CN104771915A - Magnetic interconnected intelligent circuit modularization system - Google Patents
Magnetic interconnected intelligent circuit modularization system Download PDFInfo
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- CN104771915A CN104771915A CN201510162215.8A CN201510162215A CN104771915A CN 104771915 A CN104771915 A CN 104771915A CN 201510162215 A CN201510162215 A CN 201510162215A CN 104771915 A CN104771915 A CN 104771915A
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Abstract
The invention relates to an intelligent circuit modularization system utilizing magnetic interconnection. The intelligent circuit modularization system comprises two or more than two devices, wherein the devices realize magnetic interconnection and have different or identical electronic or circuit functions, a device with a power supply function is at least arranged in the intelligent circuit modularization system, and the device with the power supply function is used as a first type device; one or a plurality of devices which are adsorbed on the first device through magnetic interconnection and have different or identical electron or circuit functions are used as the second type devices, the second type devices can be gradually adsorbed and interconnected through magnetism, and in addition, signals transmitted from the previous second type device are transmitted to the next second type device magnetically adsorbed on the previous second type device after the self processing is carried out. The intelligent circuit modularization system has the advantages that a circuit board and other electronic devices are protected, in addition, the appearance is attractive, the use and the connection are safe and convenient, compatibility with Lego blocks is realized, the contact points are many, more complicated and intelligent sensors and external equipment can be expanded, and the application and the originality on the modeling can be really realized.
Description
Technical field
The present invention relates to technical field of electronic products, particularly relate to a kind of smart circuit modular system being applied to the application of toy DIY intention assembled and education experiment.
Background technology
Present society is an electronic information society, is all flooded with various electronic equipment and electronic signal around people, mobile phone, computer, wifi, intelligence, cloud, Internet of Things ..., etc., people are using every day, and every day is all in contact.These things are so close from people, but always allow the mystery that people feels such.Along with the popular of the objective concept of wound and development, more people want to understand these things, and wound visitor more deep in addition and extremely visitors want to make these things.The correlation technique of these things concerning with non-professional people be extremely difficult.In order to the technical threshold that will play these electronic equipments and electronic signal reduces, a kind of utilize magnetic interconnect and be applied to the smart circuit modular system that the assembled and education experiment of toy DIY intention applies arise at the historic moment.This smart circuit modular system is without the need to professional knowledge, only need to understand function, understand application, utilize simple assembling combination mutually can complete abundant electronic circuit function, and the DIY making of Original model is carried out by the material in the lives such as happy high building blocks, paper, timber, plastics, clay, 3D printing technique, student and the adult of being convenient to more than 8 years old use and learn.
Have similar all kinds of electronic building blocks in the market, these product electronic devices and components are outmoded and outside exposed, easily damage; Lack application and intention during use, just can only remove by step against books, and can only assembled circuit, the application in modeling and intention cannot be done; Connection is mixed and disorderly inconvenient, can not be directly mutually assembled with happy high building blocks, could be mutually assembled with happy high building blocks or can only pass through keyset; Only have three conductive contacts, cannot connect complicated sensor and external equipment, expansion is extremely restricted.
Summary of the invention
The present invention will solve the problem of prior art, propose and a kind ofly utilize magnetic to interconnect and be applied to the smart circuit modular system of toy DIY intention assembled and education experiment application, not only solve the problem that electronic application threshold is too high, also allow electronic application become more creative, also solve the problem of electronic devices and components outmoded and Naked dew simultaneously and expand limited and be connected the problem of inconvenience in a jumble.
For achieving the above object, technical scheme of the present invention is as follows:
A kind of smart circuit modular system utilizing magnetic to interconnect, what comprise that two or more are interconnected by magnetic has similar and different electronics or the device of circuit function, at least comprise a kind of device with power supply function in described smart circuit modular system, described in there is the device of power supply function as first kind device; One or more by the magnetic interconnection absorption device with similar and different electronics or circuit function on a first device as Equations of The Second Kind device, the signal passed over from a upper Equations of The Second Kind device step by step by magnetic interconnection absorption, and can be passed to magnetic absorption next Equations of The Second Kind device thereon by described Equations of The Second Kind device after self process.Described first kind device comprises: 1, power supply circuit board, and described power supply circuit board is provided with gauge tap, battery gang socket, USB and at least one protruding end, and protruding end upper surface is provided with gold plated contact a, and gold plated contact a is no less than 2; 2, upper insulator a, described upper insulator a bottom is provided with deep trouth b, wraps up from top to the non-protruding end portion of power supply circuit board, and is provided with gauge tap in upper insulator a relevant position, the breach of battery gang socket and USB; 3, lower insulator a, described lower insulator a top is provided with deep trouth a, and wrap up power supply circuit board from below, be provided with several locating dowel a in deep trouth a, power supply circuit board is fixed on lower insulator a by locating dowel a.By half parcel of upper insulator a and lower insulator a to power supply circuit board, reduce unnecessary components and parts Naked and reveal.Described Equations of The Second Kind device comprises: 1, switching circuit board, and described switching circuit board one end is provided with via hole a, and via hole a is no less than 2, and lower surface is provided with the resilient contact identical with via hole a quantity; 2, primary function circuit plate, described primary function circuit plate has at least one end to be provided with via hole b, via hole b quantity is identical with via hole a and arrange one_to_one corresponding, has a protruding end at least, protruding end upper surface is provided with the gold plated contact b identical with via hole b quantity, switching circuit board is fixedly connected with via hole b plug connector by via hole a with primary function circuit plate, and the general welding manner that adopts connects; 3, upper insulator b, described upper insulator b bottom is provided with deep trouth d, wraps up from top to the non-protruding end portion of switching circuit board and primary function circuit plate; 4, lower insulator b, described lower insulator b top is provided with deep trouth c, have via hole a one end and primary function circuit plate parcel to switching circuit board from below, be provided with several locating dowel b in deep trouth c, switching circuit board and primary function circuit plate are fixed on lower insulator b by locating dowel b.Wrapped up half of switching circuit board and primary function circuit plate by upper insulator b and lower insulator b, reduce unnecessary components and parts Naked and reveal.In described smart circuit modular system, what the Equations of The Second Kind device be connected can be identical is multiple, or different multiple, can optionally be interconnected by described magnet; Multiple Equations of The Second Kind device is interconnected the electronics of rear system successively or circuit function superposes mutually, and the order of connection of each Equations of The Second Kind device affects electronics or the circuit function of smart circuit modular system.Signal passes to next by the interconnective described Equations of The Second Kind device of described magnet by described Equations of The Second Kind device successively, and described Equations of The Second Kind device can be received signal that a described Equations of The Second Kind device passes over and pass to the next Equations of The Second Kind device connected by magnet after carrying out overlap-add procedure by the electronic circuit self with specific function again.
Preferably, the quantity of described gold plated contact a, described gold plated contact b and resilient contact can be arranged as required, is generally 5 or 7, wherein 2 is the positive and negative electrode of power supply, all the other are data signal end, add expansion, can adapt to more complicated sensor and external equipment.Gold plated contact a and gold plated contact b does not have elasticity, and be the planar contacts of the thick Gold plated Layer of circle, resilient contact has elasticity, during connection, to be contacted and connects, delivered current and data-signal by resilient contact with gold plated contact a and gold plated contact b.
Preferably, the lower insulator a of described first device is built-in with magnet a, the lower insulator b of described second device is built-in with magnet b, upper insulator b is built-in with magnet c, and magnet a is identical with magnet b magnetic pole, contrary with magnet c magnetic pole, first device and the second device, the second device and the second device are mutually adsorbed by the principle that magnet homopolar-repulsion, heteropole are attracting and link, magnetic adsorption type is not only convenient and swift, and prevents wiring error.
Preferably, described first kind device is the device with power supply function, and the voltage that power supply provides is 5V, also can use the human safety voltage lower than 12V, and be not limited to direct current or alternating current; Power supply is not limited to common batteries, rechargeable battery, USB or charger baby etc.
Preferably; described first kind device is the device of the electronic circuit with specific function; comprise sound, look, optical, electrical, magnetic, power, ripple, programming, single-chip microcomputer, display screen etc., multiple electric function and integrated digital circuit, analog circuit, numerical model analysis or the D/A converting circuit etc. such as sensor and various logic circuit.
