Nothing Special   »   [go: up one dir, main page]

CN104741779B - A kind of Laser output head and Laser Processing board - Google Patents

A kind of Laser output head and Laser Processing board Download PDF

Info

Publication number
CN104741779B
CN104741779B CN201510191989.3A CN201510191989A CN104741779B CN 104741779 B CN104741779 B CN 104741779B CN 201510191989 A CN201510191989 A CN 201510191989A CN 104741779 B CN104741779 B CN 104741779B
Authority
CN
China
Prior art keywords
laser
laser beam
unit
laser output
jointing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510191989.3A
Other languages
Chinese (zh)
Other versions
CN104741779A (en
Inventor
杨德权
张浩泰
蒋峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxphotonics Co Ltd
Original Assignee
Maxphotonics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maxphotonics Co Ltd filed Critical Maxphotonics Co Ltd
Priority to CN201510191989.3A priority Critical patent/CN104741779B/en
Publication of CN104741779A publication Critical patent/CN104741779A/en
Application granted granted Critical
Publication of CN104741779B publication Critical patent/CN104741779B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a kind of Laser output head and Laser Processing board, Laser output head comprises the first Laser output unit, for exporting the first laser beam; Second Laser output unit, for exporting the second laser beam; First light beam synthesis unit, described first light beam synthesis unit is positioned at the front of the laser output of described first Laser output unit and the second Laser output unit, and for by described first laser beam and the second laser-beam transformation being the laser beam of an outbound course; Focusing unit, the contiguous first light beam synthesis unit of described focusing unit, focuses on for the laser beam exported described first light beam synthesis unit, forms focused beam.The present invention, achieve the laser beam that a Laser output head can export different wave length, such as, the compatible QCS jointing of Laser Processing board, QBH jointing and pulse jointing, complete the cutting of different materials, welding or mark operation to realize changing out splice going splice.

