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CN104991383A - Display substrate and manufacturing method thereof and display panel and manufacturing method thereof - Google Patents

Display substrate and manufacturing method thereof and display panel and manufacturing method thereof Download PDF

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Publication number
CN104991383A
CN104991383A CN201510490258.9A CN201510490258A CN104991383A CN 104991383 A CN104991383 A CN 104991383A CN 201510490258 A CN201510490258 A CN 201510490258A CN 104991383 A CN104991383 A CN 104991383A
Authority
CN
China
Prior art keywords
substrate
photosensitive semiconductor
base plate
encapsulation region
sealed plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510490258.9A
Other languages
Chinese (zh)
Inventor
江亮亮
郭磊
惠大胜
尹傛俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201510490258.9A priority Critical patent/CN104991383A/en
Publication of CN104991383A publication Critical patent/CN104991383A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)

Abstract

The invention provides a display substrate and a manufacturing method thereof and a display panel and a manufacturing method thereof, relates to the technical field of displaying, and solves the problems that an existing display panel sealing frame glue is poor in solidifying uniformity. The display substrate comprises a display region, a sealing region which encloses the display region, an underlayment substrate and photosensitive semiconductor patterns arranged above the underlayment substrate and located on the sealing region. The display substrate and the manufacturing method thereof and the display panel and the manufacturing method thereof are suitable for manufacturing of a liquid crystal display panel.

Description

A kind of display base plate and preparation method thereof, display panel and preparation method thereof
Technical field
The present invention relates to display technique field, particularly relate to a kind of display base plate and preparation method thereof, display panel and preparation method thereof.
Background technology
Conventional TFT-LCD (Thin Film Transistor-Liquid Crystal Display, Thin Film Transistor-LCD) as shown in Figure 1, the liquid crystal 13 comprising array base palte 12, color membrane substrates 11 and be filled between array base palte 12 and color membrane substrates 11.Wherein, liquid crystal 13 is sealed between array base palte 12 and color membrane substrates 11 by sealed plastic box 14.
The technique (Cell technique) that existing array base palte and color membrane substrates carry out box comprising: as shown in Fig. 2 (a), array base palte 12 carries out liquid crystal 13 instil, and apply sealed plastic box 14, wherein sealed plastic box 14 spreads for preventing liquid crystal 13.But before sealed plastic box solidification, liquid crystal contacts with sealed plastic box, sealed plastic box partly can be dissolved in liquid crystal thus liquid crystal pollution is occurred, therefore, prior art utilizes ultraviolet light (UV after array base palte 12 with color membrane substrates 11 pairs of boxes, Ultra Violet) UV solidification is carried out, as shown in Fig. 2 (b) to sealed plastic box.
Because the intensity of ultraviolet light decays gradually because of the absorption of sealed plastic box on direction of illumination, therefore the curing efficiency of sealed plastic box constantly reduces along UV-irradiation direction, as shown in Figure 3, the curing efficiency of sealed plastic box reduces along with the increase of distance d, then bottom sealed plastic box on UV-irradiation direction, likely solidification is incomplete, namely sealed plastic box solidification homogeneity is poor, and then after causing liquid crystal to contact with sealed plastic box, liquid crystal pollution occurs.And due to sealed plastic box non-leuco transparent, increase intensity of illumination or prolonging light time in prior art, also effectively cannot improve the curing efficiency bottom sealed plastic box.
Summary of the invention
Embodiments of the invention provide a kind of display base plate and preparation method thereof, display panel and preparation method thereof, the display base plate that the embodiment of the present invention provides is when forming display panel and carrying out sealed plastic box solidification, adopt method for making of the present invention, curing efficiency and the solidification homogeneity of sealed plastic box can be improved.
For achieving the above object, embodiments of the invention adopt following technical scheme:
On the one hand, embodiments provide a kind of display base plate, comprise viewing area and surround the encapsulation region of described viewing area, comprising: underlay substrate; To be arranged on described underlay substrate and to be positioned at the photosensitive semiconductor pattern of described encapsulation region.
Optionally, also comprise: the active layer pattern being positioned at described viewing area;
Described photosensitive semiconductor pattern and the same material of described active layer pattern, and the photosensitive semiconductor pattern of described active layer pattern and described encapsulation region is formed with a composition.
Optionally, described display base plate also comprises: be positioned at the insulation course on described underlay substrate, and described insulation course at least covers described encapsulation region, and described photosensitive semiconductor pattern is formed on described insulation course.
Optionally, described insulation course also covers described viewing area.
Optionally, encapsulation region described in described photosensitive semiconductor pattern covers.
On the other hand, embodiments provide a kind of method for making of display base plate, described display base plate comprises viewing area and surrounds the encapsulation region of described viewing area, and described method for making comprises:
Underlay substrate is formed photosensitive semiconductor film, and obtains semiconductor photoactive layer to described photosensitive semiconductor patterning thin film, described semiconductor photoactive layer comprises: the photosensitive semiconductor pattern being positioned at described encapsulation region.
Optionally, described semiconductor photoactive layer also comprises: the active layer pattern being positioned at viewing area.
Optionally, underlay substrate forms photosensitive semiconductor film, and before obtaining semiconductor photoactive layer to described photosensitive semiconductor patterning thin film, described method also comprises:
Underlay substrate forms insulation course, and described insulation course at least covers described encapsulation region.
Optionally, described insulation course also covers described viewing area.
On the other hand, embodiments provide a kind of display panel, comprise the first substrate to box and second substrate, arbitrary described display base plate that described first substrate or described second substrate provide for the embodiment of the present invention, it is bonding that the encapsulation region of described first substrate and described second substrate pass through sealed plastic box, described sealed plastic box is positioned at encapsulation region, and directly contacts with described photosensitive semiconductor pattern.
Optionally, described sealed plastic box also comprises: adjuvant, and described adjuvant produces the efficiency of free radical after illumination for improving described photosensitive semiconductor pattern.
Optionally, described adjuvant comprises: at least one in azo-compound, organic or inorganic superoxide.
Again on the one hand, embodiments provide a kind of method for making of display panel, comprising:
Sealed plastic box is formed in the encapsulation region of first substrate;
By first substrate and second substrate to box; Wherein, arbitrary described display base plate that described second substrate provides for the embodiment of the present invention, described sealed plastic box directly contacts with the photosensitive semiconductor pattern of described display base plate encapsulation region;
Ultraviolet light is utilized to irradiate described sealed plastic box, to be cured described sealed plastic box from the side away from described photosensitive semiconductor pattern of first substrate.
