CN105011622A - Semiconductor cooling/heating mattress - Google Patents
Semiconductor cooling/heating mattress Download PDFInfo
- Publication number
- CN105011622A CN105011622A CN201510442330.0A CN201510442330A CN105011622A CN 105011622 A CN105011622 A CN 105011622A CN 201510442330 A CN201510442330 A CN 201510442330A CN 105011622 A CN105011622 A CN 105011622A
- Authority
- CN
- China
- Prior art keywords
- breather pipe
- mattress
- silicon chips
- semiconductor
- semiconductor silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 238000001816 cooling Methods 0.000 title abstract description 7
- 238000010438 heat treatment Methods 0.000 title abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 239000000945 filler Substances 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 7
- 229920000742 Cotton Polymers 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Mattresses And Other Support Structures For Chairs And Beds (AREA)
Abstract
A related semiconductor cooling/heating mattress comprises a mattress body and a cooling/heating device fixedly disposed at the edge of the inner side of the mattress body, the mattress body is inside provided with a repetitively-folded bent breather pipe which is horizontally arranged, the gas inlet end of the breather pipe is communicated with the cooling/heating device, the gas outlet end of the breather pipe is sealed, and the upper end of the breather pipe is provided with multiple through holes. Compared with the prior art, the semiconductor cooling/heating mattress is simple in structure, safe, comfortable, and long in service life, and the temperature of the mattress is adjustable according to demands.
Description
Technical field
The present invention relates to bedding technical field, particularly a kind of semiconductor cold-warm mattress.
Background technology
Various mattresses on existing market, the poor effect that winter warming or summer feel nice and cool is all usually that electricity consumption is directly heated, so easily cause security incident, so be necessary to solve this problem.
Summary of the invention
Technical problem to be solved by this invention is to provide the mattress that a kind of structure is simple, can regulate temperature, safety and comfort, long service life as required.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of semiconductor cold-warm mattress, comprises mattress body and refrigerated medium warmer, and described refrigerated medium warmer is fixedly placed in described mattress body inside edge; Be provided with in described mattress body that horizontal the inlet end of described breather pipe is communicated with described refrigerated medium warmer in folding forniciform breather pipe, the outlet side of described breather pipe seals, and the upper end of described breather pipe is provided with multiple through hole.
The invention has the beneficial effects as follows: refrigerated medium warmer can input hot gas or cold air as required in mattress body, make in user's sleeping process more comfortable, security is high, and this apparatus structure is simple and realize cooling/heating by electronic device, can increase the service life.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described refrigerated medium warmer comprises dropping equipment, fairing, voltage regulator and the semiconductor silicon chips of connecting successively, the inlet end of described semiconductor silicon chips stretches out described mattress, and this is external, and the outlet side of described semiconductor silicon chips is communicated with the inlet end of described breather pipe;
Described dropping equipment for accessing external communication electricity, and carries out step-down to alternating current;
Described fairing is used for being rectified into direct current to the alternating current after step-down;
Described voltage regulator carries out voltage-regulation to direct current, to semiconductor silicon chips conveying stable DC electricity;
Described semiconductor silicon chips is for transporting cold wind or hot blast in the backward communicating pipe that is energized.
Adopt the beneficial effect of above-mentioned further scheme to be: stabling current can be provided for semiconductor silicon chips by pressure device, fairing and voltage regulator, ensure that semiconductor silicon chips running is stable, extend the service life of this device.
Further, described water pipe folding bending between gap in be provided with flexible filler.
Further, described flexible filler is made up of cotton.
The beneficial effect of above-mentioned further scheme is adopted to be: cotton flexible filler can promote the comfort level of user.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of semiconductor cold-warm mattress of the present invention;
Fig. 2 is the structural representation of refrigerated medium warmer;
Fig. 3 is the module frame chart of a kind of semiconductor cold-warm mattress of the present invention.
In accompanying drawing, the list of parts representated by each label is as follows:
1, mattress body, 2, refrigerated medium warmer, 21, dropping equipment, 22, fairing, 23, voltage regulator, 24, semiconductor silicon chips;
3, breather pipe, 4, flexible filler, 5 through holes.
Detailed description of the invention
Be described principle of the present invention and feature below in conjunction with accompanying drawing, example, only for explaining the present invention, is not intended to limit scope of the present invention.
As shown in Figure 1 to Figure 3, a kind of semiconductor cold-warm mattress, comprises mattress body 1 and refrigerated medium warmer 2, and described refrigerated medium warmer 2 is fixedly placed in described mattress body 1 inside edge; Be provided with in described mattress body 1 that horizontal the inlet end of described breather pipe 3 is communicated with described refrigerated medium warmer 2 in folding forniciform breather pipe 3, the outlet side of described breather pipe 3 seals, and the upper end of described breather pipe 3 is provided with multiple through hole 5.
Preferably, described refrigerated medium warmer 2 comprises dropping equipment 21, fairing 22, voltage regulator 23 and the semiconductor silicon chips 24 of connecting successively, the inlet end of described semiconductor silicon chips 24 stretches out outside described mattress body 1, and the outlet side of described semiconductor silicon chips 24 is communicated with the inlet end of described breather pipe 3;
Described dropping equipment 21 for accessing external communication electricity, and carries out step-down to alternating current;
Described fairing 22 is for being rectified into direct current to the alternating current after step-down;
Described voltage regulator 23 pairs of direct currents carry out voltage-regulation, carry stable DC electricity to semiconductor silicon chips 24;
Described semiconductor silicon chips 24 is for transporting cold wind or hot blast in the backward communicating pipe 3 that is energized.