Description

A kind of Laser output head and Laser Processing board
Technical field
The present invention relates to laser technology field, particularly relate to a kind of Laser output head and Laser Processing board.
Background technology
Monochromaticjty is good, divergence is minimum, brightness advantages of higher because it has for laser, is widely used in field of machining, such as: laser cutting, welding, laser marking etc.
In prior art, the Laser output capitiform formula that each laser instrument uses is different, a Laser Processing board only configures a Laser output head, export a kind of laser of wavelength, complete specific one operation, cannot in the compatible working procedures of a Laser Processing board, such as: cutting machine can only complete cutting, mark board can only complete mark etc., but because different materials is different to its absorption of the laser of different wave length, therefore, then need to dismantle whole equipment when needs use different manufacturers Laser output head to complete different operation, particularly troublesome, such as: to complete cutting at mark board, welding sequence, then need to take whole mark board apart, change Laser output head, to complete mark operation at cutting machine, need too to take whole cutting machine apart, change Laser output head trouble.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of Laser output head and Laser Processing board, can realize Laser output head and export different wave length laser beam, to make a Laser Processing board can compatible different laser machining process.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of Laser output head, comprise the first Laser output unit, for exporting the first laser beam; Second Laser output unit, for exporting the second laser beam; First light beam synthesis unit, described first light beam synthesis unit is positioned at the front of the laser output of described first Laser output unit and the second Laser output unit, and for by described first laser beam and the second laser-beam transformation being the laser beam of an outbound course; Focusing unit, the contiguous first light beam synthesis unit of described focusing unit, focuses on for the laser beam exported described first light beam synthesis unit, forms focused beam.
Wherein, described first light beam synthesis unit comprises the first anti-reflection film and the first reflectance coating, wherein, described first anti-reflection film and the first reflectance coating bonded to each other; Described first Laser output unit is positioned at described first anti-reflection film side, described first anti-reflection film is used for the first laser beam described in transparent transmission, described second Laser output unit is positioned at described first reflectance coating side, described first reflectance coating is for reflecting described second laser beam, wherein, described first laser beam after transparent transmission and described second laser beam after reflecting all export from same outbound course.
Wherein, the angle between described first laser beam and described first anti-reflection film is 45 degree, and the angle between described second laser beam and described first reflectance coating is 45 degree.
Wherein, described Laser output head also comprises housing, and described housing is provided with nozzle; Described first Laser output unit, described second Laser output unit, described first light beam synthesis unit and focusing unit are arranged in described housing, and described nozzle is corresponding with described focusing unit, and described focused beam penetrates from described nozzle.
Wherein, described second Laser output unit comprises the first Laser output module, the second Laser output module and the second light beam synthesis unit; Described first Laser output module is for exporting the 3rd laser beam, and described second Laser output module is for exporting the 4th laser beam; Described second light beam synthesis unit is positioned at the front of the laser output of described first Laser output module and the second Laser output module, for being the laser beam that same outbound course exports by described 3rd laser beam and the 4th laser-beam transformation, form described second laser beam to make described 3rd laser beam and/or the 4th laser beam.
Wherein, described second light beam synthesis unit comprises the second anti-reflection film and the second reflectance coating, wherein, described second anti-reflection film and the second reflectance coating bonded to each other; Described first Laser output module is positioned at described second reflectance coating side, described second reflectance coating is for reflecting described 3rd laser beam, described second Laser output module is positioned at described second anti-reflection film side, described second anti-reflection film is used for the 4th laser beam described in transparent transmission, wherein, described 3rd laser beam after reflection and described 4th laser beam after transparent transmission all export from same outbound course, form described second laser beam with the 4th laser beam after making described 3rd laser beam after reflection and/or transparent transmission.
Wherein, described first Laser output unit comprises the first laser instrument, the first jointing, the first tapered end and collimation unit;