Embodiments of the invention provide a kind of display base plate and preparation method thereof, display panel and preparation method thereof, the underlay substrate of display base plate is formed with photosensitive semiconductor pattern in encapsulation region, after adopting sealed plastic box to encapsulate with other substrates, when ultraviolet light polymerization is carried out to sealed plastic box, ultraviolet light from other substrates away from photosensitive semiconductor pattern side irradiate photosensitive semiconductor pattern time, under the catalysis of ultraviolet light, photosensitive semiconductor pattern generates unstable free electron and hole, free electron and hole combine and form free radical, free radical can accelerate the solidification of sealed plastic box, thus sealed plastic box is accelerated in the side solidification away from ultraviolet light, improve the solidification homogeneity of sealed plastic box.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is existing liquid crystal panel schematic diagram;
Fig. 2 is that array base palte and color membrane substrates are to the process schematic representation of box;
Fig. 3 is the corresponding relation schematic diagram of sealed plastic box curing efficiency and distance;
The plan structure schematic diagram of a kind of display base plate that Fig. 4 provides for the embodiment of the present invention;
Fig. 5 is for the A-A ' of display base plate shown in Fig. 4 is to schematic diagram;
The another kind of display base plate schematic diagram that Fig. 6 provides for the embodiment of the present invention;
Fig. 7 forms the schematic diagram that photosensitive semiconductor film and photoresist carry out exposing on underlay substrate;
Fig. 8 is the schematic diagram after developing to the photoresist shown in Fig. 7;
Fig. 9 is the schematic diagram after etching photosensitive semiconductor film;
The method for making schematic diagram of a kind of display panel that Figure 10 provides for the embodiment of the present invention;
Figure 11 carries out ultra-violet curing schematic diagram to the encapsulation region of first substrate and second substrate;
A kind of display panel schematic diagram that Figure 12 provides for the embodiment of the present invention.
Reference numeral:
10-underlay substrate; 11-color membrane substrates; 12-array base palte; 13-liquid crystal; 14-sealed plastic box; 15-photosensitive semiconductor pattern; 16-insulation course; 17-photosensitive semiconductor film; 18-photoresist; 101-display base plate; 101-viewing area; 102-encapsulation region; 200-display panel; 201-first substrate; 202-second substrate.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
In order to the technical scheme of the convenient understanding embodiment of the present invention, need to be illustrated in all embodiments of the present invention, the definition of " film ", " layer " and " pattern ", and between relation.Wherein, " film " refers to and utilizes a certain material on substrate, utilize deposition or the thin film produced of other techniques.If be somebody's turn to do " film " without the need to patterning processes in the middle of whole manufacturing process, then should " film " can also be called " layer "; If " film " also patterning processes should be needed in the middle of whole manufacturing process, be then called before patterning processes " film ", be called after patterning processes " layer ".At least one film " pattern " is comprised in " layer " after patterning processes.
Example, above-mentioned gate insulation layer can be deposit on the transparent substrate obtained by SiNx (silicon nitride).Gate insulation layer is generally without the need to patterning processes.Example again, source and drain metal level generally comprises source electrode and drain electrode, and it is the metallic film of depositing electrically conductive on substrate, carries out composition obtain source and drain metal level to metallic film, wherein, source electrode and drain electrode are called pattern.
So-called " patterning processes " is that film is formed the technique comprising the layer of at least one pattern; And patterning processes comprises usually: gluing on film, utilize mask plate to expose described photoresist, the photoresist erosion that recycling developer solution need be removed is fallen, then etches away the film portion not covering photoresist, finally by remaining photoresist lift off.And in all embodiments of the present invention, " patterning processes " refers to and forms required Rotating fields technique through single exposure.
Embodiments provide a kind of display base plate 100, as shown in Figure 4, Figure 5, comprise viewing area 101 and surround the encapsulation region 102 of viewing area 101, described display base plate 100 comprises: underlay substrate 10; And to be arranged on underlay substrate 10 and to be positioned at the photosensitive semiconductor pattern 15 of encapsulation region 102.
Embodiments provide a kind of display base plate, the underlay substrate of display base plate is formed with photosensitive semiconductor pattern in encapsulation region, after adopting sealed plastic box to encapsulate with other substrates, when ultraviolet light polymerization is carried out to sealed plastic box, ultraviolet light from other substrates away from photosensitive semiconductor pattern side irradiate photosensitive semiconductor pattern time, under the catalysis of ultraviolet light, photosensitive semiconductor pattern generates unstable free electron and hole, free electron and hole combine and form free radical, free radical can accelerate the solidification of sealed plastic box, thus sealed plastic box is accelerated in the side solidification away from ultraviolet light, improve the solidification homogeneity of sealed plastic box.
Preferably, as shown in Figure 4, Figure 5, photosensitive semiconductor pattern 15 covers encapsulation region 102.Namely encapsulation region is all formed with photosensitive semiconductor pattern, improve the solidification homogeneity of the whole sealed plastic box of encapsulation region, thus the sealed plastic box homogeneity avoiding local solidification not exclusively to cause is bad.
Preferably, as shown in Figure 6, display base plate 100 also comprises: be positioned at the insulation course 16 on underlay substrate 10, and insulation course 16 at least covers encapsulation region 102, and photosensitive semiconductor pattern 15 is formed on insulation course 16.
