CN104883817B

CN104883817B - Module device and electronic apparatus having the same

Info

Publication number: CN104883817B
Application number: CN201410708113.7A
Authority: CN
Inventors: 李起远; 赵成镐; 李斗焕; 黄崇哲
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2014-02-28
Filing date: 2014-11-28
Publication date: 2020-01-14
Anticipated expiration: 2034-11-28
Also published as: CN104883817A; KR20150102555A; KR102214401B1

Abstract

A module device provided on a circuit board of an electronic apparatus and an electronic apparatus having the module device are provided. The module device includes: a main body including an upper case and a lower case for accommodating the module; an extension portion extending outward from one end of the lower case, exposed outward from the main body; and a flexible circuit provided on one surface of the lower case and exposed above the extension portion for engagement with the circuit board.

Description

Module device and electronic apparatus having the same

Technical Field

The present disclosure relates generally to a module device, and more particularly, to a module device provided on a circuit board in an electronic apparatus.

Background

Generally, electronic devices such as portable terminals are equipped with many functions including a camera, voice, mail, MP3 player, video, data, and the like. Nowadays, more and more functions are added to electronic devices, such as temperature measurements, Ultraviolet (UV) measurements, blood glucose measurements, sensing of vital signs of a user, etc. To provide these various functions, the electronic device has modules for performing these functions. The module is electrically connected to the circuit board.

For example, a microphone that receives sound, a receiver and speaker that transmit sound, a camera that captures pictures or images, a vibration motor that provides various feedback (e.g., vibrations other than sound) to transmit signals to a user, and the like may be electrically connected to the circuit board.

If the modules are mounted on a circuit board in an electronic device, additional connectors are provided to each module to electrically connect the module to the circuit board. Specifically, a flexible connector (e.g., a wire or a flexible circuit) at the module connection end is electrically connected to the circuit board by a process such as soldering.

When the connector is engaged with the circuit board, the connector may be electrically connected to the circuit board, and thus may transmit or receive a signal to or from the circuit board.

However, additional connectors are required in order to electrically connect the module to the circuit board.

In addition, the number of manufacturing processes of the electronic device is increased due to the need for a process (e.g., soldering) of electrically connecting the connector to the module or the circuit board.

Soldering the connectors results in an increase in the size of the module, the connectors occupying a large amount of space on the circuit board.

The above information is provided as background information only to aid in the understanding of the present disclosure. There is no determination, nor is there any assertion, as to whether any of the above can be considered prior art with respect to the present disclosure.

Disclosure of Invention

An aspect of the present disclosure is to address at least the above problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the present disclosure is to provide a module device having a simplified structure.

Another aspect of the present disclosure is to provide a module device that does not require a connector for electrical connection of a circuit board, for example, an additional substrate or a wire.

Another aspect of the present disclosure is to provide a module device configured to contact a circuit board through a C-clip (C-clip) of the circuit board so that the number of processes may be minimized and reliability of connection between the module device and the C-clip of the circuit board may be increased.

According to one aspect of the present disclosure, a module device disposed on a circuit board of an electronic apparatus is provided. The module device includes: a main body including an upper case and a lower case for accommodating the module; an extension portion extending outward from one end of the lower case, exposed outward from the main body; and a flexible circuit provided on one surface of the lower case and exposed above the extension portion for engagement with a circuit board.

According to another aspect of the present disclosure, a module device disposed on a circuit board of an electronic apparatus is provided. The module device includes: a main body including an upper case and a lower case for accommodating the module; an extension part extending outward from one end of the lower case and exposed outward from the main body; a flexible circuit provided on one surface of the lower case, wherein one end of the flexible circuit is bent to be exposed above the extension portion for engagement with the circuit board; a support between the flexible circuit and the extension portion for supporting the flexible circuit; and a fixing member between a portion of the main body and the flexible circuit for fixing the curved surface of the flexible circuit.