Described first laser instrument is for generation of laser beam, described first jointing connects described first laser instrument, described collimation unit is between described first jointing and described first light beam synthesis unit, described first tapered end is between described first jointing and described collimation unit, the laser beam that described first laser instrument generates forms the first laser beam after the first jointing, the first tapered end and collimation unit, and described first laser beam is incident to the first light beam synthesis unit; Described first Laser output module comprises second laser, the second jointing and the second tapered end; Described second laser is for generation of laser beam, described second jointing connects described second laser, described second tapered end closes between Shu Danyuan at described second jointing and the second light beam, the laser beam that described second laser generates forms the 3rd laser beam after the second jointing and the second tapered end, and described 3rd laser beam is incident to the second light beam and closes Shu Danyuan.
Wherein, described second Laser output module comprises the 3rd laser instrument, pulse jointing and galvanometer unit; Described 3rd laser instrument is for generation of laser beam, described pulse jointing connects described 4th laser instrument, described galvanometer unit closes between Shu Danyuan at described pulse jointing and the second light beam, the laser beam that described 3rd laser instrument generates forms the 4th laser beam through described pulse jointing and galvanometer unit, and described 4th laser beam is incident to the second light beam and closes Shu Danyuan.
Wherein, described first connector and the second connector to be respectively in QCS connector, QBH connector, QD connector, LLK connector and JK connector two; Described first tapered end and the second tapered end to be respectively in QCS tapered end, QBH tapered end, QD tapered end, LLK tapered end and JK tapered end two.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of Laser Processing board, Laser Processing board comprises above-mentioned Laser output head.
The invention has the beneficial effects as follows: the situation being different from prior art, the present invention at the first light beam synthesis unit in the laser beam by the first laser beam and the second laser-beam transformation being an outbound course, the laser beam that first light beam synthesis unit exports focuses on through focusing unit, form focused beam, focused beam is treated handled thing and is processed, wherein, first light beam synthesis unit is only for adjusting the transmission direction of the first laser beam and the second laser beam, the first laser beam and the second laser-beam transformation is made to be the laser beam of an outbound course, there is no the characteristic of change first laser beam and the second laser beam, therefore, the laser that first light beam synthesis unit exports can in the first laser beam and the second laser beam one, or, laser beam together with first laser beam is overlapping with the second laser beam, and the first laser beam and the second laser beam two-way laser beam that to be wavelength not identical, achieve a Laser output head and export different wave length laser beam.
Accompanying drawing explanation
Fig. 1 is the structural representation of Laser output head embodiment of the present invention;
Fig. 2 is the schematic diagram that in Laser output head embodiment of the present invention, first laser beam and the second laser beam are merged into synthesized laser beam;
Fig. 3 is the structural representation of the first light beam synthesis unit in Laser output head embodiment of the present invention;
Fig. 4 is that in Laser output head embodiment of the present invention, between first laser beam and the first anti-reflection film, angle is 45 degree, angle between second laser beam and the first reflectance coating is 45 degree, makes the first laser beam after transparent transmission be merged into the schematic diagram of synthesized laser beam with the second laser beam after reflection;
Fig. 5 is the structural representation that in Laser output head embodiment of the present invention, second laser beam Shi You mono-tunnel or two-way laser beam are formed.
Detailed description of the invention
Below in conjunction with drawings and embodiments, the present invention is described in detail.
Refer to Fig. 1, Laser output head 20 comprises the first Laser output unit 21, second Laser output unit 22, first light beam synthesis unit 23 and focusing unit 24.
First Laser output unit 21 is for exporting the first laser beam, second Laser output unit 22 is for exporting the second laser beam, first light beam synthesis unit 23 is positioned at the front of the laser output of the first Laser output unit 21 and the second Laser output unit 22, and the laser beam of the first light beam synthesis unit 23 for by the first laser beam and the second laser-beam transformation being an outbound course, as shown in Figure 2.What deserves to be explained is: the first light beam synthesis unit 23 is the transmission direction of change first laser beam and the second laser beam, the first laser beam is exported from identical delivery outlet with the second laser beam, and outbound course is identical; First Laser output unit 21 and the second Laser output unit 22 can be opened simultaneously, also can singlely open, if when both open simultaneously, the laser that then the first light beam synthesis unit 23 goes out to export is overlapped to form by the first laser beam and the second laser beam, if during single unlatching, then the laser that the first light beam synthesis unit 23 goes out to export is one in the first laser beam and the second laser beam.
The contiguous first light beam synthesis unit 23 of focusing unit 24, focus on for the laser beam exported the first light beam synthesis unit 23, form focused beam, wherein, focused beam gets to pending object, processes pending object.
Incorporated by reference to Fig. 3, first light beam synthesis unit 23 comprises the first anti-reflection film 231 and the first reflectance coating 232, wherein, first anti-reflection film 231 and the first reflectance coating 232 formation first bonded to each other light beam synthesis unit 23, certainly, in other alternate embodiments, the first light beam synthesis unit 23 also comprises intermediate layer (not shown), first anti-reflection film 231 is individually fixed in relative surface, intermediate layer two with the first reflectance coating 232, intermediate layer transparent transmission light.First Laser output unit 21 is positioned at the first anti-reflection film 231 side, first anti-reflection film 231 transparent transmission first laser beam, second Laser output unit 22 is positioned at the first reflectance coating 232 side, first reflectance coating 232 is for reflected second laser bundle, wherein, the first laser beam after transparent transmission and the second laser beam after reflecting all export from same delivery outlet, and both outbound courses are also identical, form beam of laser bundle with the second laser beam after making the first laser beam after transparent transmission and/or reflection.In the present embodiment, angle between first laser beam and the first anti-reflection film 231 is 45 degree, angle between second laser beam and the first reflectance coating 232 is 45 degree, due to the first laser beam transparent transmission, therefore, the angle of the first laser beam after transparent transmission and the first reflectance coating 232 is also be 45 degree, angle between the second laser beam after reflection and the first reflectance coating 232 is also 45 degree, therefore, the first laser beam after transparent transmission and/or rear second laser beam of reflection form a branch of synthesized laser beam, as shown in Figure 4.It should be noted that: the laser that the first anti-reflection film 231 transparent transmission wavelength is identical with the first laser beam, laser for other wavelength shields, first reflectance coating 232 is the reflection wavelength laser identical with the second laser beam, and the laser for other wavelength is transparent transmission.
In order to avoid the impact of ambient light, Laser output head 20 also comprises housing 25, and the first Laser output unit 21, second Laser output unit 22, first light beam synthesis unit 23 and focusing unit 24 are arranged in housing 25, and wherein, housing 25 is light tight.Certainly, conveniently installing/dismounting, housing 25 also can be provided with multiple installing port (not shown), Laser output unit is removably fixed on installing port, when Laser output unit changed by needs, direct dismounting and change, need not take whole Laser output head 20 apart replacing.Housing 25 is provided with nozzle 251, nozzle 251 is corresponding with focusing unit 24, and focused beam penetrates from nozzle 251, and nozzle 251 is aimed at pending thing, then starts Laser output unit, realizes treating handled thing and processes, such as: mark, cutting etc.
In embodiments of the present invention, the transmission direction of the first laser beam and the second laser beam is changed by the first light beam synthesis unit, first laser beam is exported from identical delivery outlet with the second laser beam, and outbound course is identical, realize the first laser beam and the second laser beam shares focusing unit and nozzle etc.
It should be noted that: the first laser beam and the second laser beam can be all the laser beam of single wavelength, first laser beam and the second laser beam also can be the synthesized laser beam of the single wavelength laser Shu Hecheng of multichannel, such as: the first laser beam and the second laser beam Wei You tri-tunnel, four kinds or more multichannel different wave length laser beam synthesis synthesized laser beam, the laser beam of a wavelength is produced by a laser instrument, therefore, Laser output head 20 is configurable more laser instrument also, by controlling the work of laser instrument, make Laser output head 20 can the different laser beam of output wavelength, be the synthetic laser synthesized by the laser beam of two-way different wave length to the second laser beam be below that example is described, certainly, those skilled in the art also can according to thought of the present invention, expand the synthesized laser beam that the second laser beam is multi laser beam integration, such as: three road laser beams, four-way laser beam etc.
Refer to Fig. 5, the second Laser output unit 22 comprises the first Laser output module 221, second Laser output module 222 and the second light beam synthesis unit 223.First Laser output module 221 is for exporting the 3rd laser beam, and the second Laser output module 222 is for exporting the 4th laser beam.Second light beam synthesis unit 223 is positioned at the front of the laser output of the first Laser output module 221 and the second Laser output module 222, for being the second laser beam exported from same outbound course by the 3rd laser beam and the 4th laser-beam transformation.Concrete, the second light beam synthesis unit 223 comprises the second anti-reflection film (not shown) and the second reflectance coating (not shown), wherein, the second anti-reflection film and the second reflectance coating bonded to each other.First Laser output module 221 is positioned at the second reflectance coating side, second reflectance coating is for reflecting the 3rd laser beam, second Laser output module 222 is positioned at the second anti-reflection film side, second anti-reflection film is used for transparent transmission the 4th laser beam, wherein, the 3rd laser beam after reflection and the 4th laser beam after transparent transmission all export from same outbound course, form the second laser beam with the 4th laser beam after making the 3rd laser beam after reflection and/or transparent transmission.