Preferably, as shown in Figure 6, insulation course 16 also covers viewing area 101.It should be noted that, viewing area is generally formed with display device, and insulation course covers the insulation that viewing area can also be used for display device.Such as, viewing area is formed with thin film transistor (TFT), and thin film transistor (TFT) comprises grid, source electrode and drain electrode, and wherein, source electrode and drain electrode are positioned at same layer, and grid is positioned at one deck, grid and source electrode and be provided with gate insulation layer to insulate between draining.Then in the embodiment of the present invention, insulation course can also be used as gate insulation layer, namely makes grid and source electrode and drain insulation.Certainly, the insulation course in display device is a lot, and be also not limited to be used as gate insulation layer, the present invention is only described for above-mentioned.
In describing the invention, it will be appreciated that, term " on ", the orientation of the instruction such as D score or position relationship be based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.
Preferably, display base plate also comprises: the active layer pattern being positioned at viewing area; Photosensitive semiconductor pattern and the same material of active layer pattern, and the photosensitive semiconductor pattern of active layer pattern and encapsulation region is formed with a composition.
It should be noted that, viewing area is generally formed with display device, and such as, viewing area is formed with thin film transistor (TFT), and thin film transistor (TFT) generally also includes active layer, and active layer generally adopts semiconductor material to be formed.Then in the embodiment of the present invention, the photosensitive semiconductor pattern of encapsulation region can be adopt with the active layer pattern of viewing area once to be formed with a patterning processes, to simplify the manufacture craft of display base plate.
Embodiments provide a kind of method for making of display base plate, as shown in Figure 4, Figure 5, display base plate 100 comprises viewing area 101 and surrounds the encapsulation region 102 of viewing area 101, and the method for making of display base plate comprises:
Underlay substrate is formed photosensitive semiconductor film, and obtains semiconductor photoactive layer to photosensitive semiconductor patterning thin film, semiconductor photoactive layer comprises: the photosensitive semiconductor pattern being positioned at encapsulation region.
Concrete, as shown in Figure 7, underlay substrate 10 forms photosensitive semiconductor film 17, then form photoresist 18 on photosensitive semiconductor film 17, photoresist 18 is exposed and develops.As shown in Figure 8, development rear section photoresist 18 is removed, and photoresist 18 reserve part correspondence is positioned at encapsulation region 102.As shown in Figure 9, etched substrate substrate 10 does not cover the photosensitive semiconductor film 17 of photoresist 18, form photosensitive semiconductor pattern 15.Finally, removed by photoresist 18, underlay substrate 10 forms semiconductor photoactive layer, and semiconductor photoactive layer comprises: the photosensitive semiconductor pattern 15 being positioned at encapsulation region 102, as shown in Figure 5.
Preferably, semiconductor photoactive layer also comprises: the active layer pattern being positioned at viewing area.Semiconductor photoactive layer also comprises the active layer pattern of viewing area, then just can be formed with active layer pattern in viewing area when exposing by arranging mask plate.
Optionally, underlay substrate is formed photosensitive semiconductor film, and before obtaining semiconductor photoactive layer to photosensitive semiconductor patterning thin film, method also comprises: on underlay substrate, form insulation course 16, described insulation course 16 at least covers encapsulation region, and the display base plate of formation as shown in Figure 6.
Embodiments provide a kind of method for making of display panel, as shown in Figure 10, comprising:
Step 101, the encapsulation region of first substrate formed sealed plastic box.
Step 102, by first substrate and second substrate to box; The display base plate that second substrate provides for the embodiment of the present invention, as shown in figure 11, second substrate 202 is formed with photosensitive semiconductor pattern 15 in encapsulation region, and sealed plastic box 14 directly contacts with the photosensitive semiconductor pattern 15 of second substrate 202 encapsulation region 102.
Step 103, utilize ultraviolet light from first substrate 201 away from photosensitive semiconductor pattern side irradiate sealed plastic box 14, to be cured sealed plastic box 14.
Embodiments provide a kind of method for making of display panel, second substrate is formed with photosensitive semiconductor pattern in encapsulation region, ultraviolet light polymerization is carried out to sealed plastic box adopting sealed plastic box to encapsulate with first substrate, ultraviolet light from first substrate away from photosensitive semiconductor pattern side irradiate photosensitive semiconductor pattern time, under the catalysis of ultraviolet light, photosensitive semiconductor pattern generates unstable free electron and hole, free electron and hole combine and form free radical, free radical can accelerate the solidification of sealed plastic box, thus sealed plastic box is accelerated in the side solidification away from ultraviolet light, improve the solidification homogeneity of sealed plastic box.
Embodiments provide a kind of display panel 200, as shown in figure 12, comprise the first substrate 201 to box and second substrate 202, second substrate 202 is formed with photosensitive semiconductor pattern 15 in encapsulation region, encapsulation region 102 and the second substrate 202 of first substrate 201 are bonding by sealed plastic box 14, sealed plastic box 14 is positioned at encapsulation region 102, and sealed plastic box 14 directly contacts with photosensitive semiconductor pattern 15.Wherein, sealed plastic box comprises: light trigger and light-cured resin.
Preferably, sealed plastic box also comprises: adjuvant, and adjuvant produces the efficiency of free radical after illumination for improving photosensitive semiconductor pattern.Adjuvant can accelerate the efficiency of free electron and hole formation free radical further, to improve the curing efficiency of photoresist further.
Optionally, adjuvant comprises: at least one in azo-compound, organic or inorganic superoxide.Certainly, the kind of adjuvant be also not limited to above-mentioned enumerate several, the embodiment of the present invention is only described for above-mentioned.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of described claim.

