CN104634148A - Flat-plate heat tube with nanometer structure - Google Patents
Flat-plate heat tube with nanometer structure Download PDFInfo
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- CN104634148A CN104634148A CN201510095893.7A CN201510095893A CN104634148A CN 104634148 A CN104634148 A CN 104634148A CN 201510095893 A CN201510095893 A CN 201510095893A CN 104634148 A CN104634148 A CN 104634148A
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- 238000001704 evaporation Methods 0.000 claims abstract description 32
- 230000008020 evaporation Effects 0.000 claims abstract description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 8
- 239000010951 brass Substances 0.000 claims abstract description 8
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 238000006073 displacement reaction Methods 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 13
- 238000005245 sintering Methods 0.000 claims description 4
- QTRSWYWKHYAKEO-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-henicosafluorodecyl-tris(1,1,2,2,2-pentafluoroethoxy)silane Chemical compound FC(F)(F)C(F)(F)O[Si](OC(F)(F)C(F)(F)F)(OC(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F QTRSWYWKHYAKEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000009827 uniform distribution Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000007385 chemical modification Methods 0.000 claims 1
- 238000009833 condensation Methods 0.000 abstract description 20
- 230000005494 condensation Effects 0.000 abstract description 20
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 7
- 239000005751 Copper oxide Substances 0.000 abstract description 7
- 229910000431 copper oxide Inorganic materials 0.000 abstract description 7
- 239000002086 nanomaterial Substances 0.000 abstract description 7
- 230000003075 superhydrophobic effect Effects 0.000 abstract description 7
- 239000000243 solution Substances 0.000 description 11
- 239000010408 film Substances 0.000 description 8
- 239000012530 fluid Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000009835 boiling Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000012792 core layer Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000006424 Flood reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明公开了一种纳米结构平板热管，其包括底板、顶板、位于顶板与底板之间的支撑板，所述底板、顶板、支撑板密封连接形成中空的密闭空腔；作为平板热管的蒸发面的底板的本体为黄铜板，所述底板内表面覆盖有纳米结构的具有超亲水性能的电化学置换形成的氧化铜薄膜；作为平板热管的冷凝面的顶板的本体为黄铜板，所述顶板内表面覆盖有纳米结构的具有超疏水性能的电镀镍层，所述支撑板侧面开有贯穿小孔与毛细管相接。此平板热管通过对蒸发面、冷凝面进行超亲、疏水表面改性，强化蒸发冷凝速度，提高蒸发区和冷凝区的换热性能，具有良好的均温性，引导并加快工质回流速度从而提高整体换热能力。
The invention discloses a flat heat pipe with a nanostructure, which comprises a bottom plate, a top plate, and a support plate located between the top plate and the bottom plate. The bottom plate, the top plate, and the support plate are sealed and connected to form a hollow airtight cavity; used as the evaporation surface of the flat heat pipe The body of the bottom plate is a brass plate, and the inner surface of the bottom plate is covered with a nanostructured copper oxide film formed by electrochemical displacement with superhydrophilic properties; the body of the top plate as the condensation surface of the flat heat pipe is a brass plate, so The inner surface of the top plate is covered with a nano-structure electroplated nickel layer with super-hydrophobic properties, and the side of the support plate is provided with through holes connected with capillaries. This flat plate heat pipe enhances the speed of evaporation and condensation, improves the heat transfer performance of the evaporation area and the condensation area by modifying the surface of the evaporation surface and the condensation surface with super affinity and hydrophobicity. Improve the overall heat transfer capacity.
Description
技术领域 technical field
本发明涉及微电子器件散热技术，尤其涉及一种用于微电子器件散热的纳米结构平板热管。 The invention relates to heat dissipation technology of microelectronic devices, in particular to a nanostructure flat heat pipe for heat dissipation of microelectronic devices.
背景技术 Background technique
随着电子封装技术的飞速发展，电子芯片的集成度以及性能不断提高，导致芯片功率不断持续增加。目前芯片表面的平均热流密度已经超过了100W/cm2，并有继续增加的趋势。同时，芯片封装完成后的芯片普遍存在局部热量高的“热点”问题，将导致芯片局部温度急剧升高，影响芯片稳定性。 With the rapid development of electronic packaging technology, the integration and performance of electronic chips continue to improve, resulting in a continuous increase in chip power. At present, the average heat flux density on the chip surface has exceeded 100W/cm2, and there is a tendency to continue to increase. At the same time, after the chip package is completed, there are generally "hot spots" with high local heat, which will lead to a sharp rise in the local temperature of the chip and affect the stability of the chip.
