CN104626151A - Mechanical arm wafer centering device and method - Google Patents
Mechanical arm wafer centering device and method Download PDFInfo
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- CN104626151A CN104626151A CN201310566847.1A CN201310566847A CN104626151A CN 104626151 A CN104626151 A CN 104626151A CN 201310566847 A CN201310566847 A CN 201310566847A CN 104626151 A CN104626151 A CN 104626151A
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Abstract
The invention provides a mechanical arm wafer centering device and method. The device comprises high-speed IO collecting circuits, an FPGA module and an embedded type CPU module. The high-speed IO collecting circuits are used for collecting AWC sensor signals and generating high-speed IO signals. The FPGA module is used for outputting high-speed IO signals and serial interruption signals to the embedded type CPU module, and the FPGA module is further used for converting address data of the embedded type CPU module into control signals to a driver and outputting the control signals to correct the position of a mechanical arm. The embedded type CPU module is used for receiving the high-speed IO signals and latching the servo axis position value, working out the deviation of the actual center in the wafer conveying process by the mechanical arm and a demonstration center according to the servo axis position value and outputting control instructions through the address data. According to the mechanical arm wafer centering device and method, the multiple sets of high-speed IO signal collecting circuits are integrated, the structure is compact, fault points are few, and the collecting circuits can be flexible configured.
Description
Technical field
The invention belongs to Mechanical course field, be specifically related to a kind of manipulator wafer centring means and method.
Background technology
In the manufacturing process of semiconductor, manipulator between each chamber or between station, is usually used to complete the transmission of wafer (wafer refers to the silicon wafer that silicon semiconductor production of integrated circuits is used, because its shape is circular, therefore is called wafer).In wafer transmission system, the generation of the objective factor such as off normal or wafer breakage during for avoiding picking and placeing, improves the degree of accuracy that wafer picks and places, and needs to design and uses AWC (Active Wafer Centering) function to carry out detecting and correct.AWC wafer self-centering function, for the off normal situation at practical center and teaching center in robotic transfer wafer process, automatically corrects, ensure that wafer is accurately transported to assigned address in the motion process of manipulator.
AWC function uses one group of (2) sensor, is positioned over the station direction (between the radial alignment of motion and crystal round fringes) needing to detect, and ensures that the line between two sensors is radial vertical with station.Manipulator is in the process performing GOTO instruction (GOTO instruction is for controlling the stretching of manipulator), when sensor has detected that wafer is come in and gone out, can image data preserving at once, the deviation at the wafer center of circle and manipulator finger center is calculated according to 4 secondary data collected.According to the deviation that this calculates, while manipulator stretching, extension puts in place, R axle (rotating shaft of manipulator) and T axle (telescopic shaft of manipulator) compensate process to this bias vector automatically, realize correction, until deviation eliminates rear GOTO order fulfillment, to ensure that wafer is sent to aiming station accurately.
The manipulator applied in current semicon industry is all the high speed acquisition function being completed sensor in AWC by motion control card or driver.This function needs the High-speed I/O signal acquisition circuit using motion control card or driver, is latched the positional value of current robot axis servomotor when the edge of wafer swept to by sensor by High-speed I/O circuit.And in actual use, manipulator needs to transmit wafer at multiple station, this just needs manipulator can gather many group High-speed I/O signals, and the manipulator of some special construction needs multi-axial Simultaneous collection High-speed I/O signal.And with it paradoxically, motion control card and driver can only gather at most two-way High-speed I/O signal, can not gather and organize sensor signal more.For solving this problem, common practices of the prior art is the interface board that increase by has line and function, is linked on interface board by High-speed I/O signal, is exported with signal in motion control card or driver by interface board, then does collection latch process.This mode needs to increase interface board to the interconnect cable of motion control card or driver and connector, and this just causes robotic failure of the prior art point to increase, and structure disperses is unfavorable for the problem of maintenance.Meanwhile, this mode still cannot solve it and not support the problem that twin shaft or multi-axial Simultaneous trigger and latch.
Summary of the invention
For above-mentioned technical problem of the prior art, the invention provides a kind of manipulator wafer centring means and method, this manipulator wafer centring means and method integration many groups High-speed I/O signal acquisition circuit, its compact conformation, trouble point are less, Acquisition Circuit can flexible configuration, and support that twin shaft or multi-axial Simultaneous trigger and latch application.
For solving the technical problem existed in above-mentioned prior art, the invention provides a kind of manipulator wafer centring means, comprising:
High-speed I/O Acquisition Circuit, for gathering AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal;
On-site programmable gate array FPGA module, for High-speed I/O holding wire that described High-speed I/O Acquisition Circuit is gathered with become serial interrupt signal, export to embedded CPU module, have no progeny during described embedded CPU module is responded and latch current servo shaft position value; This FPGA module also exports the control signal of driver for being converted to by the address date of described embedded CPU module, to correct the position of manipulator;
Embedded CPU module, for receiving the High-speed I/O signal of described FPGA module output and latching axis servomotor positional value, and calculate the off normal situation at practical center and teaching center in robotic transfer wafer process according to axis servomotor positional value after, export control instruction by address date.
Wherein, this device also comprises: EEPROM module, for storing AWC sensor group number information, and be connected with embedded CPU module by universal serial bus, after each manipulator wafer centring means powers on, the AWC sensor group number information stored in EEPROM module is read, to predict the quantity of AWC sensor access for described embedded CPU module.
Wherein, this device also comprises: bus communication circuit, for the information interaction between described manipulator wafer centring means and robot controller; Described bus communication circuit adopts open architecture; Described open architecture comprises: Canopen, EhterCAT;
Driver interface circuit, for the information interaction between FPGA module and driver.
Wherein, this device also comprises: power circuit, for controlling manipulator wafer centring means power supply, produces different voltage, the modules of gadgetize hand wafer centring means.
Wherein, described FPGA module is connected with embedded CPU module by address date line.
Wherein, described control signal comprises: read code device signal, send position command, speed command or torque instruction to driver.
Wherein, described High-speed I/O Acquisition Circuit at least possesses 8 groups of signal input interfaces.
Wherein, the AWC sensor group number information in described EEPROM module can be revised by external communication bus online.
Accordingly, the present invention also provides a kind of manipulator wafer spotting device, comprising:
High-speed I/O Acquisition Circuit gathers AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal;
The High-speed I/O holding wire that described High-speed I/O Acquisition Circuit generates by FPGA module with become serial interrupt signal, export to embedded CPU module;
Embedded CPU module receives described High-speed I/O signal, latches axis servomotor positional value, and calculate the off normal situation at practical center and teaching center in robotic transfer wafer process according to axis servomotor positional value after, exports control instruction by address date;
The address date of described embedded CPU module converts to and exports the control signal of driver by FPGA module, to correct the position of manipulator.
Wherein, described High-speed I/O Acquisition Circuit gathers AWC sensor signal by high-speed isolated type photoelectrical coupler, also comprise before generating High-speed I/O signal: this manipulator wafer centring means is started shooting, the AWC sensor group number information stored in EEPROM module is read, to predict the quantity of AWC sensor access after embedded CPU module powers on.
Manipulator wafer centring means provided by the invention and method, integrated many group High-speed I/O signal acquisition circuits, its compact conformation, trouble point are less, Acquisition Circuit can flexible configuration, and support that twin shaft or multi-axial Simultaneous trigger and latch application.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly introduced, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is manipulator wafer centring means first example structure schematic diagram provided by the invention;
Fig. 2 is manipulator wafer centring means second example structure schematic diagram provided by the invention;
Fig. 3 is manipulator wafer spotting device embodiment schematic flow sheet provided by the invention.
Detailed description of the invention
In order to make the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, the present invention is described in further detail, and obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Be manipulator wafer centring means first example structure schematic diagram provided by the invention see Fig. 1.As shown in the figure, this manipulator wafer centring means comprises:
High-speed I/O Acquisition Circuit 1, for gathering AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal; Preferably, described High-speed I/O Acquisition Circuit 1 at least possesses 8 groups of signal input interfaces.
Field programmable gate array (FPGA, Field-Programmable Gate Array) module 2, for High-speed I/O holding wire that described High-speed I/O Acquisition Circuit is gathered with become serial interrupt signal, export to embedded CPU module 3, have no progeny during described embedded CPU module is responded and latch current servo shaft position value; This FPGA module 2 also exports the control signal of driver for being converted to by the address date of described embedded CPU module 3, to correct the position of manipulator.
Embedded CPU module 3, for receiving the High-speed I/O signal of described FPGA module 2 output and latching axis servomotor positional value, and calculate the off normal situation at practical center and teaching center in robotic transfer wafer process according to axis servomotor positional value after, export control instruction by address date.
Manipulator wafer centring means provided by the invention, not only can integrated many group High-speed I/O signal acquisition circuits, and its compact conformation, trouble point are less, Acquisition Circuit can flexible configuration, and support that twin shaft or multi-axial Simultaneous trigger and latch application.
See Fig. 2, it is manipulator wafer centring means second example structure schematic diagram provided by the invention.In the present embodiment, by the structure of this manipulator wafer centring means of description specifically and the function of all parts.As shown in Figure 2, this manipulator wafer centring means comprises:
High-speed I/O Acquisition Circuit 1, for gathering AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal; Preferably, described High-speed I/O Acquisition Circuit 1 at least possesses 8 groups of signal input interfaces.
Field programmable gate array (FPGA, Field-Programmable Gate Array) module 2, for High-speed I/O holding wire that described High-speed I/O Acquisition Circuit is gathered with become serial interrupt signal, export to embedded CPU module 3, have no progeny during described embedded CPU module is responded and latch current servo shaft position value; This FPGA module 2 also exports the control signal of driver for being converted to by the address date of described embedded CPU module 3, to correct the position of manipulator.More specifically, described control signal comprises: read code device signal, send position command, speed command or torque instruction to driver.Based on this, it will be appreciated by persons skilled in the art that the hardware configuration of the integrated motion control of manipulator wafer centring means that the embodiment of the present invention provides and many group High-speed I/O signals collecting.
Embedded CPU module 3, for receiving the High-speed I/O signal of described FPGA module 2 output and latching axis servomotor positional value, and calculate the off normal situation at practical center and teaching center in robotic transfer wafer process according to axis servomotor positional value after, export control instruction by address date.Concrete, described FPGA module is connected with embedded CPU module by address date line.
Bus communication circuit 4, for the information interaction between described manipulator wafer centring means and robot controller; More specifically, described bus communication circuit adopts open architecture, such as Canopen, EhterCAT etc.
Driver interface circuit 5, for the information interaction between FPGA module 2 and driver.It will be appreciated by persons skilled in the art that in various embodiments of the present invention, described driver comprises motion control card and/or servo-driver.
Preferably, the manipulator wafer centring means that the embodiment of the present invention provides also comprises EEPROM module 6.EEPROM module 6 is for storing AWC sensor group number information, and be connected with embedded CPU module 3 by universal serial bus, after each manipulator wafer centring means powers on, the AWC sensor group number information stored in EEPROM module 6 is read, to predict the quantity of AWC sensor access for described embedded CPU module 3.Further, the AWC sensor group number information in described EEPROM module 6 can be revised by external communication bus online.Based on this, it will be appreciated by persons skilled in the art that manipulator wafer centring means that the embodiment of the present invention provides can Configuration Online AWC sensor group number flexibly.
