CN105023857B - Nude film pickup unit including its nude film engagement equipment and nude film joint method - Google Patents
Nude film pickup unit including its nude film engagement equipment and nude film joint method Download PDFInfo
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- CN105023857B CN105023857B CN201510214675.0A CN201510214675A CN105023857B CN 105023857 B CN105023857 B CN 105023857B CN 201510214675 A CN201510214675 A CN 201510214675A CN 105023857 B CN105023857 B CN 105023857B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
- H01L2224/861—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB] the connector being supplied to the parts to be connected in the bonding apparatus
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to nude film pickup unit, it includes supporting plate, ejection part, at least one inversion pick-up part, inspects part and inspect driving part.The supporting plate support includes the chip of multiple nude films.The ejection part is arranged in the lower section of the supporting plate, and each in nude film described in ejection.The top that the supporting plate is arranged in and is inverted pick-up part, picks up the nude film of the ejection, and with the rotary part for the nude film for being used to be inverted the pickup.The top inspected part and be arranged in the supporting plate, and detect the position for being intended to the nude film by the inversion pick-up part pickup.It is described inspect driving part be connected to it is described inspect part, and it is mobile described in inspect part, to detect the position of then another to be picked up nude film when the inversion pick-up part picks up the nude film of the ejection.
Description
Technical field
Method the present invention relates to nude film pickup unit including its nude film engagement equipment and for engaging nude film, more
In particular it relates to for the pick device for picking up each multiple from the nude film of chip sawing including the pick device
And the equipment being bonded on each in the nude film on substrate, and for each in the nude film to be bonded on
Method on substrate.
Background technology
Generally, semiconductor device can be formed on silicon by repeating a series of manufacture methods.Sawing can be passed through
The chip for forming semiconductor device thereon is divided into multiple nude films by journey, and the nude film is individually picked up, and is then bonded on lining
On bottom.
Specifically, bonding sheet or cutting belt can be attached to the rear surface of the chip comprising separated nude film, and can be incited somebody to action
Bonding sheet is installed to the mounting bracket with toroidal.The supporting plate that mounting bracket can be engaged in equipment by nude film supports, and naked
Piece ejector may be arranged at below chip.Each nude film can be pushed up by nude film ejector so that nude film from bonding sheet easily
Separation, then it can be picked up by being arranged in the pick device above chip.Hereafter, the nude film of pickup can be shifted and is bonded on substrate
On.
To pick up each nude film in accurate location, by the position of the checking device inspection nude film to be picked up, then perform and pick up
Take process.However, because checking device is fixed on the precalculated position above chip, therefore, pick device is naked in pickup one
The lower section of checking device is likely located at during piece.Therefore, checking device waits during the nude film is picked up, and then can detect
Pick up the position for the nude film then to be picked up after the nude film.In addition, the time needed for nude film engaging process may extend.
The content of the invention
The present invention provides the nude film pickup unit for the position that can sequentially detect nude film simultaneously from die pick nude film.
The present invention also provides the nude film engagement equipment for including nude film pickup unit as described above.
The present invention also provides the nude film joint method using nude film engagement equipment engagement nude film.
According to an aspect of the present invention, nude film pickup unit may include：The support of chip of the support comprising multiple nude films
Plate；Be arranged in the top of the supporting plate to detect the position of nude film inspects part；Be arranged in the lower section of the supporting plate with
The ejection part of the nude film of part detection is inspected described in ejection warp；At least one inversion pick-up part, it is arranged in the support
The top of plate is to pick up nude film by the ejection part ejection and including the rotation for being inverted the nude film being picked
Part；And inspect driving part, its be connected to it is described inspect part and be configured to it is mobile described in inspect part, with described
The position of then another to be picked up nude film is detected when being inverted the nude film of pick-up part pickup ejection.
According to some exemplary embodiments, the nude film pickup unit may also include the mobile inversion pick-up part with
Sequentially pick up the pickup driving part of nude film.
According to some exemplary embodiments, the nude film pickup unit may include to be coaxially arranged and be configured to replace
The first and second of ground pickup nude film are inverted pick-up part.
According to some exemplary embodiments, the nude film pickup unit may also include mobile described first and second and be inverted
Pick-up part is with the alternately pickup driving part with sequentially pickup nude film.
According to some exemplary embodiments, the pickup driving part can inspect part with inspecting driving part movement
Direction identical side move up it is described first and second be inverted pick-up part.