According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes: a circuit board; a C-clip mounted on the circuit board; and a module device disposed on the circuit board and electrically connected to the C-clip. The module device includes: a main body including an upper case and a lower case for accommodating the module; an extension part extending outward from one end of the lower case and exposed outward from the main body; a flexible circuit including a first connection surface sandwiched between the upper case and the lower case for electrical connection to the module, and a second connection surface extending from the first connection surface toward the extension portion and bent from the first connection surface for electrical connection to the circuit board; a support between the flexible circuit and the extension portion for supporting the flexible circuit; and a fixing member between a portion of the main body and the flexible circuit for fixing the curved surface of the flexible circuit.

According to another aspect of the present disclosure, a module device disposed on a circuit board of an electronic apparatus is provided. The module device includes: a main body including an installation space for receiving a module; and a flexible circuit mounted on a surface of the mounting space and a surface of the end of the body adjacent to the mounting space. The flexible circuit on the surface of the end of the body engages the circuit board, electrically connected to the circuit board.

According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes: a circuit board; a C-clip mounted on the circuit board; and a module device disposed on the circuit board and electrically connected to the C-clip. The module device includes: a main body including an installation space for receiving a module; and a flexible circuit including a first connection surface provided on a surface of the mounting space for electrical connection to the module, and a second connection surface connected to one end of the first connection surface and bent on the body surface so as to be exposed on an upper surface of the end of the body for engagement with the circuit board; a support between the flexible circuit and the extension portion for supporting the flexible circuit; and a fixing member between a portion of the main body and the flexible circuit for fixing the curved surface of the flexible circuit.

Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses exemplary embodiments of the disclosure.

Drawings

The foregoing and other aspects, features, and advantages of certain exemplary embodiments of the present disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which:

fig. 1 illustrates a module device disposed on a circuit board of an electronic device according to an embodiment of the present disclosure;

FIG. 2 is a cross-sectional view of a modular device disposed on a circuit board of an electronic device according to an embodiment of the present disclosure;

FIG. 3 illustrates a second connection surface below a body in a modular device according to an embodiment of the disclosure;

fig. 4A and 4B illustrate mounting of a modular device on a circuit board of an electronic device according to an embodiment of the present disclosure;

FIG. 5 illustrates a module device disposed on a circuit board of an electronic device according to another embodiment of the present disclosure;

FIG. 6 is a rear view of a modular device disposed on a circuit board of an electronic device according to another embodiment of the present disclosure;

FIG. 7 is a cross-sectional view of a modular device disposed on a circuit board of an electronic device according to another embodiment of the present disclosure;

FIG. 8 illustrates a second connection surface lower than a body in a modular device according to another embodiment of the present disclosure; and

fig. 9A and 9B illustrate mounting of a module device on a circuit board of an electronic device according to another embodiment of the present disclosure.

It should be understood that like reference numerals are used to indicate like parts, assemblies and structures throughout the figures.

Detailed Description

The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of exemplary embodiments of the present disclosure as defined by the claims and their equivalents. The following description includes various specific details to aid understanding, but these specific details should be considered exemplary only. Accordingly, those skilled in the art will recognize that many changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are not limited to a literal meaning, but are used only by the inventors to achieve a clear and consistent understanding of the invention. Accordingly, it will be appreciated by those skilled in the art that the following descriptions of the exemplary embodiments of the present disclosure are provided for illustration only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.

It is to be understood that the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more such surfaces.

It is to be understood that the term "substantially" as used herein is intended to mean that the characteristic, parameter or value need not be exactly achieved, but that deviations or variations may occur within a range that does not preclude the effect that the characteristic is intended to provide, including for example tolerances, measurement error, measurement accuracy limitations and other factors well known to those of skill in the art.

The electronic device according to the present disclosure may be any of a terminal, a portable terminal, a mobile terminal, a communication terminal, a portable mobile terminal, a display device, and the like.

For example, the electronic device may be a combination of two or more of one or more of a variety of devices, such as a smart phone, a portable phone, a navigator, a game console, a Television (TV), an in-vehicle head unit (in-vehicle head unit), a laptop computer, a tablet computer, a Portable Multimedia Player (PMP), a Personal Digital Assistant (PDA), and so forth. The electronic device may be implemented as a pocket-sized portable communication terminal having wireless communication capabilities. Further, the electronic device may be a flexible device or a flexible display device.