针对温度升高导致的芯片失效的解决方案中，既包含风冷、液冷、热管等常规冷却方式，也有诸如半导体冷却、微喷射流技术、液态金属散热、碳纤维材料散热等新型散热方式。然而受制于结构、空间、成本、可维护、噪音等多方面的因素，传统的冷却方式并不能满足未来高热流密度电子元件散热要求，而新兴的散热技术又由于技术不成熟等原因尚不能得到大规模的应用。 Solutions to chip failure caused by temperature rise include not only conventional cooling methods such as air cooling, liquid cooling, and heat pipes, but also new cooling methods such as semiconductor cooling, micro-jet technology, liquid metal heat dissipation, and carbon fiber material heat dissipation. However, due to various factors such as structure, space, cost, maintainability, and noise, the traditional cooling method cannot meet the heat dissipation requirements of electronic components with high heat flux density in the future, and the emerging heat dissipation technology cannot be obtained due to immature technology and other reasons. large-scale applications.
平板热管（Vapor chamber）是一种根据热管工作原理而设计的新型散热介质，其主要结构有外壳、吸液芯、工质等，其工作原理为当热量由热源通过平板热管的蒸发区时，在低真空度的腔体内，工质液体沸腾气化，在压力差的作用下，气体流向冷凝区，遇冷凝结放热，并在毛细力的作用下沿吸液芯回流回蒸发区，而冷凝面的热量由平板热管外部其他散热方式带走。虽然工作原理相似，但是与热管一维线性的传热方式相比，平板热管的传热方式为二维面上传热，因此具有更好的传热性能与均温性。然而现有的平板热管工质回流主要依靠吸液芯提供的毛细力，换热的毛细极限和沸腾极限比较小，另外由于吸液芯的存在，靠近冷凝面的冷凝后的液体工质不能马上回流而充斥在冷凝面附近的吸液芯上，使得传热热阻加大，此外烧结吸液芯结构本身需要消耗大量能源，并且烧结质量很难控制。 The flat heat pipe (Vapor chamber) is a new heat dissipation medium designed according to the working principle of the heat pipe. Its main structure includes a shell, a liquid-absorbing core, and a working medium. In the cavity with low vacuum degree, the working medium liquid boils and vaporizes. Under the action of pressure difference, the gas flows to the condensation area, condenses and releases heat when it encounters condensation, and flows back to the evaporation area along the liquid-absorbing core under the action of capillary force. The heat on the condensation surface is taken away by other heat dissipation methods outside the flat heat pipe. Although the working principle is similar, compared with the one-dimensional linear heat transfer method of the heat pipe, the heat transfer method of the flat heat pipe is two-dimensional surface heat transfer, so it has better heat transfer performance and temperature uniformity. However, the return flow of the working medium in the existing flat heat pipe mainly depends on the capillary force provided by the liquid-absorbing core, and the capillary limit and boiling limit of heat transfer are relatively small. In addition, due to the existence of the liquid-absorbing core, the condensed liquid working medium close to the condensation surface cannot immediately Backflow floods the liquid-absorbing core near the condensation surface, which increases the heat transfer resistance. In addition, the sintering of the liquid-absorbing core structure itself consumes a lot of energy, and the sintering quality is difficult to control.
发明内容 Contents of the invention
针对现有技术的不足，本发明要解决的技术问题是提供一种强化蒸发冷凝速度，引导并加快工质回流速度从而提高整体换热能力的纳米结构平板热管。 Aiming at the deficiencies of the prior art, the technical problem to be solved by the present invention is to provide a nano-structured flat heat pipe that enhances the speed of evaporation and condensation, guides and speeds up the reflow speed of the working medium, thereby improving the overall heat exchange capacity.
为了解决上述技术问题，本发明所采用的技术方案是：一种纳米结构平板热管，其包括底板、顶板、位于顶板与底板之间的支撑板，所述底板、顶板、支撑板密封连接形成中空的密闭空腔；作为平板热管的蒸发面的底板的本体为黄铜板，所述底板内表面覆盖有纳米结构的具有超亲水性能的电化学置换形成的氧化铜薄膜；作为平板热管的冷凝面的顶板的本体为黄铜板，所述顶板内表面覆盖有纳米结构的具有超疏水性能的电镀镍层，所述支撑板侧面开有贯穿小孔与毛细管相接。 In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is: a nanostructured flat heat pipe, which includes a bottom plate, a top plate, and a support plate located between the top plate and the bottom plate, and the bottom plate, top plate, and support plate are sealed and connected to form a hollow The airtight cavity of the flat heat pipe; the body of the bottom plate as the evaporation surface of the flat heat pipe is a brass plate, and the inner surface of the bottom plate is covered with a nanostructured copper oxide film formed by electrochemical replacement with superhydrophilic properties; as the condensation of the flat heat pipe The main body of the top plate is a brass plate, and the inner surface of the top plate is covered with a nanostructured electroplated nickel layer with super-hydrophobic properties.
作为本发明纳米结构平板热管的技术方案的一种改进，所述支撑板内表面烧结与所述顶板和所述底板相连接的多孔结构的吸液芯层。 As an improvement of the technical solution of the nanostructured flat heat pipe of the present invention, the inner surface of the support plate is sintered with a porous structure liquid-absorbing core layer connected to the top plate and the bottom plate.
作为本发明纳米结构平板热管的技术方案的一种改进，所述顶板内侧使用全氟癸基三乙氧基硅烷进行化学修饰。 As an improvement of the technical solution of the nanostructured flat heat pipe of the present invention, the inner side of the top plate is chemically modified with perfluorodecyltriethoxysilane.
作为本发明纳米结构平板热管的技术方案的一种改进，所述顶板的内表面设有从中心向外侧降低的5°的倾角。 As an improvement of the technical solution of the nanostructure flat heat pipe of the present invention, the inner surface of the top plate is provided with an inclination angle of 5° decreasing from the center to the outside.
作为本发明纳米结构平板热管的技术方案的一种改进，密闭空腔内充填有蒸发工质。 As an improvement of the technical solution of the nanostructured flat heat pipe of the present invention, the sealed cavity is filled with evaporating working fluid.
作为本发明纳米结构平板热管的技术方案的一种改进，所述蒸发工质是去离子水。 As an improvement of the technical solution of the nanostructured flat heat pipe of the present invention, the evaporating working medium is deionized water.
作为本发明纳米结构平板热管的技术方案的一种改进，所述蒸发工质为液体时所述平板热管的充液率为35%~45%。 As an improvement of the technical solution of the nanostructured flat heat pipe of the present invention, when the evaporating working medium is liquid, the liquid filling rate of the flat heat pipe is 35% to 45%.
作为本发明纳米结构平板热管的技术方案的一种改进，所述平板热管的密闭空腔内的真空度为12.33kPa。 As an improvement of the technical solution of the nanostructure flat heat pipe of the present invention, the vacuum degree in the airtight cavity of the flat heat pipe is 12.33kPa.
作为本发明纳米结构平板热管的技术方案的一种改进，所述平板热管的顶板、底板与支撑板通过胶封贴合的方式密封连接。 As an improvement of the technical solution of the nanostructured flat heat pipe of the present invention, the top plate, the bottom plate and the support plate of the flat heat pipe are hermetically connected by glue sealing.
作为本发明纳米结构平板热管的技术方案的一种改进，所述平板热管密闭空腔内均匀分布着多个两端分别与顶板、底板抵触的支撑柱。 As an improvement of the technical solution of the nanostructured flat heat pipe of the present invention, a plurality of support columns whose two ends respectively conflict with the top plate and the bottom plate are uniformly distributed in the airtight cavity of the flat heat pipe.
本发明的有益效果在于：本发明是适用于热源自下而上进行散热的平板热管，底板为平板热管蒸发面，其内表面附着一层具有超亲水性的微纳米阶层结构的氧化铜薄膜，有利于流体工质液膜均匀分布，强化了地面的均温性；同时氧化铜薄膜层形成的粗糙结构形成了许多凹坑、细缝，可作为沸腾传热的汽化核心，强化了沸腾换热能力。顶板内表面电镀一层镍，具有超疏水性，采用超疏水表面强化珠状凝结，减小传热热阻，加快工质循环速度。此平板热管通过对蒸发面、冷凝面进行超亲、疏水表面改性，强化蒸发冷凝速度，提高蒸发区和冷凝区的换热性能，具有良好的均温性，引导并加快工质回流速度从而提高整体换热能力。 The beneficial effect of the present invention is that: the present invention is a flat heat pipe suitable for dissipating heat from bottom to top, the bottom plate is the evaporation surface of the flat heat pipe, and a layer of copper oxide with a super-hydrophilic micro-nano hierarchical structure is attached to the inner surface The thin film is conducive to the uniform distribution of the liquid film of the fluid working medium, which strengthens the uniform temperature of the ground; at the same time, the rough structure formed by the copper oxide film layer forms many pits and fine cracks, which can be used as the vaporization core of boiling heat transfer, and strengthen the boiling heat transfer capacity. The inner surface of the top plate is electroplated with a layer of nickel, which is super-hydrophobic. The super-hydrophobic surface is used to strengthen bead condensation, reduce heat transfer resistance, and speed up the circulation of working fluid. The flat plate heat pipe enhances the evaporation and condensation speed, improves the heat transfer performance of the evaporation area and the condensation area by modifying the surface of the evaporating surface and the condensing surface with super-philicity and hydrophobicity. Improve the overall heat transfer capacity.