Preferably, described upper insulator a and lower insulator a, upper insulator b and lower insulator b are welded into an entirety by ultrasonic welding process.
Preferably, the upper insulator a upper surface in described first kind device has the little round platform a of the high feature of multiple compatibility pleasure, and lower insulator a lower surface has the large round platform a of the happy high feature of multiple compatibility, and convenient happy height directly carries out assembled on device.
Preferably, the upper insulator b upper surface in described Equations of The Second Kind device has the little round platform b of the high feature of multiple compatibility pleasure, and lower insulator b lower surface has the large round platform b of the happy high feature of multiple compatibility, and convenient happy height directly carries out assembled on device.
Preferably, the height of described first kind device and the splicing of Equations of The Second Kind device, Equations of The Second Kind device and Equations of The Second Kind device is happy high calibrated altitude.
Preferably, the side that the upper insulator a of described first kind device connects with power supply circuit board protruding end is provided with little groove a, and the both sides that lower insulator a upper surface is positioned at power supply circuit board protruding end are provided with little groove b; The side that the upper insulator b of described Equations of The Second Kind device connects with primary function circuit plate protruding end is provided with little groove c, the side connected with switching circuit board is provided with small boss a, the both sides that upper insulator b lower surface is positioned at switching circuit board are provided with small boss b, the both sides that the lower insulator b upper surface of Equations of The Second Kind device is positioned at primary function circuit plate protruding end are provided with little grooves d, during connection, small boss a can snap in low groove a or little groove c, small boss b can snap in low groove b or little grooves d, plays fool proof anti-channeling and the function strengthening being connected.
Preferably, upper insulator b upper surface or the side of described Equations of The Second Kind device are provided with groove or hole, to adapt to components and parts or the sensor of primary function circuit plate.
Beneficial effect of the present invention is: the circuit board and other electronic devices and components that well protect product of the present invention, prevent outside exposed and cause aged deterioration etc., and good looking appearance; Use and connect safe ready, compatible happy high building blocks, can be directly assembled with it; Contact is many, can expand more complicated more intelligent sensor and external equipment, application and intention various, the application in the modeling of real meaning and intention can be done.
Accompanying drawing explanation
Fig. 1 is a splicing example of the smart circuit modular system that the present invention utilizes magnetic to interconnect;
Fig. 2 the most simply splices example, only has the example that a first kind device and an Equations of The Second Kind device splice mutually in system;
Fig. 3 is the exemplary plot of first kind device;
Fig. 4 is the structural blast figure of first kind device;
Fig. 5 is the structural blast figure overlooked of first kind device;
Fig. 6 is the exemplary plot of Equations of The Second Kind device;
Fig. 7 is the structural blast figure of Equations of The Second Kind device;
Fig. 8 is the structural blast figure of switching circuit board and primary function circuit plate in Equations of The Second Kind device;
Fig. 9 be Equations of The Second Kind device overlook three-view diagram;
Figure 10 is the structural blast figure overlooked of Equations of The Second Kind device;
Figure 11 is the structural representation of a kind of embodiment of other function of Equations of The Second Kind device;
Figure 12 is the structural blast figure of Figure 11;
Figure 13 is the structural representation of the another embodiment of other function of Equations of The Second Kind device;
Figure 14 is the structural blast figure of Figure 13.
In figure: 1, first kind device; 1.1, upper insulator a; 1.2, magnet a; 1.3, gold plated contact a; 1.4, little round platform a; 1.5, battery gang socket; 1.6, USB; 1.7, lower insulator a; 1.8, little groove a; 1.9, little groove b; 1.10, gauge tap; 1.11, power supply circuit board; 1.12, locating dowel a; 1.13, deep trouth a; 1.14, large round platform a; 1.15, deep trouth b; 2, Equations of The Second Kind device; 2.1, upper insulator b; 2.2, small boss a; 3.2, plush copper a; 2.3, little round platform b; 2.4, groove or hole; 2.5, lower insulator b; 2.6, magnet b; 2.7, gold plated contact b; 2.8, little groove c; 2.9, little grooves d; 2.10, resilient contact; 2.11, switching circuit board; 2.12, plug connector; 2.13, locating dowel b; 2.14, deep trouth c; 2.15, primary function circuit plate; 2.16, via hole a; 2.17, via hole b; 2.18, small boss b; 2.19, magnet c; 2.20, large round platform b; 2.21, deep trouth d.
Detailed description of the invention
Below by detailed description of the invention and accompanying drawing, the present invention is further illustrated.
Fig. 1 be the present invention a kind of utilize magnetic to interconnect smart circuit modular system and the whole implementation example of using method, the present invention includes the first kind device 1 with power supply function and one or morely interconnect the device with similar and different electronics or circuit function that is adsorbed on first device 1 as Equations of The Second Kind device 2 by magnetic; The signal passed over from a upper Equations of The Second Kind device 2 step by step by magnetic interconnection absorption, and can be passed to magnetic absorption next Equations of The Second Kind device 2 thereon by Equations of The Second Kind device 2 after self process; Equations of The Second Kind device 2 can optionally be interconnected by magnetic; Multiple Equations of The Second Kind device 2 is interconnected the electronics of rear system successively or circuit function superposes mutually, and the order of connection of each Equations of The Second Kind device 2 affects electronics or the circuit function of smart circuit modular system;
The simplest example is that a first kind device 1 adds an Equations of The Second Kind device 2, as shown in Figure 2.Power supply circuit board 1.11 two ends in figure in first kind device 1 are provided with protruding end, therefore can connect two Equations of The Second Kind devices 2; In figure, Equations of The Second Kind device 2 is containing a switching circuit board 2.11 and the primary function circuit plate 2.15 being provided with a protruding end, therefore can connect first kind device 1 and an Equations of The Second Kind device 2 or two Equations of The Second Kind devices 2 one by one.
With reference to Fig. 3, Fig. 4 and Fig. 5, first kind device 1 profile with power supply function is up-narrow and down-wide " convex " font, comprises upper insulator a1.1 and lower insulator a1.7 and power supply circuit board 1.11; Upper insulator a1.1 upper surface is provided with the little round platform a1.4 of the happy high feature of multiple compatibility, and pleasure is high directly can be built by interpolation method on device; Upper insulator a1.1 bottom is provided with deep trouth b1.15, in order to hold the various sensor components and parts on power supply circuit board 1.11; Before and after both sides respectively establish a little groove a1.8, be connected other Equations of The Second Kind device 2 thereon with strengthening by magnetic in order to location; Upper insulator about an a1.1 wherein side is provided with battery gang socket 1.5 and USB 1.6, battery easy to use, USB, charger baby, the various power supply such as rechargeable battery, another side is provided with a gauge tap 1.10, in order to the powered-down when system does not use; Power supply circuit board 1.11 is provided with former and later two protruding ends, and protruding end upper surface is provided with 5 plane gold plated contact a1.3, provides power supply in order to give the Equations of The Second Kind device 2 connected by magnetic absorption; The lower surface of lower insulator a1.7 is provided with the large round platform a1.14 of the happy high feature of multiple compatibility, directly can be built on happy height by interpolation method; By little round platform a1.4 and the large round platform a1.14 of the happy high feature of multiple compatibility, each device also can be built by interpolation method mutually; The top of lower insulator a1.7 is provided with deep trouth a1.13, in order to hold the various sensor components and parts on power supply circuit board 1.11, be positioned at power supply circuit board 1.11 and be provided with little groove b1.9 and the magnet a1.2 that former and later two both sides, protruding end are also provided with location fool proof anti-channeling, to connect Equations of The Second Kind device 2, in addition four locating dowel a1.12 are also had, for Positioning Power circuit board 1.11; Power supply circuit board 1.11 embeds the deep trouth a1.13 of lower insulator a1.7, and upper insulator a1.1 fastens and covers tightly, and by ultrasonic welding process, upper insulator a 1.1 and lower insulator a1.7 is welded into an entirety.