Claims (13)

1. a display base plate, comprises viewing area and surrounds the encapsulation region of described viewing area, it is characterized in that, comprising:
Underlay substrate;
To be arranged on described underlay substrate and to be positioned at the photosensitive semiconductor pattern of described encapsulation region.
2. display base plate according to claim 1, is characterized in that, also comprises: the active layer pattern being positioned at described viewing area;
Described photosensitive semiconductor pattern and the same material of described active layer pattern, and the photosensitive semiconductor pattern of described active layer pattern and described encapsulation region is formed with a composition.
3. display base plate according to claim 1 and 2, it is characterized in that, described display base plate also comprises: be positioned at the insulation course on described underlay substrate, and described insulation course at least covers described encapsulation region, and described photosensitive semiconductor pattern is formed on described insulation course.
4. display base plate according to claim 3, is characterized in that, described insulation course also covers described viewing area.
5. display base plate according to claim 1, is characterized in that, encapsulation region described in described photosensitive semiconductor pattern covers.
6. a method for making for display base plate, described display base plate comprises viewing area and surrounds the encapsulation region of described viewing area, it is characterized in that, described method for making comprises:
Underlay substrate is formed photosensitive semiconductor film, and obtains semiconductor photoactive layer to described photosensitive semiconductor patterning thin film, described semiconductor photoactive layer comprises: the photosensitive semiconductor pattern being positioned at described encapsulation region.
7. method for making according to claim 6, is characterized in that, described semiconductor photoactive layer also comprises: the active layer pattern being positioned at viewing area.
8. the method for making according to claim 6 or 7, is characterized in that, underlay substrate is formed photosensitive semiconductor film, and before obtaining semiconductor photoactive layer to described photosensitive semiconductor patterning thin film, described method also comprises:
Underlay substrate forms insulation course, and described insulation course at least covers described encapsulation region.
9. method for making according to claim 8, is characterized in that, described insulation course also covers described viewing area.
10. a display panel, comprise the first substrate to box and second substrate, it is characterized in that, described first substrate or described second substrate are the display base plate described in any one of claim 1-5, it is bonding that the encapsulation region of described first substrate and described second substrate pass through sealed plastic box, described sealed plastic box is positioned at encapsulation region, and directly contacts with described photosensitive semiconductor pattern.
11. display panels according to claim 10, is characterized in that, described sealed plastic box also comprises: adjuvant, and described adjuvant produces the efficiency of free radical after illumination for improving described photosensitive semiconductor pattern.
12. display panels according to claim 11, is characterized in that, described adjuvant comprises: at least one in azo-compound, organic or inorganic superoxide.
The method for making of 13. 1 kinds of display panels, is characterized in that, comprising:
Sealed plastic box is formed in the encapsulation region of first substrate;
By first substrate and second substrate to box; Wherein, described second substrate directly contacts with the photosensitive semiconductor pattern of described display base plate encapsulation region for the display base plate described in any one of claim 1-5, described sealed plastic box;
Ultraviolet light is utilized to irradiate described sealed plastic box, to be cured described sealed plastic box from the side away from described photosensitive semiconductor pattern of first substrate.
CN201510490258.9A 2015-08-11 2015-08-11 Display substrate and manufacturing method thereof and display panel and manufacturing method thereof Pending CN104991383A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Cited By (4)

