CN104470214A - Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board - Google Patents
Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board Download PDFInfo
- Publication number
- CN104470214A CN104470214A CN201410693447.1A CN201410693447A CN104470214A CN 104470214 A CN104470214 A CN 104470214A CN 201410693447 A CN201410693447 A CN 201410693447A CN 104470214 A CN104470214 A CN 104470214A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- rigid
- flexible
- soft board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a shape machining method for a flexible printed circuit board of a rigid-flexible combined circuit board. The machining method includes the steps that a rigid printed circuit board, a middle layer, a bottom layer, an adhesive layer and the flexible printed circuit board of the rigid-flexible combined circuit board are pretreated and then laminated, the shape of the flexible printed circuit board and the shape of the rigid printed circuit board are machined, and the machining process includes the steps of milling the rigid printed circuit board and punching the flexible printed circuit board. The shape machining method has the advantages that an existing process for the rigid-flexible combined circuit board is improved, and the punching working procedure in original flexible printed circuit board machining is omitted; after the rigid-flexible combined circuit board is laminated, the shape of the rigid printed circuit board is formed through milling, then the shape of the flexible printed circuit board is formed through punching, and the problems that as the grooving length of the flexible printed circuit board is large, and much middle hollow is formed, the flexible printed circuit board is prone to deforming in the press-fit process, holes cannot be drilled in a disk in the follow-up working procedure, the rejection rate of the rigid-flexible combined circuit board is large, and the production efficiency is low are solved; the flexible printed circuit board punching working procedure is omitted, the production cost is saved, and the production efficiency is improved.
Description
Technical field
The present invention relates to the soft board external form processing method of a kind of processing method of wiring board external form, particularly a kind of flexible and hard combined circuit board.
Background technology
At present, add man-hour in three layers of soft or hard knot tying soft board length being greater than to 100mm and being less than 400mm, to soft board stamp, need process separately to its external form, concrete form just goes out with jet-bedding form when doing soft board, then lamination.But in existing technique, there is following shortcoming: slotting length is longer, soft board can be more and yielding because of middle hollow out in follow-up bonding processes, cause rear operation hole drill less than on dish, cause product percent defective high, and production efficiency is low.
Summary of the invention
Goal of the invention: for the problems referred to above, the object of this invention is to provide the not yielding and Rigid Flex external form processing method of enhancing productivity of a kind of soft board pressing.
Technical scheme: a kind of flexible and hard combined circuit board soft board external form processing method, first carries out preliminary treatment by the hardboard of Rigid Flex, intermediate layer, bottom, glue-line, soft board, carries out lamination, then process rigid-flex external form, comprise the steps:
(1) hardboard milling: hardboard place external form is milled out with 1.5mm milling cutter, and extend 1.0mm to soft board place;
(2) soft board is die-cut: cut described soft board with etching knife stamping, and described etching cutting die need keep away position in described hardboard region.
Further, in above-mentioned steps (2), be that the thickness of hardboard adds 0.5mm for keeping away bit depth.
Further, above-mentioned Rigid Flex is 3 layers of board.
Further, in above-mentioned Rigid Flex, the length of soft board is 100-400mm.
Beneficial effect: compared with prior art, advantage of the present invention improves existing Rigid Flex technique, eliminates stamp operation in the processing of original soft board.Rigid Flex is after lamination, hardboard is first milled out profile, more die-cut soft board profile, solve soft board because of slotting length longer, middle hollow out is more, in bonding processes, easily there is distortion, cause rear operation hole drill less than on dish, cause product percent defective high, the problem that production efficiency is low, decrease soft board stamp operation simultaneously, save production cost, improve production efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of Rigid Flex of the present invention;
Fig. 2 is the schematic diagram of hardboard milling processing;
Fig. 3 is A place partial enlarged drawing in Fig. 2;
Fig. 4 is the schematic diagram of soft board Punching Technology;
Fig. 5 is B place partial enlarged drawing in Fig. 4.
Embodiment
Below in conjunction with the drawings and specific embodiments, illustrate the present invention further, these embodiments should be understood only be not used in for illustration of the present invention and limit the scope of the invention, after having read the present invention, the amendment of those skilled in the art to the various equivalent form of value of the present invention has all fallen within the application's claims limited range.
A kind of Rigid Flex external form processing method, first carries out pre-treatment to hardboard, intermediate layer overlay film, bottom overlay film, pure glue, soft board.Carry out according to following technological process, hardboard: sawing sheet, deburring (mill FR4 face), paste pure glue, cold pressing, groove milling, turn pressing; Intermediate layer overlay film: sawing sheet, hole, window, turn pressing; Bottom overlay film: sawing sheet, boring, turn pressure and; Pure glue: sawing sheet, turn processing; Soft board: sawing sheet, boring, internal layer pre-treatment, press dry film, exposure, DES, AOI, internal layer pre-treatment, paste CVL, pressing, baking, target punching, alligatoring, turn pressing.