According to some exemplary embodiments, the pickup driving part includes linear motor.
According to some exemplary embodiments, the nude film pickup unit may also include moves described first and second respectively
Pick-up part is inverted alternately and sequentially to pick up the first and second pickup driving parts of nude film.
According to some exemplary embodiments, the nude film pickup unit may additionally include and inspect driving part movement inspection
Direction identical side depending on part moves up the ejector driving part of the ejection part.
According to some exemplary embodiments, the nude film pickup unit may additionally include and inspect driving part movement inspection
The side vertical depending on the direction of part moves up the support driving part of the supporting plate.
According to another aspect of the present invention, nude film engagement equipment may include nude film pickup unit and nude film joint unit.
The nude film pickup unit may include：The supporting plate of chip of the support comprising multiple nude films；It is arranged in the top of the supporting plate
Part is inspected with detect the position of nude film；The naked of part detection is inspected in the lower section for being arranged in the supporting plate with ejection by described
The ejection part of piece；At least one inversion pick-up part, it is arranged in the top of the supporting plate to pick up by the ejection part
The nude film of part ejection and the rotary part including being used to be inverted the nude film being picked；And driving part is inspected, it connects
Part is inspected described in being connected to and is configured to inspect part described in movement, with the nude film of the inversion pick-up part pickup ejection
When detect the position of then another to be picked up nude film.The nude film joint unit, which can abut, is inverted pick-up part arrangement, with
Receive inverted nude film and inverted nude film is bonded on substrate.
According to some exemplary embodiments, the nude film joint unit may include to pick up and shift the naked of inverted nude film
Piece transfering part, the substrate loading component by substrate from external load to engaging zones, and will be shifted by nude film transfering part
Nude film be bonded on attachment on substrate.
According to some exemplary embodiments, the nude film joint unit may also include adjacent nude film transfering part arrangement simultaneously
And it is configured to pick up and shifts and picked up by inversion pick-up part and the buffering transfering part of inverted nude film.
According to some exemplary embodiments, the nude film joint unit, which may also include, is movably disposed within nude film transfer
Intermediate transfer part between part and attachment.Intermediate transfer part can receive multiple inverted nude films, then by described in
Inverted nude film is transferred to attachment.
According to some exemplary embodiments, the attachment may include multiple engaging heads, will be multiple inverted naked
Piece is simultaneously engaged with substrate.
According to a further aspect of the invention, engaging the method for nude film may include：Multiple nude films are included using being arranged in
The position of any one inspected in the multiple nude films of part detection of the top of chip, part is inspected from the chip ejection by described
The nude film of detection, pick up and be inverted the nude film of ejection, simultaneously towards another subsequent to be picked up of the adjacent nude film being picked
Part is inspected to detect its position described in nude film movement, and inverted nude film is bonded on substrate.
, can be by multiple inverted nude films including inverted nude film by nude film transfer portion according to some exemplary embodiments
Part is sequentially transferred to intermediate transfer part, is then transferred to simultaneously by the intermediate transfer part described inverted for engaging
The attachment of nude film.
Brief description of the drawings
Exemplary embodiment can be understood in more detail from the following description with reference to accompanying drawing, wherein：
Fig. 1 is to show the schematic diagram that equipment is engaged according to the nude film of exemplary embodiment；
Fig. 2 is the schematic diagram for showing nude film engagement equipment as shown in Figure 1；And
Fig. 3 A-3C are the schematic diagrames for showing the method using nude film as shown in Figure 1 engagement equipment engagement nude film.
Embodiment
Hereinafter, the equipment for engaging nude film according to embodiment of the present invention will be described in detail by referring to the drawings
And method.The present invention can carry out various modifications and materialization in a variety of manners, and therefore, specific embodiment will be shown in the accompanying drawings
Go out and describe in detail in the description.However, the present invention is not understood as limited to specific embodiments described herein.Phase
Instead, it should be appreciated that changing, be equal and substituting also within the scope of the invention without departing substantially from spirit and technical scope of the invention.
In each figure, identical reference refers to identical element from beginning to end.In the accompanying drawings, to be clearly shown, the size of structure
It is exaggerated or minimized.
Term " first " or " second " can be used for describing various elements, however, the element should not be so limited to these terms.