Preferably, described tracheae 3 folding bending between gap in be provided with flexible filler 4.
Preferably, described flexible filler 4 is made up of cotton.
The refrigerated medium warmer 2 of this device can input hot gas or cold air as required in mattress body 1, and make in user's sleeping process more comfortable, security is high, and this apparatus structure is simple and realize cooling/heating by electronic device, can increase the service life.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. a semiconductor cold-warm mattress, is characterized in that: comprise mattress body (1) and refrigerated medium warmer (2), and described refrigerated medium warmer (2) is fixedly placed in described mattress body (1) inside edge; Be provided with horizontal in folding forniciform breather pipe (3) in described mattress body (1), the inlet end of described breather pipe (3) is communicated with described refrigerated medium warmer (2), the outlet side sealing of described breather pipe (3), the upper end of described breather pipe (3) is provided with multiple through hole (5).
2. a kind of semiconductor cold-warm mattress according to claim 1, it is characterized in that: described refrigerated medium warmer (2) comprises dropping equipment (21), fairing (22), voltage regulator (23) and the semiconductor silicon chips (24) of connecting successively, the inlet end of described semiconductor silicon chips (24) stretches out described mattress body (1) outward, and the outlet side of described semiconductor silicon chips (24) is communicated with the inlet end of described breather pipe (3);
Described dropping equipment (21) for accessing external communication electricity, and carries out step-down to alternating current;
Described fairing (22) is for being rectified into direct current to the alternating current after step-down;
Described voltage regulator (23) carries out voltage-regulation to direct current, to semiconductor silicon chips (24) conveying stable DC electricity;
Described semiconductor silicon chips (24) is for backward communicating pipe (3) interior transporting cold wind or the hot blast of being energized.
3. a kind of semiconductor cold-warm mattress according to claim 1, is characterized in that: described tracheae (3) folding bending between gap in be provided with flexible filler (4).
4. a kind of semiconductor cold-warm mattress according to claim 3, is characterized in that: described flexible filler (4) is made up of cotton.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510442330.0A CN105011622A (en) | 2015-07-24 | 2015-07-24 | Semiconductor cooling/heating mattress |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510442330.0A CN105011622A (en) | 2015-07-24 | 2015-07-24 | Semiconductor cooling/heating mattress |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105011622A true CN105011622A (en) | 2015-11-04 |
Family
ID=54402216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510442330.0A Pending CN105011622A (en) | 2015-07-24 | 2015-07-24 | Semiconductor cooling/heating mattress |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105011622A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108402780A (en) * | 2018-05-14 | 2018-08-17 | 浙江聚珖科技股份有限公司 | A kind of semiconductor cooling heating circulating mattress |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2142294Y (en) * | 1992-09-30 | 1993-09-22 | 唐绍章 | Semiconductor heating or cooling bed mattress |
| JPH09396A (en) * | 1995-06-22 | 1997-01-07 | Nippon Kenko Zoushin Kenkyukai:Kk | mattress |
| CN201008464Y (en) * | 2006-03-07 | 2008-01-23 | 戴贵骅 | Cooling and warming mattress |
| CN201324047Y (en) * | 2008-12-17 | 2009-10-14 | 尹永日 | Cool and warm mattress |
| CN202112699U (en) * | 2011-07-05 | 2012-01-18 | 唐德芳 | Semiconductor cold and hot water mattress |
| CN204043108U (en) * | 2014-09-02 | 2014-12-24 | 秦阳林 | A kind of semiconductor cooling heating air conditioner |
| CN204091476U (en) * | 2014-10-12 | 2015-01-14 | 西安科技大学 | A kind of air-conditioning mattress |
-
2015
- 2015-07-24 CN CN201510442330.0A patent/CN105011622A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2142294Y (en) * | 1992-09-30 | 1993-09-22 | 唐绍章 | Semiconductor heating or cooling bed mattress |
| JPH09396A (en) * | 1995-06-22 | 1997-01-07 | Nippon Kenko Zoushin Kenkyukai:Kk | mattress |
| CN201008464Y (en) * | 2006-03-07 | 2008-01-23 | 戴贵骅 | Cooling and warming mattress |
| CN201324047Y (en) * | 2008-12-17 | 2009-10-14 | 尹永日 | Cool and warm mattress |
| CN202112699U (en) * | 2011-07-05 | 2012-01-18 | 唐德芳 | Semiconductor cold and hot water mattress |
| CN204043108U (en) * | 2014-09-02 | 2014-12-24 | 秦阳林 | A kind of semiconductor cooling heating air conditioner |
| CN204091476U (en) * | 2014-10-12 | 2015-01-14 | 西安科技大学 | A kind of air-conditioning mattress |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108402780A (en) * | 2018-05-14 | 2018-08-17 | 浙江聚珖科技股份有限公司 | A kind of semiconductor cooling heating circulating mattress |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151104 |