With reference to Fig. 6, Fig. 7, Fig. 8, Fig. 9 and Figure 10, there is Equations of The Second Kind device 2 profile of various electronics or circuit function in " Z " font, comprise upper insulator b2.1 and lower insulator b2.5 and switching circuit board 2.11 and primary function circuit plate 2.15; Upper insulator b2.1 upper surface is provided with the little round platform b2.3 of the happy high feature of multiple compatibility, and pleasure is high directly can be built by interpolation method on device; Upper insulator b2.1 bottom is provided with deep trouth d2.21, in order to hold the various sensor components and parts of switching circuit board 2.11 and the non-protruding end portion of primary function circuit plate 2.15, lower surface is positioned at switching circuit board 2.11 both sides and is provided with small boss b2.18 and magnet c2.19, and magnet c2.19 magnetic pole is contrary with the magnet a1.2 in first kind device 1; Being provided with a little groove c2.8 on front side of upper insulator b2.1, being connected other device thereon with strengthening by magnetic in order to location; Be provided with a small boss a2.2 on rear side of upper insulator b2.1, device and device assembled after, small boss a2.2 can stick in little groove a1.8 or little groove c2.8 play reinforcement and foolproof function; Some grooves or hole 2.4 can be offered by the electronics of Equations of The Second Kind device 2 or the requirement of circuit function in upper insulator b2.1 upper surface or left and right side, so that sensor Received signal strength or place larger-size sensor; The lower surface of lower insulator b2.5 is provided with the large round platform b2.20 of the happy high feature of multiple compatibility, directly can be built on happy height by interpolation method; By little round platform b2.3 and the large round platform b2.20 of the happy high feature of multiple compatibility, each device also can be built by interpolation method mutually; The little round platform b2.3 of the happy high feature of the compatibility in Equations of The Second Kind device 2 is identical with function with large round platform a1.14 size with the little round platform a1.4 of the happy high feature of the compatibility in first kind device 1 with large round platform b2.20; The top of lower insulator b2.5 is provided with deep trouth c2.14, and deep trouth c2.14, in order to hold the various sensor components and parts on primary function circuit plate 2.15, is also provided with locating dowel b2.13 in deep trouth c2.14, for positioning transfer circuit board 2.11 and primary function circuit plate 2.15; Lower insulator b2.5 upper surface is arranged in both sides, primary function circuit plate 2.15 protruding end and is also provided with the little grooves d 2.9 of location and fool proof anti-channeling and the magnet b2.6 with first kind device 1 magnet a1.2 identical polar; In Equations of The Second Kind device 2, switching circuit board 2.11 is superimposed upon primary function circuit plate 2.15 one end and becomes to be integrated with the via hole b2.17 positioning welding on primary function circuit plate 2.15 by the via hole a2.16 on switching circuit board 2.11 by plug connector 2.12, and after being welded into one, switching circuit board 2.11 provides power supply and signal transmission by via hole a2.16 and via hole b2.17 to primary function circuit plate 2.15; Switching circuit board 2.11 and primary function circuit plate 2.15 embed in the deep trouth c2.14 of lower insulator b2.5 after being welded into one, upper insulator b2.1 fastens and covers tightly, and by ultrasonic welding process, upper insulator b2.1 and lower insulator b2.5 is welded into an entirety.Switching circuit board 2.11 lower surface is provided with 5 resilient contacts 2.10, and primary function circuit plate 2.15 protruding end upper surface is provided with 5 plane gold plated contact b2.7.
When above-described first kind device 1 and Equations of The Second Kind device 2 splice, in Equations of The Second Kind device 2, the small boss a2.2 of upper insulator b2.1 embeds in the little groove a1.8 of upper insulator a1.1 in first kind device 1, small boss b2.18 embeds in the little groove b1.9 of lower insulator a1.7 in first kind device 1, magnet a1.2 and magnet c2.19 adsorbs mutually, and resilient contact 2.10 and gold plated contact a1.3 connect one to one; When Equations of The Second Kind device 2 and Equations of The Second Kind device 2 splice, in a rear Equations of The Second Kind device 2, the small boss a2.2 of upper insulator b2.1 embeds in the little groove c2.8 of upper insulator b2.1 in previous Equations of The Second Kind device 2, small boss b2.18 embeds in the little grooves d 2.9 of lower insulator b2.5, magnet b2.6 and magnet c2.19 adsorbs mutually, and resilient contact 2.10 and gold plated contact b2.7 connect one to one.
With reference to Figure 11 and Figure 12, example is illustrated as a kind of embodiment of close other function of Equations of The Second Kind device 2 of structure, its feature is that primary function circuit plate 2.15 is provided with multiple protruding end, and the signal of switching circuit board 2.11 is exported transmission to more Equations of The Second Kind device 2 by primary function circuit plate 2.15 simultaneously.
With reference to Figure 13 and Figure 14, example is illustrated as the another embodiment of close other function of Equations of The Second Kind device 2 of structure, its feature is that primary function circuit plate 2.15 superposes polylith switching circuit board 2.11, can simultaneously for primary function circuit plate 2.15 provides more input signal.
Although the present invention with preferred embodiment openly as above; but it is not for limiting invention; any those skilled in the art without departing from the spirit and scope of the present invention; the Method and Technology content of above-mentioned announcement can be utilized to make possible variation and amendment to technical solution of the present invention; therefore; every content not departing from technical solution of the present invention; the any simple modification done above embodiment according to technical spirit of the present invention, equivalent variations and modification, all belong to the protection domain of technical solution of the present invention.
Claims (10)
1. the smart circuit modular system utilizing magnetic to interconnect, what comprise that two or more are interconnected by magnetic has similar and different electronics or the device of circuit function, it is characterized in that: in described smart circuit modular system, at least comprise a kind of device with power supply function, described in there is the device of power supply function as first kind device (1); One or morely interconnect the device with similar and different electronics or circuit function that is adsorbed on first device (1) as Equations of The Second Kind device (2) by magnetic, the signal passed over from a upper Equations of The Second Kind device (2) step by step by magnetic interconnection absorption, and can be passed to magnetic absorption next Equations of The Second Kind device (2) thereon by described Equations of The Second Kind device (2) after self process.
2. a kind of smart circuit modular system utilizing magnetic to interconnect according to claim 1, is characterized in that: described first kind device (1) comprising:
Power supply circuit board (1.11), described power supply circuit board (1.11) is provided with gauge tap (1.10), battery gang socket (1.5), USB (1.6) and at least one protruding end, protruding end upper surface is provided with gold plated contact a(1.3), gold plated contact a(1.3) be no less than 2;
Upper insulator a(1.1), described upper insulator a(1.1) bottom is provided with deep trouth b(1.15), wrap up from top to the non-protruding end portion of power supply circuit board (1.11), and at upper insulator a(1.1) relevant position is provided with gauge tap (1.10), the breach of battery gang socket (1.5) and USB (1.6);
Lower insulator a(1.7), described lower insulator a(1.7) top is provided with deep trouth a(1.13), from below power supply circuit board (1.11) is wrapped up, deep trouth a(1.13) in be provided with several locating dowel a(1.12), power supply circuit board (1.11) is by locating dowel a(1.12) be fixed on lower insulator a(1.7).
3. a kind of smart circuit modular system utilizing magnetic to interconnect according to claim 2, it is characterized in that: described upper insulator a(1.1) upper surface is provided with the little round platform a(1.4 of the happy high feature of some compatibilities), described lower insulator a(1.7) lower surface is provided with the large round platform a(1.14 of the happy high feature of some compatibilities).
4. a kind of smart circuit modular system utilizing magnetic to interconnect according to claim 2, is characterized in that: described upper insulator a(1.1) side that connects with power supply circuit board (1.11) protruding end is provided with little groove a(1.8); Described lower insulator a(1.7) the upper surface both sides that are positioned at power supply circuit board (1.11) protruding end are provided with little groove b(1.9) and magnet a(1.2).