The following description is based on the understanding that: for example, a module device according to an embodiment of the present disclosure is a coin-type vibration motor provided in an electronic apparatus (e.g., a portable terminal), and a module device according to another embodiment of the present disclosure is a receiver provided in an electronic apparatus (e.g., a portable terminal). However, the module device is not limited to the coin type vibration motor or the receiver. For example, as long as a module such as a speaker, a microphone, a camera, and the like is mounted on a circuit board of an electronic device, various modifications and variations can be made to the module device according to the embodiments of the present disclosure.

In the module device according to the embodiment of the present disclosure, the position of the flexible circuit may be changed in consideration of the position of the module device mounted in the electronic apparatus. For example, if the module device is disposed on a circuit board, the flexible circuit may be flush with, higher than, or lower than one surface of the module. That is, the second connection surface 12b described later is flush with, higher than, or lower than one surface of the module device 10. The height of the second connection surface 12b may be changed according to the engagement state between the module device 10 and the circuit board 1 electrically connected to the module device 10.

Fig. 1 illustrates a module device provided on a circuit board of an electronic apparatus according to an embodiment of the present disclosure, and fig. 2 is a sectional view of the module device provided on the circuit board of the electronic apparatus according to an embodiment of the present disclosure.

Referring to fig. 1 and 2, a module device 10 according to an embodiment of the present disclosure may include: a main body 11, an extension 11aa, and a flexible circuit 12. The modular device 10 may also comprise a support 13 and a fixture 14.

The main body 11 may include a lower case 11a and an upper case 11b mounted on the lower case 11 a. At least a part of the periphery of the lower case 11a, an extension 11aa extends from one surface of the main body 11, being exposed outward without being covered by the upper case 11 b.

A coin type vibration motor or an operation member of the module 15 such as a speaker, a receiver, a microphone, or a camera may be installed in a space between the upper case 11b and the lower case 11 a.

Although the main body 11 includes the lower case 11a and the upper case 11b covering the module 15 mounted on the lower case 11a in the embodiment of the present disclosure, the main body 11 is not limited to this specific structure. For example, in another embodiment of the present disclosure described below, the module device 20 may include a main body 21 as a single piece, and a mounting space 21a such as an insertion groove may be formed in the main body 21 so as to accommodate the module 25. That is, the module 25 is fixedly installed in the installation space 21a defined by the insertion groove, and the main body 21 in which the module 25 is fixed is electrically connected with the C-clip 2 of the circuit board 1 in the electronic device. Accordingly, in various embodiments of the present disclosure (referring to fig. 5 and 7), the

body

11 or 21 may be modified or changed in various ways according to the shape, structure, or position of the

module device

10 or 20 mounted on the circuit board 1.

The flexible circuit 12 may be disposed on one surface of the lower case 11a above the extension 11aa, and electrically connected with the module 15 and the connector 2 of the circuit board 1. Specifically, the flexible circuit 12 may be disposed on one surface of the lower case 11a, and thus electrically connected with the module 15 mounted on the lower case 11 a. Further, the flexible circuit 12 may be exposed above the extension 11aa and directly engaged with the connector 2 of the circuit board 2 for electrical connection to the connector 2.

The flexible circuit 12 may include a first connection surface 12a and a second connection surface 12 b.

The first coupling surface 12a may be provided on one surface of the lower case 11a, specifically, one surface of the lower case 11a covered by the upper case 11 b. Since the module 15 is mounted on the first connection surface 12a, the first connection surface 12a can be electrically connected with the module 15.

The second connection surface 12b may extend from the first connection surface 12a toward the extension part 11aa and then be mounted above the extension part 11 aa. The second connection surface 12b may be bent from the first connection surface 12a toward the surface of the upper case 11b, and may be directly engaged with the connector 2 of the circuit board 1. According to the embodiment of the present disclosure, the extension part 11aa extends from one surface of the lower case 11a, and the second connection surface 12b is bent to be distant from the extension part 11aa, which should not be construed as limiting the present disclosure. The extension part 11aa may be bent from one surface of the body 11, and the second connection surface 12b may be mounted on the surface of the bent extension part 11 aa. Thus, the support 13 may be disposed under the extension part 11aa, thereby supporting the bent extension part 11aa and the second connection surface 12 b.

Although the second connection surface 12b is flush with the surface of the upper case 11b in the module device 10 according to the embodiment of the present disclosure, the height of the second connection surface 11b is not limited thereto. For example, as shown in fig. 3, 4A and 4B, the second connection surface 12B may be lower than the surface of the upper case 11B (refer to fig. 8 and 9, the surface of the main body 21 in another embodiment of the present disclosure) by a predetermined value. Or although not shown, the second connection surface 12b may be higher than the surface of the upper case 11b by a predetermined value. The height of the second connection surface 12b may vary depending on the engagement mechanism between the module device 10 and the circuit board 1 (specifically, the structure or shape of the connector 2 of the circuit board 1 or the module device 10).

FIG. 3 illustrates a second connection surface below a body in a modular device according to an embodiment of the disclosure; fig. 4A and 4B illustrate mounting of a module device on a circuit board of an electronic device according to an embodiment of the present disclosure.

Referring to fig. 3, 4A and 4B, the module device 10 may be mounted on a circuit board 1 of an electronic apparatus according to an embodiment of the present disclosure. For example, the connector 2 (herein, a C-clip) protrudes from the circuit board 1 to the C-clip so as to electrically connect the module device 10 to the circuit board 1, and thus the height t2 of the second connection surface 12b of the module device 10 is smaller than the height t1 of the surface of the main body 11. As described above, the height t2 of the second connection surface 12b may be equal to or greater than the height t1 of the surface of the body 11. That is, the height t2 of the second connection surface 12b may be changed according to the shape of the circuit board 1, the position of the module device 10 on the circuit board 1, or the position or shape of the connector 2 on the circuit board 1.

According to an embodiment of the present disclosure, a connector 2 may be provided on the circuit board 1 inside the electronic device to be electrically connected to the module device 10. Here, the connector 2 may be a C-clip, for example. Therefore, the height t2 of the second connection surface 12b may be smaller than the height t1 of the surface of the main body 11 of the module device 10 in consideration of the height of the C-clip 2 or the engagement force between the module device 10 and the C-clip 2 on the circuit board 1. When the module device 10 is mounted on the circuit board 1, the C-clip 2 applies a force to the module device 10 in a direction opposite to the engagement direction of the module device 10 with the circuit board 1. Nevertheless, the module device 10 can be engaged with the circuit board 1 with a certain engagement force maintained. However, the height t2 of the second connection surface 12b may be changed in consideration of the engagement mechanism between the module device 10 and the connector 2 of the circuit board 1 or the height of the module device 10 after the module device 10 is engaged with the circuit board 1.

The support 13 may be sandwiched between the extension part 11aa and the second connection surface 12b so as to support the second connection surface 12b bent away from the extension part 11 aa. The support 13 may be formed of an elastic material or plastic. For example, if the module 15 is a vibration motor and the support 13 is an elastic member formed of rubber or silicon rubber, the elastic member may absorb vibration generated from the vibration motor, thereby reducing vibration applied to the second connection surface 12 b.

The fixing member 14 may be located in a space between the curved surface 12c of the second coupling surface 12b and the housing of the main body 11 (specifically, a side surface of the upper housing 11 b), thereby fixing the curved surface 12 c. The fixing piece 14 can prevent the second connection surface 12b from being damaged or deformed by a collision or the like by fixing the second connection surface 12b to the main body 11. The fixing member 14 may be formed of an elastic material or plastic. For example, if the module 15 is a vibration motor and the fixing member 14 is an elastic member formed of rubber or silicon rubber, the fixing member 14 may partially absorb vibration generated from the vibration motor, thereby reducing vibration applied to the second connection surface 12 b.