Change the transmission direction of the 3rd laser beam and the 4th laser beam, the know-why exported from same outbound course to make both, with, change the transmission direction of the second laser beam and the first laser beam, identical with the know-why making both export from same outbound course, certainly, those skilled in the art also can based on the integrated more multi-laser beam of above-mentioned know-why, with the laser making Laser output head 20 can export more multi-wavelength.In the present embodiment, the first Laser output unit 21 comprises the first laser instrument (not shown), the first jointing 211, first tapered end 212 and collimation unit 213.First laser instrument is for generation of laser beam, first jointing 211 connects the first laser instrument, collimation unit 213 is between the first jointing 211 and the first light beam synthesis unit 23, first tapered end 212 is between the first jointing 211 and collimation unit 213, the laser beam that first laser instrument generates forms the first laser beam after the first jointing, the first tapered end 212 and collimation unit 213, and the first laser beam is incident to the first light beam synthesis unit 23; First Laser output module 221 comprises second laser, the second jointing 2211 and the second tapered end 2212, second laser is for generation of laser beam, second jointing 2211 connects second laser, second tapered end 2212 closes between Shu Danyuan 223 at the second jointing 2211 and the second light beam, the laser beam that second laser generates forms the 3rd laser beam after the second jointing and the second tapered end, and the 3rd laser beam is incident to the second light beam synthesis unit; In embodiments of the present invention, the first connector and the second connector to be respectively in QCS connector, QBH connector, QD connector, LLK connector and JK connector two; Corresponding, the first tapered end and the second tapered end to be respectively in QCS tapered end, QBH tapered end, QD tapered end, LLK tapered end and JK tapered end two.Wherein, QCS tapered end, QBH tapered end, QD tapered end, LLK tapered end and JK tapered end are the address of the existing industrial standard of the art.
Second Laser output module 222 comprises the 3rd laser instrument, pulse jointing 2221 and galvanometer unit 2222,3rd laser instrument is for generation of laser beam, pulse jointing 2221 connects the 3rd laser instrument, galvanometer unit 2222 closes between Shu Danyuan 223 at pulse jointing 2221 and the second light beam, the laser beam that 3rd laser instrument generates forms the 4th laser beam through extra pulse jointing and galvanometer unit, and the 4th laser beam is incident to the second light beam and closes Shu Danyuan.
What deserves to be explained is: the transmission direction of light beam synthesis unit of the present invention just for changing laser beam, the characteristic of laser beam can not be changed, therefore, the laser beam that light beam synthesis unit exports can be a road laser beam, also can be that the identical laser beam in multiplexing direction overlaps the road laser beam formed, unaffected each other between multi-path laser bundle, therefore, Laser output head of the present invention can export the laser of different wave length simultaneously, also can export the laser beam of one of them wavelength.
In embodiments of the present invention, first light beam synthesis unit is in the laser beam by the first laser beam and the second laser-beam transformation being an outbound course, the laser beam that first light beam synthesis unit exports focuses on through focusing unit, form focused beam, focused beam is treated handled thing and is processed, wherein, first light beam synthesis unit is only for adjusting the transmission direction of the first laser beam and the second laser beam, the first laser beam and the second laser-beam transformation is made to be the laser beam of an outbound course, do not change the characteristic of the first laser beam and the second laser beam, therefore, the laser that first light beam synthesis unit exports can in the first laser beam and the second laser beam one, or, laser beam together with first laser beam is overlapping with the second laser beam, and the first laser beam and the second laser beam two-way laser beam that to be wavelength not identical, therefore, the present invention can be opened and/closedown by control first Laser output unit and/or the second Laser output unit, realize a Laser output head and export different wave length laser beam.
The present invention provides again Laser Processing board embodiment.Laser Processing board comprises above-mentioned Laser output head, and the concrete structure for Laser output head can consult above-mentioned embodiment, repeats no longer one by one herein.
Because a Laser output head of the present invention can export different wave length laser beam, therefore, Laser Processing board can compatible different laser machining process, such as: the compatible QCS jointing of Laser Processing board and QBH jointing, to realize the cutting action to different materials, or the compatible QCS jointing of Laser Processing board, QBH jointing and pulse jointing, to realize cutting, welding and mark operation.
The foregoing is only embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.