After pre-treatment, by the above-mentioned hardboard through pre-treatment, intermediate layer overlay film, bottom overlay film, pure glue, soft board lamination, carry out lamination, be pressed into 3 layers of Rigid Flex as shown in Figure 1, wherein the cut to lengthen of soft board is at 100-400mm.After lamination, carry out X-Ray, then carry out milling limit, be i.e. the sharp processing of rigid-flex, carry out as follows:
As shown in Figure 2 and Figure 3, first to hardboard milling: hardboard place external form milled out with 1.5mm milling cutter, and extend 1.0mm to soft board place; Again as shown in Figure 4, Figure 5, then die-cut to soft board: to cut described soft board with etching knife stamping, described etching cutting die need keep away position in described hardboard region, and the degree of depth of wherein keeping away position is that the thickness of hardboard adds 0.5mm.
After Rigid Flex external form is disposed, carry out holing, deburring, desmearing, heavy copper, whole plate copper facing, IQC, outer pre-treatment, press dry film, exposure, DES, AOI, IQC, heavy tin, flying probe, milling external form, cleaning, die-cut, FQC, FQA, packaging, warehouse-in.
Claims (4)
1. a flexible and hard combined circuit board soft board external form processing method, first carries out preliminary treatment by the hardboard of Rigid Flex, intermediate layer, bottom, glue-line, soft board, carries out lamination, then process rigid-flex external form, comprise the steps:
(1) hardboard milling: hardboard place external form is milled out with 1.5mm milling cutter, and extend 1.0mm to soft board place;
(2) soft board is die-cut: cut described soft board with etching knife stamping, and described etching cutting die need keep away position in described hardboard region.
2. a kind of flexible and hard combined circuit board soft board external form processing method according to claim 1, is characterized in that: in described step (2), and keeping away bit depth is that the thickness of described hardboard adds 0.5mm.
3. a kind of flexible and hard combined circuit board soft board external form processing method according to claim 1, is characterized in that: described Rigid Flex is 3 layers of board.
4. a kind of flexible and hard combined circuit board soft board external form processing method according to claim 1, it is characterized in that: in described Rigid Flex, soft board length is 100-400mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410693447.1A CN104470214B (en) | 2014-11-25 | 2014-11-25 | A kind of flexible and hard combined circuit board soft board external form processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410693447.1A CN104470214B (en) | 2014-11-25 | 2014-11-25 | A kind of flexible and hard combined circuit board soft board external form processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104470214A true CN104470214A (en) | 2015-03-25 |
| CN104470214B CN104470214B (en) | 2017-09-01 |
Family
ID=52915354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410693447.1A Active CN104470214B (en) | 2014-11-25 | 2014-11-25 | A kind of flexible and hard combined circuit board soft board external form processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104470214B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228370A (en) * | 2015-10-26 | 2016-01-06 | 江苏弘信华印电路科技有限公司 | A kind of two sides rigid plate area rigid-flex combined board manufacture craft that sample is not large |
| CN105228380A (en) * | 2015-10-26 | 2016-01-06 | 江苏弘信华印电路科技有限公司 | A kind of gross thickness is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre |
| CN105246271A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Island type hard board rigid-flex combination board |
| CN105246274A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Preparation method for four layer rigid-flex combination board with thickness over 0.32 mm and plugging handle in middle |
| CN105246272A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Manufacture method for rigid-flex combination plate with outer layer rigid thickness over 0.4mm and inner layer printed with character |
| CN107278064A (en) * | 2017-08-09 | 2017-10-20 | 常熟东南相互电子有限公司 | The preparation method of flexible-rigid compound circuit board |
| CN107995800A (en) * | 2017-12-28 | 2018-05-04 | 信利光电股份有限公司 | The soft board and hardboard associated methods of a kind of Rigid Flex |
| CN112188744A (en) * | 2020-10-29 | 2021-01-05 | 惠州市特创电子科技有限公司 | Circuit board and processing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102271469A (en) * | 2011-07-08 | 2011-12-07 | 深圳市精诚达电路有限公司 | Method for processing rigid-flexible printed circuit board (PCB) |
| CN203181405U (en) * | 2013-02-02 | 2013-09-04 | 宁波华远电子科技有限公司 | Flexible printed circuit manufactured by continuous die cutting |
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
| US20140216792A1 (en) * | 2011-07-15 | 2014-08-07 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof |
-
2014
- 2014-11-25 CN CN201410693447.1A patent/CN104470214B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102271469A (en) * | 2011-07-08 | 2011-12-07 | 深圳市精诚达电路有限公司 | Method for processing rigid-flexible printed circuit board (PCB) |