As described above, the module 15 may be at least one of a coin motor, a receiver, a speaker, a microphone, or a camera.

If the second connection surface 12b is provided in the main body 11 and the main body 11 is mounted on the circuit board 1, the second connection surface 12b can be directly connected with the C-clip 2 of the circuit board 1. Therefore, the module device 10 according to the embodiment of the present disclosure avoids the need for an additional substrate to electrically connect the module device 10 with the C-clip 2 of the circuit board 1. Further, since the second connection surface 12b can be bent to a variable height according to the shape of the circuit board 1, the engagement reliability can be increased and the engagement height can be controlled. Therefore, the height of the module device 10 engaged with the circuit board 1 can be adjusted. Since the module device 10 can occupy a reduced space and can be miniaturized, the mounting space of the module device 10 on the circuit board 1 can be reduced. If an additional substrate is used to connect the module device 10 to the circuit board 1, additional processes such as soldering are required. However, since the module device 10 directly contacts the C-clip 2 of the circuit board 1, the number of processes can be minimized, and the module device 10 can be more reliably connected to the circuit board 1.

FIG. 5 illustrates a module device disposed on a circuit board of an electronic device according to another embodiment of the present disclosure; fig. 6 is a rear view of a modular device disposed on a circuit board of an electronic device according to another embodiment of the present disclosure.

Referring to fig. 5 and 6, a module device 20 provided on a circuit board (circuit board 1 in fig. 9) of an electronic apparatus according to another embodiment of the present disclosure may include a main body 21 and a flexible circuit 22. The module device 20 is similar to the module device 10 of the above-described embodiment, except that the module device 20 includes the main body 21 as one piece and thus the shape of the flexible circuit 22 is different. For example, in this embodiment, the module 25 is a device for converting an electric signal into an audio signal and transmitting the audio signal. For example, the module device 20 is described as an audio device since the structure of the module device 20 may be suitable for an audio device. However, the module device 20 is not limited to a specific device. As described above, the module 25 may be at least one of a receiver, a coin-type vibration motor, a microphone, a camera, or a speaker.

Fig. 7 is a cross-sectional view of a modular device disposed on a circuit board of an electronic device according to another embodiment of the present disclosure. Specifically, referring to fig. 7, according to an embodiment of the present disclosure, a mounting space 21a having a groove (similar to an insertion groove formed therein) may be formed in the main body 21 so as to receive the module 25. That is, the module 25 is mounted in the mounting space 21a defined by the insertion groove. Since the module 25 is fixed in the mounting space 21a, the main body 21 can be electrically connected to the C-clip 2 of the circuit board 1. The flexible circuit 22 is provided on the surface of the mounting space 21a and at a portion of the main body 21 adjacent to the surface of the mounting space 21a (flush with the surface of the main body 21 in fig. 7, or lower than the surface of the main body 21 in fig. 8) so that the flexible circuit 22 can be electrically connected to the module 25 mounted in the mounting space 21a, and the flexible circuit 22 at the end of the main body 21 (specifically, the second connection surface 22b of the flexible circuit 22) can be electrically connected to the C-clip 2 of the circuit board 1 when the main body 21 is mounted on the circuit board 1 of the electronic apparatus.

According to embodiments of the present disclosure, the flexible circuit 22 may include a first connection surface 22a and a second connection surface 22 b.

The first connection surface 22a may be disposed on a surface of the installation space 21a and electrically connected with the module 25.

The second connection surface 22b is connected to one end of the first connection surface 22a, and is bent from the first connection surface 22a so that the second connection surface 22b can be exposed from the surface of the installation space 21a to the upper surface of the end of the main body 21. When the main body 21 is mounted on the circuit board 1, the second connection surface 22b directly contacts the circuit board 1.

Although the second connection surface 22b may be disposed at an upper portion of one end of the body 21 to extend from the surface of the installation space 21a, the second connection surface 22b is not limited to this specific structure. For example, the second connection surface 22b may be connected to one end of the first connection surface 22a to be exposed on a lower surface of one end of the body 21. Therefore, the second connection surface 22b may be disposed on the upper surface or the lower surface of the main body 21 depending on the position where the main body 21 is mounted on the circuit board 1.