It will be understood by those skilled in the art that, the manipulator wafer centring means that the embodiment of the present invention provides also comprises power circuit 7, for controlling manipulator wafer centring means power supply, produce different voltage, the modules of gadgetize hand wafer centring means.
Manipulator wafer centring means provided by the invention, not only can integrated many group High-speed I/O signal acquisition circuits, and its compact conformation, trouble point are less, Acquisition Circuit can flexible configuration, and support that twin shaft or multi-axial Simultaneous trigger and latch application.
In order to make the public better understand technical scheme of the present invention, the manipulator wafer spotting device flow process that existing detailed description can realize based on the manipulator wafer centring means that the present invention's embodiment provides.See Fig. 3, it is manipulator wafer spotting device embodiment schematic flow sheet provided by the invention.As shown in the figure, this manipulator wafer spotting device comprises:
Step S101, High-speed I/O Acquisition Circuit gathers AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal;
Step S102, the High-speed I/O holding wire that described High-speed I/O Acquisition Circuit generates by FPGA module with become serial interrupt signal, export to embedded CPU module;
Step S103, embedded CPU module receives described High-speed I/O signal, latches axis servomotor positional value;
Step S104, embedded CPU module exports control instruction by address date after calculating the off normal situation at practical center and teaching center in robotic transfer wafer process according to axis servomotor positional value;
Step S105, the address date of described embedded CPU module converts to and exports the control signal of driver by FPGA module, to correct the position of manipulator.
Preferably, also comprise step S100 before step S101, this manipulator wafer centring means is started shooting, and reads the AWC sensor group number information stored in EEPROM module after embedded CPU module powers on, to predict the quantity of AWC sensor access.
To sum up, manipulator wafer centring means provided by the invention and method, not only can integrated many group High-speed I/O signal acquisition circuits, and its compact conformation, trouble point are less, Acquisition Circuit can flexible configuration, and support that twin shaft or multi-axial Simultaneous trigger and latch application.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. a manipulator wafer centring means, is characterized in that, comprising:
High-speed I/O Acquisition Circuit, for gathering AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal;
On-site programmable gate array FPGA module, for High-speed I/O holding wire that described High-speed I/O Acquisition Circuit is gathered with become serial interrupt signal, export to embedded CPU module, have no progeny during described embedded CPU module is responded and latch current servo shaft position value; This FPGA module also exports the control signal of driver for being converted to by the address date of described embedded CPU module, to correct the position of manipulator;
Embedded CPU module, for receiving the High-speed I/O signal of described FPGA module output and latching axis servomotor positional value, and calculate the off normal situation at practical center and teaching center in robotic transfer wafer process according to axis servomotor positional value after, export control instruction by address date.
2. manipulator wafer centring means as claimed in claim 1, it is characterized in that, this device also comprises:
EEPROM module, for storing AWC sensor group number information, and be connected with embedded CPU module by universal serial bus, after each manipulator wafer centring means powers on, the AWC sensor group number information stored in EEPROM module is read, to predict the quantity of AWC sensor access for described embedded CPU module.
3. manipulator wafer centring means as claimed in claim 1, it is characterized in that, this device also comprises: bus communication circuit, for the information interaction between described manipulator wafer centring means and robot controller; Described bus communication circuit adopts open architecture; Described open architecture comprises: Canopen, EhterCAT;
Driver interface circuit, for the information interaction between FPGA module and driver.
4. manipulator wafer centring means as claimed in claim 1, it is characterized in that, this device also comprises: power circuit, for controlling manipulator wafer centring means power supply, produces different voltage, the modules of gadgetize hand wafer centring means.
5. the manipulator wafer centring means according to any one of Claims 1-4, is characterized in that, described FPGA module is connected with embedded CPU module by address date line.
6. the manipulator wafer centring means according to any one of Claims 1-4, it is characterized in that, described control signal comprises: read code device signal, send position command, speed command or torque instruction to driver.