Claims (9)

1. a Laser output head, is characterized in that, comprising:
First Laser output unit, for exporting the first laser beam;
Second Laser output unit, for exporting the second laser beam;
First light beam synthesis unit, described first light beam synthesis unit is positioned at the front of the laser output of described first Laser output unit and the second Laser output unit, and for by described first laser beam and the second laser-beam transformation being the laser beam of an outbound course;
Focusing unit, the contiguous first light beam synthesis unit of described focusing unit, focuses on for the laser beam exported described first light beam synthesis unit, forms focused beam;
Described second Laser output unit comprises the first Laser output module, the second Laser output module and the second light beam synthesis unit;
Described first Laser output module is for exporting the 3rd laser beam, and described second Laser output module is for exporting the 4th laser beam;
Described second light beam synthesis unit is positioned at the front of the laser output of described first Laser output module and the second Laser output module, for being the laser beam that same outbound course exports by described 3rd laser beam and the 4th laser-beam transformation, form described second laser beam to make described 3rd laser beam and/or the 4th laser beam.
2. Laser output head according to claim 1, is characterized in that,
Described first light beam synthesis unit comprises the first anti-reflection film and the first reflectance coating, wherein, described first anti-reflection film and the first reflectance coating bonded to each other;
Described first Laser output unit is positioned at described first anti-reflection film side, described first anti-reflection film is used for the first laser beam described in transparent transmission, described second Laser output unit is positioned at described first reflectance coating side, described first reflectance coating is for reflecting described second laser beam, wherein, described first laser beam after transparent transmission and described second laser beam after reflecting all export from same outbound course.
3. Laser output head according to claim 2, is characterized in that,
Angle between described first laser beam and described first anti-reflection film is 45 degree, and the angle between described second laser beam and described first reflectance coating is 45 degree.
4. Laser output head according to claim 1, is characterized in that,
Described Laser output head also comprises housing, and described housing is provided with nozzle;
Described first Laser output unit, described second Laser output unit, described first light beam synthesis unit and focusing unit are arranged in described housing, and described nozzle is corresponding with described focusing unit, and described focused beam penetrates from described nozzle.
5. Laser output head according to claim 1, is characterized in that,
Described second light beam synthesis unit comprises the second anti-reflection film and the second reflectance coating, wherein, described second anti-reflection film and the second reflectance coating bonded to each other;
Described first Laser output module is positioned at described second reflectance coating side, described second reflectance coating is for reflecting described 3rd laser beam, described second Laser output module is positioned at described second anti-reflection film side, described second anti-reflection film is used for the 4th laser beam described in transparent transmission, wherein, described 3rd laser beam after reflection and described 4th laser beam after transparent transmission all export from same outbound course, form described second laser beam with the 4th laser beam after making described 3rd laser beam after reflection and/or transparent transmission.
6. Laser output head according to claim 5, is characterized in that,
Described first Laser output unit comprises the first laser instrument, the first jointing, the first tapered end and collimation unit;
Described first laser instrument is for generation of laser beam, described first jointing connects described first laser instrument, described collimation unit is between described first jointing and described first light beam synthesis unit, described first tapered end is between described first jointing and described collimation unit, the laser beam that described first laser instrument generates forms the first laser beam after the first jointing, the first tapered end and collimation unit, and described first laser beam is incident to the first light beam synthesis unit;
Described first Laser output module comprises second laser, the second jointing and the second tapered end;
Described second laser is for generation of laser beam, described second jointing connects described second laser, described second tapered end closes between Shu Danyuan at described second jointing and the second light beam, the laser beam that described second laser generates forms the 3rd laser beam after the second jointing and the second tapered end, and described 3rd laser beam is incident to the second light beam and closes Shu Danyuan.
7. Laser output head according to claim 6, is characterized in that,
Described first connector and the second connector to be respectively in QCS connector, QBH connector, QD connector, LLK connector and JK connector two;
Described first tapered end and the second tapered end to be respectively in QCS tapered end, QBH tapered end, QD tapered end, LLK tapered end and JK tapered end two.
8. Laser output head according to claim 5, is characterized in that,
Described second Laser output module comprises the 3rd laser instrument, pulse jointing and galvanometer unit;
Described 3rd laser instrument is for generation of laser beam, described pulse jointing connects described 4th laser instrument, described galvanometer unit closes between Shu Danyuan at described pulse jointing and the second light beam, the laser beam that described 3rd laser instrument generates forms the 4th laser beam through described pulse jointing and galvanometer unit, and described 4th laser beam is incident to the second light beam and closes Shu Danyuan.
9. a Laser Processing board, is characterized in that, described Laser Processing board comprises as Laser output head as described in any one in claim 1 ~ 8.
CN201510191989.3A 2015-04-22 2015-04-22 A kind of Laser output head and Laser Processing board Active CN104741779B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510191989.3A CN104741779B (en) 2015-04-22 2015-04-22 A kind of Laser output head and Laser Processing board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510191989.3A CN104741779B (en) 2015-04-22 2015-04-22 A kind of Laser output head and Laser Processing board