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Publication number Priority date Publication date Assignee Title
WO2018176704A1 (en) * 2017-03-31 2018-10-04 惠科股份有限公司 Preparation method for substrate, and display panel and preparation method therefor
CN108918349A (en) * 2018-03-23 2018-11-30 张家港康得新光电材料有限公司 Measure the device and method of the dispersate number of particles and/or partial size in disperse system
CN109445156A (en) * 2018-12-24 2019-03-08 惠科股份有限公司 Display panel, display device and display panel manufacturing method
CN109309174B (en) * 2018-12-07 2021-11-05 合肥鑫晟光电科技有限公司 Display panel and packaging method thereof

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CN102654689A (en) * 2011-12-14 2012-09-05 北京京东方光电科技有限公司 Frame sealing glue, frame sealing glue photocuring method and liquid crystal display device
CN103676339A (en) * 2013-12-18 2014-03-26 合肥京东方光电科技有限公司 Color membrane substrate and manufacturing method thereof
CN104297990A (en) * 2014-10-22 2015-01-21 合肥鑫晟光电科技有限公司 Colored film substrate and manufacturing method thereof, display panel and manufacturing method thereof, and display device
CN104793408A (en) * 2015-05-07 2015-07-22 合肥鑫晟光电科技有限公司 Display panel and display device

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Publication number Priority date Publication date Assignee Title
US20020089633A1 (en) * 2001-01-09 2002-07-11 International Business Machines Corporation System and method for producing thin film patterns interspersed with voids to admit light to otherwise shadowed regions
CN102654689A (en) * 2011-12-14 2012-09-05 北京京东方光电科技有限公司 Frame sealing glue, frame sealing glue photocuring method and liquid crystal display device
CN103676339A (en) * 2013-12-18 2014-03-26 合肥京东方光电科技有限公司 Color membrane substrate and manufacturing method thereof
CN104297990A (en) * 2014-10-22 2015-01-21 合肥鑫晟光电科技有限公司 Colored film substrate and manufacturing method thereof, display panel and manufacturing method thereof, and display device
CN104793408A (en) * 2015-05-07 2015-07-22 合肥鑫晟光电科技有限公司 Display panel and display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018176704A1 (en) * 2017-03-31 2018-10-04 惠科股份有限公司 Preparation method for substrate, and display panel and preparation method therefor
CN108918349A (en) * 2018-03-23 2018-11-30 张家港康得新光电材料有限公司 Measure the device and method of the dispersate number of particles and/or partial size in disperse system
CN109309174B (en) * 2018-12-07 2021-11-05 合肥鑫晟光电科技有限公司 Display panel and packaging method thereof
CN109445156A (en) * 2018-12-24 2019-03-08 惠科股份有限公司 Display panel, display device and display panel manufacturing method

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Application publication date: 20151021