These terms are only used for distinguishing an element and another element.For example, the first element can be named as the second element, it is on the contrary
As the same, this is without departing from the scope of the present invention.
Term used herein is only used for describing specific embodiment, and is not intended to limit the present invention.Unless mention phase
Anti- situation, otherwise the term of singulative may include plural form.In this manual, such as " including (include,
Including) ", " include (comprise, comprising) " or the term of " having (have, having) " is used for illustrating this
Presence of feature, numeral, step, operation, element, component disclosed in text or its combination, it should be understood that be not excluded for one or
A number of other features, numeral, step, operation, element, component or the pre-existing or addition property of its combination.
Unless otherwise defined, otherwise all terms used herein, including technology and scientific terminology all have and this area
The implication identical implication that those of ordinary skill is generally understood that.It should also be understood that term, such as that defined in conventional dictionary
A bit, should be interpreted that has the implication consistent with the situational meaning in association area, and should not be interpreted as having preferable or mistake
The implication of degree form, unless being expressly defined as that there is such implication herein.
Fig. 1 is the schematic diagram for showing the nude film engagement equipment according to an exemplary embodiment, and Fig. 2 is to show
The schematic diagram of nude film engagement equipment as shown in Figure 1.
With reference to figure 1 and Fig. 2, may include to prop up according to the nude film of the exemplary embodiment of present invention engagement equipment 1000
Fagging 100, ejection part 200, first are inverted pick-up part 300, second and are inverted pick-up part 400, inspect part 500, inspect
Driving part 600 and nude film joint unit 700.
Supporting plate 100 can be used for the chip 10 that support includes multiple nude films 20 separated by sawing process.Can be by chip
10 are attached to bonding sheet 30 or cutting belt.Bonding sheet 30 can be installed to the mounting bracket (not shown) with toroidal.Support
Plate 100 can support mounting bracket, and with opening 110 with each nude film 20 of ejection.Although being not shown, supporting plate 100
The expander for the bonding sheet 30 that may include there is toroidal to be supported between nude film and mounting bracket, for keeping the installation
The clamper of frame and the clamper driving part for vertically moving the clamper.Especially, clamper driving part can
Clamper is moved down, to expand bonding sheet 30, thus the distance between expansible nude film.
Nude film engagement equipment 1000 may include support driving part 150, and it moves horizontally supporting plate along x-axis and y-axis direction
100, with to performing engaging process from the separated nude film 20 of chip 10.
Ejection part 200 is arranged in the lower section of supporting plate 100 with ejection nude film 20.Ejection positioned at the lower section of supporting plate 100
Part 200 promotes each nude film 20 through bonding sheet 30, so that nude film 20 easily separates from bonding sheet 30.Therefore, ejection part 200
It is configured to the whole region for allowing a part rather than nude film 20 for promoting nude film 20.For example, ejection part 200 may include to be used for
The ejection pin or bar of ejection nude film 20.
Nude film engagement equipment 1000 may include ejector driving part 250, and it moves horizontally ejection part 200 with sequentially
Ejection nude film 20.For example, ejector driving part 250 can move up ejection part 200 in x-axis and y-axis side.Or ejection
Device driving part 250 can move ejection part 200 in the direction of the x axis, and support driving part 150 to move in the y-axis direction
Supporting plate 100.
First inversion pick-up part 300 and second, which is inverted pick-up part 400, can be arranged in the top of supporting plate 100.The
Each in the one inversion inversion pick-up part 400 of pick-up part 300 and second can replace and sequentially pick up by ejection part
The nude film 20 of 200 sequentially ejections.First, which is inverted pick-up part 300 and second, which is inverted pick-up part 400, can include first respectively
Pick-up and the second pick-up, it is configured to may move in vertical direction, to use vacuum pressure pickup nude film 20.In addition,
First inversion pick-up part 300 and second, which is inverted pick-up part 400, can include the first rotary part 310 and the second rotating part respectively
Part 410.The nude film 20 of pickup can be rotated 180 degree by the first rotary part 310 and the second rotary part 410, so as to be inverted pickup
Nude film 20.