| US20140216792A1 (en) * | 2011-07-15 | 2014-08-07 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof |
| CN203181405U (en) * | 2013-02-02 | 2013-09-04 | 宁波华远电子科技有限公司 | Flexible printed circuit manufactured by continuous die cutting |
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228380B (en) * | 2015-10-26 | 2018-04-06 | 江苏弘信华印电路科技有限公司 | A kind of gross thickness is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre |
| CN105228370B (en) * | 2015-10-26 | 2018-08-10 | 江苏弘信华印电路科技有限公司 | A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare |
| CN105246271A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Island type hard board rigid-flex combination board |
| CN105246274A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Preparation method for four layer rigid-flex combination board with thickness over 0.32 mm and plugging handle in middle |
| CN105246272A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Manufacture method for rigid-flex combination plate with outer layer rigid thickness over 0.4mm and inner layer printed with character |
| CN105246274B (en) * | 2015-10-26 | 2018-09-25 | 江苏弘信华印电路科技有限公司 | A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method |
| CN105228380A (en) * | 2015-10-26 | 2016-01-06 | 江苏弘信华印电路科技有限公司 | A kind of gross thickness is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre |
| CN105246272B (en) * | 2015-10-26 | 2018-04-06 | 江苏弘信华印电路科技有限公司 | A kind of outer layer rigidity plate thickness is more than the rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol |
| CN105228370A (en) * | 2015-10-26 | 2016-01-06 | 江苏弘信华印电路科技有限公司 | A kind of two sides rigid plate area rigid-flex combined board manufacture craft that sample is not large |
| CN105246271B (en) * | 2015-10-26 | 2018-08-10 | 江苏弘信华印电路科技有限公司 | A kind of manufacturing method for the rigid-flex combined board for having an isolated island formula hardboard |
| CN107278064A (en) * | 2017-08-09 | 2017-10-20 | 常熟东南相互电子有限公司 | The preparation method of flexible-rigid compound circuit board |
| CN107278064B (en) * | 2017-08-09 | 2019-07-09 | 常熟东南相互电子有限公司 | The production method of flexible-rigid compound circuit board |
| CN107995800A (en) * | 2017-12-28 | 2018-05-04 | 信利光电股份有限公司 | The soft board and hardboard associated methods of a kind of Rigid Flex |
| CN107995800B (en) * | 2017-12-28 | 2020-01-03 | 信利光电股份有限公司 | Soft board and hard board combination method of soft and hard combination board |
| CN112188744A (en) * | 2020-10-29 | 2021-01-05 | 惠州市特创电子科技有限公司 | Circuit board and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104470214B (en) | 2017-09-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104470214A (en) | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board | |
| CN103533741B (en) | A kind of double-side thick copper plate and preparation method thereof | |
| CN203722926U (en) | PCB made of PTFE material | |
| CN106714460A (en) | Method for manufacturing special-shaped slot hole in printed circuit board | |
| CN102271469A (en) | Method for processing rigid-flexible printed circuit board (PCB) | |
| CN105479913A (en) | Method for gluing regularly typeset reinforcing pieces | |
| CN103648235B (en) | A kind of preparation method of aluminum base circuit board | |
| CN106102319A (en) | Uncap after a kind of Rigid Flex and directly take off the processing technique of lid | |
| CN104105349A (en) | Method for processing rigid-flex printed board by cover laminating and lining filling method | |
| CN102045948B (en) | Method for manufacturing PCB by laminating metal substrate with non-flow prepreg | |
| CN104228299B (en) | A kind of pad pasting work piece production technique | |
| CN206332922U (en) | Suitable for the jigsaw of the big thickness PCB single board sharp processing of small size | |
| CN104661434A (en) | Double-faced aluminum substrate manufacturing process | |
| WO2020220680A1 (en) | High-precision forming method for rigid-flex printed circuit board | |
| CN105392294A (en) | Positioning and manufacturing method for reinforcing sheet with inwardly-contracted adhesive | |
| CN103945659A (en) | Method of manufacturing six-layer copper-based circuit board | |
| CN103923574B (en) | Double faced adhesive tape and manufacture method thereof, FPC product are pasted the method for double faced adhesive tape | |
| CN103687314B (en) | A kind of manufacture method of novel aluminum base circuit board | |
| TW201513982A (en) | Multiple half cut cutter and circuit cutting method using multiple half cut cutter | |
| CN203031671U (en) | Waste discharge device of cavity of circular cutter | |
| CN113825326B (en) | Manufacturing method of printed circuit board capable of effectively improving glue overflow in cavity area of carrier-like board | |
| CN109693080B (en) | Burr-free milling process for rigid-flex printed circuit board | |
| CN103586508A (en) | Dual-edge eccentric copper-foil punching tool with improved structure | |
| CN102500682A (en) | Punching and processing process of plate edge copper-plated half-hole plate | |
| CN105208773B (en) | A kind of preparation method of rigid-flex combined board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |