance to scaling powder performance is qualified under the conditions of 288 DEG C/10s), are adapted to production of the LED flex circuit applications with white encapsulated membranes.
Description
Technical field
It is more particularly to a kind of to be applied to LED flexible printed wiring boards white the present invention relates to a kind of white thermosetting ink
Encapsulated membranes ink, category electronic chemical product field.
Background technology
With the development in market, LED flex circuit applications are not only used to produce LED, also for producing automobile lamp, instrument
Table.Due to appearance requirement more and more higher of the market to automobile, also increasingly beautiful, light, thin, brightness is high for the requirement of car light, long lifespan,
The use of FPC patch LED car lamps is increasingly popularized.Current white FPC is essentially all by using white encapsulated membranes pressing and forming
Circuit soft plate produce, because there is the factors, mesh such as the unstable, environmental pollution of outward appearance in the white encapsulated membranes ink of silk-screen printing
The way of preceding main flow is that white encapsulated membranes ink is coated on Kapton using coating machine, is given birth to using production line scale
Production not only contributes to the management and control of quality, can be with centralized recovery solvent, it is to avoid the infringement to operating personnel and environment.
Being currently used for producing the special white encapsulated membranes ink of white encapsulated membranes has hydroxyl cure type and epoxy curing type.
Such as white encapsulated membranes ink in patent CN102079959A, CN102079956A, CN102532996A, CN102731743A
All it is the polyester or acrylate for having used hydroxyl, reuses isocyanates and be heating and curing to form white coating.
CN103923439A is that white coating is prepared using resin based on epoxy curing systems, and CN103192572A is then by epoxy
System and polyester system, which are put together, to be used, to reach required physical property, but above-mentioned patent is not all referred under the high temperature conditions
The performance of resistance to scaling powder.Theoretically, resistance to scaling powder is surveyed under the conditions of 288 DEG C/10s of the more difficult satisfaction of above-mentioned hydroxyl cure agent coating
Examination, curable epoxide type wants more superior, but two-sided all toughness after CN103923439A coatings, it is adaptable to glued membrane.In FPC life
Produce in process, welding process is essential, particularly present pb-free solder, and high-temperature region is up to 270 DEG C.In solder paste melts,
Scaling powder then starts to flow to pad peripheral, under conditions of high temperature, and the erosiveness to white coating is greatly reinforced, and can cause
Ordinary white coating changes colour, come off.
The content of the invention
It is an object of the invention to provide a kind of LED flexible printed-circuit boards white encapsulated membranes ink and its preparation side
Method.White encapsulated membranes prepared by the ink have that high covering power, high-flexibility, tack are strong, whiteness is high, reflectance good, high temperature
The excellent performance of resistance to scaling powder (resistance to scaling powder performance is qualified under the conditions of 288 DEG C/10s), is adapted to LED flex circuit applications and is wrapped with white
The production of sealer.
A kind of LED flexible printed-circuit boards white encapsulated membranes ink, it is characterised in that the mass fraction proportioning of each component
For：
By such scheme, the diallyl epoxy resin chemistry structural formula such as formula (I):
Formula (I):
Wherein, R1Represent：-CH2- CH=CH2, R2Represent：This diallyl epoxy resin epoxy value
For 0.28-0.34.
By such scheme, the synthetic method of diallyl epoxy resin is：Diallyl bisphenol is normal with solvent normal propyl alcohol
Warm stirring and dissolving, after the completion of dissolving, is reacted under conditions of sodium hydroxide presence with epoxychloropropane.
By such scheme, reaction temperature is 90-94 DEG C, and the reaction time is 2.0-2.5 hours.
By such scheme, after diallyl bisphenol is dissolved with solvent normal propyl alcohol stirring at normal temperature, sodium hydroxide is first added,
Reacted 0.5-1.0 hours under the conditions of 60-65 DEG C, then add epoxychloropropane, reacted.Sodium hydroxide is used as two allyls
The catalyst of base bisphenol-A and epichlorohydrin reaction, can carry out ring-closure reaction by dehydrochlorination simultaneously in follow-up reaction.