Nude film engagement equipment 1000 may include pickup driving part 450, and it moves first and is inverted pick-up part 300 and second
Pick-up part 400 is inverted alternately and sequentially to pick up nude film 20.Especially, first it is inverted the inversion of pick-up part 300 and second
Pick-up part 400 for example can be coaxially arranged on x-axis direction as shown in Figures 1 and 2, and pick up driving part 450
It is configurable to move the first inversion pick-up part 300 and the second inversion pick-up part 400 in the direction of the x axis.For example, pickup is driven
Dynamic component 450 can be configured by using linear motor.Or pickup driving part 450 can by using for
The first motor, the first ball screw, the first ball nut and the first linear movement of mobile first inversion pick-up part 300 are drawn
Lead device and for move the second motor of the second inversion pick-up part 400, the second ball screw, the second ball nut and
Second linear movement guide device is configured.
In such cases, supporting plate 100 can be moved in the y-axis direction by support driving part 150, and ejection part
200 can be inverted the inversion pick-up part 400 of pick-up part 300 and second identical side by ejector driving part 250 with first
Upwards, i.e., move in the direction of the x axis, with sequentially ejection nude film 20 in the direction of the x axis.
Or nude film engagement equipment 1000 may include the first and second pickup driving parts, to move in the direction of the x axis respectively
Dynamic first, which is inverted pick-up part 300 and second, is inverted pick-up part 400, so as to alternately and sequentially pick up nude film 20.
Inspect the top that part 500 may be arranged at supporting plate 100.Inspect part 500 can using ejection part 200 with
And first inversion pick-up part 300 or second be inverted the ejection of pick-up part 400 and pickup nude film 20 before check be intended to by ejection part
Whether the nude film 20 of the ejection of part 200 is in accurate position.For example, inspecting part 500 may include figure for capturing nude film 20
As to detect the camera of the position of nude film 20.In addition, when there is error the position of the nude film 20 checked, controller (does not show
Go out) operation for supporting driving part 150 can be controlled, to correct the error exactly, so that nude film 20 is in accurate position
Put.
Inspect driving part 600 be connected to inspect part 500 with movement inspect part 500.Specifically, drive division is inspected
The removable part 500 of inspecting of part 600 is with when the first pick-up part 300 or the second pick-up part 400 pick up the nude film 20 of ejection
The position of subsequent another the to be picked up nude film 20 of detection.For example, when the first inversion pick-up part 300 and second is inverted pickup section
When part 400 is moved along the x-axis direction by pickup driving part 450, inspect driving part 600 and can be configured as picking up with the first inversion
Part 300 and second is taken to be inverted on the identical direction of pick-up part 400, i.e. mobile inspection along the x-axis direction as shown in Figures 1 and 2
Depending on part 500.
Nude film joint unit 700 can abut first driven by pickup driving part 450 and be inverted pick-up part 300 and second
Pick-up part 400 is inverted to arrange.For example, two nude film joint units 700 can abut the first inversion pick-up part 300 and the respectively
Two are inverted an arrangement in pick-up part 400, receive and are inverted the inversion pick-up part 400 of pick-up part 300 and second by first
Inverted nude film 20, is then bonded on substrate 40 by pickup and inverted nude film 20.
Nude film joint unit 700 may include nude film transfering part 710, intermediate transfer part 720, substrate loading component 730
With attachment 740.Nude film transfering part 710 can pick up is inverted the inversion pick-up part 400 of pick-up part 300 and second by first
Inverted nude film 20, and nude film 20 is transferred to intermediate transfer part 720.Intermediate transfer part 720 can receive multiple nude films 20.
For example, intermediate transfer part 720 can receive the nude film 20 shifted by nude film transfering part 710 of predetermined quantity, then simultaneously will
Nude film 20 is transferred to attachment 740.Substrate loading component 730 can be by substrate 40 from external load to wherein by attachment
740 perform the engaging zones of engaging process.Attachment 740 can be by the nude film 20 shifted by intermediate transfer part 720 individually
It is bonded on substrate 40.Especially, nude film joint unit 700 may include what at least one adjacent nude film transfering part 710 was arranged
Transfering part 750 is buffered, it plays identical with nude film transfering part 710.In intermediate transfer part 720 to attachment
While 740 transfer multiple nude film 20, the gentle transfering part 750 that rushes of nude film transfering part 710 can be picked up by the first inversion pickup
The inversion pick-up part 400 of part 300 and second picks up and inverted nude film 20, to shorten the time needed for engaging process.
Attachment 740 may include engaging head so that nude film 20 is individually bonded on substrate 40.Or attachment
740 may include multiple engaging heads so that multiple nude films 20 are simultaneously engaged with substrate 40, to shorten the time needed for engaging process.
Hereinafter, it will be described in further detail with reference to figure 3A-3C and be engaged nude film 20 using nude film engagement equipment 1000
Method on substrate 40.
Fig. 3 A-3C are the schematic diagrames for showing the method using nude film as shown in Figure 1 engagement equipment engagement nude film.
With reference to figure 3A, first, for each nude film 20 is bonded on substrate 40, it is intended to be fallen by first by inspecting the detection of part 500
Put the position of the nude film 20 of the pickup of pick-up part 300.Meanwhile second second pick-up of inversion pick-up part 400 can be to moving down
It is dynamic, adjoin the adjacent nude film 20 for the nude film 20 to be picked up in the direction of the x axis with pickup.Now, the position of adjacent nude film 20
Checked in advance by inspecting part 500.In a word, in figure 3 a in shown step, it is intended to be fallen by first inspecting part 500 and checking
When putting the position of the nude film 20 for any one pickup that pick-up part 300 and second is inverted in pick-up part 400, another inversion is picked up
Take part while be picked up the operation of another nude film 20.
With reference to figure 3B, moved in the first inversion pick-up part 300 by pickup driving part 450 towards the nude film 20 to be picked up
When, inspect part 500 and can while be moved by inspecting driving part 600, to be intended to be inverted pick-up part 4,000 by second positioned at subsequent
The top of the nude film 20 taken.Now, the second pick-up of the second inversion pick-up part 400 can pick up adjacent nude film 20.
With reference to figure 3C, in the first pick-up nude film 20 to be picked up of the first inversion pick-up part 300, portion is inspected
The position of the detectable nude film 20 for being then intended to be picked up by the second inversion pick-up part 400 of part 500.Now, second it is inverted pickup section
Part 400 can move towards the nude film transfering part 710 for being arranged in right side in fig. 3 c, and then rotate the second pick-up to be inverted phase
Adjacent nude film 20.
Then, when adjacent nude film 20 is transferred to nude film transfering part 710 from the second inversion pick-up part 400, first
Being inverted pick-up part 300 can move towards the nude film transfering part 710 for being arranged in left side in fig. 3 c, and then rotate the first pickup
Device is to be inverted the nude film 20 of pickup.
As described above, it is inverted the alternating of pick-up part 400 in the first inversion pick-up part 300 and second and sequentially picks up naked
During piece 20, inspect part 500 and also sequentially moved by inspecting driving part 600 to detect the position of nude film 20, thus picked up naked
The operation of piece 20 can be consecutively carried out without stopping operation.
The nude film of nude film transfering part 710 is transferred to from the first inversion inversion pick-up part 400 of pick-up part 300 and second
20 can be sequentially received in intermediate transfer part 720.When the quantity of nude film 20 reaches predetermined quantity, intermediate transfer part
Nude film 20 can be transferred to attachment 740 by 720.Then, attachment 740 can nude film 20 is single or simultaneously engagement arrive by
On the substrate 40 that substrate loading component 730 loads.
According to the exemplary embodiment as described above of the present invention, it is inverted pick-up part 300 or second first and is inverted
When pick-up part 400 picks up a nude film 20, inspect part 500 and can be moved by inspecting driving part 600 and then be intended to pick up to detect
The position of another nude film 20 taken.Therefore, the first inversion inversion pick-up part 400 of pick-up part 300 and second can be continuous
Nude film 20 is picked up without interrupt operation in ground.Therefore, engaging the whole processing time needed for nude film 20 can fully shorten, because
This, it is contemplated that cost-effective and raising productivity ratio.
In addition, to pick up each nude film 20 from chip 10, have relatively in the element of nude film engagement equipment 1000
The weight of weight and the higher supporting plate 100 of the possibility therefore vibrated in its operating process can be moved only along y-axis or x-axis direction
It is dynamic, and ejection part 200, first be inverted pick-up part 300 and second be inverted pick-up part 400 and inspect part 500 can
Only moved along x-axis or y-axis direction.Accordingly it is also possible to expection, can be reduced vibrating noise, thus work as caused by moving supporting plate
Improved as environment.
Although nude film pickup unit including its nude film engagement equipment and engagement are described with reference to specific embodiment
The method of nude film, but they are not limited to this.Therefore, those skilled in the art will readily appreciate that, the present invention can be carried out each
Kind modifications and changes, this is without departing from the spirit and scope of the present invention being defined by the appended claims.