7. the manipulator wafer centring means according to any one of Claims 1-4, is characterized in that, described High-speed I/O Acquisition Circuit at least possesses 8 groups of signal input interfaces.
8. manipulator wafer centring means as claimed in claim 2, it is characterized in that, the AWC sensor group number information in described EEPROM module can be revised by external communication bus online.
9. a manipulator wafer spotting device, is characterized in that, comprising:
High-speed I/O Acquisition Circuit gathers AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal;
The High-speed I/O holding wire that described High-speed I/O Acquisition Circuit generates by FPGA module with become serial interrupt signal, export to embedded CPU module;
Embedded CPU module receives described High-speed I/O signal, latches axis servomotor positional value, and calculate the off normal situation at practical center and teaching center in robotic transfer wafer process according to axis servomotor positional value after, exports control instruction by address date;
The address date of described embedded CPU module converts to and exports the control signal of driver by FPGA module, to correct the position of manipulator.
10. manipulator wafer centring means as claimed in claim 9, is characterized in that, described High-speed I/O Acquisition Circuit gathers AWC sensor signal by high-speed isolated type photoelectrical coupler, also comprises before generating High-speed I/O signal:
This manipulator wafer centring means is started shooting, and reads the AWC sensor group number information stored in EEPROM module after embedded CPU module powers on, to predict the quantity of AWC sensor access.
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| CN106737655A (en) * | 2015-11-20 | 2017-05-31 | 沈阳新松机器人自动化股份有限公司 | A kind of configurable manipulator wafer centring means |
| CN106783712A (en) * | 2015-11-24 | 2017-05-31 | 沈阳新松机器人自动化股份有限公司 | The method that dynamic wafer centre deviation position is verified in AWC systems |
| CN108581239A (en) * | 2018-04-10 | 2018-09-28 | 上海柏楚电子科技股份有限公司 | A method of for square tube laser cutting Observed Drift and the compensation of real-time cutter track |
| CN109786301A (en) * | 2017-11-13 | 2019-05-21 | 台湾积体电路制造股份有限公司 | For automating the system and method for chip processing |
| CN110091340A (en) * | 2019-05-07 | 2019-08-06 | 芯导精密(北京)设备有限公司 | A kind of wafer pick-and-place manipulator |
| CN112992746A (en) * | 2021-01-31 | 2021-06-18 | 江苏亚电科技有限公司 | Positioning device and positioning method for conveying mechanism of wafer cleaning equipment |
| CN115112013A (en) * | 2021-05-07 | 2022-09-27 | 沈阳新松机器人自动化股份有限公司 | Sensor-based FPD manipulator dynamic glass deviation rectifying method |
| CN115167198A (en) * | 2022-06-21 | 2022-10-11 | 沈阳新松机器人自动化股份有限公司 | Wafer deviation rectifying system and method of double-end mechanical arm |
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| CN112992746A (en) * | 2021-01-31 | 2021-06-18 | 江苏亚电科技有限公司 | Positioning device and positioning method for conveying mechanism of wafer cleaning equipment |
| CN112992746B (en) * | 2021-01-31 | 2022-03-11 | 江苏亚电科技有限公司 | Positioning device and positioning method for conveying mechanism of wafer cleaning equipment |
| CN115112013A (en) * | 2021-05-07 | 2022-09-27 | 沈阳新松机器人自动化股份有限公司 | Sensor-based FPD manipulator dynamic glass deviation rectifying method |
| CN115167198A (en) * | 2022-06-21 | 2022-10-11 | 沈阳新松机器人自动化股份有限公司 | Wafer deviation rectifying system and method of double-end mechanical arm |
| CN115167198B (en) * | 2022-06-21 | 2023-03-21 | 沈阳新松机器人自动化股份有限公司 | Wafer deviation rectifying system and method of double-end mechanical arm |
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| CN104626151B (en) | 2016-06-29 |
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