By such scheme, described post processing is after product is washed, then carries out vacuum distillation and remove solvent and unreacted
Complete epoxychloropropane.
By such scheme, the BMI include be N, N ' -4,4 '-diphenyl methane dimaleimide, N, N ' -
One kind or mixture of 4,4 '-Diphenyl Ether Bismaleimide.N, N ' -4,4 '-diphenyl methane dimaleimide can select flood
The BMI-01 of lake span.The synthetic method of N, N ' -4,4 '-Diphenyl Ether Bismaleimide is referred to：《Diaminodiphenyl ether span
Carry out imido synthetic method with characterizing》, Chen Wen, Liu Jingmin, dragon be warm etc., and insulating materials, 2008,41 (2) are synthesized.
By such scheme, the polyethers amine hardener is the graceful JEFFAMINE D-230 of Hensel.
By such scheme, described ethylene-acrylate rubber is the ethylene-acrylate rubber containing epoxide group, can
From DENKA ER5300.
By such scheme, described pigment is rutile type titanium white, and average grain diameter is 0.23-0.36 microns, be can select
The trade mark have Du Pont R-103, R-706.
By such scheme, described inorganic filler includes at least one of aluminium hydroxide, aerosil.
By such scheme, described organic solvent two kinds or more of the mixture in acetone, butanone, butyl acetate.
By such scheme, optional dispersant has BYK-110, BYK-161 of BYK companies etc..
The LED flex circuit applications white encapsulated membranes that above-mentioned LED flexible printed-circuit boards are prepared with white encapsulated membranes ink.
Above-mentioned LED flexible printed-circuit boards are as follows with the preparation method of white encapsulated membranes ink：First by diallyl epoxy
Resin carries out pre-polymerization with bimaleimide resin under conditions of heating, then prepolymer is fully molten with a part of organic solvent
Xie Hou, adds pigment, inorganic filler, dispersant, ER5300 organic solvent solution and remaining organic solvent, through fully dispersed
Afterwards, grinding filtering, collects filtrate, then adds polyethers amine hardener, stirs, and obtains LED flexible printed-circuit boards and uses white
Color encapsulated membranes ink.
By such scheme, described pre-polymerization temperature is that the pre-polymerization time is 15-30 minutes at 120-130 DEG C.
Above-mentioned LED flexible printed-circuit boards are as follows with the preparation method of white encapsulated membranes：LED flexible printed-circuit boards are used
White encapsulated membranes ink is applied on Kapton by coating machine, in 80 DEG C~140 DEG C dry out solvent, makes to apply after drying
The coating layer thickness of cloth is 10~25 μm, is then solidified 5~10 minutes under the conditions of 160 ± 5 DEG C, then in the another side of polyimides
Separated type material is combined after coating encapsulating adhesive, dry out solvent, the white encapsulated membranes of LED flex circuit applications are produced.
White encapsulated membranes prepared by the ink have that high covering power, high-flexibility, tack are strong, whiteness is high, reflectance good,
The high temperature excellent performance of resistance to scaling powder (resistance to scaling powder performance is qualified under the conditions of 288 DEG C/10s), is adapted to LED flex circuit applications with vain
The production of color encapsulated membranes.The encapsulated membranes are particularly suitable for use in pb-free solder, LED type FPC is produced with this white encapsulated membranes, it is to avoid weldering
Disk is intensive, manual welding and white coating comes off during more soldering paste, improves wiring board outward appearance and qualification rate.
Embodiment
In the following embodiments, each component consumption such as table 1 being related in the process for preparation of white encapsulated membranes ink used
Shown, the performance of each embodiment is as shown in table 2.
Embodiment 1
The formula of white encapsulated membranes ink is as shown in embodiment 1 in table 1.Proportional quantity is added first in 10L container
Diallyl epoxy resin, bimaleimide resin, react 30 minutes under conditions of 120 DEG C, add after the cooling of question response thing
Enter a part of mixed solvent to be dissolved.Again by above-mentioned lysate and pigment, inorganic filler, dispersant, ER5300 it is organic molten
Agent solution, remaining mixed solvent are added in 50L container together, after high-speed stirred is uniform at room temperature, pour into ball mill
Middle grinding 48h.Lapping liquid is filtered by 300 mesh filter screens after the completion of grinding, polyethers amine hardener is finally added in filtrate, is stirred
Mix uniform, be made into the white encapsulated membranes ink of coating.