Claims (12)
1. a kind of nude film pickup unit, it includes：
The supporting plate of chip of the support comprising multiple nude films；
Be arranged in the top of the supporting plate to detect the position of the nude film inspects part；
Be arranged in the lower section of the supporting plate with ejection pass through described in inspect part detection nude film ejection part；
First, which is inverted pick-up part and second, is inverted pick-up part, and it is coaxially disposed in described on trunnion axis (x) direction
The top of supporting plate is to pick up nude film by the ejection part ejection and including for being inverted the rotation of nude film being picked
Part, and the first inversion pick-up part and the second inversion pick-up part and the part of inspecting are in the trunnion axis (x) side
It is coaxially arranged upwards,
Move described first respectively on trunnion axis (x) direction and be inverted pick-up part and the second inversion pick-up part with alternately
Sequentially pick up the first and second pickup driving parts of the nude film；And
Inspect driving part, its be connected to it is described inspect part and be configured to it is mobile described in inspect part, with described first
Inversion pick-up part or the second inversion pick-up part detect then another to be picked up nude film when picking up the nude film of the ejection
Position.
2. nude film pickup unit according to claim 1, wherein the pickup driving part is inspecting drive division with described
The direction identical side that part is inspected described in part movement moves up the first inversion pick-up part and the second inversion pickup section
Part.
3. nude film pickup unit according to claim 1, wherein the pickup driving part includes linear motor.
4. nude film pickup unit according to claim 1, it is additionally included in moves the inspection with the driving part of inspecting
Direction identical side depending on part moves up the ejector driving part of the ejection part.
5. nude film pickup unit according to claim 1, it is additionally included in moves the inspection with the driving part of inspecting
The side vertical depending on the direction of part moves up the support driving part of the supporting plate.
6. a kind of nude film engages equipment, it includes：
Nude film pickup unit, it includes：The supporting plate of chip of the support comprising multiple nude films；It is arranged in the top of the supporting plate
Part is inspected with detect the position of the nude film；Part detection is inspected in the lower section for being arranged in the supporting plate with ejection by described
Nude film ejection part；First, which is inverted pick-up part and second, is inverted pick-up part, and it is coaxial on trunnion axis (x) direction
Ground is arranged in the top of the supporting plate to pick up nude film by the ejection part ejection and including being picked for inversion
Nude film rotary part, and it is described first be inverted pick-up part and second be inverted pick-up part with the part of inspecting described
Trunnion axis (x) is coaxially arranged on direction；Moved respectively on trunnion axis (x) direction it is described first be inverted pick-up part and
Second inversion pick-up part picks up driving parts alternately and sequentially to pick up the first and second of the nude film；And inspect drive
Dynamic component, its be connected to it is described inspect part and be configured to it is mobile described in inspect part, to be inverted pickup section described first
The position of then another to be picked up nude film is detected when part or the nude film of the second inversion pick-up part pickup ejection；And
Nude film joint unit, it abuts the inversion pick-up part arrangement, to receive the inverted nude film and by the inversion
Nude film be bonded on substrate.
7. nude film according to claim 6 engages equipment, wherein the nude film joint unit includes：
Pick up and shift the nude film transfering part of the inverted nude film；
By substrate loading component of the substrate from external load to engaging zones；And
By the attachment of the nude film shifted by the nude film transfering part engagement over the substrate.
8. nude film according to claim 6 engages equipment, wherein the nude film joint unit also includes the adjacent nude film
Transfering part is arranged and is configured to pick up and shifts and shifted by the buffering of the inversion pick-up part pickup and inverted nude film
Part.
9. nude film according to claim 6 engages equipment, wherein the nude film joint unit also includes being movably disposed
Intermediate transfer part between the nude film transfering part and the attachment, the intermediate transfer part reception are multiple
The nude film put, the inverted nude film is then transferred to the attachment.
10. nude film according to claim 9 engages equipment, wherein the attachment include multiple engaging heads with by described in
Multiple inverted nude films simultaneously engage with over the substrate.