5. a kind of smart circuit modular system utilizing magnetic to interconnect according to claim 1, is characterized in that: described Equations of The Second Kind device (2) comprising:
Switching circuit board (2.11), described switching circuit board (2.11) one end is provided with via hole a(2.16), via hole a(2.16) be no less than 2, lower surface is provided with and via hole a(2.16) resilient contact (2.10) that quantity is identical;
Primary function circuit plate (2.15), described primary function circuit plate (2.15) has at least one end to be provided with via hole b(2.17), via hole b(2.17) quantity and via hole a(2.16) identical and arrange one_to_one corresponding, has a protruding end at least, protruding end upper surface is provided with and via hole b(2.17) gold plated contact b(2.7 that quantity is identical), switching circuit board (2.11) and primary function circuit plate (2.15) are by via hole a(2.16) with via hole b(2.17) be fixedly connected with plug connector (2.12);
Upper insulator b(2.1), described upper insulator b(2.1) bottom is provided with deep trouth d(2.21), wrap up from top to the non-protruding end portion of switching circuit board (2.11) and primary function circuit plate (2.15);
Lower insulator b(2.5), described lower insulator b(2.5) top is provided with deep trouth c(2.14), have via hole a(2.16 to switching circuit board (2.11) from below) one end and primary function circuit plate (2.15) parcel, deep trouth c(2.14) in be provided with several locating dowel b(2.13), switching circuit board (2.11) and primary function circuit plate (2.15) are by locating dowel b(2.13) be fixed on lower insulator b(2.5).
6. a kind of smart circuit modular system utilizing magnetic to interconnect according to claim 5, it is characterized in that: described upper insulator b(2.1) upper surface is provided with the little round platform b(2.3 of the happy high feature of some compatibilities), described lower insulator b(2.5) lower surface is provided with the large round platform b(2.20 of the happy high feature of some compatibilities).
7. a kind of smart circuit modular system utilizing magnetic to interconnect according to claim 5, it is characterized in that: described upper insulator b(2.1) side that connects with primary function circuit plate (2.15) protruding end is provided with little groove c(2.8), the side connected with switching circuit board (2.11) is provided with small boss a(2.2), upper insulator b(2.1) the lower surface both sides that are positioned at switching circuit board (2.11) are provided with small boss b(2.18) and magnet c(2.19); Described lower insulator b(2.5) the upper surface both sides that are positioned at primary function circuit plate (2.15) protruding end are provided with little grooves d (2.9) and magnet b(2.6).
8. a kind of smart circuit modular system utilizing magnetic to interconnect according to claim 5, is characterized in that: described upper insulator b(2.1) upper surface or side be provided with groove or hole (2.4).
9. a kind of smart circuit modular system utilizing magnetic to interconnect according to claim 2 or 5, is characterized in that: described gold plated contact a(1.3) with described resilient contact (2.10) and described gold plated contact b(2.7) quantity is identical and arrange one_to_one corresponding.
10. a kind of smart circuit modular system utilizing magnetic to interconnect according to claim 4 or 7, it is characterized in that: described little groove a(1.8) and described little groove c(2.8) with described small boss a(2.2) match, described little groove b(1.9) and described little grooves d (2.9) and described small boss b(2.18) match; Described magnet a(1.2) with described magnet b(2.6) upper surface magnetic pole identical, with described magnet c(2.19) lower surface magnetic pole contrary.
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| CN106129697A (en) * | 2016-08-24 | 2016-11-16 | 汕头市万格文教科技实业有限公司 | A kind of electronic joint for modularization intelligent electronic building blocks splices standard module |
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| CN108421266A (en) * | 2017-02-14 | 2018-08-21 | 郭秋霞 | A kind of modularization magnetoelectricity building blocks combination |
| CN108568837A (en) * | 2017-03-07 | 2018-09-25 | 新加坡国立大学 | A kind of rope drive moduleization change joint Manipulator |
| RU2658268C1 (en) * | 2017-03-13 | 2018-06-19 | Сергей Владимирович Рогозинников | Modular construction set and laboratory modular unit for the physical phenomena studying |
| CN108879148A (en) * | 2018-06-27 | 2018-11-23 | 深圳矽递科技股份有限公司 | A kind of intelligent modularized programmable electronic builds system |
| CN108898929A (en) * | 2018-09-13 | 2018-11-27 | 江苏立教信息科技有限公司 | A kind of educational suite of the compatible more structural members of multimode connection |
| CN109192019A (en) * | 2018-10-26 | 2019-01-11 | 山东远大朗威教育科技股份有限公司 | The changeable Experiment of Electrical Circuits system of DIS |
| CN109308039A (en) * | 2018-11-23 | 2019-02-05 | 广州艾考教育科技有限公司 | A kind of magnetic-type connection controller |
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