Above-mentioned white encapsulated membranes ink is coated on Kapton with coating machine, by 80 DEG C~140 DEG C segmentations
The coating of 25 μm of formation after formula drying tunnel, then through being handled 10 minutes in 160 ± 5 DEG C of drying tunnel, then in the another of Kapton
Separated type material is combined after simultaneously applying the special adhesive of encapsulated membranes, dry out solvent, that is, is prepared into LED flex circuit applications white
Encapsulated membranes.
The encapsulated membranes separated type material is removed and fitted afterwards with the copper face of flexibility coat copper plate, under the conditions of 10MPa, 170 DEG C, soon
Sample is made for 2 minutes in pressure, then is prepared within 60 minutes LED flex circuit application samples, the performance test results by 160 ± 5 DEG C of bakings
See attached list 2.
Embodiment 2
The formula of white encapsulated membranes ink is as shown in embodiment 2 in table 1.Proportional quantity is added first in 10L container
Diallyl epoxy resin, bimaleimide resin, react 15 minutes under conditions of 130 DEG C, add after the cooling of question response thing
Enter the dark bonding solvent of a part to be dissolved.Again by above-mentioned lysate and pigment, inorganic filler, dispersant, ER5300 it is organic
Solvent solution, remaining mixed solvent are added in 50L container together, after high-speed stirred is uniform at room temperature, pour into ball milling
48h is ground in machine.Lapping liquid is filtered by 300 mesh filter screens after the completion of grinding, polyethers amine hardener is finally added in filtrate,
Stir, be made into the white encapsulated membranes ink of coating.
Above-mentioned white encapsulated membranes ink is coated on Kapton with coating machine, by 80 DEG C~140 DEG C segmentations
The coating of 10 μm of formation after formula drying tunnel, then through being handled 5 minutes in 160 ± 5 DEG C of drying tunnel, then in the another of Kapton
Separated type material is combined after the special adhesive of face coating encapsulated membranes, dry out solvent, that is, is prepared into LED flex circuit applications white bag
Sealer.
The encapsulated membranes separated type material is removed and fitted afterwards with the copper face of flexibility coat copper plate, under the conditions of 10MPa, 170 DEG C, soon
Sample is made for 2 minutes in pressure, then is prepared within 60 minutes LED flex circuit application samples, the performance test results by 160 ± 5 DEG C of bakings
See attached list 2.
Embodiment 3
The formula of white encapsulated membranes ink is as shown in embodiment 3 in table 1.Proportional quantity is added first in 10L container
Diallyl epoxy resin, bimaleimide resin, react 20 minutes under conditions of 125 DEG C, add after the cooling of question response thing
Enter the dark bonding solvent of a part to be dissolved.Again by above-mentioned lysate and pigment, inorganic filler, dispersant, ER5300 it is organic
Solvent solution, remaining mixed solvent are added in 50L container together, after high-speed stirred is uniform at room temperature, pour into ball milling
48h is ground in machine.Lapping liquid is filtered by 300 mesh filter screens after the completion of grinding, polyethers amine hardener is finally added in filtrate,
Stir, be made into the white encapsulated membranes ink of coating.
Above-mentioned white encapsulated membranes ink is coated on Kapton with coating machine, by 80 DEG C~140 DEG C segmentations
The coating of 15 μm of formation after formula drying tunnel, then through being handled 5~10 minutes in 160 ± 5 DEG C of drying tunnel, then in Kapton
Separated type material is combined after the special adhesive of another side coating encapsulated membranes, dry out solvent, that is, is prepared into LED flex circuit applications with vain
Color encapsulated membranes.