附图说明 Description of drawings
图1为本发明一种纳米结构平板热管实施例的立体分解结构示意图。 FIG. 1 is a schematic diagram of a three-dimensional decomposition structure of an embodiment of a nanostructure flat heat pipe according to the present invention.
图2为实施例中平板热管的组合状态的立体结构示意图。 Fig. 2 is a three-dimensional structural schematic diagram of the combined state of the flat heat pipe in the embodiment.
具体实施方式 Detailed ways
下面结合附图来进一步说明本发明的具体实施方式。 The specific implementation manner of the present invention will be further described below in conjunction with the accompanying drawings.
如图1、图2所示，本发明一种纳米结构平板热管，其包括底板11、顶板12、位于顶板12与底板11之间的支撑板13，所述底板11、顶板12、支撑板13密封连接形成中空的密闭空腔；作为平板热管的蒸发面的底板11的本体为黄铜板，所述底板11内表面覆盖有纳米结构的具有超亲水性能的电化学置换形成的氧化铜薄膜；作为平板热管的冷凝面的顶板12的本体为黄铜板，所述底板12内表面覆盖有纳米结构的具有超疏水性能的电镀镍层，所述支撑板13侧面开有贯穿小孔与毛细管15相接。本发明是适用于热源自下而上进行散热的平板热管，底板11为平板热管蒸发面，其内表面经过高温氧化脱水的处理，附着一层具有超亲水性的微纳米阶层结构的氧化铜薄膜，其接触角设为15°为最佳，氧化铜薄膜具有特殊的微米-纳米阶层结构，有利于流体工质液膜均匀分布，强化了地面的均温性；同时氧化铜薄膜层形成的粗糙结构形成了许多凹坑、细缝，可作为沸腾传热的汽化核心，强化了沸腾换热能力。同时顶板12内表面电镀一层镍，顶板12内侧使用全氟癸基三乙氧基硅烷进行化学修饰，降低其表面能，使其具有超疏水性，修饰部分的接触角可选择为160°，滑动角3°。采用超疏水表面强化珠状凝结，减小传热热阻，同时顶板12的导流通道能快速将凝结液导向边缘，加快工质循环速度。此平板热管通过对蒸发面、冷凝面进行超亲、疏水表面改性，强化蒸发冷凝速度，提高蒸发区和冷凝区的换热性能，具有良好的均温性，引导并加快工质回流速度从而提高整体换热能力。通过毛细管15与外界真空泵、注液器相连接可实现平板热管的抽气注液过程。 As shown in Fig. 1 and Fig. 2, a kind of nanostructure flat heat pipe of the present invention comprises a bottom plate 11, a top plate 12, a support plate 13 between the top plate 12 and the bottom plate 11, and the bottom plate 11, top plate 12, support plate 13 The sealed connection forms a hollow airtight cavity; the body of the bottom plate 11 as the evaporation surface of the flat heat pipe is a brass plate, and the inner surface of the bottom plate 11 is covered with a nanostructured copper oxide film formed by electrochemical displacement with super-hydrophilic properties The body of the top plate 12 as the condensation surface of the flat heat pipe is a brass plate, and the inner surface of the bottom plate 12 is covered with a nanostructured electroplated nickel layer with super-hydrophobic properties. 15 connected. The present invention is a flat heat pipe suitable for dissipating heat from bottom to top. The bottom plate 11 is the evaporation surface of the flat heat pipe. Copper film, the best contact angle is set to 15°, the copper oxide film has a special micro-nano hierarchical structure, which is conducive to the uniform distribution of the liquid film of the fluid working medium, and strengthens the temperature uniformity of the ground; at the same time, the copper oxide film layer forms The rough structure forms many pits and slits, which can be used as the vaporization core of boiling heat transfer, which strengthens the boiling heat transfer capacity. At the same time, the inner surface of the top plate 12 is electroplated with a layer of nickel, and the inner side of the top plate 12 is chemically modified with perfluorodecyltriethoxysilane to reduce its surface energy and make it superhydrophobic. The contact angle of the modified part can be selected as 160°. The sliding angle is 3°. The super-hydrophobic surface is used to strengthen bead condensation, which reduces the heat transfer resistance, and at the same time, the diversion channel of the top plate 12 can quickly guide the condensate to the edge to speed up the circulation of the working fluid. The flat plate heat pipe enhances the evaporation and condensation speed, improves the heat transfer performance of the evaporation area and the condensation area by modifying the surface of the evaporating surface and the condensing surface with super-philicity and hydrophobicity. Improve the overall heat transfer capacity. Connecting the capillary 15 with an external vacuum pump and a liquid injector can realize the pumping and liquid injection process of the flat heat pipe.
更佳地，所述支撑板13内表面烧结有与所述顶板12和所述底板11相连接的多孔结构的吸液芯层。该吸液芯层由800目的纯铜粉高温烧结而成，铜粉烧结形成的多孔结构提供了较大的毛细力，能有效促进冷凝面的冷凝工质回流至蒸发面。 More preferably, the inner surface of the support plate 13 is sintered with a porous structure liquid-absorbing core layer connected with the top plate 12 and the bottom plate 11 . The liquid-absorbing core layer is made of 800-mesh pure copper powder sintered at high temperature. The porous structure formed by sintering copper powder provides a large capillary force, which can effectively promote the return of the condensed working medium on the condensing surface to the evaporating surface.
更佳地，所述顶板12内表面设有从中心向外侧边缘降低并设有的5°的倾角作为导流通道帮助冷凝工质快速回流。 More preferably, the inner surface of the top plate 12 is provided with an inclination angle of 5° lowered from the center to the outer edge as a guide channel to help the condensed working fluid return quickly.
更佳地，密闭空腔内充填有蒸发工质，所述蒸发工质是去离子水，实现快速蒸发和冷凝进行换热并快速回流。所述蒸发工质为液体时所述平板热管的充液率为35%~45%，以40%为最佳，具有足够的工质进行蒸发，也具有足够的空间进行蒸发。 More preferably, the airtight cavity is filled with evaporating working medium, and the evaporating working medium is deionized water, which realizes rapid evaporation and condensation for heat exchange and rapid reflux. When the evaporating working medium is liquid, the liquid filling rate of the flat heat pipe is 35% to 45%, with 40% being the best, so that there is enough working medium for evaporation and enough space for evaporation.
更佳地，所述平板热管的密闭空腔内的真空度为12.33kPa，提高蒸发的速度，保证工质快速蒸发冷凝，进行换热循环。 More preferably, the vacuum degree in the airtight cavity of the flat heat pipe is 12.33kPa, so as to increase the speed of evaporation, ensure rapid evaporation and condensation of working fluid, and perform a heat exchange cycle.
更佳地，所述平板热管的顶板12、底板11与支撑板13通过胶封贴合的方式密封连接。具体的是支撑板外侧与底板、顶板形成的空隙中填充环氧树脂密封胶，对密闭腔体内的真空度起到保护的作用，防止由于内外部因素造成腔体内真空度被破坏以及工质泄漏。 More preferably, the top plate 12, the bottom plate 11 and the support plate 13 of the flat heat pipe are hermetically connected by glue sealing. Specifically, epoxy sealant is filled in the gap formed between the outer side of the support plate and the bottom plate and top plate, which protects the vacuum in the closed cavity and prevents the vacuum in the cavity from being damaged and the working fluid from leaking due to internal and external factors. .
更佳地，所述平板热管密闭空腔内均匀分布着多个两端分别与顶板12、底板11抵触的支撑柱14，用于防止由于外力作用使平板热管表面发生变形。一种具体的方式是均匀设置四个支撑柱14于顶板12与底板11之间。 More preferably, a plurality of supporting pillars 14 are uniformly distributed in the airtight cavity of the flat heat pipe, and the two ends thereof are in contact with the top plate 12 and the bottom plate 11 respectively, so as to prevent deformation of the surface of the flat heat pipe due to external force. A specific way is to evenly arrange four support columns 14 between the top plate 12 and the bottom plate 11 .
以上所揭露的仅为本发明的优选实施例而已，当然不能以此来限定本发明之权利范围，因此依本发明申请专利范围所作的等同变化，仍属本发明所涵盖的范围。 What is disclosed above is only a preferred embodiment of the present invention, and of course it cannot limit the scope of rights of the present invention. Therefore, equivalent changes made according to the patent scope of the present invention still fall within the scope of the present invention.
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