11. a kind of method for engaging nude film, the nude film bonding apparatus described in its any one with claim 6-10 performs, described
Method includes：
Using positioned at the position of any one inspected in the multiple nude film of part detection of the top of the chip comprising multiple nude films
Put；
From the nude film that part detection is inspected described in chip ejection warp；
Pick up and be inverted the nude film of the ejection, it is another naked simultaneously towards then being picked up for the nude film being picked described in adjoining
Part is inspected to detect its position described in piece movement；And
The inverted nude film is bonded on substrate.
12. according to the method for claim 11, wherein by multiple inverted nude films including the inverted nude film by naked
Piece transfering part is sequentially transferred to intermediate transfer part, is then transferred to simultaneously by the intermediate transfer part for engaging institute
State the attachment of inverted nude film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140051405A KR101614204B1 (en) | 2014-04-29 | 2014-04-29 | Unit for picking up a die, apparatus and method for bonding the same and |
| KR10-2014-0051405 | 2014-04-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105023857A CN105023857A (en) | 2015-11-04 |
| CN105023857B true CN105023857B (en) | 2018-01-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510214675.0A Active CN105023857B (en) | 2014-04-29 | 2015-04-29 | Nude film pickup unit including its nude film engagement equipment and nude film joint method |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101614204B1 (en) |
| CN (1) | CN105023857B (en) |
| TW (1) | TW201608665A (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134422A (en) * | 2016-02-29 | 2017-09-05 | 上海微电子装备（集团）股份有限公司 | Chip bonding device and method |
| CN107134427B (en) * | 2016-02-29 | 2020-05-01 | 上海微电子装备（集团）股份有限公司 | Chip bonding device and method |
| CN107134423B (en) * | 2016-02-29 | 2020-11-20 | 上海微电子装备（集团）股份有限公司 | Flip chip bonding device and bonding method thereof |
| CN109196628B (en) * | 2016-03-22 | 2021-11-26 | 株式会社新川 | Bonding apparatus and bonding method |
| CN107452641B (en) * | 2016-05-31 | 2020-10-23 | 细美事有限公司 | Method for picking up bare chip from wafer |
| CN107887294B (en) * | 2016-09-30 | 2020-04-10 | 上海微电子装备（集团）股份有限公司 | Chip universal batch bonding device and method |
| CN107887295B (en) * | 2016-09-30 | 2019-07-23 | 上海微电子装备（集团）股份有限公司 | A kind of chip bonding device and bonding method |
| CN109256354B (en) * | 2017-07-14 | 2021-01-12 | 财团法人工业技术研究院 | Transfer support and transfer module |
| CN109390249A (en) | 2017-08-10 | 2019-02-26 | 上海微电子装备（集团）股份有限公司 | Semiconductor manufacturing apparatus |
| KR102000081B1 (en) * | 2017-09-19 | 2019-07-17 | 세메스 주식회사 | Die stage unit for testing die and die binding apparatus having the same |
| KR102391432B1 (en) * | 2017-10-19 | 2022-04-27 | 세메스 주식회사 | Die transfer module and die bonding apparatus including the same |
| DE102017124582A1 (en) | 2017-10-20 | 2019-04-25 | Asm Assembly Systems Gmbh & Co. Kg | Complementary tool for chip transfer device with removal tool and turning tool |
| JP7018338B2 (en) * | 2018-03-19 | 2022-02-10 | ファスフォードテクノロジ株式会社 | Manufacturing method of die bonding equipment and semiconductor equipment |
| KR20220014134A (en) | 2020-07-28 | 2022-02-04 | 엘지전자 주식회사 | Motor assembly having Thrust-Radial integrated gap sensor and the control method thereof |
| KR102635493B1 (en) * | 2020-11-04 | 2024-02-07 | 세메스 주식회사 | Apparatus for transferring die in bonding equipment and method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102340980A (en) * | 2010-07-15 | 2012-02-01 | 雅马哈发动机株式会社 | Mounting apparatus |
-
2014
- 2014-04-29 KR KR1020140051405A patent/KR101614204B1/en active IP Right Grant
-
2015
- 2015-04-13 TW TW104111741A patent/TW201608665A/en unknown
- 2015-04-29 CN CN201510214675.0A patent/CN105023857B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102340980A (en) * | 2010-07-15 | 2012-02-01 | 雅马哈发动机株式会社 | Mounting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105023857A (en) | 2015-11-04 |
| TW201608665A (en) | 2016-03-01 |
| KR20150124648A (en) | 2015-11-06 |
| KR101614204B1 (en) | 2016-04-20 |
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