The encapsulated membranes separated type material is removed and fitted afterwards with the copper face of flexibility coat copper plate, under the conditions of 10MPa, 170 DEG C, soon
Sample is made for 2 minutes in pressure, then is prepared within 60 minutes LED flex circuit application samples, the performance test results by 160 ± 5 DEG C of bakings
See attached list 2.
Embodiment 4
The formula of white encapsulated membranes ink is as shown in embodiment 4 in table 1.Proportional quantity is added first in 10L container
Diallyl epoxy resin, bimaleimide resin, react 27 minutes under conditions of 123 DEG C, add after the cooling of question response thing
Enter a part of mixed solvent to be dissolved.Again by above-mentioned lysate and pigment, inorganic filler, dispersant, ER5300 it is organic molten
Agent solution, remaining mixed solvent are added in 50L container together, after high-speed stirred is uniform at room temperature, pour into ball mill
Middle grinding 48h.Lapping liquid is filtered by 300 mesh filter screens after the completion of grinding, polyethers amine hardener is finally added in filtrate, is stirred
Mix uniform, be made into the white encapsulated membranes ink of coating.
Above-mentioned white encapsulated membranes ink is coated on Kapton with coating machine, by 80 DEG C~140 DEG C segmentations
The coating of 20 μm of formation after formula drying tunnel, then through being handled 5~10 minutes in 160 ± 5 DEG C of drying tunnel, then in Kapton
Separated type material is combined after the special adhesive of another side coating encapsulated membranes, dry out solvent, that is, is prepared into LED flex circuit applications with vain
Color encapsulated membranes.
The encapsulated membranes separated type material is removed and fitted afterwards with the copper face of flexibility coat copper plate, under the conditions of 10MPa, 170 DEG C, soon
Sample is made for 2 minutes in pressure, then is prepared within 60 minutes LED flex circuit application samples, the performance test results by 160 ± 5 DEG C of bakings
See attached list 2.
Embodiment 5
The formula of white encapsulated membranes ink is as shown in embodiment 5 in table 1.Proportional quantity is added first in 10L container
Diallyl epoxy resin, bimaleimide resin, react 20 minutes under conditions of 125 DEG C, add after the cooling of question response thing
Enter a part of mixed solvent to be dissolved.Again by above-mentioned lysate and pigment, inorganic filler, dispersant, ER5300 it is organic molten
Agent solution, remaining mixed solvent are added in 50L container together, after high-speed stirred is uniform at room temperature, pour into ball mill
Middle grinding 48h.Lapping liquid is filtered by 300 mesh filter screens after the completion of grinding, polyethers amine hardener is finally added in filtrate, is stirred
Mix uniform, be made into the white encapsulated membranes ink of coating.
Above-mentioned white encapsulated membranes ink is coated on Kapton with coating machine, by 80 DEG C~140 DEG C segmentations
The coating of 15 μm of formation after formula drying tunnel, then through being handled 5~10 minutes in 160 ± 5 DEG C of drying tunnel, then in Kapton
Separated type material is combined after the special adhesive of another side coating encapsulated membranes, dry out solvent, that is, is prepared into LED flex circuit applications with vain
Color encapsulated membranes.
The encapsulated membranes separated type material is removed and fitted afterwards with the copper face of flexibility coat copper plate, under the conditions of 10MPa, 170 DEG C, soon
Sample is made for 2 minutes in pressure, then is prepared within 60 minutes LED flex circuit application samples, the performance test results by 160 ± 5 DEG C of bakings
See attached list 2.
Embodiment 6
The formula of white encapsulated membranes ink is as shown in embodiment 6 in table 1.Proportional quantity is added first in 10L container
Diallyl epoxy resin, bimaleimide resin, 17 clocks are reacted under conditions of 128 DEG C, are added after the cooling of question response thing
A part of mixed solvent is dissolved.Again by above-mentioned lysate and pigment, inorganic filler, dispersant, ER5300 organic solvent
Solution, remaining mixed solvent are added in 50L container together, after high-speed stirred is uniform at room temperature, are poured into ball mill
Grind 48h.Lapping liquid is filtered by 300 mesh filter screens after the completion of grinding, polyethers amine hardener, stirring are finally added in filtrate
Uniformly, it is made into the white encapsulated membranes ink of coating.
Above-mentioned white encapsulated membranes ink is coated on Kapton with coating machine, by 80 DEG C~140 DEG C segmentations
The coating of 13 μm of formation after formula drying tunnel, then through being handled 5~10 minutes in 160 ± 5 DEG C of drying tunnel, then in Kapton
Separated type material is combined after the special adhesive of another side coating encapsulated membranes, dry out solvent, that is, is prepared into LED flex circuit applications with vain
Color encapsulated membranes.
The encapsulated membranes separated type material is removed and fitted afterwards with the copper face of flexibility coat copper plate, under the conditions of 10MPa, 170 DEG C, soon
Sample is made for 2 minutes in pressure, then is prepared within 60 minutes LED flex circuit application samples, the performance test results by 160 ± 5 DEG C of bakings
See attached list 2.
Embodiment 7
The formula of white encapsulated membranes ink is as shown in embodiment 7 in table 1.Proportional quantity is added first in 10L container
Diallyl epoxy resin, bimaleimide resin, react 20 minutes under conditions of 125 DEG C, add after the cooling of question response thing
Enter a part of mixed solvent to be dissolved.Again by above-mentioned lysate and pigment, inorganic filler, dispersant, ER5300 it is organic molten
Agent solution, remaining mixed solvent are added in 50L container together, after high-speed stirred is uniform at room temperature, pour into ball mill
Middle grinding 48h.Lapping liquid is filtered by 300 mesh filter screens after the completion of grinding, polyethers amine hardener is finally added in filtrate, is stirred
Mix uniform, be made into the white encapsulated membranes ink of coating.
Above-mentioned white encapsulated membranes ink is coated on Kapton with coating machine, by 80 DEG C~140 DEG C segmentations
The coating of 16 μm of formation after formula drying tunnel, then through being handled 5~10 minutes in 160 ± 5 DEG C of drying tunnel, then in Kapton
Separated type material is combined after the special adhesive of another side coating encapsulated membranes, dry out solvent, that is, is prepared into LED flex circuit applications with vain
Color encapsulated membranes.
The encapsulated membranes separated type material is removed and fitted afterwards with the copper face of flexibility coat copper plate, under the conditions of 10MPa, 170 DEG C, soon
Sample is made for 2 minutes in pressure, then is prepared within 60 minutes LED flex circuit application samples, the performance test results by 160 ± 5 DEG C of bakings
See attached list 2.
Table 1:White encapsulated membranes ink formulations component table
Table 2：LED flex circuit applications white encapsulated membranes performance test table
Note：1. whiteness test uses full-automatic 012 leucometer 10 of WSB-L types；1210121012101210121012
2. resistance to scaling powder test is to press white encapsulated membranes after wiring board, after being handled through 160 DEG C/1h, add at pad
Enter soldering paste, after being handled under conditions of 288 DEG C, 10s, butanone is dipped in soft bristle tooth brush by the scaling powder composition of the yellow beside pad
Wipe out, do not fallen off with the nondiscolouring of white coating surface, coating be considered as it is qualified.
The synthesis of above-mentioned diallyl epoxy resin can use following synthetic method：By diallyl bisphenol with solvent just
Propyl alcohol stirring at normal temperature dissolves, after the completion of dissolving, the sodium hydrate aqueous solution that 2130g concentration is 15.4% is added dropwise, in 60 DEG C of conditions
Lower reaction 1 hour.Then 1350ml epoxychloropropane is added into flask again, is reacted 2 hours under the conditions of 94 DEG C, post processing
Produce diallyl epoxy resin.
Above-mentioned dispersant can select BYK-110, BYK-161 of BYK companies etc..
Claims (9)
1. a kind of LED flexible printed-circuit boards white encapsulated membranes ink, it is characterised in that the mass fraction proportioning of each component
For：
The chemical structural formula such as formula (I) of the diallyl epoxy resin:
Formula (I):
Wherein, R1Represent：-CH2- CH=CH2, R2Represent：This diallyl epoxy resin epoxy value is
0.28-0.34。
2. LED flexible printed-circuit boards according to claim 1 white encapsulated membranes ink, it is characterised in that：It is described double
Maleimide is N, N ' -4,4 '-diphenyl methane dimaleimide, N, one kind of N ' -4,4 '-Diphenyl Ether Bismaleimide
Or mixture.
3. LED flexible printed-circuit boards according to claim 1 white encapsulated membranes ink, it is characterised in that：It is described poly-
Ether amines curing agent is the graceful JEFFAMINE D-230 of Hensel.
4. LED flexible printed-circuit boards according to claim 1 white encapsulated membranes ink, it is characterised in that：Described
Ethylene-acrylate rubber is the ethylene-acrylate rubber containing epoxide group.
5. LED flexible printed-circuit boards according to claim 1 white encapsulated membranes ink, it is characterised in that：Described
Pigment is rutile type titanium white, and average grain diameter is 0.23-0.36 microns；Described inorganic filler includes aluminium hydroxide, gas phase
At least one of silica；Described dispersant has BYK-110, BYK-161 of BYK companies；Described organic solvent choosing
From two kinds or more in acetone, butanone, butyl acetate of mixture.
6. the LED flexibility circuits that a kind of LED flexible printed-circuit boards as claimed in claim 1 are prepared with white encapsulated membranes ink
Plate white encapsulated membranes.
7. the LED flexible printed-circuit boards as claimed in claim 1 preparation method of white encapsulated membranes ink, its feature exists
In step is：Diallyl epoxy resin and bimaleimide resin are first subjected to pre-polymerization under conditions of heating, then will be pre-
After polymers is fully dissolved with a part of organic solvent, adding pigment, inorganic filler, dispersant, ethylene-acrylate rubber has
Machine solvent solution and remaining organic solvent, after fully dispersed, filtrate is collected in grinding filtering, then adds polyetheramine solidification
Agent, stirs, and obtains the white encapsulated membranes ink of LED flexible printed-circuit boards.
8. the LED flexible printed-circuit boards according to claim 7 preparation method of white encapsulated membranes ink, its feature exists
In：Pre-polymerization temperature is that the pre-polymerization time is 15-30 minutes at 120-130 DEG C.
9. a kind of LED flexible printed-circuit boards as claimed in claim 6 preparation method of white encapsulated membranes, its feature exists
In：Step is：LED flexible printed-circuit boards are applied on Kapton with white encapsulated membranes ink by coating machine,
In 80 DEG C~140 DEG C dry out solvent, it is 10~25 μm to make the coating layer thickness being coated with after drying, then solid under the conditions of 160 ± 5 DEG C
Change 5~10 minutes, then separated type material is combined after the another side coating encapsulating adhesive of polyimides, dry out solvent, produce LED
Flex circuit application white encapsulated membranes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510478788.1A CN105062201B (en) | 2015-08-07 | 2015-08-07 | LED flexible printed-circuit boards white encapsulated membranes ink and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510478788.1A CN105062201B (en) | 2015-08-07 | 2015-08-07 | LED flexible printed-circuit boards white encapsulated membranes ink and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105062201A CN105062201A (en) | 2015-11-18 |
| CN105062201B true CN105062201B (en) | 2017-09-15 |
Family
ID=54491736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510478788.1A Active CN105062201B (en) | 2015-08-07 | 2015-08-07 | LED flexible printed-circuit boards white encapsulated membranes ink and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105062201B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115141511A (en) * | 2022-08-10 | 2022-10-04 | 江西锦荣新材料有限公司 | High-temperature-resistant white ink and LED substrate made of same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101481490A (en) * | 2009-01-19 | 2009-07-15 | 东莞联茂电子科技有限公司 | Thermosetting resin composition and use |
| CN101792626A (en) * | 2009-01-30 | 2010-08-04 | 株式会社东进世美肯 | Ink composition for forming organic insulating film suitable for roll printing method |
| CN102732096A (en) * | 2012-07-10 | 2012-10-17 | 依利安达电子（昆山）有限公司 | Halogen-free flame-retardant solvent-free double-curing ink composition and preparation method thereof |
| CN103923439A (en) * | 2014-04-08 | 2014-07-16 | 广东生益科技股份有限公司 | White resin composition and method for preparing white coating by using white resin composition |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010013558A (en) * | 2008-07-03 | 2010-01-21 | Toyobo Co Ltd | Photocurable or heat-curable resin composition, photocurable or heat-curable layer, ink, adhesive and printed circuit board |
-
2015
- 2015-08-07 CN CN201510478788.1A patent/CN105062201B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101481490A (en) * | 2009-01-19 | 2009-07-15 | 东莞联茂电子科技有限公司 | Thermosetting resin composition and use |
| CN101792626A (en) * | 2009-01-30 | 2010-08-04 | 株式会社东进世美肯 | Ink composition for forming organic insulating film suitable for roll printing method |
| CN102732096A (en) * | 2012-07-10 | 2012-10-17 | 依利安达电子（昆山）有限公司 | Halogen-free flame-retardant solvent-free double-curing ink composition and preparation method thereof |
| CN103923439A (en) * | 2014-04-08 | 2014-07-16 | 广东生益科技股份有限公司 | White resin composition and method for preparing white coating by using white resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105062201A (en) | 2015-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101585955B (en) | Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil | |
| CN101845287B (en) | Intermediate temperature-cured epoxy adhesive for coverlay of flexible printed circuit and preparation method thereof | |
| CN107674388B (en) | Halogen-free resin composition and glue film prepared therefrom, cover film and copper-clad plate | |
| CN101142253A (en) | Epoxy resin, epoxy resin composition, and utilizing the same, prepreg and laminated plate | |
| WO2006090794A1 (en) | Latent hardener for epoxy resin and epoxy resin composition | |
| CN104388029A (en) | Normal-temperature-curing epoxy resin flexible pouring sealant | |
| CN101291972A (en) | Epoxy resin, curable resin composition, and cured product thereof | |
| WO2019010871A1 (en) | Photosensitive cover film and preparation method therefor, and photosensitive cover film product | |
| CN101591518A (en) | A kind of modified by silsesquioxane for flexible copper clad laminate high temperature resistant epoxy adhesive | |
| CN109795188A (en) | A kind of copper-clad plate and preparation method thereof with good heat resistance | |
| CN103923590B (en) | A kind of black-colored resin composition and prepare the method for black glued membrane with this resin combination | |
| CN102311612A (en) | Resin composition and resin coated copper foil made of same | |
| CN105073820A (en) | Thermosetting resin composition | |
| CN107353777A (en) | It is electromagnetically shielded the preparation method of membrane coat and electromagnetic shielding film | |
| CN109517433A (en) | High covering UV ink that can be recoated and its preparation method and application | |
| CN103013326A (en) | Coating for LDS (Laser Direct Structuring) plastic component and preparation technology thereof | |
| CN103694639B (en) | A kind of Halogen ageing-resistant epoxy resin composition and prepare the method for mulch film with this resin combination | |
| CN105062201B (en) | LED flexible printed-circuit boards white encapsulated membranes ink and preparation method thereof | |
| CN103923439B (en) | A kind of white resin composition and prepare the method for white glued membrane with this resin combination | |
| CN101440266B (en) | Surface mount adhesive for surface mount technology and preparation method thereof | |
| CN101400715B (en) | Liquid epoxy resin composition and adhesive using same | |
| CN109749686A (en) | A kind of compound black adhesive and preparation method thereof of lithium battery aluminum-plastic film | |
| CN103571267A (en) | Printing ink with high adhesive force | |
| CN103781860A (en) | Liquid ink | |
| CN110408350A (en) | A kind of UV glue and preparation method thereof for encapsulation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210730 Address after: 436070 light steel plant 2, No. 2 Industrial Zone, Gedian Development Zone, Ezhou City, Hubei Province Patentee after: Huashuo electronic materials (Wuhan) Co.,Ltd. Address before: 430074 No.30 Guanggu street, Guanshan Road, Hongshan District, Wuhan City, Hubei Province Patentee before: HAISO TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |