CN105050320A - Circuit structure for high-density printed circuit board (PCB) - Google Patents
Circuit structure for high-density printed circuit board (PCB) Download PDFInfo
- Publication number
- CN105050320A CN105050320A CN201510479000.9A CN201510479000A CN105050320A CN 105050320 A CN105050320 A CN 105050320A CN 201510479000 A CN201510479000 A CN 201510479000A CN 105050320 A CN105050320 A CN 105050320A
- Authority
- CN
- China
- Prior art keywords
- pcb
- conductor layer
- hole
- measuring point
- circuit structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention is suitable for the field of computers, and provides a circuit structure for a high-density printed circuit board (PCB). The circuit structure comprises a ball grid array-packaged electron device, wherein a measuring point is arranged at the position of a through hole in a PCB wiring region below the ball grid array-packaged electron device; the PCB around a conductor layer at one end of the through hole is covered with a solder resist layer; the through hole is fully filled with the solder resist layer and is exposed out of the outer ring part of the conductor layer at one end of the through hole to form the measuring point; and the conductor layer at the other end of the through hole and the PCB around the conductor layer are covered with the solder resist layer. According to the circuit structure, the measuring point is arranged in the through hole in the back surface of a ball grid array (BGA) electron device, so that the area of the PCB is reduced under the condition that the PCB is finite in area and relatively high in integration level; testing of a circuit is facilitated; and meanwhile, the signal quality of a PCB circuit is not affected.
Description
Technical field
The application belongs to computer realm, particularly relates to a kind of circuit structure for High density of PCB plate.
Background technology
In PCB circuit, for improving the performance of finished product rate and checking product, the test link of PCB is indispensable, for BGA (BallGridArray in PCB circuit, ball grid array) electronic device that encapsulates, common method of testing arranges measuring point on pcb board, by measuring point to complete the measurement to main signal.But along with electronic product integrated level increase, the electronic device in pcb board unit are and wiring more and more intensive, the requirement of signal quality, speed is also strict all the more.Because each measuring point can take certain PCB area, thus for the higher PCB circuit of density ratio, when PCB surface amass limited or line signal quality requirement is higher, do not allowed any bracing wire of circuit designer to add measuring point.Therefore, amass for reaching saving PCB surface, rationally arrange measuring point, and do not affect signal quality, to facilitate the correct test of each road signal for BGA package electronic device, being one has technical problem to be solved.
Summary of the invention
The main purpose of the application is to provide a kind of circuit structure for High density of PCB plate, is intended to solve the problem mentioned in background technology.
The application is achieved in that a kind of circuit structure for High density of PCB plate, comprises BGA Package electronic device, and the hole site of crossing in the PCB layout region below described BGA Package electronic device arranges measuring point; PCB around the conductor layer of described via hole one end is covered by solder mask, and described via hole is entirely filled in by solder mask and exposed the outer perimeter section of the conductor layer of described via hole one end, forms described measuring point;
PCB around the conductor layer of the described via hole other end and conductor layer thereof is covered by solder mask.
Further, the shape of described measuring point is annular.
Further, the width of described annular is not less than 4mil
Measuring point is set by the hole site of crossing in the PCB layout region below BGA electronic device, makes when pcb board limited area, integrated level are higher, save PCB surface and amass, facilitate the test of circuit, do not affect PCB circuit signal quality simultaneously.
Accompanying drawing explanation
Fig. 1 is the pcb board electrical block diagram that the embodiment of the present application provides.
Embodiment
In order to make the object of the application, principle and advantage clearly understand, below in conjunction with drawings and Examples, the application is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the application, and be not used in restriction the application.
For the circuit structure of High density of PCB plate in the embodiment of the application, comprise BGA Package electronic device, and the hole site of crossing in PCB layout region below described BGA Package electronic device arranges measuring point; PCB around the conductor layer of described via hole one end is covered by solder mask, and described via hole is entirely filled in by solder mask and exposed the outer perimeter section of the conductor layer of described via hole one end, forms described measuring point; PCB around the conductor layer of the described via hole other end and conductor layer thereof is covered by solder mask.
Fig. 1 shows the application one embodiment, as shown in Figure 1: on pcb board 3, be provided with via hole 1, described via hole 1 for the connection between pcb board 3 different layers, in the present embodiment, conductor layer is layers of copper, and sidewall and the upper and lower side fringe region of described via hole 1 are provided with layers of copper 4.Pcb board 3 around the top layers of copper 4 of via hole 1, cover by solder mask 2, described solder mask 2 can be green oil.
For bottom layers of copper 4 and the pcb board 3 around thereof of via hole 1, covered by solder mask 2.Meanwhile, whole via hole 1 is filled in process entirely by solder mask, to prevent in PCB processing procedure, and the problem of BGA device circuit rosin joint.Layers of copper 4 part on via hole 1 top, its layers of copper 4 center fraction is covered by solder mask 2 together with top via hole 1 region, exposes the part layers of copper 5 of outer perimeter section, forms the measuring point on pcb board 3.Part layers of copper 5 shape exposed is annular, and its width D is not less than 4mil.
In the particular embodiment, BGA electronic device is arranged on the side of pcb board 3, and described measuring point is arranged on the opposite side of pcb board 3 region corresponding with BGA electronic device.
By arranging measuring point on via hole 1, make, in small size or the very high PCB circuit design of integrated level, to save the area of pcb board.Meanwhile, this measuring point can be arranged on the back side of bga device, saves PCB circuit, facilitates the test of circuit, does not affect PCB circuit signal quality simultaneously.The foregoing is only the preferred embodiment of the application, not in order to limit the application, any amendment done within all spirit in the application and principle, equivalently to replace and improvement etc., within the protection range that all should be included in the application.
Claims (3)
1. for a circuit structure for High density of PCB plate, comprise BGA Package electronic device, it is characterized in that, the hole site of crossing in the PCB layout region below described BGA Package electronic device arranges measuring point; PCB around the conductor layer of described via hole one end is covered by solder mask, and described via hole is entirely filled in by solder mask and exposed the outer perimeter section of the conductor layer of described via hole one end, forms described measuring point; PCB around the conductor layer of the described via hole other end and conductor layer thereof is covered by solder mask.
2. a kind of circuit structure for High density of PCB plate as claimed in claim 1, is characterized in that, the shape of described measuring point is annular.
3. a kind of circuit structure for High density of PCB plate as claimed in claim 2, it is characterized in that, the width of described annular is not less than 4mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510479000.9A CN105050320A (en) | 2015-07-31 | 2015-07-31 | Circuit structure for high-density printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510479000.9A CN105050320A (en) | 2015-07-31 | 2015-07-31 | Circuit structure for high-density printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105050320A true CN105050320A (en) | 2015-11-11 |
Family
ID=54456380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510479000.9A Pending CN105050320A (en) | 2015-07-31 | 2015-07-31 | Circuit structure for high-density printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105050320A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446328A (en) * | 2019-07-30 | 2019-11-12 | 武汉精立电子技术有限公司 | A kind of pcb board and its manufacturing method |
-
2015
- 2015-07-31 CN CN201510479000.9A patent/CN105050320A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446328A (en) * | 2019-07-30 | 2019-11-12 | 武汉精立电子技术有限公司 | A kind of pcb board and its manufacturing method |
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| C06 | Publication | ||
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| DD01 | Delivery of document by public notice |
Addressee: Chen Jianguo Document name: Notification of Passing Preliminary Examination of the Application for Invention |
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| DD01 | Delivery of document by public notice |
Addressee: Chen Jianguo Document name: Notification of Publication of the Application for Invention |
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| DD01 | Delivery of document by public notice |
Addressee: Chen Jianguo Document name: Notification of before Expiration of Request of Examination as to Substance |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151111 |
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| WD01 | Invention patent application deemed withdrawn after publication |