CN104843488B - A kind of output device and cutting splitting system - Google Patents
A kind of output device and cutting splitting system Download PDFInfo
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- CN104843488B CN104843488B CN201510170532.4A CN201510170532A CN104843488B CN 104843488 B CN104843488 B CN 104843488B CN 201510170532 A CN201510170532 A CN 201510170532A CN 104843488 B CN104843488 B CN 104843488B
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- carrying platform
- output device
- output
- substrate
- cutting
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Abstract
The invention belongs to display technology field, and in particular to a kind of output device and cutting splitting system.The output device, including carrying platform, the upper surface of the carrying platform are provided with the supporting region for placing substrate to be output, and the supporting region is curved-surface structure.The output device, by the way that the supporting region of its carrying platform is arranged into curved-surface structure, the self gravitation of the substrate to be output finished using cutting, downward pendant power is produced, and combine the vacuum adsorption force of carrying platform, realize the sliver of substrate to be output.
Description
Technical field
The invention belongs to display technology field, and in particular to a kind of output device and cutting splitting system.
Background technology
In display technology field, to improve production efficiency, prepared generally on big plate (i.e. motherboard) and form unit display surface
The color film pattern or array pattern of plate, platelet is cut into by cutting mode after the shaping of display panel motherboard, it is more so as to be separated into
Individual independent display panel unit.
In the prior art, cutting splitting flow as shown in Figure 1, cutting splitting technique therein using cutter device 10,
The two parts of sliver apparatus 11, the carrying platform (Stage) of the two is planar structure.(Glass, can be by coloured silk for substrate motherboard 31
Ilm substrate 32 and array base palte 33 are formed) (cut) first is cut in cutter device 10, only in substrate motherboard after now break bar cutting
There is cut-in groove 101 on 31 surfaces, i.e., only form grooving on the surface of part substrate motherboard 31 of cutting position；Then by specific
Sliver apparatus 11 (generally including sliver bar 111) carries out sliver (break) at its back side, for example with rod-type sliver (bar
Type break), the sliver mode such as roller type sliver (roller type break) carry out sliver, substrate motherboard 31 is with table
Face cut-in groove 101, which further oozes, to be split so that cut-in groove 101 forms crack 112 through the thickness of whole substrate motherboard 31；So
The substrate motherboard 31 after sliver is transmitted into (transfer) by conveyer 12 afterwards and arrives output device 13, passes through output device 13
Carrying platform discharge (output)；Each display base plate in substrate motherboard 31 is completely separated finally by delaminating.
If without sliver after cutting, due to cutting can not complete natural cracking, after substrate motherboard 31 is discharged, pick up piece,
It is bad that the cutting such as flange easily occurs when delaminating；And after increasing specific breaking machine, not only floor space increases, and can increase
Cutting process entirety cycle period (cycle time).
It can be seen that design is a kind of to have cutting and sliver function concurrently simultaneously, shortening the cutting splitting system of cycle period turns into mesh
Preceding technical problem urgently to be resolved hurrily.
The content of the invention
The technical problems to be solved by the invention are for above shortcomings in the prior art, there is provided one kind output dress
Put with cutting splitting system, due to sliver can be realized in output device, compared with the prior art in cutting splitting system can save
Sliver apparatus therein is removed, reduces production cost, improves production efficiency and the quality of production.
Technical scheme is the output device used by solving present invention problem, including carrying platform, the carrying
The upper surface of platform is provided with the supporting region for placing substrate to be output, wherein, the supporting region is curved-surface structure.
Preferably, the upper epidermis of the carrying platform is the domes of evagination.
Preferably, the upper surface of the carrying platform is provided with the film of arch, and the film has highly-breathable.
Preferably, the film is arranged at the upper surface of the carrying platform by attaching mode.
Preferably, the center of curvature axis of the curved-surface structure or the arched film exports with carrying platform edge
The central axis in direction overlaps.
Preferably, in addition to vacuum mechanism, the carrying platform upper epidermis offer adsorption hole, the adsorption hole and institute
Vacuum mechanism is stated to be connected.
Preferably, in addition to rotation motor, the rotation motor are used for the base to be output to being arranged at the supporting region
Plate carries out Plane Angle rotation.
A kind of cutting splitting system, including cutter device and conveyer, for by with multiple unit display base plates
The cutting of substrate motherboard is separated into independent unit display base plate, wherein, in addition to above-mentioned output device.
Preferably, the layer of the conveyer is the domes of indent.
Preferably, the lower surface of the conveyer is provided with the film of indent, and the film has highly-breathable.
The beneficial effects of the invention are as follows：The output device, by the way that the supporting region of its carrying platform is arranged into curved-surface structure,
The self gravitation of the substrate to be output finished using cutting, downward pendant power is produced, and combines the vacuum adsorption force of carrying platform,
The sliver of substrate to be output is realized, improves production efficiency；
Using the cutting splitting system of the output device, sliver apparatus can be saved, shortens cutting cycle period, reduction is held
The floor space of carrying platform, reduce carrying platform cost；Meanwhile substrate to be output cuts that the degree of splitting is big, it is easy to follow-up pick up piece, stripping
Piece, bait drop, and reduction flange etc. is bad, improves the quality of production.
Brief description of the drawings
Fig. 1 is the schematic diagram of cutting splitting technique in the prior art；
Fig. 2 is the structural representation of output device in the embodiment of the present invention 1；
Fig. 3 is the structural representation of output device in the embodiment of the present invention 2；
Fig. 4 is the structural representation of conveyer in the embodiment of the present invention 2；
Fig. 5 is the schematic diagram of cutting splitting technique in the embodiment of the present invention 3；
In figure：
10- cutter devices；101- cut-in grooves；11- sliver apparatus；111- sliver bars；112- cracks；12- is passed
Send device；13- output devices；
21- carrying platforms；22- adsorption holes；23- rotation motors；24- films；
31- substrate motherboards；32- color membrane substrates；33- array base paltes.
Embodiment
To make those skilled in the art more fully understand technical scheme, below in conjunction with the accompanying drawings and specific embodiment party
Formula is described in further detail to output device of the present invention and cutting splitting system.
Embodiment 1：
The present embodiment provides a kind of output device, and the output device is changed by contacting the structure on surface with substrate to be output
Enter, realize sliver function while output, not only reduce occupation area of equipment, also shorten the cycle period of cutting.It is logical
In the case of often, substrate to be output is the motherboard that multiple cell boards can be separated into cutting splitting.For example, motherboard can be by color film
The substrate motherboard 31 that substrate 32 and array base palte 33 are formed.
As shown in Fig. 2 the output device includes carrying platform 21, the upper surface of carrying platform 21 is provided with treats for placement
The supporting region of output substrate motherboard 31, supporting region are curved-surface structure.Preferably, the upper epidermis of carrying platform 21 is the arch of evagination
Shape structure.Under the surface condition of carrying platform 21 of above-mentioned curved-surface structure, the substrate motherboard 31 after cutting is positioned over output dress
During 21 top of carrying platform put, because substrate motherboard 31 and carrying platform 21 are that curved face contact (rather than is put down in the prior art
Plane contact under the surface condition of face carrying platform 21), hence in so that substrate motherboard 31 does not connect with the surface curve of carrying platform 21
Contact portion point is produced downward pendant power by self gravitation effect, aggravates the cracking degree of cut-in groove 101.
It may further be preferable that the center of curvature axis of curved-surface structure or arched film and carrying platform 21 are along outbound course
Central axis overlap.Now, substrate motherboard 31 and the highest point that the line contact part of carrying platform 21 is carrying platform 21,
The cracking effect of preferable cut-in groove 101 can be obtained.
In the output device of the present embodiment, domes can according to the size of substrate motherboard 31 to be output, size, weight and
The position of cut-in groove 101 sets different radians or curvature.So that the domes of carrying platform 21 and the size phase of substrate motherboard 31
Matching, can greatly improve cracking effect.
Preferably, the output device also includes vacuum mechanism, and the upper epidermis of carrying platform 21 offers adsorption hole 22, absorption
Hole 22 is connected with vacuum mechanism.That is, the output device in the present embodiment, while being exported to substrate motherboard 31, except
By self gravitation effect aggravation cut-in groove 101 cracking, can also further by vacuum absorption holes 22 adsorbed to
Under the double action of the absorption affinity on the surface of carrying platform 21, sliver is better achieved.
In addition, the output device of the present embodiment also includes rotation motor 23, rotation motor 23 is used for being arranged at supporting region
Substrate motherboard 31 to be output carry out Plane Angle rotation.For example, substrate motherboard 31 is carried out to 90 ° of rotations in supporting region, just
In sliver of the unit display base plate in two mutually perpendicular directions.It is preferred that the rotation motor 23 is arranged under carrying platform 21
Side, the rotation of 90 ° or 180 ° of the progress of output substrate motherboard 31 is treated by rotation motor 23, so as to realize along vertical two
The sliver in direction, reach 0 ° or 90 ° can sliver effect.
Embodiment 2：
The present embodiment provides a kind of output device, and the difference of the output device and output device in embodiment 1 is that this holds
The upper surface of carrying platform 21 can be plane, and the structure of arch is set on its upper surface.
Preferably, the upper surface of carrying platform 21 is provided with the film 24 of arch, and the film 24 has highly-breathable.
It may further be preferable that film 24 is arranged at the upper surface of carrying platform 21 by attaching mode.
The other structures of output device are same as Example 1 in the present embodiment, can be with for example, in order to strengthen sliver effect
Vacuum absorption holes 22 and corresponding vacuum mechanism (setting the arched film of highly-breathable, do not interfere with adsorption effect) are set；
In order to realize sliver of the substrate motherboard 31 in two vertical direction, the rotation motor 23 rotated can be provided for, here no longer
It is described in detail.
Output device in embodiment 1 and embodiment 2, by the way that the supporting region of its carrying platform is arranged into curved-surface structure,
The self gravitation of the substrate motherboard to be output finished using cutting, downward pendant power is produced, and the vacuum for combining carrying platform is inhaled
Attached power, realize the sliver of substrate motherboard to be output.
Embodiment 3：
The present embodiment provides a kind of cutting splitting system, including cutter device 11 and conveyer 12, more for that will have
The substrate motherboard cutting of individual unit display base plate is separated into independent unit display base plate, in addition to embodiment 1 or embodiment 2
Output device 13.
As shown in figure 5, exemplified by using the output device 13 in embodiment 1, the course of work of the cutting splitting system is：
Substrate motherboard 31 (Glass) first cuts (cut) in cutter device 10, is now only formed on the segment glass surface of cutting position
Grooving (according to the set location of cutter head in cutter device 10, grooving can be formed in the upper surface of substrate motherboard 31, or in base
The upper and lower surface of plate motherboard 31 respectively forms grooving)；Then (transfer) sliver is transmitted using conveyer 12
Substrate motherboard 31 afterwards, in transmit process, substrate motherboard 31 is carried out 90 ° of rotations of plane by conveyer 12 by rotation motor
Turn；Then substrate motherboard 31 is sent to the carrying platform 21 of output device 13, and then carried by the arch of output device 13
Platform 21 discharges (output), carries out sliver by the self gravitation of substrate motherboard 31 and vacuum adsorption force while discharge, makes
The glass for obtaining cutting position largely permeates cracking, and grooving runs through the thickness of whole substrate motherboard 31；Finally by delaminating
It is completely separated each unit display base plate in substrate motherboard 31.
In the cutting splitting system, because sliver can realize nature sliver in output device 13, compared with the prior art
In cutting splitting system can save sliver apparatus therein.
It may further be preferable that as shown in figure 4, the layer of conveyer 12 is the domes of indent；Or transmission
The lower surface of device 13 is provided with the film of indent, and film has highly-breathable.Here conveyer 12 fills using with output
The design of 13 identical curved-surface structures is put, can just be entered before the substrate motherboard 31 after cutting is sent into output device 13
The pre- sliver of row, lift the sliver effect of output device 13.
Cutting splitting system in the present embodiment, using the output device in embodiment 1 or embodiment 2, it will be used to export
The carrying platform of the output device of substrate motherboard after cutting is designed as curved surface domes or increases the high ventilated membrane of arch,
Complete to split using the self gravitation and vacuum adsorption force of curved surface arch carrying platform sorption bending (bending) and substrate motherboard
Piece, reach following effect：
1. sliver apparatus can be saved, the floor space of carrying platform is reduced, reduces production cost；
2. sliver apparatus can be saved, shorten cutting cycle period, improve production efficiency,
3. substrate to be output is cut, the degree of splitting is big, be easy to it is follow-up pick up piece, delaminate, bait drops, it is bad to reduce flange etc., carries
The high quality of production.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, but the invention is not limited in this.For those skilled in the art, the essence of the present invention is not being departed from
In the case of refreshing and essence, various changes and modifications can be made therein, and these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of output device, have crannied substrate to be output for load-bearing surface and export the substrate after sliver, it is described defeated
Going out device includes carrying platform, and the upper surface of the carrying platform is provided with the supporting region for placing substrate to be output, and it is special
Sign is, the supporting region is curved-surface structure, and the supporting region and the substrate to be output are curved face contact, the base to be output
Plate ftractures in the supporting region.
2. output device according to claim 1, it is characterised in that the upper epidermis of the carrying platform is the arch of evagination
Structure.
3. output device according to claim 1, it is characterised in that the upper surface of the carrying platform is provided with arch
Film, the film have highly-breathable.
4. output device according to claim 3, it is characterised in that the film is arranged at described hold by attaching mode
The upper surface of carrying platform.
5. the output device according to Claims 2 or 3, it is characterised in that the curved-surface structure or the arched film
Center of curvature axis overlaps with the carrying platform along the central axis of outbound course.
6. the output device according to Claims 2 or 3, it is characterised in that also including vacuum mechanism, on the carrying platform
Top layer offers adsorption hole, and the adsorption hole is connected with the vacuum mechanism.
7. the output device according to Claims 2 or 3, it is characterised in that also used including rotation motor, the rotation motor
Plane Angle rotation is carried out in the substrate to be output to being arranged at the supporting region.
8. a kind of cutting splitting system, including cutter device and conveyer, for by the base with multiple unit display base plates
The cutting of plate motherboard is separated into independent unit display base plate, it is characterised in that also including defeated described in claim any one of 1-7
Go out device.
9. cutting splitting system according to claim 8, it is characterised in that the layer of the conveyer is indent
Domes.
10. cutting splitting system according to claim 8, it is characterised in that the lower surface of the conveyer is provided with
The film of indent, the film have highly-breathable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510170532.4A CN104843488B (en) | 2015-04-10 | 2015-04-10 | A kind of output device and cutting splitting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510170532.4A CN104843488B (en) | 2015-04-10 | 2015-04-10 | A kind of output device and cutting splitting system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104843488A CN104843488A (en) | 2015-08-19 |
| CN104843488B true CN104843488B (en) | 2017-12-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510170532.4A Expired - Fee Related CN104843488B (en) | 2015-04-10 | 2015-04-10 | A kind of output device and cutting splitting system |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107414319B (en) * | 2017-09-15 | 2020-01-14 | 京东方科技集团股份有限公司 | Laser cutting apparatus and control method thereof |
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| CN101851061A (en) * | 2009-03-30 | 2010-10-06 | 三星钻石工业股份有限公司 | Method for dividing brittle material substrate |
| CN104416682A (en) * | 2013-08-23 | 2015-03-18 | 三星钻石工业股份有限公司 | Substrate Cutting Device |
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| TW200500185A (en) * | 2003-02-21 | 2005-01-01 | Mitsuboshi Diamond Ind Co Ltd | Substrate-processing table and device |
| US20070214925A1 (en) * | 2003-09-24 | 2007-09-20 | Mitsubishi Diamond Industrial Co., Ltd | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| CN2765747Y (en) * | 2005-02-16 | 2006-03-22 | 梁吉旺 | Plate disintegrating device |
| JP2009143774A (en) * | 2007-12-14 | 2009-07-02 | Shiigu Kk | Glass sheet cutting method |
| JP2010232603A (en) * | 2009-03-30 | 2010-10-14 | Mitsuboshi Diamond Industrial Co Ltd | Substrate fixing device |
| US20110126593A1 (en) * | 2009-11-30 | 2011-06-02 | Rashid Abdul-Rahman | Apparatus and method for separating a glass sheet |
| JP5961064B2 (en) * | 2012-07-31 | 2016-08-02 | 三星ダイヤモンド工業株式会社 | Suction table manufacturing method and suction table |
| KR101365049B1 (en) * | 2012-08-02 | 2014-02-20 | 한국미쯔보시다이아몬드공업(주) | Rolling break apparatus for brittle material substrate |
| JP5888176B2 (en) * | 2012-08-09 | 2016-03-16 | 日本電気硝子株式会社 | How to break tempered glass |
| JP6043149B2 (en) * | 2012-10-29 | 2016-12-14 | 三星ダイヤモンド工業株式会社 | Breaking device for brittle material substrate and method for breaking brittle material substrate |
| JP6140030B2 (en) * | 2013-08-21 | 2017-05-31 | 三星ダイヤモンド工業株式会社 | Method for dividing wafer laminate for image sensor |
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2015
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101851061A (en) * | 2009-03-30 | 2010-10-06 | 三星钻石工业股份有限公司 | Method for dividing brittle material substrate |
| CN104416682A (en) * | 2013-08-23 | 2015-03-18 | 三星钻石工业股份有限公司 | Substrate Cutting Device |
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| CN104843488A (en) | 2015-08-19 |
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Granted publication date: 20171229 |