As briefly described in the above-described embodiments of the present disclosure, the second connection surface 22b of the module device 20 is flush with the surface of the main body 21, wherein the structure should not be construed as limiting the present disclosure. For example, the second connection surface 22B may be lower than the surface of the body 21 by a predetermined value (refer to fig. 8, 9A, and 9B) or higher than the surface of the body 21 by a predetermined value (not shown). The height of the second connection surface 22b may be changed according to an engagement mechanism between the connector 2 of the circuit board 1 and the module device 20, or the structure or shape of the module device 20.

FIG. 8 illustrates a second connection surface lower than a body in a modular device according to another embodiment of the present disclosure; and fig. 9A and 9B illustrate mounting of a module device on a circuit board of an electronic device according to another embodiment of the present disclosure.

Referring to fig. 8, 9A, and 9B, the module device 20 may be mounted on the circuit board 1 of the electronic apparatus according to an embodiment of the present disclosure. For example, it should be noted that the C-clip 2 protrudes on the circuit board 1 to be electrically connected to the module device 20. Therefore, the height t2 of the second connection surface 22b of the module device 20 is smaller than the height t1 of the surface of the main body 21. When the module device 20 is mounted on the circuit board 1, a force can be applied to the module device 20 in a direction opposite to the engagement direction of the module device 20 and the circuit board 1 due to the C-type clip 2. Nevertheless, the module device 20 can be engaged with the circuit board 1 with a certain engagement force maintained. However, as described above, the height t2 of the second connection surface 22b may be equal to or greater than the height t1 of the surface of the main body 21. This means that the height t2 of the second connection surface 22b can be changed according to the shape of the circuit board 1, the position where the module device 20 is mounted on the circuit board 1, the position of the connector 2 on the circuit board 1, or the shape of the connector 2.

According to one embodiment of the present disclosure, a connector 2 may be provided on the circuit board 1 inside the electronic device for electrically connecting the module devices 10. Here, the connector 2 may be a C-clip, for example. Therefore, the height t2 of the second connection surface 12b may be smaller than the height t1 of the surface of the main body 11 of the module device 10 in consideration of the height of the C-clip 2 or the engagement force between the module device 10 and the C-clip 2 on the circuit board 1. However, the height t2 of the second connection surface 12b may be changed in consideration of the engagement mechanism between the module device 10 and the connector 2 of the circuit board 1 or the height of the module device 10 after the module device 10 is engaged with the circuit board 1.

Therefore, in another embodiment of the present disclosure, an additional substrate is not required in order to electrically connect the module device 20 with the C-clip 2 of the circuit board 1. Furthermore, since the module device 20 can be made smaller, the module device 20 can occupy less space on the circuit board 1. With an additional substrate, additional processes such as soldering should be required. In contrast, in the embodiment of the present disclosure, since the module device 20 may be directly contacted to the circuit board 1, the number of processes may be minimized, and the module device 20 may be more reliably connected to the circuit board 1.

It should be clear from the above description that no connectors, such as e.g. substrates or wires, are required for electrically connecting the module device with the circuit board. Furthermore, since the module device can be made smaller, the module device can occupy less space on the circuit board. With an additional substrate, additional processes such as soldering should be required. In contrast, since the module device can be directly contacted to the circuit board by the C-clip mounted on the circuit board, the number of processes can be minimized, and the module device can be more reliably connected to the circuit board.

While the disclosure has been shown and described with reference to certain exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.

Claims

1. A modular device disposed on a circuit board of an electronic device, the modular device comprising:

a main body including an upper case and a lower case for accommodating the module therein;

an extension portion extending outward from one end of the lower case, exposed outward from the main body; and

a flexible circuit disposed on an inner surface of the lower case for electrical connection with the module,

wherein the circuit board is disposed outward from the main body and includes at least one connection terminal,

wherein at least a portion of the flexible circuit is configured to be exposed outwardly from the main body to above the extension portion to be electrically connected with the at least one connection terminal, an

Wherein the at least one portion of the flexible circuit is spaced apart from the upper case of the main body by a height of a connection terminal of the circuit board.

2. The modular device of claim 1 wherein the flexible circuit comprises:

a first connecting surface sandwiched between the upper and lower housings for electrical connection to the module; and

and a second connection surface extending from the first connection surface to the extension portion and bent from the first connection surface for electrical connection to the circuit board.

3. The modular device of claim 2 wherein the second connection surface is above, flush with, or below the body.

4. The modular device of claim 2, further comprising: a support between the extension portion and the second connection surface for supporting the second connection surface.

5. The modular device of claim 2, further comprising: a fixing member between a portion of the body and the curved surface of the second coupling surface for fixing the curved surface.

6. The modular device of claim 1 wherein the module is at least one of a receiver, a speaker, a microphone, a camera, and a vibration motor.

7. A modular device disposed on a circuit board of an electronic device, the modular device comprising:

an extension part extending outward from one end of the lower case and exposed outward from the main body;

a flexible circuit disposed on an inner surface of the lower case for electrical connection with the module;

a support between the flexible circuit and the extension portion for supporting the flexible circuit; and

a fixing member between a portion of the main body and the flexible circuit for fixing a curved surface of the flexible circuit,

wherein at least a portion of the flexible circuit is configured to be exposed outwardly from the main body and is configured to be bent to be exposed over the extension portion to be electrically connected with the at least one connection terminal, an

8. An electronic device, comprising:

a circuit board;

a C-clip mounted on the circuit board; and

a module device disposed on the circuit board and electrically connected to the C-clip,

wherein the module device comprises:

a flexible circuit including a first connection surface sandwiched between the upper case and the lower case for electrical connection to the module, and a second connection surface extending from the first connection surface toward the extension portion and bent from the first connection surface for electrical connection to the circuit board;

wherein the circuit board is disposed outward from the main body,

wherein at least a portion of the flexible circuit is configured to be exposed outwardly from the body, an

Wherein the second connection surface of the flexible circuit is spaced apart from the upper housing of the body by a height of a C-clip on the circuit board.

9. The electronic device of claim 8, wherein the second connection surface is above, flush with, or below the body.

10. A modular device disposed on a circuit board of an electronic device, the modular device comprising:

a main body including an installation space for receiving a module therein; and

a flexible circuit mounted on an inner surface of the mounting space and a surface of the end of the body adjacent to the mounting space,

wherein a flexible circuit on a surface of the end of the body is electrically connected to the circuit board,

Wherein the at least one portion of the flexible circuit is spaced apart from the upper case of the main body by a height of the connection terminal of the circuit board.

11. The modular device of claim 10 wherein the flexible circuit comprises:

a first connection surface provided on a surface of the installation space for electrically connecting to the module; and

a second connecting surface connected to one end of the first connecting surface and bent on the surface of the body so as to be exposed on an upper surface of the end of the body for engagement with the circuit board.

12. The modular device of claim 11 wherein the second connection surface is above, flush with, or below the body.

13. The modular device of claim 10 wherein the flexible circuit comprises:

a second connecting surface connected to one end of the first connecting surface and exposed on a lower surface of the end portion of the body for engagement with the circuit board.

14. The modular device of claim 10 wherein the module is at least one of a receiver, a speaker, a microphone, a camera, and a vibration motor.

15. An electronic device, comprising:

a circuit board;

a C-clip mounted on the circuit board; and

wherein the module device comprises:

a main body including an installation space for receiving a module therein; and

a flexible circuit including a first connection surface provided on a surface of the mounting space for electrical connection with the module and a second connection surface connected to one end of the first connection surface and bent on a surface of the body so as to be exposed on an upper surface of the end of the body for engagement with the circuit board;

wherein the circuit board is disposed outward from the main body,

Wherein the second connection surface of the flexible circuit is spaced apart from the upper surface of the body end by a height of a C-clip on the circuit board.

16. The electronic device of claim 15, wherein the second connection surface is above, flush with, or below the body.