Publications (2)

Publication Number Publication Date
CN104741779A CN104741779A (en) 2015-07-01
CN104741779B true CN104741779B (en) 2016-03-30

Family

ID=53582343

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510191989.3A Active CN104741779B (en) 2015-04-22 2015-04-22 A kind of Laser output head and Laser Processing board

Country Status (1)

Country Link
CN (1) CN104741779B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016201418A1 (en) * 2016-01-29 2017-08-03 Kjellberg-Stiftung Apparatus and method for thermal processing
TW201819085A (en) * 2016-11-28 2018-06-01 盟立自動化股份有限公司 Laser machining system
CN106881872A (en) * 2016-12-29 2017-06-23 平湖波科激光有限公司 The multiwavelength laser welding method and multi-wave length laser device of laminated plastics
CN112202047B (en) * 2020-09-23 2022-06-21 广东粤港澳大湾区硬科技创新研究院 Laser device
CN112247363A (en) * 2020-10-13 2021-01-22 深圳市嗨兴科技有限公司 Control method and device for multi-beam-combination engraving

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7279721B2 (en) * 2005-04-13 2007-10-09 Applied Materials, Inc. Dual wavelength thermal flux laser anneal
CN1873466A (en) * 2005-05-30 2006-12-06 成序三 Optical system for synthesizing multi laser beams and method
CN101800218A (en) * 2010-03-15 2010-08-11 江苏奥雷光电有限公司 Coaxial laser integrating optical transmit-receive function
CN201913386U (en) * 2010-12-30 2011-08-03 沈阳新松机器人自动化股份有限公司 Optical fiber transmission laser welding head
CN102500921B (en) * 2011-11-14 2016-02-03 镭射谷科技(深圳)有限公司 Multiple road laser soldering device
KR101582632B1 (en) * 2012-08-07 2016-01-05 한국기계연구원 Substrate cutting method using fresnel zone plate

Also Published As

Publication number Publication date
CN104741779A (en) 2015-07-01

Similar Documents

Publication Publication Date Title
CN104741779B (en) A kind of Laser output head and Laser Processing board
CN105050764A (en) Apparatus for and method of forming plural groups of laser beams using two rotating diffractive optical elements
CN102741011B (en) Laser processing system
CN103212786B (en) Laser processing device and method thereof
CN100393470C (en) Laser beam machine
CN103563191A (en) Method and apparatus for combining light sources in a pump laser array
CN103692089B (en) Laser cutting device and laser cutting method
CN103056513B (en) Laser processing system
EP3290545A1 (en) Laser cladding tool head and to-be-processed surface sensing method therefor
CN103934577B (en) Stray-light-free laser processing system with adjustable cutting width
CN104393486A (en) Adjustment device and method for optical path of external cavity semiconductor laser
CN1840278A (en) Laser processing device
CN107544137A (en) High-capacity optical fiber laser Optic gate
CN102248293B (en) Rotary adjustable water waveguide laser processing device
CN102248805A (en) Laser marking device and marking light-splitting method
CN204230629U (en) A kind of external-cavity semiconductor laser optical path adjustment device
CN104009395A (en) Optical fiber coupling module with multiple single-diode semiconductor lasers
CN201845130U (en) Beam splitting system of laser processing equipment
CN103949774A (en) Laser processing head for monitoring quality of laser beam and real-time monitoring method
CN206794281U (en) A kind of export structure of laser cleaning machine
CN103364897B (en) For the lens combination of single-mode laser coupling
CN104767118A (en) Optical fiber coupling semiconductor laser device
CN203918227U (en) Optical image module and there is its laser cutting device
CN102096195A (en) Three-dimensionally spectroscopic combined pentaprism
CN107695544A (en) Laser boring method and device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant